JP2002290003A - Electronic equipment unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic equipment unit on which many wiring boards are mounted and which can improve working efficiency when function adding work, maintenance work, and exchanging work are performed on a device incorporated in the unit, by making a worker easily accessible to the device even when the worker performs access to the device only from the front side and can reduce the installed area and cost of the device by making the other cooling system than one cooling system unnecessary even when the device requires forced cooling. SOLUTION: On one surface of a back panel wiring board 4, a plurality of printed boards 2 housed in parallel with each other and one or several printed wiring board 3 are orthogonally arranged. The printed boards 3 are housed with an inclination θ against the back panel wiring board 4. The wiring boards 3 are packaged each having one function of mounting electronic parts 6 and, at the same time, are made to work as lands when the device is forcibly cooled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device unit, and more particularly to a printed wiring board housing structure and a cooling structure in an electronic device such as an electronic computer and an electronic communication device. The present invention relates to an electronic device unit having a high cooling efficiency and a high work efficiency even in maintenance and replacement.

[0002]

2. Description of the Related Art Conventionally, a unit of an electronic device used for a communication device or the like is generally constructed by inserting a plurality of printed wiring boards into a back panel.

[0003] With respect to a structure for mounting a conventional printed wiring board, for example, as described in Japanese Patent Application Laid-Open No. H11-31854, a back panel is used to reduce the load on the back panel and increase the transmission speed. The printed wiring board is accommodated from the front and back sides, and the front printed wiring board and the rear printed wiring board are orthogonal to each other. Also, the electrical connection between the printed wiring board and the back panel is connected by a connector, and since this connector is mounted vertically to the back panel, the printed wiring board must also be installed vertically to the back panel. become.
With such a structure, a plurality of printed wiring boards are accommodated in the back panel, and are configured as a device having one function.

[0004]

In recent years, electronic equipment such as communication equipment has been required to reduce the number of electronic parts compared to the equipment already in operation in order to increase the communication speed and to add advanced functions such as adding a communication interface. There are many cases where high integration and additional components are required. In order to meet such needs, it is necessary to add a printed wiring board on which those components are mounted while the apparatus is operating. In addition, when some of the electronic components have failed in the operating device, an operation of replacing the corresponding printed wiring board occurs. General communication equipment (especially backbone equipment) is used for a long time for the purpose of providing services such as telephone and Internet without interruption.
Because of the necessity of continuous operation, the function addition, maintenance, and replacement work as described above is usually performed while the apparatus is operating.

In carrying out this work, in the case of the above-mentioned prior art, since the printed wiring board is housed on the front and back sides of the back panel, the operator must approach from the front and back sides of the apparatus. Absent. From such a premise, it is necessary to secure a work space from the front of the apparatus to the rear of the apparatus, which restricts the arrangement conditions of the apparatus. As a result, in a place where a large number of communication devices are installed, such as a communication station building, it is apparent that the arrangement density of the devices is reduced, and there is a problem that the installation area of the devices is required extra. Also, since the printed wiring board is housed vertically to the back panel inside the device and orthogonally housed on the front and back sides, forced cooling by the cooling air of the cooling fan is performed. In such a case, since the cooling air flow paths are orthogonal to each other on the front and rear sides, independent cooling mechanisms are required on the front and rear sides. As a result, there is a problem that the cost of the device is increased and power consumption is increased.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide an electronic equipment unit on which a large number of printed wiring boards are mounted, when an operator adds, maintains, or exchanges functions of the apparatus. By providing an electronic device unit that has a structure with high work efficiency and requires only one cooling system even when forced cooling is required, so that access from only the front side is sufficient, An object of the present invention is to reduce the installation area of the apparatus and reduce the cost of the apparatus.

[0007]

In order to solve the above-mentioned problems, in an electronic equipment unit comprising a plurality of printed wiring boards mounted on a back panel, a plurality of first printed wiring boards are mounted on the back panel. Are mounted in parallel, a second printed wiring board is mounted on the back panel, and the second printed wiring board is in a positional relationship above or below the first printed wiring board, In addition, when a cross section parallel to the back panel is taken, the cutting line of the first printed wiring board and the cutting line of the second printed wiring board are orthogonal to each other.

At this time, the angle formed by the second printed wiring board and the back panel is defined as a gradient θ (90 ° ≦ 90 °) with the direction in which the first printed wiring board is mounted as a starting line direction. θ ≦ 180 °).

In some cases, the value of the gradient θ can be changed depending on the temperature of the unit.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments according to the present invention will be described below with reference to FIGS.

[Embodiment 1] A first embodiment according to the present invention will be described below with reference to FIGS. FIG.
1 is a perspective view of an electronic device unit according to a first embodiment of the present invention. FIG. 2 is a side view of the electronic device unit according to the first embodiment of the present invention. FIG. 3 is a perspective view of the electronic device unit according to the first embodiment of the present invention, and is a diagram for explaining the role of each printed wiring board. FIG.
FIG. 4 is a side view showing a state in which the back panel wiring board 4 and the printed wiring board 3 are mounted with through holes and connectors.

In the electronic equipment unit of the present invention, a plurality of printed wiring boards 2, a single printed wiring board 3, and a back panel wiring board 4 are accommodated by a shelf 1 as shown in FIG. And the printed wiring boards 2, 3
And, it has one function by being electrically, engineeringly and mechanically connected by a connector 5 mounted on the back panel wiring board 4.

A plurality of electronic components 6 are mounted on the printed wiring boards 2 and 3, each having one function by circuit connection on the printed wiring boards 2 and 3. The printed wiring boards 2 are accommodated vertically with respect to the back panel wiring board 4, and the printed wiring boards 2 are mounted neatly in parallel at a certain mounting pitch.

The printed wiring board 3 is arranged above the printed wiring board 2 and in an orthogonal relationship. That is, when viewed from the front in FIG. 1, the line of the cross section of the printed wiring board 2 and the line of the cross section of the printed wiring board 3 are orthogonal to each other.

Next, a preferred example of the function of each printed wiring board will be described.

General communication devices such as exchanges, routers, and transmission devices are roughly divided into an interface system and a control system as functions of a printed wiring board. The interface printed wiring board has a terminal function for connecting external lines such as telephone lines, Internet lines, and LAN lines, and for connecting between devices. Efficiency is better if the printed wiring board is installed in the device. On the other hand, the control printed wiring board has a function of performing switching processing and routing processing on a data signal received or sent by the interface printed wiring board, and transmitting and receiving a data signal to and from each interface printed wiring board. In such an apparatus configuration, the data signal of the interface system printed wiring board and the control system printed wiring board is wired in a bus shape, which is the most common system configuration of communication equipment.

Therefore, in the mounting configuration of the electronic device unit of the present embodiment, if the printed wiring board 2 is a printed wiring board having an interface function and the printed wiring board 3 is a printed wiring board having a control function. As shown in FIG. 3, the interface type printed wiring board 2
And the bus connection generated between the control system printed wiring boards 3
As the wiring on the back panel wiring board 4, each bus line can be easily wired at the same distance, and a complicated wiring design is not required. In addition, since wiring between the interface printed wiring board 2 and the control printed wiring board 3 can be performed in a short distance, transmission loss,
Electric characteristics such as reflection and crosstalk are improved, and high-speed electric transmission is possible between the respective printed wiring boards (between the connectors). As a result, the speed and function of the device can be increased, and as a result, the number of layers of the back panel wiring board can be reduced,
The wiring design period can be shortened, and lower device and development costs can be realized.

Further, in this electronic device unit, when the electronic parts 6 having high heat generation are mounted on the printed wiring board 2 and the printed wiring board 3, cooling is performed from the lower part of the shelf 1 as shown in FIG. Means may be considered in which external air (cooling air) is sucked by the fan 13 and the respective printed wiring boards are cooled by forced convection. In this case, the printed wiring board 3 is
From the direction in which the printed wiring board 2 of the back panel wiring board 4 is mounted as a starting line, a certain inclination θ (90 ° ≦ θ ≦ 1
80 °, however, considering convection efficiency, it is preferable that θ> 90 °. 2), the printed wiring board 3 itself serves as a lad as shown in FIG. 2, so that a rectifying effect of cooling air can be expected, and it is possible to cope with a large-capacity high-heat device. Since the structure of the electronic device unit can be used as a cooling structure and a printed wiring board having a function, it is very efficient for mounting in an apparatus. Further, the printed wiring board 3 may be mounted below, and the cooling fan 13 may flow cooling air from above.

The specific means for mounting the printed wiring board 3 and the back panel wiring board 4 at an angle is as follows. That is, the connector 5 mounted on the back panel wiring board 4 usually has connector pins inserted into through holes 7 prepared in advance on the back panel wiring board 4,
By soldering or press-fit connection, it is electrically and mechanically connected to the back panel wiring board 4. Therefore, as shown in FIG.
Is preliminarily inclined at an angle θ, the connector 5-a inserted into the through-hole 7-a is mounted at an angle θ. That is, the printed wiring board 3 connected to the connector 5-a is stored at an inclination θ with respect to the back panel wiring board 4.

On the other hand, if the through-hole 7-b into which the connector 5-b to which the printed wiring board 2 is connected is inserted is made perpendicular to the back panel wiring board 4, the printed wiring board 2 is accommodated vertically. Will be.

[Second Embodiment] A second embodiment according to the present invention will be described below with reference to FIG. FIG. 5 is a side view for accommodating the back panel wiring board 4 and the printed wiring board 3 according to the second embodiment of the present invention at an inclination θ.

In the first embodiment, a method has been described in which a through hole for mounting a printed wiring board has a slope in order to accommodate the back panel wiring board 4 and the printed wiring board 3 at a slope θ. However, the following may be performed.
That is, the back panel wiring board 4 is divided by the back panel wiring board 4-a and the back panel wiring board 4-b of the respective portions in which the printed wiring board 2 and the printed wiring board 3 are accommodated, and the connectors mounted on the respective parts. 5-c and connector 5
-D is mounted perpendicular to the back panel wiring board. Then, the flexible wiring board 8 is connected to the back panel wiring board 4-a and the back panel wiring board 4-b by soldering or connector fitting, so that the electrical connection between them is maintained. In this case, since the flexible wiring board 8 has a flexible structure, the accommodation angle of the back panel wiring board 4-a and the back panel wiring board 4-b can be set freely, and as a result, the back panel wiring board 4- The printed wiring board 3 connected to the connector a at a can be accommodated in the back panel wiring board 4-b with an inclination θ.

Third Embodiment A third embodiment according to the present invention will be described below with reference to FIGS. FIG.
It is a side view for accommodating the back panel wiring board 4 and the printed wiring board 3 of the third embodiment according to the present invention at an inclination θ. FIG. 7 is a side view for explaining convection and cooling efficiency of the printed wiring board.

In the second embodiment, the structure in which the back panel wiring board is divided into a plurality of parts and joined by a flexible wiring board has been described. However, the following application is also conceivable.

As shown in FIG. 6, the bar gear 9 is mounted on the back panel wiring board 4-a, and the back panel wiring board 4-a is mounted.
b) a geared stepping motor 10 is mounted, and the rod-shaped gear 9 and the gear of the geared stepping motor 10 are installed so as to mesh with each other.

In this way, the mechanism allows the angle θ between the back panel wiring board 4-a and the back panel wiring board 4-b.
Can be adjusted by rotation of the stepping motor 10 with gears. Also, the back panel wiring board 4-a
A temperature sensor is attached to each of the back panel wiring board 4-b and temperature information is input to a control IC 12 such as a microcomputer. Then, the control IC 12 controls the stepping motor 10 with a gear. With such a system configuration, the angle θ between the back panel wiring board 4-a and the back panel wiring board 4-b, that is, the inclination θ of the printed wiring board 3 can be controlled according to the surrounding temperature condition.

If the inclination .theta. Of the back panel wiring board 4 and the printed wiring board 3 can be adjusted according to the temperature condition as described above, there are the following advantages.

Assuming that the heat generation amount of the printed wiring board 2 is Pw1 and the heat generation amount of the printed wiring board 3 is Pw2, when the heat generation is relatively high as shown in FIG. The cooling air velocity flowing on the printed wiring board 2 is increased by increasing the cooling resistance.

Conversely, when Pw2 is large as shown in FIG. 7B, the inclination θ of the printed wiring board 3 is reduced, and
The cooling air is applied to the entire printed wiring board 3. Generally, the inclination of the printed wiring board 3 when Pw1> Pw2 is θ1, and the printed wiring board 3 when Pw1 <Pw2
Is assumed to be θ2, the relationship between θ1 and θ2 is θ1> θ
It should be 2. According to such an operation principle, the temperature of the printed wiring board is always controlled by the temperature sensor and the inclination θ of the printed wiring board 3 is controlled. Can be dynamically controlled even when the value of the changes.

Embodiment 4 Hereinafter, a fourth embodiment according to the present invention will be described with reference to FIG. FIG. 8 is a perspective view of an electronic device unit according to the fourth embodiment of the present invention.

In the first embodiment, the printed wiring board 2 is constituted by one sheet. The present embodiment is implemented by being divided into a plurality of parts as shown in FIG.

When divided into a plurality of parts, each inclination θ
Depending on the heat value of each printed wiring board and the ventilation resistance of the device,
Another advantage is that it can be changed independently.

[0033]

According to the present invention, by arranging a plurality of printed wiring board groups mounted in parallel and one or several printed wiring boards orthogonally, it is possible to increase the speed and function of the apparatus. This makes it possible to reduce the number of layers of the back panel wiring board and shorten the wiring design period.

Further, since all the printed wiring boards are housed on one side of the back panel wiring board, the working space can be reduced even when the printed wiring boards are maintained, replaced, or added with functions.

Further, according to the present invention, the printed wiring board is housed in the back panel with a certain inclination,
Since the printed wiring board can also be used as a cooling lad, the mounting efficiency in the device is improved, and a single cooling system can be used. As a result, the speed and function of the device can be increased, and the cost of the device and the development cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic device unit according to a first embodiment of the present invention.

FIG. 2 is a side view of the electronic device unit according to the first embodiment of the present invention.

FIG. 3 is a perspective view of the electronic device unit according to the first embodiment of the present invention, illustrating the role of each printed wiring board.

FIG. 4 is a side view showing a state where the back panel wiring board 4 and the printed wiring board 3 are mounted with through holes and connectors.

FIG. 5 is a side view for accommodating a back panel wiring board 4 and a printed wiring board 3 according to a second embodiment of the present invention at an inclination θ.

FIG. 6 is a side view for accommodating a back panel wiring board 4 and a printed wiring board 3 according to a third embodiment of the present invention at an inclination θ.

FIG. 7 is a side view for explaining convection and cooling efficiency of the printed wiring board.

FIG. 8 is a perspective view of an electronic device unit according to a fourth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Shelf 2 ... Printed wiring board 3 ... Printed wiring board 4 ... Back panel wiring board 5 ... Connector 6 ... Electronic components 7 ... Through hole 8 ... Flexible wiring board 9 ... Bar gear 10 ... Motor with gear 11 ... Temperature sensor 12 ... Control IC 13 ... Cooling fan

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 7/20 G06F 1/00 360B 360C 360D (72) Inventor Hidenori Morisugi Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture 216 Address F Term in Hitachi, Ltd. Communications Division 5E322 BA04 BB06 EA06 5E344 AA01 AA07 AA08 BB01 BB04 CD18 DD07 DD19 EE02 EE12 EE30 5E348 EE06 EE33 EE37 EF07 EF10 EF22

Claims (5)

[Claims] 1. An electronic device unit comprising a plurality of printed wiring boards mounted on a back panel, wherein a plurality of first printed wiring boards are mounted in parallel on the back panel, and a second printed wiring board is provided. When a board is mounted on the back panel, and the second printed wiring board is in a positional relationship above or below the first printed wiring board, and when it has a cross section parallel to the back panel An electronic device unit, wherein a cutting line of the first printed wiring board and a cutting line of the second printed wiring board are orthogonal to each other. 2. An angle between the second printed wiring board and the back panel is defined as an inclination θ (90) with a direction of the back panel on which the first printed wiring board is mounted as a starting line direction. 2. The electronic device unit according to claim 1, wherein (° ≦ θ ≦ 180 °). 3. 3. The back panel wiring board according to claim 2, wherein a through hole for inserting a connector for mounting the second printed wiring board is formed at the inclination θ. Electronic equipment unit. 4. An angle formed between the second printed wiring board and the first printed wiring board by dividing the back panel wiring board and connecting each of the divided parts by a flexible wiring board. The electronic device unit according to claim 2, wherein θ is maintained. 5. The divided back panel wiring board,
5. The electronic device unit according to claim 4, wherein a rod-shaped gear and a stepping motor with a gear are attached, and a temperature sensor and a control IC are operated to adjust the inclination θ according to a temperature state around the unit. .