CN113783081B - Semiconductor saturable absorption assembly and mode locker - Google Patents
Semiconductor saturable absorption assembly and mode locker Download PDFInfo
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- CN113783081B CN113783081B CN202111011488.4A CN202111011488A CN113783081B CN 113783081 B CN113783081 B CN 113783081B CN 202111011488 A CN202111011488 A CN 202111011488A CN 113783081 B CN113783081 B CN 113783081B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
- H01S3/1106—Mode locking
- H01S3/1112—Passive mode locking
- H01S3/1115—Passive mode locking using intracavity saturable absorbers
- H01S3/1118—Semiconductor saturable absorbers, e.g. semiconductor saturable absorber mirrors [SESAMs]; Solid-state saturable absorbers, e.g. carbon nanotube [CNT] based
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
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- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Abstract
The application discloses semiconductor saturable absorption subassembly and mode locker, the semiconductor saturable absorption subassembly of this application includes first casing, second casing, saturable absorber, first adjusting part and second adjusting part. The first adjusting assembly is arranged on the surfaces of the first shell and the second shell and used for adjusting the saturable absorber to move upwards or downwards; the second adjusting component is arranged on the surfaces of the first shell and the second shell and used for adjusting the saturable absorber to move leftwards or rightwards. This application can change the position of saturable absorber in the saturable absorption subassembly of semiconductor through first adjusting part, second adjusting part to switch different saturable absorption points, realize multiple spot work, improve saturable absorber's utilization ratio, reduce the damage to saturable absorber, and then can increase of service life. In addition, the semiconductor saturable absorption component has the advantages of simple structure, low cost and convenient large-scale use.
Description
Technical Field
The application relates to the technical field of laser, in particular to a semiconductor saturable absorption assembly and a mode locker.
Background
In the related art, an ultrafast laser generates laser light by using the nonlinear absorption characteristic of a saturable absorber and changing the absorption of laser light in a cavity with the intensity of an optical field. The common structure is that a reflector is combined with a semiconductor saturable absorber, and the modulation depth of the absorber and the bandwidth of the reflector are adjusted by changing the thickness of the semiconductor saturable absorber and the refractive index of the reflector.
However, the structure has a narrow spectral response range and a complex structure, and the saturable absorber works in a single point, and is easily damaged and influences the service life after being exposed to pulse impact for a long time.
Disclosure of Invention
The present application is directed to solving at least one of the problems in the prior art. Therefore, the semiconductor saturable absorption component is provided, the structure can be simplified, and the service life can be prolonged.
A semiconductor saturable absorption module according to an embodiment of a first aspect of the present application, comprising: a first housing defining a receiving cavity; the second shell is provided with a light through hole and is arranged inside the accommodating cavity; the saturable absorber is positioned in the light through hole, and the periphery of the saturable absorber is connected with the inner wall of the second shell; the first adjusting assembly is arranged on the surfaces of the first shell and the second shell and used for adjusting the saturable absorber to move upwards or downwards; and the second adjusting assembly is arranged on the surfaces of the first shell and the second shell and is used for adjusting the saturable absorber to move leftwards or rightwards.
According to the semiconductor saturable absorption component of the embodiment of the application, at least the following beneficial effects are achieved: can change the position of saturable absorber in the saturable absorption subassembly of semiconductor through first regulating part, second regulating part to switch different saturable absorption points, realize multiple spot work, improve saturable absorber's utilization ratio, reduce the damage to saturable absorber, and then can increase of service life. In addition, the semiconductor saturable absorption component has the advantages of simple structure, low cost and convenient large-scale use.
According to some embodiments of the present application, the first adjustment assembly comprises: a first magnet disposed on an outer surface of the second housing; the second magnet is arranged on the outer surface, close to the first magnet, of the first shell and is parallel to the first magnet; wherein the first magnet and the second magnet are the same in magnetism to adjust the saturable absorber to move upwards, and opposite in magnetism to adjust the saturable absorber to move downwards.
According to some embodiments of the application, the second adjustment assembly comprises: a third magnet disposed on an outer surface of the second housing; the outer surface of the third magnet is adjacent to the outer surface of the first magnet; the fourth magnet is arranged on the outer surface, close to the third magnet, of the first shell and is parallel to the third magnet; wherein the third magnet is the same magnetic as the fourth magnet to adjust the saturable absorber to move leftward and the opposite magnetic to adjust the saturable absorber to move rightward.
According to some embodiments of the application, further comprising: the buffer assembly is arranged corresponding to the first adjusting assembly and the second adjusting assembly, so that buffer protection is achieved for movement of the first adjusting assembly and the second adjusting assembly.
According to some embodiments of the application, the cushioning assembly further comprises: the first spring is arranged on the inner wall, far away from the first magnet, of the first shell; and/or the second spring is arranged on the inner wall of the first shell, which is far away from the third magnet.
According to a mode locker of an embodiment of a second aspect of the present application, comprising: a semiconductor saturable absorber component according to an embodiment of the above first aspect of the present application; and the light-transmitting heat conduction assembly is arranged on the surface of the saturable absorber and used for dissipating heat of the saturable absorber.
According to the mode locker of the embodiment of the application, at least the following beneficial effects are achieved: by adopting the semiconductor saturable absorption assembly, the structure of the mode locker is simplified, the service life can be effectively prolonged, and the cost is greatly reduced; in addition, set up printing opacity heat conduction components and can improve the heat dispersion of mode locker to improve working property.
According to some embodiments of the application, further comprising: the focusing assembly is arranged on one side close to the light-transmitting heat-conducting assembly, is coupled with the semiconductor absorbable assembly and is used for focusing the laser beam on the semiconductor absorbable assembly.
According to some embodiments of the application, further comprising: the output assembly is arranged on one side far away from the light-transmitting heat-conducting assembly and is coupled with the semiconductor absorbable assembly.
According to some embodiments of the application, the focusing assembly comprises: a first optical fiber for transmitting the laser beam; and one side of the focusing lens is coupled with the first optical fiber, and the other side of the focusing lens is coupled with the light-transmitting heat-conducting component.
According to some embodiments of the application, the output assembly comprises: the second optical fiber is used for outputting the laser beam modulated by the semiconductor absorbable component; and one side of the collimating lens is coupled with the second optical fiber, and the other side of the collimating lens is coupled with the semiconductor absorbable component.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The present application is further described with reference to the following figures and examples, in which:
FIG. 1 is a schematic diagram of a semiconductor saturable absorber device according to an embodiment of the present application;
FIG. 2 is a schematic view of another embodiment of a semiconductor saturable absorber device according to the present application;
fig. 3 is a schematic structural diagram of a mold locker according to an embodiment of the present application.
Reference numerals:
the optical fiber saturable absorber comprises a semiconductor saturable absorption component 100, a first shell 110, a second shell 120, a saturable absorber 130, a first adjusting component 140, a first magnet 141, a second magnet 142, a second adjusting component 150, a third magnet 151, a fourth magnet 152, a buffer component 160, a first spring 161, a second spring 162, a light-transmitting heat-conducting component 200, a focusing component 300, a first optical fiber 310, a focusing lens 320, an output component 400, a second optical fiber 410 and a collimating lens 420.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it should be understood that the positional descriptions referred to, for example, the directions or positional relationships indicated by upper, lower, front, rear, left, right, etc., are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present application.
In the description of the present application, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and larger, smaller, larger, etc. are understood as excluding the present numbers, and larger, smaller, inner, etc. are understood as including the present numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present application, unless otherwise specifically limited, terms such as set, installed, connected and the like should be understood broadly, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present application in combination with the specific contents of the technical solutions.
In the description of the present application, reference to the description of "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
A semiconductor saturable absorber component according to an embodiment of the present application is described below with reference to fig. 1.
As shown in fig. 1, the semiconductor saturable absorber module according to the embodiment of the present application comprises a first shell 110, a second shell 120, a saturable absorber 130, a first adjustment module 140, and a second adjustment module 150.
The first housing 110 defines a receiving chamber; the second shell 120 defines a light through hole, and the second shell 120 is arranged inside the accommodating cavity; the saturable absorber 130 is positioned in the light through hole (not marked in the figure), and the periphery of the saturable absorber 130 is connected with the inner wall of the second shell 120; the first adjusting component 140 is disposed on the surface of the first casing 110 and the second casing 120, and is used for adjusting the saturable absorber 130 to move upwards or downwards; the second adjusting component 150 is disposed on the surface of the first housing 110 and the second housing 120, and is used for adjusting the saturable absorber 130 to move left or right.
For example, as shown in fig. 1, the first housing 110 may be formed substantially in a rectangular parallelepiped plate-shaped structure defining a housing chamber, and serves to enhance the airtightness of the semiconductor saturable absorption device 100, thereby improving reliability in use. The second housing 120 is arranged in the accommodating cavity, the second housing 120 is of a rectangular plate-shaped structure, a certain gap is reserved between the second housing 120 and the inner wall of the first housing 110, and a light through hole is defined in the second housing 120 and used for accommodating the saturable absorber 130. The periphery of the saturable absorber 130 is connected to the inner wall of the second housing 120, and four corners of the saturable absorber 130 are fixed in the light through holes by glue. The second housing 120 is a heat sink, the heat sink may be made of a material with high thermal conductivity, such as molybdenum copper, tungsten copper, and the like, and the heat sink is used for dissipating heat from the saturable absorber 130 to improve the working performance.
The first adjusting assembly 140 and the second adjusting assembly 150 are disposed on the surfaces of the first housing 110 and the second housing 120, wherein the first adjusting assembly 140 is used for adjusting the saturable absorber 130 to move upwards or downwards, and the second adjusting assembly 150 is used for adjusting the saturable absorber 130 to move leftwards or rightwards, so that the operating point of the saturable absorber 130 can be changed.
According to the semiconductor saturable absorber module 100 of the embodiment of the application, the position of the saturable absorber 130 in the semiconductor saturable absorber module 100 can be changed through the first adjusting module 140 and the second adjusting module 150, so that different saturable absorption points are switched, multi-point operation is realized, the utilization rate of the saturable absorber 130 is improved, damage to the saturable absorber 130 is reduced, and the service life is further prolonged. In addition, the semiconductor saturable absorption module 100 has a simple structure and low cost, and is convenient for large-scale use.
In some embodiments of the present application, as shown in fig. 1, the first adjustment assembly 140 includes a first magnet 141 and a second magnet 142, the first magnet 141 being disposed on an outer surface of the second housing 120; the second magnet 142 is disposed on the outer surface of the first casing 110 close to the first magnet 141, and is parallel to the first magnet 141; the first magnet 141 and the second magnet 142 have the same magnetism to adjust the saturable absorber 130 to move upwards, and have the opposite magnetism to adjust the saturable absorber 130 to move downwards. The direction of movement of the saturable absorber 130 can be adjusted by changing the polarity of the second magnet 142 provided on the outer surface of the first housing 110 according to the principle that like poles of magnets repel each other and opposite poles of magnets attract each other. For example, when the side of the first magnet 141 close to the second magnet 142 is N-polar, the polarity of the second magnet 142 is changed, and when the side of the second magnet 142 close to the first magnet 141 is N-polar, the saturable absorber 130 moves upward due to the repulsion of like poles; when the side of the second magnet 142 close to the first magnet 141 is S-pole, the saturable absorber 130 moves downward due to opposite attraction. The user only needs to change the polarity of the second magnet 142, and then the working point of the saturable absorber 130 can be changed; in addition, the second magnet 142 is disposed outside the first casing 110, which is convenient for a user to operate.
In some embodiments of the present application, as shown in fig. 1, the second adjustment assembly 150 includes a third magnet 151 and a fourth magnet 152, the third magnet 151 being disposed on an outer surface of the second housing 120; wherein, the outer surface of the third magnet 151 is adjacent to the outer surface of the first magnet 141; the fourth magnet 152 is disposed on the outer surface of the first casing 110 close to the third magnet 151, and is parallel to the third magnet 151; wherein the third magnet 151 is magnetically identical to the fourth magnet 152 to adjust the saturable absorber 130 to move leftward, and the magnetic polarities are opposite to adjust the saturable absorber 130 to move rightward.
The third magnet 151 is disposed on the outer surface of the second casing 120, and the fourth magnet 152 is disposed on the outer surface of the first casing 110 close to the third magnet 151, wherein the plane of the third magnet 151 is adjacent to the plane of the first magnet 141, and the plane of the fourth magnet 152 is adjacent to the plane of the second magnet 142. The direction of movement of the saturable absorber 130 can be adjusted by changing the polarity of the fourth magnet 152 provided on the outer surface of the first housing 110 according to the principle that like poles of magnets repel each other and opposite poles of magnets attract each other. For example, when the side of the third magnet 151 close to the fourth magnet 152 is N-polar, the polarity of the fourth magnet 152 is changed, and when the side of the fourth magnet 152 close to the third magnet 151 is N-polar, the saturable absorber 130 moves to the left due to the repulsion of like poles; when the side of the fourth magnet 152 close to the third magnet 151 is S-pole, the saturable absorber 130 moves rightward due to opposite attraction. The user only needs to change the polarity of the fourth magnet 152, so that the operating point of the saturable absorber 130 can be changed; in addition, the fourth magnet 152 is disposed outside the first casing 110, which is convenient for a user to operate.
In some embodiments of the present application, as shown in fig. 2, the semiconductor saturable absorber assembly 100 further includes a buffer assembly 160, and the buffer assembly 160 is disposed corresponding to the first adjustment assembly 140 and the second adjustment assembly 150 to buffer and protect the movement of the first adjustment assembly 140 and the second adjustment assembly 150. The buffering component 160 is arranged corresponding to the first adjusting component 140 and the second adjusting component 150, when the first adjusting component 140 controls the saturable absorber 130 to move upwards or downwards and the second adjusting component 150 controls the saturable absorber 130 to move leftwards or rightwards, the buffering and protecting effects on the movement of the saturable absorber 130 can be achieved, the second shell 120 is prevented from directly impacting the surface of the first shell 110, the saturable absorber 130 in the first shell 110 is damaged, and the service life of the saturable absorber 130 can be prolonged.
In some embodiments of the present application, as shown in fig. 2, the buffering assembly 160 further includes a first spring 161 and a second spring 162, the first spring 161 is disposed on an inner wall of the first housing 110 away from the first magnet 141; the second spring 162 is disposed on an inner wall of the first housing 110 away from the third magnet 151. The buffer assembly 160 includes a first spring 161 and a second spring 162, the first spring 161 is disposed opposite to the first magnet 141 and is disposed on an inner wall of the first casing 110 away from the first magnet 141; the second spring 162 is disposed opposite to the third magnet 151 and on the inner wall of the first casing 110 far from the third casing. One end of each of the first spring 161 and the second spring 162 is fixed on the inner wall of the first casing 110 by glue, and the other end is fixed on the outer surface of the second casing 120 by glue, so that when the first adjusting assembly 140 or the second adjusting assembly 150 works, the movement of the saturable absorber 130 can be buffered and protected. In other embodiments, the cushioning member 160 may be made of sponge, rubber, or other materials with cushioning effect.
In some embodiments, as shown in fig. 2 and 3, the present application further provides a mold locker, which includes a light-transmissive and heat-conductive component 200 and the semiconductor saturable absorber component 100 in any of the above embodiments, wherein the light-transmissive and heat-conductive component 200 is disposed on a surface of the saturable absorber 130 for dissipating heat from the saturable absorber 130. The light-transmissive heat-conductive member 200 is made of an optical material having a high thermal conductivity and a high transparency to operating light wavelengths, such as sapphire, ruby, silicon nitride, and the like. The transparent heat conducting component 200 is disposed on the surface of the saturable absorber 130, and is configured to transmit a laser beam to irradiate the surface of the saturable absorber 130, and simultaneously dissipate heat from the saturable absorber 130, so as to reduce influence of temperature on operation of the mode locker.
According to the mode locker of the embodiment of the application, by adopting the semiconductor saturable absorption assembly 100, the structure of the mode locker is simplified, meanwhile, the service life can be effectively prolonged, and the cost is greatly reduced; in addition, set up printing opacity heat conduction assembly 200 and can improve the heat dispersion of mode locker to improve working property.
In some embodiments of the present application, as shown in fig. 2 and 3, the mode locker further includes a focusing element 300, and the focusing element 300 is disposed at a side close to the light-transmitting and heat-conducting element 200, and coupled to the semiconductor absorptive element, for focusing the incident laser beam on the semiconductor absorptive element. The focusing assembly 300 modulates the laser beam, the modulated laser beam passes through the light-transmitting heat-conducting assembly 200 and then is projected onto the surface of the saturable absorber 130, and the saturable absorber 130 performs nonlinear absorption on the laser beam, so as to obtain the target pulse laser.
In some embodiments of the present application, the mold locker further includes an output member 400, and the output member 400 is disposed at a side far away from the light-transmissive heat-conductive member 200 and coupled to the semiconductor absorbable member. The output component 400 is disposed opposite to the focusing component 300, and is located at a side far away from the light-transmitting and heat-conducting component 200, and is configured to receive and output the target pulsed laser modulated by the saturable absorber 130. In other embodiments, the focusing element 300, the semiconductor saturable absorber element 100 and the output element 400 are located on the same central axis, which can improve the photon absorption rate of the saturable absorber 130, thereby obtaining more optical feedback.
In some embodiments of the present application, the focusing assembly 300 includes a first optical fiber 310 and a focusing lens 320, the first optical fiber 310 being used for transmitting the laser beam; the focusing lens 320 is coupled to the first optical fiber 310 on one side and to the light-transmissive heat-conductive member 200 on the other side. The incident laser beam is transmitted to the focusing lens 320 through the first optical fiber 310, the focusing lens 320 focuses the laser beam, and the focused laser beam is projected onto the surface of the light-transmitting heat-conducting component 200, passes through the light-transmitting heat-conducting component 200, and enters the semiconductor saturable absorption component 100. The mode locker can be conveniently connected with other optical devices through the first optical fiber 310, and the use process of the mode locker is simplified.
In some embodiments of the present application, the output assembly 400 includes a second optical fiber 410 and a collimating lens 420, the second optical fiber 410 is used for outputting the laser beam modulated by the semiconductor absorbable assembly; the collimating lens 420 is coupled to the second optical fiber 410 on one side and to the semiconductor absorbable component on the other side. The collimating lens 420 is configured to collimate the laser beam modulated by the semiconductor saturable absorption component 100, and the collimated laser beam enters the second optical fiber 410 and is output by the second optical fiber 410.
The embodiments of the present application have been described in detail with reference to the drawings, but the present application is not limited to the embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present application. Furthermore, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
Claims (8)
1. A semiconductor saturable absorber assembly, comprising:
a first housing defining a receiving cavity;
the second shell is provided with a light through hole and is arranged inside the accommodating cavity;
the saturable absorber is positioned in the light through hole, and the periphery of the saturable absorber is connected with the inner wall of the second shell;
the first adjusting assembly is arranged on the surfaces of the first shell and the second shell and used for adjusting the saturable absorber to move upwards or downwards;
the second adjusting assembly is arranged on the surfaces of the first shell and the second shell and used for adjusting the saturable absorber to move leftwards or rightwards;
the first adjustment assembly includes:
the first magnet is arranged on the outer surface of the second shell;
the second magnet is arranged on the outer surface, close to the first magnet, of the first shell and is parallel to the first magnet;
wherein the first magnet and the second magnet are the same in magnetism to adjust the saturable absorber to move upwards, and the opposite in magnetism to adjust the saturable absorber to move downwards;
the second adjustment assembly includes:
a third magnet disposed on an outer surface of the second housing; the outer surface of the third magnet is adjacent to the outer surface of the first magnet;
the fourth magnet is arranged on the outer surface, close to the third magnet, of the first shell and is parallel to the third magnet;
wherein the third magnet is the same magnetic as the fourth magnet to adjust the saturable absorber to move leftward and the opposite magnetic to adjust the saturable absorber to move rightward.
2. The semiconductor saturable absorber assembly of claim 1, further comprising:
the buffer assembly is arranged corresponding to the first adjusting assembly and the second adjusting assembly, so that buffer protection is achieved for movement of the first adjusting assembly and the second adjusting assembly.
3. The semiconductor saturable absorber assembly of claim 2, wherein the buffer assembly further comprises:
the first spring is arranged on the inner wall, far away from the first magnet, of the first shell;
and the second spring is arranged on the inner wall of the first shell, which is far away from the third magnet.
4. Mode locker, its characterized in that includes:
a semiconductor saturable absorber component of any one of claims 1 to 3;
and the light-transmitting heat conduction component is arranged on the surface of the saturable absorber and used for dissipating heat of the saturable absorber.
5. The mode locker according to claim 4, further comprising:
the focusing assembly is arranged on one side close to the light-transmitting heat-conducting assembly, is coupled with the semiconductor absorbable assembly and is used for focusing a laser beam on the semiconductor absorbable assembly.
6. The mold locker according to claim 5, further comprising:
the output assembly is arranged on one side far away from the light-transmitting heat-conducting assembly and is coupled with the semiconductor absorbable assembly.
7. The mode locker of claim 6, wherein said focusing assembly comprises:
a first optical fiber for transmitting the laser beam;
and one side of the focusing lens is coupled with the first optical fiber, and the other side of the focusing lens is coupled with the light-transmitting heat-conducting component.
8. The mode locker of claim 7, wherein said output assembly comprises:
the second optical fiber is used for outputting the laser beam modulated by the semiconductor absorbable component;
and one side of the collimating lens is coupled with the second optical fiber, and the other side of the collimating lens is coupled with the semiconductor absorbable component.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111011488.4A CN113783081B (en) | 2021-08-31 | 2021-08-31 | Semiconductor saturable absorption assembly and mode locker |
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| CN202111011488.4A CN113783081B (en) | 2021-08-31 | 2021-08-31 | Semiconductor saturable absorption assembly and mode locker |
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| CN113783081B true CN113783081B (en) | 2022-11-04 |
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| US7649920B2 (en) * | 2007-04-03 | 2010-01-19 | Topcon Corporation | Q-switched microlaser apparatus and method for use |
| CN103185122A (en) * | 2012-03-31 | 2013-07-03 | 北京普纳森电子科技有限公司 | Magnetically-coupled vacuum transmission device applicable to plasma processing equipment |
| CN105883211A (en) * | 2016-06-04 | 2016-08-24 | 长葛市尚辰机械制造有限公司 | Novel portable type machinery part assembly box |
| CN106981817A (en) * | 2017-05-23 | 2017-07-25 | 苏州贝林激光有限公司 | The devices and methods therefor of saturable absorbing mirror service life can be extended |
| CN211508176U (en) * | 2020-03-24 | 2020-09-15 | 深圳市达则科技有限责任公司 | Saturable absorber device for optical fiber mode-locked laser |
| CN111653936A (en) * | 2020-06-22 | 2020-09-11 | 广东瀚盈激光科技有限公司 | Point changing device of semiconductor saturable absorption mirror, collimation adjusting method and laser |
| CN214313853U (en) * | 2020-12-23 | 2021-09-28 | 珠海光库科技股份有限公司 | Mode locking device capable of replacing saturable absorption mirror and mode locking laser |
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