JP2008134662A - Planar optical circuit component and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately fix an optical waveguide circuit substrate or a substrate-attached optical component on a holding substrate through an adhesive. <P>SOLUTION: The optical waveguide circuit substrate 101 includes a clad 103 which is formed on a planar substrate 104 in a manner surrounding a core 102 and its periphery, bearing a warp by the difference of a thermal expansion coefficient in the planar substrate 104, the core 102, and the clad 103. The holding substrate 120 has an adhesive face 122, and is provided on both ends with a reference face 121 that is higher by one step than the adhesive face 122. The reference face 121 is arranged at two places or at three places forming vertexes of a triangle on the holding substrate 120. The optical waveguide circuit substrate 101 is fixed in close contact with the reference face 121 of the holding substrate 120. A proper amount of adhesive 114 is applied to the adhesive face 122 which is a difference-in-level face situated in a comparatively shallow position in view from the reference face 121 of the holding substrate 120 and then, the adhesive 114 is filled between the optical waveguide circuit substrate 101 and the adhesive face 122, thereby fixing the optical waveguide circuit substrate 101 and the holding substrate 120. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a planar optical circuit component and a method of manufacturing the planar optical circuit component. More specifically, the present invention is applied to the field of optical communication and the like, and is a planar optical circuit component formed by bonding and fixing an optical waveguide circuit substrate or an optical component with a substrate to a holding substrate. And a manufacturing method thereof.

  An optical waveguide comprising a core having a high refractive index on a flat substrate and a clad having a low refractive index surrounding the core, or an optical component with a substrate such as a light receiving element / light emitting element fixed on the substrate is an optical fiber. It is possible to realize a practical and highly functional optical device by connecting to each other or coupling between optical components. As such a practical and highly functional optical device, in order to produce an optical device with low loss, excellent mechanical strength, and high reliability, a fixing structure that stably holds optical components is required. .

  Conventionally, as a method for fixing the optical waveguide, a method of bonding and fixing the optical waveguide to a holding substrate (holder) has been used.

  FIG. 9 is a diagram for explaining a conventional method for fixing an optical waveguide. In FIG. 9, reference numeral 401 denotes an optical waveguide circuit substrate, 414 denotes an adhesive, 450 denotes a bowl-like lower holder, 450a denotes a spacer portion, and 451 denotes an upper portion. Shows the holder.

  This conventional optical waveguide fixing method is an optical circuit for fixing an optical waveguide circuit board 401 having an optical circuit part having a predetermined function and an optical input / output waveguide part to the lower holder 450 and the upper holder 451. The part is placed in a non-contact state with respect to the lower holder 450 and the upper holder 451, and a part of the optical input / output waveguide part is fixed to the lower holder 450 and the upper holder 451 with an adhesive 414. In such a conventional optical waveguide fixing method, since the optical waveguide circuit board 401 can be fixed without applying stress to the optical circuit portion, it is possible to realize an optical circuit component having low loss and high mechanical strength. (For example, refer to Patent Document 1).

JP-A-6-67041

  However, in the conventional optical waveguide fixing method described above, the thickness of the fixing agent (adhesive) for fixing the optical waveguide circuit substrate and the holding substrate is not uniform, and the optical waveguide circuit substrate is tilted or optically guided. There is a portion where the fixing agent hardly intervenes between the circuit board and the holding substrate, and there has been a problem that both of them are peeled off in a reliability test such as a temperature cycle.

  The present invention has been made in view of such problems, and an object of the present invention is to hold an optical waveguide circuit board, an optical component with a substrate including a light receiving element or a light emitting element, and the like through an adhesive. An object of the present invention is to provide a planar optical circuit component having high reliability by fixing an optical waveguide circuit substrate or an optical component with a substrate to a holding substrate with high accuracy by fixing the substrate to the substrate, and a manufacturing method thereof.

  The present invention has been made to achieve such an object, and the invention according to claim 1 is directed to a flat substrate, a core having a high refractive index, and a low formed so as to surround the core. In a planar optical circuit component comprising an optical waveguide circuit substrate having a clad having a refractive index and a holding substrate for fixing the optical waveguide circuit substrate, the optical waveguide circuit substrate includes the planar substrate, the core, The holding substrate has a warp due to a difference in thermal expansion coefficient with the clad, and the holding substrate is divided into a reference surface serving as a contact surface with the optical waveguide circuit substrate, and a plurality of steps separated by at least two steps of different depths The reference surface is disposed at two locations on the holding substrate or at three locations that are the vertices of a triangle, the step surface having a shallow depth with respect to the reference surface, and the step surface Set in the gap with the optical waveguide circuit board The resulting adhesive, and the holding substrate and the optical waveguide circuit board is characterized in that it is bonded and fixed.

  According to a second aspect of the present invention, in the first aspect of the present invention, a heat conductive material is provided on a pedestal provided on a deep stepped surface of the holding substrate.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the light receiving element or the light emitting element disposed at a position facing the core of the optical waveguide circuit substrate, and the light receiving element or the light emitting element. An optical component with a substrate having a fixed substrate for holding an element is provided on the holding substrate.

  According to a fourth aspect of the present invention, in the invention of the third aspect, the holding substrate of the portion on which the optical component with substrate is mounted has a reference surface that is a contact surface with the optical component with substrate, A plurality of stepped surfaces separated by steps having different depths of two or more steps, and provided in a gap between the stepped surface having a shallow depth with respect to the reference surface and the optical component with substrate. The optical component with substrate and the holding substrate are bonded and fixed by an adhesive.

  The invention according to claim 5 is the invention according to claim 4, wherein the reference surface and the adhesive surface are provided on a side wall of the holding substrate.

  According to a sixth aspect of the present invention, in the invention according to any one of the first to fifth aspects, the recess that forms a stepped surface having a deep depth with respect to the reference surface is formed as a relief groove for the adhesive. It is characterized by that.

  According to a seventh aspect of the present invention, there is provided an optical waveguide circuit board comprising: a core having a high refractive index on a flat substrate; and a clad having a low refractive index formed so as to surround the core; In a method of manufacturing a planar optical circuit component including a holding substrate that fixes an optical waveguide circuit substrate, the optical waveguide circuit substrate has a warp due to a difference in thermal expansion coefficient between the planar substrate, the core, and the cladding. In addition, a reference surface serving as a contact surface with the optical waveguide circuit substrate is formed at two locations on the holding substrate or at three apexes of a triangle, and is separated by at least two steps having different depths. Forming a stepped portion having an adhesive surface, which is a plurality of stepped surfaces, filling the gap between the stepped surface having a shallow depth with respect to the reference surface and the optical waveguide circuit substrate, Circuit board and said holding board The characterized by adhesively fixed.

  The invention according to claim 8 is the invention according to claim 7, wherein a pedestal is formed on a deep stepped surface of the holding substrate, and a heat conductive material is provided on the pedestal.

  The invention according to claim 9 is the invention according to claim 7 or 8, wherein the light receiving element or light emitting element disposed at a position facing the core of the optical waveguide circuit substrate, and the light receiving element or An optical component with a substrate having a fixed substrate for holding a light emitting element is formed on the holding substrate.

  According to a tenth aspect of the present invention, in the invention according to the ninth aspect, a reference surface serving as a contact surface with the optical component with substrate is formed on the holding substrate on which the optical component with substrate is mounted. Forming a bonding surface which is a plurality of step surfaces separated by at least two steps of different depths, and bonding to a gap between the step surface having a shallow depth with respect to the reference surface and the optical component with substrate An agent is filled, and the optical component with substrate and the holding substrate are bonded and fixed.

  The invention described in claim 11 is characterized in that, in the invention described in claim 10, the reference surface and the adhesive surface are formed on a side wall of the holding substrate.

  According to a twelfth aspect of the present invention, in the invention according to any one of the seventh to eleventh aspects, a recess that forms a stepped surface having a deep depth with respect to the reference surface is defined as a relief groove of the adhesive. It is characterized by doing.

  With such a configuration, the optical waveguide circuit board and the optical component with the board are fixed so that the uppermost surface is in contact with the reference surface of the plurality of stepped surfaces having different depths provided on the holding substrate. It becomes possible to fix the optical waveguide circuit board and the substrate-mounted optical component with high accuracy. Furthermore, since the step between the reference surface and the adhesive surface is ensured as the thickness of the adhesive, high reliability can be achieved by setting the desired step in consideration of the shrinkage rate during curing of the adhesive and the hardness after curing. It is possible to provide a planar optical circuit component having characteristics.

  As described above, according to the present invention, the holding substrate is a reference surface having a contact surface with the optical waveguide circuit substrate, and a plurality of step surfaces separated by at least two steps of different depths. Since the optical waveguide circuit board and the holding substrate are bonded and fixed by an adhesive provided in a gap between the stepped surface having a shallow depth with respect to the reference portion and the optical waveguide circuit board, the holding substrate has a depth. By having a plurality of reference surfaces, adhesive surfaces, and relief grooves separated by different steps, the optical waveguide circuit board can be held with high accuracy and high reliability can be obtained.

  Further, an optical component with a substrate having a light receiving element or a light emitting element disposed at a position facing the core of the optical waveguide circuit board and a fixed substrate for holding the light receiving element or the light emitting element is fixed in the same manner as the optical waveguide circuit board. Since it is provided on the holding substrate by means, it becomes possible to align the optical axis of the core of the optical waveguide circuit substrate with the center of the light receiving element of the optical component with substrate with an accuracy of 20 μm or less.

Embodiments of the present invention will be described below with reference to the drawings.
[Example 1]
FIGS. 1 to 3 are configuration diagrams for explaining a first embodiment of a planar optical circuit component according to the present invention. FIG. 1 is a configuration diagram before fixing each component component, and FIG. 2 is a diagram after fixing each component component. FIG. 3 is a sectional view thereof. In the figure, 101 is an optical waveguide circuit board, 102 is a core, 103 is a clad, 104 is a flat board, 114 is an adhesive, 120 is a holding board, 121 is a reference plane, 122 is an adhesive face, and 123 is a relief groove for the adhesive. Is shown.

  The planar optical circuit component of the present invention includes a quartz-based optical waveguide circuit substrate 101 and a holding substrate 120. The optical waveguide circuit substrate 101 has a core 102 having a high refractive index on a planar substrate 104, And a clad 103 having a low refractive index formed so as to surround the core 102.

  The holding substrate 120 has a plurality of stepped surfaces 122 that are divided by a plurality of steps having different depths, and is higher than the bonding surface 122 at both ends and is in contact with the optical waveguide circuit substrate 101. A reference surface 121 serving as a surface is provided.

  The optical waveguide circuit substrate 101 is fixed so as to be in close contact with the uppermost surface that becomes the reference surface 121 of the holding substrate 120. In this fixing method, first, an appropriate amount of adhesive 114 is applied to the adhesive surface 122 which is a stepped surface at a relatively shallow position when viewed from the reference surface 121 of the holding substrate 120, and then, the optical waveguide circuit substrate 101. The optical waveguide substrate 101 and the holding substrate 120 are fixed by positioning so that the reference plane 121 and the reference surface 121 are in close contact with each other and curing the adhesive.

  In the first embodiment, even when an elastic adhesive or the like having high viscosity is filled, the thickness of the adhesive layer changes depending on the position and pressure to be suppressed when the optical waveguide circuit board 101 is closely attached to the holding substrate 120. In order to stably fix the optical waveguide circuit board 101, the recesses constituting the deep stepped surface are formed as escape grooves 123 through which excess adhesive escapes.

  Further, by holding the optical waveguide circuit substrate 101 so as to be in contact with the reference surface 121 of the holding substrate 120, the applied adhesive 114 is desired between the optical waveguide circuit substrate 101 and the bonding surface 122 of the holding substrate 120. The adhesive layer is formed. Here, by making the area (width) of the reference surface 121 relatively small, the adhesive 114 remaining on the reference surface 121 is reduced as much as possible, and the optical waveguide circuit substrate 101 is stably fixed on the holding substrate 120. Can do.

  In the first embodiment, the width d1 of the reference surface 121 is 1 mm. However, if the width d1 is 10 mm or less, it is confirmed that the same effect as the first embodiment is obtained. Further, since the adhesive layer can be segmented by forming a plurality of relief grooves 123 of the adhesive 114, the optical waveguide circuit substrate 101 can be brought into close contact with the reference surface 121 of the holding substrate 120 with a small suppression pressure, and Since the change of the adhesive layer when the adhesive 114 is cured is small, the optical waveguide circuit board 101 can be fixed at a desired height.

  If the thickness of the adhesive layer for fixing the optical waveguide circuit substrate 101 to the holding substrate 120 is too thin, sufficient adhesive force cannot be obtained, and if it is too thick, the shrinkage width at the time of curing increases, and stress is applied to the optical waveguide circuit substrate 101. Therefore, it is necessary to control the thickness of the adhesive layer appropriately. Here, by controlling the adhesive layer in consideration of the shrinkage rate of the adhesive 114, there is an effect of bringing the optical waveguide circuit substrate 101 and the holding substrate 120 into close contact when the adhesive 114 contracts.

  In Example 1, since an adhesive having a shrinkage rate of several percent was used, the step d2 between the reference surface 121 and the adhesive surface 122 was set to 0.03 mm as shown in FIG. Further, the step d3 of the escape groove 123 was set to 0.5 mm. Generally, since the shrinkage rate of the adhesive is about several percent, it is desirable to set the step between the reference surface 121 and the adhesive surface 122 to 0.1 mm or less.

  In the first embodiment, the holding substrate 120 is manufactured by cutting an aluminum plate by machining, and is fixed with an elastic adhesive so that the optical waveguide circuit substrate 101 has a height of 0.01 mm or less with respect to the holding substrate 120. It was confirmed that it can be fixed with high accuracy. Furthermore, it was confirmed that there was no deterioration such as peeling after the temperature cycle test (from −40 ° C. to 75 ° C., 100 cycles).

  In the first embodiment, aluminum is used as the material of the holding substrate 120. However, the same effect can be obtained even when other metals or non-metals such as plastic and ceramic are used. Further, although machining is used as a means for forming a surface having a step, it can be produced with high accuracy by molding.

[Example 2]
4 and 5 are configuration diagrams for explaining a second embodiment of the planar optical circuit component according to the present invention. FIG. 4 is a configuration diagram before fixing each component component, and FIG. 5 is a diagram after fixing each component component. It is the figure which attached the planar optical circuit component of this to the temperature control apparatus. In the figure, 201 is an optical waveguide circuit substrate, 202 is a core, 203 is a clad, 204 is a flat substrate (silicon substrate), 205 is a slab waveguide, 206 is an arrayed waveguide, 213 is a thermally conductive agent, and 214 is an adhesive. , 220 is a holding substrate, 221 is a reference surface, 222 is an adhesive surface, 223 is an adhesive relief groove, 224 is a base, 231 is a heat sink, and 232 is a Peltier element.

  The planar optical circuit component of Example 2 is composed of an optical waveguide circuit substrate 201 and a holding substrate 220. The optical waveguide circuit substrate 201 is made of quartz glass having a high refractive index on the planar substrate 204. A core 202 and a clad 203 having a low refractive index formed so as to surround the core 202 are provided.

  In general, the optical waveguide circuit substrate 201 made of such a composite material has a slight curvature warpage due to the difference in thermal expansion coefficient between the silicon substrate 204 and the glass forming the optical waveguide. The warp of the optical waveguide circuit board 201 does not have a constant curvature throughout the board, and the curvature differs depending on the location. Therefore, when the optical waveguide circuit board 201 is supported by one large surface or four points, it is difficult to rattle and fix it stably. In view of this, the holding substrate 220 of the second embodiment is configured to provide three protruding reference surfaces as the reference surface 221 so that the optical waveguide circuit substrate 201 can be stably supported.

  The optical waveguide circuit board 201 is formed with an arrayed waveguide grating composed of two slab waveguides 205 and a plurality of arrayed waveguides 206 connecting between them as a functional circuit. This arrayed waveguide grating can split or multiplex incident light for each wavelength by controlling the optical path difference of light propagating through the arrayed waveguide 205 with high accuracy. It is a functional circuit. Therefore, it is necessary to adjust the temperature of the arrayed waveguide grating using the Peltier element 232 or the like so that the wavelength division wavelength characteristic does not change due to a change in environmental temperature.

  Further, it is necessary to fix the optical waveguide circuit board 201 so that no stress is applied when the optical waveguide circuit board 201 is fixed to the holding board 220. Therefore, when the optical waveguide circuit substrate 201 is fixed on the holding substrate 220, the pedestal 224 is provided immediately below the arrayed waveguide 206, that is, the pedestal 224 is provided on the deep stepped surface, and the thermal conductive agent 213 is provided on the pedestal 224. The thermal connection between the holding substrate 220 and the optical waveguide circuit substrate 201 was realized.

  The height of the pedestal 224 was prepared so that the gap between the optical waveguide circuit substrate 201 and the pedestal 224 was 0.1 mm in consideration of the warpage amount of the reference surface 221 of the holding substrate 220 and the optical waveguide circuit substrate 201. Further, the pedestal 224 is raised so as to be surrounded by the escape groove 223 so that the excess heat conductive agent 213 flows into the escape groove 223 when the amount of the applied thermal conductive agent 213 is large. Since the escape groove 223 is not completely filled with an adhesive or a heat conductive agent, the stress on the substrate can be reduced compared with a case where the entire surface of the optical waveguide circuit board 201 is fixed with an adhesive or a heat conductive agent. is there.

  The optical waveguide circuit board 201 and the holding board 220 are applied with a thermal conductive agent and an adhesive on the pedestal 224 and the bonding surface 222, respectively, and then are provided with three protrusion-like standards provided on the optical waveguide circuit board 201 and the holding board 220. It was fixed so that the surface was in close contact. In order to confirm the effectiveness of the planar optical circuit component of the second embodiment, it is fixed so that the back surface of the holding substrate 220 manufactured on the Peltier element 232 fixed on the heat sink 231 is in contact, and is demultiplexed with respect to the environmental temperature. The wavelength characteristics were evaluated.

  As a result, it was confirmed that the temperature change of the optical waveguide circuit board 201 can be maintained at 0.1 degrees or less by driving the Peltier element 232 at an environmental temperature of 20 to 60 degrees. It has also been confirmed that there is no deterioration in characteristics when the optical waveguide circuit board 201 is bonded and fixed to the holding board 220. In addition, the size of the protrusion-shaped reference surface used in Example 2 was 1 mm in width, 2 mm in length, and 0.03 mm in height.

[Example 3]
FIGS. 6 to 8 are structural views for explaining a third embodiment of the planar optical circuit component according to the present invention. FIG. 6 is a structural diagram before fixing each component component, and FIG. 7 is a diagram after fixing each component component. FIG. 8 is a side view of the component parts after fixing.

  In the figure, reference numeral 301 denotes an optical waveguide circuit substrate, 302 a core, 303 a clad, 304 a planar substrate, 314 an adhesive, 320 a holding substrate, 321 a first reference surface, 322 a first adhesive surface, 323 Is the first adhesive relief groove, 324 is the second reference surface, 325 is the second adhesive surface, 326 is the second adhesive relief groove, 330 is the optical component with substrate, 331 is the light receiving element, 332 Is a fixed substrate of the light receiving element, 341 is a third reference surface, 342 is a third adhesive surface, 343 is a third adhesive relief groove, 344 is a fourth reference surface, 345 is a fourth adhesive surface, Reference numeral 346 denotes a fourth adhesive escape groove, 347 denotes a fifth reference surface, 348 denotes a fifth adhesive surface, and 349 denotes a fifth adhesive escape groove.

  The planar optical circuit component according to the third embodiment includes a quartz-based optical waveguide circuit substrate 301, a substrate-mounted optical component 330 including a light receiving element 331 fixed to a fixed substrate 332, and a holding substrate 320. . The optical waveguide circuit substrate 301 includes a core 302 having a high refractive index and a clad 303 having a low refractive index formed so as to surround the core 302 on a flat substrate 304.

  The holding substrate 320 has an adhesive surface that is a plurality of step surfaces separated by a plurality of steps having different depths at a portion in contact with the bottom surface and the side surface of the optical waveguide circuit substrate 301 or the optical component 330 with a substrate. In the first and second reference surfaces 321 and 324 and the third and fourth reference surfaces 341 and 344, the optical axis of the core 302 of the optical waveguide circuit substrate 301 is centered on the light receiving element 331 of the optical component 330 with substrate. It was produced by controlling the relative heights in the y and z directions with high precision so as to match.

  The position of the optical waveguide circuit board 301 in the x direction is based on the side surface of the step forming the second reference surface 324, and the optical component with substrate 330 is supported using the fifth reference surface 347. The optical waveguide circuit board 301, the substrate-equipped optical component 330, and the holding board 320 are fixed via an adhesive 314 applied to the respective adhesive surfaces 322, 324, 342, 344, and 348. The excessively applied adhesive 314 flows into the escape grooves 323, 326, 343, and 346, thereby fixing the optical waveguide circuit board 301 and the optical component 330 with the board at desired positions.

  The planar optical circuit component of the third embodiment makes it possible to match the optical axis of the core 302 of the optical waveguide circuit substrate 301 and the center of the light receiving element 331 of the optical component 330 with substrate with an accuracy of 20 μm or less. The thickness of the adhesive layer was controlled by setting the step between each reference surface and the adhesive surface to 0.03 mm. It was confirmed that the manufactured planar optical circuit component was not deteriorated in the temperature cycle test.

It is a block diagram for demonstrating Example 1 of the planar optical circuit component which concerns on this invention. It is a block diagram after fixation of each component. It is sectional drawing after fixation of each element component. It is a block diagram for demonstrating Example 2 of the planar optical circuit component which concerns on this invention. It is the figure which attached the planar optical circuit component after fixing each element component to the temperature control apparatus. It is a structural diagram for explaining Example 3 of the planar optical circuit component according to the present invention. It is a top view after fixation of each element component. It is a side view after fixation of each component part. It is a figure for demonstrating the fixing method of the conventional optical waveguide.

Explanation of symbols

101, 201, 301 Optical waveguide circuit substrate 102, 202, 302 Core 103, 203, 303 Clad 104, 204, 304 Planar substrate 114, 214, 314 Adhesive 120, 220, 320 Holding substrate 121, 221 Reference surface 122, 222 Adhesive surfaces 123 and 223 Adhesive clearance groove 205 Slab waveguide 206 Array waveguide 213 Thermal conductive agent 224 Base 231 Heat sink 232 Peltier element 321 First reference surface 322 First adhesive surface 323 First adhesive surface Relief groove 324 Second reference surface 325 Second adhesive surface 326 Second adhesive relief groove 330 Optical component 331 with substrate Light receiving element 332 Fixed substrate 341 of light receiving element Third reference surface 342 Third adhesive surface 343 Third adhesive clearance groove 344 Fourth reference surface 345 Fourth adhesive surface 346 Fourth adhesive clearance groove 3 7 a fifth reference surface 348 fifth adhesive surface 349 fifth adhesive escape groove 401 optical waveguide board 414 glue 450 trough-shaped lower holder 450a spacer portion 451 the upper holder of

Claims (12)

An optical waveguide circuit board comprising a core having a high refractive index on a flat substrate, a clad having a low refractive index formed so as to surround the core, and a holding substrate for fixing the optical waveguide circuit board In the configured planar optical circuit component,
The optical waveguide circuit substrate has a warp due to a difference in thermal expansion coefficient between the planar substrate and the core and the clad,
The holding substrate includes a reference surface serving as a contact surface with the optical waveguide circuit substrate, and an adhesive surface that is a plurality of step surfaces separated by steps having different depths of at least two steps.
The reference planes are arranged at two locations on the holding substrate or at three locations that are the vertices of a triangle,
The optical waveguide circuit substrate and the holding substrate are bonded and fixed by an adhesive provided in a gap between the step surface having a shallow depth with respect to the reference surface and the optical waveguide circuit substrate. Planar optical circuit components.   The planar optical circuit component according to claim 1, wherein a heat conductive material is provided on a pedestal provided on a deep step surface of the holding substrate.   An optical component with a substrate having a light receiving element or a light emitting element disposed at a position facing the core of the optical waveguide circuit substrate and a fixed substrate for holding the light receiving element or the light emitting element is provided on the holding substrate. The planar optical circuit component according to claim 1 or 2, wherein The holding substrate of the portion on which the optical component with substrate is mounted is
A reference surface serving as a contact surface with the optical component with substrate, and an adhesive surface that is a plurality of step surfaces separated by steps having different depths of at least two steps or more,
The optical component with substrate and the holding substrate are bonded and fixed by an adhesive provided in a gap between the step surface having a shallow depth with respect to the reference surface and the optical component with substrate. The planar optical circuit component according to claim 3.   The planar optical circuit component according to claim 4, wherein the reference surface and the adhesive surface are provided on a side wall of the holding substrate.   6. The planar optical circuit component according to claim 1, wherein a concave portion forming a step surface having a deep depth with respect to the reference surface is a relief groove for the adhesive. An optical waveguide circuit board comprising a core having a high refractive index on a flat substrate, a clad having a low refractive index formed so as to surround the core, and a holding substrate for fixing the optical waveguide circuit board In a method for producing a configured planar optical circuit component,
The optical waveguide circuit substrate has a warp due to a difference in thermal expansion coefficient between the planar substrate and the core and the clad,
A reference plane serving as a contact surface with the optical waveguide circuit substrate is formed at two locations on the holding substrate or at three apexes of a triangle, and is separated by at least two steps of different depths. Forming a stepped portion having an adhesive surface which is a plurality of stepped surfaces;
Planar light characterized in that an adhesive is filled in a gap between the stepped surface having a shallow depth with respect to the reference surface and the optical waveguide circuit substrate, and the optical waveguide circuit substrate and the holding substrate are bonded and fixed. Circuit component manufacturing method.   The method for producing a planar optical circuit component according to claim 7, wherein a pedestal is formed on a deep stepped surface of the holding substrate, and a heat conductive material is provided on the pedestal.   An optical component with a substrate having a light receiving element or a light emitting element disposed at a position facing the core of the optical waveguide circuit substrate and a fixed substrate for holding the light receiving element or the light emitting element is formed on the holding substrate. A method for producing a planar optical circuit component according to claim 7 or 8, wherein: The holding substrate on which the optical component with substrate is mounted has a reference surface that is a contact surface with the optical component with substrate, and a plurality of step surfaces separated by at least two steps of different depths. Form a bonding surface,
The adhesive between the optical component with substrate and the holding substrate is bonded and fixed by filling an adhesive into a gap between the step surface having a shallow depth with respect to the reference surface and the optical component with substrate. 2. A method for producing a planar optical circuit component according to 1.   The method for producing a planar optical circuit component according to claim 10, wherein the reference surface and the adhesive surface are formed on a side wall of the holding substrate.   The method for producing a planar optical circuit component according to claim 7, wherein a concave portion forming a step surface having a deep depth with respect to the reference surface is used as a relief groove for the adhesive.

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