JP2008129748A - Non-contact ic tag and non-contact ic tag connected body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC tag and a non-contact IC tag connected body, having a contact writable exclusive pad for performing write processing in encoding or use disclosure. <P>SOLUTION: The non-contact IC tag 1 of a UHF band or microwave band has a half-waveform dipole antenna 2 on a base film 11 face, wherein the antenna face is covered with a surface protection sheet 5 or an adhesive layer. Contact write exclusive pads 3a and 3b exposed from the surface protection sheet 5 are formed in a region adjacent to an IC chip 4 mounted between right and left antennas, or the antenna face is covered with an adhesive layer 7 and a peeling paper 8, and a contact write exclusive pad exposed from the adhesive layer and the peeling paper is formed. Preferably, both the IC chip 4 and the contact write exclusive pad are exposed on the outer surface so that the IC chip 4 section can be prevented from being made high. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a non-contact IC tag and a non-contact IC tag connecting body. More specifically, the present invention relates to a non-contact IC tag including a contact writing dedicated pad and a non-contact IC tag connecting body in addition to a normal dipole antenna in a UHF band or microwave band non-contact IC tag.

  The non-contact IC tag is also referred to as RFID (Radio Frequency Identification), and includes an IC chip that holds information capable of identifying an individual, and can read this information by wireless communication in a non-contact manner. Such non-contact IC tags are used, for example, in the fields of transportation, distribution, warehouse, factory process management, and handling of luggage.

In recent years, in addition to the conventional 13.56 MHz band or microwave band (2.45 GHz) non-contact IC tag, it has become possible to use the UHF band (952 M to 955 MHz) in Japan due to the revision of the law. Band non-contact IC tags are being put to practical use.
The UHF band non-contact IC tag can collectively read from a long distance (3 to 5 meters) as compared with the electromagnetic induction type 13.56 MHz band non-contact IC tag. Further, the microwave band IC tag can communicate at a distance of 1 to 1.5 meters, and is expected to be widely used in applications that take advantage of these features in the future.
In the classification of radio waves, the UHF band indicates 300 M to 3 GHz, but in the case of a non-contact IC tag, it often refers to a tag using 860 M to 960 MHz. An IC tag using the 2.45 GHz band included in the above range is not normally called an UHF band IC tag.

The frequency band in Japan that can use the UHF band IC tag can use 2MHz of 952M to 954MHz for high output type and 3MHz of 952M to 955MHz for low output type by amendment of Radio Law in April 2005. The UHF band IC tag had problems such as the weak response wave of the IC tag being interfered by the transmission wave of other reader / writers, and it was pointed out that it was difficult to read. This prevents this interference.
In other words, the new law adopts the carrier sense method, which requires LBT (Listen Before Talk) to check whether other readers are emitting radio waves before the leaders send radio waves. It is considered that reader / writer devices corresponding to such a new method are also being sold, and the spread of UHF band IC tags is promoted.

  By the way, in the case of UHF band IC tags, there is an advantage that reading from a long distance (3 to 5 meters) is possible as described above, but conversely, when writing from a short distance of about 1 cm to 30 cm, There arises a problem of erroneous writing to the non-contact IC tag. In particular, when writing to an IC tag concatenation immediately after manufacture in which IC tags are continuously formed (usually encoding processing by a manufacturer or continuous writing processing before the user starts using), the interval between IC tags is However, since it is about 2 cm to 5 cm, it is difficult to specify one IC tag and write it, and it is necessary to write the target IC tag strictly shielded from other IC tags. There is.

  FIG. 6 is a diagram for explaining a conventional UHF band IC tag writing method. In FIG. 6, it seems that the reader / writer 10 is placed in the horizontal direction in the same plane as the non-contact IC tag connecting body 1R, but in reality, both antenna surfaces are placed in parallel and facing each other. I want you to see it as a simple figure. Conventionally, different data is sequentially written for each target IC tag while intermittently sending the IC tag connecting body 1R in this state (for example, in the direction of arrow A). In this case, since the radiation range of the radio wave (C1) of the reader / writer 10 capable of long-distance writing is wide and a plurality of IC tags are included in the range, it is difficult to write to a specific IC tag.

  It is considered that a model such as a proximity write only reader / writer for UHF band IC tags is not commercially available at present. Accordingly, the output of the handy reader / writer is reduced, and other IC tags are shielded and written so as to communicate only with the target IC tag from a relatively short distance as described above, or the IC tag is connected. A single IC tag of interest is written separately from the body. This work is bothersome and problematic. The microwave band (2.45 GHz) is used in the same way although the communication distance is somewhat shortened.

Therefore, in the present invention, in addition to the half-wave dipole antenna that UHF band IC tags and microwave band tags normally have, a dedicated pad for contact writing is provided in the IC tag, and writing is performed using the dedicated pad. It is what.
There exists patent document 1 as a prior art indirectly related to this application. Patent Document 1 describes an information card having a dipole antenna, and “a pinhole may be formed in the cover sheet of the dipole antenna, and data in the IC memory may be rewritten through the pinhole” (third). The lower right column of the page). However, it is troublesome to open a pinhole in the cover sheet each time.

  Further, as an inevitable structural problem of the non-contact IC tag, there is a problem that the thickness of the IC chip is much larger than that of the base film or the like. IC chips have been reduced in size and thinned, but recent IC chips also have a planar size of 0.2 mm to 2 mm square and a thickness of 100 μm to 400 μm. Therefore, even if the antenna pattern is formed on the base film surface, the IC chip is mounted, and the surface protection sheet is covered and flattened, the IC chip portion becomes bulky when the IC tag labels are stacked. If an external force is applied in this state, the IC chip portion is damaged and becomes cheaper.

  Therefore, the present invention intends to enable contact writing positively by providing the IC chip portion of the IC tag with a dedicated window-opening write pad that can be directly contact-written from the outside. In this case, the contact write-only pad is provided in an area close to the IC chip, so that the surface protection sheet of the IC chip part or the adhesive layer on the opposite side is opened including the IC chip part (window open state). In this case, contact writing can be performed, the thickness of the IC chip portion can be reduced, the external force received by the IC chip can be reduced, and damage due to the external force can be reduced.

JP-A-2-19989

  As described above, in the UHF band or microwave band non-contact IC tag, even when continuous writing is performed, the non-contact IC tag that can be reliably written to the target IC tag and its connected body are realized. At the same time, an opening is formed in the base material of the IC chip portion or the like, and the destruction from the external force received by the IC chip is reduced.

  The first of the gist of the present invention that solves the above problems is a UHF band or microwave band non-contact IC tag having a half-wavelength dipole antenna on the base film surface, the antenna surface being covered with a surface protection sheet. A non-contact IC tag is characterized in that a contact writing dedicated pad exposed from a surface protection sheet is formed in a region close to an IC chip mounted between the left and right antennas.

  A second aspect of the present invention that solves the above problems is a UHF band or microwave band non-contact IC having a half-wavelength dipole antenna on the base film surface, the antenna surface being covered with an adhesive layer and release paper. The contactless IC tag is characterized in that a contact write-dedicated pad exposed from the pressure-sensitive adhesive layer and the release paper is formed in an area close to the IC chip mounted between the left and right antennas.

  The third aspect of the present invention that solves the above problems is that a half-wavelength dipole antenna is formed on the surface of the belt-like base film at regular intervals in a direction perpendicular to the belt-like base film, and the antenna surface is surface-protected. In a UHF band or microwave band non-contact IC tag linking body covered with a sheet, a contact write-dedicated pad is formed in a proximity region of the IC chip mounted between the left and right antennas, and the IC chip is formed on the surface protection sheet. A contact-less IC tag connecting body is characterized in that a band-shaped opening is formed so that the portion including the contact writing dedicated pad is parallel to the length direction of the base film.

  A fourth aspect of the present invention for solving the above problems is that a half-wave dipole antenna is formed on a band-shaped base film surface at regular intervals in a direction in which the length direction is orthogonal to the band-shaped base film. In a UHF band or microwave band non-contact IC tag linking body coated with a layer and release paper, a contact writing dedicated pad is formed in the proximity region of the IC chip mounted between the left and right antennas, and the adhesive layer and release paper The non-contact IC tag connecting body is characterized in that a portion including the IC chip and the contact writing dedicated pad is formed with a band-shaped opening so as to be parallel to the length direction of the base film.

The contactless IC tag of the present invention (Claim 1) is provided with a contact write-only pad exposed on the outer surface of the surface protection sheet in addition to a normal half-wavelength dipole antenna. Continuous writing at the start or the like can be efficiently performed by bringing the reader / writer terminal into contact with the pad.
The non-contact IC tag according to the present invention (Claim 2) has two contact writing dedicated pads on both sides of the IC chip, and each pad is connected to the junction between the left and right antennas and the IC chip. The contact writing can be performed through the antenna terminal of the IC chip.

In the non-contact IC tag of the present invention (Claim 3), both the IC chip and the contact writing dedicated pad are exposed from the surface protection sheet together with the above effects, so that the impact received by the IC chip from the external force is reduced. Destruction can be reduced. Since the surface protective sheet is perforated even after the IC tag is attached to an article or the like, the protruding height of the IC chip can be reduced.
Since the non-contact IC tag of the present invention (Claim 4) has an adhesive layer and release paper on the side surface opposite to the surface protective sheet, it can be used as an IC tag label.

In the non-contact IC tag of the present invention (Claim 5), in addition to a normal half-wave dipole antenna, an adhesive layer and a contact write-only pad exposed on the outer surface of the release paper are formed. Continuous writing at the start of processing or use can be performed efficiently by bringing the terminal of the reader / writer into contact with the pad.
The non-contact IC tag according to the present invention (Claim 6) has two contact writing dedicated pads on both sides of the IC chip, and each pad is connected to the joint between the left and right antennas and the IC chip. The contact writing can be performed through the antenna terminal of the IC chip.

  In the non-contact IC tag of the present invention (Claim 7), both the IC chip and the contact writing dedicated pad are exposed from the adhesive layer and the release paper together with the above effects, so that the IC chip receives an impact from external force. Can be relaxed to reduce destruction. Since the adhesive layer has a hole after the IC tag is attached to an article or the like, the protruding height of the IC chip can be reduced.

In addition to the effect of the non-contact IC tag of claim 1, the non-contact IC tag connecting body of the present invention (invention 8) has a belt-like opening formed in the surface protection sheet, so that it can be wound up In addition, the external force applied to the IC chip due to the tightening can be reduced.
In addition to the effect of the non-contact IC tag of claim 5, the non-contact IC tag connecting body of the present invention (invention 11) has a strip-like opening formed in the pressure-sensitive adhesive layer and release paper. In this case, the external force applied to the IC chip due to the tightening can be reduced.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a plan view showing a first form of the non-contact IC tag of the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and FIG. 3 is a second form of the non-contact IC tag of the present invention. FIG. 4 is a cross-sectional view taken along the line AA of FIG. 3, and FIG. 5 is a view showing various states of openings.

  FIG. 1 is a plan view showing a non-contact IC tag of the present invention. The state seen through the transparent surface protection sheet 5 is assumed. As shown in FIG. 1, a half-wave dipole antenna 2 is formed on the surface of the base film 11. A pair of left and right quarter-wave antennas 2L and 2R are single dipoles extending in parallel, and an IC chip 4 is mounted (electrically connected) between the joints 2a and 2b of the antennas 2L and 2R. The IC chip 4 stores the written data in a memory and performs data communication through the dipole antenna 2. In addition, the voltage obtained by DC conversion by the diode and the capacitor inside the IC chip is acquired from the radio wave. It also has the function of adjusting the impedance with the antenna. The antennas 2L and 2R can adopt various shapes, and may not have a bent shape as shown in the figure. However, EPC Global defines the overall length to be within 4 inches, and the antennas 2L and 2R are folded. Often.

A feature of the IC tag 1A according to the first embodiment of the present invention is a region adjacent to the IC chip 4, and two contact write-dedicated pads 3a exposed on the outer surface on both upper and lower (or left and right) sides of the IC chip 4. , 3b is formed. The contact write dedicated pads 3a and 3b are connected to the same pads as the antennas 2L and 2R of the IC chip 4, respectively.
Further, there is a feature that a circular opening 9 is formed in a portion of the surface protection sheet 5 including the dedicated pads 3a and 3b and the entire IC chip 4 portion. The opening 9 is not limited to a circle, and may be rectangular or oval. Of course, contact writing is possible even if the entire surface protection sheet 5 including the IC chip 4 portion is not opened and only the dedicated pads 3a and 3b are opened. However, the opening including the IC chip 4 part is preferable for the purpose of reducing the thickness of the IC chip 4 part as described above.

Even a non-contact IC tag of a normal dipole antenna can be written in contact with the joint to the IC chip 3 if the antenna is exposed on the outer surface. joint 2a of the chip 4, branches from 2b, preferably to have a constant contact area (2mm ² ~9mm ² about). This is because the joining portions 2a and 2b are usually thin wires having a width of about 1 mm to 2 mm and are not very suitable for contact writing.
Since the current IC chip 4 is miniaturized, the IC chip 4 is actually smaller than the contact write pads 3a and 3b, contrary to FIG. Therefore, when the opening 9 is circular, the diameter is about 5 mm to 10 mm, and when the opening 9 is square, the length of one side is about 5 mm to 10 mm.

  The dipole antenna 2 is set to have a shape in which a current distribution of a half wavelength of the irradiated radio wave is generated. For example, when the UHF band is 954 MHz, one wavelength is 31.4 cm, and a half wavelength is 15.7 cm. When this condition is satisfied, resonance with radio waves is efficiently generated. In principle, the total of the folded line segments of the pair of left and right quarter-wave antennas 2L and 2R is designed to have such a length. One unit of the IC tag of the folded antenna is manufactured to a size (base material size) of about 10 cm in length and about 3 to 4 cm in width. In the case of the microwave band (2.45 GHz), the antenna has a shorter shape.

However, in the case of contact writing, writing can be performed stably without considering the resonance state of radio waves, and the power required by the IC tag can be easily supplied. At present, it seems that there is no reader / writer for both UHF band contact writing and non-contact writing. However, it can be easily realized by improving the existing reader / writer.
Note that when the contact writing dedicated pads 3a and 3b are provided on the antenna 2, the entire structure including the dipole antenna 2 and the contact writing dedicated pads 3a and 3b is connected to the pads of the IC chip 4, so that in the case of noncontact communication It is necessary to design the shape so that it functions as a single antenna that causes resonance and impedance matching.

2 is a cross-sectional view taken along line AA in FIG. The quarter wavelength antennas 2L and 2R are formed on the surface of the base film 11, and the IC chip 4 is attached to the joints 2a and 2b. The surface of the dipole antenna 2 is laminated with a surface protective sheet 5 with an adhesive layer 6, but has a feature that an opening 9 is formed in an IC chip 4 portion including dedicated pads 3 a and 3 b.
In FIG. 2, the dipole antennas 2 </ b> L and 2 </ b> R and the adhesive layer 6 are illustrated as having a gap, but are actually in close contact with each other. Although not shown, it is usual to provide an adhesive layer and release paper on the side of the base film 11 opposite to the antenna 2 so that it can be used as a label. However, it can be used as a hanging tag without an adhesive layer.

FIG. 3 is a plan view showing a second embodiment of the non-contact IC tag of the present invention. The state seen through the transparent base film 11 is assumed. In this embodiment, since the opening 9 is formed on the pressure-sensitive adhesive layer side, the opening 9 cannot be directly seen from the surface side when it is attached to an article. Accordingly, the opening 9 is illustrated by a broken line. Since the dipole antenna 2 is formed on the base film 11, the opening 9 cannot be formed on the upper side. It may be considered that there is no base film 11 and the antenna 2 is formed on the surface protection sheet.
The feature of the non-contact IC tag 1B of the second form is that the opening 9 is formed as a hole penetrating the adhesive layer and the release paper at the same time. Also in this case, it is preferable to open the whole including the exclusive pads 3a and 3b and the IC chip 4 together in order to reduce the thickness of the IC chip 4 as described above.

  4 is a cross-sectional view taken along line AA in FIG. The quarter wavelength antennas 2L and 2R are formed on the surface of the base film 11, and the IC chip 4 is attached to the joints 2a and 2b. Unlike FIG. 2, the surface of the antenna 2 is directed downward (toward the pressure-sensitive adhesive layer 7 side), and the surface of the dipole antenna 2 is covered with the pressure-sensitive adhesive layer 7 and the release paper 8. Openings 9 are formed in the adhesive layer 7 and release paper 8 of the IC chip 4 including the dedicated pads 3a and 3b, and the windows are open. Since the opening 9 is on the article to be adhered, contact writing cannot be performed unless it is peeled off after being adhered to the article or the like.

Therefore, contact writing is performed before sticking to an article or the like. Since a part of the antenna is exposed, it is necessary that the article on the opening 9 side does not cause a short circuit or the like, and it is preferable to avoid a metal or a wet body. Even when the release paper 8 is peeled off and attached to an article or the like, since the opening is formed in the pressure-sensitive adhesive layer 7, the protrusion of the IC chip 4 portion from the article surface can be reduced.
In FIG. 4, the dipole antennas 2 </ b> L and 2 </ b> R and the pressure-sensitive adhesive layer 7 are illustrated as having a gap, but in actuality, they are in close contact.

FIG. 5 is a view showing various formation states of the opening 9. FIG. 5A shows a case where the openings 9a and 9b are formed only in the contact writing dedicated pads 3a and 3b, and only the pads 3a and 3b are exposed on the outer surface. Even in this state, contact writing is possible.
FIG. 5B shows an IC tag connecting body composed of dipole antennas, and contact writing pads 3a and 3b are formed at positions opposite to the IC chip 4 along the flow direction of the IC tag connecting body 1R. In this case, a band-shaped opening (also referred to as a groove) 9 having a width d is formed in a portion including the IC chip 4 and the dedicated pads 3a and 3b. In the case where the strip-shaped opening 9 is formed in this manner, even when the strip-shaped opening 9 is formed in a winding shape, the winding thickness of the opening 9 is reduced, so that damage to the IC chip 4 due to the tightening pressure can be reduced.
Therefore, the present application can also be applied to such a non-contact IC tag connecting body 1R.

FIG. 5C shows a connecting body 1R similar to FIG. 5B, in which an oval opening 9 is formed in a part including the IC chip 4 and the dedicated pads 3a and 3b so as to be parallel to the longitudinal direction of the connecting body. This is the case. Thus, also when the opening 9 is formed, the strong pressure due to the tightening can be relieved.
In addition, when opening circularly, it is as having shown in FIG. 1 and FIG. The above opening state appears in the same manner in appearance both when the opening 9 is formed in the surface protective sheet 5 and when it is formed in the pressure-sensitive adhesive layer 7 and the release paper 8.

  In general, it is necessary to properly align and laminate the surface protective sheet 5 or the release paper 8 with the adhesive layer 7 formed with the openings 9 as independent holes and the base film 11 after the antenna is formed. Accompanied by difficulties. In the case where the strip-shaped opening 9 is formed as shown in FIG. 5B, it is only necessary to stack two sheets with a constant interval width d, so that the manufacturing process becomes relatively easy. The width d can be about 5 mm to 15 mm.

When contact writing is performed on the IC tag, writing is performed by bringing the probe or contact pin of the reader / writer into contact with the contact writing dedicated pads 3a and 3b. When continuous writing work is performed with an automated line, writing can be performed by contacting the contact pin while intermittently automatically feeding the IC tag connecting body. Since the write signal does not flow to other IC tags, erroneous writing does not occur.
It should be noted that the contact write-dedicated pad mainly means that data used for writing is received from the reader / writer 10 and written to the memory of the IC chip 4, and that the data of the IC chip 4 can be read. Of course.

Such writing is mainly performed when an IC tag manufacturer writes a production lot, a product number, or the like, or when a user continuously writes a product name, a product price, quality, or the like at the start of use. The above writing is, of course, writing to the memory of the IC tag. Since actual writing is often performed simultaneously with printing on a label, the reader / writer may have a printing function and a contact writing function.
The IC tag 1 on which a product name or the like is written is attached to a product or an article and placed in various places. Subsequent reading (reading) can use a normal UHF band reader / writer, and can radiate radio waves and read from a long distance of 3 to 5 meters.

As described above, the frequency band in Japan where UHF band IC tags can be used is 2 MHz from 952 M to 954 MHz for the high output type, and 3 MHz from 952 M to 955 MHz for the low output type. Among the high output type HF band IC tag reader / writers, there is “XR480-JP” of Symbol Technologies as an installation type. These antennas are quite large.
As a low output handy reader / writer, “BHT-230QWID” (952 M to 955 MHz; output 10 mW) will be released soon from Denso Wave Co., Ltd. The reading distance is seen to be about 10 cm from the closest distance. As another low output type UHF band IC tag, a reader / writer of Fujitsu Limited can be used. For example, a CF type reader / writer “TFU-RW526” for accessing the UHF band RFID tag can be used by inserting the Multipad main body “FHT401SS1” into the main body. In this case, the communication distance is about 3 cm to 10 cm.

The non-contact IC tag connecting body 1R can be manufactured by the same process as the conventional non-contact IC tag connecting body. As the base film 11, a material obtained by laminating a metal foil (for example, aluminum or copper foil) on the resin film surface is used. A photosensitive photoresist is applied to the metal foil surface of the base film 11 and exposed to light using a photomask to form a resist layer. It is assumed that the photomask has a pattern of the dipole antenna 2 and the contact writing dedicated pads 3a and 3b. An antenna pattern or the like may be resist printed without using a photomask. Next, the metal foil is etched to form a predetermined antenna.
After the etching, the IC chip 3 is mounted on the dipole antenna 2 of the base film 11 with an anisotropic conductive adhesive film or the like, and then the surface protection sheet 5 having the openings 9 is aligned with the IC chip 4 and laminated. In the case of the strip-shaped opening 9, alignment in the width direction is necessary, but alignment in the traveling (flow) direction is not necessary.
As the IC chip 3, a UHF band or microwave band compatible IC chip is used. For example, US Impinge “Monza”, US Texas Instruments “UHF-IC-01”, Philips Electronics “UCODE EPCG2”, and the like.

  When the opening 9 is formed in the pressure-sensitive adhesive layer 7 and the release paper 8, the opening 9 is formed in a state where the release paper is attached to both sides of the double-sided pressure-sensitive adhesive tape. The opening 9 can be formed using a rotary die cutter or a flat punching blade. Also in this case, when the strip-shaped opening 9 is used, the processing for forming the opening 9 is not necessary. After the opening 9 is formed, the release paper on one side is peeled and removed, and the opening 9 and the IC chip 4 are aligned and pressure bonded to the surface of the antenna 2 for lamination.

After using a base material obtained by laminating aluminum foil having a thickness of 12 μm on a strip-shaped polyethylene terephthalate (PET) film having a width of 120 mm and a thickness of 20 μm, and half-wave dipole antenna pattern 2 and contact writing dedicated pads 3a and 3b are resist printed, Etched. The half-wave dipole antenna 2 is shaped as shown in FIG. 1 so that the length (the total length of the folding line segments) is 160 mm. Further, the contact writing dedicated pads 3a and 3b are 2 mm × 2 mm squares, and the line connecting the two dedicated pads 3a and 3b with the IC chip 4 interposed therebetween is in the direction of the half-wave dipole antenna 2 as shown in FIG. It was formed close to the IC chip 4 so as to be orthogonal. The IC chip 4 was manufactured by Texas Instruments, and was attached to the joints 2a and 2b using an anisotropic conductive adhesive film.
Two PET films having a width of 55 mm and a thickness of 12 μm are used as the surface protection sheet 5 on the half-wavelength dipole antenna 2 surface, and the IC chip 4 and the contact write-only pads 3a and 3b are in a band-like shape having a width (d) of 10 mm. Lamination was performed so as to form the opening 9 to complete the non-contact IC tag connecting body 1R of the present invention. Further, the connecting body was cut into unit IC tags to complete the non-contact IC tag 1A of the present invention.

  The completed non-contact IC tag 1A can be remotely read from a distance of 3 meters (using “XR480-JP” manufactured by Symbol Technologies). In addition, writing from a contact writing dedicated pad by a prototype reader / writer was also possible.

It is obvious to those skilled in the art that the present invention can be applied not only to a half-wavelength dipole antenna but also to a one-wavelength loop antenna, a half-wavelength folded dipole antenna, and the like.
Note that the above description is based on the premise that the contact writing dedicated pads 3a and 3b and the non-contact writing by the antenna 2 are connected to the same pad of the IC chip 4, but as in the case of a dual interface IC card. It is also possible to adopt a form in which both the non-contact and non-contact interfaces are provided and the memory is shared inside the IC chip. In this case, since the IC chip has one contact-only interface, the IC tag may have only one contact write-only pad connected to the interface.

It is a top view which shows the 1st form of the non-contact IC tag of this invention. It is the sectional view on the AA line of FIG. It is a top view which shows the 2nd form of the non-contact IC tag of this invention. FIG. 4 is a sectional view taken along line AA in FIG. 3. It is a figure which shows the various states of opening. It is a figure explaining the writing method of the conventional UHF band IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact IC tag 1R Non-contact IC tag connection body 2 Dipole antenna, antenna 2a, 2b Joint part 3a, 3b Contact writing exclusive pad 4 IC chip 5 Surface protection sheet 6 Adhesive layer 7 Adhesive layer 8 Release paper 9 Opening 10 Reader / Writer 11 Base film

Claims (12)

In a UHF band or microwave band non-contact IC tag that has a half-wave dipole antenna on the base film surface and is covered with a surface protection sheet, in a region close to the IC chip mounted between the left and right antennas A non-contact IC tag, wherein a contact writing exclusive pad exposed from a surface protective sheet is formed. 2. The non-contact IC tag according to claim 1, wherein two contact write-dedicated pads are provided on both sides of the IC chip, and each pad is connected to a joint between the left and right antennas and the IC chip. 3. The non-contact IC tag according to claim 1, wherein both the IC chip and the contact writing dedicated pad are exposed from the surface protection sheet. 4. The non-contact IC tag according to claim 1, further comprising a pressure-sensitive adhesive layer protected with a release paper on a surface opposite to the antenna surface of the base film. In the UHF band or microwave band non-contact IC tag, which has a half-wave dipole antenna on the base film surface and is covered with an adhesive layer and release paper, close to the IC chip mounted between the left and right antennas A non-contact IC tag, wherein a contact write-only pad exposed from the pressure-sensitive adhesive layer and release paper is formed in a region to be touched. 6. The non-contact IC tag according to claim 5, wherein two contact writing dedicated pads are provided on both sides of the IC chip, and each pad is connected to a joint between the left and right antennas and the IC chip. 7. The non-contact IC tag according to claim 5, wherein both the IC chip and the contact writing dedicated pad are exposed from the pressure-sensitive adhesive layer and the release paper. A UHF band or microwave band non-contact IC tag in which half-wavelength dipole antennas are formed at regular intervals in the direction perpendicular to the band-shaped base film on the surface of the band-shaped base film, and the antenna surface is covered with a surface protective sheet In the connecting body, a contact writing dedicated pad is formed in the proximity region of the IC chip mounted between the left and right antennas, and a portion including the IC chip and the contact writing dedicated pad is formed on the surface protection sheet. A non-contact IC tag linking body, wherein a strip-shaped opening is formed so as to be parallel to the vertical direction. 9. The non-contact IC tag connection according to claim 8, wherein two contact writing dedicated pads are provided on both sides of the IC chip, and each pad is connected to a joint between the left and right antennas and the IC chip. body. The non-contact IC tag connecting body according to claim 8 or 9, further comprising an adhesive layer protected with a release paper on a surface opposite to the antenna surface of the base film. A half-wave dipole antenna is formed on the surface of the belt-like base film at regular intervals in the direction perpendicular to the belt-like base film, and the antenna surface is covered with an adhesive layer and release paper. In the contact IC tag connecting body, a contact writing pad is formed in a proximity region of the IC chip mounted between the left and right antennas, and the adhesive layer and the release paper include the IC chip and the contact writing pad. However, the non-contact IC tag connecting body is characterized in that a band-shaped opening is formed so as to be parallel to the length direction of the base film. 12. The non-contact IC tag connection according to claim 11, wherein two contact write-dedicated pads are provided on both sides of the IC chip, and each pad is connected to a joint between the left and right antennas and the IC chip. body.

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