JP2008184621A - Sealing agent, member coated with thermally sprayed coating, and bearing - Google Patents

Sealing agent, member coated with thermally sprayed coating, and bearing Download PDF

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JP2008184621A
JP2008184621A JP2007016514A JP2007016514A JP2008184621A JP 2008184621 A JP2008184621 A JP 2008184621A JP 2007016514 A JP2007016514 A JP 2007016514A JP 2007016514 A JP2007016514 A JP 2007016514A JP 2008184621 A JP2008184621 A JP 2008184621A
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sealing agent
thermal spray
spray coating
ether compound
sealing
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JP5069473B2 (en
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Kazutoyo Murakami
和豊 村上
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NTN Corp
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NTN Corp
NTN Toyo Bearing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a sealing agent which is excellent in the penetration property and the filling property into pores (voids) and with which it is possible to attain such sealing state that substantially all of the voids of a thermally sprayed coating are filled; and to provide a member coated with a thermally sprayed coating. <P>SOLUTION: The sealing agent for a thermally sprayed coating comprises epoxy group-containing components, a curing agent for the epoxy group-containing components and a hydroxyl group-containing vinyl ether compound, and is free from polymerizable vinyl group-containing solvents except the hydroxyl group-containing vinyl ether compound, wherein the hydroxyl group-containing vinyl ether compound is incorporated in an amount of 10-30 wt.% based on the whole of the epoxy-containing components. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、封孔処理剤、溶射被膜被覆部材および軸受に関し、特にエポキシ樹脂系封孔処理剤および該処理剤により処理されて得られる溶射被膜被覆部材および軸受に関する。   The present invention relates to a sealing agent, a thermal spray coating member, and a bearing, and more particularly, to an epoxy resin-based sealing agent, and a thermal spray coating member and a bearing obtained by treatment with the processing agent.

鋼等から構成される機械部品の基材表面に金属またはセラミックスなどの硬質粒子および粉体を溶射し、耐熱性や耐摩耗性、耐食性を高める技術は以前より実施されている。一般に溶射被膜はその被膜形成の過程で生じる空隙や間隙、ボイド等の気孔を有しており、この気孔は種々の特性を被膜自体に付与している。気孔の中で、あるものは基材表面から基材素地に通じる連通孔の形態を示し、被膜表層が接している環境と、被膜が被覆されている基材とを連通している。この連通孔を通じて、溶射被膜外部に接触した気体や液体が基材素地まで浸透したり、拡散したりする現象がみられる。その結果、溶射材自身が腐食劣化したり、素地基材が炭素鋼などの場合は、被膜と基材の接触界面で、基材が選択的に腐食劣化して、溶射被膜の基材に対する接合性が損なわれ剥離したりする場合がある。また、機械部品本体と、それが設置/具備される部材との間の絶縁性を確保する目的でセラミックス溶射がなされる場合があるが、上述の気体や液体の浸透拡散現象によって絶縁破壊され、所望の絶縁抵抗が発揮されなくなる場合もある。   A technique for improving the heat resistance, wear resistance, and corrosion resistance by spraying hard particles and powders such as metals or ceramics on the surface of a base material of a machine part composed of steel or the like has been practiced. In general, the thermal spray coating has pores such as voids, gaps, and voids generated in the process of forming the coating, and these pores impart various characteristics to the coating itself. Some of the pores show the form of communication holes that lead from the substrate surface to the substrate substrate, and communicate the environment where the coating surface layer is in contact with the substrate on which the coating is coated. Through this communication hole, a phenomenon is observed in which a gas or liquid in contact with the outside of the thermal spray coating permeates or diffuses to the base material. As a result, when the thermal spray material itself deteriorates due to corrosion, or when the base substrate is carbon steel or the like, the substrate selectively deteriorates at the contact interface between the coating and the substrate, and the spray coating is bonded to the substrate. It may lose its properties and peel off. In addition, ceramic spraying may be performed for the purpose of ensuring insulation between the machine part main body and the member on which it is installed / provided, but the dielectric breakdown is caused by the above-mentioned gas and liquid penetration diffusion phenomenon, In some cases, the desired insulation resistance may not be exhibited.

そこで、溶射被膜を形成した後、何らかの封孔処理を施し、被膜の環境遮断性を高める封孔処理が行なわれてきた。従来から広く知られる一般的な封孔処理方法として、エポキシ樹脂、アクリル樹脂、ウレタン樹脂、フェノール樹脂、フッ素樹脂等の合成樹脂を有機溶剤に溶解させた封孔処理剤を溶射被膜に塗布する方法がある。しかし、この方法では、溶射被膜表面に塗布されるだけで細孔の底部までは浸透しない。したがって形状(寸法)精度を保つために、封孔処理後に溶射被膜表面を研削あるいは研磨などで除去した場合、溶射被膜に対する封孔処理効果はほとんど期待できないことがある。また、使用している過程で摩耗により合成樹脂の塗膜がすり減ってしまい、封孔処理の効果が持続しない場合も見られる。   Therefore, after forming a sprayed coating, some sealing treatment has been performed to perform a sealing treatment that enhances the environmental barrier properties of the coating. As a general well-known sealing treatment method, a method of applying a sealing treatment agent in which a synthetic resin such as an epoxy resin, an acrylic resin, a urethane resin, a phenol resin, or a fluororesin is dissolved in an organic solvent is applied to the spray coating. There is. However, in this method, it is only applied to the surface of the sprayed coating and does not penetrate to the bottom of the pores. Therefore, when the surface of the sprayed coating is removed by grinding or polishing after the sealing treatment in order to maintain the shape (dimension) accuracy, the sealing treatment effect on the sprayed coating may be hardly expected. In addition, there are cases where the coating film of the synthetic resin is worn away due to wear in the process of use, and the effect of the sealing treatment is not sustained.

一方、封孔処理を施すことで、金属基材と溶射被膜材との密着力を向上させようとする試みもしばしば行なわれる。
一般的な溶射被膜は、被膜を製膜させたい表面とは化学的な結合を形成するのではなく、機械的な締結力(アンカー効果、投錨効果などという。)が主となって基材との密着力を構成する。特に歯車や軸受、スピンドルなど、金属基材からなる寸法精度の要求が厳しい機械部品表面に対し溶射を適用する場合、これら機械部品の表面は研摩で仕上げることが多く、表面粗さRaが1μm 未満になっていることが多い。よって、これら金属部品の表面に溶射を行なう場合、ショットブラストあるいはタンブラー処理などの公知の表面改質手法にて、表面粗さRaを1μm 以上程度まで増大させる処理を行なうことが多い。この手法により、ある程度溶射被膜と基材との間の接着力の向上は可能であるが、表面改質の程度次第では基材の寸法精度が悪化したり、表層部の焼き鈍りが起こることで基材材質の物性が低下するなどの弊害が起こりうる。結果的に、この手法による密着力の向上手法には限界がある。
On the other hand, attempts are often made to improve the adhesion between the metal substrate and the thermal spray coating material by applying a sealing treatment.
A general thermal sprayed coating does not form a chemical bond with the surface on which the coating is to be formed, but a mechanical fastening force (referred to as an anchoring effect, anchoring effect, etc.) and the base material. Consistency of contact. In particular, when spraying is applied to the surfaces of mechanical parts made of metal substrates such as gears, bearings, and spindles, where the dimensional accuracy is severely demanded, the surfaces of these machine parts are often polished and the surface roughness Ra is less than 1 μm. In many cases. Therefore, when spraying the surfaces of these metal parts, a process of increasing the surface roughness Ra to about 1 μm or more is often performed by a known surface modification method such as shot blasting or tumbling. This technique can improve the adhesion between the thermal spray coating and the substrate to some extent, but depending on the degree of surface modification, the dimensional accuracy of the substrate may deteriorate or the surface layer may be annealed. Defects such as deterioration of physical properties of the base material may occur. As a result, there is a limit to the method for improving the adhesion by this method.

そこで、物理的な密着力を補助するために化学的な接着力を併用するよう努力がなされてきたが、上記に示す一般的な封孔処理方法では、溶射被膜表面に塗布されるだけで細孔の底部の基材界面まで浸透しないため、溶射被膜の最外表面近傍のセラミックス粒子間の接着力のみを高めるだけに留まってしまい、金属基材と溶射被膜材との間で化学的な接着力を発揮させるには到らない。   Therefore, efforts have been made to use chemical adhesion in combination to assist physical adhesion. However, in the general sealing treatment method described above, the coating is only applied to the surface of the sprayed coating. Since it does not penetrate to the base material interface at the bottom of the hole, it only increases the adhesion between the ceramic particles near the outermost surface of the thermal spray coating, and the chemical adhesion between the metal base and the thermal spray coating material. It does not reach the power.

これらを改善する方法として、例えば、封孔処理剤に、可視光線により硬化する光硬化性樹脂を利用する方法(特許文献1参照)、電着塗料により、塗料粒子の電気泳動現象で溶射被膜の細孔中に析出・充填させようとする方法(特許文献2参照)、ガラス質物質を形成するB23 を添加した溶射材を母材表面に溶射した後、溶射被膜を加熱してB23 を溶融させ、溶射被膜中に発生している間隙に充填する方法(特許文献3参照)、溶射材料中にガラス質物質を形成するB23 を添加して被膜を形成し、その後の加熱処理で溶融B23 が気孔充填作用を行なうもの(特許文献3参照)などが知られている。しかし、これらの方法は、加圧または減圧工程に加え、いずれも特殊な装置や煩雑な工程を必要とするなど、工業的生産方法に適さないという問題がある。 As a method for improving these, for example, a method of using a photocurable resin that is cured by visible light as a sealing agent (see Patent Document 1), an electro-deposition paint, and an electrophoretic phenomenon of paint particles, A method of depositing and filling pores (see Patent Document 2), spraying a sprayed material added with B 2 O 3 forming a vitreous substance on the surface of the base material, and then heating the sprayed coating to form B A method of melting 2 O 3 and filling a gap generated in the sprayed coating (see Patent Document 3), adding B 2 O 3 forming a vitreous substance in the sprayed material to form a coating, There are known ones in which molten B 2 O 3 performs pore filling in the subsequent heat treatment (see Patent Document 3). However, these methods have a problem that they are not suitable for industrial production methods, such as requiring special equipment and complicated steps in addition to the pressurization or decompression step.

このため、封孔処理剤の必須組成として、(i)合成樹脂、(ii)重合性有機溶剤、並びに(iii)フッ素系界面活性剤およびパーフルオロ基含有有機ケイ素化合物からなる群から選ばれる少なくとも1種を含有させる方法が知られている(特許文献4参照)。この方法は、(i)合成樹脂の硬化時、「(ii)重合性有機溶剤を単独で」あるいは「(i)合成樹脂と複合的に」硬化物を形成させることを意図しているものであるが、(ii)重合性有機溶剤の単純な加熱のみでは、溶液中の溶存酸素などが重合を阻害するため、実際に溶剤部分が硬化することが困難である。特に、特許文献4の実施例に示されたような、代表的なビニル基含有有機化合物である「スチレンモノマー」を重合性溶剤とした場合、エポキシ樹脂の硬化温度では重合反応は充分に行なわれず、エポキシ樹脂中に未反応の重合性溶剤が残存し、硬化後封孔樹脂の長期的な安定性に懸念が生じる。重合性溶剤の重合反応を促進する目的で、特許文献4にも記載があるとおりラジカル重合開始剤などを配合したり、一方で、封孔処理剤の系に溶存する酸素を高度に除去することが必要となる。しかしながら、高温型ラジカル重合開始剤は一般的に反応性が高く爆発などの危険性が高い有機過酸化物からなるため、取扱上の注意が必要であった。一方で低温型重合開始剤を選択すればかかる懸念事項は緩和されるが、低温においても重合開始剤の分解反応が進行するため、未硬化封孔処理剤のポットライフに留意する必要が生じる。また、溶存酸素量の観点からも、保存安定性を高めるために細かい注意事項の遵守が常に要求されるという問題がある。   Therefore, the essential composition of the sealing agent is at least selected from the group consisting of (i) a synthetic resin, (ii) a polymerizable organic solvent, and (iii) a fluorosurfactant and a perfluoro group-containing organosilicon compound. A method of containing one kind is known (see Patent Document 4). This method is intended to form a cured product when (i) the synthetic resin is cured, ((ii) the polymerizable organic solvent alone or in combination with (i) the synthetic resin). However, (ii) only by simple heating of the polymerizable organic solvent, dissolved oxygen or the like in the solution inhibits the polymerization, so that it is difficult to actually cure the solvent portion. In particular, when “styrene monomer”, which is a typical vinyl group-containing organic compound as shown in Examples of Patent Document 4, is used as a polymerizable solvent, the polymerization reaction is not sufficiently performed at the curing temperature of the epoxy resin. The unreacted polymerizable solvent remains in the epoxy resin, and there is concern about the long-term stability of the sealing resin after curing. For the purpose of accelerating the polymerization reaction of the polymerizable solvent, a radical polymerization initiator or the like is blended as described in Patent Document 4, while the oxygen dissolved in the sealing agent system is highly removed. Is required. However, high temperature type radical polymerization initiators are generally composed of organic peroxides that are highly reactive and have a high risk of explosion, and therefore, care must be taken in handling. On the other hand, if a low temperature type polymerization initiator is selected, such concerns are alleviated. However, since the decomposition reaction of the polymerization initiator proceeds even at a low temperature, it is necessary to pay attention to the pot life of the uncured sealing agent. In addition, from the viewpoint of the amount of dissolved oxygen, there is a problem that it is always required to observe detailed precautions in order to enhance storage stability.

上述のとおり、従来技術においては、たとえ基材表面まで封孔処理剤を浸透させることに成功しても、重合性溶剤をエポキシ樹脂に配合することによる懸念事項が存在している。
一方、フレキシブル配線基板材料や半導体パッケージ用ビルドアップ材料や液晶ディスプレー周辺材料に用いられる強靭性をもつウレタン変性エポキシ樹脂として、イソシアネート類とヒドロキシビニルエーテル類とグリシドール類とを反応させて得られるエポキシ樹脂が知られている(特許文献5参照)。
しかし、このヒドロキシビニルエーテル類は、ウレタン変性エポキシ樹脂の樹脂骨格を形成するために配合されているのであり、封孔処理剤の低粘度化、高浸透化等については寄与しないものである。
特開平5−106014号公報 特開平6−212391号公報 特開平10−259469号公報 特開2003−183806号公報 特開2006−111809号公報
As described above, in the prior art, even if the sealing agent is permeated to the surface of the base material, there are concerns due to blending the polymerizable solvent into the epoxy resin.
On the other hand, epoxy resins obtained by reacting isocyanates, hydroxyvinyl ethers and glycidols as toughened urethane-modified epoxy resins used for flexible wiring board materials, build-up materials for semiconductor packages, and peripheral materials for liquid crystal displays. It is known (see Patent Document 5).
However, these hydroxy vinyl ethers are blended in order to form the resin skeleton of urethane-modified epoxy resin, and do not contribute to lowering the viscosity or increasing the penetration of the sealing agent.
JP-A-5-106014 JP-A-6-212391 JP-A-10-259469 Japanese Patent Laid-Open No. 2003-183806 JP 2006-111809 A

本発明は、かかる問題に対処するためになされたものであり、気孔(間隙)に対する浸透性および充填性に優れ、溶射被膜材の間隙が実質的に全て充填されている状態まで封孔処理を施すことができ、経時的な封孔特性の劣化を回避できる封孔処理剤および封孔処理方法、ならびに研削または研磨除去されても封孔処理剤の浸透・充填層が十分存在し、更に機械的性質、電気的性質などの物性をも向上させることができる溶射被膜被覆部材、およびそれを用いた軸受の提供を目的とする。   The present invention has been made in order to cope with such problems, and has excellent permeability and filling ability to pores (gap), and sealing treatment is performed until substantially all gaps of the thermal spray coating material are filled. A sealing agent and a sealing method that can be applied and avoid deterioration of sealing characteristics over time, and there is a sufficient penetration / filling layer of the sealing agent even after being removed by grinding or polishing. It is an object of the present invention to provide a thermal spray coating member capable of improving physical properties such as mechanical properties and electrical properties, and a bearing using the same.

本発明の封孔処理剤は、エポキシ基含有成分と、該エポキシ基含有成分の硬化剤と、水酸基含有ビニルエーテル化合物とを含み、上記水酸基含有ビニルエーテル化合物以外の重合性ビニル基含有溶剤を含まない、溶射被膜の封孔処理剤であって、上記水酸基含有ビニルエーテル化合物は、上記エポキシ基含有成分全体に対して、 10〜30 重量%配合されていることを特徴とする。
また、上記エポキシ基含有成分は、1分子中に含まれるエポキシ基の数が3個以上のポリグリシジルエーテル化合物を必須成分とし、1分子中に含まれるエポキシ基の数が2個のアルキレンジグリシジルエーテル化合物および環状脂肪族ジエポキシ化合物から選ばれた少なくとも1つを含む混合物であり、上記硬化剤を除く、上記エポキシ基含有成分全体に対して、ポリグリシジルエーテル化合物が 10〜80 重量%配合されていることを特徴とする。
上記エポキシ基含有成分は、更に1分子中に含まれるエポキシ基の数が1個のモノグリシジルエーテル化合物を含むことを特徴とする。
本発明の溶射被膜被覆部材は、金属基材上に上記封孔処理剤で封孔処理された溶射被膜を有する溶射被膜被覆部材であることを特徴とする。
本発明の軸受は上記溶射被膜被覆部材が軸受構成部材表面に形成されていることを特徴とする。
The sealing agent of the present invention contains an epoxy group-containing component, a curing agent for the epoxy group-containing component, and a hydroxyl group-containing vinyl ether compound, and does not contain a polymerizable vinyl group-containing solvent other than the hydroxyl group-containing vinyl ether compound. A sealing agent for thermal spray coating, wherein the hydroxyl group-containing vinyl ether compound is blended in an amount of 10 to 30% by weight based on the total epoxy group-containing component.
In addition, the epoxy group-containing component is a polyglycidyl ether compound having 3 or more epoxy groups contained in one molecule as an essential component, and alkylene diglycidyl having 2 epoxy groups contained in one molecule. A mixture containing at least one selected from an ether compound and a cycloaliphatic diepoxy compound, wherein the polyglycidyl ether compound is blended in an amount of 10 to 80% by weight based on the whole epoxy group-containing component excluding the curing agent. It is characterized by being.
The epoxy group-containing component further includes a monoglycidyl ether compound having one epoxy group in one molecule.
The thermal spray coating member of the present invention is a thermal spray coating member having a thermal spray coating sealed with the above-described sealing agent on a metal substrate.
The bearing according to the present invention is characterized in that the thermal spray coating member is formed on the surface of the bearing constituent member.

本発明の封孔処理剤は、極めて低粘度のエポキシ基含有成分 70〜90 重量%と、同様に極めて低粘度の溶剤である水酸基含有ビニルエーテル化合物 10〜30 重量%の混合物に、更に低粘度の液状硬化剤を添加した組成であるので、封孔剤混合物は非常に低粘度となり、従来の重合性/非重合性溶剤を使用して系を低粘度化した封孔処理剤と比較し、同等以上の浸透性を確保できる。また、本化合物を添加剤に用いることで、蒸発減量を大幅に低下させることが出来るため、封孔処理後の溶射膜の空隙は効果的に樹脂で充填される。更に、本化合物を添加剤に用いることで系の反応性は大幅に向上し、熱硬化条件を緩和できる。
上記エポキシ基含有成分が所定のポリグリシジルエーテル化合物を主成分とする混合物であるので、封孔処理剤における溶剤の揮発による空隙の発生を効果的に抑制し、溶射被膜材の間隙が実質的に全て充填されている状態まで封孔処理を施すことができる。
また、複数のポリグリシジルエーテル化合物の混合物は、分子構造が類似するので相溶性に優れるため、相分離などが生じるおそれがないことから気孔内に容易に浸透することができる。このため溶射被膜材の封孔状態や経時的な封孔特性の劣化のおそれを回避でき、使用時における溶射被膜の剥離などの破損を防止し、機械部品の寿命を向上させることができる。
The sealing agent of the present invention comprises a mixture of 70 to 90% by weight of an epoxy group-containing component having an extremely low viscosity and 10 to 30% by weight of a hydroxyl group-containing vinyl ether compound which is also a very low viscosity solvent. Since it has a composition with a liquid curing agent added, the sealant mixture has a very low viscosity, which is equivalent to a sealant with a low viscosity using a conventional polymerizable / non-polymerizable solvent. The above permeability can be secured. Further, by using the present compound as an additive, the evaporation loss can be greatly reduced, so that the voids of the sprayed film after the sealing treatment are effectively filled with the resin. Furthermore, by using this compound as an additive, the reactivity of the system is greatly improved, and the thermosetting conditions can be relaxed.
Since the epoxy group-containing component is a mixture containing a predetermined polyglycidyl ether compound as a main component, the generation of voids due to the volatilization of the solvent in the sealing agent is effectively suppressed, and the gap between the sprayed coating materials is substantially reduced. The sealing process can be performed until all of them are filled.
In addition, since a mixture of a plurality of polyglycidyl ether compounds has a similar molecular structure and is excellent in compatibility, there is no possibility of phase separation or the like, so that it can easily penetrate into pores. For this reason, it is possible to avoid the possibility of deterioration of the sealing state of the sprayed coating material and the sealing characteristics over time, prevent damage such as peeling of the sprayed coating during use, and improve the life of the machine parts.

また、本発明の溶射被膜被覆部材は、上記封孔処理剤を用いて形成されるので、溶射被膜の気孔(間隙)に対する浸透性および充填性に優れ、封孔処理後に溶射被膜表層部分を研削あるいは研磨除去した場合でも封孔処理剤の浸透・充填層が十分存在し、その結果被膜の基材保護性を大幅に向上させ、更に機械的性質、電気的性質などの物性を向上させることができ、軸受に用いることができる。   In addition, since the thermal spray coating member of the present invention is formed using the above-mentioned sealing agent, it has excellent permeability and filling properties with respect to pores (gap) of the thermal spray coating, and the surface layer portion of the thermal spray coating is ground after the sealing treatment. Or even if it is removed by polishing, there is a sufficient penetration / filling layer of the sealing agent, and as a result, the substrate protection of the film can be greatly improved, and further physical properties such as mechanical properties and electrical properties can be improved. Can be used for bearings.

溶射被膜材の封孔特性の劣化や使用時における溶射被膜の破損を防止できる封孔処理剤について鋭意検討した結果、エポキシ基含有成分として、1分子中に含まれるエポキシ基の数が異なる所定のポリグリシジルエーテル化合物等の混合物とともに、水酸基含有ビニルエーテル化合物とを含む封孔処理剤を用いて封孔処理された溶射被膜は、水酸基含有ビニルエーテル化合物を含まない封孔処理剤に比較して、気孔(間隙)に対する浸透性および充填性に優れ、封孔処理後に溶射被膜表層部分を研削あるいは研磨除去した場合でも封孔処理剤の浸透・充填層が十分存在し、その結果被膜の基材保護性を大幅に向上させ、更に機械的性質、電気的性質などの物性をも向上させ得ることを見出した。
これは優れた浸透性および充填性により粒子境界に侵入した封孔処理剤が粒子境界を適切に充填し、優れた接着力により粒子境界と強固に接着し、かつ揮発性の高い重合性ビニル基含有溶剤を含まないので、溶剤の揮発による空隙の発生を効果的に抑制することにより、溶射被膜材の間隙が実質的に全て充填されている状態まで封孔処理を施すことができることによるものと考えられる。本発明はこのような知見に基づき完成されたものである。
As a result of intensive investigations on a sealing agent that can prevent deterioration of the sealing properties of the thermal spray coating material and breakage of the thermal spray coating during use, the number of epoxy groups contained in one molecule is different as an epoxy group-containing component. The thermal spray coating that has been sealed using a sealing agent containing a hydroxyl group-containing vinyl ether compound together with a mixture of a polyglycidyl ether compound or the like has pores ( It has excellent permeability and filling ability to the gap), and even if the surface layer of the thermal spray coating is ground or polished after the sealing treatment, there is a sufficient penetration / filling layer of the sealing agent, resulting in the protection of the base material of the coating. It has been found that the physical properties such as mechanical properties and electrical properties can be improved significantly.
This is because the sealing agent that has penetrated the particle boundary due to its excellent permeability and filling property properly fills the particle boundary, firmly adheres to the particle boundary due to its excellent adhesive force, and has a highly volatile polymerizable vinyl group. Because it does not contain the contained solvent, by effectively suppressing the generation of voids due to the volatilization of the solvent, it is possible to perform the sealing treatment until the gap of the thermal spray coating material is substantially all filled Conceivable. The present invention has been completed based on such findings.

本発明の封孔処理剤は、1分子中に含まれる官能基が少なくとも水酸基とビニル基である水酸基含有ビニルエーテル化合物と、1分子中に含まれるエポキシ基の数が3個以上のポリグリシジルエーテル化合物を必須成分とし、この必須成分に加えて、1分子中に含まれるエポキシ基の数が2個のアルキレンジグリシジルエーテル化合物および/または1分子中に含まれるエポキシ基の数が2個の環状脂肪族ジエポキシ化合物を含む混合物である。ポリグリシジルエーテル化合物および環状脂肪族ジエポキシ化合物はその分子内にオキシラン環が解裂して形成される繰り返し単位を含まない化合物である。本発明の混合物は硬化剤と反応して硬化物を形成する。   The sealing agent of the present invention includes a hydroxyl group-containing vinyl ether compound in which functional groups contained in one molecule are at least a hydroxyl group and a vinyl group, and a polyglycidyl ether compound having 3 or more epoxy groups contained in one molecule. In addition to this essential component, an alkylene diglycidyl ether compound having two epoxy groups contained in one molecule and / or a cyclic fat having two epoxy groups contained in one molecule It is a mixture containing a group diepoxy compound. A polyglycidyl ether compound and a cycloaliphatic diepoxy compound are compounds that do not contain a repeating unit formed by cleavage of an oxirane ring in the molecule. The mixture of the present invention reacts with a curing agent to form a cured product.

水酸基含有ビニルエーテル化合物としては、2−ヒドロキシエチルビニルエーテル、4−ヒドロキシブチルビニルエーテル、ジエチレングリコールモノビニルエーテル、ヒドロキシメチルビニルエーテル、ヒドロキシプロピルビニルエーテル、ヒドロキシペンチルビニルエーテル、ヒドロキシヘキシルビニルエーテル、ヒドロキシヘプチルビニルエーテル、ヒドロキシオクチルビニルエーテル、ヒドロキシノニルビニルエーテル、4−ヒドロキシシクロへキシルビニルエーテル、3−ヒドロキシシクロへキシルビニルエーテル、2−ヒドロキシシクロへキシルビニルエーテル、シクロヘキサンジメタノールモノビニルエーテル、ジエチレングリコールモノビニルエーテル、トリエチレングリコールモノビニルエーテル、テトラエチレングリコールモノビニルエーテルなどが挙げられる。これらの中で、封孔処理剤の粘度を下げることができ、化合物自体が低粘度であり、かつ熱硬化時の発熱反応による溶剤の揮発を抑えることができ、化合物の沸点は高く、更には、作業環境の悪化を防ぐことができ、生体粘膜への刺激性が極めて低い、ジエチレングリコールモノビニルエーテル化合物が好ましい。
水酸基含有ビニルエーテル化合物は希釈剤としても作用する。
Examples of the hydroxyl group-containing vinyl ether compound include 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, hydroxymethyl vinyl ether, hydroxypropyl vinyl ether, hydroxypentyl vinyl ether, hydroxyhexyl vinyl ether, hydroxyheptyl vinyl ether, hydroxyoctyl vinyl ether, hydroxynonyl vinyl ether. 4-hydroxycyclohexyl vinyl ether, 3-hydroxycyclohexyl vinyl ether, 2-hydroxycyclohexyl vinyl ether, cyclohexanedimethanol monovinyl ether, diethylene glycol monovinyl ether, triethylene glycol monovinyl ether, tetraethyleneglycol Such as mono-vinyl ether. Among these, the viscosity of the sealing agent can be lowered, the compound itself has a low viscosity, and the solvent volatilization due to an exothermic reaction during thermosetting can be suppressed, and the boiling point of the compound is high. A diethylene glycol monovinyl ether compound that can prevent deterioration of the working environment and has extremely low irritation to the biological mucous membrane is preferable.
The hydroxyl group-containing vinyl ether compound also acts as a diluent.

水酸基含有ビニルエーテル化合物は、硬化剤を除くエポキシ基含有成分全体に対して、 10〜30 重量%配合される。好ましくは 15〜25 重量%である。10 重量%未満のときは、封孔処理剤の粘度低減効果が低く、封孔処理剤の浸透性向上効果も得られない。一方、水酸基含有ビニルエーテル化合物の配合割合が 30 重量%を超えるときは封孔処理剤の有効成分であるエポキシ化合物の濃度が相対的に低くなるため、硬化物の耐熱性や基材との密着力が劣り、結果的に封孔能力が低下してしまう懸念が生じる。   The hydroxyl group-containing vinyl ether compound is blended in an amount of 10 to 30% by weight based on the entire epoxy group-containing component excluding the curing agent. Preferably it is 15-25 weight%. When it is less than 10% by weight, the effect of reducing the viscosity of the sealing agent is low, and the effect of improving the permeability of the sealing agent cannot be obtained. On the other hand, when the compounding ratio of the hydroxyl group-containing vinyl ether compound exceeds 30% by weight, the concentration of the epoxy compound, which is the active ingredient of the sealing agent, becomes relatively low, so the heat resistance of the cured product and the adhesion to the substrate However, there is a concern that the sealing ability is lowered as a result.

1分子中に含まれるエポキシ基の数が3個以上のポリグリシジルエーテル化合物としては、トリグリシジルエーテル化合物、テトラグリシジルエーテル化合物等が挙げられる。
ポリグリシジルエーテル化合物の例としては、トリメチロールプロパンポリグリシジルエーテル、グリセロールトリグリシジルエーテル、ソルビトールポリグリシジルエーテルを挙げることができる。
これらの中で、封孔処理剤の粘度を下げる観点から、トリグリシジルエーテル化合物が好ましく、特にトリメチロールプロパンポリグリシジルエーテルが好ましい。
Examples of the polyglycidyl ether compound having 3 or more epoxy groups contained in one molecule include triglycidyl ether compounds and tetraglycidyl ether compounds.
Examples of the polyglycidyl ether compound include trimethylolpropane polyglycidyl ether, glycerol triglycidyl ether, and sorbitol polyglycidyl ether.
Among these, from the viewpoint of lowering the viscosity of the sealing agent, a triglycidyl ether compound is preferable, and trimethylolpropane polyglycidyl ether is particularly preferable.

1分子中に含まれるエポキシ基の数が2個のアルキレンジグリシジルエーテル化合物としては、ネオペンチルグリコールジグリシジルエーテル、グリセロールジグリシジルエーテル、ポリエチレングリコールジグリシジルエーテル、ポリプロピレングリコールジグリシジルエーテル、1,6−ヘキサンジオールジグリシジルエーテルを挙げることができる。   Examples of the alkylene diglycidyl ether compound having two epoxy groups contained in one molecule include neopentyl glycol diglycidyl ether, glycerol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, 1,6- Mention may be made of hexanediol diglycidyl ether.

1分子中に含まれるエポキシ基の数が2個の環状脂肪族ジエポキシ化合物は、脂環式化合物の環を形成する炭素原子において、隣接する2つの炭素原子がオキシラン環を形成している、いわゆる脂環式エポキシ化合物であって、オキシラン環を2つ含む脂環式ジエポキシ化合物、例えば、1,2,8,9−ジエポキシリモネンが挙げられる。封孔処理剤の粘度を低下させつつ処理物の物性の低下を効果的に防止する好ましい化合物である。
また、水素添加ビスフェノールA、テトラヒドロフタル酸のジグリシジルエーテルなどの脂環式化合物のジグリシジルエーテルも使用することができる。
The cycloaliphatic diepoxy compound having two epoxy groups contained in one molecule is a so-called alicyclic compound in which two adjacent carbon atoms form an oxirane ring. Examples of the alicyclic epoxy compound include alicyclic diepoxy compounds containing two oxirane rings, such as 1,2,8,9-diepoxy limonene. It is a preferred compound that effectively prevents the physical properties of the treated product from being lowered while lowering the viscosity of the sealing agent.
Further, diglycidyl ethers of alicyclic compounds such as hydrogenated bisphenol A and diglycidyl ether of tetrahydrophthalic acid can also be used.

本発明の封孔処理剤は、取り扱い性の向上や、溶射被膜材への更なる浸透性向上の目的で、1分子中に含まれるエポキシ基の数が1個のモノグリシジルエーテル化合物を配合することができる。
1分子中に含まれるエポキシ基の数が1個のモノグリシジルエーテル化合物としては、ブチルグリシジルエーテルなどのアルキルモノグリシジルエーテル、アルキルフェノールモノグリシジルエーテル等、公知のモノグリシジルエーテル化合物を挙げることができる。
The sealing agent of the present invention contains a monoglycidyl ether compound having one epoxy group contained in one molecule for the purpose of improving the handleability and further improving the permeability to the spray coating material. be able to.
Examples of the monoglycidyl ether compound having one epoxy group contained in one molecule include known monoglycidyl ether compounds such as alkyl monoglycidyl ethers such as butyl glycidyl ether and alkylphenol monoglycidyl ethers.

トリグリシジルエーテル化合物は、溶射被膜と金属基材との間の接着力を飛躍的に高める封孔処理剤成分として使用できる。同時に該化合物自体の粘度が低いために、後述するジグリシジルエーテル化合物等と混合することによって、キシレン、メチルエチルケトンなどの有機溶剤や、重合性ビニル基含有溶剤などの添加を必要とせず、封孔剤に対し、充分な浸透性を付与できる。
また、樹脂中に含む塩素イオン量を 0.5 重量%以下とすることで、湿潤雰囲気下における絶縁抵抗などの電気特性の低下や、基材の腐食性などが抑えられる。
トリグリシジルエーテル化合物の 25℃における粘度は 500 mPa・s 以下であることが好ましい。500 mPa・s を超えると浸透性に劣る。
The triglycidyl ether compound can be used as a sealing agent component that dramatically increases the adhesion between the thermal spray coating and the metal substrate. At the same time, since the viscosity of the compound itself is low, it is not necessary to add an organic solvent such as xylene and methyl ethyl ketone or a polymerizable vinyl group-containing solvent by mixing with a diglycidyl ether compound, which will be described later. In contrast, sufficient permeability can be imparted.
In addition, when the amount of chlorine ions contained in the resin is 0.5% by weight or less, it is possible to suppress deterioration of electrical characteristics such as insulation resistance in a humid atmosphere and corrosivity of the base material.
The viscosity of the triglycidyl ether compound at 25 ° C. is preferably 500 mPa · s or less. If it exceeds 500 mPa · s, the permeability is poor.

混合物全体に対して、トリグリシジルエーテル化合物の配合割合が 10〜80 重量%であることが好ましく、より好ましくは 20〜50 重量%である。10 重量%未満のときは、封孔液自体の粘度を低く設定できるため、硬化物の浸透性は高まるものの、一方ではトリグリシジルエーテル化合物の接着性向上効果が得られにくくなるため、基材との接着力は減少する。また、トリグリシジルエーテル化合物の配合割合が 80 重量%を超えるときは封孔処理剤の粘度が高くなるため浸透性に劣る。   The blending ratio of the triglycidyl ether compound is preferably 10 to 80% by weight, more preferably 20 to 50% by weight, based on the entire mixture. If it is less than 10% by weight, the viscosity of the sealing liquid itself can be set low. The adhesive strength of is reduced. Further, when the blending ratio of the triglycidyl ether compound exceeds 80% by weight, the permeability of the sealing agent is increased, so that the permeability is poor.

1分子中に含まれるエポキシ基の数が2個のアルキレンジグリシジルエーテル化合物は、それ自体が低粘度のエポキシ化合物であるため、ポリグリシジルエーテルへの添加によって封孔剤の粘度を低下させることができるため好ましい。また、1,2,8,9−ジエポキシリモネンに示されるような環状脂肪族ジエポキシ化合物の添加も好ましい。これら化合物は、硬化反応時にエポキシ分子と共重合することで一体化するため、配合による硬化物の物性低下や、硬化時の体積減少を防ぐことができるため好ましい。   Since the alkylene diglycidyl ether compound having two epoxy groups contained in one molecule is an epoxy compound having a low viscosity in itself, the viscosity of the sealant may be reduced by addition to the polyglycidyl ether. This is preferable because it is possible. Addition of a cycloaliphatic diepoxy compound as shown in 1,2,8,9-diepoxy limonene is also preferred. Since these compounds are integrated by copolymerizing with epoxy molecules at the time of the curing reaction, it is preferable because the physical properties of the cured product can be prevented from being reduced by blending and the volume at the time of curing can be prevented.

混合物全体に対して、アルキレンジグリシジルエーテル化合物の配合割合が 10〜80 重量%であることが好ましく、より好ましくは 50〜80 重量%である。10 重量%未満のときは封孔剤の粘度低減効果が小さくなり、封孔剤の浸透性を高めることができない。また、80 重量%を超えると、封孔剤の浸透性は高まるが、硬化時に高密度の架橋構造を形成する役割を持つトリグリシジルエーテル化合物の配合割合が、相対的に減少するため、硬化後のエポキシ樹脂の物性は低下する。   The blending proportion of the alkylene diglycidyl ether compound is preferably 10 to 80% by weight, more preferably 50 to 80% by weight, based on the entire mixture. When it is less than 10% by weight, the effect of reducing the viscosity of the sealant is reduced, and the permeability of the sealant cannot be increased. On the other hand, if the amount exceeds 80% by weight, the permeability of the sealant increases, but the proportion of the triglycidyl ether compound, which plays a role in forming a high-density cross-linked structure at the time of curing, is relatively reduced. The physical properties of the epoxy resin are reduced.

アルキレンジグリシジルエーテル化合物は、上記トリグリシジルエーテル化合物と所定量混合することで、トリグリシジルエーテル化合物単体の持つ基材密着力や、分子の架橋密度、樹脂硬度を大幅に低下させることなく、封孔処理剤の浸透度を確保することで溶射被膜用の封孔処理剤として充分な機能を発現させることができる。   The alkylene diglycidyl ether compound is mixed with the above-mentioned triglycidyl ether compound in a predetermined amount, so that the substrate adhesion force, molecular cross-linking density, and resin hardness of the triglycidyl ether compound itself can be sealed without significantly decreasing. By ensuring the penetration of the treatment agent, a sufficient function as a sealing treatment agent for thermal spray coating can be exhibited.

1分子中に含まれるエポキシ基の数が1個のモノグリシジルエーテル化合物は単官能基を介して樹脂の一部と結合することができる。また、それ自身が低粘度のエポキシ化合物であるため封孔処理剤の粘度を低下させることができ、一方で、硬化後の樹脂内部の残留応力の低減や、硬化速度の調整効果を与えることができる。
モノグリシジルエーテル化合物の配合量は、混合物全体に対して、0〜30 重量%とすることが好ましい。
モノグリシジルエーテル化合物の添加量が 30 重量%を超えると、揮発量が増加したり、トリグリシジルエーテル化合物の量が相対的に減少し、硬化後樹脂の架橋密度が不足し、物性が大きく低下したり硬化物が形成されにくくなる。またポリグリシジルエーテル化合物の配合量も減少するため、溶射被膜と基材間の密着力が小さくなる。
A monoglycidyl ether compound having one epoxy group contained in one molecule can be bonded to a part of the resin through a monofunctional group. In addition, since it is a low-viscosity epoxy compound itself, the viscosity of the sealing agent can be lowered, and on the other hand, it can reduce the residual stress inside the cured resin and provide an effect of adjusting the curing rate. it can.
It is preferable that the compounding quantity of a monoglycidyl ether compound shall be 0-30 weight% with respect to the whole mixture.
When the amount of monoglycidyl ether compound added exceeds 30% by weight, the amount of volatilization increases, the amount of triglycidyl ether compound decreases relatively, the crosslinking density of the resin after curing is insufficient, and the physical properties are greatly reduced. It becomes difficult to form a cured product. Moreover, since the compounding quantity of a polyglycidyl ether compound also reduces, the adhesive force between a thermal spray coating and a base material becomes small.

上記グリシジルエーテル化合物の混合物に対して硬化剤が配合される。硬化剤としては、酸無水物類および脂肪族アミン化合物、脂環式アミン化合物、芳香族アミン化合物などのアミン化合物類、イミダゾール類などの公知のエポキシ樹脂用硬化剤を単体あるいは組合せて使用することができる。
酸無水物類としては、無水フタル酸、無水トリメリット酸、無水ピロメリット酸、無水ベンゾフェノンテトラカルボン酸、エチレングリコールビストリメリテート、グリセロールトリストリメリテート、無水マレイン酸、テトラヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、エンドメチレンテトラヒドロ無水フタル酸、メチルエンドメチレンテトラヒドロ無水フタル酸、メチルブテニルテトラヒドロ無水フタル酸、無水コハク酸、ドデセニル無水コハク酸、ヘキサヒドロ無水フタル酸、メチルヘキサヒドロ無水フタル酸、メチルシクロヘキセンジカルボン酸無水物およびその誘導体等を挙げることができる。
これらの中で 25℃における粘度が 50 mPa・s 以下の酸無水物硬化剤は、添加によって封孔処理剤系全体の粘度を顕著に低下できるため、好適な硬化剤となる。
酸無水物硬化剤の配合量は、エポキシ基1当量に対して 0.80〜0.95 当量とすることが好ましい。
A curing agent is blended with the mixture of the glycidyl ether compounds. As the curing agent, a known epoxy resin curing agent such as an acid anhydride and an aliphatic amine compound, an alicyclic amine compound, an aromatic amine compound, or an imidazole may be used alone or in combination. Can do.
Examples of acid anhydrides include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimellitate, glycerol trislimitate, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydro Phthalic anhydride, endomethylenetetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, methylbutenyltetrahydrophthalic anhydride, succinic anhydride, dodecenyl succinic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylcyclohexene Examples thereof include dicarboxylic acid anhydrides and derivatives thereof.
Among these, an acid anhydride curing agent having a viscosity at 25 ° C. of 50 mPa · s or less is a suitable curing agent because the viscosity of the entire sealing agent system can be significantly reduced by addition.
It is preferable that the compounding quantity of an acid anhydride hardening | curing agent shall be 0.80-0.95 equivalent with respect to 1 equivalent of epoxy groups.

本発明の封孔処理剤には、その他材料として界面活性剤を添加できる。特に効果のある界面活性剤としては、フッ素系界面活性剤やシリコン系界面活性剤が挙げられ、特に公知のフッ素系界面活性剤の使用が好ましい。本発明において、公知のアニオン性、カチオン性、ノニオン性および両性の界面活性剤を使用できる。本発明の封孔処理剤に、フッ素系界面活性剤を配合する場合は、単独でまたは2種以上を混合して使用することができる。また、シリコーンオイルなど界面活性効果や浸透効果を高める添加剤であれば、発明の特徴を妨げない範囲で使用できる。   A surfactant can be added to the sealing agent of the present invention as other materials. Particularly effective surfactants include fluorine-based surfactants and silicon-based surfactants, and it is particularly preferable to use known fluorine-based surfactants. In the present invention, known anionic, cationic, nonionic and amphoteric surfactants can be used. When a fluorine-based surfactant is added to the sealing agent of the present invention, it can be used alone or in admixture of two or more. Moreover, if it is an additive which improves the surface active effect and the osmosis | permeation effect, such as silicone oil, it can be used in the range which does not disturb the characteristic of invention.

アニオン性界面活性剤としては、スルホン酸塩、硫酸塩、カルボン酸塩、リン酸塩、ホスホン酸塩、リン酸エステル等を使用できる。カチオン性界面活性剤としては、第四級アンモニウム塩、アミノハロゲン塩等を使用できる。ノニオン性界面活性剤としては、ポリオキシエチレンエステル型、ポリオキシエチレンエーテル型、ソルビタンエステル型等を使用できる。両性界面活性剤としては、イミダゾリン型、ベタイン型等を使用できる。   As the anionic surfactant, sulfonate, sulfate, carboxylate, phosphate, phosphonate, phosphate ester and the like can be used. As the cationic surfactant, a quaternary ammonium salt, an amino halogen salt, or the like can be used. As the nonionic surfactant, polyoxyethylene ester type, polyoxyethylene ether type, sorbitan ester type and the like can be used. As the amphoteric surfactant, imidazoline type, betaine type and the like can be used.

封孔処理方法は、鋼等の基材金属の表面に金属、合金、酸化物セラミックス、炭化物サーメット等の溶射材を公知の溶射方法で形成した溶射被膜に対し、本発明の封孔処理剤を用いて溶射被膜の気孔を封孔処理するものである。
溶射材として用いる金属としてはAl、Zn、Cr、Ni等を、合金としてはステンレス鋼等を、酸化物セラミックスとしてはアルミナ、ジルコニア、チタニア等を、炭化物サーメットとしてはクロム炭化物、タングステン炭化物等を、それぞれ挙げることができる。
溶射方法としては、例えばプラズマ溶射法、高速ガス炎溶射法等を用いることができる。溶射被膜の膜厚は、溶射材料の種類や得られる溶射被膜被覆部材の用途に応じて適宜設定することができるが、通常、炭素鋼を基材として、溶射材をアルミナとした場合、20〜2000μm 程度、好ましくは 50〜1000μm 程度である。
The sealing treatment method comprises applying the sealing treatment agent of the present invention to a thermal spray coating formed by a known thermal spraying method on a surface of a base metal such as steel with a metal, alloy, oxide ceramics, carbide cermet or the like. It is used to seal the pores of the thermal spray coating.
Al, Zn, Cr, Ni etc. as the metal used as the spray material, stainless steel etc. as the alloy, alumina, zirconia, titania etc. as the oxide ceramics, chromium carbide, tungsten carbide etc. as the carbide cermet, Each can be mentioned.
As the spraying method, for example, a plasma spraying method, a high-speed gas flame spraying method, or the like can be used. The film thickness of the thermal spray coating can be appropriately set according to the type of the thermal spray material and the use of the resulting thermal spray coating coating member, but usually when carbon steel is the base material and the thermal spray material is alumina, 20 ~ It is about 2000 μm, preferably about 50 to 1000 μm.

上記封孔処理方法において封孔処理剤の浸透・充填性は、処理される溶射被膜を形成している粒子境界融着構造により左右されるので、溶射被膜の粒子境界融着構造や、封孔後の溶射被膜の要求特性に適した最適な封孔処理剤を選択するのが望ましい。
例えば、本発明の封孔処理剤は、形成された溶射被膜の気孔率が 10%以下である場合の封孔処理に用いることが好ましい。また、本発明の封孔処理剤は、溶射材としてセラミック粉末や炭化物サーメット等を用いてプラズマ溶射、高速ガス炎溶射法によって形成した溶射被膜の気孔率 10 %以下である場合の封孔処理に用いることが好ましい。本発明の封孔処理剤を用いてこれら溶射被膜に封孔処理を施した場合、非常に優れた封孔効果を発揮し、表層を、例えば 200μm 程度、研削除去しても封孔効果を確認することができる。
このように、本発明の封孔処理剤を用いることにより、溶射被膜の気孔(間隙)がエポキシ基を重合して得られる樹脂で実質的に全て充填されるので、間隙のない連続被膜表面を有する溶射被膜被覆部材を得ることができる。
ここで、溶射被膜の気孔(間隙)が「実質的に全て充填されている」とは、溶射被膜表面に塗膜形状で存在している封孔処理剤により形成された層(封孔処理剤に含まれる成分の硬化物などからなる)を含めた溶射被膜の最外層部分(例えば、表面から厚さ 0.2 mm 程度)を研削・研磨して除去した後、JIS H 8666に基づく染色浸透試験において、着色が見られないことを意味する。
In the above sealing treatment method, the penetration and filling properties of the sealing agent depend on the particle boundary fusion structure forming the sprayed coating to be treated. It is desirable to select an optimum sealing agent suitable for the required characteristics of the later sprayed coating.
For example, the sealing agent of the present invention is preferably used for sealing treatment when the formed sprayed coating has a porosity of 10% or less. Further, the sealing agent of the present invention is used for sealing treatment when the porosity of a thermal spray coating formed by plasma spraying or high-speed gas flame spraying method using ceramic powder or carbide cermet as a thermal spraying material is 10% or less. It is preferable to use it. When these thermal spray coatings are subjected to a sealing treatment using the sealing agent of the present invention, a very excellent sealing effect is exhibited, and the sealing effect is confirmed even if the surface layer is removed by grinding, for example, about 200 μm. can do.
As described above, by using the sealing agent of the present invention, the pores (gap) of the sprayed coating are substantially completely filled with the resin obtained by polymerizing the epoxy group. The thermal spray coating covering member which has can be obtained.
Here, the pores (gap) of the sprayed coating are “substantially all filled” means that the layer formed by the sealing agent existing in the form of a coating on the surface of the sprayed coating (sealing agent) In the dye penetration test based on JIS H 8666, the outermost layer part (for example, about 0.2 mm thick from the surface) of the thermal spray coating including the cured product of the components contained in the material is removed by grinding and polishing. , Meaning no coloration.

上記封孔処理方法は、上述の封孔処理剤が溶射被膜底部まで浸透し充填性が向上することにより、粒子間境界の間隙が確実に埋められることで粒子間の個々の結合力や、基材との密着力が増大し、粒子間境界の間隙を全て埋めることができる。このため大気中における環境水分や異物の侵入が遮断され、酸化物セラミックス溶射被膜の固有の値を低減させることなく、絶縁抵抗値および絶縁破壊値の低下を抑制することができる。また得られた封孔処理済みの溶射被膜は表面を研削または研磨などした場合にも露出する間隙が存在しない。
したがって、溶射被膜自体の機械的強さや基材との密着強さを高める手段、絶縁抵抗値および絶縁破壊値など電気特性の低下抑制手段などとして利用できる。
The above-mentioned sealing treatment method allows the above-mentioned sealing agent to penetrate to the bottom of the thermal spray coating and improve the filling property, thereby filling the gaps between the particles with certainty, thereby ensuring the individual bonding force between the particles and the base. The adhesion force with the material is increased, and all the gaps between the boundaries between particles can be filled. For this reason, the penetration | invasion of environmental moisture and a foreign material in air | atmosphere is interrupted | blocked, and the fall of an insulation resistance value and a dielectric breakdown value can be suppressed, without reducing the intrinsic | native value of an oxide ceramic sprayed coating. Further, the obtained thermally sprayed coating after sealing does not have an exposed gap even when the surface is ground or polished.
Therefore, it can be used as a means for increasing the mechanical strength of the sprayed coating itself and the adhesion strength with the base material, a means for suppressing a decrease in electrical characteristics such as an insulation resistance value and a dielectric breakdown value, and the like.

本発明の封孔処理剤を用いて封孔処理を施すと、溶射被膜の間隙が封孔処理剤で実質的に全て充填された後、溶射被膜表層を隠蔽する形で封孔処理剤による塗膜状の薄い層が形成される。この塗膜状の薄い層を有する被覆部材はそのまま使用することもできるが、被覆部材の寸法精度を保つためには、研削砥石、研磨紙、不織布バフなどを用いて溶射被膜の表面を研削・研磨してかかる層を除去することができる。   When the sealing treatment is performed using the sealing treatment agent of the present invention, the gap between the thermal spray coatings is substantially filled with the sealing treatment agent, and then the coating with the sealing treatment agent is performed so as to conceal the surface layer of the thermal spray coating. A film-like thin layer is formed. The coated member having a thin layer in the form of a coating can be used as it is, but in order to maintain the dimensional accuracy of the coated member, the surface of the sprayed coating is ground and ground using a grinding wheel, abrasive paper, non-woven buff, etc. This layer can be removed by polishing.

封孔処理は、溶射後の溶射被膜に対し速やかに施すことが好ましい。溶射被膜は、粒子径分布のある多数の粒子が粒子間表層のみで融着して形成された被膜である。必然的に粒子境界に間隙が生成するため、被膜形成の直後から粒子境界の間隙をぬって水分や異物が侵入するなど、環境条件の影響を受けることが多い。したがって封孔効率の低下を防ぐには溶射後、溶射被膜の封孔処理をできる限り早く施すことが望ましい。   The sealing treatment is preferably performed quickly on the sprayed coating after spraying. The thermal spray coating is a coating formed by fusing a large number of particles having a particle size distribution only at the interparticle surface layer. Since gaps are inevitably generated at the particle boundaries, it is often affected by environmental conditions such as moisture and foreign matter entering through the gaps at the grain boundaries immediately after the formation of the coating. Therefore, in order to prevent a decrease in the sealing efficiency, it is desirable to perform the sealing treatment of the sprayed coating as soon as possible after spraying.

本発明の溶射被膜被覆部材は、鋼等から構成される機械部品の基材表面に金属またはセラミックスなどの硬質粒子および粉体を溶射して溶射被膜を形成した後、本発明の封孔処理剤を用いて、溶射被膜材の間隙が実質的に全て充填されている状態まで封孔処理を施して得られる被覆部材である。したがって、得られた溶射被膜被覆部材は、機械的強さや基材との密着強さが高められ、更に絶縁抵抗値および絶縁破壊値など電気特性が向上する溶射被膜を機械部品基材に被覆するので、機械部品を周囲の環境から完全に遮断し、水や異物の侵入を防ぎ保護することができる。
また、研削砥石、研磨紙、不織布バフなどを用いて溶射被膜の表面を研削・研磨することにより、被覆部材の寸法精度を保つことができる。
The thermal spray coating member of the present invention is formed by spraying hard particles such as metal or ceramics and powder on the surface of a base material of a machine part composed of steel or the like to form a thermal spray coating, and then the sealing treatment agent of the present invention. Is a covering member obtained by performing a sealing process until the gap between the sprayed coating materials is substantially filled. Therefore, the obtained thermal spray coating member is coated with a thermal spray coating on which the mechanical strength and adhesion strength with the base material are enhanced and electrical characteristics such as insulation resistance value and dielectric breakdown value are improved. As a result, the machine parts can be completely shielded from the surrounding environment to prevent and protect water and foreign matter from entering.
Further, the dimensional accuracy of the covering member can be maintained by grinding and polishing the surface of the sprayed coating using a grinding wheel, polishing paper, non-woven cloth buff or the like.

本発明の溶射被膜被覆部材は、軸受を構成している部材表面に好適に応用できる。軸受としては、転がり軸受、すべり軸受のいずれにも用いることができる。転がり軸受は、外周面に内輪転走面を有する内輪と内周面に外輪転走面を有する外輪とが同心に配置され、内輪転走面と外輪転走面との間に複数個の転動体が配置される。さらに、この複数個の転動体を保持する保持器および外輪等に固定されるシール部材とにより構成される。
本発明の溶射被膜被覆部材は、深溝玉軸受および円筒/円錐ころ軸受等の転がり軸受の外輪部に処理されるセラミック溶射被膜の封孔処理剤として好適に用いることができる。
溶射被膜被覆部材で外輪部表面が処理された軸受はハウジングに外輪外径面を摺動させながら圧入することで固定される。本発明の溶射被膜被覆部材を設けることで、封入樹脂の作用により、溶射被膜が強化されるため、圧入時に起こりうるハウジングとの衝突による被膜の破損リスクを減少させることができる。
また、本発明の溶射被膜被覆部材は、すべり軸受の摺動面としても用いることができる。
The thermal spray coating member of the present invention can be suitably applied to the surface of a member constituting a bearing. As a bearing, it can be used for either a rolling bearing or a sliding bearing. In a rolling bearing, an inner ring having an inner ring rolling surface on an outer peripheral surface and an outer ring having an outer ring rolling surface on an inner peripheral surface are arranged concentrically, and a plurality of rolling bearings are provided between the inner ring rolling surface and the outer ring rolling surface. A moving object is arranged. Furthermore, it is comprised with the sealing member fixed to the holder | retainer and outer ring | wheel etc. which hold | maintain these rolling elements.
The thermal spray coating member of the present invention can be suitably used as a sealing agent for a ceramic thermal spray coating to be processed on the outer ring portion of rolling bearings such as deep groove ball bearings and cylindrical / conical roller bearings.
The bearing whose outer ring surface has been treated with the thermal spray coating member is fixed by being pressed into the housing while sliding the outer diameter surface of the outer ring. By providing the thermal spray coating member of the present invention, the thermal spray coating is strengthened by the action of the encapsulating resin, so that the risk of damage to the coating due to collision with the housing that can occur during press-fitting can be reduced.
Moreover, the thermal spray coating covering member of the present invention can also be used as a sliding surface of a slide bearing.

実施例1〜実施例5および比較例1〜比較例4
表1で用いた材料を以下に示す。
(1)グリシジルエーテル化合物または環状脂肪族ジエポキシ化合物
(1−1)トリメチロールプロパントリグリシジルエーテル:ナガセケムテックス社製、デナコールEX−321L、粘度; 500 mPa・s (25℃)
(1−2)アルキレンジグリシジルエーテル:ジャパンエポキシレジン社製、YED216M、粘度; 15 mPa・s (25℃)
(1−3)アルキレンモノグリシジルエーテル:ジャパンエポキシレジン社製、YED111E、粘度; 7 mPa・s (25℃)
(1−4)環状脂肪族ジエポキシ化合物:ダイセル化学工業社製、セロキサイド3000、粘度; 10 mPa・s (25℃)
(2)水酸基含有ビニルエーテル化合物
(2−1)ビニルエーテルA:丸善石油化学社製、工業薬品、2−ヒドロキシエチルビニルエーテル、粘度; 3 mPa・s (20℃)、沸点140℃
(2−2)ビニルエーテルB:丸善石油化学社製、工業薬品、4−ヒドロキシブチルビニルエーテル、粘度; 5 mPa・s (20℃)、沸点187℃
(2−3)ビニルエーテルC:丸善石油化学社製、工業薬品、ジエチレングリコールモノビニルエーテル、粘度; 5 mPa・s (20℃)、沸点208℃
(3)重合性ビニル基含有溶剤
(3−1)スチレンモノマー:和光純薬工業社製、試薬、粘度; 1 mPa・s (20℃)、沸点145℃
(4)硬化剤、硬化促進剤
(4−1)酸無水物系硬化剤:大日本インキ化学工業社製、エピクロンB−570、粘度; 40 mPa・s (25℃)
(4−2)イミダゾール系硬化促進剤:四国化成工業社製、OR−2E4MZ
Examples 1 to 5 and Comparative Examples 1 to 4
The materials used in Table 1 are shown below.
(1) Glycidyl ether compound or cycloaliphatic diepoxy compound (1-1) Trimethylolpropane triglycidyl ether: manufactured by Nagase ChemteX Corporation, Denacol EX-321L, viscosity: 500 mPa · s (25 ° C.)
(1-2) Alkylene diglycidyl ether: manufactured by Japan Epoxy Resin Co., Ltd., YED216M, viscosity; 15 mPa · s (25 ° C.)
(1-3) Alkylene monoglycidyl ether: manufactured by Japan Epoxy Resin, YED111E, viscosity; 7 mPa · s (25 ° C.)
(1-4) Cycloaliphatic diepoxy compound: Daicel Chemical Industries, Celoxide 3000, viscosity; 10 mPa · s (25 ° C.)
(2) Hydroxyl-containing vinyl ether compound (2-1) Vinyl ether A: manufactured by Maruzen Petrochemical Co., Ltd., industrial chemicals, 2-hydroxyethyl vinyl ether, viscosity; 3 mPa · s (20 ° C.), boiling point 140 ° C.
(2-2) Vinyl ether B: manufactured by Maruzen Petrochemical Co., Ltd., industrial chemicals, 4-hydroxybutyl vinyl ether, viscosity; 5 mPa · s (20 ° C.), boiling point 187 ° C.
(2-3) Vinyl ether C: manufactured by Maruzen Petrochemical Co., Ltd., industrial chemicals, diethylene glycol monovinyl ether, viscosity; 5 mPa · s (20 ° C.), boiling point 208 ° C.
(3) Polymerizable vinyl group-containing solvent (3-1) Styrene monomer: manufactured by Wako Pure Chemical Industries, reagent, viscosity; 1 mPa · s (20 ° C), boiling point 145 ° C
(4) Curing agent, curing accelerator (4-1) Acid anhydride curing agent: manufactured by Dainippon Ink & Chemicals, Epicron B-570, viscosity; 40 mPa · s (25 ° C.)
(4-2) Imidazole-based curing accelerator: Shikoku Kasei Kogyo Co., Ltd., OR-2E4MZ

表1に示す各成分を室温で充分に撹拌混合し、混合樹脂中の気泡を抜くため30分静置して封孔処理剤を得た。得られた封孔処理剤の評価を焼成後重量減少率試験により行なった。
<焼成後重量減少率試験>
得られた封孔処理剤を、140℃×2 時間の条件で充分に乾燥させ、異物付着のないガラス製容器(容量 3 ml )に約 2 g 秤量し、焼成前秤量値とした。その後、ガラス容器の口を開放したまま、80℃×1 時間予備焼成し、その後 120℃×2 時間焼成を行ない、焼成後の重量を測定し焼成後秤量値とし、下記の式にしたがって封孔処理剤の重量減少率を計測した。測定結果を表1に示す。なお、測定結果に対する判定基準は、重量減少率が 1 %を超えると溶射被膜に残存する微小空隙内で硬化後に空隙部を生じたり、発生ガスによって硬化物中の残留気泡の発生が多くなったりする懸念があるため「不可」と判定され、1 %以下を「可」と判定される。また、「未硬化」は上記焼成条件において固体状にならなかった場合である。

焼成後重量減少率(%)=100×(焼成前秤量値−焼成後秤量値)/焼成前秤量値
Each component shown in Table 1 was sufficiently stirred and mixed at room temperature, and left to stand for 30 minutes to remove bubbles in the mixed resin, thereby obtaining a sealing agent. The obtained sealing agent was evaluated by a weight reduction rate test after firing.
<Weight reduction test after firing>
The obtained sealing agent was sufficiently dried under conditions of 140 ° C. × 2 hours, and weighed about 2 g in a glass container (capacity: 3 ml) with no foreign matter adhered to obtain a weighed value before firing. Then, with the mouth of the glass container kept open, pre-fired at 80 ° C for 1 hour, then fired at 120 ° C for 2 hours, measured the weight after firing, set the weight after firing, and sealed according to the following formula The weight reduction rate of the treatment agent was measured. The measurement results are shown in Table 1. The criterion for the measurement results is that if the weight loss rate exceeds 1%, voids are generated after curing in the microscopic voids remaining in the sprayed coating, or the generation of residual bubbles in the cured product increases due to the generated gas. Therefore, 1% or less is judged as “possible”. Further, “uncured” is a case where the material did not become solid under the above-described firing conditions.

Weight reduction rate after firing (%) = 100 × (weighed value before firing−weighed value after firing) / weighed value before firing

次に、φ20 mm×25 mm のSUJ2製試験片(以下「試験片基材」と記す)を準備し、その円筒端面に膜厚 400 μm のアルミナセラミック溶射被膜を大気プラズマ溶射法により形成した。
溶射面の表面に室温雰囲気下において、ポリアミド製ブラシを用いて表1に示す封孔処理剤を塗布し 30 分静置した。その後ポリエチレン製のヘラで表面付着分の過剰な封孔処理剤を掻き取った状態をもって、封孔処理剤の塗布済み試験片とした。その後、これら塗布済み試験片を 80℃×1 時間予備焼成し、その後 120℃×2 時間焼成を行ない、封孔処理剤を硬化させた。次に、セラミック平面と平行にダイヤモンド砥石を用いて研削除去を行なった。研削除去量は、下記に示す3水準を設定した。
(1)表層部の硬化樹脂層を重点的に除去する目的でセラミック部を約 10 μm 研削除去した。
(2)硬化試験片の表面から約 200 μm の深さまでの樹脂浸透層を除去する目的で、約 200 μm 研削除去した。
(3)硬化試験片の表面から約 400 μm の深さまでの樹脂浸透層を除去する目的で、約 400 μm 研削除去した。
表面を研削除去して得られた硬化試験片を用いて以下に示す浸透性試験、密着力試験、絶縁抵抗試験、耐電圧特性試験により浸透性、密着力、絶縁抵抗値、耐電圧特性を測定した。また、低温焼成の可否確認試験を実施した。
Next, a φ20 mm × 25 mm SUJ2 test piece (hereinafter referred to as “test piece base material”) was prepared, and an alumina ceramic sprayed coating having a film thickness of 400 μm was formed on the cylindrical end face by an atmospheric plasma spraying method.
On the surface of the sprayed surface, the sealing agent shown in Table 1 was applied using a polyamide brush in a room temperature atmosphere and allowed to stand for 30 minutes. Thereafter, a test piece coated with a sealing agent was prepared by scraping off the excess sealing agent on the surface with a polyethylene spatula. Thereafter, these coated test pieces were pre-fired at 80 ° C. for 1 hour, and then fired at 120 ° C. for 2 hours to cure the sealing agent. Next, grinding removal was performed using a diamond grindstone parallel to the ceramic plane. The grinding removal amount was set at the following three levels.
(1) The ceramic part was ground and removed by about 10 μm for the purpose of intensively removing the cured resin layer on the surface layer part.
(2) About 200 μm was ground and removed for the purpose of removing the resin permeation layer from the surface of the cured specimen to a depth of about 200 μm.
(3) About 400 μm was removed by grinding for the purpose of removing the resin permeation layer from the surface of the cured test piece to a depth of about 400 μm.
Measure the permeability, adhesion, insulation resistance, and withstand voltage characteristics with the following permeability test, adhesion test, insulation resistance test, and withstand voltage test using the cured specimen obtained by grinding and removing the surface. did. In addition, a test for confirming whether low-temperature firing was possible was performed.

<浸透性試験>
硬化試験片の浸透性試験は、封孔処理を施した硬化試験片の被膜面に対しJIS H 8666に基づくフェロキシル試験を適用して行なった。フェロキシル試験の概略を図1に示す。試験条件は、図1に示す試験液を浸漬させたろ紙3、スズ板4、ウエイト5の形状が試験片に合わせたもの(φ16 mm )となっている点を除き、試験液組成、試験面圧、放置時間等の条件はすべてJIS H 8666に準拠した。ろ紙3が着色することは、溶射被膜2に試験片基材1と外部空間とを連結する連通孔があるため、フェロキシル試験溶液が試験片基材1の鉄イオンに接触して青色に呈色したことを示す。判定基準は、元来白色であったろ紙3の表面に青色の斑点が 1 個以上見られたものを「斑点あり」とし、青色の斑点が 0 個であったものを「斑点なし」とし、浸透性測定結果を表1に併記する。
<Penetration test>
The permeability test of the cured test piece was performed by applying a ferroxyl test based on JIS H 8666 to the coating surface of the cured test piece subjected to the sealing treatment. An outline of the ferroxyl test is shown in FIG. The test conditions were the test solution composition, test surface, except that the shape of the filter paper 3, tin plate 4 and weight 5 in which the test solution shown in FIG. 1 was immersed was adjusted to the test piece (φ16 mm). All conditions such as pressure and standing time were in accordance with JIS H 8666. When the filter paper 3 is colored, the sprayed coating 2 has a communication hole that connects the test piece base 1 and the external space, so that the ferroxyl test solution contacts the iron ions of the test piece base 1 and turns blue. Indicates that Judgment criteria are “spotted” when one or more blue spots were seen on the surface of filter paper 3 that was originally white, and “no spots” when zero blue spots were found, The permeability measurement results are also shown in Table 1.

<密着力試験>
密着力試験の概略を図2に示す。焼成後の表層部分を 200μm 研削除去した硬化試験片に対し、高粘度エポキシ系接着剤を介して引張治具6(接着部の形状:φ16 mm )をエポキシ接着面2aで接着し、引張圧縮試験機にて矢印方向に引っ張って単位面積あたりの溶射被膜2の密着力を測定した。測定結果を表1に併記する。判定基準は、密着力が 2 MPa 以上で「可」、2 MPa より下回ると「不可」と判定される。
<Adhesion test>
An outline of the adhesion test is shown in FIG. Tensile jig 6 (adhesive part shape: φ16 mm) is bonded to epoxy test surface 2a via a high-viscosity epoxy adhesive to the cured test piece with the surface layer portion after firing removed by 200μm. The adhesion of the thermal spray coating 2 per unit area was measured by pulling in the direction of the arrow with a machine. The measurement results are also shown in Table 1. Judgment criteria are “possible” when the adhesion is 2 MPa or more, and “impossible” when it is below 2 MPa.

<絶縁抵抗試験>
絶縁抵抗試験の概略を図3に示す。硬化試験片を 80℃の温水に 1 時間浸漬後、配線9に取り付けた 1000 V DC絶縁抵抗計8を用いて、溶射被膜2表面と試験片基材1間の絶縁抵抗を測定した。7は電極である。測定結果を表1に併記する。判定基準は、2000 MΩをこえる(表中に>2000 として表示)の抵抗率を示す場合は「可」、2000 MΩより下回る抵抗率の場合は「不可」と判定される。
<Insulation resistance test>
An outline of the insulation resistance test is shown in FIG. After immersing the cured test piece in warm water at 80 ° C. for 1 hour, the insulation resistance between the surface of the sprayed coating 2 and the test piece base 1 was measured using a 1000 V DC insulation resistance meter 8 attached to the wiring 9. 7 is an electrode. The measurement results are also shown in Table 1. The judgment criterion is “OK” when the resistivity exceeds 2000 MΩ (indicated as> 2000 in the table), and “No” when the resistivity is lower than 2000 MΩ.

<耐電圧特性試験>
耐電圧特性試験の概略を図4に示す。溶射被膜2と試験片基材1との間の配線9に取り付けた高電圧発生装置10によりDC 5 kV の電圧を印加してモニタ11により耐電圧特性を評価した。7は電極である。測定結果を表1に併記する。判定基準は、DC 5 kV を 5 分間印加させ、絶縁破壊を生じなかったら「可」、絶縁破壊を生じた場合「不可」とした。
<Withstand voltage characteristics test>
An outline of the withstand voltage characteristic test is shown in FIG. A voltage of DC 5 kV was applied by a high voltage generator 10 attached to the wiring 9 between the thermal spray coating 2 and the test piece base 1, and the withstand voltage characteristics were evaluated by the monitor 11. 7 is an electrode. The measurement results are also shown in Table 1. The judgment criteria were DC 5 kV applied for 5 minutes, "No" if no dielectric breakdown occurred, and "No" if dielectric breakdown occurred.

<低温焼成の可否確認試験>
通常の焼成条件は、予備焼成を 80℃×1 時間、その後本焼成を 120℃×2 時間という条件であるが、量産時の生産性や封孔処理を施す商品の熱による変形を抑える目的で、焼成条件を緩和する要求がある。そのため、本焼成を通常よりも緩い条件である、100℃×2 時間の条件で行ない、通常焼成品と比較することで、封孔処理剤組成の低温焼成の可否確認を行なった。比較項目は、<耐電圧特性>とし、耐電圧特性試験の概略などは、上記<耐電圧特性試験>と同様の方法で行なった。実験結果を表1に併記する。判定基準は、通常焼成品の耐電圧特性試験の結果と同じく、DC 5 kV を 5 分間印加させ、絶縁破壊を生じなかったら「可」、絶縁破壊を生じた場合「不可」とした。
<Low temperature firing possibility confirmation test>
The normal firing conditions are 80 ° C x 1 hour for pre-baking and then 120 ° C x 2 hours for main firing, but for the purpose of suppressing productivity during mass production and heat distortion of products subjected to sealing treatment. There is a demand to relax firing conditions. Therefore, the main firing was performed under conditions of 100 ° C. × 2 hours, which is a milder condition than usual, and the feasibility of low-temperature firing of the sealing agent composition was confirmed by comparing with the normal fired product. The comparative item was <withstand voltage characteristic>, and the outline of the withstand voltage characteristic test was performed in the same manner as in the above <withstand voltage characteristic test>. The experimental results are also shown in Table 1. As with the result of the withstand voltage characteristic test of the normal fired product, the determination criterion was “appropriate” when DC 5 kV was applied for 5 minutes and no dielectric breakdown occurred, and “impossible” when dielectric breakdown occurred.

Figure 2008184621
Figure 2008184621

表1に示すように、各実施例の封孔処理剤は重量減少率が 1 %を下回り、比較例1に示す、アルキレンモノエポキシ化合物の添加系よりも焼成後の重量減少は更に低い水準となった。これにより、当組成を用いることで、従来組成よりも更に確実な封孔性が期待できる。
実施例1、2、3、4、5は極めて低粘度の水酸基含有ビニルエーテル化合物を使用したため、封孔処理剤自体の粘度も著しく低下できたため、400 μm という深部まで封孔処理剤の浸透が可能となった。
比較例1はアルキレンモノエポキシ化合物を希釈溶剤として使用したため、結果的に硬化剤を除く封孔処理剤の組成は、ほぼ全てをエポキシ化合物のみで構成したことになる。これに対し、実施例1、2、3、4、5は、希釈溶剤に水酸基含有ビニルエーテル化合物を採用したため、系の粘度低下のみならず、水酸基の存在によりエポキシ基の開環反応が促進されたため、結果的に低温焼成が可能となった。酸無水物を硬化剤に採用した場合、そのままでは硬化反応速度は遅いため、一般的にはアミンやイミダゾールなどの硬化促進剤を併用しなければならないが、アミンは毒性や刺激性が高いものが多かったり、イミダゾールは高粘度で分散性が悪いものが多いため、これら硬化促進剤の使用はできるだけ減らしたい要求がある。しかし、ビニルエーテル系添加剤を併用することで、これら硬化促進剤の使用量を減らすことができる。
比較例2は希釈溶剤に焼成時の蒸発量が比較的大きなスチレンモノマーを使用したため蒸発減量も大きく、また溶射被膜の表層から 200 μm を研削除去した段階で耐電圧特性が合格の判定基準以下となった。
比較例3または4はいずれも、希釈溶剤として添加した水酸基含有ビニルエーテルの添加量が不足したり過剰であったと考える。比較例3では、ビニルエーテルの添加量が少ないため、封孔処理剤の粘度低減効果が低く、結果的に研削量 200 μm までは問題なかったものの、研削量 400 μm では浸透性が不足した。また、硬化促進効果を示す水酸基量も少なかったため低温焼成も不可となった。一方、比較例4では、水酸基含有ビニルエーテルの添加量が多すぎたため、硬化後樹脂の主骨格をなすエポキシ成分が不足し硬化物の密着性や強度が著しく低下した。そのため、結果的に研削量 200 μm 以上の水準から研削時の加工衝撃で充填樹脂と皮膜間ですきまが生じ、そのすきまに湿気が侵入することで電気特性が低下した。
以上の結果より、当発明において封孔剤用の添加剤としては、水酸基含有ビニルエーテルの所定量の添加は非常に有効な手段といえる。
As shown in Table 1, the sealing agent of each example had a weight reduction rate of less than 1%, and the weight reduction after firing was lower than that of the addition system of the alkylene monoepoxy compound shown in Comparative Example 1. became. Thereby, by using this composition, a more reliable sealing property than the conventional composition can be expected.
In Examples 1, 2, 3, 4, and 5, since the extremely low viscosity hydroxyl group-containing vinyl ether compound was used, the viscosity of the sealing agent itself could be remarkably lowered, so that the sealing agent could penetrate to a depth of 400 μm. It became.
In Comparative Example 1, an alkylene monoepoxy compound was used as a diluting solvent. As a result, the composition of the sealing agent excluding the curing agent was almost entirely composed of the epoxy compound. In contrast, Examples 1, 2, 3, 4, and 5 employ a hydroxyl group-containing vinyl ether compound as a diluent solvent, which not only lowers the viscosity of the system, but also promotes the ring opening reaction of the epoxy group due to the presence of the hydroxyl group. As a result, low-temperature firing became possible. When an acid anhydride is used as a curing agent, the curing reaction rate is slow as it is, so it is generally necessary to use a curing accelerator such as amine or imidazole. However, amines are highly toxic and irritating. Since many imidazoles have high viscosity and poor dispersibility, there is a demand to reduce the use of these curing accelerators as much as possible. However, the combined use of vinyl ether additives can reduce the amount of these curing accelerators used.
Comparative Example 2 uses a styrene monomer that has a relatively large amount of evaporation during firing as a diluent solvent, so the evaporation loss is large, and the withstand voltage characteristics are less than the acceptance criteria at the stage where 200 μm is ground and removed from the surface of the sprayed coating. became.
In any of Comparative Examples 3 and 4, it is considered that the amount of the hydroxyl group-containing vinyl ether added as a diluent solvent was insufficient or excessive. In Comparative Example 3, since the amount of vinyl ether added was small, the effect of reducing the viscosity of the sealing agent was low. As a result, there was no problem up to a grinding amount of 200 μm, but the permeability was insufficient at a grinding amount of 400 μm. Moreover, since the amount of hydroxyl groups showing a curing accelerating effect was small, low-temperature firing became impossible. On the other hand, in Comparative Example 4, since the addition amount of the hydroxyl group-containing vinyl ether was too large, the epoxy component constituting the main skeleton of the resin after curing was insufficient, and the adhesion and strength of the cured product were significantly reduced. As a result, a gap between the filled resin and the film was generated due to the processing impact during grinding from the level of grinding of 200 μm or more, and the electrical characteristics deteriorated due to moisture entering the gap.
From the above results, it can be said that the addition of a predetermined amount of a hydroxyl group-containing vinyl ether is a very effective means as an additive for a sealing agent in the present invention.

上記試験結果は、本発明の封孔処理剤により溶射被膜の気孔(間隙)を充填することによって、基材と溶射被膜間の密着力を向上させ、更に大気中の水分の侵入を防止し、酸化物セラミックス溶射被膜の固有の値を低減させることなく、絶縁抵抗値および耐電圧特性の低下を抑制できることを示している。   The above test results are that the pores (gap) of the thermal spray coating is filled with the sealing agent of the present invention, thereby improving the adhesion between the substrate and the thermal spray coating, and further preventing the intrusion of moisture in the atmosphere, It shows that the decrease in the insulation resistance value and the withstand voltage characteristic can be suppressed without reducing the intrinsic value of the oxide ceramic sprayed coating.

本発明の封孔処理剤を用いることによって、気孔(間隙)に対する浸透性および充填性に優れ、溶射被膜材の間隙が実質的に全て充填されている状態まで封孔処理を施すことができる。このため経時的な封孔特性が劣化するおそれがなく、使用時に剥離などのない溶射被膜を形成するための封孔処理剤として好適に利用できる。   By using the sealing agent of the present invention, the sealing treatment can be performed until the pores (gap) are excellent in permeability and filling property and substantially all the gaps of the thermal spray coating material are filled. For this reason, there is no possibility that the sealing characteristics with time will be deteriorated, and it can be suitably used as a sealing agent for forming a sprayed coating without peeling during use.

また本発明の溶射被膜被覆部材は、封孔処理剤の浸透・充填層が十分存在するので、封孔処理後に溶射被膜表層部分を研削あるいは研磨除去された場合でも溶射被膜の耐熱性や耐摩耗性、耐食性を大幅に向上させ、更に機械的性質、電気的性質などの物性をも向上させることができる。このため、高精度な後加工が要求される、鋼等から構成される各種産業機械部品の溶射被膜の保護用部材、改質部材として好適に利用できる。特に絶縁軸受に応用できる。   In addition, since the spray coating member of the present invention has a sufficient penetration / filling layer of the sealing agent, even if the surface layer portion of the spray coating is ground or polished after the sealing treatment, the heat resistance and wear resistance of the spray coating are reduced. Property and corrosion resistance can be greatly improved, and further physical properties such as mechanical properties and electrical properties can be improved. For this reason, it can utilize suitably as a member for protection of a thermal-sprayed film of various industrial machine parts comprised from steel etc. which require high-precision post-processing, and a modification member. Especially applicable to insulated bearings.

フェロキシル試験の概略を示す図である。It is a figure which shows the outline of a ferroxyl test. 密着力試験の概略を示す図である。It is a figure which shows the outline of an adhesive force test. 絶縁抵抗試験の概略を示す図である。It is a figure which shows the outline of an insulation resistance test. 耐電圧特性試験の概略を示す図である。It is a figure which shows the outline of a withstand voltage characteristic test.

符号の説明Explanation of symbols

1 試験片基材
2 封孔処理済み溶射被膜
3 フェロキシル試験溶液付きろ紙
4 スズ板
5 ウエイト
6 引張治具
7 電極
8 絶縁抵抗計
9 配線
10 高電圧発生装置
11 モニタ
DESCRIPTION OF SYMBOLS 1 Test piece base material 2 Sealed thermal spray coating 3 Filter paper with ferroxyl test solution 4 Tin plate 5 Weight 6 Tension jig 7 Electrode 8 Insulation resistance meter 9 Wiring 10 High voltage generator 11 Monitor

Claims (5)

エポキシ基含有成分と、該エポキシ基含有成分の硬化剤と、水酸基含有ビニルエーテル化合物とを含み、前記水酸基含有ビニルエーテル化合物以外の重合性ビニル基含有溶剤を含まない、溶射被膜の封孔処理剤であって、
前記水酸基含有ビニルエーテル化合物は、前記エポキシ基含有成分全体に対して、 10〜30 重量%配合されていることを特徴とする封孔処理剤。
A thermal spray coating sealing agent comprising an epoxy group-containing component, a curing agent for the epoxy group-containing component, and a hydroxyl group-containing vinyl ether compound, and no polymerizable vinyl group-containing solvent other than the hydroxyl group-containing vinyl ether compound. And
The said hydroxyl-containing vinyl ether compound is mix | blended 10 to 30weight% with respect to the whole said epoxy-group containing component, The sealing agent characterized by the above-mentioned.
前記エポキシ基含有成分は、1分子中に含まれるエポキシ基の数が3個以上のポリグリシジルエーテル化合物を必須成分とし、1分子中に含まれるエポキシ基の数が2個のアルキレンジグリシジルエーテル化合物および環状脂肪族ジエポキシ化合物から選ばれた少なくとも1つを含む混合物であり、前記硬化剤を除く、前記エポキシ基含有成分全体に対して、ポリグリシジルエーテル化合物が 10〜80 重量%配合されていることを特徴とする請求項1記載の封孔処理剤。   The epoxy group-containing component includes a polyglycidyl ether compound having 3 or more epoxy groups contained in one molecule as an essential component, and an alkylene diglycidyl ether compound having 2 epoxy groups contained in one molecule. And a polyglycidyl ether compound in an amount of 10 to 80% by weight based on the entire epoxy group-containing component excluding the curing agent. The sealing agent according to claim 1. 前記エポキシ基含有成分は、更に1分子中に含まれるエポキシ基の数が1個のモノグリシジルエーテル化合物を含むことを特徴とする請求項2記載の封孔処理剤。   The sealing agent according to claim 2, wherein the epoxy group-containing component further comprises a monoglycidyl ether compound having one epoxy group in one molecule. 金属基材上に封孔処理剤で封孔処理された溶射被膜を有する溶射被膜被覆部材であって、前記封孔処理剤が請求項1、請求項2または請求項3記載の封孔処理剤であることを特徴とする溶射被膜被覆部材。   A thermal spray coating member having a thermal spray coating that has been sealed with a sealing agent on a metal substrate, wherein the sealing agent is the sealing agent according to claim 1, claim 2, or claim 3. A thermal spray coating member characterized by the above. 溶射被膜被覆部材が軸受構成部材表面に形成されている軸受において、前記溶射被膜被覆部材が請求項4記載の溶射被膜被覆部材であることを特徴とする軸受。   The bearing in which the thermal spray coating member is formed on the surface of the bearing constituent member, wherein the thermal spray coating member is the thermal spray coating member according to claim 4.
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US10371213B2 (en) 2009-09-25 2019-08-06 Saint-Gobain Performance Plastics Rencol Limited System, method and apparatus for tolerance ring control of slip interface sliding forces
CN104395494A (en) * 2012-04-24 2015-03-04 艾尔尤斯科技有限公司 Coatings, coated surfaces, and methods for production thereof
JP2015520132A (en) * 2012-04-24 2015-07-16 エレウス テクノロジーズ インコーポレイテッド Film, coated surface, and manufacturing method thereof
JP2017206772A (en) * 2012-04-24 2017-11-24 エレウス テクノロジーズ インコーポレイテッド Film, coating surface, and production method thereof
WO2016136483A1 (en) * 2015-02-23 2016-09-01 Ntn株式会社 Roller bearing
JP2016156409A (en) * 2015-02-23 2016-09-01 Ntn株式会社 Rolling bearing
US10190633B2 (en) 2015-02-23 2019-01-29 Ntn Corporation Rolling bearing
US11005334B2 (en) 2017-12-15 2021-05-11 Saint-Gobain Performance Plastics Rencol Limited Annular member, method, and assembly for component displacement control

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