JP2008134073A - Inspection unit, display device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress wear of an inspection unit 20 due to an inspection. <P>SOLUTION: The inspection unit 30 comprises: a substrate member 22; a plurality of inspection elements 31 projected and formed in an element area 24 disposed in the substrate member 22 so as to be in contact with a plurality of inspection pads 19 respectively in inspection; and a dummy inspection element 41 projected and formed outside the element area 24 in the substrate member 22. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an inspection unit, a display device, and a manufacturing method thereof.

  In recent years, there has been a strong demand for display panels that can display higher-quality images. However, as display becomes more detailed, it is difficult to completely prevent the occurrence of display defects (including display defects) due to, for example, disconnection of wiring. Therefore, in order to detect a display defect, an inspection process is performed in the manufacturing process of the display panel (see, for example, Patent Document 1).

  This inspection process will be described by taking a liquid crystal display device as an example. A liquid crystal display device includes a TFT substrate on which a plurality of TFTs (thin film transistors) are arranged in a matrix, and a counter substrate on which a common electrode, a color filter, and the like are formed, and the TFT substrate is opposed to the TFT substrate. A liquid crystal layer is sealed between the substrate and the counter substrate by a sealing material.

  On the TFT substrate, a mounting area on which an IC chip or the like is mounted is provided in an area that does not overlap the counter substrate. In the mounting region, a plurality of lead lines are drawn out from the gate lines and source lines connected to each TFT, and pads serving as terminals are formed in the middle or at the ends.

  As shown in FIG. 8 which is an enlarged cross-sectional view, a mounting region 102 of the TFT substrate 101 has a plurality of pads (not shown) to which bumps such as IC chips are electrically connected, and a display defect is inspected. The plurality of test pads 103 are formed at predetermined intervals. The interval between adjacent test pads 103 is a fine pitch of about 30 μm, for example.

On the other hand, the inspection probe 104 included in the inspection unit is formed of, for example, an FPC (flexible printed circuit board) and includes a plurality of inspection elements 105. Then, the inspection probe 104 is brought close to the TFT substrate 101 and each inspection element 105 is brought into contact with each inspection pad 103. At this time, pressure was applied between the test element 105 and the test pad 103 by pressing the surface of the back side of the test probe 104 (that is, the side opposite to the test element 105) through an elastic member such as a rubber plate. Contact in condition. As a result, the presence or absence of display defects is inspected.
JP-A-4-58131

  The stress applied to the inspection probe is distributed and uniformly applied to the plurality of inspection elements in the central region of the element region where the plurality of inspection elements are formed. As a result, stress is applied to the inspection element in a direction that faces the inspection pad of the TFT substrate.

  On the other hand, since the applied stress is difficult to be uniformly distributed in the end region of the element region, stress is easily applied to the test element in a direction different from the direction facing the test pad. As a result, there is a problem that in the end region of the element region, the inspection element is worn by deformation or wear, and it is difficult to reliably inspect.

  The present invention has been made in view of such various points, and an object thereof is to suppress wear associated with the inspection of the inspection unit.

  To achieve the above object, an inspection unit according to the present invention is an inspection unit for inspecting an apparatus including a substrate on which a plurality of inspection pads are formed, and includes a substrate member and the plurality of inspections at the time of inspection. A plurality of inspection elements formed so as to protrude from an element region provided on the substrate member so as to come into contact with the pads, and dummy inspection elements formed so as to protrude outside the element region on the substrate member. ing.

  On the substrate, a dummy test pad that contacts the dummy test element in a state where the test element is in contact with the test pad at the time of testing is formed outside the test pad region where the plurality of test pads are formed. It is preferable.

  The said board | substrate member may be comprised by the flexible printed circuit board.

  At least one of the apparatus including the substrate and the substrate member may have flexibility.

  It is preferable that the dummy inspection element protrudes from the substrate member at the same height as the inspection element.

  A life detection pad is formed around the dummy inspection pad on the substrate, and the life detection element is in contact with the dummy inspection pad and the dummy inspection element on the substrate member. Preferably, it is formed so as to face the pad for use.

  The display device according to the present invention includes a first substrate, a second substrate disposed to face the first substrate, a display medium layer provided between the first substrate and the second substrate, The first substrate is provided with a display region in which a circuit unit for controlling the display medium layer is formed, and is provided outside the display region and connected to the circuit unit. A dummy test pad that is not connected to the circuit portion is formed outside the test pad region on the first substrate.

  It is preferable to be configured to be inspected by an inspection unit that has a plurality of inspection elements that protrude from the substrate member and that respectively contact the plurality of inspection pads.

  The inspection unit preferably includes a dummy inspection element that contacts the dummy inspection pad during inspection.

  It is preferable that the dummy test pad protrudes higher than the test pad on the first substrate.

  The dummy inspection pad is preferably made of resin.

  The said board | substrate member may be comprised by the flexible printed circuit board.

  At least one of the apparatus including the substrate and the substrate member may have flexibility.

  The inspection unit has a life detection element formed around the dummy inspection element, and the first substrate has a life detection pad in a state where the dummy inspection element and the dummy inspection pad are in contact with each other. It is preferably formed so as to face the life detection element.

  The display device manufacturing method according to the present invention includes a first substrate, a second substrate disposed to face the first substrate, and a display provided between the first substrate and the second substrate. And a plurality of test pads connected to the circuit unit, wherein the circuit unit for controlling the display medium layer is formed in the display area of the first substrate. A test pad forming process for forming a test pad area outside the display area, and a test process for testing a device including the first substrate by a test unit in which a plurality of test elements protrude from the substrate member. In the inspection step, the inspection element and the inspection pad are brought into contact in a state where a spacer portion is interposed between the first substrate and the substrate member outside the inspection pad region.

  The height of the spacer part is preferably higher than the sum of the height of the test element and the height of the test pad.

  A dummy test pad forming step of forming a dummy test pad not connected to the circuit portion outside the test pad region on the first substrate, wherein the test step includes a dummy test element formed on the test unit; Preferably, the spacer portion is formed by the dummy inspection pad brought into contact with the dummy inspection element.

  It is preferable that the dummy test pad protrudes higher than the test pad on the first substrate.

  The dummy inspection pad is preferably made of resin.

  The said board | substrate member may be comprised by the flexible printed circuit board.

  At least one of the apparatus including the substrate and the substrate member may have flexibility.

  In the inspection unit, a life detection element is formed around the dummy inspection element, and the life detection pad is in contact with the dummy inspection element and the dummy inspection pad with respect to the first substrate. Including a life detection pad forming step that is formed so as to face the life detection element. In the detection step, the inspection unit depends on whether the life detection pad and the life detection element are in contact with each other. You may make it detect the lifetime of.

-Action-
Next, the operation of the present invention will be described.

  When inspecting a device including a substrate on which a plurality of inspection pads are formed, the inspection unit is brought close to the substrate and each inspection element of the inspection unit is brought into contact with each inspection pad of the substrate. At that time, in the center of the element region in the inspection unit, the applied stress is distributed between the adjacent inspection elements. Therefore, the inspection element has a uniform stress straight in the direction in which the substrate member and the substrate face each other. Join.

  On the other hand, at the end of the element region, the stress is dispersed by the inspection element in the element region and the dummy inspection element outside the element region. In other words, since the dummy inspection elements are formed so as to protrude outside the element region, the uniform stress is applied straightly in the direction in which the substrate member and the substrate face each other. It becomes. As a result, it is possible to reliably perform inspection by suppressing wear due to deformation or wear of the inspection element at the end of the element region.

  Further, when the dummy test pad is formed outside the test pad region, the dummy test element comes into contact with the dummy test pad while the test element is in contact with the test pad during the test.

  When the board member is formed of a flexible printed board, the stress applied to each inspection element can be made uniform in the element region. Similarly, when at least one of the apparatus including the substrate and the substrate member has flexibility, the stress applied to each inspection element is made uniform.

  If the dummy inspection element protrudes from the substrate member at the same height as the inspection element, the dummy inspection element can be easily formed by the same process as the inspection element.

  Further, the life detection pad is formed around the dummy inspection pad, and the life inspection element is formed on the substrate member so as to face the life detection pad in a state where the dummy inspection pad and the dummy inspection element are in contact with each other. For example, the life of the inspection unit is detected depending on whether or not the life detecting element and the life detecting pad are in contact with each other.

  That is, when the life of the inspection unit still remains, since the dummy inspection element is less worn, the life detection element and the life detection pad are in contact with the dummy inspection element and the dummy inspection pad. Do not touch each other. On the other hand, when the life of the inspection unit is exhausted, the wear of the dummy inspection element is large, so that the life detection element and the life detection pad are in contact with each other with the dummy inspection element and the dummy inspection pad in contact with each other. Will be. This makes it possible to detect the life of the inspection unit.

  In addition, if a dummy test pad is formed outside the test pad area on the first substrate of the display device, when the test unit is brought into contact with the test pad, the end of the test pad area also becomes the test unit. The applied stress can be dispersed by the dummy inspection pad. As a result, it is possible to suppress the wear of the inspection unit and perform the inspection reliably.

  When the inspection unit includes a plurality of inspection elements, each inspection element contacts each inspection pad during inspection. Furthermore, if the inspection unit has a dummy inspection element, the dummy inspection element can be brought into contact with the dummy inspection pad during inspection. In particular, it is preferable that the dummy test pad protrudes higher than the test pad because it is possible to further suppress the wear of the test pad at the end of the test pad region and the test element of the test unit.

  If the inspection unit has a life detection element and the first substrate has a life detection pad, the inspection is performed according to whether the life detection element and the life detection pad are in contact with each other, as described above. The life of the unit is detected.

  When manufacturing a display device, first, in a test pad forming process, a plurality of test pads are formed in a test pad area outside the display area. Subsequently, in the inspection process, the apparatus including the first substrate is inspected by the inspection unit. In this inspection process, the inspection element and the inspection pad are brought into contact with each other with the spacer portion interposed between the first substrate and the substrate member of the inspection unit outside the inspection pad region.

  That is, in the inspection pad region, the inspection pad and the inspection element are in contact with each other, and the device including the first substrate is inspected. On the other hand, since the spacer portion is interposed between the substrate member of the inspection unit and the first substrate outside the inspection pad region, the stress applied to each inspection element can be made uniform at the end portion of the inspection pad region. It becomes. As a result, since the wear of the inspection element is suppressed, it is possible to manufacture the display device by reliably inspecting the device including the first substrate.

  The height of the spacer portion is preferably higher than the sum of the height of the test element and the height of the test pad from the viewpoint of suppressing wear of the test element.

  In the display device manufacturing method, a dummy test pad is formed outside the test pad region, and in the test process, the dummy test pad and the dummy test element are brought into contact with each other to form a spacer portion. It is possible. In particular, it is preferable that the dummy test pad protrudes higher than the test pad because the test pad at the end of the test pad region and the test element of the test unit can be further suppressed.

  Furthermore, when performing the life detection pad forming step in the manufacturing method of the display device, the life detection pad is formed on the first substrate. That is, the life detection pad is formed to face the life detection element in a state where the dummy inspection element and the dummy inspection pad are in contact with each other. Thus, in the detection step, the life of the inspection unit is detected based on whether or not the life detection pad and the life detection element are in contact with each other.

  According to the present invention, since the dummy inspection elements are formed so as to protrude outside the element region of the substrate member of the inspection unit, each inspection element is uniformly formed at the end of the element region as well as the center of the element region. Stress can be applied straight, wear of the inspection element at the end of the element region can be suppressed, and inspection can be performed reliably. Moreover, since the wear of the inspection element is suppressed, the life of the inspection unit can be improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiment.

Embodiment 1 of the Invention
1 to 3 show Embodiment 1 of the present invention. FIG. 2 is a plan view schematically showing the appearance of the liquid crystal display device 1. FIG. 1 is an enlarged plan view showing a mounting area 10 of the liquid crystal display device 1. FIG. 3 is an enlarged sectional view showing the liquid crystal display device 1 and the inspection unit 20.

  In the first embodiment, a liquid crystal display device 1 will be described as an example of a display device. As shown in FIG. 2, the liquid crystal display device 1 includes a glass substrate 21 that is a first substrate that constitutes the TFT substrate 11, a glass substrate 26 that constitutes a counter substrate 12 that is disposed to face the glass substrate 21, A liquid crystal layer (not shown) that is a display medium layer provided between the glass substrate 21 and the glass substrate 26 is provided. The TFT substrate 11 is configured by patterning a plurality of thin films on a glass substrate 21. Similarly, the counter substrate 12 is configured by patterning a plurality of thin films on the glass substrate 26.

  For example, a color filter, a common electrode, and a black matrix are formed on the glass substrate 26 of the counter substrate 12 although not shown.

  On the other hand, the TFT substrate 11 is configured as a so-called active matrix substrate. As shown in FIG. 2, a glass substrate 21 of the TFT substrate 11 is mounted with a display region 14 in which a circuit unit 13 for controlling a liquid crystal layer is formed, and an IC chip for driving and controlling the circuit unit 13, for example. Mounting area 10. The display area 14 is an area that contributes to display, and is formed in a rectangular area in which the TFT substrate 11 and the counter substrate 12 overlap each other. On the other hand, the counter substrate 12 is formed smaller than the TFT substrate 11, and as shown in FIG. 2, the mounting region 10 is formed in a band-shaped region of the glass substrate 21 that does not overlap the counter substrate 12. . Further, a frame region 15 having a rectangular frame shape is formed around the display region 14 in a region overlapping the glass substrate 26 of the counter substrate 12. The frame area 15 does not contribute to display.

  Although not shown in the figure, a plurality of pixels, which are unit areas for display, are arranged in a matrix on the TFT substrate 11. A plurality of gate wirings (not shown) are formed on the glass substrate 21 of the TFT substrate 11 so as to extend in parallel with each other. Further, a plurality of source wirings (not shown) are formed on the TFT substrate 11 in parallel with each other, and are formed so as to be orthogonal to the gate wiring. As a result, the TFT substrate 11 is formed with a pattern of gate lines and source lines in a grid pattern.

  Each of the pixels is formed by a rectangular region partitioned by the gate wiring and the source wiring. Each pixel has a pixel electrode (not shown) for driving the liquid crystal layer. The pixel electrode is disposed substantially at the center of the pixel and is formed in a rectangular shape.

  Further, although not shown, each pixel is formed with a TFT (Thin-Film Transistor) which is a switching element for switching the pixel electrode. The TFT includes a gate electrode connected to the gate wiring, a source electrode connected to the source wiring, and a drain electrode connected to the pixel electrode. Thus, the signal voltage is supplied from the source wiring to the pixel electrode through the source electrode and the drain electrode in a state where the scanning voltage is applied to the gate electrode through the gate wiring. In other words, the circuit unit 13 includes these TFTs, gate wirings, source wirings, pixel electrodes, and the like.

  In addition, a lead-out wiring 16 is connected to the end portions of the gate wiring and the source wiring in the circuit portion 13 and led out to the mounting region 10 through the frame region 15. That is, as shown in an enlarged view in FIG. 1, in the mounting region 10, for example, a plurality of lead wires 16 are formed in parallel to each other. Each lead-out wiring 16 is formed with a pad 18 to which a bump or the like as an electrode terminal contacts and is electrically connected when an IC chip or the like is mounted. The pads 18 are formed of a metal material and are arranged in two rows, for example, in a staggered manner as shown in FIG.

  Further, an inspection pad 19 for inspection is formed on the leading end side of each lead-out wiring 16. These test pads 19 are also formed of a metal material and arranged in, for example, two rows in a zigzag manner, like the pads 18. That is, the glass substrate 21 of the TFT substrate 11 has an inspection pad region 23 provided outside the display region 14 and having a plurality of inspection pads 19 connected to the circuit unit 13 as shown in FIG. is doing. That is, the plurality of pads 18 are formed in a region between the test pad region 23 and the display region 14. Each pad 18 and the inspection pad 19 are each formed in a hexagonal shape, for example.

  As shown in FIGS. 1 and 3, a dummy test pad 29 not connected to the circuit unit 13 is formed outside the test pad region 23 in the mounting region 10 of the glass substrate 21. A plurality of dummy test pads 29 are preferably arranged so as to be aligned in the direction in which the test pads 19 are arranged (that is, the direction intersecting with the lead-out wiring 16).

  As shown in FIG. 1, the dummy inspection pad 29 is formed in the same hexagonal shape as the inspection pad 19, for example, when viewed from the normal direction of the surface of the TFT substrate 11. On the other hand, as shown in FIG. 3, the dummy inspection pad 29 protrudes higher than the inspection pad 19 on the glass substrate 21. Further, unlike the test pad 19 made of a metal material, the dummy test pad 29 is preferably made of, for example, the same resin as the insulating film formed on the TFT substrate 11.

  As shown in FIG. 3, the liquid crystal display device 1 is configured to be inspected by an inspection unit 20. The inspection unit 20 is for inspecting a device including the glass substrate 21 on which the plurality of inspection pads 19 are formed. In the first embodiment, the liquid crystal display device 1 is turned on to check whether there is a display defect. Inspected.

  The inspection unit 20 includes a substrate member 22 and a plurality of inspection elements 31 and dummy inspection elements 41 formed on the substrate member 22. Further, although not shown, the inspection unit 20 includes a signal supply unit that supplies an inspection signal from the inspection element 31 to the circuit unit 13.

  The board | substrate member 22 is comprised by the flexible printed circuit board (FPC: flexible printed circuit). Thereby, the inspection unit 20 has flexibility as a whole.

  The plurality of inspection elements 31 are formed so as to protrude from the element region 24 provided on the substrate member 22 so as to come into contact with the plurality of inspection pads 19 at the time of inspection. That is, the element region 24 is a region facing the inspection pad region 23 of the glass substrate 21 at the time of inspection. The plurality of test elements 31 are formed of a metal material and are arranged in a zigzag pattern, for example, so as to correspond to each test pad 19.

  The dummy inspection element 41 is formed so as to protrude outside the element region 24 of the substrate member 22. That is, as shown in FIG. 3, for example, two dummy inspection elements 41 are provided corresponding to the dummy inspection pads 29, and each dummy inspection element 31 is in contact with the inspection pad 19 at the time of inspection. It comes in contact with the pad 29. The dummy inspection element 41 is formed of, for example, the same metal material as the inspection element 31 and protrudes from the substrate member 22 at the same height as the inspection element 31.

  The liquid crystal display device 1 is configured as a transmissive liquid crystal display device, for example. Then, the driving is controlled by an IC chip or the like mounted in the mounting region 10, and light from the backlight unit disposed on the opposite side of the TFT substrate 11 from the counter substrate 12 is selectively transmitted to obtain a desired It is designed to display.

-Manufacturing method-
Next, a method for manufacturing the liquid crystal display device 1 will be described.

  In the first embodiment, after the TFT substrate 11 and the counter substrate 12 are manufactured, the liquid crystal display device 1 is manufactured by bonding them. Thus, an inspection process of the liquid crystal display device 1 is performed before mounting an IC driver or the like which is a drive circuit. Then, after detecting the presence or absence of a display defect, the IC driver or the like is mounted on the liquid crystal display device 1 having no display defect.

  The process of manufacturing the TFT substrate 11 includes a test pad forming process. That is, the circuit portion 13 (that is, TFT, gate wiring, source wiring, etc.) is formed in the display area 14 of the glass substrate 21, and the lead-out wiring 16 is formed in the frame area 15 and the mounting area 10. In the test pad forming process, as shown in FIG. 1, a plurality of test pads 19 connected to the circuit unit 13 are formed in the test pad region 23.

  The inspection pad 19 can be patterned by photolithography or the like at the same time as the lead wiring 16 and the plurality of pads 18. These pads 18 and inspection pads 19 are arranged in a staggered manner, for example, as described above.

  Further, the process of manufacturing the TFT substrate 11 includes a dummy test pad forming process. That is, in the dummy test pad forming step, the dummy test pad 29 that is not connected to the circuit unit 13 is formed outside the test pad region 23 in the mounting region 10. The dummy inspection pad 29 is formed in the same process as the insulating film included in the circuit unit 13 in the display area 14. In other words, the dummy test pad forming step is performed simultaneously with the step of forming the insulating film of the circuit unit 13.

  On the other hand, a dummy inspection element 41 is also formed on the inspection unit 20 so as to correspond to the dummy inspection pad 29 outside the element region 24. The dummy inspection element 41 is formed simultaneously with the inspection element 31 in the process of manufacturing the inspection unit. The dummy inspection element 41 can also be formed of a material different from the inspection element 31 independently.

  Thereafter, an inspection process is performed, and the liquid crystal display device 1 is inspected by the inspection unit 20. In the inspection process, the inspection is performed by bringing the inspection element 31 and the inspection pad 19 into contact with each other with the spacer portion 30 interposed between the glass substrate 21 and the substrate member 22 outside the inspection pad region 23.

  That is, at this time, pressure is applied to the inspection element 31 and the inspection pad 19 by pressing the surface of the inspection unit 20 on the back side (that is, opposite to the inspection element 31) through an elastic member such as a rubber plate. In contact with each other. Then, an inspection signal is supplied to the circuit unit 13 and the liquid crystal display device is turned on to perform the inspection.

  The spacer portion 30 is composed of a dummy inspection element 41 and a dummy inspection pad 29 that are in contact with each other. As shown in FIG. 3, the height of the dummy inspection pad 29 is higher than the height of the inspection pad 19 and the height of the dummy inspection element 41 is the same as the height of the inspection element 31. The height of the portion 30 is higher than the sum of the height of the test element 31 and the height of the test pad 19. At this time, since the board member 22 of the inspection unit 20 is formed of a flexible printed board, the inspection unit 20 is curved outside the element region 24.

-Effect of Embodiment 1-
Therefore, according to the first embodiment, the dummy inspection element 41 is formed outside the element region 24, and the dummy inspection pad 29 is formed outside the inspection pad region 23. The spacer portions 30 can be formed by bringing the dummy inspection pads 29 into contact with each other. That is, in the state where the inspection element 31 and the inspection pad 19 are in contact with each other at the time of inspection, the spacer portion 30 is disposed between the substrate member 22 of the inspection unit 20 and the glass substrate 21 outside the element region 24 and the inspection pad region 23. It can be formed by interposing.

  That is, since the stress applied to press the inspection unit 20 against the glass substrate 21 can be dispersed by the spacer portion 30 outside the element region 24 and the inspection pad region 23, the element region 24 is also formed at the end of the element region 24. As in the center of the liquid crystal display device 1, uniform stress can be applied straightly to each inspection element 31, and wear due to deformation or wear of the inspection element 31 at the end portion of the element region 24 can be suppressed to inspect the liquid crystal display device 1. It can be done reliably. Furthermore, since the wear of the inspection element 31 can be suppressed, the life of the inspection unit 20 can be improved.

  Furthermore, since the board member 22 is formed of a flexible printed board, the stress applied to each inspection element 31 in the element region 24 can be made more uniform.

  Since the dummy inspection element 41 is formed so as to protrude from the substrate member 22 at the same height as the inspection element 31, the dummy inspection element 41 can be easily formed by the same process as the inspection element 31. That is, an extra process for forming the dummy inspection element 41 can be prevented from increasing.

  In addition, since the dummy inspection pad 29 protrudes higher than the inspection pad 19, the dummy inspection element 41 is easily formed, and the height of the spacer portion 30 is set to the height of the inspection element 31 and the inspection pad 19. Thus, the stress can be reliably dispersed to the outside of the element region 24. That is, the wear of the inspection element 31 of the inspection unit 20 can be further suppressed.

  Furthermore, since the dummy inspection pad 29 is formed of resin, it can be formed in the same process with the same material as the insulating film included in the circuit portion 13 when the TFT substrate 11 is manufactured. That is, the dummy inspection pad 29 can be formed without increasing unnecessary processes.

<< Embodiment 2 of the Invention >>
4 to 7 show Embodiment 2 of the present invention. FIG. 4 is an enlarged plan view showing the mounting area 10 of the liquid crystal display device 1. FIG. 5 is an enlarged sectional view showing the liquid crystal display device 1 and the inspection unit 20. 6 and 7 are cross-sectional views showing the spacer portion 30 in an enlarged manner. In the following embodiments, the same portions as those in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The second embodiment is configured such that the life of the inspection unit 20 can be further detected in the first embodiment.

  That is, also in the second embodiment, as shown in FIG. 4, a plurality of dummy inspection pads 29 are formed on the glass substrate 21 at predetermined intervals. A life detection pad 33 is formed around the dummy inspection pad 29 on the glass substrate 21. As shown in FIG. 4, the life detection pad 33 is disposed so as to be sandwiched between, for example, two dummy inspection pads 29. That is, the life detection pad 33 and the dummy inspection pad 29 are arranged in a line. The life detection pad 33 is formed of the same metal material as the inspection pad 19 and is formed on the glass substrate 21 at the same height.

  On the other hand, as shown in FIG. 5, a plurality of dummy inspection elements 41 are formed on the substrate member 22 of the inspection unit 20 in the same manner as in the first embodiment. Around the dummy inspection element 41, a life detection element 34 is formed so as to protrude on the substrate member 22.

  The dummy inspection elements 41 are disposed corresponding to the dummy inspection pads 29, and the life detection elements 34 are disposed corresponding to the life detection pads 33. Therefore, the life detection element 34 is arranged between the two dummy inspection elements 41, and the life detection elements 34 and the dummy inspection elements 41 are arranged in a line.

  Then, as shown in an enlarged view in FIG. 6, the life detection element 34 is opposed to the life detection pad 33 without being in contact with the dummy inspection pad 29 and the dummy inspection element 41. Is formed. In other words, the life detection pad 33 is formed to face the life detection element 34 in a state where the dummy inspection element 41 and the dummy inspection pad 29 are in contact with each other.

  The life detection pad 33 and the life detection element 34 are electrically connected to a life detection unit (not shown). Then, as shown in an enlarged view in FIG. 7, when the dummy inspection element 41 is worn and the life of the inspection unit 20 is exhausted, the life detection pad 33 and the life detection element 34 come into contact with each other. It has become. As a result, the conduction state between the life detection pad 33 and the life detection element 34 is detected by the life detection unit.

-Manufacturing method-
Next, a manufacturing method of the liquid crystal display device 1 of Embodiment 2 will be described.

  Also in the second embodiment, as in the first embodiment, after the TFT substrate 11 and the counter substrate 12 are manufactured, the liquid crystal display device 1 is manufactured by bonding them, and the liquid crystal display device 1 is mounted before the C driver is mounted. The inspection process of the display device 1 is performed. In the inspection process, the life of the inspection unit 20 is also detected.

  That is, in the process of manufacturing the TFT substrate 11, in addition to performing the test pad forming process and the dummy test pad forming process as in the first embodiment, the second embodiment performs the life detection pad forming process.

  In the lifetime detection pad forming step, the lifetime detection pad 33 is formed on the glass substrate 21 so as to face the lifetime detection element 34 in a state where the dummy inspection element 41 and the dummy inspection pad 29 are in contact with each other. The life detection pad 33 is formed in the same process as the inspection pad 19. Then, the life detection pad 33 is disposed so as to be sandwiched between, for example, two dummy inspection pads 29.

  On the other hand, for the inspection unit 20, the dummy inspection element 41 is formed so as to correspond to the dummy inspection pad 29 outside the element region, and the life detection element 34 is corresponding to the life detection pad 33. Is formed. The life detection element 34 and the dummy inspection element 41 are formed simultaneously with the inspection element 31 in the process of manufacturing the inspection unit.

  Thereafter, an inspection process is performed, and the liquid crystal display device 1 is inspected by the inspection unit 20. In the inspection process, as in the first embodiment, the inspection element 31 and the inspection pad 19 are brought into contact with each other for inspection. At this time, as shown in FIG. 6, the dummy inspection element 41 and the dummy inspection pad 29 are in contact with each other outside the element region 24 and the inspection pad region 23. Thus, the stress applied to the inspection unit 20 is dispersed and uniformized not only in each inspection element 31 in the element region 24 but also in the dummy inspection element 41.

  In this inspection step, the life of the inspection unit 20 is detected based on whether or not the life detection pad 33 and the life detection element 34 are in contact with each other.

  That is, when the life of the inspection unit 20 still remains, as shown in FIG. 6, since the dummy inspection element 41 is less worn, the dummy inspection element 41 and the dummy inspection pad 29 come into contact with each other and the spacer portion In the state where 30 is configured, the life detection element 34 and the life detection pad 33 are not opposed to each other and do not contact each other. Therefore, since there is no conduction between the life detection element 34 and the life detection pad 33, the life detection unit (not shown) detects that the life of the inspection unit 20 still remains.

  By the way, when the inspection unit 20 is repeatedly used for inspection, as shown in FIG. 7, the dummy inspection element 41 is worn and the inspection unit 20 reaches the end of its life. As a result, since the height of the dummy inspection element 41 (projection length from the substrate member 22) is reduced, the life detection element 34 of the inspection unit 20 contacts the life detection pad 33 of the glass substrate 21. It becomes.

  As a result, when the life of the inspection unit 20 is exhausted, as shown in FIG. 7, the wear of the dummy inspection element 41 is large. The element for use and the life detection pad come into contact with each other. This makes it possible to detect the life of the inspection unit. The life detecting element 34 and the life detecting pad 33 are electrically connected to each other, and it is detected that the life of the inspection unit 20 is exhausted in the life detecting unit.

  When it is detected that the life of the inspection unit 20 has been exhausted, the liquid crystal display device 1 is again inspected by the new inspection unit 20.

-Effect of Embodiment 2-
Therefore, according to the second embodiment, since the dummy test element 41 and the dummy test pad 29 are provided, the same effects as those of the first embodiment can be obtained. In addition, the life of the inspection unit 20 can be detected based on whether or not the life detection element 34 and the life detection pad 33 are in contact with each other.

  That is, in addition to suppressing wear of the inspection element 31 at the end of the element region 24, the life of the inspection unit 20 can be reliably detected. Accordingly, the liquid crystal display device 1 can be accurately inspected by replacing the inspection unit 20 with a new one at an appropriate time.

  Furthermore, the life detection element 34 can be formed in the same process as the test element 31, and the life detection pad 33 can be formed in the same process as the test pad 19. That is, the life detection pad 33 and the life detection element 34 can be formed without increasing new processes.

<< Other Embodiments >>
In the said Embodiment 1 and 2, although the board | substrate member 22 was comprised with the flexible printed circuit board and the test | inspection unit 20 had flexibility, this invention is not limited to this, The apparatus containing the board | substrate which is test object And at least one of the board | substrate member 22 should just have flexibility. Therefore, for example, the TFT substrate 11 may be constituted by, for example, a flexible plastic substrate instead of the glass substrate 21. Further, in this case, the substrate member 22 of the inspection unit 20 may be made of a relatively hard material.

  As a result, even if the height of the spacer portion 30 composed of the dummy test pad 29 and the dummy test element 41 is higher than the total height of the test pad 19 and the test element 31, these test pads 19 and The dummy inspection pad 29 and the dummy inspection element 41 can be easily brought into contact with each other with the inspection elements 31 in contact with each other, and the stress applied to each inspection element 31 can be appropriately dispersed.

  In the first embodiment, the spacer 30 is configured by the dummy inspection pad 29 and the dummy inspection element 41. However, the present invention is not limited to this. That is, the spacer portion 30 may be configured by at least one of the dummy inspection pad 29 and the dummy inspection element 41. As a result, the stress applied to the inspection unit 20 is dispersed by the dummy inspection pad 29 or the dummy inspection element 41 interposed between the substrate member 22 and the glass substrate 21, thereby suppressing the wear of each inspection element 31. Thus, the inspection can be performed reliably.

  In the first and second embodiments, the lighting inspection after the TFT substrate 11 and the counter substrate 12 are bonded to each other has been described. However, the present invention is not limited to this. That is, the inspection unit 20 can be configured to inspect the TFT substrate 11 before being bonded to the counter substrate 12. In this case, the inspection unit 20 can detect an output signal from the circuit unit 13 after supplying the inspection signal to the circuit unit 13 to detect a defective state of the circuit unit 13 (for example, disconnection of the gate wiring or the like). .

  In the first and second embodiments, the liquid crystal display device has been described as an example. However, the present invention is not limited to this, and other display devices such as an organic EL display device, wirings, and elements are formed. The same applies to an apparatus having a substrate.

  As described above, the present invention is useful for an inspection unit, a display device, and a manufacturing method thereof, and is particularly suitable for suppressing wear caused by inspection of an inspection unit.

FIG. 1 is an enlarged plan view illustrating a mounting area of the liquid crystal display device according to the first embodiment. FIG. 2 is a plan view schematically showing the appearance of the liquid crystal display device. FIG. 3 is an enlarged sectional view showing the liquid crystal display device and the inspection unit. FIG. 4 is an enlarged plan view showing a mounting area of the liquid crystal display device according to the second embodiment. FIG. 5 is an enlarged cross-sectional view of the liquid crystal display device and the inspection unit. FIG. 6 is an enlarged sectional view showing the spacer portion. FIG. 7 is an enlarged sectional view showing the spacer portion. FIG. 8 is an enlarged sectional view showing a conventional liquid crystal display device and an inspection unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Liquid crystal display device 10 Mounting area | region 11 TFT substrate 12 Opposite board | substrate 13 Circuit part 14 Display area 15 Frame area 16 Lead-out wiring 18 Pad 19 Inspection pad 20 Inspection unit 21 Glass substrate 22 Substrate member 23 Inspection pad area 24 Element area 29 Dummy inspection pad 30 Spacer 31 Inspection Element 33 Life Detection Pad 34 Life Detection Element 41 Dummy Inspection Element

Claims (22)

An inspection unit for inspecting a device including a substrate on which a plurality of inspection pads are formed,
A substrate member;
A plurality of inspection elements formed so as to protrude from the element region provided on the substrate member so as to come into contact with the plurality of inspection pads at the time of inspection;
An inspection unit comprising: a dummy inspection element formed to protrude outside the element region of the substrate member. In claim 1,
On the substrate, a dummy test pad that contacts the dummy test element in a state where the test element is in contact with the test pad at the time of testing is formed outside the test pad region where the plurality of test pads are formed. Inspection unit characterized by that. In claim 1,
The inspection unit, wherein the substrate member is formed of a flexible printed circuit board. In claim 1,
At least one of the apparatus including the substrate and the substrate member has flexibility. In claim 1,
The inspection unit, wherein the dummy inspection element protrudes from the substrate member at the same height as the inspection element. In claim 2,
On the substrate, a life detection pad is formed around the dummy inspection pad,
An inspection unit in which the life test element is formed on the substrate member so as to face the life detection pad in a state where the dummy test pad and the dummy test element are in contact with each other. A display device comprising: a first substrate; a second substrate disposed opposite to the first substrate; and a display medium layer provided between the first substrate and the second substrate,
The first substrate is provided with a display region in which a circuit unit for controlling the display medium layer is formed, and an inspection in which a plurality of inspection pads connected to the circuit unit are formed outside the display region. And a pad area,
A display device, wherein a dummy test pad that is not connected to the circuit portion is formed outside the test pad region of the first substrate. In claim 7,
A display device configured to be inspected by an inspection unit having a plurality of inspection elements formed to protrude from a substrate member and in contact with the plurality of inspection pads. In claim 8,
The display device, wherein the inspection unit includes a dummy inspection element that contacts the dummy inspection pad during inspection. In claim 7,
The display device according to claim 1, wherein the dummy test pad protrudes higher than the test pad on the first substrate. In claim 7,
The display device, wherein the dummy inspection pad is made of resin. In claim 8,
The display device according to claim 1, wherein the substrate member is formed of a flexible printed circuit board. In claim 8,
At least one of the device including the substrate and the substrate member has flexibility. In claim 9,
In the inspection unit, a life detection element is formed around the dummy inspection element,
The display device according to claim 1, wherein a life detection pad is formed on the first substrate so as to face the life detection element in a state where the dummy inspection element and the dummy inspection pad are in contact with each other. A first substrate; a second substrate disposed opposite to the first substrate; and a display medium layer provided between the first substrate and the second substrate, wherein the display medium layer is controlled. A method for manufacturing a display device having a circuit portion for forming a display area on the first substrate,
A test pad forming step of forming a plurality of test pads connected to the circuit section in a test pad area outside the display area;
Including an inspection step of inspecting an apparatus including the first substrate by an inspection unit formed by projecting a plurality of inspection elements on the substrate member,
In the inspection step, the inspection element and the inspection pad are brought into contact with each other in a state where a spacer portion is interposed between the first substrate and the substrate member outside the inspection pad region. Device manufacturing method. In claim 15,
The method of manufacturing a display device, wherein the height of the spacer portion is higher than the sum of the height of the test element and the height of the test pad. In claim 15,
A dummy test pad forming step of forming a dummy test pad that is not connected to the circuit unit outside the test pad region on the first substrate;
In the inspection step, the spacer portion is formed by a dummy inspection element formed in the inspection unit and the dummy inspection pad in contact with the dummy inspection element. In claim 17,
The method for manufacturing a display device, wherein the dummy test pad protrudes higher than the test pad on the first substrate. In claim 17,
The method for manufacturing a display device, wherein the dummy inspection pad is made of a resin. In claim 15,
The method for manufacturing a display device, wherein the substrate member is formed of a flexible printed circuit board. In claim 15,
At least one of the apparatus including the substrate and the substrate member is flexible. In claim 17,
In the inspection unit, a life detection element is formed around the dummy inspection element,
Including a life detection pad forming step of forming a life detection pad on the first substrate so as to face the life detection element in a state where the dummy inspection element and the dummy inspection pad are in contact with each other;
In the detecting step, the life of the inspection unit is detected based on whether or not the life detecting pad and the life detecting element are in contact with each other.

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