JP2008131442A - Portable radio and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a portable radio by which a shield effect against a radio frequency can be improved without imairing the ease of maintenance. <P>SOLUTION: The portable radio is provided with an antenna, a circuit board 70 which has a reference potential pattern layer 75 and electronic components on its first surface 72, a case body 60 as a shield case which is mounted on the first surface 72 of the circuit board 70 is electrically connected with the reference potential pattern layer 75 and covers the electronic components, a connection part 9 which can attach and detach the case body 60 and the circuit board 70 to each other and from each other and partially fixes them and a solder layer 720 as a conductive layer which is arranged between the reference potential pattern layer 75 except the connection 9 and the case body 60 as a shield case. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a portable wireless device such as a cellular phone having a built-in antenna, a PHS (Personal Handyphone System), a PDA (Personal Digital Assistant), a portable navigation device, and a notebook computer.

  Conventionally, a cellular phone as a portable wireless device has a structure in which an antenna is attached to the outside of a casing. However, in recent years, a structure in which an antenna is built in a housing is being adopted for reasons of design and the like.

As a portable radio device incorporating such an antenna, for example, a mobile phone in which a battery, a circuit board, a shield case, a flexible wiring board, and a key sheet are sequentially stacked in a casing and the antenna is disposed in an end of the casing. Can be illustrated (see Patent Document 1).
JP 2006-67524 A

  By the way, in recent years, a high frequency of several GHz or more is used for a digital signal of a portable wireless device such as a cellular phone, and it is required to reliably shield unnecessary high frequency due to clock noise with respect to an electronic component arranged on a circuit board. Yes.

  On the other hand, the shield case may be attached to the circuit board by screwing in consideration of maintainability and cost. Although mounting by screwing is excellent in maintainability and the like, there is a possibility that a gap may be formed in a part where screws are not fixed. Although this gap has not been a problem so far, unnecessary high frequencies that adversely affect other circuits on the circuit board may intrude due to the recent increase in the frequency of digital signals.

  An object of the present invention is to provide a portable radio capable of improving the shielding effect against high frequencies without impairing maintainability.

  The present invention relates to an antenna, a circuit board having a reference potential pattern layer and an electronic component on a first surface, and attached to the first surface of the circuit board and electrically connected to the reference potential pattern layer. And a shield case that covers the electronic component, a connecting portion that is detachable and partially fixed to the shield case and the circuit board, and the reference potential pattern layer and the shield case excluding the connecting portion. The present invention relates to a portable wireless device comprising a conductive layer disposed therebetween.

  A plurality of circuit blocks including the electronic components are formed on the first surface of the circuit board, each circuit block is partitioned by the reference potential pattern layer, and the shield case is formed by each circuit block. It is preferable to have a partition wall formed at a position facing the reference potential pattern layer that partitions

  The plurality of circuit blocks include at least a wireless circuit, a power supply circuit, and a digital circuit, and the conductive layer is interposed between a reference potential pattern layer that partitions each circuit block and a partition wall formed in the shield case. Preferably they are arranged.

  Further, the circuit block constituting the wireless circuit and the circuit block constituting the power supply circuit and / or the digital circuit are arranged adjacent to each other, and the conductive layer is used as the reference for partitioning between the two adjacent circuit blocks arranged. It is preferable to arrange between the potential pattern layer and the shield case.

  The conductive layer is preferably formed of solder.

  The present invention provides an antenna, a circuit board having a reference potential pattern layer and an electronic component on a first surface, and attached to the first surface of the circuit board and electrically connected to the reference potential pattern layer. And a shield case that covers the electronic component, and a connecting portion that is detachable and partially fixed to the shield case and the circuit board. A first step of forming a solder layer on the reference potential pattern layer so as not to exceed a width of the reference potential pattern layer; and a first case so that a conductive portion of the shield case is in contact with the reference potential pattern layer. A second step in which the solder layer is sandwiched between the conductive portion and the reference potential pattern layer while pressing the surface side and deforming the solder layer; Manufacturing method for a portable radio device which comprises a third step of fixing the said circuit board and Dokesu about.

  ADVANTAGE OF THE INVENTION According to this invention, the portable radio which can improve the shielding effect with respect to a high frequency can be provided, without impairing maintainability.

  Embodiments of the present invention will be described below with reference to the drawings. In the following, a mobile phone will be described as a portable wireless device, but the present invention is not limited to this, and a PHS (Personal Handy Phone System), a PDA (Personal Digital Assistant), a portable navigation device, a notebook personal computer, etc. It may be another portable wireless device equipped with an antenna.

  FIG. 1 is an external perspective view of a mobile phone 1 according to an embodiment of the present invention. As shown in FIG. 1, the mobile phone 1 is a foldable mobile phone 1, and includes a rectangular and thin operation unit side body 21 and a rectangular and thin display unit side body 22. .

  The upper end portion of the operation unit side body 21 and the lower end portion of the display unit side body 22 are connected via a hinge mechanism 26 so as to be opened and closed. The cellular phone 1 relatively rotates (rotates) the operation unit side body 21 and the display unit side body 22 connected via the hinge mechanism 26, thereby causing the operation unit side body 21 and the display unit to be rotated. The side housing 22 can be in an open state (open state), or the operation unit side housing 21 and the display unit side housing 22 can be folded (folded state). In the present embodiment, the foldable mobile phone 1 is described as a portable wireless device. However, the foldable mobile phone 1 is not foldable. A slide type that is slid, a rotary type that rotates one case around an axis along the overlapping direction, a case where both cases 21 and 22 are connected via a biaxial hinge, The display unit 27 and the operation unit 24 may be arranged in one housing.

  As shown in FIG. 1, the display unit side body 22 is arranged on an inner surface 22 a that is a surface facing the operation unit side body 21 in a folded state, and a display unit 27 that displays various types of information, and a call partner side And an audio output unit 29 for outputting the audio.

  The display unit side body 22 houses a circuit board (not shown) inside the front case 122a and the rear case 122b. A liquid crystal module constituting the display unit 27 is disposed on the surface of the circuit board. The liquid crystal module is accommodated such that the display surface is exposed from the front case 122a. In addition, various electronic components such as a speaker are mounted and electrically connected to the circuit board.

  As shown in FIG. 1, the operation unit side body 21 is in a folded state, the operation unit 24 arranged on the inner surface 21 a that is a surface facing the display unit side body 22, and the user of the mobile phone 1 makes a call. A voice input unit 23 to which a voice uttered from time to time is input, and a battery (not shown in FIG. 1) disposed on the outer surface 21b side, which is the surface opposite to the inner surface 21a. The operation unit 24 includes a function setting operation button 24a for operating various functions such as various settings, a phone book function, and a mail function, and an input operation button 24b for inputting numbers such as telephone numbers and characters such as mail. And a determination operation button 24c for performing determination and scrolling in various operations.

  FIG. 2 is an exploded perspective view of members built in the operation unit side body 21. FIG. 3 is an exploded side view of the operation unit side body 21. FIG. 4 is a plan view for explaining the reference potential pattern layer 75 of the circuit board 70. FIG. 5 is a bottom view for explaining the arrangement of the ribs 44 in the case body 60 as a shield case. FIG. 6A to FIG. 6C are cross-sectional views illustrating a procedure for attaching the case body 60 to the circuit board 70. FIGS. 7A to 7C are enlarged views of region A in FIGS. 6A to 6C.

  As shown in FIG. 2 or 3, the operation unit side body 21 includes a front case 30, a key sheet 40 that constitutes the various buttons 24 a, 24 b, and 24 c described above, a flexible wiring board 50, and a case body 60. A circuit board 70 including various electronic components such as a reference potential pattern layer and an RF (Radio Frequency) module for a mobile phone, a rear case 80, and a battery 85. In the operation unit side body 21, the front case 30, the key sheet 40, the flexible wiring board 50, the case body 60, the circuit board 70, and the rear case 80 are arranged in a stacked manner. The battery 85 is accommodated in an opening (not shown) formed in the rear case 80 so as to be removable from the outside.

  As shown in FIG. 2 or FIG. 3, the front case 30 and the rear case 80 are arranged such that the concave inner surfaces face each other, and are joined so that the outer peripheral edges overlap each other. Between the front case 30 and the rear case 80, the key sheet 40, the flexible wiring board 50, the case body 60, and the circuit board 70 are incorporated so as to be sandwiched therebetween. That is, the case body 60 is laminated so as to cover the first surface 72 of the circuit board 70, the flexible wiring board 50 is laminated on the upper surface side of the case body 60, and the key sheet 40 is disposed on the upper surface of the flexible wiring board 50. Laminated.

  As shown in FIG. 3, the case body 60 functions as a shield case and is attached in a state of being placed on the first surface 72 of the circuit board 70. Specifically, it is attached to the first surface 72 of the circuit board 70 in a state where the bottom surface 44 a of the rib 44 as a partition wall formed on the case body 60 is in contact.

  Moreover, the circuit board 70 and the case body 60 as a shield case are partially fixed in a detachable manner at the plurality of connecting portions 9. Specifically, the circuit board side screw holes 701, 702, 703, and 704 formed at the four corners of the circuit board 70 shown in FIG. 4 and predetermined members are arranged at the four corners of the case body 60 shown in FIG. In the state where the case body side screw holes 601, 602, 602, and 604 formed as above are overlapped, the screw member 700 is screwed into the overlapped screw holes, whereby the circuit board 70 and the case body 60 are Partially fixed so as to be detachable.

  Various electronic components (not shown) are arranged on the circuit board 70 on the first surface 72 on the front case 30 side and the second surface 73 on the opposite side to the first surface 72. On the first surface 72, various electronic components form a plurality of circuit blocks by a predetermined combination. For example, various circuit blocks including a wireless circuit, a power supply circuit, a digital circuit, and the like are formed.

  The case body 60 is a metal member having a shape in which one wide surface of a thin rectangular parallelepiped is opened. Specifically, as shown in FIG. 3, the case body 60 includes a flat plate portion 42 and a rib 44 formed substantially perpendicular to one surface of the flat plate portion 42. The rib 44 is formed to be equal to or sufficiently higher than the height of the electronic component having the highest height among the various electronic components mounted on the first surface 72 of the circuit board 70. The case body 60 may be formed by forming a skeleton from a resin and forming a conductor film on the surface thereof, in addition to being formed from a metal. Here, the ribs 44 are formed on the periphery and inside of the flat plate portion 42 so as to correspond to a reference potential pattern layer 75 described later. Specifically, when the first surface 72 on which the reference potential pattern layer 75 is formed and the back surface on which the rib 44 in the case body 60 is formed face each other, the bottom surface of the rib 44 is arranged. 44 a is formed on the reference potential pattern layer 75.

  The case body 60 is electrically connected to the reference potential pattern layer 75 formed on the first surface 72 of the circuit board 70 by the rib 44 (bottom surface 44a). As a result, the case body 60 is electrically connected to the reference potential pattern layer 75 and has the same potential. That is, the case body 60 functions as a shield case. Therefore, the case body 60 serves as a shield case to prevent external noise from acting on various electronic components (not shown) disposed on the first surface 72 of the circuit board 70, and at the same time RF (Radio Frequency) as an electronic component. ) Absorbs noise emitted from a high-frequency circuit such as a module and prevents it from acting on other electronic components disposed on the first surface 72.

  A reference potential pattern layer 75 as shown in FIG. 4 is formed on the first surface 72 of the circuit board 70. The reference potential pattern layer 75 is formed so as to partition each circuit block including the above-described wireless circuit, power supply circuit, digital circuit, and the like. The reference potential pattern layer 75 is formed, for example, between a wireless circuit and a power supply circuit adjacent thereto, or between a wireless circuit and a digital circuit adjacent thereto. Since the bottom surface 44 a of the rib 44 in the case body 60 is disposed on the reference potential pattern layer 75, each circuit is surrounded by the rib 44 and covered with a part of the case body 60. The rib 44 functions as a partition wall in each circuit, and shields each circuit together with a part of the case body 60.

  A plurality of solder layers 720 as conductive layers are formed on the upper surface of the reference potential pattern layer 75. That is, a plurality of solder layers 720 are disposed between the reference potential pattern layer 75 and the bottom surface 44 a of the rib 44. Each of the plurality of solder layers 720 is formed at a position spaced from the connecting portion 9, and each of the plurality of solder layers 720 is formed with a space therebetween. Specifically, the solder layer 720 is located at a position where the bottom surface 44a of the rib 44 and the reference potential pattern layer 75 are easily separated in a state where the circuit board 70 and the case body 60 are fixed by the connecting portion 9, in other words, there is a gap. It is arranged at a position where it tends to occur. Here, the solder layer 720 does not fix the rib 44 and the reference potential pattern layer 75. That is, the rib 44 is disposed on the upper surface of the solidified solder material (solder layer 720). The solder layer 720 can be made of a material mainly composed of Su—As—Cu, and can be easily deformed even after being hardened, so that the conduction between the rib 44 and the reference potential pattern layer 75 is ensured. Can be.

  As shown in FIGS. 6C and 7C, the solder layer 720 has a shape that abuts against the bottom surface 44 a of the rib 44 and rises along the side wall 44 b of the rib 44. The solder layer 720 is formed by placing the solder material 720a on the reference potential pattern layer 75 and attaching the case body 60 by the connecting portion 9 in a state where the bottom surface 44a of the rib 44 is placed on the top surface thereof. . That is, the solder material 720a is deformed so as to follow the shape of the rib 44 by pressing the bottom surface 44a of the rib 44 against the upper surface of the solder material 720a disposed at a predetermined position of the reference potential pattern layer 75. Thereby, the center is depressed and the thickness is reduced, and the center is deformed into a flat shape corresponding to the shape of the bottom surface 44a. Here, by reducing the amount of the solder material 720a disposed on the reference potential pattern layer 75, it is possible to prevent the portions that rise on both sides from being formed. In addition, since the solder layer 720 has a predetermined elastic force, it contributes to the reliable contact between the reference potential pattern layer 75 and the rib 44 together with the deformation corresponding to the shape of the rib 44 described above.

  The flexible wiring board 50 has a plurality of key switches 524 a, 524 b, 524 c on the surface on the front case 30 side, and is placed on the flat plate portion 42 in the case body 60. The key switches 524a, 524b, and 524c of the flexible wiring board 50 have a structure having a metal dome of a metal plate that is curved in a bowl shape and is three-dimensionally formed. When the apex of the bowl-shaped shape is pressed, the metal dome contacts a switch terminal formed in an electric circuit (not shown) printed on the surface of the flexible wiring board 50 and is electrically connected. The flexible wiring board 50 is obtained by sandwiching wiring between a plurality of insulating films.

  The key sheet 40 is configured by attaching a plurality of key tops 424a, 424b, 424c to the surface of a silicon rubber sheet 41 with an adhesive. A plurality of key tops 424a, 424b, 424c in the key sheet 40 are arranged at positions facing the key switches 524a, 524b, 524c in the flexible wiring board 50, and are not shown in the figure and formed in the front case 30 described later. It arrange | positions so that it may expose from a hole.

  The front case 30 is formed with a plurality of key holes on the inner side surface 21a facing the display unit 27 of the display unit side body 22 in a state in which the cellular phone 1 is folded. From each of the plurality of key holes, the pressing surfaces of the key tops 424a, 424b, 424c attached to the key sheet 40 are exposed. By pressing the exposed pressing surfaces of the key tops 424a, 424b, and 424c downward, the apexes of the corresponding metal domes (corrugated shapes) in the key switches 524a, 524b, and 524c are pressed, and the switch terminals are pressed. Contact and conduct electrically.

  On one end side of the rear case 80, an antenna element 66 housed in the base 65 is disposed. That is, the antenna element 66 is disposed on one end side of the mobile phone 1. Specifically, the antenna element 66 is disposed on the end side opposite to the hinge mechanism 26 side in the mobile phone 1. The antenna element 66 is formed of a strip-shaped sheet metal.

  The antenna element 66 is fed from the circuit board 70 via a feed terminal (not shown). As a result, the antenna element 66 is fed from the circuit board 70 via the feed terminal 77 and is connected to the RF module and the like of the circuit board 70.

A procedure for attaching the case body 60 to the circuit board 70 will be described below.
First, as shown in FIG. 6A, a solder material 720a is disposed by printing at a predetermined position on the reference potential pattern layer 75 formed on the first surface 72 of the circuit board 70. The solder material 720a is arranged by adjusting the arrangement amount so as to be narrower than the width of the reference potential pattern layer 75. The amount and thickness of the solder material 720a can be adjusted with a metal mask. The position where the solder material 720a is disposed is a position where a gap is easily formed between the reference potential pattern layer 75 and the bottom surface 44a of the rib 44 as described above.

  Next, as shown in FIG. 6B, the case body 60 is arranged such that the ribs 44 in the case body 60 face the first surface 72 of the circuit board 70. As shown in FIGS. 6B and 7B, the case body 60 is disposed so that the bottom surface 44a of the rib 44 is disposed on the curved upper surface of the solder material 720a. In FIG. 6, various electronic components to be mounted on the first surface 72 of the circuit board 70 are omitted.

  Subsequently, a circuit in which case body side screw holes 601, 602, 602, and 604 are formed at the four corners of the circuit board 70 are formed by arranging predetermined members at the four corners of the case body 60. It arrange | positions so that it may overlap with each board | substrate side screw hole 701,702,703,704. Then, by inserting and screwing the screw member 700 into the overlapping screw hole from the second surface 73 side of the circuit board 70, the circuit board 70 and the case body 60 are detachably partially fixed.

  By fixing the circuit board 70 and the case body 60 in this manner, the circuit board 70 and the case body 60 move in a direction in which the distance between the circuit board 70 and the case body 60 becomes narrower as indicated by arrows in FIG. The bottom surface 44a of 44 presses the upper surface of the solder material 720a toward the first surface 72 side. The solder material 720a disposed on the reference potential pattern layer 75 is deformed into a planar shape whose center corresponds to the bottom surface 44a of the rib 44, as shown in FIGS. 6C and 7C. Is deformed into a shape that rises along the side wall 44 b of the rib 44. That is, by pressing the flat bottom surface 44a of the rib 44 against the curved upper surface of the solder material 720a, the center is depressed and the thickness is reduced, and the planar shape corresponds to the shape of the bottom surface 44a. Deform. Then, the solder material 720 a extruded by this deformation is deformed so as to follow the shape of the rib 44. Here, since the solder layer 720 has a predetermined elastic force, it contributes to reliable contact between the bottom surface 44 a of the rib 44 and the reference potential pattern layer 75.

  According to this embodiment, the circuit board 70 and the case body 60 are fixed by the screw structure, and the solder layer 720 in which the solidified solder material is deformed is formed between the circuit board 70 and the case body 60. Thus, a conductive portion is provided in a gap formed between the circuit board 70 and the case body 60 to suppress the entry and wraparound of unnecessary high frequency into each space partitioned by the case body 60 that is a shield case. Thereby, the shielding effect with respect to a high frequency can be improved, without impairing maintainability.

  In addition, according to the present embodiment, by forming the solder layer 720 between the circuit board 70 and the case body 60, the electrical conductivity between the case body 60 as the shield case and the reference potential pattern layer 75 is improved. Yes. Thereby, it is possible to improve the conductivity with a simple structure without impairing the maintainability. Further, since the solder layer 720 can be formed at a desired position, it can be conducted at a position where electrical conduction is required, and the arrangement interval can be changed flexibly according to the frequency (wavelength) to be shielded. can do.

  Further, according to the present embodiment, the shielding property and the like can be improved without adding other conductive members such as a conductive gasket, a tab, and a U-shaped cross-section support part. Thereby, cost reduction and size reduction can be achieved by reducing the number of parts. In addition, the other members described above have large variations in resistance values, and the flexibility and springiness change over time, so that it is difficult to maintain stable performance over the long term. According to the present embodiment, since the shielding property and the like are improved only by forming the solder layer 720 without adding the above-described other conductive member, it is suitable for long-term use.

  Further, according to the present embodiment, the shielding property and the like can be improved without changing the shape of the case body 60. As a result, the cost for changing the shape of the case body 60 can be reduced, and a time merit can be obtained due to the necessity of correcting the mold or the like.

  Further, according to the present embodiment, the solder layer 720 can be formed by disposing the solder material 720 a on the reference potential pattern layer 75, disposing the case body 60 on the solder material 720 a and fixing it by the connecting portion 9. . As a result, the solder layer 720 which is a conductive layer can be formed simultaneously with the assembling work, so that the shielding effect against high frequency can be improved without increasing the work load.

  Further, according to the present embodiment, even when the processing accuracy varies in the case body 60 and the like, the variation can be absorbed when the solder layer 720 is formed. Thereby, even if there is variation in materials and processing accuracy in the circuit board 70 and the case body 60, it can be electrically connected suitably. Furthermore, since it is not necessary to manage the manufacturing process at the time of manufacture excessively, the cost increase at the time of manufacture can be suppressed.

  Further, according to the present embodiment, the solder layer 720 is the reference potential pattern layer simultaneously with the step of printing and arranging the solder material at the mounting position of the various electronic components in order to mount the various electronic components on the circuit board 70. It can be formed by placing a solder material on 75. As a result, the solder layer 720, which is a conductive layer, can be formed at the same time in the process of printing and arranging the solder material for mounting various electronic components. Therefore, the shield against high frequency can be efficiently performed without increasing the number of work steps. An effect etc. can be improved.

  As mentioned above, although preferred embodiment of this form was described, this invention can be implemented with a various form, without being limited to embodiment mentioned above. In the present embodiment, the circuit board 70 and the case body 60 are fixed by a screwing structure, but the present invention is not limited to this, and the case body is fixed by fixing the front case 30 and the circuit board 70 by a screwing structure. 60 can be clamped and fixed. Further, the circuit board 70 can be clamped and fixed by fixing the rear case 80 and the case body 60 by a screwing structure. Moreover, you may fix by the engaging structure by an engaging claw. That is, the circuit board 70 and the case body 60 may be fixed by the engagement structure, the front case 30 and the circuit board 70 may be fixed by the engagement structure, and the rear case 80 and the case body 60 May be fixed by an engagement structure.

  Further, in the present embodiment, the antenna element 66 is disposed on the end side opposite to the hinge mechanism 26 side in the mobile phone 1, but is not limited thereto, and may be on the hinge mechanism 26 side. 21 may be disposed outside. Furthermore, it may be arranged not on the operation unit side body 21 but on the display unit side body 22 side.

  In the present embodiment, the case body 60 is attached to the circuit board 70 on which the solder material 720a is disposed. However, the present invention is not limited to this, and the case body 60 on which the solder material 720a is disposed on the bottom surface 44a of the rib 44 is provided. 70 may be attached.

  In the present embodiment, the solder layer 720 is disposed at a position where a gap is easily formed between the circuit board 70 and the bottom surface 44a of the rib 44. However, the present invention is not limited to this, and the interval between the solder layers 720 is narrowed. Can do. Thereby, the noise of the high frequency band of a still higher frequency can be shielded, and the outstanding shielding property can be acquired.

  In this embodiment, a solder material mainly composed of Su—Ag—Cu is used as the solder layer 720. However, the present invention is not limited to this, and a solder material mainly composed of other components is used. it can.

1 is an external perspective view of a mobile phone 1 according to an embodiment of the present invention. 4 is an exploded perspective view of members built in an operation unit side body 21. FIG. 3 is an exploded side view of an operation unit side body 21. FIG. 5 is a plan view for explaining a reference potential pattern layer 75 of a circuit board 70. FIG. It is a bottom view explaining arrangement | positioning of the rib 44 in the case body 60 as a shield case. 5 is a cross-sectional view illustrating a procedure for attaching a case body 60 to a circuit board 70. FIG. It is an enlarged view of the area | region A in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mobile phone 9 Connection part 21 Operation part side housing | casing 22 Display part side housing | casing 30 Front case 40 Key sheet 44 Rib 44a Bottom face (rib)
44b Side (rib)
DESCRIPTION OF SYMBOLS 50 Flexible wiring board 60 Case body 66 Antenna element 70 Circuit board 72 1st surface 73 2nd surface (back surface)
75 Reference potential pattern layer 80 Rear case 720 Solder layer

Claims (6)

An antenna,
A circuit board having a reference potential pattern layer and an electronic component on the first surface;
A shield case attached on the first surface of the circuit board and electrically connected to the reference potential pattern layer and covering the electronic component;
A connecting part that is detachable and partially fixed to the shield case and the circuit board;
And a conductive layer disposed between the reference potential pattern layer excluding the connecting portion and a shield case. A plurality of circuit blocks including the electronic component are formed on the first surface of the circuit board,
Each circuit block is partitioned by the reference potential pattern layer,
The portable wireless device according to claim 1, wherein the shield case has a partition wall formed at a position facing a reference potential pattern layer that partitions each circuit block. The plurality of circuit blocks include at least a wireless circuit, a power supply circuit, and a digital circuit,
The portable wireless device according to claim 2, wherein the conductive layer is disposed between a reference potential pattern layer partitioning each circuit block and a partition wall formed in the shield case. The circuit block constituting the wireless circuit and the circuit block constituting the power supply circuit and / or the digital circuit are arranged adjacent to each other,
The portable wireless device according to claim 3, wherein the conductive layer is disposed between the reference potential pattern layer that partitions between the adjacent circuit blocks and the shield case.   The portable wireless device according to claim 1, wherein the conductive layer is formed of solder. An antenna; a circuit board having a reference potential pattern layer and an electronic component on a first surface; and the electronic component mounted on the first surface of the circuit board and electrically connected to the reference potential pattern layer. A method of manufacturing a portable radio, comprising: a shield case that covers the shield case; and a connecting portion that is detachable and partially fixed to the shield case and the circuit board,
Forming a solder layer on the reference potential pattern layer so as not to exceed the width of the reference potential pattern layer;
The shield case is pressed to the first surface side so that the conductive portion in the shield case contacts the reference potential pattern layer, and the solder layer is deformed while the solder layer is deformed between the conductive portion and the reference potential pattern layer. A second step sandwiched between,
A method of manufacturing a portable wireless device, comprising: a third step of fixing the shield case and the circuit board by the connecting portion.

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