JP2008153559A5 - - Google Patents
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- JP2008153559A5 JP2008153559A5 JP2006342074A JP2006342074A JP2008153559A5 JP 2008153559 A5 JP2008153559 A5 JP 2008153559A5 JP 2006342074 A JP2006342074 A JP 2006342074A JP 2006342074 A JP2006342074 A JP 2006342074A JP 2008153559 A5 JP2008153559 A5 JP 2008153559A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate surface
- fan
- circuit board
- electronic device
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (4)
前記電子機器は、前記発熱体を載置する回路基板と、該回路基板に対向配置されたファンとを有し、
前記回路基板は、該ファンの回転平面と略平行に対向配置される第１の基板面と、前記第１の基板面に対し所定の角度で傾斜された第２の基板面を有しており、
被冷却体である前記発熱体は、前記回路基板の前記第２の基板面に載置されてなり、
前記ファンは、旋回流の冷却風を前記回路基板の第１の基板面に通風し、
前記第１の基板面に通風される冷却風が、前記回路基板の第１の基板面に衝突の後、前記第２の基板面によって前記発熱体に導風されることによって前記発熱体を冷却することを特徴とした電子機器。 In an electronic device that cools a heating element with cooling air from a cooling fan,
The electronic device has a circuit board on which the heating element is placed, and a fan disposed to face the circuit board,
The circuit board has a first substrate surface that is substantially parallel to faces the rotation plane of the fan, the second substrate surface with respect to the first substrate surface is inclined at a predetermined angle ,
The heating element, which is the object to be cooled, is placed on the second substrate surface of the circuit board,
The fan blows a swirling cooling air through the first board surface of the circuit board,
Cooling air that is ventilated on the first substrate surface collides with the first substrate surface of the circuit board, and then is guided to the heating element by the second substrate surface, thereby cooling the heating element. Electronic equipment characterized by
更に、第１の基板面に延設され回動自在な折れ曲がり部を備え、該折れ曲がり部を介して前記第２の基板面が第１の基板面に対して所定の角度で傾斜されていることを特徴とした電子機器。Furthermore, it is provided with a bent portion that extends on the first substrate surface and is rotatable, and the second substrate surface is inclined at a predetermined angle with respect to the first substrate surface via the bent portion. Electronic equipment characterized by
前記回路基板の第２の基板面の傾斜角度は、発熱体の発熱温度、およびファンの通風量に応じて異なる角度で設定されることを特徴とする電子機器。 The electronic device according to claim 1,
The electronic device according to claim 1, wherein an inclination angle of the second board surface of the circuit board is set at a different angle depending on a heat generation temperature of the heat generating element and a ventilation amount of the fan.
前記回路基板の第１の基板面は、前記ファンの中心部において構成され、前記第２の基板面は前記ファンの周辺部を含んで複数個構成され、前記第２の基板面に載置する前記発熱体の複数個を前記ファンによって冷却可能としたことを特徴とする電子機器。 The electronic device according to claim 1 ,
A first board surface of the circuit board is configured at a central portion of the fan, and a plurality of second board surfaces including a peripheral portion of the fan are configured and placed on the second board surface. An electronic apparatus characterized in that a plurality of the heating elements can be cooled by the fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006342074A JP4737067B2 (en) | 2006-12-20 | 2006-12-20 | Electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006342074A JP4737067B2 (en) | 2006-12-20 | 2006-12-20 | Electronics |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008153559A JP2008153559A (en) | 2008-07-03 |
| JP2008153559A5 true JP2008153559A5 (en) | 2009-04-23 |
| JP4737067B2 JP4737067B2 (en) | 2011-07-27 |
Family
ID=39655384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006342074A Active JP4737067B2 (en) | 2006-12-20 | 2006-12-20 | Electronics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4737067B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8015830B2 (en) * | 2009-08-20 | 2011-09-13 | Hamilton Sundstrand Space Systems International, Inc. | Heat pump for high temperature environments |
| JP5702962B2 (en) * | 2010-07-20 | 2015-04-15 | 株式会社東芝 | Heat dissipation structure of electronic equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827895A (en) * | 1981-08-12 | 1983-02-18 | Hitachi Ltd | Vane type rotating apparatus |
| JPS5827895U (en) * | 1981-08-19 | 1983-02-23 | 株式会社東芝 | induction heating device |
| JPS58182296A (en) * | 1982-04-19 | 1983-10-25 | 株式会社日立製作所 | Housing structure for controller |
| JP2002290003A (en) * | 2001-03-27 | 2002-10-04 | Hitachi Ltd | Electronic equipment unit |
-
2006
- 2006-12-20 JP JP2006342074A patent/JP4737067B2/en active Active
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