JP2008138254A - Surface-treated metal sheet, surface treatment agent for metal, and method for manufacturing surface-treated metal sheet - Google Patents

Surface-treated metal sheet, surface treatment agent for metal, and method for manufacturing surface-treated metal sheet Download PDF

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JP2008138254A
JP2008138254A JP2006325648A JP2006325648A JP2008138254A JP 2008138254 A JP2008138254 A JP 2008138254A JP 2006325648 A JP2006325648 A JP 2006325648A JP 2006325648 A JP2006325648 A JP 2006325648A JP 2008138254 A JP2008138254 A JP 2008138254A
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JP4864670B2 (en
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Hiromasa Shoji
浩雅 莊司
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Nippon Steel Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface-treated metal sheet which does not contain chromium and has superior adhesiveness to a paint film, superior corrosion resistance, and further, superior weldability, and to provide a manufacturing method therefor. <P>SOLUTION: The surface-treated metal sheet comprises a metal layer (A) of which the metal excludes chromium, and a layer (B) formed of a hydroxide or an oxide of a metal (b) which excludes chromium and a metal (a), or a mixture of the hydroxide and the oxide, on the metal layer (A). The layer (B) also includes the metal (a) which is the same type as the metal layer (A). The surface treatment agent for the metal and the method for manufacturing the surface-treated metal sheet are disclosed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、6価クロムを使用しない表面処理金属板および金属表面処理剤に関する。また、前記金属表面処理剤を使用した表面処理金属板の製造方法に関する。   The present invention relates to a surface-treated metal plate and a metal surface treatment agent that do not use hexavalent chromium. Moreover, it is related with the manufacturing method of the surface treatment metal plate which uses the said metal surface treating agent.

容器、自動車、家電、建材等の種々の用途で使用されるめっき金属板や金属板には、意匠性、耐食性、絶縁性等の様々な特性発現を目的として、塗装、ラミネート等の処理が施される。   Plated metal plates and metal plates used in various applications such as containers, automobiles, home appliances, and building materials are subjected to treatments such as painting and laminating for the purpose of developing various properties such as design properties, corrosion resistance, and insulation. Is done.

これら金属板表面には下地処理として、金属クロムとクロム水和酸化物の析出処理やクロメート処理等を施すことがある。前者は所謂ティンフリースチールで塗装密着性、耐食性、塗装後耐食性などの缶の要求性能をバランス良く満足させることから、飲料缶等の広い範囲で用いられている。また、後者は金属板を重クロム酸溶液中に浸漬もしくは電解し酸化クロム被膜が形成されることにより、塗装密着性、耐食性が向上することから幅広い分野、用途で用いられてきた。   The surface of these metal plates may be subjected to a precipitation treatment of chromium metal and chromium hydrated oxide or a chromate treatment as a base treatment. The former is so-called tin-free steel, which satisfies the required performance of cans such as coating adhesion, corrosion resistance, and post-coating corrosion resistance in a well-balanced manner, and is used in a wide range of beverage cans and the like. The latter has been used in a wide range of fields and applications because coating adhesion and corrosion resistance are improved by immersing or electrolyzing a metal plate in a dichromic acid solution to form a chromium oxide film.

しかしながら、近年、地球環境問題への関心が高まり、6価クロムを使用しないことが望まれるようになり、6価クロムを使用しない被膜で6価クロムを使用した被膜と同等の性能発現を目指して様々な処理が開発されているが、十分な特性が得られていない。なお、ここで6価クロムの使用とは、製造工程で6価クロムを使用すること、被膜中に6価クロムを含有することを意味する。   However, in recent years, interest in global environmental issues has increased, and it has become desirable not to use hexavalent chromium, with the aim of achieving performance equivalent to a film using hexavalent chromium in a film that does not use hexavalent chromium. Various treatments have been developed, but sufficient characteristics have not been obtained. Here, the use of hexavalent chromium means that hexavalent chromium is used in the production process and that the film contains hexavalent chromium.

例えば、特許文献1には、ティンフリースチールを代替できるクロムフリー技術として、冷延鋼板を基材とし、鉄素地と反応し不働態被膜を形成させるタンニン酸と塗装密着性向上に寄与するシランカップリング剤とを含有する化成処理液中に基材を浸漬もしくはスプレーし、複合被膜を形成し、塗装密着性、耐食性の向上を図る技術が開示されている。しかしながら、冷延鋼板上に形成した複合被膜は、従来の6価クロムを用いて形成した被膜と比較して十分な性能とはいえない。   For example, in Patent Document 1, as a chromium-free technique that can replace tin-free steel, tannic acid, which uses a cold-rolled steel sheet as a base material, reacts with an iron base to form a passive film, and contributes to improved paint adhesion. A technique for improving a coating adhesion and corrosion resistance by immersing or spraying a base material in a chemical conversion treatment solution containing a ring agent to form a composite film is disclosed. However, the composite coating formed on the cold-rolled steel sheet cannot be said to have sufficient performance as compared with the coating formed using conventional hexavalent chromium.

特許文献2には、アルミニウム用として、ジルコニウムの酸化物、酸素酸塩、有機酸塩及びフルオロ錯塩の少なくとも1種にジルコニウムと反応性を有する架橋性樹脂と親水性樹脂を含む防錆処理剤が開示されている。この処理剤の場合、親水性樹脂の耐水性不足を補うために架橋性樹脂が必須成分であり、これによって造膜性が付与されて非常に強固な樹脂被膜が形成される一方で、無機成分であるジルコニウム量の比率が下がるため耐食性が十分ではない。   Patent Document 2 discloses an anticorrosive treatment agent containing a crosslinkable resin and a hydrophilic resin that are reactive with zirconium in at least one of zirconium oxide, oxyacid salt, organic acid salt, and fluoro complex salt for aluminum. It is disclosed. In the case of this treatment agent, a crosslinkable resin is an essential component to make up for the lack of water resistance of the hydrophilic resin, thereby forming a very strong resin film by imparting a film-forming property, while an inorganic component Therefore, the corrosion resistance is not sufficient.

これらの技術に対し、特許文献3に開示されている、金属イオンとフッ素イオンの錯イオンを含む溶液に金属材料を浸漬、あるいは電解することで形成される、クロムを含まない金属酸化物や金属水酸化物等の無機被膜は、耐食性に優れ、その上層に施す樹脂との密着性にも優れている。   In contrast to these technologies, metal oxides and metals not containing chromium, which are formed by immersing or electrolyzing a metal material in a solution containing complex ions of metal ions and fluorine ions, disclosed in Patent Document 3. Inorganic coatings such as hydroxides are excellent in corrosion resistance and excellent in adhesion to the resin applied to the upper layer.

特開2002−275641号公報JP 2002-275641 A 特開2000−282267号公報JP 2000-282267 A WO2003/048416号公報WO2003 / 048416

前述のように金属イオンとフッ素イオンの錯イオンから形成されるような金属酸化物や金属水酸化物の無機被膜を被覆した金属板は、耐食性および樹脂との密着性に優れているが、通常、金属酸化物や金属水酸化物は電気絶縁性が高く、そのために金属酸化物や金属水酸化物の無機被膜を被覆した金属板の溶接性が低くなる。   As described above, a metal plate coated with a metal oxide or metal hydroxide inorganic coating formed from a complex ion of metal ions and fluorine ions is excellent in corrosion resistance and adhesion to a resin. Metal oxides and metal hydroxides have high electrical insulating properties, so that the weldability of metal plates coated with inorganic coatings of metal oxides and metal hydroxides is low.

従来のティンフリースチール等のクロム水和酸化物を上層に有する金属板においても、その電気抵抗が大きいことにより、一般に溶接性が低く、溶接する際に機械的、化学的にクロム水和酸化物層を除去する必要があった。溶接性を向上させるためには、無機被膜を薄くすることが考えられるが、十分な耐食性が得られなくなる。もちろん、無機被膜を厚くすると耐食性に優れるが、溶接性が低下することになる。   Conventional metal plates such as tin-free steel, which have chromium hydrated oxide as the upper layer, are generally poor in weldability due to their large electrical resistance, and mechanically and chemically hydrated chromium oxides when welding. It was necessary to remove the layer. In order to improve the weldability, it is conceivable to make the inorganic coating thin, but sufficient corrosion resistance cannot be obtained. Of course, when the inorganic coating is thickened, the corrosion resistance is excellent, but the weldability is lowered.

すなわち、6価クロムを使用しない金属イオンとフッ素イオンの錯イオンから形成されるような金属酸化物や金属水酸化物の無機被膜を被覆した金属板は、耐食性および上層に形成する樹脂層との密着性に優れているが、さらに溶接性にも優れた無機被膜は開発されておらず早急な解決が望まれていた。   That is, a metal plate coated with a metal oxide or metal hydroxide inorganic coating formed from a complex ion of fluorine ions and metal ions not using hexavalent chromium has a corrosion resistance and a resin layer formed on the upper layer. An inorganic coating with excellent adhesion but also excellent weldability has not been developed, and an immediate solution has been desired.

本発明は、このような状況を鑑みたものであり、6価クロムを使用しない無機被膜で優れた塗装密着性と耐食性を有するものであって、かつ優れた溶接性を有する被膜を持つ表面処理金属板および金属表面処理剤を提供することを目的とし、さらには前記表面処理金属板の製造方法を提供することを目的とする。   The present invention has been made in view of such a situation, and is an inorganic coating that does not use hexavalent chromium, has excellent coating adhesion and corrosion resistance, and has a surface treatment having a coating with excellent weldability. It aims at providing a metal plate and a metal surface treating agent, and also aims at providing the manufacturing method of the said surface treatment metal plate.

本発明者らは、前記課題を解決する手段を鋭意検討した結果、クロムを除く金属aの金属層Aとその上層にクロム及び金属aを除く金属bの水酸化物、酸化物、あるいは前記水酸化物と前記酸化物の混合物からなる層Bを有し、該層Bに前記金属層Aと同種の金属aを含有するものが、高い塗装密着性と高い耐食性で、さらに優れた溶接性を有することを見出し、本発明に至った。   As a result of intensive studies on means for solving the above problems, the present inventors have found that a metal layer A of metal a excluding chromium and a hydroxide, oxide of metal b excluding chromium and metal a on the upper layer thereof, or the water It has a layer B made of a mixture of an oxide and the oxide, and the layer B contains the same kind of metal a as the metal layer A, which has high paint adhesion and high corrosion resistance, and further has excellent weldability. As a result, the present invention has been found.

本発明の趣旨とするところは以下の通りである。
(1)金属表面上に、クロムを除く金属aの金属層A、さらにその上層にクロム及び金属aを除く金属bの水酸化物、酸化物、あるいは前記水酸化物と前記酸化物の混合物からなる層Bを有し、該層Bに前記金属層Aと同種の金属aを含有することを特徴とする金属板。
(2)前記金属層Aの平均厚さが、1nm以上1μm以下であることを特徴とする(1)に記載の金属板。
(3)前記金属層Aの金属aがコバルト、ニッケル、銅、スズから選ばれる1種以上であることを特徴とする(1)又は(2)に記載の金属板。
(4)前記層Bの平均厚さが、1nm以上1μm以下であることを特徴とする(1)〜(3)のいずれかに記載の金属板。
(5)前記層Bに含有する金属aが、層B中の総金属元素換算に対して0.1at%以上50at%未満含有することを特徴とする(1)〜(4)のいずれかに記載の金属板。
(6)前記層Bの金属bが、ケイ素、チタン、ジルコニウムから選ばれる1種以上であることを特徴とする(1)〜(5)のいずれかに記載の金属板。
The gist of the present invention is as follows.
(1) From the metal layer A of the metal a excluding chromium on the metal surface, and further from the hydroxide or oxide of the metal b excluding chromium and the metal a on the upper layer, or a mixture of the hydroxide and the oxide. A metal plate comprising: a layer B comprising: a metal B of the same kind as that of the metal layer A.
(2) The metal plate according to (1), wherein the average thickness of the metal layer A is 1 nm or more and 1 μm or less.
(3) The metal plate according to (1) or (2), wherein the metal a of the metal layer A is one or more selected from cobalt, nickel, copper, and tin.
(4) The metal plate according to any one of (1) to (3), wherein the average thickness of the layer B is 1 nm or more and 1 μm or less.
(5) In any one of (1) to (4), the metal a contained in the layer B is contained in an amount of 0.1 at% or more and less than 50 at% relative to the total metal elements in the layer B. Metal plate of description.
(6) The metal plate according to any one of (1) to (5), wherein the metal b of the layer B is at least one selected from silicon, titanium, and zirconium.

(7)クロムを除く金属b及び該金属bに対してモル比で少なくとも6倍のフッ素を含有する錯イオンと、クロムを除き、かつ該金属bと異なる金属aの金属イオンであって、該金属bに対してモル比で2倍以上10倍以下の金属イオンとを含むことを特徴とする金属表面処理剤。
(8)pHが2以上4以下であることを特徴する(7)に記載の金属表面処理剤。
(9)前記フッ素を含有する錯イオンの金属bが、ケイ素、チタン、ジルコニウムから選ばれる1種以上であることを特徴とする(7)又は(8)に記載の金属表面処理剤。
(10)前記金属イオンの金属aがコバルト、ニッケル、銅、スズから選ばれる1種以上からなることを特徴とする(7)〜(9)のいずれかに記載の金属表面処理剤。
(7) a metal b excluding chromium and a complex ion containing fluorine at a molar ratio of at least 6 times the metal b, and a metal ion of metal a excluding chromium and different from the metal b, A metal surface treatment agent comprising a metal ion having a molar ratio of 2 to 10 times the metal b.
(8) The metal surface treating agent according to (7), wherein the pH is 2 or more and 4 or less.
(9) The metal surface treatment agent according to (7) or (8), wherein the fluorine-containing complex ion metal b is at least one selected from silicon, titanium, and zirconium.
(10) The metal surface treatment agent according to any one of (7) to (9), wherein the metal a of the metal ion is one or more selected from cobalt, nickel, copper, and tin.

(11)(7)〜(10)のいずれかに記載の金属表面処理剤中で金属基材をカソード電解して被膜を形成することを特徴とする表面処理金属板の製造方法。 (11) A method for producing a surface-treated metal sheet, comprising forming a film by cathodic electrolysis of a metal substrate in the metal surface treatment agent according to any one of (7) to (10).

本発明によれば、6価クロムを使用しない環境負荷の低い被膜であって、塗装密着性と耐食性に優れ、さらに溶接性に優れた被膜を有する表面処理金属板を提供できる。また、本発明の金属表面処理剤および該処理剤を使用した前記表面処理金属板の製造方法によれば、金属層Aと金属酸化物や金属水酸化物の層Bの2層構造被膜を1工程で効率よく作製でき、さらに、金属層Aと同種の金属aを含む層Bが形成できる。   ADVANTAGE OF THE INVENTION According to this invention, the surface treatment metal plate which is a film with a low environmental load which does not use hexavalent chromium, is excellent in coating adhesiveness and corrosion resistance, and also has the film excellent in weldability can be provided. In addition, according to the metal surface treatment agent of the present invention and the method for producing the surface-treated metal plate using the treatment agent, a two-layer coating film of a metal layer A and a layer B of metal oxide or metal hydroxide is provided. A layer B containing the same kind of metal a as that of the metal layer A can be formed.

以下に本発明を詳しく説明する。   The present invention is described in detail below.

本発明者らは、鋭意検討した結果、金属板の表面上に金属層A、該金属層Aと同種の金属aを含有する層Bを有する表面処理金属板が、塗料密着性および耐食性を低下させることなく、優れた溶接性が得られることを見出した。この機構については、次のように推定している。   As a result of intensive studies, the present inventors have found that a surface-treated metal plate having a metal layer A on the surface of the metal plate and a layer B containing the same kind of metal a as the metal layer A reduces paint adhesion and corrosion resistance. The present inventors have found that excellent weldability can be obtained without causing them to occur. This mechanism is estimated as follows.

水酸化物、酸化物、あるいは水酸化物と酸化物の混合物からなる層Bに下層の金属層Aと同種の金属aが含有されることで、次のような顕著な効果が生ずる。絶縁性の無機層Bに導電性の金属を分散して含有されることで、層Bに金属が存在しない場合に比べて、層Bの電気抵抗が低くなり、溶接性が向上するものである。   When the same kind of metal a as that of the lower metal layer A is contained in the layer B made of hydroxide, oxide, or a mixture of hydroxide and oxide, the following remarkable effects are produced. By containing conductive metal in the insulating inorganic layer B in a dispersed manner, the electrical resistance of the layer B is lowered and weldability is improved as compared with the case where no metal is present in the layer B. .

層Bの電気抵抗を単に下げるだけであれば、分散する金属はどのようなものでもよいが、金属層Aと異種の金属を上部層Bに分散すると局部セルが形成され、耐食性が低下する。すなわち、層Bに含まれる金属を金属層Aと同種の金属aにすることによって、局部セルの形成を防止でき、高い耐食性を示す。さらに局部セル形成の防止による耐食性に加えて、金属表面上に金属層Aがあることで優れた耐食性を示す。   As long as the electric resistance of the layer B is simply lowered, any metal can be dispersed. However, when a metal different from the metal layer A is dispersed in the upper layer B, a local cell is formed and the corrosion resistance is lowered. That is, when the metal contained in the layer B is the same type of metal a as that of the metal layer A, the formation of local cells can be prevented and high corrosion resistance is exhibited. Furthermore, in addition to the corrosion resistance by prevention of local cell formation, the presence of the metal layer A on the metal surface shows excellent corrosion resistance.

また、その上層にある水酸化物、酸化物、あるいは水酸化物と酸化物の混合物からなる層Bは、必要に応じて、その上に形成される有機樹脂層と化学結合や水素結合等で強固な結合を形成できるために、優れた塗装密着性を示す。さらに、層Bは、バリヤ性の高い酸化物や水酸化物の無機膜であるために、耐食性の向上にも寄与している。なお層厚にも依るが、耐食性、溶接性、密着性をバランス良く発現するのは、金属aが無機層Bに無機層Bの平均厚さの1/10以下のサイズで微分散している場合である。   In addition, the layer B made of hydroxide, oxide, or a mixture of hydroxide and oxide on the upper layer is formed by chemical bonds, hydrogen bonds, or the like with the organic resin layer formed thereon, if necessary. Because it can form a strong bond, it exhibits excellent paint adhesion. Furthermore, since the layer B is an oxide or hydroxide inorganic film having a high barrier property, it also contributes to an improvement in corrosion resistance. Although depending on the layer thickness, the reason that the corrosion resistance, weldability, and adhesion are expressed in a balanced manner is that the metal a is finely dispersed in the inorganic layer B with a size of 1/10 or less of the average thickness of the inorganic layer B. Is the case.

金属層Aの平均厚さは1nm以上1μm以下が好ましい。1nm以下では被覆率が100%未満の場合があり耐食性が不十分となることがある。また、1μm超の場合、耐食性が飽和し経済的ではない。ここで平均厚さとは1000倍〜20万倍程度の断面SEM観察又は断面TEM観察において、任意の10視野で測定された膜厚の平均値を意味する。   The average thickness of the metal layer A is preferably 1 nm or more and 1 μm or less. If it is 1 nm or less, the coverage may be less than 100% and the corrosion resistance may be insufficient. On the other hand, if it exceeds 1 μm, the corrosion resistance is saturated and it is not economical. Here, the average thickness means an average value of film thicknesses measured in arbitrary 10 fields of view in cross-sectional SEM observation or cross-sectional TEM observation of about 1000 to 200,000 times.

金属層Aを構成する金属aは、水系から電析可能な金属が好ましく、より好ましくは容易に電析するコバルト、ニッケル、銅、亜鉛、スズであり、さらに好ましくは標準電極電位が高いコバルト、ニッケル、銅、スズである。金属層Aには酸化物、フッ化物等の化合物が含まれていても良い。   The metal a constituting the metal layer A is preferably a metal that can be electrodeposited from an aqueous system, more preferably cobalt, nickel, copper, zinc, and tin that are easily electrodeposited, more preferably cobalt having a high standard electrode potential, Nickel, copper and tin. The metal layer A may contain compounds such as oxides and fluorides.

水酸化物、酸化物、あるいは水酸化物と酸化物の混合物からなる層Bの平均厚さは1nm以上1μm以下が好ましい。1nm以下では被覆率が100%未満の場合があり塗装密着性が不十分となることがある。また、1μm超の場合、塗装密着性が飽和し経済的ではないし、低下する場合もある。なお、塗装密着性とは塗装やラミネート等により形成された有機樹脂層との密着性を意味する。   The average thickness of the layer B made of hydroxide, oxide, or a mixture of hydroxide and oxide is preferably 1 nm or more and 1 μm or less. If it is 1 nm or less, the coverage may be less than 100%, and the paint adhesion may be insufficient. On the other hand, if it exceeds 1 μm, the coating adhesion is saturated, which is not economical and may decrease. The paint adhesion means the adhesion with an organic resin layer formed by painting or laminating.

層Bに含有する金属aは、層B中の総金属元素換算に対して0.1at%〜50at%が好ましい。0.1at%未満では溶接性が不十分な場合があり、50at%超では塗装密着性を低下させる場合がある。   The metal a contained in the layer B is preferably 0.1 at% to 50 at% with respect to the total metal elements in the layer B. If it is less than 0.1 at%, weldability may be insufficient, and if it exceeds 50 at%, paint adhesion may be reduced.

層Bを構成する水酸化物、酸化物の金属種は特に限定するものではないが、鉄、マグネシウム、ニオブ、タンタル、アルミニウム、ニッケル、コバルト、チタン、ジルコニウム、ケイ素等が挙げられる。また、1種類の金属で構成されていても良いし、2種類以上の複合系、混合系、積層でもよい。好適な金属は、ケイ素、チタン、ジルコニウムである。これらは耐食性が優れており、高バリヤ性に起因するものと推測されるが、その詳細な機構は不明である。   The metal species of the hydroxide and oxide constituting the layer B are not particularly limited, and examples thereof include iron, magnesium, niobium, tantalum, aluminum, nickel, cobalt, titanium, zirconium, silicon and the like. Moreover, you may be comprised with 1 type of metal and 2 or more types of composite type | system | groups, mixed systems, and lamination | stacking may be sufficient. Suitable metals are silicon, titanium and zirconium. These have excellent corrosion resistance and are presumed to be due to high barrier properties, but the detailed mechanism is unknown.

次に、金属板表面上に層AとBを形成するための本発明の金属表面処理剤について述べる。
金属bと該金属bに対してモル比で少なくとも6倍のフッ素を含有する錯イオンは、その金属酸化物と平衡反応を形成し、その平衡のずれにより層Bを形成する。前記フッ素が6倍未満では、後述する層Bを形成する錯イオンのpH緩衝作用が有効に働かずに金属aのイオンの還元により層Aが適切に形成されない場合がある。さらには、その上層に金属酸化物、金属水酸化物が適切に析出しない場合がある。6倍以上のフッ素であれば、成膜のためのpH緩衝作用、基材表面を活性化させる液中フッ素イオン濃度への効果等で、好適な金属酸化物や金属水酸化物被膜を形成できるとともに、共存する金属aのイオンの還元により層Aが形成される。
Next, the metal surface treating agent of the present invention for forming the layers A and B on the surface of the metal plate will be described.
A complex ion containing fluorine at a molar ratio of at least 6 times with respect to the metal b and the metal b forms an equilibrium reaction with the metal oxide, and forms a layer B due to the deviation of the equilibrium. If the fluorine is less than 6 times, the pH buffering action of complex ions forming the layer B described later does not work effectively, and the layer A may not be formed properly by reduction of the metal a ions. Furthermore, metal oxide and metal hydroxide may not be appropriately deposited on the upper layer. If the fluorine is 6 times or more, a suitable metal oxide or metal hydroxide film can be formed due to the pH buffering action for film formation, the effect on the fluorine ion concentration in the liquid that activates the substrate surface, etc. At the same time, the layer A is formed by reduction of the ions of the coexisting metal a.

前記錯イオンとしては、例えば、ヘキサフルオロチタン酸、ヘキサフルオロニオブ酸、ヘキサフルオロタンタル酸、ヘキサフルオロジルコニウム酸等、あるいはこれらの塩、例えば、アンモニウム塩、カリウム塩、ナトリウム塩等を用いることができ、これらに関して特に制約はない。さらに、金属とフッ素以外の元素が錯イオン中に含まれていてもよい。濃度範囲は適宜設定すればよい。   As the complex ion, for example, hexafluorotitanic acid, hexafluoroniobic acid, hexafluorotantalic acid, hexafluorozirconic acid, etc., or salts thereof such as ammonium salt, potassium salt, sodium salt, etc. can be used. There are no particular restrictions on these. Furthermore, elements other than metal and fluorine may be contained in the complex ions. The concentration range may be set as appropriate.

また、金属層Aを形成する金属aの金属イオンaは、金属bに比してモル比で2倍以上10倍以下が好ましい。2倍未満では層Bに金属aが含有されない場合がある。10倍より大きい場合は層Bの形成を阻害する場合がある。   Further, the metal ion a of the metal a forming the metal layer A is preferably 2 times or more and 10 times or less in molar ratio as compared with the metal b. If it is less than 2 times, the layer B may not contain the metal a. When it is larger than 10 times, the formation of the layer B may be inhibited.

金属表面処理剤のpHは2以上4以下が好ましい。処理液pHが2未満では水素発生反応が活発に起こり、成膜量が安定しない場合がある。一方、4より大きい場合は、金属イオンaと錯イオンが共存することが難しくなり、溶液が不安定で凝集したものが析出する場合がある。pH調整は、アンモニア水、フッ酸等を用いる等の周知の方法でよく、特に制約はない。   The pH of the metal surface treatment agent is preferably 2 or more and 4 or less. When the treatment solution pH is less than 2, hydrogen generation reaction occurs actively, and the film formation amount may not be stable. On the other hand, when it is larger than 4, it becomes difficult for the metal ions a and complex ions to coexist, and the solution may be unstable and aggregated. The pH adjustment may be performed by a known method such as using ammonia water or hydrofluoric acid, and there is no particular limitation.

金属板を上述の金属表面処理剤に浸漬して電解する場合、電解条件は特に限定されず、反応温度や反応時間等の諸条件を適宜設定すればよい。例えば、電解する際の電流密度は、0.1A/dm2〜50A/dm2が好ましい。電解する際の反応温度は、常温〜80℃が好ましい。電解する際の反応時間は、目的とする成膜量に応じて設定すれば良いが生産性を考慮すると1秒〜60分間が好ましい。また、金属板の前処理等について特に制約はないが、脱脂した表面、スケールが除去された表面が好ましい。 When the metal plate is immersed in the above-described metal surface treatment agent for electrolysis, the electrolysis conditions are not particularly limited, and various conditions such as reaction temperature and reaction time may be set as appropriate. For example, the current density at the time of electrolysis, 0.1A / dm 2 ~50A / dm 2 is preferred. The reaction temperature during electrolysis is preferably from room temperature to 80 ° C. The reaction time for electrolysis may be set according to the target film formation amount, but is preferably 1 second to 60 minutes in consideration of productivity. Moreover, although there is no restriction | limiting in particular about the pretreatment of a metal plate, etc., the surface from which the degreased surface and the scale were removed is preferable.

層A及び層Bの成膜機構は推定ではあるが、次の通りである。まず、層Bを形成する錯イオンのpH緩衝作用が有効に働き、金属aのイオンの還元により層Aが形成される。その後、金属aのイオンの還元が起こりながら、錯イオンから層Bが形成され、金属aが層Bに取り込まれる。その結果、金属表面上に、金属aの金属層A、さらにその上層に金属bの水酸化物や酸化物の層Bが形成され、該層Bに前記金属層Aと同種の金属aが含有した被膜組織が形成される。したがって、本発明の金属表面処理剤および該処理剤を使用した製造方法では、金属表面に金属被膜と、金属酸化物や金属水酸化物被膜を1工程で製造できる。   The film formation mechanism of layer A and layer B is estimated but is as follows. First, the pH buffer action of the complex ions forming the layer B works effectively, and the layer A is formed by reduction of the metal a ions. Thereafter, while reduction of ions of metal a occurs, layer B is formed from complex ions, and metal a is taken into layer B. As a result, a metal layer A of the metal a is formed on the metal surface, and a hydroxide or oxide layer B of the metal b is formed thereon, and the layer B contains the same metal a as the metal layer A. A covered film structure is formed. Therefore, in the metal surface treatment agent and the production method using the treatment agent of the present invention, a metal film and a metal oxide or metal hydroxide film can be produced on the metal surface in one step.

本発明に適用できる金属板は、例えば、冷延鋼板、ステンレス鋼板、アルミニウム又はアルミニウム合金板、亜鉛メッキ鋼板等の例えば各種金属・合金、各種金属表面処理材等であり、特に限定されない。   The metal plate applicable to the present invention is, for example, a cold-rolled steel plate, a stainless steel plate, an aluminum or aluminum alloy plate, a galvanized steel plate or the like, for example, various metals / alloys, various metal surface treatment materials, etc., and is not particularly limited.

以下、本発明を実施例により具体的に説明するが、本発明はこれら実施例によって何ら限定されるものではない。   EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.

表1、2に諸条件を示す。金属板はアセトン中で超音波脱脂処理を施した冷延鋼板を使用した。金属表面処理剤は、金属層A及び層Bに含有する金属aとしてニッケル、銅、亜鉛、スズ、スズ−コバルトの塩を用い、また、層Bの金属bとしてチタン、ジルコニウム、ケイ素、ニオブのヘキサフルオロ錯塩水溶液、タンタルのヘプタフルオロ錯塩水溶液を用いて、必要に応じてアンモニウム水、フッ酸を用いてpHを調整した処理剤を用いた。金属板を上記処理剤中で電流密度を0.1〜10A/dm2に制御して1〜100秒間カソード電解を行い、成膜後、水洗し乾燥した。 Tables 1 and 2 show the conditions. As the metal plate, a cold-rolled steel plate subjected to ultrasonic degreasing treatment in acetone was used. The metal surface treatment agent uses a salt of nickel, copper, zinc, tin, tin-cobalt as the metal a contained in the metal layer A and the layer B, and titanium, zirconium, silicon, niobium as the metal b of the layer B. Using a hexafluoro complex salt aqueous solution and a tantalum heptafluoro complex salt aqueous solution, a treatment agent whose pH was adjusted with ammonium water or hydrofluoric acid as necessary was used. The metal plate was subjected to cathodic electrolysis for 1 to 100 seconds while controlling the current density at 0.1 to 10 A / dm 2 in the above treatment agent, washed with water and dried after film formation.

実験No.1は0.1mol/Lヘキサフルオロケイ酸アンモニウム水溶液に基材を浸漬し、銅板を対極として電解を行い、成膜した。   Experiment No. No. 1 was formed by immersing the base material in a 0.1 mol / L ammonium hexafluorosilicate aqueous solution and performing electrolysis using a copper plate as a counter electrode.

実験No.2〜12は0.1mol/Lヘキサフルオロケイ酸アンモニウム水溶液に0〜1mol/Lになるように硫酸銅を添加、基材を浸漬し、銅板を対極として電解を行い、成膜した。   Experiment No. In Nos. 2 to 12, copper sulfate was added to a 0.1 mol / L ammonium hexafluorosilicate aqueous solution so as to be 0 to 1 mol / L, the substrate was immersed, and electrolysis was performed using a copper plate as a counter electrode to form a film.

実験No.13〜24は0.1mol/Lヘキサフルオロジルコン酸アンモニウム水溶液にニッケルのモル濃度が0.11〜1.1mol/Lになるように硫酸ニッケルと塩化ニッケルを添加し、pH2〜4に調整後、基材を浸漬し、ニッケル板を対極として電解を行い、成膜した。   Experiment No. 13 to 24 were added nickel sulfate and nickel chloride to a 0.1 mol / L ammonium hexafluorozirconate aqueous solution so that the molar concentration of nickel was 0.11 to 1.1 mol / L, and adjusted to pH 2 to 4, The substrate was immersed and electrolysis was performed using a nickel plate as a counter electrode to form a film.

実験No.25〜33は0.1mol/Lヘキサフルオロニオブ酸アンモニウム水溶液にニッケルのモル濃度が0.11mol/Lになるように硫酸ニッケルと塩化ニッケルを添加し、pH2〜4に調整後、基材を浸漬し、ニッケル板を対極として電解を行い、成膜した。   Experiment No. Nos. 25 to 33 were prepared by adding nickel sulfate and nickel chloride to a 0.1 mol / L ammonium hexafluoroniobate aqueous solution so that the molar concentration of nickel was 0.11 mol / L, adjusting the pH to 2 to 4, and then immersing the substrate. Then, electrolysis was performed using a nickel plate as a counter electrode to form a film.

実験No.34〜42は0.01mol/Lヘプタフルオロタンタル酸アンモニウム水溶液にニッケルのモル濃度が0.011mol/Lになるように硫酸ニッケルと塩化ニッケルを添加し、pH2〜4に調整後、基材を浸漬し、ニッケル板を対極として電解を行い、成膜した。なお、硫酸ニッケルと塩化ニッケルのモル比は10:1とした。   Experiment No. For 34 to 42, nickel sulfate and nickel chloride were added to 0.01 mol / L ammonium heptafluorotantalate aqueous solution so that the molar concentration of nickel was 0.011 mol / L, and after adjusting to pH 2 to 4, the substrate was immersed Then, electrolysis was performed using a nickel plate as a counter electrode to form a film. The molar ratio of nickel sulfate to nickel chloride was 10: 1.

実験No.43は0.001mol/Lヘキサフルオロジルコン酸アンモニウム水溶液に0.001mol/Lになるように硫酸亜鉛を添加しpHを2に調整後、基材を浸漬し、亜鉛板を対極として電解を行い、成膜した。   Experiment No. 43, after adding zinc sulfate to 0.001 mol / L ammonium hexafluorozirconate aqueous solution to adjust the pH to 2, the substrate is immersed, and electrolysis is performed using the zinc plate as a counter electrode. A film was formed.

実験No.44は0.01mol/Lヘキサフルオロジルコン酸アンモニウム水溶液に0.001mol/Lになるように硫酸亜鉛を添加しpHを2に調整後、基材を浸漬し、亜鉛板を対極として電解を行い、成膜した。   Experiment No. After adding zinc sulfate to 0.01 mol / L ammonium hexafluorozirconate aqueous solution to adjust the pH to 2, the substrate was immersed, and electrolysis was performed using the zinc plate as a counter electrode. A film was formed.

実験No.45は0.1mol/Lヘキサフルオロジルコン酸アンモニウム水溶液に0.001mol/Lになるように硫酸亜鉛を添加しpHを2に調整後、基材を浸漬し、亜鉛板を対極として電解を行い、成膜した。   Experiment No. 45 was adjusted to pH 2 by adding zinc sulfate to a 0.1 mol / L ammonium hexafluorozirconate aqueous solution to adjust the pH to 2, and then the substrate was immersed, and electrolysis was performed using the zinc plate as a counter electrode. A film was formed.

実験No.46は0.001mol/Lヘキサフルオロジルコン酸アンモニウム水溶液に0.01mol/Lになるように硫酸亜鉛を添加しpHを2に調整後、基材を浸漬し、亜鉛板を対極として電解を行い、成膜した。   Experiment No. After adding zinc sulfate to 0.001 mol / L ammonium hexafluorozirconate aqueous solution to adjust its pH to 2, 46 was immersed in the base material and electrolyzed using the zinc plate as a counter electrode, A film was formed.

実験No.47は0.01mol/Lヘキサフルオロジルコン酸アンモニウム水溶液に0.01mol/Lになるように硫酸亜鉛を添加しpHを2に調整後、基材を浸漬し、亜鉛板を対極として電解を行い、成膜した。   Experiment No. 47 was added zinc sulfate to 0.01 mol / L ammonium hexafluorozirconate aqueous solution to adjust the pH to 2 and adjusted to pH 2, and then the substrate was immersed, and electrolysis was performed using the zinc plate as a counter electrode. A film was formed.

実験No.48は0.1mol/Lヘキサフルオロジルコン酸アンモニウム水溶液に0.01mol/Lになるように硫酸亜鉛を添加しpHを2に調整後、基材を浸漬し、亜鉛板を対極として電解を行い、成膜した。   Experiment No. 48 was adjusted to pH 2 by adding zinc sulfate to a 0.1 mol / L ammonium hexafluorozirconate aqueous solution to adjust the pH to 2, and then the substrate was immersed and electrolyzed using the zinc plate as a counter electrode, A film was formed.

実験No.49は0.001mol/Lヘキサフルオロジルコン酸アンモニウム水溶液に0.1mol/Lになるように硫酸亜鉛を添加しpHを2に調整後、基材を浸漬し、亜鉛板を対極として電解を行い、成膜した。   Experiment No. 49 was added to the 0.001 mol / L ammonium hexafluorozirconate aqueous solution to adjust the pH to 2 by adding zinc sulfate to 0.1 mol / L, and then the substrate was immersed and electrolyzed using the zinc plate as a counter electrode, A film was formed.

実験No.50は0.01mol/Lヘキサフルオロジルコン酸アンモニウム水溶液に0.1mol/Lになるように硫酸亜鉛を添加しpHを2に調整後、基材を浸漬し、亜鉛板を対極として電解を行い、成膜した。   Experiment No. 50, after adding zinc sulfate to 0.01 mol / L ammonium hexafluorozirconate aqueous solution to adjust the pH to 2 and adjusting the pH to 2, the substrate is immersed, and the zinc plate is used as a counter electrode for electrolysis. A film was formed.

実験No.51は0.1mol/Lヘキサフルオロジルコン酸アンモニウム水溶液に0.1mol/Lになるように硫酸亜鉛を添加しpHを2に調整後、基材を浸漬し、亜鉛板を対極として電解を行い、成膜した。   Experiment No. 51 was adjusted to pH 2 by adding zinc sulfate to a 0.1 mol / L ammonium hexafluorozirconate aqueous solution to adjust the pH to 2, and then the substrate was immersed, and electrolysis was performed using the zinc plate as a counter electrode. A film was formed.

実験No.52〜54は0.1mol/Lヘキサフルオロチタン酸アンモニウム水溶液に0.1mol/Lになるように硫酸スズを添加、基材を浸漬し、スズ板を対極として電解を行い、成膜した。   Experiment No. In 52 to 54, tin sulfate was added to a 0.1 mol / L ammonium hexafluorotitanate aqueous solution so as to have a concentration of 0.1 mol / L, the substrate was immersed, and electrolysis was performed using a tin plate as a counter electrode to form a film.

実験No.55〜57は0.1mol/Lヘキサフルオロチタン酸アンモニウム水溶液に0.3mol/Lの塩化コバルト及び0.3mol/Lのフッ化スズを添加、基材を浸漬し、スズ板を対極として電解を行い、成膜した。   Experiment No. 55-57 add 0.3 mol / L cobalt chloride and 0.3 mol / L tin fluoride to 0.1 mol / L ammonium hexafluorotitanate aqueous solution, immerse the base material and perform electrolysis using the tin plate as the counter electrode. The film was formed.

これらの被膜の膜厚は成膜時間によって制御した。断面TEM(高分解能透過型電子顕微鏡)観察及びEDS(エネルギー分散型X線分析)測定により、A及びB層の積層構造及び金属aを確認した。なお、実験No.55〜57についてはA層及び金属aがコバルト及びスズの2種類からなることを確認した。膜中の含有元素はX線光電子分光法によって定量した。   The film thickness of these films was controlled by the film formation time. The cross-sectional TEM (high resolution transmission electron microscope) observation and EDS (energy dispersive X-ray analysis) measurement confirmed the laminated structure of the A and B layers and the metal a. Experiment No. About 55-57, it confirmed that A layer and the metal a consisted of two types, cobalt and tin. The contained elements in the film were quantified by X-ray photoelectron spectroscopy.

断面TEM観察では、B層中に含有された金属aの平均サイズは、実施例No.2〜12では5〜50nmの範囲でそれぞれB層の膜厚の1/20〜1/40のサイズであり、実施例No.13〜33では10〜60nmの範囲でそれぞれB層の膜厚の1/10〜1/30のサイズであり、実施例No.34〜42では1〜5nmの範囲でそれぞれB層の膜厚の1/10〜1/20のサイズであった。また、実施例No.43〜51ではB層中に含有された金属aの平均サイズが0.5〜50nmの範囲、実施例No.52〜57ではB層中に含有された金属aの平均サイズが5〜50nmの範囲であった。   In the cross-sectional TEM observation, the average size of the metal a contained in the B layer is determined according to Example No. 2 to 12 are sizes of 1/20 to 1/40 of the thickness of the B layer in the range of 5 to 50 nm. Nos. 13 to 33 are sizes of 1/10 to 1/30 of the thickness of the B layer in the range of 10 to 60 nm. In 34 to 42, the size was 1/10 to 1/20 of the thickness of the B layer in the range of 1 to 5 nm. In addition, Example No. 43 to 51, the average size of the metal a contained in the B layer is in the range of 0.5 to 50 nm. In 52 to 57, the average size of the metal a contained in the B layer was in the range of 5 to 50 nm.

比較例として、No.58はクロム付着量が20mg/m2となるように塗布型クロメート処理剤を塗布、乾燥した。さらに、比較例としてNo.59、60はそれぞれティンフリースチール、冷延鋼板である。 As a comparative example, no. In No. 58, a coating type chromate treatment agent was applied and dried so that the chromium adhesion amount was 20 mg / m 2 . Furthermore, as a comparative example, no. 59 and 60 are tin-free steel and cold-rolled steel, respectively.

平板部の耐食性試験は以下の条件で評価した。35℃、5質量%NaCl水溶液を噴霧し、72時間経過後の白錆発生率を測定し、4段階で評価した。
◎:錆発生率 0%
○:錆発生率 5%未満
△:錆発生率 5%以上、20%未満
×:錆発生率 20%以上
The corrosion resistance test of the flat plate portion was evaluated under the following conditions. A 5 mass% NaCl aqueous solution was sprayed at 35 ° C., and the white rust occurrence rate after 72 hours was measured and evaluated in four stages.
A: Rust occurrence rate 0%
○: Rust occurrence rate less than 5% △: Rust occurrence rate 5% or more, less than 20% ×: Rust occurrence rate 20% or more

溶接性は、100mm×100mmの表面に対してロレスタ表面抵抗測定機を用いて表面抵抗を10回測定し、1mΩ以下の回数により4段階で評価した。
◎ : 10回
○ : 8〜9回
△ : 5〜7回
× : 0〜4回
Weldability was evaluated in four stages by measuring the surface resistance 10 times using a Loresta surface resistance measuring machine on a 100 mm × 100 mm surface, and by the number of times of 1 mΩ or less.
◎: 10 times ○: 8-9 times △: 5-7 times ×: 0-4 times

有機樹脂層は以下のように形成した。No.1〜13、16、19、22〜25、28、31、34、37、40、43〜60はアクリル系エマルジョンを用いて塗装、乾燥してアクリル樹脂層を形成した。No.14、17、20、26、29、32、35、38、41はエポキシ樹脂エマルジョンを用いて塗装、乾燥してエポキシ樹脂層を形成した。No. 15、18、21、27、30、33、36、39、42はポリエチレンテレフタレート樹脂フィルムを熱圧着して形成した。なお、有機樹脂層は、形成後の厚さが15μmとなるように行った。   The organic resin layer was formed as follows. No. 1-13, 16, 19, 22-25, 28, 31, 34, 37, 40, 43-60 were coated with an acrylic emulsion and dried to form an acrylic resin layer. No. Nos. 14, 17, 20, 26, 29, 32, 35, 38, and 41 were coated with an epoxy resin emulsion and dried to form an epoxy resin layer. No. 15, 18, 21, 27, 30, 33, 36, 39, and 42 were formed by thermocompression bonding of a polyethylene terephthalate resin film. The organic resin layer was formed so that the thickness after formation was 15 μm.

樹脂層との密着性は以下の条件で評価した。沸騰水に60分間浸漬した後、JIS K5400に記載されている碁盤目試験法に準拠して碁盤目を付けて、さらに7mmのエリクセン加工をした。その加工部に粘着テープ(セロハン(登録商標)テープ、ニチバン(株)製)を貼り付け、速やかに斜め45°の方向に引っ張って剥離させて、100個の碁盤目の内で剥離した碁盤目の数を数えた。剥離の程度により4段階で評価した。   The adhesion with the resin layer was evaluated under the following conditions. After dipping in boiling water for 60 minutes, a grid pattern was applied according to the grid pattern test method described in JIS K5400, and an Eriksen process of 7 mm was further performed. Adhesive tape (cellophane (registered trademark) tape, manufactured by Nichiban Co., Ltd.) was applied to the processed part, and the tape was peeled off by pulling it in an oblique direction of 45 ° and peeling off within 100 grids. I counted the number of. The evaluation was made in four stages depending on the degree of peeling.

樹脂層との密着性の評点は下記の通りである。
◎ : 剥離面積率25%未満
○ : 剥離面積率25%以上50%未満
△ : 剥離面積率50%以上75%未満
× : 剥離面積率75%以上
The score of adhesion with the resin layer is as follows.
◎: Peeling area rate less than 25% ○: Peeling area rate of 25% or more and less than 50% Δ: Peeling area rate of 50% or more and less than 75% ×: Peeling area rate of 75% or more

表1、2に得られた結果を示す。実験No.1の層Bに金属aが含有されない場合は、溶接性が不十分であるが、実験No.2〜57の層Bに金属aが存在する場合は、良好な溶接性を示した。また、本発明の金属板は、無処理、塗布クロメートとTFSに比して優れた性能バランスが確認された。また、本発明の金属板には6価クロムを含有していないので、クロメート処理に比べて環境負荷が小さいことは明らかである。   Tables 1 and 2 show the results obtained. Experiment No. 1 does not contain metal a, the weldability is insufficient. When the metal a was present in the 2 to 57 layers B, good weldability was exhibited. In addition, the metal plate of the present invention was confirmed to have an excellent performance balance as compared with the non-treated, coated chromate and TFS. Further, since the metal plate of the present invention does not contain hexavalent chromium, it is clear that the environmental load is smaller than that of the chromate treatment.

Figure 2008138254
Figure 2008138254

Figure 2008138254
Figure 2008138254

Claims (11)

金属板表面上に、クロムを除く金属aの金属層A、さらにその上層にクロム及び金属aを除く金属bの水酸化物、酸化物、あるいは前記水酸化物と前記酸化物の混合物からなる層Bを有し、該層Bに前記金属層Aと同種の金属aを含有することを特徴とする表面処理金属板。   A metal layer A of metal a excluding chromium on the surface of the metal plate, and a layer made of a hydroxide or oxide of metal b excluding chromium and metal a on the upper layer, or a mixture of the hydroxide and the oxide. A surface-treated metal plate comprising B, wherein the layer B contains the same metal a as the metal layer A. 前記金属層Aの平均厚さが、1nm以上1μm以下であることを特徴とする請求項1に記載の表面処理金属板。   2. The surface-treated metal plate according to claim 1, wherein the average thickness of the metal layer A is 1 nm or more and 1 μm or less. 前記金属層Aの金属aがコバルト、ニッケル、銅、スズから選ばれる1種以上であることを特徴とする請求項1又は2に記載の表面処理金属板。   The metal a of the said metal layer A is 1 or more types chosen from cobalt, nickel, copper, and tin, The surface treatment metal plate of Claim 1 or 2 characterized by the above-mentioned. 前記層Bの平均厚さが、1nm以上1μm以下であることを特徴とする請求項1〜3のいずれか1項に記載の表面処理金属板。   The average thickness of the said layer B is 1 nm or more and 1 micrometer or less, The surface treatment metal plate of any one of Claims 1-3 characterized by the above-mentioned. 前記層Bに含有される金属aが、層B中の総金属元素換算に対して0.1at%以上50at%未満であることを特徴とする請求項1〜4のいずれか1項に記載の表面処理金属板。   5. The metal a contained in the layer B is 0.1 at% or more and less than 50 at% with respect to the total metal elements in the layer B. 5. Surface treatment metal plate. 前記層Bの金属bが、ケイ素、チタン、ジルコニウムから選ばれる1種以上であることを特徴とする請求項1〜5のいずれか1項に記載の表面処理金属板。   The surface-treated metal plate according to any one of claims 1 to 5, wherein the metal b of the layer B is at least one selected from silicon, titanium, and zirconium. クロムを除く金属b及び該金属bに対してモル比で少なくとも6倍のフッ素を含有する錯イオンと、クロムを除き、かつ該金属bと異なる金属aの金属イオンであって、該金属bに対してモル比で2倍以上10倍以下の金属イオンとを含むことを特徴とする金属表面処理剤。   A metal ion excluding chromium and a complex ion containing fluorine in a molar ratio of at least 6 times that of the metal b, and a metal ion of a metal a excluding chromium and different from the metal b, the metal b A metal surface treatment agent comprising a metal ion having a molar ratio of 2 to 10 times. pHが2以上4以下であることを特徴する請求項7に記載の金属表面処理剤。   The metal surface treating agent according to claim 7, wherein the pH is 2 or more and 4 or less. 前記フッ素を含有する錯イオンの金属bが、ケイ素、チタン、ジルコニウムから選ばれる1種以上であることを特徴とする請求項7又は8に記載の金属表面処理剤。   The metal surface treating agent according to claim 7 or 8, wherein the metal b of the complex ion containing fluorine is at least one selected from silicon, titanium, and zirconium. 前記金属イオンの金属aがコバルト、ニッケル、銅、スズから選ばれる1種以上からなることを特徴とする請求項7〜9のいずれか1項に記載の金属表面処理剤。   The metal surface treatment agent according to any one of claims 7 to 9, wherein the metal a of the metal ion is at least one selected from cobalt, nickel, copper, and tin. 請求項7〜10のいずれか1項に記載の金属表面処理剤中で金属板をカソード電解して金属板表面上に被膜を形成することを特徴とする表面処理金属板の製造方法。   A method for producing a surface-treated metal plate, comprising cathodic electrolyzing a metal plate in the metal surface treatment agent according to any one of claims 7 to 10 to form a film on the surface of the metal plate.
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* Cited by examiner, † Cited by third party
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