JP2008170070A - Heating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heating device such as a reflow soldering device and the like of high heat insulating property. <P>SOLUTION: This reflow soldering device solders a printed board 6 loading electronic components by heating it in a heating chamber (preheating chamber 2, reflow chamber 3) of the furnace 1 while conveying it by a conveyor 5. The inside of the furnace 1 is surrounded by a steel plate 7, and a heat insulating layer 8 composed of a heat insulating material, a heat-proof resin sheet 9, a heat insulating layer composed of a heat insulating material, and a resin sheet 11 are successively disposed in adjacent to each other at its outer side to constitute a peripheral wall of the furnace 1. The heat insulating material of the heat insulating layers 8, 10 is composed of, for example, rock wool, glass wool and the like. The heat insulating resin sheet 9 is composed of, for example, a polyimide resin and a fluororesin. The outer resin sheet 11 is composed of, for example, a polyimide resin and a fluororesin though it does not need as much of heat resistance as that of the heat-resisting resin sheet 9 of the inside. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heating device such as a reflow soldering device, and more particularly to a heating device excellent in heat insulation.

An example of the heating device is a reflow soldering device. This reflow soldering apparatus generally has a heating chamber composed of a preheating chamber and a reflow chamber, and a cooling chamber in order along the conveying line of the conveyor. The substrate on which the electronic component is mounted is heated in the heating chamber while being conveyed by the conveyor, and the cream solder on the substrate is melted and soldered. Conventionally, in this type of apparatus, a heat insulating layer made of a heat insulating material such as rock wool or glass wool is provided on the peripheral wall of the heating chamber so that internal heat does not leak to the outside (see Patent Document 1).
Japanese Patent Laid-Open No. 7-212026

  However, there is a limit to the heat insulation of the heating chamber only by using heat insulating materials such as rock wool and glass wool. If the thickness of the heat insulating layer is increased in order to improve the heat insulation, the size of the heating chamber increases, There is a problem that causes an increase in size. Moreover, in order to compensate for the temperature drop of the heating chamber, there is a problem that the power consumption of the heater is increased and the running cost is increased.

  An object of the present invention is to provide a heating device having excellent heat insulation.

In order to solve the above problems, the present invention employs the following means. That is,
The present invention provides a heating apparatus having a heat insulating layer made of a heat insulating material on a peripheral wall of a heating chamber, and performing heat treatment in the heating chamber while conveying an object to be heated by a conveying means, and a resin sheet is disposed outside the heat insulating layer The heating apparatus is characterized in that the resin sheet forms the outer surface of the peripheral wall.

  Further, the present invention has a heat insulating layer made of a heat insulating material on the peripheral wall of the heating chamber, and in the heating device that performs the heat treatment in the heating chamber while conveying the object to be heated by the conveying means, the heat insulating layer includes a plurality of the heat insulating layers, A heating device in which a heat resistant resin sheet is inserted between the heat insulating layer and the heat insulating layer.

  Further, the present invention has a heat insulating layer made of a heat insulating material on the peripheral wall of the heating chamber, and in the heating device that performs the heat treatment in the heating chamber while conveying the object to be heated by the conveying means, the heat insulating layer includes a plurality of the heat insulating layers, In the heating device, wherein a heat-resistant resin sheet is inserted between the heat-insulating layer and the heat-insulating layer, a resin sheet is disposed outside the heat-insulating layer, and the resin sheet forms the outer surface of the peripheral wall is there.

  According to the first aspect of the present invention, since the resin sheet is disposed outside the heat insulating layer and this resin sheet forms the outer surface of the peripheral wall, in the conventional case where the peripheral wall outer surface is formed of a steel plate. Compared to this, the heat insulation is significantly improved.

  According to the second aspect of the present invention, since the heat resistant resin sheet is inserted between the heat insulating layers, the movement of air in the heat insulating layer is blocked by the heat resistant resin sheet. As a result, the heat insulating property is improved without increasing the thickness of the heat insulating layer.

  According to the third aspect of the present invention, the above-described effects are also obtained.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the reflow soldering apparatus includes a heating chamber (three preheating chambers 2 and one reflow chamber 3) and a cooling chamber 4 in a furnace 1. It has in order along. In each chamber 2, 3, 4, an inert gas, in this embodiment nitrogen gas, is supplied to prevent solder oxidation, and the printed circuit board 6 on which electronic components are mounted is placed in the furnace 1 by the conveyor 5. Be transported. The printed circuit board 6 on which electronic components are mounted has paste-like cream solder applied to the soldering locations.

  As shown in FIG. 2, the inside of the furnace 1 is surrounded by a steel plate 7, and the outside thereof is a heat insulating layer 8 made of a heat insulating material, a heat resistant resin sheet 9, a heat insulating layer 10 made of a heat insulating material, and a resin sheet. 11 are sequentially arranged adjacent to the outside to constitute the peripheral wall of the furnace 1. For example, rock wool or glass wool is used as the heat insulating material for forming the heat insulating layers 8 and 10. The heat resistant resin sheet 9 is made of, for example, polyimide resin or fluororesin. The outer resin sheet 11 is not required to be as heat resistant as the inner heat resistant resin sheet 9, but is formed of, for example, a polyimide resin or a fluororesin.

  In FIG. 1, 12 is a blower, 13 is a motor that drives the blower 12, 14 is a heater, and 15 is an air guide device. Thus, the hot air circulation device 16 is configured, and the hot air circulation device 16 is provided above and below the preheating chamber 2 and the reflow chamber 3 with the conveyor 5 interposed therebetween. In the cooling chamber 4, a cooling air circulation device 17 is provided above and below the conveyor 5. The cooling air circulation device 17 is different from the hot air circulation device 16 only in that it does not include a heater, and the other configurations are the same.

  Therefore, in the preheating chamber 2 and the reflow chamber 3, the atmospheric gas heated by the heater 14 is sucked into the blower 12 from the suction port facing the rotation axis direction of the blower 12 and is discharged in the radial direction of the blower 12. It is discharged from the outlet to the air guide device 15, guided by the air guide device 15, and blown onto the printed circuit board 6 on the conveyor 5 from a plurality of gas jet ports. The atmospheric gas blown to the printed circuit board 6 is then heated by the heater 14 through the circulation path as described above, sucked into the blower 12 and discharged from the discharge port. In this way, the atmospheric gas is circulated through the chambers 2 and 3 by the hot air circulation device 16 and the printed circuit board 6 is heated. In the cooling chamber 4, atmospheric gas as cooling air circulates in the cooling chamber 4 to cool the printed circuit board 6 on the conveyor.

  In this way, the printed circuit board 6 on which electronic components are mounted is heated to a predetermined temperature in the preheating chamber 2 while being conveyed by the conveyor 5, and then the cream solder is heated and melted in the reflow chamber 3 and melted in the cooling chamber 4. The solder is cooled and solidified, and the electronic component is soldered onto the substrate.

  In the above, the inside of the heating chamber (the preheating chamber 2 and the reflow chamber 3) is heated by the heater 14 and becomes a high temperature. This heat is transferred to the steel plate 7 constituting the inner wall of the heating chamber and further transferred to the outside. In this embodiment, the heat resistant resin sheet is interposed between the heat insulating layer 8 and the heat insulating layer 10. 9 is inserted, the heat conduction due to the movement of the air in the heat insulating layer 8 is cut off by the heat resistant resin sheet 9 and decreases, and further, the outside of the heat insulating layer 10 is not a steel plate but the resin sheet 11 is arranged. Since the outer surface of the peripheral wall is formed, the heat conduction is further reduced. In this way, a reflow soldering apparatus having an excellent heat insulation effect is provided.

  In addition, in this embodiment, although what used nitrogen gas as an atmospheric gas in a furnace was shown, atmospheric gas is not restricted to nitrogen gas. For example, air may be used.

  Further, the present invention is not limited to a soldering apparatus such as a reflow soldering apparatus but can be applied to other heating apparatuses such as a drying apparatus.

It is a front view which shows the furnace of the reflow soldering apparatus which is one Embodiment of this invention. It is a longitudinal cross-sectional view of FIG.

Explanation of symbols

  1 .... Furnace, 2 .... Preheating chamber, 3 .... Reflow chamber, 4 .... Cooling chamber, 5 .... Conveyor, 6 .... Printed circuit board with electronic parts, 7 .... Steel plate, 8 .... Heat insulation layer, 9 .... Heat-resistant resin sheet, 10 .... Heat insulation layer, 11 .... Resin sheet, 12 .... Blower, 13 .... Motor, 14 .... Heater, 15 .... Blasting device, 16 .... Hot air circulation device, 17 ..Cooling air circulation device

Claims (3)

  In a heating apparatus having a heat insulating layer made of a heat insulating material on the peripheral wall of the heating chamber and performing a heat treatment in the heating chamber while conveying an object to be heated by a conveying means, a resin sheet is disposed outside the heat insulating layer, and this resin A heating device, wherein the sheet forms the outer surface of the peripheral wall.   In a heating apparatus having a heat insulating layer made of a heat insulating material on the peripheral wall of the heating chamber, and performing heat treatment in the heating chamber while conveying the object to be heated by the conveying means, the heating apparatus includes a plurality of the heat insulating layers, A heating device, wherein a heat-resistant resin sheet is inserted therebetween.   The heating apparatus according to claim 2, wherein a resin sheet is disposed outside the heat insulating layer, and the resin sheet forms an outer surface of the peripheral wall.

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