JP2008168495A - Mold and mold apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the time for one cycle of the mold from heating to cooling and eliminate the need of a special structure of the mold. <P>SOLUTION: Water connection ducts 3 and 6 of a thickness of about 10 mm made of a material free of induction heating are arranged between molds 1 and 4 and induction heating coils 2 and 5, respectively. The arrangement enables induction heating of the molds most efficiently at the distance of about 10 mm between the molds and the induction heating coils and thus allows heating of the molds to a needed temperature in a short time. When cold water is passed through the water connection ducts, the molds can be cooled in a short time. Therefore, the time for one cycle of the molds from their heating to cooling can be reduced. Because requiring neither embedding of induction heating coils in the molds nor piercing of water connection holes in the molds, the apparatus eliminates the need of a special structure for the molds, allowing a cost reduction. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a molding die and a molding die apparatus. More specifically, the present invention can shorten the time of one molding cycle from heating to cooling of the die and reduce the cost without requiring a special die structure. The present invention relates to a molding die and a molding die apparatus that can perform the above.

2. Description of the Related Art Conventionally, a mold apparatus that heats a mold with a high-frequency induction current is known (see, for example, Patent Document 1 and Patent Document 2).
On the other hand, there is known a molding die apparatus that heats / cools a die with hot water / cold water (see, for example, Patent Document 3).
Japanese Patent Publication No. 58-40504 JP 2005-179085 A Japanese Patent No. 2738974

In the molding die apparatus that heats the mold by the high-frequency induction current, the mold can be heated to a required temperature in a short time, but cannot be cooled in a short time. Therefore, one cycle of molding from heating to cooling of the mold is performed. There was a problem that the time was long.
On the other hand, in the mold apparatus that heats / cools the mold with hot water / cold water, the mold can be cooled in a short time, but it cannot be heated to the required temperature in a short time. There is a problem that the time of one cycle of molding to reach a long time.
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a molding die and a molding die apparatus that can shorten the time of one cycle of molding from heating to cooling of the die and reduce the cost without requiring a special die structure. Is to provide.

In a first aspect, the present invention is characterized in that a water duct having a thickness of about 10 mm made of a material that cannot be induction-heated is provided between a mold and an induction heating coil for induction-heating the mold. A molding die is provided.
In the mold according to the first aspect, the distance between the mold and the induction heating coil is about 10 mm, but the mold can be induction-heated most efficiently at this distance, and the mold can be heated to the required temperature in a short time. . Furthermore, the mold can be cooled in a short time by flowing cold water through the water duct. Therefore, the time for one molding cycle from heating to cooling of the mold can be shortened. In addition, since it is not necessary to embed an induction heating coil in the mold or to form a water passage hole, a special mold structure is not required, and the cost can be reduced.

In a second aspect, the present invention provides a molding die characterized in that in the molding die according to the first aspect, water flowing through the water flow duct is in direct contact with the die.
In the molding die according to the second aspect, since the water flowing through the water flow duct is in direct contact with the die, it is necessary to have a structure that prevents water leakage, but the cooling efficiency can be improved.

In a third aspect, the present invention provides a molding die according to the first or second aspect, a high-frequency power source for energizing the induction heating coil, and a cold water temperature for cooling water flowing through the water flow duct. There is provided a molding die device characterized by comprising a conditioner.
In the molding die according to the third aspect, since the molding die according to the first or second aspect is used, it is possible to shorten the time of one cycle of molding from heating to cooling and improve productivity. I can do it.

  According to the molding die and the molding die apparatus of the present invention, the time for one cycle of molding from heating to cooling of the die can be shortened, and productivity can be improved.

  Hereinafter, the present invention will be described in more detail with reference to embodiments shown in the drawings. Note that the present invention is not limited thereby.

FIG. 1 is a partially broken front view showing a molding die apparatus 100 according to the first embodiment.
The molding die apparatus 100 includes a molding die 10, a movable drive unit 11, an IH power supply unit 12, a cold water temperature controller 13, and a control unit 14.

  The molding die 10 includes a fixed die 1 having a fixed position, an induction heating coil 2 for induction heating the fixed die 1, and induction heating provided between the fixed die 1 and the induction heating coil 2. A non-magnetic material such as heat-resistant plastic, ceramic, heat-resistant glass, stone, etc., having a thickness of about 10 mm, a movable duct 4 having a variable position, and a movable mold 4. An induction heating coil 5 for induction heating, and a water duct 6 having a thickness of about 10 mm made of a material that cannot be induction-heated and interposed between the movable die 4 and the induction heating coil 5 are provided.

A temperature sensor 7 is installed on the fixed mold 1 and the movable mold 4.
The temperature sensor 7 is connected to the control unit 14.
The induction heating coils 2 and 5 are connected to the IH power supply unit 12.
Cold water is supplied to the water flow duct 3 from a cold water temperature controller 13.

One cycle of molding is, for example, as follows.
(0) As an initial state, the movable mold 4 is open. The water ducts 3 and 6 are drained.
(1) The control unit 14 closes the movable mold 4.
(2) The control unit 14 energizes the induction heating coils 2 and 5 from the IH power source unit 12, induction-heats the fixed mold 1 and the movable mold 4 to a necessary temperature, and controls energization according to the temperature sensor 7. Maintain temperature.
(3) Molten resin is injected into the cavity between the fixed mold 1 and the movable mold 4.
(4) The control unit 14 stops energization of the induction heating coils 2 and 5, passes cold water through the water flow ducts 3 and 6 by the cold water temperature controller 13, and cools the fixed mold 1 and the movable mold 4. When the temperature sensor 7 confirms that the resin has been cooled to a temperature at which it can be stably cured, the movable mold 4 is opened and drained from the water ducts 3 and 6.
(5) When the molded product is taken out, the initial state is restored.

According to the molding die apparatus 100 and the molding die 10 of Example 1, the following effects can be obtained.
(1) Although the distance between the molds 1 and 4 and the induction heating coils 2 and 5 is about 10 mm, the molds 1 and 4 can be induction-heated most efficiently at this distance, and the molds 1 and 4 are required in a short time. Can be heated to temperature. Moreover, the molds 1 and 4 can be cooled in a short time by flowing cold water through the water flow ducts 3 and 6. Therefore, it is possible to shorten the time for one molding cycle from heating to cooling of the mold.
(2) Since the molds 1 and 4 and the induction heating coils 2 and 5 are separated from each other by about 10 mm through the water ducts 3 and 6, the heat of the molds 1 and 4 is transmitted to the induction heating coils 2 and 5 It is difficult to avoid the temperature rise of the induction heating coils 2 and 5, and the induction heating efficiency can be prevented from being lowered. Further, since the induction heating coils 2 and 5 can be cooled by flowing cold water through the water flow ducts 3 and 6, installation of a fan or the like for cooling the induction heating coils 2 and 5 becomes unnecessary, and the cost can be reduced.
(3) Since there is no need to embed an induction heating coil in the molds 1 and 4 or to make a water passage hole, a special mold structure is not required and the cost can be reduced.

FIG. 2 is a partially broken front view showing a molding die apparatus 200 according to the second embodiment.
In this molding die apparatus 200, in the molding die 20, cold water flowing through the water flow ducts 3 a and 6 a comes into direct contact with the outer surfaces 1 a and 4 a of the molds 1 and 4.
8a and 8b are packings for preventing water leakage.

  According to the molding die apparatus 200 and the molding die 20 of the second embodiment, the water flowing through the water flow ducts 3a and 6a is in direct contact with the molds 1 and 4, so that the cooling efficiency can be improved.

(A) Either one of the induction heating coil 2 and the water flow duct 3 or the induction heating coil 5 and the water flow duct 6 may be omitted.
(B) In the water flow ducts 3 and 6, the water channel may have a number of communication round holes.

  The molding die and molding die apparatus of the present invention can be used for resin or rubber molding or press molding.

It is a partially broken front view which shows the molding die apparatus which concerns on Example 1. FIG. It is a partially broken front view which shows the molding die apparatus which concerns on Example 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Fixed type 2,5 Induction heating coil 3,3a, 6,6a Water duct 4 Movable type 7 Temperature sensor 8a, 8b Packing 10,20 Molding die 11 Movable type drive part 12 IH power supply part 13 Cold water temperature controller 14 Control unit 100, 200 Molding device

Claims (3)

A molding die characterized in that a water duct having a thickness of about 10 mm made of a material that is not capable of induction heating is provided between the die and an induction heating coil for induction heating the die. The molding die according to claim 1, wherein water flowing in the water flow duct is in direct contact with the die. A molding die according to claim 1, a high-frequency power source for energizing the induction heating coil, and a cold water temperature controller for cooling water flowing through the water flow duct. Molding equipment to do.

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