JP2008140875A - Plasma processing apparatus, and cleaning method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus which can efficiently remove attached substances even in an area within a processing chamber that is hard to be exposed to plasma, and to provide a cleaning method therefor. <P>SOLUTION: The plasma processing apparatus is provided with a vacuum processing container 1 to process a substrate by plasma, an upper electrode 3 that is arranged above the vacuum processing container 1 and is electrically connected with a high-frequency power supply, a lower electrode 2 that is opposite to the upper electrode in the vacuum processing container 1 and is electrically connected with the high-frequency power supply, and a straightening vane 5 that is provided in an area surrounding a side face under the lower electrode 2 in the vacuum processing container 1. The straightening vane 5 is electrically connected to a first grounding part 18 by means of a first switch 28. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a plasma processing apparatus for processing a semiconductor substrate or the like using plasma and a plasma cleaning method thereof.

  A conventional plasma processing apparatus will be described by taking a plasma etching apparatus as an example. First, an etching method using a conventional plasma etching apparatus will be described below with reference to FIG. FIG. 5 is a cross-sectional view showing a conventional plasma etching apparatus.

  As shown in FIG. 5, in the etching method using the conventional plasma etching apparatus, first, the load lock chamber 90 and the vacuum processing vessel 91 are evacuated by the vacuum pumps 113 and 99, respectively, so that the vacuum state is obtained. Next, the gate valve 114 is opened, and the wafer 115 held in the load lock chamber 112 is transferred to the vacuum processing container 91. Thereafter, the wafer 115 transferred to the vacuum processing container 91 is held on the lower electrode 92 using an electrostatic chuck.

  Subsequently, the vacuum pump 99 is evacuated while introducing a predetermined etching gas from a gas introduction pipe 98 provided above the vacuum processing container 91 so that the inside of the vacuum processing container 91 has a predetermined pressure. adjust. After the pressure of the etching gas is stabilized, high-frequency power is applied between the lower electrode 92 connected to the high-frequency power supply 110 and the upper electrode 93 connected to the high-frequency power supply 111, so that the etching gas in the vacuum processing vessel 91 is changed. Turn into plasma. Here, the vacuum processing container 91 is connected to the ground 97 in order to stabilize the plasma 117 in the chamber.

  Next, plasma etching is performed on the wafer 115 held on the lower electrode 92. At this time, the plasma reacts with the wafer 115 or the material in the deposited film formed on the wafer 115, and the etching reaction proceeds. As the etching reaction proceeds, the material in the deposited film on the wafer 115 that has reacted with the etching gas becomes a reaction gas, and is exhausted out of the vacuum processing vessel 91 by the vacuum pump 99.

  Here, part of the generated species generated by the etching reaction is deposited as an adhering substance on the inner wall of the vacuum processing container 91. For example, when plasma etching is performed on an oxide film formed on the wafer 115, if an etching gas such as CF 4 (carbon tetrafluoride) is used, a fluorocarbon-based deposit is generated, and the inner wall of the vacuum processing vessel 91 and the like. There is a risk of sticking to. The method of depositing the generated deposit differs depending on the etching conditions such as the object to be etched and the type of etching gas, but as the deposit progresses, the stress increases as the deposited deposit becomes thicker. The deposits come to peel from the inner wall of the vacuum processing container 91. When the deposits are separated to generate particles and affect the wafer 115 or the like, the yield of the product is lowered. For this reason, before the deposits accumulated in the vacuum processing container 91 become particles, it is necessary to clean the inside of the vacuum processing container 91 and remove the deposits.

  Here, a cleaning method of a general plasma etching apparatus will be described. The method for cleaning the inside of the vacuum processing container 91 can be broadly divided into two types, that is, wet cleaning and plasma cleaning. The first wet cleaning is a method of removing deposits in the vacuum processing container 91 by opening the vacuum processing container 91 to the atmosphere and performing a physical and chemical cleaning process. This method is generally performed when maintenance of the plasma etching apparatus is performed. In addition, the wet cleaning can effectively remove the deposits in the vacuum processing container 91. However, in order to release the vacuum processing container 91 to the atmosphere, the inside of the vacuum processing container 91 is again performed after performing maintenance. Is required to be in a vacuum state, and it takes time to restore the plasma processing apparatus.

  On the other hand, in the second plasma cleaning, before or after the etching process, an etching gas for etching the deposits deposited in the vacuum processing container 91 is introduced, and the plasma is discharged, whereby the inside of the vacuum processing container 91 is discharged. It is a method of removing the deposits. In this method, since the deposits can be removed without opening the vacuum processing vessel 91 to the atmosphere, it is not necessary to stop the plasma etching apparatus for a long time. For this reason, plasma cleaning is often used at the actual production site of semiconductor devices.

  Next, a cleaning method using the above-described conventional plasma etching apparatus (FIG. 5) will be described. Although basically the same as the etching method using the conventional plasma etching apparatus described above, a cleaning gas having an action of removing deposits in the vacuum processing vessel 91 is used instead of the etching gas in cleaning. Is introduced into the vacuum processing vessel 91. As a specific cleaning method, a dummy wafer is mounted on the lower electrode 92 before or after the etching process, and then a cleaning gas is introduced into the vacuum processing container 91 to generate plasma. Thereafter, the deposits in the vacuum processing container 91 are removed by plasma, and the plasma discharge is completed in an appropriate time so as not to damage the members provided in the vacuum processing container 91.

  A dummy wafer used for cleaning is mounted on the lower electrode 92 for the purpose of preventing the lower electrode 92 from being etched by plasma, but the dummy wafer may not be used depending on the cleaning conditions.

Here, a method has been proposed for effectively removing the deposits deposited near the upper electrode 93 during plasma cleaning (see, for example, Patent Document 1). FIG. 6 is a cross-sectional view showing a cleaning method in a conventional plasma etching apparatus. As shown in the figure, in the conventional plasma etching apparatus, the upper electrode is composed of an upper inner peripheral electrode 101 and an upper outer peripheral electrode 102 which are insulated from each other. Thereby, when removing the deposits near the outer periphery of the upper electrode, the upper inner electrode 101 is grounded to the ground 103, and the upper outer electrode 102 is connected to the high frequency power source 106, whereby the lower electrode 107 is connected. And high frequency power is applied between the upper peripheral electrode 102 and the upper peripheral electrode 102. On the other hand, when removing the deposits on the inner peripheral portion, the upper outer peripheral electrode 102 is grounded to the ground 104, and the upper inner peripheral electrode 101 is connected to the high frequency power source 105, whereby the lower electrode 107 and the upper inner peripheral electrode are connected. High frequency power is applied between the partial electrodes 101. By the above method, plasma is generated in the upper electrode on the side to which the high frequency power is applied, and the etching reaction is efficiently performed in the vicinity of the outer peripheral portion and the inner peripheral portion of the upper electrode. When such a conventional plasma cleaning method is used, it is possible to efficiently remove the deposits deposited near the upper electrode.
JP 2003-174014 A

  However, in an actual plasma etching apparatus, it is necessary to control the flow rate in order to improve etching processing uniformity. For this reason, as shown in FIG. 6, in the conventional plasma etching apparatus, the lower electrode 107 is provided with a step difference from the gas exhaust part 109, and the flow rate of the etching gas is provided on the side surface below the lower electrode 107. A rectifying plate 108 is provided for equalizing.

  According to the above-described configuration, in the vicinity of the rectifying plate 108 surrounding the side surface below the lower electrode 107, it is away from the region where plasma is generated. Therefore, as the plasma cleaning process time in the vacuum processing container 100 becomes longer, the removal efficiency of the deposits due to the plasma decreases, and the deposits near the rectifying plate 108 provided below the lower electrode 107 are completely removed. It will not be done. As a result, the thickness of the deposit gradually increases, which causes generation of particles.

  As described above, the conventional plasma cleaning method does not consider the problem that the deposits attached to the parts provided below the upper surface of the lower electrode 107 adversely affect the wafer to be processed. A method for positively removing deposits by plasma cleaning and a processing apparatus therefor have not been sufficiently studied.

  Further, in a semiconductor device that is remarkably miniaturized, the particle size of particles generated from the vacuum processing container 100 that can be a defect of the wafer to be processed is also reduced, and the influence of minute particles of 0.2 μm or less on the wafer to be processed. It is also necessary to consider. Therefore, there is a need for a method and an apparatus for efficiently removing components provided in the vacuum processing vessel 100 and deposits accumulated on the inner wall.

  Therefore, an object of the present invention is to provide a plasma processing apparatus and a cleaning method thereof that can efficiently remove deposits even in a region that is difficult to be exposed to plasma.

  In order to solve the above problems, a plasma processing apparatus of the present invention includes a processing chamber for plasma processing a substrate, an upper electrode disposed in an upper portion of the processing chamber and electrically connected to a high frequency power source, A lower electrode facing the upper electrode in the processing chamber and electrically connected to a high-frequency power source and capable of mounting the substrate, and a rectifying plate provided in a region surrounding the side surface of the lower portion of the lower electrode in the processing chamber And a first grounding portion connected to the rectifying plate via a first switch.

  According to this configuration, since the rectifying plate is connected to the first grounding portion via the first switch, the rectifying plate can be appropriately brought into a floating state or a ground state. Thereby, for example, when cleaning the plasma processing apparatus using plasma, the plasma discharged in the processing chamber can be diffused to the vicinity of the rectifying plate by placing the rectifying plate in a floating state. As a result, the deposits can be efficiently removed by the action of the plasma even on deposits deposited on areas such as the upper surface of the current plate that are difficult to clean by the conventional method. For this reason, it can suppress that a particle mixes in a product, and can suppress the fall of the yield of a product.

  In the plasma processing apparatus of the present invention, the lower electrode may have a drive mechanism that moves up and down in the processing chamber. In this case, since the step between the upper surface of the lower electrode and the upper surface of the rectifying plate can be reduced by moving the lower electrode downward, the region near the rectifying plate is exposed to the plasma during plasma cleaning. It becomes easy and the removal efficiency of a deposit | attachment can be improved.

  A cover ring disposed above the upper electrode and provided in a region surrounding the side surface of the upper electrode in the processing chamber; and a second ring connected to the cover ring via a second switch. May be further provided. In this case, since the cover ring is connected to the second grounding portion via the second switch, the cover ring can be brought into a floating state when the plasma processing apparatus is cleaned. As a result, the plasma can be spread even in a region near the cover ring where the plasma is difficult to spread by the conventional cleaning method, and the deposits can be efficiently removed.

  The upper electrode may have a drive mechanism that moves up and down in the processing chamber, thereby moving the upper electrode upward and reducing the step between the lower surface of the upper electrode and the lower surface of the cover ring. Therefore, it is possible to further improve the removal efficiency of the deposits deposited near the cover ring.

  Next, in the cleaning method of the plasma processing apparatus of the present invention, the processing chamber, the upper electrode and the lower electrode provided opposite to each other in the processing chamber, and the side surface of the processing chamber in the lower portion of the lower electrode are surrounded. A plasma processing apparatus cleaning method comprising a rectifying plate provided in a region and a first grounding portion connected to the rectifying plate via a first switch, after the step (a), (A) adjusting the process chamber to a predetermined pressure by introducing and exhausting gas into the process chamber; turning on the first switch; and A step (b) of cleaning the processing chamber by applying high-frequency power between the upper electrode and the lower electrode to make the gas into plasma by electrically connecting a grounding portion; after b) The first switch is turned off, and the rectifying plate is brought into an electrically floating state, whereby high-frequency power is applied between the upper electrode and the lower electrode to turn the gas into plasma, and the processing chamber (C).

  According to this method, in step (c), the rectifying plate is brought into a floating state, whereby the plasma discharged into the processing chamber can be expanded to the vicinity of the rectifying plate, and the deposits deposited in the vicinity of the rectifying plate are removed. be able to. As a result, when the plasma processing apparatus cleaning method of the present invention is used, deposits can be effectively removed even in regions where plasma is not easily exposed by conventional methods, and the generation of particles due to deposits is suppressed. Can do. For this reason, it can suppress that a particle mixes in a product, and can suppress the fall of the yield of a product.

  The lower electrode has a drive mechanism that moves up and down in the processing chamber. In the step (c), the difference in height between the upper surface of the rectifying plate and the upper surface of the lower electrode is reduced. As described above, a step of moving the lower electrode below the processing chamber may be included.

  A cover ring disposed above the upper electrode and provided in a region surrounding the side surface of the upper electrode in the processing chamber; and a second ring connected to the cover ring via a second switch. A grounding portion, and in the step (b) and the step (c), the second switch is turned on to electrically connect the cover ring and the second grounding portion. The process chamber is cleaned, the first switch is turned on to electrically connect the rectifying plate and the first grounding portion, and the second switch is turned off to cover the covering. (D) further comprising a step (d) of cleaning the processing chamber by applying high-frequency power between the upper electrode and the lower electrode so that the gas is turned into plasma by bringing the gas into an electrically floating state. It may be.

  Further, the upper electrode has a drive mechanism that moves up and down in the processing chamber, and the step (d) has a small difference in height between the lower surface of the cover ring and the lower surface of the upper electrode. As such, a step of moving the upper electrode above the processing chamber may be included.

  By using the above method, the plasma can be diffused even in regions where the plasma is difficult to reach by conventional methods, such as near the current plate or the cover ring. It is possible to improve the removal efficiency of deposits.

  According to the plasma processing apparatus and the cleaning method of the present invention, the plasma is diffused to a region located below the surface of the lower electrode that is difficult to be exposed to plasma by the conventional method, or a region located above the upper electrode. be able to. For this reason, the deposits deposited in the plasma processing chamber can be efficiently removed, and the generation of particles can be suppressed, so that an effect of suppressing a decrease in product yield can be obtained.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings.

(First embodiment)
Hereinafter, a plasma processing apparatus and a cleaning method thereof according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1A is a cross-sectional view showing the configuration of the plasma processing apparatus according to the present embodiment. FIGS. 1B and 1C are cross-sectional views showing a cleaning method of the plasma processing apparatus according to the present embodiment, respectively. In this embodiment, an example of a plasma etching processing apparatus is given, but the present invention is not limited to this, and other plasma processing apparatuses such as a plasma CVD (Chemical Vapor Deposition) processing apparatus are used. Also good.

  As shown in FIG. 1A, the plasma processing apparatus of the present embodiment includes a load lock chamber 12 for holding a substrate and a vacuum processing container 1 for etching the substrate. Both are connected via a gate valve 14. In order to stabilize the plasma in the chamber, the vacuum processing vessel (processing chamber) 1 is connected to the ground 7.

  Furthermore, the plasma processing apparatus of the present embodiment is disposed at the upper part in the vacuum processing container 1 and is electrically connected to the high-frequency power source 11 and is disposed above the upper electrode 3. 1, a cover ring 6 provided in a region surrounding the side surface of the upper electrode 3, a lower electrode 2 facing the upper electrode 3, connected to the high-frequency power source 10, and capable of mounting the substrate 15; A rectifying plate 5 provided in a region surrounding the side surface of the lower portion of the lower electrode 2 in the vacuum processing container 1 is provided. Further, a gas introduction pipe 8 for introducing gas, a vacuum pump 9 for exhausting gas provided on the lower surface of the vacuum processing container 1, and a lower electrode 2 are provided on the upper part of the vacuum processing container 1. A focus ring 4 is provided in a region surrounding the side surface of the substrate 15 and fixes the substrate 15 on the lower electrode 2. The vacuum processing container 1, the upper electrode 3, the lower electrode 2, and the rectifying plate 5 are insulated from one another. The upper electrode 3 is formed with a plurality of gas holes 16 provided so that the gas introduced from the gas introduction pipe 8 is diffused throughout the interior of the vacuum processing vessel 1.

  Here, in the plasma processing apparatus of the present embodiment, the rectifying plate 5 is electrically connected to the first grounding portion 18 via the first switch 28, and the first switch is used when performing the plasma processing. By switching 28, the current plate 5 can be brought into a floating state or a grounded state.

  Next, a cleaning method using the above-described plasma processing apparatus of the present embodiment will be described with reference to FIGS.

  First, as shown in FIG. 1B, after the etching process of the substrate to be processed is completed, the substrate 15 serving as a dummy wafer is held on the lower electrode 2 using an electrostatic chuck. Next, the inside of the vacuum processing container 1 is adjusted to a predetermined pressure by exhausting from the vacuum pump 9 while introducing the cleaning gas from the gas introduction pipe 8.

  Subsequently, after the pressure in the vacuum processing container 1 is stabilized, the cleaning gas is applied by applying high-frequency power between the upper electrode 3 connected to the high-frequency power source 11 and the lower electrode 2 connected to the high-frequency power source 10. Is turned into plasma. As a result, the gas converted into plasma reacts with the deposits accumulated in the vacuum processing container 1, whereby the deposits become gas and are discharged from the vacuum pump 9 to the outside of the vacuum processing container 1. At this time, the vacuum processing container 1 is connected to the ground 7 in order to stabilize the plasma 17 in the chamber. The rectifying plate 5 is electrically connected to the first grounding portion 18 by turning on the first switch 28.

  Next, as shown in FIG. 1C, high frequency power is continuously applied between the upper electrode 3 and the lower electrode 2 to turn the cleaning gas into plasma. Here, the 1st switch 28 connected to the 1st grounding part 18 is turned off, and the rectifying plate 5 is made into a floating state. At this time, the plasma discharged in the vacuum processing vessel 1 spreads to the vicinity of the rectifying plate 5 in a floating state, so that even deposits deposited in the vicinity of the rectifying plate 5 can be removed. The reason why the plasma diffuses to the vicinity of the rectifying plate 5 is based on the principle that the plasma forms a closed circuit toward the ground plane. According to this principle, the plasma having the property of proceeding toward the ground plane (flowing current) tends to proceed by searching for a lower potential portion when the ground plane is eliminated. For this reason, in this step, the plasma 17 spreads toward the rectifying plate 5 in a floating state. By the above method, the deposits deposited in the vacuum processing container 1 can be removed using the plasma processing apparatus according to the present embodiment.

  The plasma processing apparatus cleaning method according to the present embodiment is characterized in that in the step shown in FIG. 1B, cleaning is performed in a state where the rectifying plate 5 is connected to the first grounding portion 18, while FIG. In the process shown in FIG. 2, the current plate 5 is in a floating state to perform plasma cleaning. Thereby, the plasma 17 generated in the vicinity of the central portion of the vacuum processing container 1 is diffused to the vicinity of the lower portion of the vacuum processing container 1 provided with the rectifying plate 5 based on the principle described above. As a result, the plasma also acts on the deposit near the rectifying plate 5 that remains without being removed in the step of FIG. 1B, so that the etching reaction proceeds and the deposit is removed. Is possible. Therefore, when the cleaning method of the plasma processing apparatus of the present embodiment is used, deposits are efficiently removed even in regions where the plasma is difficult to be exposed, such as the upper surface of the rectifying plate 5 that is lower than the upper surface of the lower electrode 2. It is possible to suppress the generation of particles due to the deposits. For this reason, it can suppress that a particle mixes in a product, and can suppress the fall of the yield of a product.

  In the plasma processing apparatus cleaning method of the present embodiment, the process shown in FIG. 1B is performed after the substrate to be etched. However, the present invention is not limited to this, and the substrate to be processed is etched. Before the processing, the plasma processing apparatus may be cleaned. Moreover, you may perform the process shown in FIG.1 (b), and the process shown in FIG.1 (c) reversely.

  In this embodiment, the substrate 15 serving as a dummy wafer is introduced to prevent the lower electrode 2 from being etched by plasma. However, the substrate 15 is not necessarily mounted on the lower electrode 2 depending on the etching conditions during cleaning. You don't have to.

(Second Embodiment)
Hereinafter, a plasma processing apparatus and a cleaning method thereof according to the second embodiment of the present invention will be described with reference to FIGS. FIG. 2A is a cross-sectional view showing the configuration of the plasma processing apparatus according to the present embodiment. FIGS. 2B and 2C are cross-sectional views showing a cleaning method of the plasma processing apparatus according to the present embodiment, respectively. The plasma processing apparatus of the present embodiment is different from the plasma processing apparatus of the first embodiment in the configuration of the lower electrode. Therefore, components similar to those in the first embodiment will be described in a simplified manner as appropriate.

  The plasma processing apparatus according to the present embodiment includes a vacuum processing container 1 connected to the load lock chamber 12 via a gate valve 14, an upper electrode 3 disposed in the upper portion of the vacuum processing container 1, and the upper electrode 3. Covering 6 provided in a region surrounding the side surface of upper electrode 3 in vacuum processing container 1, upper electrode 22 facing lower electrode 22 on which substrate 15 can be mounted, and vacuum processing container 1 and a current plate 5 provided in a region surrounding the side surface of the lower portion of the lower electrode 22. The upper electrode 3 and the lower electrode 22 are connected to the high frequency power supplies 11 and 10, respectively.

  In addition, the plasma processing apparatus of the present embodiment includes a gas introduction tube 8 provided at the upper part of the vacuum processing container 1, a vacuum pump 9 provided at the lower surface of the vacuum processing container 1, and the substrate 15 on the lower electrode 22. And a focus ring 4 provided in a region surrounding the side surface. A plurality of gas holes 16 are formed in the upper electrode 3. Moreover, the vacuum processing container 1, the upper electrode 3, the lower electrode 2, and the rectifying plate 5 are insulated from each other.

  Here, in the plasma processing apparatus of this embodiment, the lower electrode 22 has a drive mechanism that moves up and down in the vacuum processing chamber 1. Further, the rectifying plate 5 is electrically connected to the first grounding portion 18 via the first switch 28. When performing plasma processing, the rectifying plate 5 is switched by switching the first switch 28. It can be floating or grounded.

  Next, a cleaning method using the above-described plasma processing apparatus of the present embodiment will be described with reference to FIGS. Note that parts similar to those of the cleaning method of the first embodiment will be described in a simplified manner.

  First, as shown in FIG. 2B, the substrate 15 to be a dummy wafer is held on the lower electrode 22 after the etching process of the substrate to be processed is completed, as in the first embodiment. Next, it adjusts so that the inside of the vacuum processing container 1 may become a predetermined pressure.

  Subsequently, after the pressure in the vacuum processing container 1 is stabilized, the cleaning gas introduced from the gas introduction pipe 8 is turned into plasma by applying high-frequency power between the upper electrode 3 and the lower electrode 2. As a result, the plasmaized gas reacts with the deposits accumulated in the vacuum processing container 1, and the deposits are discharged out of the vacuum processing container 1 from the vacuum pump 9. The vacuum processing container 1 is connected to the ground 7. The rectifying plate 5 is electrically connected to the first grounding portion 18 by turning on the first switch 28.

  Next, as shown in FIG. 2C, high frequency power is continuously applied between the upper electrode 3 and the lower electrode 22 to turn the cleaning gas into plasma. Here, the lower electrode 22 having the driving mechanism is moved downward so that the difference in height between the upper surface of the lower electrode 22 and the upper surface of the rectifying plate 5 is reduced. At this time, the first switch 28 is turned off, and the rectifying plate 5 is brought into a floating state. As a result, the plasma discharged in the vacuum processing container 1 spreads to the vicinity of the rectifying plate 5 in a floating state, so that even deposits deposited in the vicinity of the rectifying plate 5 can be removed.

  The characteristic of the cleaning method of the plasma processing apparatus of the present embodiment is that, in the step shown in FIG. 2B, while the rectifying plate 5 is connected to the first grounding portion 18 and cleaning is performed, FIG. In the process shown in FIG. 2, the current plate 5 is in a floating state and the lower electrode 22 is moved downward to perform plasma cleaning. As a result, the potential of the rectifying plate 5 becomes lower, and the step between the upper surface of the rectifying plate 5 and the upper surface of the lower electrode 22 is reduced, so that the rectifying plate 5 has plasma compared to the cleaning method of the first embodiment. It becomes easy to be exposed by. As a result, when the cleaning method of the plasma processing apparatus of the present embodiment is used, it is possible to remove the deposits deposited near the rectifying plate 5 more efficiently, and the effect of suppressing the generation of particles due to the deposits can be obtained. . For this reason, it can suppress that a particle mixes in a product, and can suppress the fall of the yield of a product.

  In the cleaning method of the present embodiment, the method of driving the lower electrode 22 with the rectifying plate 5 in a floating state in the step shown in FIG. 2C is described. However, the rectifying plate 5 is connected to the first grounding portion 18. A method of driving the lower electrode 22 in an electrically connected state may be used. Even in this case, since the current plate 5 is more easily exposed to plasma than the conventional cleaning method, the deposits deposited near the current plate 5 can be sufficiently removed.

(Third embodiment)
Hereinafter, a plasma processing apparatus and a cleaning method thereof according to the third embodiment of the present invention will be described with reference to FIGS. FIG. 3A is a cross-sectional view showing the configuration of the plasma processing apparatus according to the present embodiment. 3B, 3C, and 3D are cross-sectional views showing a cleaning method for the plasma processing apparatus according to this embodiment. The plasma processing apparatus of the present embodiment is different from the plasma processing apparatus of the first embodiment in the configuration of the cover ring 6. Therefore, components similar to those in the first embodiment will be described in a simplified manner as appropriate.

  The plasma processing apparatus according to the present embodiment includes a vacuum processing container 1 connected to the load lock chamber 12 via a gate valve 14, an upper electrode 3 disposed in the upper portion of the vacuum processing container 1, and the upper electrode 3. Covering 6 provided in a region surrounding the side surface of upper electrode 3 in vacuum processing container 1, upper electrode 2 facing lower electrode 2 on which substrate 15 can be mounted, and vacuum processing container 1 and a rectifying plate 5 provided in a region surrounding the side surface of the lower portion of the lower electrode 2. The upper electrode 3 and the lower electrode 2 are connected to high frequency power supplies 11 and 10, respectively.

  Further, the plasma processing apparatus of the present embodiment includes a gas introduction tube 8 provided on the upper portion of the vacuum processing container 1, a vacuum pump 9 provided on the lower surface of the vacuum processing container 1, and a substrate 15 on the lower electrode 2. And a focus ring 4 provided in a region surrounding the side surface. A plurality of gas holes 16 are formed in the upper electrode 3. Moreover, the vacuum processing container 1, the upper electrode 3, the lower electrode 2, and the rectifying plate 5 are insulated from each other.

  Here, in the plasma processing apparatus of the present embodiment, the cover ring 6 is electrically connected to the second grounding part 19 via the second switch 29. The rectifying plate 5 is electrically connected to the first grounding portion 18 via the first switch 28. With this configuration, when plasma processing is performed, the rectifying plate 5 and the cover ring can be brought into a floating state or a ground state by switching the first switch 28 and the second switch 29, respectively.

  Next, a cleaning method using the above-described plasma processing apparatus of the present embodiment will be described with reference to FIGS. 3B, 3C, and 3D. Note that steps similar to those of the cleaning method of the first embodiment will be described in a simplified manner.

  First, as shown in FIG. 3B, the substrate 15 to be a dummy wafer is held on the lower electrode 2 after the etching process of the substrate to be processed is completed as in the first embodiment. Next, it adjusts so that the inside of the vacuum processing container 1 may become a predetermined pressure.

  Subsequently, after the pressure in the vacuum processing container 1 is stabilized, the cleaning gas introduced from the gas introduction pipe 8 is turned into plasma by applying high-frequency power between the upper electrode 3 and the lower electrode 2. As a result, the plasmaized gas reacts with the deposits accumulated in the vacuum processing container 1, and the deposits are discharged out of the vacuum processing container 1 from the vacuum pump 9. The vacuum processing container 1 is connected to the ground 7. The rectifying plate 5 and the cover ring 6 are electrically connected to the first grounding portion 18 and the second grounding portion 19 by turning on the first switch 28 and the second switch 29, respectively. .

  Next, as shown in FIG. 3C, high-frequency power is continuously applied between the upper electrode 3 and the lower electrode 2 to turn the cleaning gas into plasma. Here, the first switch 28 is turned off, and the rectifying plate 5 is brought into a floating state. As a result, the plasma 17 discharged in the vacuum processing vessel 1 spreads to the vicinity of the rectifying plate 5 in a floating state, so that even deposits deposited in the vicinity of the rectifying plate 5 can be removed.

  Next, as shown in FIG. 3D, the second switch 29 is turned off and the cover ring 6 is brought into a floating state. On the other hand, the rectifying plate 5 turns on the first switch 28 to be electrically connected to the first grounding unit 18. At this time, the plasma 17 that has spread near the current plate 5 in the above-described step (see FIG. 3C) spreads to the vicinity of the cover ring 6 that is in a lower potential state. Thereby, the deposits deposited near the cover ring 6 can be removed.

  The plasma processing apparatus cleaning method of the present embodiment is characterized in that cleaning is performed with the rectifying plate 5 in a floating state in the step shown in FIG. 3C, and the cover ring 6 is floated in the step shown in FIG. The state is to perform cleaning. According to this method, not only in the vicinity of the rectifying plate 5 at a position lower than the upper surface of the lower electrode 2 but also in the region where the plasma in the vicinity of the covering 6 positioned above the upper electrode 3 is not easily exposed. Deposits can be removed. Therefore, when the cleaning method of the plasma processing apparatus of the present embodiment is used, the plasma can be spread throughout the vacuum processing container 1, so that the deposits deposited in the vacuum processing container 1 can be more effectively removed. Can do.

  In this embodiment, instead of the lower electrode 2, the lower electrode 22 having the driving mechanism mentioned in the cleaning method of the second embodiment may be used. In this case, since the level difference between the upper surface of the lower electrode 22 and the upper surface of the rectifying plate 5 can be reduced, the rectifying plate 5 is easily exposed to plasma, and the deposits deposited near the rectifying plate 5 are more effectively removed. It can be removed.

  In the cleaning method of this embodiment, the step shown in FIG. 3C may be omitted, and only the step of cleaning the vicinity of the cover ring (see FIG. 3D) may be performed. In this case, deposits near the cover ring 6 that are difficult to remove by the conventional cleaning method can be sufficiently removed.

(Fourth embodiment)
Hereinafter, a plasma processing apparatus and a cleaning method thereof according to the fourth embodiment of the present invention will be described with reference to FIGS. FIG. 4A is a cross-sectional view showing the configuration of the plasma processing apparatus according to the present embodiment. 4B, 4C, and 4D are cross-sectional views showing a cleaning method for the plasma processing apparatus according to the present embodiment, respectively. Note that the plasma processing apparatus of the present embodiment differs from the plasma processing apparatus of the first embodiment in the configuration of the upper electrode 3 and the cover ring 6. Therefore, components similar to those in the first embodiment will be described in a simplified manner as appropriate.

  The plasma processing apparatus according to the present embodiment includes a vacuum processing container 1 connected to the load lock chamber 12 via a gate valve 14, an upper electrode 43 disposed in the upper part of the vacuum processing container 1, and the upper electrode 3. Covering 6 provided in a region surrounding the side surface of the upper electrode 43 in the vacuum processing container 1, the lower electrode 2 facing the upper electrode 43 and mounting the substrate 15, and the vacuum processing container 1 and a rectifying plate 5 provided in a region surrounding the side surface of the lower portion of the lower electrode 2. The upper electrode 43 and the lower electrode 2 are connected to the high frequency power supplies 11 and 10, respectively.

  Further, the plasma processing apparatus of the present embodiment includes a gas introduction tube 8 provided on the upper portion of the vacuum processing container 1, a vacuum pump 9 provided on the lower surface of the vacuum processing container 1, and a substrate 15 on the lower electrode 2. And a focus ring 4 provided in a region surrounding the side surface. A plurality of gas holes 16 are formed in the upper electrode 3. Moreover, the vacuum processing container 1, the upper electrode 3, the lower electrode 2, and the rectifying plate 5 are insulated from each other.

  Here, in the plasma processing apparatus of the present embodiment, the upper electrode 43 has a drive mechanism that moves up and down in the vacuum processing chamber 1. The cover ring 6 is electrically connected to the second grounding part 19 via the second switch 29, and the rectifying plate 5 is electrically connected to the first grounding part 18 via the first switch 28. It is connected to the. For this reason, when plasma processing is performed, the rectifying plate 5 and the cover ring 6 can be brought into a floating state or a grounded state by switching the first switch 28 and the second switch 29, respectively.

Next, a cleaning method using the above-described plasma processing apparatus of the present embodiment will be described with reference to FIGS. 4B, 4C, and 4D. Note that steps similar to those of the cleaning method of the first embodiment will be described in a simplified manner.

  First, as shown in FIG. 4B, the substrate 15 to be a dummy wafer is held on the lower electrode 2 after the etching process of the substrate to be processed is completed as in the first embodiment. Next, it adjusts so that the inside of the vacuum processing container 1 may become a predetermined pressure.

  Subsequently, after the pressure in the vacuum processing container 1 is stabilized, the cleaning gas introduced from the gas introduction pipe 8 is turned into plasma by applying high-frequency power between the upper electrode 43 and the lower electrode 2. As a result, the plasmaized gas reacts with the deposits accumulated in the vacuum processing container 1, and the deposits are discharged out of the vacuum processing container 1 from the vacuum pump 9. The vacuum processing container 1 is connected to the ground 7. The rectifying plate 5 and the cover ring 6 are electrically connected to the first grounding portion 18 and the second grounding portion 19 by turning on the first switch 28 and the second switch 29, respectively. .

  Next, as shown in FIG. 4C, high frequency power is continuously applied between the upper electrode 3 and the lower electrode 2 to turn the cleaning gas into plasma. Here, the first switch 28 is turned off, and the rectifying plate 5 is brought into a floating state. As a result, the plasma 17 discharged in the vacuum processing vessel 1 spreads to the vicinity of the rectifying plate 5 in a floating state, so that even deposits deposited in the vicinity of the rectifying plate 5 can be removed.

  Next, as shown in FIG. 4D, the second switch is turned off and the cover ring 6 is brought into a floating state. At this time, the upper electrode 43 having the driving mechanism is moved upward so that the step between the lower surface of the upper electrode 43 and the lower surface of the cover ring 6 is reduced. Further, the first switch 28 is turned off to bring the rectifying plate 5 into a floating state. As a result, the plasma 17 that has spread near the rectifying plate 5 in the above-described step (see FIG. 4C) spreads to the vicinity of the cover ring 6, which is in a lower potential state, and is deposited near the cover ring 6. The attached deposits can be removed.

  A characteristic of the cleaning method of the plasma processing apparatus of the present embodiment is that the cover ring 6 is in a floating state in a state where the rectifying plate 5 is connected to the first grounding portion 18 in the step shown in FIG. The plasma cleaning is performed by moving the upper electrode 43 upward. As a result, the potential of the cover ring 6 becomes lower, and the level difference between the lower surface of the cover ring 6 and the lower surface of the upper electrode 43 becomes smaller. Therefore, the cover ring 6 has plasma less than the cleaning method of the third embodiment. It becomes easy to be exposed by. As a result, when the cleaning method of the plasma processing apparatus of the present embodiment is used, it is possible to more efficiently remove the deposits deposited near the rectifying plate 5 and the cover ring 6, and further suppress the generation of particles due to the deposits. Effect is obtained. For this reason, it can suppress that a particle mixes in a product, and can suppress the fall of the yield of a product.

  In the cleaning method of this embodiment, the step shown in FIG. 4C may be omitted, and only the step of cleaning the vicinity of the cover ring 6 (see FIG. 4D) may be performed. In this case, deposits near the cover ring 6 that are difficult to remove by the conventional cleaning method can be sufficiently removed.

  The plasma processing apparatus and the cleaning method of the present invention are useful in a plasma processing apparatus that performs processing such as etching on a substrate using plasma.

(A) is sectional drawing which shows the structure of the plasma processing apparatus which concerns on the 1st Embodiment of this invention, (b) and (c) are the cleaning methods of the plasma processing apparatus which concern on 1st Embodiment. It is sectional drawing shown. (A) is sectional drawing which shows the structure of the plasma processing apparatus which concerns on the 2nd Embodiment of this invention, (b) and (c) are the cleaning methods of the plasma processing apparatus which concern on 2nd Embodiment. It is sectional drawing shown. (A) is sectional drawing which shows the structure of the plasma processing apparatus which concerns on the 3rd Embodiment of this invention, (b), (c) and (d) are the plasma processing which concerns on 3rd Embodiment. It is sectional drawing which shows the cleaning method of an apparatus. (A) is sectional drawing which shows the structure of the plasma processing apparatus which concerns on the 4th Embodiment of this invention, (b), (c) and (d) are the plasma processing which concerns on 4th Embodiment. It is sectional drawing which shows the cleaning method of an apparatus. It is sectional drawing which shows the structure of the conventional plasma etching apparatus. It is sectional drawing which shows the cleaning method of the conventional plasma etching apparatus.

Explanation of symbols

1 Vacuum processing container
2 Lower electrode
3 Upper electrode
4 Focus ring
5 Current plate
6 Covering
7 Earth
8 Gas introduction pipe
9 Vacuum pump
10, 11 High frequency power supply
12 Load lock room
14 Gate valve
15 substrate
16 Gas hole
17 Plasma
18 First grounding section
19 Second grounding section
22 Lower electrode
28 First switch
29 Second switch
43 Upper electrode
90 Load lock room
91 Vacuum processing container
92 Lower electrode
93 Upper electrode
97 Earth
98 Gas introduction pipe
99 vacuum pump
100 Vacuum processing container
101 Upper inner peripheral electrode
102 Upper perimeter electrode
103, 104 Earth
105, 106 high frequency power supply
107 Lower electrode
108 Current plate
109 Exhaust section
110, 111 high frequency power supply
112 Load lock room
113 Vacuum pump
114 Gate valve
115 wafers
117 Plasma

Claims (12)

A processing chamber for plasma processing the substrate; an upper electrode disposed in an upper portion of the processing chamber and electrically connected to a high-frequency power source;
A lower electrode facing the upper electrode in the processing chamber, electrically connected to a high frequency power source, and capable of mounting the substrate;
A rectifying plate provided in a region surrounding the side surface of the lower electrode in the processing chamber;
A plasma processing apparatus, comprising: a first grounding portion connectable to the rectifying plate via a first switch.   The plasma processing apparatus according to claim 1, wherein the lower electrode has a drive mechanism that moves up and down in the processing chamber. A cover ring disposed above the upper electrode and provided in a region surrounding the side surface of the upper electrode in the processing chamber;
The plasma processing apparatus according to claim 1, further comprising: a second grounding unit connectable to the cover ring via a second switch.   The plasma processing apparatus according to claim 1, wherein the upper electrode has a drive mechanism that moves up and down in the processing chamber. A processing chamber for plasma processing the substrate;
An upper electrode disposed in an upper portion of the processing chamber and electrically connected to a high-frequency power source;
A lower electrode facing the upper electrode in the processing chamber, electrically connected to a high frequency power source, and capable of mounting the substrate;
A rectifying plate provided in a region surrounding the side surface at the lower portion of the lower electrode in the processing chamber,
The plasma processing apparatus, wherein the lower electrode has a drive mechanism that moves up and down in the processing chamber. A processing chamber for plasma processing the substrate;
An upper electrode disposed in an upper portion of the processing chamber and electrically connected to a high-frequency power source;
A lower electrode facing the upper electrode in the processing chamber, electrically connected to a high frequency power source, and capable of mounting the substrate;
A rectifying plate provided in a region surrounding the side surface of the lower electrode in the processing chamber;
A cover ring disposed above the upper electrode and provided in a region surrounding the side surface of the upper electrode in the processing chamber;
A plasma processing apparatus comprising: a grounding part connectable to the cover ring via a switch. A processing chamber for plasma processing the substrate;
An upper electrode disposed in an upper portion of the processing chamber and electrically connected to a high-frequency power source;
A lower electrode facing the upper electrode in the processing chamber, electrically connected to a high frequency power source, and capable of mounting the substrate;
A rectifying plate provided in a region surrounding the side surface at the lower portion of the lower electrode in the processing chamber,
The plasma processing apparatus having a drive mechanism in which the upper electrode moves up and down in the processing chamber. A processing chamber; an upper electrode and a lower electrode provided opposite to each other in the processing chamber; a rectifying plate provided in a region surrounding the side surface of the lower portion of the lower electrode in the processing chamber; A cleaning method for a plasma processing apparatus comprising a first grounding portion connected via a switch,
(A) adjusting the processing chamber to a predetermined pressure by introducing and exhausting gas into the processing chamber;
After the step (a), the first switch is turned on, and the rectifying plate and the first grounding portion are electrically connected, and a high frequency is generated between the upper electrode and the lower electrode. A step (b) of applying electric power to turn the gas into plasma and cleaning the processing chamber;
After the step (b), the first switch is turned off and the rectifying plate is brought into an electrically floating state, so that high frequency power is applied between the upper electrode and the lower electrode, and the gas And a step (c) of cleaning the inside of the processing chamber. The lower electrode has a drive mechanism that moves up and down in the processing chamber,
The step (c) includes a step of moving the lower electrode below the processing chamber so that a difference in height between an upper surface of the rectifying plate and an upper surface of the lower electrode is reduced. A method for cleaning a plasma processing apparatus according to claim 1. A cover ring disposed above the upper electrode, provided in a region surrounding the side surface of the upper electrode in the processing chamber, and a second grounding unit connected to the cover ring via a second switch And
In the step (b) and the step (c), the processing chamber is cleaned with the second switch turned on and the cover ring and the second grounding portion are electrically connected,
The first switch is turned on to electrically connect the rectifying plate and the first grounding unit, and the second switch is turned off to bring the cover ring into an electrically floating state. The plasma processing according to claim 8, further comprising a step (d) of applying high frequency power between the upper electrode and the lower electrode to convert the gas into plasma and cleaning the processing chamber. How to clean the device. The upper electrode has a drive mechanism that moves up and down in the processing chamber,
The step (d) includes a step of moving the upper electrode above the processing chamber so that a difference in height between a lower surface of the cover ring and a lower surface of the upper electrode is reduced. A method for cleaning a plasma processing apparatus according to claim 1.   The method of cleaning a plasma processing apparatus according to claim 8, further comprising a step of performing an etching process on the substrate mounted on the lower electrode.

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