JP2008183516A - Dry air supply device and substrate treating apparatus equipped therewith - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dry air supply device supplying hot dry air with no cost increase, and a substrate treating apparatus equipped therewith. <P>SOLUTION: A ceramic adsorbent is packed in honeycomb structures of a primary rotor 603 and a secondary rotor 606. A region X1 of a blocking member 641 is connected to an inlet of a motor-driven three-way valve 611 by piping 610. A region Z3 of a blocking member 643 is connected to one inlet of a heat exchange unit 613 by piping 614. One outlet of the three-way valve 611 is connected to the other inlet of the heat exchange unit 613 by piping 612. The other outlet of the three-way valve 611 is connected to exhausting piping 617 extended to the outside of a dry air generator 60. The piping 61 of the substrate treating apparatus is connected to one outlet of the heat exchange unit 613. Exhausting piping 618 is connected to the other outlet of the heat exchange unit 613. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a dry air supply device that supplies dry air and a substrate processing apparatus including the dry air supply device.

  Conventionally, in order to perform various processes on substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal display devices, glass substrates for plasma displays, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, etc. A substrate processing apparatus is used.

  For example, in a substrate processing apparatus that cleans a substrate, dry air is used to dry the substrate after the cleaning process after the substrate is cleaned. In this case, a dry air supply device that supplies dry air is used (see, for example, Patent Document 1).

In the dry air supply apparatus described in Patent Document 1, the air sucked by the fan is dehumidified by passing through a rotor having an adsorbent, and is supplied to the substrate processing apparatus as dry air. Moreover, after a part of dry air is cooled by the cooler to predetermined temperature, it passes a rotor again. The dry air that has passed through the rotor is heated to a predetermined temperature by a heater, supplied to the rotor to desorb moisture adsorbed in the rotor, and then discharged to the outside of the dry air supply device. The
JP 2004-321964 A

  Conventionally, in a substrate processing apparatus, it has been a problem to further improve the throughput of substrate processing including substrate drying processing. In order to shorten the drying process time, there is a method in which dry air supplied into the substrate processing apparatus is heated in advance by a heater. Thereby, it becomes possible to supply high-temperature dry air, and the time of the drying process can be shortened. However, providing the heater increases the manufacturing cost of the dry air supply device. Moreover, since it is necessary to supply electric power to a heater, the operating cost of a dry air supply apparatus rises.

  On the other hand, when dry air is supplied into the substrate processing apparatus without providing a heater in the dry air supply apparatus, it is impossible to reduce the time for the drying process.

  An object of the present invention is to provide a dry air supply device capable of supplying high-temperature dry air without increasing costs, and a substrate processing apparatus including the dry air supply device.

  (1) A dry air supply device according to a first aspect of the present invention is a dry air supply device that supplies dry air, has a built-in adsorbent, is rotatably supported, and rotationally drives the rotary body. Rotation drive means, a first supply system for supplying air to the rotating body so as to pass through the first part in the rotating body, and air to be supplied to the rotating body so as to pass through the second part in the rotating body. The second supply system, heating means for heating the air that has passed through the second part in the rotating body, and air heated by the heating means so as to pass through the third part in the rotating body are rotated as regeneration air. The third supply system that supplies the body and the amount of heat of the regeneration air that has passed through the third part in the rotating body and is discharged from the rotating body passes through the first part in the rotating body and is discharged from the rotating body Heat exchange means for generating dry air heated to Those were example.

  In the dry air supply apparatus according to the first aspect of the invention, the rotating body in which the adsorbent is built is rotationally driven by the rotational driving means. Air is supplied to the rotating body by the first supply system so as to pass through the first portion in the rotating body. Further, air is supplied to the rotating body by the second supply system so as to pass through the second portion in the rotating body. The air that has passed through the second part in the rotating body is heated by the heating means.

  The air heated by the heating means is supplied as regenerating air to the rotating body by the third supply system so as to pass through the third portion in the rotating body. The amount of heat of the regeneration air passing through the third portion in the rotating body and discharged from the rotating body is given to the air discharged from the rotating body after passing through the first portion in the rotating body by the heat exchange means. Thereby, the dry air heated by the heat exchange means is generated.

  With such a configuration, the heated dry air can be generated by the heat exchange means without providing a heater for heating the air flowing out of the rotating body. Thereby, it is possible to supply the substrate processing apparatus with the dry air whose temperature has been increased without increasing the manufacturing cost and the operating cost of the dry air supply apparatus. Thereby, the drying speed of the substrate can be improved. Therefore, the throughput of substrate processing can be improved without increasing costs.

  (2) The dry air supply device exchanges heat with a fourth supply system that supplies the regeneration air that has passed through the third portion of the rotating body and discharged from the rotating body to the heat exchanging means, and the fourth supply system. An air amount adjusting means for adjusting the amount of regeneration air supplied to the means may be further provided.

  In this case, the regeneration air that has passed through the third portion in the rotating body and is discharged from the rotating body is supplied to the heat exchanging means by the fourth supply system. Then, the amount of regeneration air supplied to the heat exchange means by the fourth supply system is adjusted by the air quantity adjusting means.

  With such a configuration, the amount of regeneration air is adjusted by the air amount adjusting means so that a desired amount of regeneration air is supplied into the heat exchange means. Thereby, dry air having a desired temperature can be generated.

  (3) The dry air supply device further includes temperature detecting means for detecting the temperature of the dry air heated by the heat exchanging means, and the air amount adjusting means is based on the temperature detected by the temperature detecting means. The amount of regeneration air supplied to the heat exchange means by the supply system may be adjusted.

  In this case, the amount of regeneration air supplied to the heat exchanging means by the fourth supply system is adjusted by the air amount adjusting means based on the temperature of the dry air detected by the temperature detecting means. Thereby, the temperature of dry air can be adjusted correctly.

  (4) The rotating body includes a first rotating body and a second rotating body having a common rotating shaft, and the rotation driving means rotates the first rotating body at a higher rotational speed than the second rotating body. Also good.

  As described above, when the first rotating body is rotationally driven by the rotational driving means at a higher rotational speed than the second rotating body, moisture, organic components, ion components, etc. remaining in the air or dry air are sufficiently obtained. Can be removed.

  (5) The temperature of the dry air heated by the heat exchange means may be 60 ° C. or higher and 70 ° C. or lower. By supplying dry air having such a high temperature to the substrate processing apparatus, the drying speed of the substrate can be improved. Therefore, the throughput of substrate processing can be improved.

  (6) A substrate processing apparatus according to a second aspect of the present invention is a substrate processing apparatus that performs processing on a substrate, a processing unit that performs processing using a processing liquid on the substrate, and a dry air that is applied to the substrate processed by the processing unit. The dry air supply device according to the first aspect of the present invention is provided.

  In the substrate processing apparatus according to the second aspect of the invention, the processing unit performs processing using the processing liquid on the substrate. Then, dry air is supplied to the substrate processed by the processing unit by the dry air supply device.

  Thus, the drying speed of a board | substrate can be improved by supplying the dry air which has the high temperature produced | generated by the dry air supply apparatus to the board | substrate after a process. Thereby, the throughput of substrate processing can be improved.

  According to the present invention, high-temperature dry air can be supplied without increasing costs.

  A dry air supply apparatus according to an embodiment of the present invention and a substrate processing apparatus including the same will be described with reference to the drawings.

  In the following description, the substrate refers to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, and the like.

(1) Configuration of Substrate Processing Apparatus FIG. 1 is a schematic cross-sectional view showing the configuration of a substrate processing apparatus according to the present embodiment. As shown in FIG. 1, the substrate processing apparatus 100 according to the present embodiment includes a processing tank 4, a downflow duct 20, a substrate moving mechanism 30, a processing liquid mixing device 50, a dry air generating device 60, a control unit 70, and a fan filter. A unit FFU is provided.

  A fan filter unit FFU is disposed above the downflow duct 20. The fan filter unit FFU includes a fan and a filter. When the fan of the fan filter unit FFU is operated, a clean downward air flow (down flow) is generated in the down flow duct 20.

  A processing tank 4 is provided in the lower part of the downflow duct 20. The processing tank 4 is formed of an inner tank 40 capable of storing a plurality of substrates W and an outer tank 43 provided so as to surround the upper outer periphery of the inner tank 40. The inner tank 40 has a substantially rectangular parallelepiped shape.

  Connected to the bottom of the inner tank 40 are a processing liquid supply pipe 41 for supplying the processing liquid into the inner tank 40 and a processing liquid discharge pipe 42 for discharging the processing liquid in the inner tank 40. In the present embodiment, the substrate W is cleaned in the inner tank 40. The processing liquid supplied into the inner tank 40 during the cleaning process is a cleaning liquid or a rinsing liquid.

  That is, the surface of the substrate W is cleaned by supplying the cleaning liquid into the inner tank 40 and immersing the substrate W in the inner tank 40 in which the cleaning liquid is stored. Thereafter, the cleaning liquid in the inner tank 40 is replaced with a rinsing liquid.

  A chemical solution such as BHF (buffered hydrofluoric acid), DHF (dilute hydrofluoric acid), hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid or ammonia is used as the cleaning liquid. As the rinsing liquid, pure water, carbonated water, hydrogen water, electrolytic ion water or the like is used.

  In the present embodiment, the processing liquid supply pipe 41 is connected to the processing liquid mixing apparatus 50. For example, chemical liquid and pure water are supplied to the processing liquid mixing apparatus 50. The processing liquid mixing apparatus 50 can mix the supplied chemical solution and pure water at a predetermined ratio. Therefore, the processing liquid mixing apparatus 50 supplies chemical liquid, pure water, or a mixed liquid thereof into the inner tank 40 through the processing liquid supply pipe 41 as a cleaning liquid or a rinsing liquid.

  A processing liquid discharge pipe 44 is connected to the bottom of the outer tank 43 to discharge the processing liquid that overflows (overflows) from the upper part of the inner tank 40 and flows into the outer tank 43.

  A substrate moving mechanism 30 is provided above the inner tank 40. The substrate moving mechanism 30 moves the holding unit 33 that holds the plurality of substrates W in the vertical direction.

  A transport area TE is provided in the upper part of the downflow duct 20. The transport area TE is used when the substrate W is transferred between the holding unit 33 that holds the substrate W and a transport mechanism (not shown).

  In the portion of the downflow duct 20 that surrounds the transfer area TE, openings 20h are formed in two opposing side surfaces, respectively. In the vicinity of the two openings 20h, a shutter SH and a shutter driver SD that can open and close the openings 20h in the vertical direction are provided. The shutter driving unit SD opens and closes the opening 20h of the downflow duct 20 by driving the shutter SH.

  For example, when the shutter SH is opened, a transport mechanism (not shown) that holds the substrate W before the cleaning process is carried into the transport area TE in the downflow duct 20 through the opening 20h, and the substrate W is loaded into the holding unit 33. give. Further, a transport mechanism (not shown) that has received the substrate W after the cleaning process from the holding unit 33 is carried out of the downflow duct 20 through the opening 20h.

  In the portion of the downflow duct 20 located in the vicinity of the upper portion of the processing tank 4, a dry air supply duct 62 and a dry air exhaust duct 63 are attached to two opposing side surfaces, respectively. The dry air supply duct 62 is connected to the dry air generator 60 via a pipe 61. The detailed configuration of the dry air generator 60 will be described later.

  Dry air (dry air) DF generated by the dry air generator 60 is sent to the dry air supply duct 62 through the pipe 61. Thereby, the dry air DF is sprayed on the substrate W pulled up from the inner tank 40, and the substrate W is dried. The dry air DF sprayed on the substrate W is exhausted from the dry air exhaust duct 63.

  As shown in FIG. 1, the control unit 70 is connected to the substrate moving mechanism 30, the processing liquid mixing device 50, the dry air generating device 60, the shutter driving unit SD, and the fan filter unit FFU. When the control unit 70 controls the operations of these components, the downflow in the downflow duct 20, the loading / unloading operation of the substrate W with respect to the substrate processing apparatus 100, the cleaning process of the substrate W and the drying process of the substrate W are controlled. The

  For example, the control unit 70 controls the fan filter unit FFU to generate a downflow in the downflow duct 20.

  The control unit 70 controls the substrate moving mechanism 30 to move the holding unit 33 that holds the substrate W into the inner tank 40 at the start of the cleaning process. In this state, the control unit 70 controls the processing liquid mixing device 50 to supply the chemical liquid or a mixed liquid of the chemical liquid and pure water into the inner tank 40 as a cleaning liquid. Thereby, the substrate W is immersed in the cleaning liquid in the inner tank 40, and the surface of the substrate W is cleaned.

  Thereafter, the control unit 70 controls the processing liquid mixing device 50 to supply pure water as a rinse liquid into the inner tank 40 and replace the cleaning liquid in the inner tank 40 with pure water. Thereby, the substrate W is immersed in pure water in the inner tank 40. Thereby, the cleaning process of the substrate W is completed.

  The control unit 70 controls the substrate moving mechanism 30 to pull up the substrate W that has been subjected to the cleaning process above the inner tank 40. Therefore, the control unit 70 controls the dry air generator 60 to supply the dry air DF to the pulled up substrate W. Thereby, the pure water adhering to the substrate W is replaced by the dry air DF, and the surface of the substrate W is dried (drying process).

  When pulling up the substrate W from the inner tank 40, the control unit 70 controls the processing liquid mixing device 50 to continuously supply a small amount of pure water into the inner tank 40. Therefore, when the substrate W is pulled up from the inner tank 40, pure water overflows from the upper opening of the inner tank 40. The pure water overflowing from the inner tank 40 flows into the outer tank 43 and is discharged from the processing liquid discharge pipe 44 connected to the outer tank 43.

  The processing liquid supply pipe 41 and the processing liquid discharge pipes 42 and 44 are each provided with a valve (not shown). The control unit 70 also controls the opening / closing operations of these valves. As a result, the opening and closing operation of the supply system and the discharge system of the processing liquid in the processing tank 4 is controlled by the control unit 70.

  Note that the temperature and humidity of the atmosphere in the substrate processing apparatus 100 according to the present embodiment are managed to be, for example, 23 ° C. ± 0.5 ° C. and 45% ± 5%, respectively.

(2) Details of Dry Air Generator (2-1) Configuration of Dry Air Generator FIG. 2 is a block diagram showing the configuration of the dry air generator 60 of FIG.

  As shown in FIG. 2, the dry air generator 60 mainly includes an air supply fan 601, a cylindrical primary rotor 603, a cylindrical secondary rotor 606, a regeneration air heater 608, an electric three-way valve 611, and a heat exchange unit 613. Is provided.

  The primary rotor 603 and the secondary rotor 606 are arranged in series with each other and are each formed of a honeycomb structure, and the honeycomb structure is filled with a ceramic adsorbent (adsorbing substance).

As air (air) passes through the primary rotor 603 and the secondary rotor 606, moisture, organic components (for example, NO _X ), ion components (for example, SO ²⁻ ) and the like contained in the air are adsorbed by the adsorbent. Removed. Hereinafter, moisture, organic components, ionic components and the like are simply referred to as moisture and the like. Thus, by providing the primary rotor 603 and the secondary rotor 606, the effect of removing moisture and the like can be further enhanced.

  The primary rotor 603 and the secondary rotor 606 are supported so as to be rotatable around a central axis. The primary rotor 603 is rotationally driven by the motor 631, and the secondary rotor 606 is rotationally driven by the motor 632. In the present embodiment, the rotation speed of the primary rotor 603 is, for example, 10 rotations / hour, and the rotation speed of the secondary rotor 606 is set, for example, to 3 rotations / hour.

  Between one end face of the primary rotor 603 and one end face of the secondary rotor 606, an annular closing member 642 is disposed in proximity to each other. In addition, a circular closing member 641 is disposed so as to be close to the other end surface of the primary rotor 603, and a circular closing member 643 is disposed so as to be close to the other end surface of the secondary rotor 606.

  The closing member 641 has a circular end surface portion and an annular peripheral wall portion, and an inner space is partitioned into three regions X1, Y1, and Z1 by a plurality of partition pieces. The space inside the closing member 642 is partitioned into three regions X2, Y2, and Z2. The closing member 643 has a circular end surface portion and an annular peripheral wall portion, and an inner space is partitioned into three regions X3, Y3, and Z3 by a plurality of partition pieces.

  The regions X1, X2, and X3 have substantially the same area and are arranged so as to face each other. The regions Y1, Y2, and Y3 have substantially the same area and are disposed so as to face each other. Further, the regions Z1, Z2, and Z3 have substantially the same area and are arranged so as to face each other.

  The closing members 641, 642 and 643 are fixed. Therefore, when the air passes through the regions Z1, Z2, and Z3 while the primary rotor 603 and the secondary rotor 606 are rotating, the region through which the air passes in the primary rotor 603 and the secondary rotor 606 changes. Similarly, when air passes through the regions Y1, Y2, and Y3 while the primary rotor 603 and the secondary rotor 606 rotate, the region through which air passes in the primary rotor 603 and the secondary rotor 606 changes. Further, when air passes through the regions X3, X2, and X1 while the primary rotor 603 and the secondary rotor 606 are rotating, the region through which the air passes in the primary rotor 603 and the secondary rotor 606 changes.

  The supply fan 601 is connected to the region Z1 of the closing member 641 by a pipe 602. The region Z3 of the closing member 643 is connected to one inlet of the heat exchange unit 613 by a pipe 614. The heat exchange unit 613 includes a thermocouple 615 that detects the temperature of air in the heat exchange unit 613.

  A pipe 604 is provided so as to branch from the pipe 602. The end of the pipe 604 is connected to the region Y1 of the closing member 641. A regeneration air amount adjustment damper 605 is inserted in the pipe 604.

  A region Y3 of the closing member 643 is connected to the inlet of the regeneration air heater 608 by a pipe 607. The outlet of the regeneration air heater 608 is connected to the region X3 of the closing member 643 by a pipe 609.

  Further, the region X1 of the closing member 641 is connected to the inlet of the electric three-way valve 611 by a pipe 610. One outlet of the electric three-way valve 611 is connected to the other inlet of the heat exchange unit 613 by a pipe 612. The other outlet of the electric three-way valve 611 is connected to a pipe 617 for exhaust gas that extends to the outside of the dry air generator 60.

  The pipe 61 of the substrate processing apparatus 100 according to the present embodiment is connected to one outlet of the heat exchange unit 613. In the pipe 61, an ULPA (Ultra Low Penetration Air) filter 616 for removing particles (fine powder) and the like is inserted.

  On the other hand, a pipe 618 is connected to the other outlet of the heat exchange unit 613. This pipe 618 is connected to the pipe 617. Air flowing from one inlet of the heat exchange unit 613 is discharged from one outlet, and air flowing from the other inlet is discharged from the other outlet.

  In the present embodiment, the control unit 70 (FIG. 1) controls the operations of the air supply fan 601, the regeneration air amount adjustment damper 605, the regeneration air heater 608, the motors 631, 632, and the electric three-way valve 611.

(2-2) Operation of Dry Air Generator The operation (action) of each component of the dry air generator 60 will be described below.

First, air (for example, 17 m ³ / min) is sucked by the air supply fan 601.

  Air sucked by the air supply fan 601 (hereinafter referred to as “undried air”) is supplied to the pipe 602, the region Z1 of the closing member 641, the primary rotor 603, the region Z2 of the closing member 642, the secondary rotor 606, and the closing member 643. After passing through the region Z3 and the pipe 614, the heat exchange unit 613 is supplied into the heat exchange unit 613 through one inlet of the heat exchange unit 613.

  As a result, air from which moisture or the like has been removed by the primary rotor 603 and the secondary rotor 606 (hereinafter referred to as dry air) is supplied into the heat exchange unit 613. In this Embodiment, the temperature of the dry air supplied in the heat exchange unit 613 by the piping 614 is 40-50 degreeC, for example.

  The air sucked by the air supply fan 601 includes the pipe 604, the regeneration air amount adjusting damper 605, the region Y1 of the closing member 641, the primary rotor 603, the region Y2 of the closing member 642, the secondary rotor 606, and the closing member. After passing through the region Y3 643, the air is supplied into the regeneration air heater 608 through the pipe 607. The air flow rate in the pipe 604 is adjusted by the regeneration air amount adjustment damper 605.

  In the following description, the air that is sucked by the air supply fan 601 and then flows into the pipe 604 is referred to as regeneration air.

  In the regeneration air heater 608, the regeneration air is heated to a predetermined temperature (for example, about 200 ° C.). In this way, the regeneration air heated to about 200 ° C. by the regeneration air heater 608 includes the pipe 609, the region X3 of the closing member 643, the secondary rotor 606, the region X2 of the closing member 642, the primary rotor 603, and the closing member. After passing through the region X1 of 641, it is supplied to the electric three-way valve 611 through the pipe 610.

  Thereby, moisture adsorbed in the secondary rotor 606 and the primary rotor 603 is removed by the heated regeneration air.

  Here, in the present embodiment, the temperature of the regeneration air after passing through the primary rotor 603 is about 80 ° C., for example.

  The regeneration air supplied to the electric three-way valve 611 is supplied from one outlet of the electric three-way valve 611 to the heat exchange unit 613 through the pipe 612 and the other inlet of the heat exchange unit 613.

As described above, for example, dry air at 40 to 50 ° C. is supplied into the heat exchange unit 613 through the pipe 614, and regeneration air (for example, about 7 m ^{3) at} about 80 ° C. is supplied into the heat exchange unit 613 through the pipe 612. / Min) is supplied.

Thereby, the dry air is heated in the heat exchange unit 613 by the amount of heat of the regeneration air. The heated dry air DF (for example, 10 m ³ / min) is supplied into the substrate processing apparatus 100 of FIG. In this case, the temperature of the dry air DF can be set to 60 to 70 ° C., for example.

  Here, the control unit 70 (FIG. 1) monitors (monitors) the temperature of the dry air in the heat exchange unit 613 by the thermocouple 615. That is, based on the monitored dry air temperature, the amount of regeneration air flowing into the pipe 612 is controlled by the opening degree of the other outlet of the electric three-way valve 611.

  For example, when the temperature of the dry air in the heat exchange unit 613 is lower than a predetermined temperature, the opening degree of the other outlet is reduced. Thereby, the flow rate of the regeneration air supplied into the heat exchange unit 613 by the pipe 612 can be increased.

  On the contrary, when the temperature of the dry air in the heat exchange unit 613 is higher than a predetermined temperature, the opening degree of the other outlet is increased. As a result, the flow rate of the regeneration air supplied into the heat exchange unit 613 by the pipe 612 can be reduced.

  Part of the regeneration air that flows out from the other outlet of the electric three-way valve 611 is discharged to the outside through the pipe 617. Similarly, the regeneration air supplied into the heat exchange unit 613 flows out from the other outlet of the heat exchange unit 613 and is then discharged to the outside through the pipe 618 and the pipe 617.

(3) Effects in the present embodiment (3-1)
As described above, in the configuration of the dry air generation device 60 according to the present embodiment, the dry air is about 60 by the regeneration air in the heat exchange unit 613 without providing a heater for heating the dry air flowing out from the secondary rotor 606. It can be heated to a temperature of ~ 70 ° C. Accordingly, it is possible to supply the hot dry air DF to the substrate processing apparatus 100 without increasing the manufacturing cost and the operating cost of the dry air generating apparatus 60. Thereby, the drying speed of the substrate W can be improved. Therefore, the throughput of substrate processing can be improved without increasing costs.

(3-2)
In general, when high-humidity undried air flows into the primary rotor 603 and the secondary rotor 606, the dehumidification by the primary rotor 603 and the secondary rotor 606 is not sufficiently performed. For this reason, a pre-chiller is usually provided, the temperature of the air flowing into the primary rotor 603 is cooled to about 7 to 10 ° C. by this pre-chiller, and the moisture contained in the undried air is removed. Thereby, air with a low dew point is obtained.

  In addition, when the moisture contained in the undried air is removed by the primary rotor 603 and the secondary rotor 606, the temperature of the undried air rises due to latent heat due to evaporation. Therefore, an after refrigerator is usually provided and this after refrigeration is performed. Reduce the temperature of the dry air raised by the machine.

  On the other hand, in the substrate processing apparatus 100 according to the present embodiment, as described above, since the temperature and humidity of the atmosphere are controlled within a certain range, a low dew point (for example, without providing a pre-chiller) , −95 ° C.) is supplied to the primary rotor 603.

  Further, in the dry air generation device 60 according to the present embodiment, the high temperature dry air DF is supplied to the dry air supply duct 62 by not providing the after refrigerator.

(3-3)
Normally, as in the present embodiment, the dry air generator 60 and the dry air supply duct 62 are connected by the pipe 61, so that the temperature of the dry air DF decreases while the dry air DF flows through the pipe 61. For example, when the length of the pipe 61 made of stainless steel (SUS304, SUS316, etc.) is about 10 m and the temperature of the dry air DF flowing in the pipe 61 is about 60 ° C., the temperature of the dry air DF is about 20 ° C. May decrease.

  In the present embodiment, the dry air DF having a temperature of about 60 to 70 ° C. can be generated by the heat exchange unit 613. Thereby, even if the temperature of the dry air DF decreases in the middle of the pipe 61, the high temperature dry air DF having a temperature of at least about 50 to 60 ° C. can be supplied at the portion immediately before the dry air supply duct 62. Thereby, the drying speed of the substrate W can be improved.

(4) Other Embodiments As described above, in this embodiment, the temperature and humidity of the atmosphere in the substrate processing apparatus 100 are managed within a certain range, but the temperature and humidity are not managed. May be provided with the above-described pre-chiller in order to obtain undried air with a low dew point from which moisture has been removed.

  Moreover, in the said embodiment, although the control part 70 decided to control the structure part of the substrate processing apparatus 100 and the structure part of the dry air generator 60, respectively, it is not limited to this, Each structure part is controlled. You may provide two control parts so that it may control independently.

(5) Correspondence between each constituent element of claim and each element of the embodiment Hereinafter, an example of correspondence between each constituent element of the claim and each element of the embodiment will be described. It is not limited to.

  In the above embodiment, the primary rotor 603 and the secondary rotor 606 are examples of rotating bodies, the motors 631 and 632 are examples of rotational driving means, and the regions Z1, Z2, and Z3 are first portions in the rotating body. The air supply fan 601 and the pipe 602 are examples of the first supply system, the areas Y1, Y2, and Y3 are examples of the second part in the rotating body, and the pipe 604 and the regeneration air amount adjustment The damper 605 is an example of the second supply system, and the regeneration air heater 608 is an example of the heating means.

  Moreover, in the said embodiment, area | region X1, X2, X3 is an example of the 3rd part in a rotary body, the piping 609 is an example of a 3rd supply system, and the heat exchange unit 613 is a heat exchange means. For example, the pipes 610 and 612 and the electric three-way valve 611 are examples of the fourth supply system, and the electric three-way valve 611 and the pipes 617 and 618 are examples of the air amount adjusting means.

  Further, in the above embodiment, the thermocouple 615 is an example of a temperature detecting means, the primary rotor 603 is an example of a first rotating body, and the secondary rotor 606 is an example of a second rotating body, The processing tank 4 is an example of a processing unit, the substrate moving mechanism 30 is an example of a substrate lifting / lowering means, the pipe 61, the dry air supply duct 62 and the dry air exhaust duct 63 are examples of a supply unit, and the dry air DF is dry air. It is an example.

  In addition, as each component of a claim, it is also possible to use the other various elements which have the structure or function described in the claim.

  INDUSTRIAL APPLICABILITY The present invention can be effectively used for manufacturing substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal display devices, glass substrates for plasma displays, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates. .

It is typical sectional drawing which shows the structure of the substrate processing apparatus which concerns on this Embodiment. It is a block diagram which shows the structure of the dry air generator of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 4 Processing tank 30 Substrate moving mechanism 60 Dry air generator 61 Piping 62 Dry air supply duct 63 Dry air exhaust duct 70 Control part 100 Substrate processing device 601 Air supply fan 603 Primary rotor 605 Reproduction air amount adjustment damper 606 Secondary rotor 608 Reproduction air heater 611 Electric three-way valve 613 Heat exchange unit 615 Thermocouple 631, 632 Motor 641, 642, 643 Closing member DF Dry air W substrate X1, X2, X3, Y1, Y2, Y3 area Z1, Z2, Z3 area

Claims (6)

A dry air supply device for supplying dry air,
A rotating body that contains an adsorbent and is rotatably supported;
A rotation driving means for rotating the rotating body;
A first supply system for supplying air to the rotating body so as to pass through a first portion in the rotating body;
A second supply system for supplying air to the rotating body so as to pass through a second portion in the rotating body;
Heating means for heating the air passing through the second part of the rotating body and exhausted from the rotating body;
A third supply system for supplying air heated by the heating means so as to pass through a third portion in the rotating body as regeneration air into the rotating body;
The amount of heat of the regeneration air passing through the third part in the rotating body and exhausted from the rotating body is increased by giving to the air passing through the first part in the rotating body and exhausted from the rotating body. A dry air supply device comprising: heat exchange means for generating warm dry air. A fourth supply system for supplying regeneration air that has passed through the third portion in the rotating body and discharged from the rotating body to the heat exchanging means;
2. The dry air supply device according to claim 1, further comprising an air amount adjusting means for adjusting an amount of regeneration air supplied to the heat exchange means by the fourth supply system. Further comprising temperature detection means for detecting the temperature of the dry air heated by the heat exchange means,
3. The air amount adjusting means adjusts the amount of regeneration air supplied to the heat exchange means by the fourth supply system based on the temperature detected by the temperature detecting means. The dry air supply apparatus as described. The rotating body includes first and second rotating bodies having a common rotation axis,
The dry air supply device according to any one of claims 1 to 3, wherein the rotation driving unit rotationally drives the first rotating body at a higher rotational speed than the second rotating body. The dry air supply device according to any one of claims 1 to 4, wherein the temperature of the dry air heated by the heat exchange means is 60 ° C or higher and 70 ° C or lower. A substrate processing apparatus for processing a substrate,
A processing unit that performs processing using a processing liquid on the substrate;
6. A substrate processing apparatus, comprising: a dry air supply device according to claim 1 that supplies dry air to a substrate processed by the processing unit.

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