JP2008171804A - Organic light-emitting device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic light-emitting device with an enlarged area of a light-emitting region in the case of an organic light-emitting device with a similar panel area, and capable of obtaining stable element characteristics without impairing advantages of a liquid moisture-absorbing member, in other words, by narrowing a non-light emitting region, as well as its manufacturing method. <P>SOLUTION: The organic light-emitting device has a side where a drive circuit is formed and a side where the drive circuit is not formed, and each of a starting point and an ending point of application of the moisture absorbing member is placed on the side where the drive circuit is formed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an organic light emitting device having an organic light emitting element having an organic compound layer disposed between a pair of electrodes composed of an anode and a cathode, and a method for manufacturing the same.

  In general, in an organic light emitting device having an organic compound layer disposed between a pair of electrodes (hereinafter, may be abbreviated as “device”), it is known that when the water enters the device, the device does not emit light. It has been. Therefore, in order to extend the lifetime of the element, a moisture absorbing member that adsorbs water is formed in the element to suppress deterioration of the element.

  As a method of forming the hygroscopic member, there are a method of sticking a sheet-like hygroscopic member to a sealing substrate, a method of applying a high-viscosity liquid hygroscopic member to the sealing substrate, and the like.

  The sheet-like moisture absorbing member has an advantage that it is easy to produce by simply sticking it to the sealing substrate. However, even if the sheet has the narrowest width, it is about 1 mm, so the hygroscopic member cannot be arranged in a space narrower than 1 mm. Therefore, the non-light emitting region becomes wide. The area of the light emitting region of an organic light emitting device manufactured using a sheet-shaped moisture absorbing member on two substrates having the same size is compared with that of an organic light emitting device manufactured without using a sheet-shaped moisture absorbing member. An organic light emitting device using a sheet-like moisture absorbing member has a disadvantage that the area of the light emitting region becomes narrow.

  On the other hand, the method of applying the liquid moisture absorbing member can use a dispenser (drawing coating device) to form the moisture absorbing member in a narrow space of 1 mm or less, and to narrow the non-light emitting region. The area of the light-emitting region of an organic light-emitting device fabricated using a liquid moisture-absorbing member on two substrates of the same size and an organic light-emitting device fabricated using a sheet-shaped moisture absorbing member without using a liquid moisture-absorbing member Compare An organic light emitting device using a liquid moisture absorbing member has an advantage that the area of the light emitting region can be increased. However, since the liquid moisture-absorbing member has a non-constant shape, there is a disadvantage that it takes time to adjust the method for forming the moisture-absorbing member such as the discharge conditions of the dispenser.

  In addition, in the application of the hygroscopic member, it is difficult to control the shape when the shape of the hygroscopic member changes at the start of application or at the end of the application, and the start point and end point of the hygroscopic member are unstable at the time of discharge. It is. Therefore, there is a possibility that the advantage of the application type moisture absorbing member that it can be formed in a narrow space is impaired. Accordingly, a dispenser control method has been proposed in order to further stabilize the shape of the hygroscopic member at the start and end of application (see Patent Document 1).

  This is a proposal of the application method of the moisture absorption member shown in FIG.

  First, as shown in FIG. 7A, a pressure 103 of nitrogen gas is applied from the upper end portion of the dispenser 101 toward the sealing substrate 100 on the sealing substrate 100. The high-viscosity liquid moisture absorbing member 102 filled in the dispenser 101 is discharged from the tip of the needle of the dispenser 101 toward the sealing substrate 100 by the pressure 103, and the dispenser 101 is moved rightward.

  Next, as shown in FIG. 7B, the dispenser 101 is further moved to the right, and the pressure 103 applied to the dispenser 101 is removed. At this time, the discharge of the hygroscopic member 102 stops.

  In this state, as shown in FIG. 7C, the dispenser 101 is further moved to the right. Since the hygroscopic member 102 is not newly discharged from the dispenser 101, the hygroscopic member 102 applied to the sealing substrate 100 side is applied in a thin shape so as to be dragged as the dispenser 101 moves. By this method, the unstable shape at the end of the formation of the hygroscopic member is controlled.

  Another object of the organic electroluminescent panel described in Patent Document 2 is to prevent the desiccant formed on the sealing substrate from contacting with the EL element formed on the opposing EL substrate due to the deflection of the sealing substrate. It is an invention. The specification describes an example in which the desiccant is formed only in a region near the periphery of the EL substrate and is not formed in a region far from the periphery. At that time, it is shown that a driver circuit and a connection portion with the outside are formed around the display area (FIG. 1A of Patent Document 2).

Japanese Patent No. 3692534 JP 2004-6286 A

  Generally, the amount of moisture absorption increases as the amount of the moisture absorption member increases. Therefore, in order to extend the life of the element, it is effective to form more moisture absorbing members on the sealing substrate. In addition, in order to form many moisture absorbing members in a narrow space, in other words, to increase the thickness of the moisture absorbing member, the viscosity of the moisture absorbing member may be increased. However, when the viscosity becomes high, the shape of the hygroscopic member may not be stabilized at the start of application, and the width may be widened. In addition, when the dispenser is separated from the sealing substrate at the end of application, the hygroscopic member may be deformed so as to pull the thread, or the width may be widened without stabilizing the shape. When the moisture absorbing member having a wider width or the deformed moisture absorbing member is brought into contact with the organic light emitting element, defective display is caused when the moisture absorbing member is brought into contact with the organic light emitting element.

  Therefore, it is necessary to apply the moisture absorbing member to a wide space so that the moisture absorbing member does not come into contact with the light emitting portion or the seal portion even when the moisture absorbing member becomes wider or deforms. As a result, the hygroscopic member can be formed in a narrow space, and the advantage of the liquid hygroscopic member that the non-light emitting region can be narrowed is lost.

  Therefore, the present invention increases the area of the light emitting region and obtains stable element characteristics in an organic light emitting device having the same panel area without impairing the advantages of the liquid moisture absorbing member, that is, by narrowing the non-light emitting region. An organic light emitting device and a method for manufacturing the same are provided.

As means for solving the problems of the background art, the organic light-emitting device according to the present invention includes:
A substrate,
An organic light-emitting element formed on the substrate and having a first electrode, an organic compound layer, and a second electrode in order from the substrate side;
A drive circuit that is formed on at least one side of the substrate outside the region where the organic light emitting device is formed on the substrate, and controls light emission of the organic light emitting device;
A sealing substrate for sealing the organic light emitting element between the substrate and
In an organic light emitting device having a moisture absorbing member applied linearly to the outer periphery of the sealing substrate,
The organic light emitting device has a side where the drive circuit is formed and a side where the drive circuit is not formed,
The start point and the end point of application of the moisture absorbing member are both located on the side where the drive circuit is formed.

In addition, the method for manufacturing the organic light emitting device according to the present invention includes:
A substrate, an organic light emitting element and a drive circuit formed on the substrate, a sealing substrate for sealing the organic light emitting element between the substrate, and a moisture absorbing member formed on the sealing substrate And a method for manufacturing an organic light emitting device comprising:
Forming a first electrode, an organic compound layer, and a second electrode in order on the substrate to form an organic light emitting device;
Forming a driving circuit for controlling light emission of the organic light emitting element on at least one side of the substrate outside the region where the organic light emitting element is formed on the substrate;
A step of applying a hygroscopic member linearly to the outer periphery of the sealing substrate;
A step of bonding the sealing substrate to the substrate so that the start point and the end point of application of the moisture absorbing member are both located on the side where the drive circuit is formed. To do.

  The organic light emitting device and the method for manufacturing the same according to the present invention increase the area of the light emitting region in an organic light emitting device having the same panel area without impairing the advantages of the liquid moisture absorbing member, that is, by narrowing the non-light emitting region. In addition, stable device characteristics can be obtained.

  Hereinafter, an organic light-emitting device according to an embodiment of the present invention will be described in detail with reference to the drawings.

<First embodiment>
FIG. 1 shows an example of the first embodiment. FIG. 1A is a schematic plan view of an organic light emitting device, and FIG. 1B is a schematic cross-sectional view taken along the line XY in FIG. In FIG. 1, 1 is a substrate, 2 is an organic light emitting element, 3 is a sealing substrate, 4 is an adhesive, 5 is a hygroscopic member, 6 is a drive circuit, and 7 is an observation direction. 1A is a schematic plan view when FIG. 1B is viewed from the observation direction 7, but the sealing substrate 3 is not shown in order to make it easy to recognize the planar configuration.

  The organic light emitting device shown is driven on one side of the substrate to the organic light emitting element 2 in which the organic compound layer is disposed between the first electrode (not shown) and the second electrode (not shown) on the substrate 1. A voltage is applied by the circuit 6 to form an element substrate configured to emit light from the organic light emitting element 2. The drive circuit 6 is a circuit that controls the light emission of the organic light emitting element, and is formed outside the region on the substrate 1 where the organic light emitting element 2 is formed. Then, the element substrate is covered with the sealing substrate 3 on which the moisture absorbing member 5 is formed by a drawing coating apparatus.

  When the hygroscopic member 5 is formed on the sealing substrate 3 with a drawing coating apparatus, the application start point (start point) 5A and end point (end point) 5B of the hygroscopic member 5 are set at the time of discharge as described in the background section. The shape is unstable. Therefore, even if the shape of the hygroscopic member 5 changes, it needs to be formed so as to be in contact with the organic light emitting element 2, the adhesive 4, and the like and not deteriorate the light emitting characteristics. The change in the shape of the hygroscopic member 5 means, for example, that the start point 5A of the hygroscopic member 5 is thickened, the end point 5B of the hygroscopic member 5 is thickened, or is deformed so as to pull a thread.

  Therefore, in this embodiment, the start point 5A and the end point 5B of the moisture absorbing member 5 are both formed on the side where the drive circuit 6 is formed. Therefore, even if the end point 5B of the hygroscopic member 5 becomes thicker or is deformed so as to pull a thread, it does not come into contact with the organic light emitting element 2 or the adhesive 4 far away from the hygroscopic member 5, and the element characteristics are improved. There is no effect.

  In the present embodiment, the drive circuit is further formed on only one side, and the start point 5A and the end point 5B are both located on the same side. By doing in this way, the area of a non-light-emitting region can be made narrower. The area of the light emitting region of an organic light emitting device produced on two substrates of the same size with the start and end points of the moisture absorbing member both located on the same side and the organic light emitting device produced without being located on one side In comparison, the former organic light emitting device can increase the area of the light emitting region.

  On the other hand, the shape of the hygroscopic member 5 in the process of formation is stable and can be formed thinner than the start point 5A and the end point 5B of the hygroscopic member 5 when viewed from the observation direction 7. Therefore, the portions other than the start point 5A and the end point 5B of the moisture absorbing member 5 are formed in a narrow non-light-emitting region without the drive circuit 6.

  For this reason, the start point 5A and the end point 5B of the moisture absorbing member 5 that tend to be unstable and thick are both formed on the drive circuit 6 that is a relatively wide non-light emitting region. On the other hand, portions other than the start point 5A and end point 5B of the moisture absorbing member 5 that can be stably and thinly formed are formed in a relatively narrow non-light emitting region, and the moisture absorbing member 5 is formed so as to surround the light emitting region. Therefore, the non-light emitting region of the moisture absorbing member 5 does not become wide. Light emitting region of an organic light emitting device manufactured by forming the start and end points of a moisture absorbing member on a drive circuit on two substrates of the same size, and an organic light emitting device manufactured without forming a moisture absorbing member on the drive circuit In comparison, the former organic light emitting device can expand the area of the light emitting region.

  The constituent members of the organic light-emitting device are formed using usual materials.

  As the substrate 1 or the sealing substrate 3, glass, quartz, or the like can be used in addition to plastic films such as polyethylene terephthalate (PET), polycarbonate (PC), and polyethersulfone (PES).

  The sealing substrate 3 is a member that seals the organic light emitting element 2 between the substrate 1 and the sealing substrate 3. The sealing substrate 3 can be used even if it is a flat substrate in addition to the substrate in which the portion corresponding to the light emitting region is dug.

  The first electrode and the second electrode are defined in the order in which they are formed on the substrate 1. An organic compound layer is formed between the first electrode and the second electrode, and the organic compound layer emits light by passing a current between the electrodes. As materials for the first electrode and the second electrode, ITO, IZO, chromium, platinum, Al, Ag, or the like can be used. When the electrode also serves as a reflective layer, it is preferably formed of a material having high light reflectivity. Further, when the electrode is on the light extraction side, it may be a transparent electrode. In the present invention, the first electrode may be an anode and the second electrode may be a cathode, and conversely, the first electrode may be a cathode and the second electrode may be an anode.

  The organic light emitting device 2 may be a known one, for example, tris [8-hydroxyquinolinato] aluminum (Alq3), N, N′-di (1-naphthyl) -N, N′-diphenylbenzidine (α -NPD) or the like can be used. The organic light emitting device 2 can be composed of a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. In addition, a single layer of only the light emitting layer, or three layers of a hole transport layer, a light emitting layer, and an electron transport layer, or five layers of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer Can also be configured.

The moisture absorbing member 5 is a member that is applied linearly to the outer peripheral portion of the sealing substrate 3 and adsorbs moisture present in the space between the substrate 1 and the sealing substrate 3. Examples of the material of the hygroscopic member 5 include a water-absorbing polymer, zeolite, activated carbon and the like. In order to apply a hygroscopic member containing these materials and increase the thickness, the viscosity of the hygroscopic member during application is preferably 1.0 × 10 ³ cP or more and 1.0 × 10 ⁶ cP or less. This is because if the viscosity is too low, it is difficult to increase the thickness and the width becomes too wide. On the other hand, if the viscosity is too high, the coating stability is impaired, and the width may become too wide. In order to apply with a narrower width, it is preferably 1.0 × 10 ⁴ cP or more and 1.0 × 10 ⁵ cP or less.

<Second Embodiment>
FIG. 2 shows an example of the second embodiment. 2A is a schematic plan view of the organic light-emitting device, and FIG. 2B is a schematic cross-sectional view taken along the line XY of FIG. 2A. 2A is a schematic plan view when FIG. 2B is viewed from the observation direction 7, but the sealing substrate 3 is not shown in order to make it easy to recognize the planar configuration. Also, the same description as in the first embodiment is omitted.

  The organic light emitting device of this embodiment is also manufactured by the same process as in the first embodiment, but the moisture absorbing member 5 is provided only on the side where the drive circuit 6 formed on one side of the organic light emitting element 2 is formed. Formed. As a result, both the start point 5A and the end point 5B of the hygroscopic member 5 are arranged on the drive circuit 6. Therefore, even if the start point 5A and the end point 5B of the moisture absorbing member 5 are thickened, the non-light emitting region does not become wide. An organic light-emitting device fabricated on two substrates of the same size with both the start and end points of the moisture absorbing member positioned on the drive circuit, and a light-emitting region of the organic light-emitting device fabricated without being positioned on the drive circuit When the areas are compared, the former organic light emitting device can expand the area of the light emitting region. Moreover, even if the end point 5B of the hygroscopic member 5 is deformed so as to pull the thread, it does not come into contact with the organic light emitting element 2, the adhesive 4, etc., and there is no adverse effect on the element characteristics.

  Further, since the hygroscopic member 5 of the present embodiment is formed only on the drive circuit 6, the area occupied by the entire hygroscopic member 5 is narrow and the light emitting region can be widened.

<Third embodiment>
FIG. 3 shows an example of the third embodiment. 3A is a schematic plan view of the organic light-emitting device, and FIG. 3B is a schematic cross-sectional view taken along the line XY of FIG. 3A is a schematic plan view when FIG. 3B is viewed from the observation direction 7, but the sealing substrate 3 is not shown in order to make it easy to recognize the planar configuration. Also, the same description as in the first embodiment is omitted.

  The organic light emitting device of the present embodiment is also manufactured in the same process as in the first embodiment, but the drive circuit 6 formed so as to be in contact with two adjacent sides across the corner portion of the organic light emitting element 2. The hygroscopic member 5 was formed on the top. As a result, both the start point 5A and the end point 5B of the hygroscopic member 5 are arranged on the drive circuit 6. Therefore, even if the start point 5A and the end point 5B of the moisture absorbing member 5 are thickened, the non-light emitting region does not become wide. An organic light-emitting device fabricated on two substrates of the same size with both the start and end points of the moisture absorbing member positioned on the drive circuit, and a light-emitting region of the organic light-emitting device fabricated without being positioned on the drive circuit When the areas are compared, the former organic light emitting device can expand the area of the light emitting region. Moreover, even if the end point 5B of the hygroscopic member 5 is deformed so as to pull the thread, it does not come into contact with the organic light emitting element 2, the adhesive 4, etc., and there is no adverse effect on the element characteristics.

  Incidentally, in the organic light emitting device of this embodiment, the driving circuit 6 is formed up to the side edge of the substrate 1, and the flat sealing substrate 3 is formed so that the adhesive 4 is in contact with a part of the driving circuit 6. Glued.

<Fourth embodiment>
FIG. 4 shows an example of the fourth embodiment. 4A is a schematic plan view of the organic light-emitting device, and FIG. 4B is a schematic cross-sectional view taken along the line XY in FIG. 4A. 4A is a schematic plan view when FIG. 4B is viewed from the observation direction 7, the sealing substrate 3 is not shown in order to make it easy to recognize the planar configuration. Also, the same description as in the first embodiment is omitted.

  The difference between this embodiment and the first embodiment is that in FIG. 4A, the start point 5A and end point 5B of the moisture absorbing member 5 are at the corners of the sealing substrate 3, and the sealing substrate 3 is a flat member. There is a point.

  The start point 5A and end point 5B of the hygroscopic member 5 are arranged in the gap between the drive circuit 6 and the sealing substrate 3, and the start point 5A and end point 5B of the hygroscopic member 5 are thick and correspond to deformation of the hygroscopic member 5. A wide area can be secured. As a result, the start point 5A and the end point 5B of the moisture absorbing member 5 are not in contact with the organic light emitting element 2, the adhesive 4, and the like, and do not affect the element characteristics. In addition, the area occupied by the entire hygroscopic member, that is, the non-light emitting region can be reduced. As a result, the light emitting region of the organic light emitting device can be widened. An organic light-emitting device fabricated on two substrates of the same size with both the start and end points of the moisture absorbing member positioned on the drive circuit, and a light-emitting region of the organic light-emitting device fabricated without being positioned on the drive circuit When the areas are compared, the former organic light emitting device can expand the area of the light emitting region.

<Fifth embodiment>
FIG. 5 shows an example of the fifth embodiment. 5A is a schematic plan view of the organic light-emitting device, and FIG. 5B is a schematic cross-sectional view taken along the line XY of FIG. 5A. 5A is a schematic plan view when FIG. 5B is viewed from the observation direction 7, but the sealing substrate 3 is not shown in order to make it easy to recognize the planar configuration. Also, the same description as in the first embodiment is omitted.

  The difference between this embodiment and the first embodiment is that, in FIG. 5A, the start point 5A and the end point 5B of the moisture absorbing member 5 are at the corners of the sealing substrate 3, the drive circuit 6 has two sides, It is. Furthermore, a part of the drive circuit 6 is in contact with the adhesive 4, and a plurality of moisture absorbing members 5 are arranged per side of the sealing substrate 3.

  The start point 5A and end point 5B of the hygroscopic member 5 are arranged in the gap between the drive circuit 6 and the sealing substrate 3, and the start point 5A and end point 5B of the hygroscopic member 5 are thick and correspond to deformation of the hygroscopic member 5. A wide area can be secured. As a result, the start point 5A and the end point 5B of the moisture absorbing member 5 are not in contact with the organic light emitting element 2, the adhesive 4, and the like, and do not affect the element characteristics. In addition, the area occupied by the entire hygroscopic member, that is, the non-light emitting region can be reduced. As a result, the light emitting region of the organic light emitting device can be widened. An organic light-emitting device fabricated on two substrates of the same size with both the start and end points of the moisture absorbing member positioned on the drive circuit, and a light-emitting region of the organic light-emitting device fabricated without being positioned on the drive circuit When the areas are compared, the former organic light emitting device can expand the area of the light emitting region.

<Sixth embodiment>
FIG. 6 shows an example of the sixth embodiment. 6A is a schematic plan view of the organic light emitting device, and FIG. 6B is a schematic cross-sectional view taken along the line XY of FIG. 6A. In FIG. 6, 8A and 8B are electrodes, 9 is an organic compound layer, 10 is an element isolation layer, and 11 is a protective layer. 6A is a schematic plan view when FIG. 6B is viewed from the observation direction 7. In order to easily recognize the planar configuration, the sealing substrate 3, the electrode 8, and the element isolation layer are illustrated. 10 and the protective layer 11 are not shown. Also, the same description as in the first embodiment is omitted.

  In FIG. 6B, the drive circuit 6 is installed on the substrate 1, and the drive circuit 6 is connected to the first electrode 8A. A protective layer 11 is disposed on the drive circuit 6. An organic compound layer 9 is disposed in the gap between the first electrode 8A and the second electrode 8B. Further, adjacent organic light emitting elements are separated by the element isolation layer 10. The start point 5A and the end point 5B of application of the moisture absorbing member 5 are arranged in contact with the sealing substrate 3 in the gap between the drive circuit 6 and the sealing substrate 3. The sealing substrate 3 is in contact with the protective layer 11 via the adhesive 4.

  The gap between the second electrode 8B and the sealing substrate 3 is narrower than the gap where the hygroscopic member 5 is disposed. Further, if the hygroscopic member 5 is disposed on the organic light emitting element 2, it is not appropriate because it hinders light emission when viewed from the observation direction.

  For this reason, the gap between the drive circuit 6 and the sealing substrate 3 is appropriate as a wide area corresponding to the thickening of the start point 5A and the end point 5B of the moisture absorbing member 5 and the deformation of the moisture absorbing member 5 without disturbing the light emission. is there. As a result, the start point 5A and the end point 5B are not in contact with the adhesive 4, the electrode 8, the organic compound layer 9, the element isolation layer 10, the protective layer 11, and the like, and do not affect the element characteristics.

  In addition, the area occupied by the entire hygroscopic member, that is, the non-light emitting region can be reduced. As a result, the light emitting region of the organic light emitting device can be widened. An organic light-emitting device fabricated on two substrates of the same size with both the start and end points of the moisture absorbing member positioned on the drive circuit, and a light-emitting region of the organic light-emitting device fabricated without being positioned on the drive circuit When the areas are compared, the former organic light emitting device can expand the area of the light emitting region.

  Although the embodiment of the present invention has been described above, the present invention is not limited to the configuration of the embodiment. The organic light emitting device of the present invention may be a so-called bottom emission type device that extracts light from the element substrate side in addition to a so-called top emission type device that extracts light from the sealing substrate side as in the embodiment. Good. However, in the case of a top emission type apparatus, since the moisture absorbing member does not block light emission as in the above embodiment, better light emission can be obtained.

  The organic light-emitting device according to the present invention can also be applied to a display device capable of color display in which a plurality of light-emitting element groups composed of, for example, RGB three-color light-emitting elements are formed. Among the display devices, the organic light emitting device of the present invention can be used particularly as a pixel portion of an active matrix drive display device. As a display device, a television receiver, a display unit of a computer, a display unit of a mobile phone, a display unit of a personal digital assistant (PDA), a display unit of a portable music player, an electronic finder unit of an imaging device, a display unit of a car navigation system , Etc. can be preferably used.

  Next, examples and comparative examples of the described embodiment will be described.

<Example 1>
A method for manufacturing the organic light emitting device shown in FIG. 1 will be described.

  A drive circuit 6 is produced on the substrate 1 by using a sputtering apparatus, an etching apparatus, or the like, using techniques such as photolithography and wet development.

Silver is laminated with a thickness of 200 nm and indium zinc oxide (ITO) with a thickness of 0.6 nm so as to be connected to the drive circuit 6 to produce a first electrode (not shown). The first electrode is subjected to UV / ozone cleaning, and then transferred to a vacuum deposition apparatus, and the degree of vacuum is evacuated to 1 × 10 ⁻⁶ Torr.

  Then on the first electrode,

で表せる、Ｎ，Ｎ’−ジ（１−ナフチル）−Ｎ，Ｎ’−ジフェニルベンジジン（α−ＮＰＤ）を５０ｎｍの膜厚で成膜し、正孔輸送層を作製する。

N, N′-di (1-naphthyl) -N, N′-diphenylbenzidine (α-NPD) can be formed to a thickness of 50 nm to form a hole transport layer.

  Next, on the hole transport layer,

で表される、クマリン６とトリス［８−ヒドロキシキノリナート］アルミニウム（Ａｌｑ３）との共蒸着膜を３０ｎｍの膜厚で成膜し、発光層を作製する。

A co-evaporated film of coumarin 6 and tris [8-hydroxyquinolinate] aluminum (Alq3) represented by the formula is formed to a thickness of 30 nm to produce a light emitting layer.

  Next, on the light emitting layer,

で表される、フェナントロリン化合物を１０ｎｍの膜厚で成膜し、電子輸送層を作製する。

A phenanthroline compound represented by the formula is formed to a thickness of 10 nm to produce an electron transport layer.

  Furthermore, a co-evaporated film of cesium carbonate and the phenanthroline compound represented by the above <Chemical Formula 3> is formed to a thickness of 40 nm to produce an electron injection layer. The hole transport layer, the light emitting layer, the electron transport layer, and the electron injection layer are used as the organic compound layer.

  Subsequently, the substrate obtained in the above process is transported to a sputtering apparatus, and indium tin oxide (ITO) is formed to a thickness of 220 nm so as to be connected to the drive circuit 6 on the electron injection layer. As the second electrode, an organic light emitting device is manufactured.

  On the other hand, the sealing substrate 3 in which the concave portions are formed is manufactured by using a method such as etching or sandblasting.

The moisture absorbing member 5 (PT-DESICCANT No. 32 manufactured by Shinagawa Kasei Co., Ltd.) is applied onto the sealing substrate 3 using a drawing coating apparatus (SHOT MINI manufactured by Musashi Engineering Co., Ltd.). At this time, the viscosity of the hygroscopic member is 4.0 × 10 ⁴ cP. The needle has an inner diameter of 0.42 mm, the applied pressure is 0.1 MPa, the coating speed is 35 mm / second, and the distance between the needle tip and the sealing substrate 3 is 0.2 mm.

  At this time, the application is started from a position on the drive circuit 6 in the bonded state. In the course of application, the organic light emitting element 2 makes a round so that the moisture absorbing member 5 and the organic light emitting element 2 do not overlap each other when viewed from the observation direction 7. The application end point is in the vicinity of the application start point.

After the completion of coating, after passing through 120 ° C. for 30 minutes, and after a drying step at 400 ° C. for 120 minutes, it is conveyed to a vacuum deposition apparatus. An adhesive 4 (manufactured by ThreeBond Co., Ltd.) is applied on the peripheral wall portion of the sealing substrate 3 in an N ₂ atmosphere in a vacuum evaporation apparatus.

  Subsequently, the sealing substrate 3 is disposed so as to cover the organic light emitting element 2 formed on the substrate 1, the substrate 1 and the sealing substrate 3 are bonded together by the adhesive 4, and the element substrate is bonded to the sealing substrate. Cover with 3. In order to cure the adhesive 4, ultraviolet rays are irradiated at 3000 mJ using a UV lamp.

  When a voltage is applied to the drive circuit 6 of the organic light emitting device, a device having a good light emission state without light emission deterioration can be obtained. Further, even in continuous light emission, the lifetime of the element is improved because there is no defect in the bonded portion. In addition, since the area of the non-light-emitting region is small and the light-emitting region is wide, a device with good light-emitting quality can be obtained.

<Example 2>
A method for manufacturing the organic light emitting device shown in FIG. 2 will be described.

  It is produced in the same manner as in Example 1 except that the position where the moisture absorbing member 5 is applied is disposed along one side of the organic light emitting element 2.

  When a voltage is applied to the drive circuit 6 of the organic light emitting device, a device having a good light emission state without light emission deterioration can be obtained. Further, even in continuous light emission, the lifetime of the element is improved because there is no defect in the bonded portion. In addition, since the area of the non-light-emitting region is small and the light-emitting region is wide, a device with good light-emitting quality can be obtained.

<Example 3>
A method for manufacturing the organic light emitting device shown in FIG. 3 will be described.

  First, the drive circuit 6 is produced in two regions on the substrate 1, that is, two sides adjacent to each other with a corner portion of the organic light emitting element 2 to be formed later. At this time, a part of the drive circuit 6 is also disposed at a position where it contacts the adhesive 4 at the time of bonding. The subsequent process for manufacturing the element substrate is the same as that in the first embodiment.

  On the other hand, the hygroscopic member 5 is applied to the sealing substrate 3 so as to be disposed on the driving circuit 6 when the flat sealing substrate 3 is bonded to the substrate 1. The apparatus to be used and the application conditions are the same as in Example 1.

  Finally, the sealing substrate 3 is disposed so as to cover the organic light emitting element 2 formed on the substrate 1, the substrate 1 and the sealing substrate 3 are bonded together by the adhesive 4, and the element substrate is bonded to the sealing substrate. Cover with 3.

  When a voltage is applied to the drive circuit 6 of the organic light emitting device, a device having a good light emission state without light emission deterioration can be obtained. Further, even in continuous light emission, the lifetime of the element is improved because there is no defect in the bonded portion. In addition, since the area of the non-light-emitting region is small and the light-emitting region is wide, a device with good light-emitting quality can be obtained.

<Comparative Example 1>
A method for manufacturing a conventional organic light emitting device will be described.

  A different point from Example 1 is a point regarding the starting point 5A and the end point 5B of the moisture absorption member 5, and other processes are produced similarly to Example 1. FIG.

  The hygroscopic member 5 is applied on the sealing substrate 3 having the recesses. At this time, the hygroscopic member 5 is applied so that the start point 5A and the end point 5B are not arranged on the drive circuit 6 when the substrate 1 and the sealing substrate 3 are bonded together. The width of the starting point 5A of the hygroscopic member 5 increases when viewed from the observation direction 7. Further, the end point 5 </ b> B of the hygroscopic member 5 has a thread shape when the drawing coating apparatus is separated from the sealing substrate 3, and a part of the end point 5 </ b> B comes into contact with the region where the adhesive 4 is disposed.

  Thereafter, similarly to Example 1, the substrate 1 and the sealing substrate 3 are bonded together to obtain an organic light emitting device.

  When a voltage is applied to the drive circuit 6 of this organic light emitting device, when viewed from the observation direction 7, a part of the starting point 5A of the moisture absorbing member 5 overlaps with the organic light emitting element 2, resulting in a light emission defect. Further, in the light emission by continuous driving, the end point 5B of the moisture absorbing member 5 is mixed between the adhesive 4 and the substrate 1, resulting in poor sealing, and the lifetime of the element is reduced.

1 is a schematic diagram illustrating an organic light emitting device according to a first embodiment and Example 1 of the present invention. It is a schematic diagram which shows the organic light-emitting device which concerns on 2nd embodiment and Example 2 of this invention. It is a schematic diagram which shows the organic light-emitting device which concerns on 3rd embodiment and Example 3 of this invention. It is a schematic diagram which shows the organic light-emitting device which concerns on 4th embodiment of this invention. It is a schematic diagram which shows the organic light-emitting device which concerns on 5th embodiment of this invention. It is a schematic diagram which shows the organic light-emitting device which concerns on the 6th embodiment of this invention. It is a schematic diagram which shows the preparation methods of the conventional organic light-emitting device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Organic light emitting element 3 Sealing substrate 4 Adhesive 5 Hygroscopic member 5A Hygroscopic member start point 5B Hygroscopic member end point 6 Drive circuit 7 Observation direction 8 Electrode 9 Organic compound layer 10 Element separation layer 11 Protective layer 100 Substrate 101 Dispenser 102 Hygroscopic member 103 pressure

Claims (4)

A substrate,
An organic light-emitting element formed on the substrate and having a first electrode, an organic compound layer, and a second electrode in order from the substrate side;
A drive circuit that is formed on at least one side of the substrate outside the region where the organic light emitting device is formed on the substrate, and controls light emission of the organic light emitting device;
A sealing substrate for sealing the organic light emitting element between the substrate and
In an organic light emitting device having a moisture absorbing member applied linearly to the outer periphery of the sealing substrate,
The organic light emitting device has a side where the drive circuit is formed and a side where the drive circuit is not formed,
An organic light emitting device characterized in that both the start point and the end point of application of the moisture absorbing member are located on the side where the drive circuit is formed.   2. The organic light emitting device according to claim 1, wherein the drive circuit is formed only on one side, and a start point and an end point of application of the moisture absorbing member are both located on the one side. .   The organic light-emitting device according to claim 1, wherein the moisture absorbing member is formed only on a side having the driving circuit. A substrate, an organic light emitting element and a drive circuit formed on the substrate, a sealing substrate for sealing the organic light emitting element between the substrate, and a moisture absorbing member formed on the sealing substrate And a method for manufacturing an organic light emitting device comprising:
Forming a first electrode, an organic compound layer, and a second electrode in order on the substrate to form an organic light emitting device;
Forming a driving circuit for controlling light emission of the organic light emitting element on at least one side of the substrate outside the region where the organic light emitting element is formed on the substrate;
A step of applying a hygroscopic member linearly to the outer periphery of the sealing substrate;
A step of bonding the sealing substrate to the substrate so that the start point and the end point of application of the moisture absorbing member are both located on the side where the drive circuit is formed. A method for manufacturing an organic light emitting device.

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