JP2008149716A - Laser cutting system and cutting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser cutting system and a cutting method which are used for cutting a brittle material substrate. <P>SOLUTION: The laser cutting system comprises: a first and a second loading stages arranged facing each other and moving reciprocally along the first direction and the second direction, and being used for loading a brittle material substrate; a laser generating device which are installed between the first loading stage and the second loading stage and is used for generating a laser beam; a first and a second cooling devices which are installed in the respective sides of the laser generating device separately along the first direction and are used for injecting a cooling fluid; a first scribe which is installed in one side facing the laser generating device in the second cooling device in the first direction and is used for forming a cutting auxiliary line on the brittle material substrate; and a second scribe which is installed in one side facing the laser generating device in the first cooling device in the first direction and is used for forming a cutting auxiliary line on the brittle material substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a laser cutting system and a cutting method, and more particularly to a laser cutting system and a cutting method used for cutting a brittle material such as a glass substrate of a liquid crystal display device.

  With the development of display technology, liquid crystal display devices are widely applied in the consumption area instead of the conventional cathode ray tube display devices due to their own properties. A liquid crystal display device generally includes two glass substrates, a liquid crystal accommodated between the two glass substrates, and a plurality of circuits. The liquid crystal displays by changing the alignment state under the influence of an electric field. In order to manufacture liquid crystal display panels having different dimensions, it is necessary to satisfy the requirements for liquid crystal display panels having different dimensions by cutting large glass substrates for liquid crystal display panels.

  FIG. 1 is a schematic diagram showing the configuration of a prior art laser cutting system. The laser cutting system used for cutting a brittle material such as the glass substrate 10 includes a scribe 20, a laser generator 30, and a cooling device 40. A cutting direction for cutting the glass substrate 10 by the laser cutting system is indicated by an arrow A. When cutting the glass substrate 10 along the cutting direction A, first, a cutting auxiliary line having a predetermined depth is formed on the surface of the glass substrate 10 by the scribe 20 and immediately cut by the laser light from the laser generator 30. The glass substrate 10 is heated along the auxiliary line, and the heating area is cooled by the cooling liquid ejected from the cooling device 40. By cooling immediately after heating, the glass substrate 10 undergoes a change in stress due to an abrupt temperature difference, so that a crack generated from a cutting auxiliary line formed on the surface extends and penetrates the cross section of the substrate. As a result, the glass substrate 10 is completely separated.

  As shown in FIG. 2, when the glass substrate 10 is cut by the laser cutting system, usually, one surface of the glass substrate 10 is first cut. For example, when cutting along the cutting direction A, first, the glass substrate 10 is first cut from one edge toward the center, and thus cut to the other edge to complete the first cutting line 50. Subsequently, the second cutting line 60 is completed by returning to the starting cutting edge of the glass substrate 10. However, in the above cutting process, there are too many invalid strokes, the cutting time is too long, and the cutting speed is also slow.

  The first object of the present invention is to solve the above-mentioned problems and provide a laser cutting system having a high cutting speed.

  The second object of the present invention is to solve the above-mentioned problems and provide a laser cutting method for cutting a brittle material substrate with the laser cutting system.

  In order to achieve the first object, a laser cutting system according to the present invention is used for cutting a brittle material substrate, and includes a first loading stage, a second loading stage, a laser generator, and a first cooling device. A second cooling device, a first scribe, and a second scribe. The first stacking stage and the second stacking stage are installed opposite to each other and can reciprocate along a first direction and a second direction orthogonal to the first direction, and load a brittle material substrate. Used for that. The laser generator is installed between the first loading stage and the second loading stage, and is used for generating laser light. The first cooling device and the second cooling device are separately installed on both sides of the laser generator along the first direction, and are used for injecting a cooling fluid. The first scribe is installed on one side of the second cooling device facing the laser generator in the first direction, and is used for forming a cutting auxiliary line on the brittle material substrate. The second scribe is installed on one side of the first cooling device facing the laser generator in the first direction, and is used to form a cutting auxiliary line on the brittle material substrate.

  In order to achieve the second object, a laser cutting method according to the present invention is a method of cutting a brittle material substrate with a laser cutting system, the laser cutting system including a first loading stage and the first loading stage. A second loading stage facing the laser generator, a laser generator, a first cooling device and a second cooling device installed separately on both sides of the laser generator, and the laser generator in the second cooling device facing the laser generator A first scribe installed on one side and a second scribe installed on one side of the first cooling device facing the laser generator, wherein the laser cutting method drives the first loading stage Thus, as the first loading stage moves, the first brittle material substrate loaded on the first loading stage also moves in the first direction. A step of forming a cutting line by laser cutting the first surface of the brittle material substrate using the first scribe, the laser generator and the first cooling device. And by driving the first stacking stage, the first brittle material substrate loaded on the first stacking stage is first orthogonal to the first direction as the first stacking stage moves. The first brittleness using the step of moving along the direction and then moving along the direction opposite to the first direction, the second scribe, the laser generator and the second cooling device. Forming a cutting line by laser cutting the first surface of the material substrate; and completing the cutting of the first surface of the first brittle material substrate, The first brittle material substrate loaded on the first loading stage is moved in the first direction as the first loading stage moves by turning the one brittle material substrate over and driving the first loading stage. Cutting along the second surface opposite to the first surface of the first brittle material substrate using the first scribe, the laser generator and the first cooling device. The first brittle material substrate loaded on the first loading stage is first formed in accordance with the step of forming the cutting line by driving the first loading stage by driving the first loading stage. Moving along a second direction perpendicular to the first direction and then moving along a direction opposite to the first direction; and the second scribe; Forming a cutting line by laser cutting the second surface opposite to the first surface of the first brittle material substrate using the laser generator and the second cooling device.

  In order to achieve the second object, another laser cutting method according to the present invention is a method of cutting a brittle material substrate with a laser cutting system, the laser cutting system comprising: a first loading stage; A second loading stage facing the loading stage; a laser generator; a first cooling device and a second cooling device separately installed on both sides of the laser generator; and the laser generator in the second cooling device; A first scribe installed on the opposite side; and a second scribe installed on the one side facing the laser generator in the first cooling device; and the laser cutting method includes the first loading stage. As the first loading stage moves, the first brittle material substrate loaded on the first loading stage is also the first one. Moving along the first scribe, the second scribe, the laser generator, the first cooling device and the second cooling device, the first brittle material substrate first The second brittle material substrate loaded on the second loading stage is also moved in accordance with the step of completing laser cutting on one surface and the second loading stage moving by driving the second loading stage. The second brittle material substrate using the step of moving along one direction, the first scribe, the second scribe, the laser generator, the first cooling device and the second cooling device; Completing the laser cutting on the first surface of the first and turning the first brittle material substrate over, and driving the first loading stage, As the stage moves, the first brittle material substrate also moves along the first direction, the first scribe, the second scribe, the laser generator, the first cooling device, and Using the second cooling device to complete the laser cutting of the flipped first brittle material substrate and turning the second brittle material substrate upside down, and driving the second loading stage, The second brittle material substrate also moves along a first direction as the two loading stages move, the first scribe, the second scribe, the laser generator, and the first cooling. Using the apparatus and the second cooling device to complete laser cutting on the second brittle material substrate turned over.

  When cutting with respect to one surface of a brittle material substrate with the laser cutting system of the present invention, the trajectory of the cutting line is cut from one edge of the brittle material substrate toward the center, and thus the other edge. And then cutting again to the center from the edge where the cutting has been completed, cutting to the edge where cutting has started all the time, and repeating such cutting trajectory, cutting to one surface of the brittle material substrate The line is completed and the ineffective stroke is effectively reduced in the above-described cutting process, and the cutting speed is increased. Note that the laser cutting system can alternately cut the brittle material substrates loaded on these loading stages using the first loading stage and the second loading stage. In contrast to cutting, another brittle material substrate can be turned over or placed or lowered, thus further increasing the cutting speed. The cutting method of cutting the brittle material substrate using the laser cutting system and the laser cutting system of the present invention can increase the cutting speed.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.

  FIG. 3 is a schematic diagram showing the configuration of the laser cutting system of the present invention. The laser cutting system 100 includes a first linear track 610, a second linear track 620, a third linear track 500, a first loading stage 710, a second loading stage 720, a laser generator 300, and a first cooling. A device 410, a second cooling device 420, a first scribe 210 and a second scribe 220 are provided.

  The first linear track 610 and the second linear track 620 are parallel to each other and orthogonal to the third linear track 500. The first linear track 610 and the second linear track 620 are respectively installed on the third linear track 500 and are separately positioned at both ends of the third linear track 500. The third linear track 500 extends along the X-axis direction, and the X-axis direction includes an X1 direction and an X2 direction opposite to the X1 direction. The first linear track 610 and the second linear track 620 extend along the Y-axis direction, and the Y-axis direction includes a Y1 direction and a Y2 direction opposite to the Y1 direction. The first linear track 610 and the second linear track 620 can reciprocate along the X-axis direction on the third linear track 500, respectively.

  The first loading stage 710 is installed on the first linear track 610 and can reciprocate along the Y-axis direction on the first linear track 610. The first loading stage 710 is used for loading the brittle material substrate 101.

  The second loading stage 720 is installed on the second linear track 620 and can reciprocate along the Y-axis direction on the second linear track 620. The second loading stage 720 is used for loading the brittle material substrate 102.

  The laser generator 300 is installed between the first stacking stage 710 and the second stacking stage 720. In the present embodiment, the laser generator 300 is installed above the third linear track 500. Is done. The laser generator 300 includes a gas laser device such as a carbon dioxide laser device, a carbon monoxide laser device, a nitrogen molecular laser device, an inert gas laser device, and the like. The laser generator 300 can generate laser light, can select the wavelength of the laser light based on the material of the brittle material substrates 101 and 102, and can be made of the material of the brittle material substrates 101 and 102. If is a glass, a laser generator having a laser beam wavelength of about 10.6 μm is selected.

  The first cooling device 410 and the second cooling device 420 are separately installed on both sides facing the laser generator 300 along the X-axis direction. In the present embodiment, the first cooling device 410 and the second cooling device 420 are installed above the third linear track 500, respectively. The first cooling device 410 and the second cooling device 420 are used to cool the brittle material substrates 101 and 102 such as glass substrates by jetting a cooling fluid. The cooling fluid can be a gas, a liquid, or a mixture thereof. The gas may be air, helium gas, nitrogen gas, carbon dioxide, or a mixture thereof. The liquid may be pure water, alcohol, acetone, isopropanol, liquid nitrogen, liquid helium, cooling oil, or a mixture thereof.

  The first scribe 210 is installed on one side of the second cooling device 420 facing the laser generator 300 along the X-axis direction. The second scribe 220 is installed on one side of the first cooling device 410 facing the laser generator 300 along the X-axis direction. The first scribe 210 and the second scribe 220 are used to form cutting assist lines on the brittle material substrates 101 and 102 to be processed. The first scribe 210 and the second scribe 220 are tools capable of forming auxiliary cutting lines on the surface of a glass substrate such as a laser generator and a blade wheel.

  The laser generator 300, the first cooling device 410, the second cooling device 420, the first scribe 210, and the second scribe 220 are linearly arranged in the X-axis direction, and the lower part is laser-cut. Define a work area.

  4, 5, and 6, the laser cutting method for cutting the brittle material substrates 101 and 102 with the laser cutting system 100 according to the embodiment of the present invention includes the following steps.

  (1) Providing brittle material substrates (first brittle material substrate, second brittle material substrate) 101, 102 and separately loading them on the first loading stage 710 and the second loading stage 720 . The brittle material substrates 101 and 102 may be a glass substrate, a ceramic substrate, a quartz substrate, a silicon wafer, or the like.

  (2) As the first linear track 610 moves on the third linear track 500 by driving the first linear track 610, the first loading stage 710 also moves along the X1 direction. Then, the brittle material substrate 101 is moved to the laser cutting work area.

  (3) The first loading stage 710 is driven to move along the Y1 direction or the Y2 direction by driving the first loading stage 710, so that the first loading stage 710 is formed on the brittle material substrate 101. The position of the disconnection (cutting line) 104 is located below the first scribe 210.

  (4) By driving the first linear track 610, the first linear track 610 moves along the X2 direction, and the first scribe 210 is used to make one of the brittle material substrates 101. By cutting from one start edge along the X1 direction toward the center of the brittle material substrate 101 and thus cutting all the way to the end edge of the brittle material substrate 101, the first surface of the brittle material substrate 101 is formed. A first cutting auxiliary line (cutting auxiliary line) 103 is formed (see FIG. 5).

  (5) When the laser generator 300 generates laser light such as carbon dioxide laser light and heats the first auxiliary cutting line 103, the brittle material substrate 101 receives heat and expands, A pressure stress is generated (see FIG. 5).

  (6) The first cooling device 410 rapidly mists the cooling fluid (not shown) on the brittle material substrate 101 along the direction in which the heated first auxiliary cutting line 103 extends. (See FIG. 5).

  Due to the action of the cooling fluid, the temperature of the surface of the brittle material substrate 101 rapidly decreases, so that the brittle material substrate 101 contracts and a tensile stress is generated therein. At this time, since the brittle material substrate 101 undergoes a sudden stress change locally within a short period of time, a crack is generated along the first cutting auxiliary line 103, and the crack grows on the cut surface. A cut line 104 is formed. The first cutting line 104 extends along the X-axis direction.

  The stress generated inside the brittle material substrate 101 by the action of laser and cooling can be expressed by the following equations (1) and (2).

  σ to 0.5αEΔT (1)

  ΔT = T1-T2 Formula (2)

  σ is the magnitude of the stress generated inside the brittle material substrate 101, α is the coefficient of thermal expansion inside the brittle material substrate 101, and E is the Young ( (Young's) coefficient, where T1 is the temperature of the brittle material substrate 101 after being heated by the laser beam, and T2 is the temperature of the brittle material substrate 101 after being cooled.

  As shown in the equations (1) and (2), the magnitude of the stress inside the brittle material substrate 101 is the coefficient of thermal expansion of the brittle material, Young's modulus, and the laser generator 300 and the first cooling device 410. Is directly proportional to the temperature difference generated in the brittle material substrate 101. However, the maximum value of T1 should not be higher than the vaporization temperature of the brittle material substrate 101.

  If the stress generated in the brittle material substrate 101 by heating and cooling is greater than the burst strength of the brittle material, crack growth occurs on the surface of the brittle material substrate 101.

  (7) By forming the first cutting line 104 and then driving the first stacking stage 710, the brittle material substrate 101 moves as the first stacking stage 710 moves along the Y1 direction. The position of the second cutting line (cutting line) 104 to be formed on the lower side of the second scribe 220 is located.

  (8) By driving the first linear track 610, the first loading stage 710 moves along the X1 direction as the first linear track 610 moves on the third linear track 500. The brittle material substrate 101 also moves along the X1 direction, and the second scribe 220 moves from the edge where the first cutting auxiliary line 103 ends toward the center of the brittle material substrate 101 along the X2 direction. The second cutting auxiliary line (cutting auxiliary line) 103 is formed on the first surface of the brittle material substrate 101 by cutting and thus cutting to the edge where the first cutting auxiliary line 103 starts (FIG. 6). To see).

  (9) When the laser generator 300 generates laser light such as carbon dioxide laser light and heats the second auxiliary cutting line 103, the brittle material substrate 101 receives heat and expands, A pressure stress is generated (see FIG. 6).

  (10) The second cooling device 420 rapidly mists the cooling fluid (not shown) on the brittle material substrate 101 along the extending direction of the heated second cutting auxiliary line 103. (See FIG. 6).

  Due to the action of the cooling fluid, the temperature of the surface of the brittle material substrate 101 rapidly decreases, so that the brittle material substrate 101 contracts and a tensile stress is generated therein. At this time, since the brittle material substrate 101 undergoes a sudden stress change locally within a short time, a crack is generated along the second cutting auxiliary line 103, and the crack grows on the cut surface. Two cut lines 104 are formed. The second cutting line 104 extends along the X-axis direction.

  Steps (3) to (10) are repeated to form a cutting line 104 extending along the X-axis direction on the first surface of the brittle material substrate 101, and the process is continued until the brittle material substrate 101 is cut.

  Based on actual requirements, a cutting line 104 extending along the X-axis direction is formed on the first surface of the brittle material substrate 101, and then the first loading stage 710 is rotated 90 degrees to By repeating steps (2) to (10), a cutting line 104 extending along the Y-axis direction is formed on the first surface of the brittle material substrate 101. Therefore, after the formation of the cutting line with respect to the first surface of the brittle material substrate 101 is completed, the brittle material substrate 101 is turned over and the above steps (2) to (10) are repeated, thereby the brittle material substrate. A second surface facing the first surface of 101 is cut to form a cutting line on the second surface.

  (11) By driving the first linear track 610, the first loading stage 710 moves along the X2 direction as the first linear track 610 moves on the third linear track 500. Then, the brittle material substrate 101 also moves along the X2 direction, and the first loading stage 710 is unloaded from the laser cutting work area.

  (12) By driving the second linear track 620, the second loading stage 720 moves along the X2 direction as the second linear track 620 moves on the third linear track 500. The brittle material substrate 102 is also moved along the X2 direction, and the second loading stage 720 is moved to the laser cutting work area.

  (13) A cutting line 104 is formed on the first surface of the brittle material substrate 102. The step of forming the cutting line 104 on the first surface of the brittle material substrate 102 is substantially the same as the step of forming the cutting line 104 on the first surface of the brittle material substrate 101 and will not be described in detail here.

  (14) The cutting line 104 is formed on the first surface of the brittle material substrate 102, and the brittle material substrate 101 that has been cut on the first surface is turned over.

  (15) The second linear track 620 is moved on the third linear track 500 by driving the second linear track 620 after the cutting of the first surface of the brittle material substrate 102 is completed. Accordingly, the second loading stage 720 moves along the X1 direction, the brittle material substrate 102 also moves along the X1 direction, and the second loading stage 720 is unloaded from the laser cutting work area. By driving the first linear track 610, as the first linear track 610 moves on the third linear track 500, the first loading stage 710 moves along the X1 direction, The brittle material substrate 101 is also moved along the X1 direction, and the first loading stage 710 is moved to the laser cutting work area. Laser cutting is performed on the second surface opposite to the first surface of the brittle material substrate 101. The step of cutting the second surface of the brittle material substrate 101 is substantially the same as the step of cutting the first surface of the brittle material substrate 101, and therefore will not be described in detail here.

  (16) Cutting the second surface of the brittle material substrate 101 and turning over the brittle material substrate 102 having completed the cutting of the first surface.

  (17) The first linear track 610 is moved on the third linear track 500 by driving the first linear track 610 after the cutting of the second surface of the brittle material substrate 101 is completed. Accordingly, the first loading stage 710 moves along the X2 direction, the brittle material substrate 101 also moves along the X2 direction, and the first loading stage 710 is unloaded from the laser cutting work area. By driving the second linear track 620, the second loading stage 720 moves along the X2 direction as the second linear track 620 moves on the third linear track 500, The brittle material substrate 102 is moved to the laser cutting work area. Laser cutting is performed on the second surface of the brittle material substrate 102. The step of cutting the second surface of the brittle material substrate 102 is substantially the same as the step of cutting the first surface of the brittle material substrate 102, and will not be described in detail here.

  (18) The second surface of the brittle material substrate 102 is cut and the brittle material substrate 101 that has been cut is removed from the first loading stage 710 and then the brittle material to be cut next. The substrate is loaded on the first loading stage 710.

  In addition, when it is not necessary to cut the second surface of the brittle material substrate 101 based on actual requirements, for example, the brittle material can be obtained simply by completing the cutting of the first surface of the brittle material substrate 101. When the substrate 101 can be completely separated (Full Body Cut, FBC), the brittle material substrate 101 that has been cut is removed from the first loading stage 710 and then the next brittle material substrate to be cut. Is loaded on the first loading stage 710.

  When the above steps are repeated, the brittle material substrates 101 and 102 on the first stacking stage 710 and the second stacking stage 720 can be cut alternately, and one of the brittle materials While cutting on the material substrate, other brittle material substrates can be flipped over or placed on or lowered, thus increasing the cutting efficiency.

  According to the present invention, when the laser cutting system 100 cuts one surface of the brittle material substrate 101, 102, the trajectory of the cutting line is directed from one edge of the brittle material substrate 101, 102 to the center. And then cut all the way to the other edge, then cut from one edge that has finished cutting to the center, cut to the edge that starts cutting all the way, By repeating, a cutting line can be formed on the surface, the ineffective stroke can be effectively reduced, and the cutting speed is increased. In addition, the laser cutting system 100 can alternately cut the brittle material substrates 101 and 102 loaded thereon using the first loading stage 710 and the second loading stage 720. While cutting one brittle material substrate, the other brittle material substrate can be turned over or loaded or removed, thus further increasing the cutting speed. The laser cutting system 100 of the present invention and the cutting method for cutting a brittle material substrate using the laser cutting system 100 can increase the cutting speed.

It is the schematic which shows the structure of the laser cutting system of a prior art. It is a figure which shows one cutting state of the laser cutting system shown in FIG. It is the schematic which shows the structure of the laser cutting system which concerns on embodiment of this invention. It is a figure which shows one cutting state of the laser cutting system shown in FIG. In FIG. 4, it is a figure which shows the cutting state which forms a 1st cutting line in a 1st brittle material board | substrate. In FIG. 4, it is a figure which shows the cutting state which forms a 2nd cutting line in a 1st brittle material board | substrate.

Explanation of symbols

100 Laser cutting system 101 Brittle material substrate (first brittle material substrate)
102 Brittle material substrate (second brittle material substrate)
103 first cutting auxiliary line, second cutting auxiliary line (cutting auxiliary line)
104 1st cutting line, 2nd cutting line, cutting line 210 1st scribe 220 2nd scribe 300 Laser generator 410 1st cooling device 420 2nd cooling device 500 3rd linear track 610 1st linear track 620 2nd linear track 710 First loading stage 720 Second loading stage

Claims (15)

A laser cutting system used to cut a brittle material substrate,
A first loading stage and a second loading stage that are installed opposite to each other and can reciprocate along a first direction and a second direction orthogonal to the first direction, and are used for loading the brittle material substrate. Stage,
A laser generator installed between the first loading stage and the second loading stage and used to generate laser light;
A first cooling device and a second cooling device, which are separately installed on both sides of the laser generator along the first direction, and used for jetting a cooling fluid;
In the first direction, a first scribe that is installed on one side of the second cooling device facing the laser generator and used to form a cutting auxiliary line on the brittle material substrate;
In the first direction, a second scribe that is installed on one side of the first cooling device facing the laser generator and used to form a cutting auxiliary line on the brittle material substrate;
A laser cutting system comprising: A first linear track and a second linear track which are installed opposite to each other and extend along the second direction;
A third linear track extending along the first direction,
The first linear track and the second linear track can reciprocate along the first direction on the third linear track,
The first loading stage and the second loading stage are capable of reciprocating along the second direction separately on the first linear track and the second linear track. The laser cutting system according to claim 1.   The laser cutting system according to claim 1, wherein the laser generator includes a gas laser device.   The laser cutting system according to claim 3, wherein the gas laser device is a carbon dioxide laser device, a carbon monoxide laser device, a nitrogen molecular laser device, or an inert gas laser device.   The laser cutting system according to claim 1, wherein the cooling fluid is a gas, a liquid, or a mixture thereof.   The laser cutting system according to claim 5, wherein the gas is air, helium gas, nitrogen gas, carbon dioxide, or a mixture thereof.   6. The laser cutting system according to claim 5, wherein the liquid is pure water, alcohol, acetone, isopropanol, liquid nitrogen, liquid helium, cooling oil, or a mixture thereof.   2. The laser cutting according to claim 1, wherein the laser generator, the first cooling device, the second cooling device, the first scribe, and the second scribe are linearly arranged in the first direction. system. A first loading stage and a second loading stage which are installed opposite to each other;
A laser generator installed between the first loading stage and the second loading stage;
A first cooling device and a second cooling device installed on both sides of the laser generator;
A first scribe installed on one side of the second cooling device facing the laser generator;
A second scribe installed on one side of the first cooling device facing the laser generator;
A method of cutting a brittle material substrate with a laser cutting system comprising:
A) driving the first loading stage to move the first brittle material substrate loaded on the first loading stage along the first direction as the first loading stage moves; ,
B) forming a cutting line by laser cutting the first surface of the first brittle material substrate using the first scribe, the laser generator and the first cooling device;
C) By driving the first loading stage, the first brittle material substrate loaded on the first loading stage is first orthogonal to the first direction as the first loading stage moves. Moving along two directions and then moving along a direction opposite to the first direction;
D) using the second scribe, the laser generator and the second cooling device to form a cutting line by laser cutting the first surface of the first brittle material substrate;
E) after completing the cutting of the first surface of the first brittle material substrate, turning the first brittle material substrate over;
F) driving the first stacking stage to move the first brittle material substrate loaded on the first stacking stage along a first direction as the first stacking stage moves; ,
G) Using the first scribe, the laser generator, and the first cooling device, a cutting line is formed by laser cutting the second surface opposite to the first surface of the first brittle material substrate. Forming a step;
H) By driving the first loading stage, the first brittle material substrate loaded on the first loading stage is first moved in a second direction orthogonal to the first direction as the first loading stage moves. Moving along a direction and then moving along a direction opposite to the first direction;
I) Using the second scribe, the laser generator, and the second cooling device, a cutting line is formed by laser cutting the second surface facing the first surface of the first brittle material substrate. Forming a step;
A cutting method comprising: Step B includes
b1) Using the first scribe, cut from one starting edge of the first brittle material substrate along the first direction toward the center of the first brittle material substrate, and thus the first brittle material substrate Forming a first cutting auxiliary line on the first surface of the first brittle material substrate by cutting to the end edge of the brittle material substrate;
b2) generating laser light with the laser generator and heating the first brittle material substrate along the first auxiliary cutting line;
b3) forming a cutting line on the first brittle material substrate by spraying a cooling fluid along the first cutting auxiliary line heated by the first cooling device;
The cutting method according to claim 9, comprising: Step D includes
d1) Using the second scribe, cutting from the end edge along the direction opposite to the first direction toward the center of the first brittle material substrate, thus cutting all the way to the start edge. Forming a second cutting aid line on the first surface of the first brittle material substrate;
d2) generating a laser beam with the laser generator and heating the first brittle material substrate along the second cutting auxiliary line;
d3) forming a cutting line on the first brittle material substrate by spraying a cooling fluid along the second cutting auxiliary line heated by the second cooling device;
The cutting method according to claim 9, comprising: Before step E,
j1) When the second loading stage is moved by driving the second loading stage, the second brittle material substrate loaded on the second loading stage is moved along a direction opposite to the first direction. And steps to
j2) forming a cutting line by laser cutting the first surface of the second brittle material substrate using the second scribe, the laser generator and the second cooling device;
j3) By driving the second loading stage, the second brittle material substrate loaded on the second loading stage first moves along the second direction as the second loading stage moves. And moving along the first direction;
j4) using the first scribe, the laser generator and the first cooling device to form a cutting line by laser cutting the first surface of the second brittle material substrate;
The cutting method according to claim 9, further comprising: A first loading stage and a second loading stage which are installed opposite to each other;
A laser generator installed between the first loading stage and the second loading stage;
A first cooling device and a second cooling device installed on both sides of the laser generator;
A first scribe installed on one side of the second cooling device facing the laser generator;
A second scribe installed on one side of the first cooling device facing the laser generator;
A method of cutting a brittle material substrate with a laser cutting system comprising:
A) driving the first loading stage to move the first brittle material substrate loaded on the first loading stage along the first direction as the first loading stage moves; ,
B) Laser cutting of the first surface of the first brittle material substrate using the first scribe, the second scribe, the laser generator, the first cooling device, and the second cooling device. And the steps to complete
C) as the second loading stage moves by driving the second loading stage, the second brittle material substrate loaded on the second loading stage also moves along the first direction; ,
D) Laser cutting of the first surface of the second brittle material substrate using the first scribe, the second scribe, the laser generator, the first cooling device and the second cooling device. And turning the first brittle material substrate over;
E) driving the first loading stage to move the first brittle material substrate along the first direction as the first loading stage moves;
F) Laser cutting of the first brittle material substrate turned upside down using the first scribe, the second scribe, the laser generator, the first cooling device, and the second cooling device. Completing and turning the second brittle material substrate over;
G) driving the second stacking stage to move the second brittle material substrate along the first direction as the second stacking stage moves;
H) Laser cutting of the second brittle material substrate turned upside down using the first scribe, the second scribe, the laser generator, the first cooling device, and the second cooling device. Steps to complete,
A cutting method comprising: Step B includes
b1) Using the first scribe, cut from one starting edge of the first brittle material substrate along the first direction toward the center of the first brittle material substrate, and thus the first brittle material substrate Forming a first cutting auxiliary line on the first surface of the first brittle material substrate by cutting to the end edge of the brittle material substrate;
b2) generating laser light with the laser generator and heating the first brittle material substrate along the first auxiliary cutting line;
b3) forming a cutting line on the first brittle material substrate by spraying a cooling fluid along the first cutting auxiliary line heated by the first cooling device;
b4) moving the first brittle material substrate along a second direction orthogonal to the first direction;
b5) Using the second scribe, cutting from the end edge along the direction opposite to the first direction toward the center of the first brittle material substrate, thus cutting all the way to the start edge. A step of forming a second cutting auxiliary line on the first surface of the first brittle material substrate;
b6) generating a laser beam with the laser generator and heating the first brittle material substrate along the second cutting auxiliary line;
b7) forming a cutting line on the first brittle material substrate by spraying a cooling fluid along the second cutting auxiliary line heated by the second cooling device;
The cutting method according to claim 13, comprising: Step D includes
d1) Using the first scribe, cut from one starting edge of the second brittle material substrate along the first direction toward the center of the second brittle material substrate, and thus the second brittle material substrate Forming a first cutting aid line on the first surface of the second brittle material substrate by cutting to the end edge of the brittle material substrate;
d2) generating a laser beam with the laser generator and heating the second brittle material substrate along the first cutting auxiliary line;
d3) forming a cutting line on the second brittle material substrate by spraying a cooling fluid along the first cutting auxiliary line heated by the first cooling device;
d4) moving the second brittle material substrate along a second direction orthogonal to the first direction;
d5) Using the second scribe, cutting from the end edge along the direction opposite to the first direction toward the center of the second brittle material substrate, thus cutting all the way to the start edge. A step of forming a second cutting aid line on the first surface of the second brittle material substrate;
d6) generating a laser beam with the laser generator and heating the second brittle material substrate along the second cutting auxiliary line;
d7) forming a cutting line on the second brittle material substrate by spraying a cooling fluid along the second cutting auxiliary line heated by the second cooling device;
The cutting method according to claim 13, comprising:

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