JP2008177068A - Insulated wire and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method capable of easily forming a terminal on an insulated wire. <P>SOLUTION: In this insulated wire, a conductor 1 is made to pass through an electrodeposition bath 8 to attach an electrodeposited layer to its outer surface, and next the electrodeposited layer is burnt in a burning process. A conductor exposure part is formed by blowing the non-solidified electrodeposited layer attached in the electrodeposition bath 8 using a jetted fluid. Accordingly, since work of forming the conductor exposure part by purposedly mechanically scraping off an insulation layer is not necessary, manufacturing efficiency can be improved as a whole, and a problem of inferior quality due to dispersion of work does not occur. Whereas ultrafine powder dust is generated in the work of scraping off the insulating layer by a mechanical means, and adversely affects a secret apparatus, an electronic component name or the like, this manufacturing method has an advantage capable of surely preventing such a problem. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an insulated wire and a method for manufacturing the same.

Conventionally, as an insulated wire, for example, as a method of manufacturing a magnet wire, many proposals have been made on improving heat resistance, flexibility (hardness of peeling of the insulating layer), and space factor (for example, Patent Document 1 or Patent Document 2).
JP 2005-174561 A JP 2003-317547 A

  However, in applications such as magnet wires, high voltage transformer coils, and non-contact type IC card antenna coils, terminals are always required. As for this terminal processing, the old method is mechanically scraping off the insulating layer.

  Therefore, an object of the present invention is to inexpensively manufacture an insulated wire that can omit the work of mechanically scraping the insulating layer. Furthermore, it is another object to provide an insulated wire that can be further reduced in size in a state where it is wound in a coil shape or stacked in multiple layers in the above-mentioned applications where downsizing is desired.

  In order to achieve the above object, an insulated wire according to the present invention is an insulated wire formed by coating an insulating layer that has been electrodeposited and baked on a conductor, and an electrodeposition layer before baking for forming the insulating layer. A conductor exposed portion formed by partial non-formation or partial removal is provided.

  In addition, the present invention continuously bakes the electrodeposition layer adhered to the outer surface of the conductor after the electrodeposition layer adhesion step of adhering and forming the electrodeposition layer on the outer surface of the conductor while continuously passing through the electrodeposition bath. In the method of manufacturing an insulated wire in which an insulating layer is formed on the outer surface of the conductor through a baking step, an uncured state adhered to the outer surface of the conductor between the electrodeposition layer attaching step and the baking step. The electrodeposition layer is blown away with a jet fluid, the electrodeposition layer is partially removed, and the conductor is partially exposed to form a conductor exposed portion through the baking step.

  Alternatively, according to the present invention, the electrodeposition layer adhered to the outer surface of the conductor is continuously baked after the electrodeposition layer adhesion step of depositing and forming the electrodeposition layer on the outer surface of the conductor while continuously passing through the electrodeposition bath. In the method of manufacturing an insulated wire in which an insulating layer is coated on the outer surface of the conductor after the baking step, the conductor is in contact with the outer surface of the conductor in the electrodeposition tank during the electrodeposition layer attaching step. With the movable masking member that moves in the same direction as the passing travel direction, the conductor is partially masked, and the conductor exposed portion is formed in the subsequent baking step without partially forming an electrodeposition layer on the outer surface of the conductor. It is a method of forming.

  In addition, the present invention continuously bakes the electrodeposition layer adhered to the outer surface of the conductor after the electrodeposition layer adhesion step of adhering and forming the electrodeposition layer on the outer surface of the conductor while continuously passing through the electrodeposition bath. In the method of manufacturing an insulated wire in which an insulating layer is coated on the outer surface of the conductor through the baking step, the outer surface of the conductor passing through the electrodeposition tank is slidably contacted during the electrodeposition layer attaching step. This is a method in which a conductor is partially masked by a sliding masking member, and a conductor exposed portion is formed in the subsequent baking step without partially forming an electrodeposition layer on the outer surface of the conductor.

  According to the insulated wire according to the present invention, since it is not necessary to mechanically scrape and form the conductor exposed portion, the manufacturing efficiency can be improved as a whole, and the problem of poor quality due to variations in work also occurs. do not do. Moreover, in the work of scraping the insulating layer by mechanical means, ultra fine dust is generated, which adversely affects confidential equipment / electronic component names, etc., but there is also an advantage that such a problem can be surely prevented. Further, it is possible to effectively prevent the conductor from being damaged by mechanical processing and causing breakage or breakage.

  According to the method for manufacturing an insulated wire according to the present invention, a conductor exposed portion that does not have an insulating layer partially and efficiently generates dust during the continuous production of a long insulated wire. And can be manufactured easily and reliably while maintaining high quality. In particular, in response to demands for miniaturization and high performance of coils such as motors and transformers, it is possible to achieve compactness, and mass production can be easily realized. In addition, it can contribute to the realization of coils such as motors and transformers with good heat dissipation.

  Hereinafter, the present invention will be described in detail with reference to the drawings illustrating embodiments.

  In FIG. 1 and FIG. 2, various types of insulated wires 3 having a rectangular cross section (that is, a rectangular shape or a single letter shape) and whose width dimension W changes in size in the longitudinal direction. Is illustrated. Although not shown in the drawings, the thickness dimension is small in the portion having the large width dimension W and large in the portion having the small width dimension W.

  1A to 1D, the portions indicated by dots indicate portions where the insulating layer 5 is covered with the conductor 1, and the portions where the dots do not exist indicate conductor exposed portions 7.

  7A is a cross-sectional view taken along the line AA in FIG. 1C, and FIG. 7B is a cross-sectional view taken along the line BB in FIG. 1C. In this way, the conductor exposed portions 7 in which the conductor 1 is partially exposed are disposed (formed) at a predetermined pitch in the longitudinal direction and across the width in the plan view.

  In this insulated wire 3, the outer surface 2 of the conductor 1 is covered with the insulating layer 5 by electrodeposition / baking, but the conductor exposed portion is not formed by partially forming the electrodeposition layer before the baking process. 7 is formed, or the conductor exposed portion 7 is formed by partially removing the electrodeposition layer before the baking step.

  In FIG. 4, the entire manufacturing method is shown in a simplified manner, 8 is an electrodeposition tank, and a rolling mill for feeding a conductor from a feeding roller 9 to roll a conductor having a circular cross section into a flat wire, for example; Electrodeposition while passing through a processing device 10 such as a washing tank (detailed illustration is omitted and indicated by a two-dot chain line), and the conductor 1 runs from below to above as indicated by an arrow G via a direction changing roller 11 The conductor 1 continuously passes through the electrodeposition tank 8 through the bottom wall of the electrodeposition tank 8 in which the liquid 12 is stored, and resin fine particles (described later) in the electrodeposition liquid 12 are placed on the outer surface of the conductor 1. It is made to adhere and an electrodeposition layer is formed. This is called an electrodeposition layer attaching step.

  FIG. 5 is a simplified plan view for explaining the outline of this electrodeposition layer attaching step. If it is described together with FIG. 4, a negative electrode 13 is inserted in the electrodeposition tank 8, and the direction of arrow G is shown. The flat wire (conductor 1) that passes through is brought into contact with a power source (not shown) so as to be a positive pole. As the electrodeposition liquid 12, an epoxy-based water dispersion (emulsion) type electrodeposition varnish or a polyimide-based or polyamide-acid-based electrodeposition varnish is suitable. A small circle schematically shows the resin fine particles 14 such as the epoxy resin, and the resin fine particles 14 during migration are negatively charged and are formed on the outer surface 2 of the conductor 1 as a positive electrode. The electrodeposition layer 15 is formed by adhering one after another efficiently.

  As shown in FIG. 4, a baking furnace 16 is provided to perform a baking process for continuously baking the electrodeposition layer 15 adhering to the outer surface of the conductor 1, and passes through the baking furnace 16. Thus, the insulating layer 5 is formed on the outer surface 2 of the conductor 1 (see FIG. 2B). Thereafter, the film is wound around a winding roller (not shown).

A conductor exposed portion forming device 17 is provided between the electrodeposition bath 8 and the baking furnace 16. That is, an uncured electrodeposition layer 15 as shown in FIG. 6 (a) that adheres to the outer surface 2 of the conductor 1 between the electrodeposition layer adhesion step and the baking step is shown in FIG. 6 (b). Thus, the electrodeposition layer 15 is partially removed by blowing off with the jetting fluid H (see arrow J in FIG. 6B). The portion 70 where the electrodeposited layer 15 is partially removed from the outer surface 2 of the conductor 1 is subjected to a subsequent baking process to form a conductor exposed portion 7 as shown in FIGS. 1 (a) to 1 (d). To do.
As the ejection fluid H, air (air) is desirable, but other gases (gas), liquids such as water, water vapor, or the like can be used.

In FIG. 6, two nozzles 18 and 18 correspond to the upper and lower surfaces of the rectangular wire conductor 1, and the fluid H is ejected over a very short time by position detection means (not shown). Thus, as shown in FIGS. 6A to 6B, the uncured (unbaked) electrodeposition layer 15 blows away. The arrangement of the nozzles 18 and 18 in FIG. 6 is suitable for forming the removal portion 70 (conductor exposed portion 7) in the width direction of the flat wire 1 as shown in FIGS. is there. As the position detecting means, when the width dimension W changes as shown in FIGS. 1A to 1D, the width dimension W may be detected, or the proximity sensor may be used to detect peaks and valleys. The position may be detected, and a measuring device that measures the length of the conductor 1 that is continuously sent may be used. In FIG. 6, a reciprocating means for moving the nozzle 18 back and forth in the left-right direction in the figure is provided, and the position fluctuations of the crests and troughs of the side edge corresponding to the change in the width dimension W of the conductor 1 are provided. Is also preferable (not shown).
In FIG. 6, it is also preferable to form the removal portion 70 (conductor exposed portion 7) only on one surface of the conductor 1 with the nozzles 18, 18 being only one.

  Next, FIG. 7 shows another embodiment (instead of FIG. 6). That is, as shown in FIG. 7A, an uncured (non-baked) electrodeposition layer 15 adhering to the short side 19 of the rectangular cross section is ejected from the nozzle 18 as shown in FIG. The electrodeposition layer 15 is removed from only the short side 19 by partially blowing away with the fluid H (see arrow J), and this removed portion 70 undergoes a subsequent baking process, for example, as shown in FIG. Conductor exposed portions 7 are formed. 3 (b) and 3 (c) respectively show the BB and CC cross sections of FIG. 3 (a). In FIGS. 1 and 2, the conductor exposed portion 7 is formed at the long side 20 of the rectangular cross section. In contrast, in FIG. 3, the conductor exposed portion 7 is formed on the short side 19. As shown in FIG. 7, it is also desirable to provide a fluid shielding member 21 so that the ejected fluid H does not blow off the electrodeposition layer 15 from a portion other than the short side 19.

  Next, FIG. 8 and FIG. 9 show another embodiment. That is, as is clear from comparison with FIG. 4 described above, a movable masking member 22 is provided in the electrodeposition tank 8 instead of the conductor exposed portion forming device 17 shown in FIG.

  In FIG. 8, a conductor is fed from a feeding roller 9, for example, a rolling mill that rolls a conductor having a circular cross section into a flat wire, and a processing device 10 such as a washing tank, and the direction changing roller 11 is passed through. Pass through the electrodeposition tank 8 containing the electrodeposition liquid 12 from the bottom to the top (as indicated by the arrow G), and the resin fine particles 14 in the electrodeposition liquid 12 adhere to the outer surface of the conductor 1 (as shown in FIG. 5). In this case, the movable masking member 22 prevents the resin fine particles 14 from approaching one of the long sides 20 and 20 having a rectangular cross section (conductor 1) in FIG. 9, as shown in FIG. In addition, with one long side 20 as the electrodeposition layer non-forming portion 72, the conductor exposed portion 7 is formed in the subsequent baking step. Although the electrodeposition layer non-forming portion 72 and the conductor exposed portion 7 corresponding thereto are partially provided, the removal portion 70 and the corresponding conductor exposed portion 7 in the embodiment shown in FIGS. In comparison, the proportion of the conductor 1 in the outer surface 2 is large. That is, in FIG. 9 and FIG. 13, the electrodeposition layer non-formation part 72 (conductor exposed part 7) is formed in one of the long sides 20 and 20 of the cross-sectional rectangle over the whole longitudinal direction.

  Returning to FIG. 8, the electrodeposited layer-attached conductor 1 continuously fed out while traveling upward from the electrodeposition tank 8 is fed into the baking furnace 16 and baked in the baking furnace 16 (baking process). After that, the insulating layer 5 is coated and wound around the winding roller 23.

  Thus, in the embodiment shown in FIGS. 9 and 13, the configuration of the insulated wire 3 can be said as follows. That is, the conductor exposed portion 7 is formed (through a subsequent baking step) by partially not forming the electrodeposition layer 15 before baking for forming the insulating layer 5.

  9 will be described further. A belt 26 is suspended between at least a pair of upper and lower rollers 24 and 25 that can freely rotate about a horizontal axis, and this is pressed against the conductor 1 that runs from the bottom to the top. Then, the belt 26 self-travels in the same direction as the traveling direction G of the conductor 1 with the pressing (contact). In this way, the belt 26 contacts one long side 20 of the conductor 1 and performs a masking action. In addition, it is also preferable to add one or a plurality of pressing rollers between the pair of upper and lower rollers 24 and 25 so that the belt 26 is brought into closer contact with the conductor 1 to ensure the masking action ( (See Figure 10). Further, at least one of the pair of upper and lower rollers 24 and 25 can be driven to rotate as a driving roller. Further, when the width dimension W of the conductor 1 changes, for example, as shown in FIGS. 1A to 1D, the width dimension of the belt 26 corresponds to the maximum portion of the width dimension W of the conductor 1, Set it large enough. Further, the conductor 1 is simplified (shown in the same cross section in FIG. 9), but when the thickness dimension also changes in size, the rollers 24 and 25 can be moved forward and backward in the horizontal direction and pressed by a resilient member, etc. Therefore, it is desirable to easily follow the change in thickness dimension.

  The manufacturing method shown in FIGS. 8, 9 and 13 can be summarized as follows. That is, during the electrodeposition layer attaching step, the conductor 1 is partially moved by the movable masking member 22 that moves in the same direction as the traveling direction G of the conductor 1 while contacting the outer surface 2 of the conductor 1 in the electrodeposition tank 8. (Only one of the long sides 20 and 20) is masked, and the electrodeposition layer 15 is not partially formed on the outer surface 2 of the conductor 1, and the conductor exposed portion 7 is formed in the subsequent baking step. . In this way, the electrodeposition layer non-forming portion 72 is first formed and is used as the conductor exposed portion 7 in the next step (baking step).

  Next, in still another embodiment shown in FIG. 10, a pair of upper and lower rollers 24 (although the electrodeposition tank 8 shown by a two-dot chain line in FIG. 9 is omitted in FIG. 10). , 25, a plurality of rollers 27 are arranged in parallel at a predetermined vertical pitch, and a belt is suspended thereon (as shown by a two-dot chain line) to form a masking member 22. This masking member The belt 22 is pressed (contacted) to at least one of the short sides 19 and 19 of the conductor 1 having a rectangular cross section (unlike FIG. 9). FIG. 15 illustrates a cross-sectional view of the intermediate product / finished product obtained by the manufacturing method shown in FIG. In FIG. 15 and FIG. 13, the same reference numerals have the same configuration, and the electrodeposition layer non-forming portion 72 and the conductor exposed portion 7 correspondingly formed in the subsequent baking process have a short side 19. The point which exists in the side differs from the point which exists in the long side 20 side of FIG.

  In FIG. 10, the same reference numerals as those in FIG. In FIG. 10, the conductor 1 is shown in a simplified manner in the same cross section. However, when the width dimension W of the conductor 1 is changed as shown in FIGS. It is preferable to follow the rollers 24, 25, 27,... By pressing the rollers 24, 25, 27,. At this time, in FIG. 10, since it is a so-called caterpillar structure, it is easy to follow. The belt 26 is made of an insulating material such as synthetic resin or rubber.

  Next, FIG. 11 or FIG. 12 shows another embodiment. That is, a sliding masking member 42 is provided in the electrodeposition tank 8 instead of the movable masking member 22 shown in FIG.

  More specifically, the conductor 1 is partially masked by the sliding masking member 42 slidably contacting the outer surface 2 of the conductor 1 passing through the electrodeposition tank 8 during the electrodeposition layer adhering step. In FIG. 13, the electrodeposition layer 15 is not partially formed on the substrate 2 and the conductor exposed portion 7 is formed as shown in FIG. 13 or FIG. 15 in the subsequent baking process in the baking furnace 16, and FIG. 15 is manufactured by the method shown in FIG. The sliding masking member 42 is made of an insulating material such as synthetic resin or rubber. In FIG. 11 or FIG. 12, a single sliding masking member 42 is used, but this is divided into a plurality of pieces so that each of them can be independently advanced and retracted. By elastically pressing, the width dimension W or thickness dimension illustrated in FIGS. 1A to 1D and the like can easily follow the change in size (in the longitudinal direction) and reliably. It is also desirable to perform a masking action (not shown). In FIG. 11 or FIG. 12, the sliding masking member 42 is supported by a holding member (not shown) in the electrodeposition tank 8, and is then pressed by a resilient member. It is desirable to contact the conductor 1 with a resilient force.

  And the insulated wire 3 illustrated in FIG. 13 manufactured by the manufacturing method of FIG. 9 or FIG. 11 has one long side 20 of the rectangular cross section as the conductor exposed portion 7, but as shown in FIG. In the state of being wound in a stacked state, the conductor exposed portion 7 of the (upper) conductor 1 is in contact with the insulating layer 5 of the adjacent (lower) conductor 1, and a mutual insulation state can be ensured.

  Therefore, in response to the demand for miniaturization, high performance, and high efficiency of electrical and electronic equipment, as shown in FIG. 14, the stacked height (thickness) dimension Y can be made sufficiently smaller than before. This contributes to the compactness of electrical and electronic equipment.

  In addition, due to the above-mentioned demand for miniaturization, the thickness of the insulating layer 5 has been extremely thin in recent years, and accordingly, pinholes formed in the insulating layer 5 at the time of manufacturing cause insulation failure. There is a problem. As a countermeasure, the insulated wire 3 according to the present invention shown in FIGS. 13 and 14 is effective, and a pinhole is manufactured by increasing the thickness of the insulating layer 5 (although it is less than twice). Sometimes it is difficult to form, and it is not necessary to increase the overall thickness (height) dimension when coiled or the like to form a stack.

  Next, the insulated wire 3 illustrated in FIG. 15 manufactured by the manufacturing method of FIG. 10 or FIG. 12 has one short side 19 of the rectangular cross section as the conductor exposed portion 7, and the insulation shown in FIG. In a state (not shown) in which the electric wires 3 are rolled up and down in the left-right direction and the up-down direction (not shown), mutual insulation can be ensured, and the dimensions stacked up and down are sufficiently smaller than before. It can contribute to the downsizing of electrical and electronic equipment.

  Moreover, in FIG. 1, the code | symbol P shows 1 pitch cut | disconnected when it is used as a final product, A cutting position can be changed according to a use, or even if the pitch P is doubled or more, it is free. is there. In any case, the manufacturing method described with reference to FIGS. 4 to 7 makes it possible to easily form a contact (terminal portion) at an arbitrary (desired) position in the longitudinal direction of the insulated wire 3, and its practical use. The range of applications is vast.

  Note that the present invention is not limited to the above-described embodiment, and the design can be freely changed besides that. The cross-sectional shape of the conductor 1 is not limited to a rectangular shape (that is, a rectangular shape, a single character shape, or a square shape). It may be a shape, a hexagonal shape, etc. In addition to changes in the width dimension and thickness dimension illustrated in FIGS. 1 and 3 in the longitudinal direction, both gradient (gradient) and stepwise may be used. Even a combination of changes can be applied to various other things. (Of course, it is applicable also to the conductor 1 of the same cross-sectional shape.)

Moreover, as shown in FIG. 4, as the baking furnace 16 and the electrodeposition tank 8, in addition to the case where only one is provided, it may be preferable that two or more are provided. A conductor exposed portion forming device 17 is disposed between the electrodeposition tank 8 and the baking furnace 16 so that a predetermined portion of the conductor exposed portion 7 is not covered with the insulating layer 5. Alternatively, in FIG. 8, the case where there is one baking furnace 16 and one electrodeposition tank 8 is shown, but another baking furnace 16 and the electrodeposition tank 8 are placed in a portion indicated by a two-dot chain line 34. The movable masking member 22 or the sliding masking member 42 is provided in each electrodeposition tank 8 at that time.
It should be noted that the drying device can be freely disposed in front of the baking furnace 16.

  As described above, the insulated wire 3 according to the present invention is an electrodeposited layer before baking for forming the insulating layer 5 in the insulated wire formed by coating the conductor 1 with the insulating layer 5 electrodeposited and baked. Since it is the structure which comprises the conductor exposed part 7 formed by 15 partial non-formation or partial removal, the effort which scrapes off the insulating layer 5 after baking mechanically conventionally is saved, and it is easy. Terminals can be formed. Further, as in the prior art, the fine dust generated when mechanically scraped off is not generated at all in the present invention, which is extremely preferable because it prevents the occurrence of defects during the manufacturing process of electrical / electronic equipment and precision equipment.

  Next, in the present invention, after the electrodeposition layer adhering step of adhering and forming the electrodeposition layer 15 on the outer surface 2 of the conductor 1 while continuously passing through the electrodeposition tank 8, the electrode adhering to the outer surface 2 of the conductor 1 is formed. In the method of manufacturing an insulated wire in which the insulating layer 5 is formed on the outer surface 2 of the conductor 1 through a baking process in which the adhesion layer 15 is continuously baked, the conductor is interposed between the electrodeposition layer adhesion process and the baking process. The uncured electrodeposition layer 15 adhering to the outer surface 2 of 1 is blown off by the jet fluid H, the electrodeposition layer 15 is partially removed, and the conductor 1 is a partially exposed conductor through a baking process. Since it is a method of forming the exposed portion 7, a terminal can be formed easily and simply at a desired position in the longitudinal direction with high efficiency.

  In addition, after the electrodeposition layer adhering step of adhering and forming the electrodeposition layer 15 on the outer surface 2 of the conductor 1 while continuously passing through the electrodeposition tank 8, the electrodeposition layer 15 adhering to the outer surface 2 of the conductor 1 is continuously formed. In the method of manufacturing an insulated wire in which an insulating layer 5 is formed on the outer surface 2 of the conductor 1 through a baking step, the outer surface of the conductor 1 in the electrodeposition tank 8 during the electrodeposition layer attaching step. The conductor 1 is partially masked by the movable masking member 22 that moves in the same direction as the passing traveling direction G of the conductor 1 while contacting the conductor 2, and the electrodeposited layer 15 is not partially formed on the outer surface 2 of the conductor 1. In addition, according to the method of forming the conductor exposed portion 7 in the subsequent baking process, as shown in FIGS. 13 and 15, the conductor exposed portion 7 is only partially in the cross section and over the entire length. It is easy to form and suitable for mass production. It can be made compact in Y. Even when the width dimension or thickness dimension of the conductor 1 changes in size, the movable masking member 22 follows and moves to obtain a high-quality product.

  In addition, after the electrodeposition layer adhering step of adhering and forming the electrodeposition layer 15 on the outer surface 2 of the conductor 1 while continuously passing through the electrodeposition tank 8, the electrodeposition layer 15 adhering to the outer surface 2 of the conductor 1 is continuously formed. In the method of manufacturing an insulated wire, in which the outer surface 2 of the conductor 1 is coated with the insulating layer 5 through a baking process, the conductor being passed through the electrodeposition tank 8 during the electrodeposition layer attaching process. The conductor 1 is partially masked by the sliding masking member 42 that is in sliding contact with the outer surface 2 of the conductor 1, and the electrodeposition layer 15 is not partially formed on the outer surface 2 of the conductor 1. According to the method of forming the exposed portion 7, as shown in FIG. 13 and FIG. 15, it is easy to form the conductor exposed portion 7 only in a part in the cross section and over the entire length, It is suitable for mass production, and as a coil etc., the overall dimension Y can be reduced as shown in FIG. .

It is a top view which shows various embodiment of the insulated wire which concerns on this invention. It is a principal part expanded sectional view. It is a figure which shows other embodiment of an insulated wire, Comprising: (a) is a top view, (b) is BB expanded sectional drawing of (a), (c) is CC of (a). It is an expanded sectional view. It is a simplified structure explanatory view explaining the manufacturing method concerning the present invention. It is an outline explanatory view of the principle of electrodeposition. It is a principal part enlarged view for an effect | action description. It is a principal part enlarged view for an effect | action description. It is simplified structure explanatory drawing explaining another embodiment of the manufacturing method of this invention. It is a principal part explanatory perspective view. It is a principal part explanatory perspective view which showed other embodiment. It is a principal part explanatory perspective view which showed another embodiment. It is a principal part explanatory perspective view which showed another embodiment. It is sectional drawing which shows another embodiment of the insulated wire which concerns on this invention. It is sectional drawing for demonstrating a use condition and an effect | action. It is sectional drawing which shows another embodiment of the insulated wire which concerns on this invention.

Explanation of symbols

1 conductor 2 outer surface 3 insulated wire 5 insulating layer 7 exposed conductor 8 electrodeposition bath
12 Electrodeposition solution
15 Electrodeposition layer
16 Baking furnace
17 Conductor exposed part forming device
22 Movable masking member
42 Sliding masking member
70 Removal section
72 Electrodeposition layer non-formation part H Ejected fluid G Passing direction

Claims (4)

  In the insulated wire formed by coating the conductor (1) with the insulating layer (5) electrodeposited and baked, a partial portion of the electrodeposition layer (15) before baking for forming the insulating layer (5) An insulated wire comprising a conductor exposed portion (7) formed by non-formation or partial removal. After the electrodeposition layer adhering step of adhering and forming the electrodeposition layer (15) on the outer surface (2) of the conductor (1) while continuously passing through the electrodeposition tank (8), the outer surface (2 In the method of manufacturing an insulated wire, the electrodeposition layer (15) attached to the outer surface (2) of the conductor (1) is coated and formed on the outer surface (2) by continuous baking.
Between the electrodeposition layer adhering step and the baking step, the uncured electrodeposition layer (15) adhering to the outer surface (2) of the conductor (1) is blown away with a jet fluid (H). The electrodeposition layer (15) is partially removed, and the conductor (1) is partially exposed to form an exposed conductor exposed portion (7) through the baking step. Method. After the electrodeposition layer adhering step of adhering and forming the electrodeposition layer (15) on the outer surface (2) of the conductor (1) while continuously passing through the electrodeposition tank (8), the outer surface (2 In the method of manufacturing an insulated wire, the electrodeposition layer (15) attached to the outer surface (2) of the conductor (1) is coated and formed on the outer surface (2) by continuous baking.
During the electrodeposition layer adhering step, the movable electrode moves in the same direction as the traveling direction (G) of the conductor (1) while contacting the outer surface (2) of the conductor (1) in the electrodeposition tank (8). The masking member (22) partially masks the conductor (1) and does not partially form the electrodeposition layer (15) on the outer surface (2) of the conductor (1). A method for producing an insulated wire, comprising forming a conductor exposed portion (7). After the electrodeposition layer adhering step of adhering and forming the electrodeposition layer (15) on the outer surface (2) of the conductor (1) while continuously passing through the electrodeposition tank (8), the outer surface (2 In the method of manufacturing an insulated wire, the electrodeposition layer (15) attached to the outer surface (2) of the conductor (1) is coated and formed on the outer surface (2) by continuous baking.
During the electrodeposition layer adhering step, the conductor (1) is partially brought into contact by the sliding masking member (42) that is in sliding contact with the outer surface (2) of the conductor (1) passing through the electrodeposition tank (8). The conductor exposed portion (7) is formed in the subsequent baking step without partially forming the electrodeposition layer (15) on the outer surface (2) of the conductor (1). A method for manufacturing an insulated wire.

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