JP2006146786A - Tag tape, tag tape roll, and radio tag circuit element cartridge - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent sealing agent from being forced out and jobs from becoming complicated in manufacturing. <P>SOLUTION: A thermal tape 101 has: a base film 101a, wherein the size of width direction that crosses a tape's longitudinal direction is (a); a first adhesive layer 101b, wherein the size of width direction is (b); a second adhesive layer 101c, wherein the size of width direction is (d); a peelable paper 101d which is arranged so that it is peelable from the second adhesive layer 101c and the size of whose width direction is (e); and a plurality of radio tag circuit elements To arranged in a tape's longitudinal direction at predetermined intervals. Prescribed mold release processing x2 is applied to a side opposite to the second adhesive layer 101c of the peelable paper 101d and, wherein a, b, d, and e, satisfy equations, a≥b, d and e≤b,d. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a tag tape roll that continuously forms a wireless tag capable of wireless communication of information with the outside in a tape shape, and a wireless tag circuit element cartridge including the tag tape roll.

  Conventionally, a tape printing device (label producing device) has been proposed in which a tape to be printed is stored in a cartridge (cassette) in the form of a roll, and the desired characters are printed while being fed out of the roll and discharged into a label. (For example, Patent Document 1).

  In this prior art, a roll having a recording tape (printed tape) provided with an adhesive layer on one side is wound, and predetermined printing is performed on the print-receiving tape while feeding the print-receiving tape from the roll, This is cut into a predetermined length to create a printed label. Also, release paper (release material) is attached to cover the adhesive layer on one side of the print-receiving tape, and the release label is peeled off to expose the adhesive layer, so that the print label is attached. Can be easily attached to the target.

Japanese Patent Laid-Open No. 2002-53248 (FIGS. 1 to 5)

  In recent years, an RFID (Radio Frequency Identification) system that reads / writes information in a non-contact manner between a small tag equipped with an RFID circuit element and a reader (reading device) / writer (writing device) has attracted attention. . Even when the tag is dirty or placed at an invisible position, the reader / writer can access (read / write information) the RFID tag circuit element provided on the tag. Practical use is expected in various fields such as management and inspection processes.

  Here, for such a tag, if the information related to the RFID tag information is printed on a label separately from the tag information stored inside, the related information can be visually recognized from the user side. Something convenient. In this case, the pressure-sensitive adhesive layer between the release material and the tape to be printed is made relatively thick, and the RFID tag circuit element is arranged in the thickened pressure-sensitive adhesive layer to form a tag tape, which is then wound. Will be a tag tape roll.

  At the time of manufacturing the tag tape roll, a stationary pressure-sensitive adhesive layer (first pressure-sensitive adhesive layer) is provided on the tag tape base material layer in order to eliminate waste of the RFID circuit element and prevent an increase in cost. Affixing adhesive layer (second adhesive layer) and a release material tape comprising a release material layer) are affixed to one side of the base tape produced in the above while interposing the RFID circuit element. As described above, a method of winding in the radial direction several times has been studied (Note that after the release material tape is once attached to the tag tape substrate layer side, the second adhesive layer is placed on the first adhesive layer side. Only the release material can be peeled off).

  In this way, a tag tape having a five-layer bonded structure of a tag tape base material layer, a first pressure-sensitive adhesive layer, a wireless tag circuit element, a second pressure-sensitive adhesive layer, and a release material layer is completed. Created for use. However, since it has a structure in which two layers of pressure-sensitive adhesive are interposed in this way, the pressure-sensitive adhesive of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer should protrude in the width direction from the tag tape base material layer and the release material layer. In some cases, the adhesive may get on the hand when the user handles the tag tape or tag label, or may stick to other objects when sticking, and dust or dirt may stick to the protruding adhesive. The inconvenience arises.

  In addition, when the base tape and the release material tape are bonded together as described above, actually, the base material tape wound around the base material tape roll, and the release material tape wound around the release material tape roll It has been studied that the two are bonded while being fed out from each roll. At this time, in the base tape roll, the tag tape base layer, the first pressure-sensitive adhesive layer, the tag tape base layer, the first pressure-sensitive adhesive layer, and so on are laminated in this order. Since the first pressure-sensitive adhesive layer sticks to the tape, it is necessary to intervene with a tape for preventing this sticking. Also, the release material tape roll is laminated in the order of the second pressure-sensitive adhesive layer, the release material layer, the second pressure-sensitive adhesive layer, the release material layer, and so on to prevent the second pressure-sensitive adhesive layer from sticking to the surface of the release material layer. It is necessary to intervene separately for the tape for the above. As described above, it is necessary to prepare an anti-sticking tape in the state of a roll for both the base tape and the release material tape, resulting in complicated operations during production.

  An object of the present invention is to provide a tag tape, a tag tape roll using the tag tape, and a wireless tag circuit element cartridge that can prevent sticking of the adhesive and complication of the manufacturing process.

  In order to achieve the above object, the first invention is provided on the one side in the thickness direction of the tag tape base layer having a dimension in the width direction intersecting the tape longitudinal direction of a. A first pressure-sensitive adhesive layer having a dimension in the width direction of b, and a one-side thickness direction of the first pressure-sensitive adhesive layer for attaching the RFID tag circuit element to the object to be attached; A second pressure-sensitive adhesive layer having a dimension of d, a release material layer covering the second pressure-sensitive adhesive layer and arranged to be peelable from the second pressure-sensitive adhesive layer, and having a dimension in the width direction of e, A plurality of RFID tag circuit elements arranged at predetermined intervals in the tape longitudinal direction between one adhesive layer and the second adhesive layer, the other side in the thickness direction of the tag tape base layer; And, a predetermined release treatment is performed on at least one of the one side in the thickness direction of the release material layer, Serial a, b, d, for e, and characterized by being configured such that a ≧ b, a ≧ d, e ≧ b, e ≧ d.

  In the first invention of the present application, the width direction dimension b of the first pressure-sensitive adhesive layer and the width direction dimension d of the second pressure-sensitive adhesive layer are the same as the width direction dimension a of the base tape layer and the width direction dimension e of the release material layer. Or smaller. By limiting the size of the pressure-sensitive adhesive layer in this way, at least the pressure-sensitive adhesive can be prevented from protruding from the base tape layer or the release material layer. This also means that when the user handles the tag tape or tag label, the adhesive is attached to the hand, attached to another object when attached, or dust or dirt adheres to the protruding adhesive. Disappears.

  Also, the other side in the thickness direction of the tag tape base layer (on the side opposite to the first pressure-sensitive adhesive layer, the surface side) or one side in the thickness direction of the release material layer (on the side opposite to the second pressure-sensitive adhesive layer, on the surface side). Of these, by applying a predetermined release treatment to at least one, the first pressure-sensitive adhesive layer, the tag tape base material layer, 1 pressure-sensitive adhesive layer, ... sticking of the first pressure-sensitive adhesive layer to the surface of the tag tape base material layer when laminated in order, second pressure-sensitive adhesive layer, release material layer, second pressure-sensitive adhesive layer, release material It is possible to prevent the second pressure-sensitive adhesive layer from sticking to the surface of the release material layer when the layers are laminated in this order. As a result, it is possible to prevent complication of work during manufacturing.

  The second invention is characterized in that in the first invention, a> b, a> d, e> b, e> d.

  Accordingly, the width direction dimension b of the first pressure-sensitive adhesive layer and the width direction dimension d of the second pressure-sensitive adhesive layer are smaller than the width direction dimension a of the base tape layer and the width direction dimension e of the release material layer. It is possible to reliably prevent the tape layer and the release material layer from protruding outside.

  The third invention is characterized in that in the first invention, the configuration is such that a≈b.

  The width direction dimension b of the first pressure-sensitive adhesive layer can be made substantially the same as the width direction dimension a of the base tape layer, and at least the pressure-sensitive adhesive can be prevented from protruding from the base tape layer.

  According to a fourth invention, in any one of the first to third inventions, the predetermined release treatment is performed on one side in the thickness direction of the release material layer, and the thickness of the release material layer is further increased. A predetermined release treatment is performed on the other side in the direction.

  By applying a mold release treatment to one side of the release material layer in the thickness direction, the adhesive layer can be securely attached to the surface of the release material layer during lamination without interposing a tape to prevent sticking. In addition, the release material layer can be reliably peeled from the second pressure-sensitive adhesive layer by performing the mold release treatment on the other side in the thickness direction.

  A fifth invention is characterized in that, in any one of the first to fourth inventions, e> a is satisfied.

  As a result, the width direction dimension e of the release material is larger than all other components, so that the user can easily peel the release material by hand when attaching the RFID label.

  The sixth invention is characterized in that, in the first or fifth invention, a = b = d.

  By making the width direction dimension “a” of the base tape layer, the width direction dimension “b” of the first pressure-sensitive adhesive layer, and the width direction dimension “d” of the second pressure-sensitive adhesive layer equal, It is possible to create a nicely arranged tape that looks good. Such a configuration includes, for example, a base tape layer, a first pressure-sensitive adhesive layer, a second pressure-sensitive adhesive layer, and a release material layer that are appropriately bonded together, and then a tag tape base material layer, a first pressure-sensitive adhesive layer, and a second It can be easily formed by cutting and removing both end portions in the width direction of the pressure-sensitive adhesive layer.

  A seventh invention includes the RFID circuit element in the tag tape base layer, the first pressure-sensitive adhesive layer, and the second pressure-sensitive adhesive layer according to any one of the first to sixth inventions. A cutting line for cutting out a predetermined area to be formed is formed.

  Thereby, when using the tag label, the user peels off the four-layer structure of the tag tape base material layer, the first adhesive layer, the wireless tag circuit element, and the second adhesive layer in the inner region of the cutting line from the release material. It is possible to realize a so-called die cut type label to be attached to the target article.

  According to an eighth invention, in any one of the first to sixth inventions, the tag tape base material layer, the first pressure-sensitive adhesive layer, the second pressure-sensitive adhesive layer, and the width direction of the release material layer. Both end portions of the substrate are cut and removed.

  Thereby, a good-looking tape in which the width direction end portions of the four layers of the tag tape base material layer, the first pressure-sensitive adhesive layer, the second pressure-sensitive adhesive layer, and the release material layer are neatly arranged can be produced.

  According to a ninth invention, in any one of the first to sixth inventions, the both ends in the width direction of the tag tape base material layer, the first pressure-sensitive adhesive layer, and the second pressure-sensitive adhesive layer are cut. It has been removed.

  Thereby, it is possible to create a good-looking tape in which the end portions in the width direction of the three layers of the tag tape base material layer, the first pressure-sensitive adhesive layer, and the second pressure-sensitive adhesive layer are neatly arranged.

  In order to achieve the above object, a tag tape roll according to a tenth aspect of the present invention includes a tag tape base layer having a dimension in the width direction intersecting the tape longitudinal direction, and one thickness direction of the tag tape base layer. A first pressure-sensitive adhesive layer having a width dimension of b, and provided on one side in the thickness direction of the first pressure-sensitive adhesive layer in order to attach the RFID circuit element to an object to be attached. A second pressure-sensitive adhesive layer whose width direction dimension is d, and a release material which covers the second pressure-sensitive adhesive layer and is detachable from the second pressure-sensitive adhesive layer, and whose width direction dimension is e A plurality of RFID tag circuit elements arranged at predetermined intervals in the tape longitudinal direction between the first adhesive layer and the second adhesive layer, and the thickness of the tag tape base layer Of the other side in the thickness direction and one side in the thickness direction of the release material layer, at least A tag tape that has been subjected to a predetermined release treatment and a ≧ b, a ≧ d, e ≧ b, e ≧ d with respect to a, b, d, and e is substantially the same as the longitudinal direction of the tape. It is characterized by being wound around orthogonal axes.

  In the tenth invention of the present application, in the tag tape constituting the tag tape roll, the width direction dimension b of the first pressure-sensitive adhesive layer and the width direction dimension d of the second pressure-sensitive adhesive layer are set to the width direction dimension a of the base tape layer and It is the same as or smaller than the width direction dimension e of the release material layer. By limiting the size of the pressure-sensitive adhesive layer in this way, at least the pressure-sensitive adhesive can be prevented from protruding from the base tape layer or the release material layer. This also allows the adhesive to come in hand when the tag tape roll, tag tape, or tag label is handled by the user, or to stick to other objects when the tag label is attached, and further, dust and dirt stick out. It will not stick to.

  Also, the other side in the thickness direction of the tag tape base material layer constituting the tag tape (the side opposite to the first pressure-sensitive adhesive layer, the surface side) or one side in the thickness direction of the release material layer (the side opposite to the second pressure-sensitive adhesive layer) , Surface side) of the first pressure-sensitive adhesive layer and tag tape without applying a tape for preventing sticking to at least one of them, by applying a predetermined release treatment. Sticking of the first pressure-sensitive adhesive layer to the surface of the tag tape base material layer when laminated in the order of the base material layer, the first pressure-sensitive adhesive layer, ..., the second pressure-sensitive adhesive layer, the release material layer, the second pressure-sensitive adhesive It is possible to prevent the second pressure-sensitive adhesive layer from sticking to the surface of the release material layer when the agent layer, the release material layer,. As a result, it is possible to prevent complication of work at the time of manufacturing the tag tape and the tag tape roll.

  In order to achieve the above object, an eleventh invention is a RFID circuit element cartridge comprising a tag tape roll formed by winding a tag tape and detachably attached to a tag label producing apparatus, wherein the tag tape Is provided on one side in the thickness direction of the tag tape base material layer having a dimension in the width direction intersecting the tape longitudinal direction, and the first dimension in which the dimension in the width direction is b. An adhesive layer and a second adhesive layer provided on one side in the thickness direction of the first adhesive layer in order to attach the RFID circuit element to the object to be attached, and having a width dimension of d A release material layer covering the second pressure-sensitive adhesive layer so as to be peelable from the second pressure-sensitive adhesive layer and having a dimension in the width direction of e, the first pressure-sensitive adhesive layer, and the second pressure-sensitive adhesive layer Are arranged at predetermined intervals in the longitudinal direction of the tape A predetermined number of RFID tag circuit elements, and at least one of the other side in the thickness direction of the tag tape base material layer and the one side in the thickness direction of the release material layer is subjected to a predetermined release treatment. The a, b, d, e are configured such that a ≧ b, a ≧ d, e ≧ b, e ≧ d.

  In the 11th invention of the present application, the width direction dimension b of the first pressure-sensitive adhesive layer and the width direction dimension d of the second pressure-sensitive adhesive layer in the tag tape constituting the tag tape roll provided in the cartridge are set to The width direction dimension a is equal to or smaller than the width direction dimension e of the release material layer. By limiting the size of the pressure-sensitive adhesive layer in this way, at least the pressure-sensitive adhesive can be prevented from protruding from the base tape layer or the release material layer. This also allows the adhesive to come in hand when the tag tape roll, tag tape, or tag label is handled by the user, or to stick to other objects when the tag label is attached, and further, dust and dirt stick out. It will not stick to.

  Also, the other side in the thickness direction of the tag tape base material layer constituting the tag tape (the side opposite to the first pressure-sensitive adhesive layer, the surface side) or one side in the thickness direction of the release material layer (the side opposite to the second pressure-sensitive adhesive layer) , Surface side) of the first pressure-sensitive adhesive layer and tag tape without applying a tape for preventing sticking to at least one of them, by applying a predetermined release treatment. Sticking of the first pressure-sensitive adhesive layer to the surface of the tag tape base material layer when laminated in the order of the base material layer, the first pressure-sensitive adhesive layer, ..., the second pressure-sensitive adhesive layer, the release material layer, the second pressure-sensitive adhesive It is possible to prevent the second pressure-sensitive adhesive layer from sticking to the surface of the release material layer when the agent layer, the release material layer,. As a result, it is possible to prevent complication of work at the time of manufacturing the tag tape and the tag tape roll.

  According to the present invention, by limiting the size of the pressure-sensitive adhesive layer, it is possible to prevent at least the pressure-sensitive adhesive from protruding from the base tape layer or the release material layer. Further, sticking can be prevented without interposing a tape for preventing sticking, and complication of work during manufacturing can be prevented.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. This embodiment is an embodiment when the present invention is applied to a RFID label generation system.

  FIG. 1 is a system configuration diagram showing a wireless tag generation system to which a tag label producing apparatus including a wireless tag circuit element cartridge including a tag tape according to the present embodiment is applied.

  In the RFID tag generating system 1 shown in FIG. 1, a tag label producing device 2 is connected to a route server 4, a terminal 5, a general-purpose computer 6, and a plurality of information servers 7 via a wired or wireless communication line 3. .

  FIG. 2 is a conceptual configuration diagram showing a detailed structure of the tag label producing apparatus 2.

  In FIG. 2, the device body 8 of the tag label producing device 2 is provided with a cartridge holder portion (not shown) as a recess, and a cartridge (wireless tag circuit element cartridge) 100 is detachably attached to this holder portion. ing.

  The apparatus main body 8 includes the above-described cartridge holder portion into which the cartridge 100 is fitted and a casing 9 that forms an outer shell, and a predetermined tag label tape 110 that performs predetermined printing (printing) on a thermal tape 101 as a tag tape. A print head (thermal head) 10 to be printed, a tape feed roller drive shaft 12 for feeding the tag label tape 110 with print from the cartridge 100, and a RFID circuit element To (provided later). The antenna 14 for transmitting and receiving signals by radio communication using a high frequency such as UHF band, and the printed tag label tape 110 are cut to a predetermined length at a predetermined timing to form a label-like RFID tag T ( The cutter 15 for generating the details will be described later, and wireless at the time of signal transmission and reception by the wireless communication. The pair of transport guides 13 for setting and holding the switching circuit element To in a predetermined access area facing the antenna 14 and guiding each RFID label T after cutting, and the guided RFID label T are carried out at the outlet (discharge). A delivery roller 17 that conveys and delivers the product to an outlet 16 and a discharge sensor 18 that detects the presence or absence of the RFID label T at the carry-out port 16 are provided.

  The discharge sensor 18 is a reflective photoelectric sensor including, for example, a projector and a light receiver. When the RFID label T does not exist between the projector and the light receiver, the light output from the projector is input to the light receiver. On the other hand, when the RFID label T is present between the projector and the light receiver, the light output from the projector is shielded and the control output from the light receiver is inverted.

  On the other hand, the apparatus main body 8 also processes the signal read from the RFID circuit element To and the RF circuit 21 for accessing (reading or writing) the RFID circuit element To via the antenna 14. A signal processing circuit 22 for driving, a cartridge motor 23 for driving the tape feed roller driving shaft 12 described above, a cartridge driving circuit 24 for controlling the driving of the cartridge motor 23, and energization to the print head 10 are controlled. A printing drive circuit 25 that performs the cutting operation by driving the cutter 15, a solenoid drive circuit 27 that controls the solenoid 26, a motor 28 for the feed roller that drives the feed roller 17, A delivery roller drive circuit 29 for controlling the delivery roller motor 28, the high-frequency circuit 21, and the signal Management circuit 22, and a control circuit 30 for cartridge driving circuit 24, the print driver circuit 25, the solenoid driving circuit 27, via the delivery roller driving circuit 29, and controls the tag label producing apparatus 2 overall operation.

  The control circuit 30 is a so-called microcomputer, and although not shown in detail, is composed of a central processing unit such as a CPU, a ROM, and a RAM, and is stored in advance in the ROM while using a temporary storage function of the RAM. Signal processing is performed according to the program. The control circuit 30 is connected to, for example, the communication line 3 via the input / output interface 31, and the route server 4, the other terminal 5, the general-purpose computer 6, the information server 7 and the like connected to the communication line 3 are connected to the control circuit 30. Information can be exchanged between the two.

  FIG. 3 is an explanatory view for explaining the detailed structure of the cartridge 100 provided with the tag tape according to the present embodiment provided in the tag label producing apparatus 2.

  In FIG. 3, a cartridge 100 includes a thermal tape roll (tag tape roll) 102 around which the thermal tape 101 is wound, a tape feed roller 107 that feeds the thermal tape 101 to the outside of the cartridge 100, and a thermal tape. And a guide roller 120 that performs conveyance while turning the conveyance direction of 101.

  The heat-sensitive tape roll 102 has a strip-like shape (for example, a wireless tag) in which a plurality of the RFID circuit elements To are sequentially formed in the longitudinal direction around the reel member 102a (in other words, around an axis substantially orthogonal to the longitudinal direction of the tape). The thermal tape 101 (which is colored in a predetermined color so that the circuit element To cannot be seen from the printing side) is wound.

  The heat-sensitive tape 101 wound around the heat-sensitive tape roll 102 has a four-layer structure in this example (see a partially enlarged view in FIG. 3), and the opposite side (see FIG. 3) from the side wound on the outer side (right side in FIG. 3). 3 (left side of 3), a base film (tag tape base material layer) 101a made of PET (polyethylene terephthalate), etc., and a first adhesive layer (first adhesive layer, stationary adhesive layer made of appropriate adhesive) ) 101b, a second pressure-sensitive adhesive layer (second pressure-sensitive adhesive layer, adhesive layer for attachment) 101c made of a suitable pressure-sensitive adhesive, and a release paper (peeling material layer) 101d in this order.

  A heat-sensitive agent that develops color by heat is applied to the front surface of the base film 101a. The back side of the base film 101a is provided with the IC circuit unit 151 and the antenna 152 for storing information via the first adhesive layer 101b.

  The release paper 101d is one that can be adhered to the product or the like by the second pressure-sensitive adhesive layer 101c when the RFID label T finally completed in a label shape is attached to a predetermined product or the like by peeling it off. is there.

  The tape feed roller 107 is rotationally driven by transmitting the driving force of the cartridge motor 23 (see FIG. 2 described above), for example, a pulse motor provided outside the cartridge 100 to the tape feed roller drive shaft 12. .

  When the cartridge 100 is mounted on the cartridge holder portion of the tag label producing apparatus 2 and a roller holder (not shown) is moved from the separation position to the contact position, the thermal tape 101 is placed between the print head 10 and the platen roller 108. While being pinched, it is pinched between the tape feed roller 107 and the sub roller 109. As the tape feed roller drive shaft 12 is driven by the drive force of the cartridge motor 23 (see FIG. 2), the tape feed roller 107, the sub roller 109, and the platen roller 108 rotate in synchronization with each other from the thermal tape roll 102. The thermal tape 101 is fed out and turned by the guide roller 120 and then supplied to the print head 10 side.

  In the print head 10, the plurality of heating elements are energized by the print drive circuit 25 (see FIG. 2), whereby the print is printed on the surface of the base film 101 a of the thermal tape 101 to form a tag label tape 110 with print. Then, it is carried out of the cartridge 100. In addition, it is good also as printing using an ink ribbon.

  FIG. 4 is a functional block diagram showing detailed functions of the high-frequency circuit 21. In FIG. 4, the high-frequency circuit 21 receives a transmission unit 32 that transmits a signal to the RFID circuit element To through the antenna 14 and a reflected wave from the RFID circuit element To that is received by the antenna 14. The unit 33 and the transmission / reception separator 34 are configured.

The transmitting unit 32 generates a carrier wave for accessing (reading or writing) the RFID tag information of the IC circuit unit 151 of the RFID circuit element To, a crystal resonator 35, and a PLL (Phase
The generated carrier wave is modulated on the basis of a signal supplied from the signal processing circuit 22 (Locked Loop) 36 and VCO (Voltage Controlled Oscillator) 37 (in this example, a “TX_ASK” signal from the signal processing circuit 22 Transmission multiplier circuit 38 (amplitude modulation based on the above) (in the case of amplitude modulation, an amplification factor variable amplifier or the like may be used), and a transmission amplifier 39 that amplifies the modulated wave modulated by the transmission multiplier circuit 38. ing. The generated carrier wave preferably uses a frequency in the UHF band, and the output of the transmission amplifier 39 is transmitted to the antenna 14 via the transmission / reception separator 34, and the IC circuit of the RFID circuit element To Supplied to the unit 151.

  The reception unit 33 is necessary from the reception first multiplication circuit 40 that multiplies the reflected wave from the RFID circuit element To received by the antenna 14 and the generated carrier wave, and the output of the reception first multiplication circuit 40. Received by the antenna 14, the first band-pass filter 41 for extracting only a signal in a wide band, the reception first amplifier 43 that amplifies the output of the first band-pass filter 41 and supplies the amplified signal to the first limiter 42. The reception second multiplication circuit 44 that multiplies the reflected wave from the RFID circuit element To and the carrier wave that has been generated and delayed in phase by 90 °, and a necessary band from the output of the reception second multiplication circuit 44. The second band pass filter 45 for extracting only the signal and the output of the second band pass filter 45 are input and amplified and supplied to the second limiter 46. Receiving second amplifier 47. The signal “RXS-I” output from the first limiter 42 and the signal “RXS-Q” output from the second limiter 46 are input to the signal processing circuit 22 and processed.

  The outputs of the reception first amplifier 43 and the reception second amplifier 47 are also input to an RSSI (Received Signal Strength Indicator) circuit 48, and a signal “RSSI” indicating the strength of these signals is input to the signal processing circuit 22. It has become so. In this way, in the tag label producing apparatus 2 according to the present embodiment, the reflected wave from the RFID circuit element To is demodulated by IQ orthogonal demodulation.

  FIG. 5 is a functional block diagram showing a functional configuration of the RFID circuit element To provided in the above-described tag tape 110 with print.

  In FIG. 5, the RFID circuit element To includes an antenna 14 on the tag label producing apparatus 2 side and the antenna (tag antenna) 152 that transmits and receives signals in a non-contact manner using a high frequency such as a UHF band, and the antenna 152. And the IC circuit portion 151 connected to the terminal.

  The IC circuit unit 151 includes a rectification unit 153 that rectifies the carrier wave received by the antenna 152, a power supply unit 154 that accumulates energy of the carrier wave rectified by the rectification unit 153 and serves as a driving power source, and the antenna 152. A clock extraction unit 156 that extracts a clock signal from the received carrier wave and supplies the clock signal to the control unit 155, a memory unit 157 that functions as an information storage unit that can store a predetermined information signal, and a modem that is connected to the antenna 152 And a controller 155 for controlling the operation of the RFID circuit element To via the rectifier 153, the clock extractor 156, the modem 158, and the like.

  The modem 158 demodulates the radio communication signal received from the antenna 152 of the tag label producing apparatus 2 received by the antenna 152 and modulates the carrier wave received from the antenna 152 based on the response signal from the control unit 155. reflect.

  The control unit 155 interprets the received signal demodulated by the modulation / demodulation unit 158, generates a return signal based on the information signal stored in the memory unit 157, and performs basic control such as returning by the modulation / demodulation unit 158. Execute proper control.

  FIG. 6 shows a screen displayed on the terminal 5 or the general-purpose computer 6 when accessing (reading or writing) the RFID tag information of the IC circuit unit 151 of the RFID circuit element To by the tag label producing apparatus 2 as described above. It is a figure showing an example.

  In FIG. 6, in this example, the tag label type (access frequency and tape size), the printed character R printed corresponding to the RFID circuit element To, and the access (reading) that is an ID unique to the RFID circuit element To. (Or write) ID, the address of the article information stored in the information server 7, the storage address of the corresponding information in the route server 4, etc. can be displayed on the terminal 5 or the general-purpose computer 6. Then, the tag label producing apparatus 2 is operated by the operation of the terminal 5 or the general-purpose computer 6 so that the print character R is printed on the cover film 103 and the corresponding RFID tag information such as article information is received from the IC circuit unit 151. It is read (or written to the IC circuit unit 151).

  In the basic configuration described above, the greatest feature of the present embodiment is the dimensional relationship in the width direction of the base film 101a, the first adhesive layer 101b, the second adhesive layer 101c, and the release paper 101d constituting the thermal tape 101. The details will be described below.

  FIGS. 7A and 7B are external views of the RFID label T formed after the information reading (or writing) of the RFID circuit element To and the cutting of the printed tag label tape 110 are completed as described above. FIG. 7A is a top view, and FIG. 7B is a bottom view. FIG. 8 is a cross-sectional view taken along section VIII-VIII ′ in FIG.

  7A, 7B, and 8, the RFID label T has a four-layer structure as described above with reference to FIG. 3, and extends from the upper side to the opposite side in FIG. The width direction (vertical direction in FIGS. 7A and 7B) and the horizontal direction in FIG. 8 intersecting with the longitudinal direction of the tape (horizontal direction in FIGS. 7A and 7B, vertical direction in FIG. 8). Base film 101a having a dimension of a in the direction (the same applies hereinafter), a first adhesive layer 101b having a width dimension of b, a second adhesive layer 101c having a width dimension of d, and a release paper having a width dimension of e. 101d constitutes four layers. At this time, the relations a ≧ b and a ≧ d and e ≧ b and e ≧ d are established between the width-direction dimensions a, b, d and e (the example shown in FIG. 8 is , Which represents an inequality sign that is not an equal sign). In other words, the base film 101a is configured such that the width direction dimension a is always greater than or equal to at least one of the first adhesive layer 101b and the second adhesive layer 101c. The width direction dimension e is always greater than or at least equal to either the first adhesive layer 101b or the second adhesive layer 101c. Further, particularly in this example, e> a, that is, the width direction dimension e of the release paper 101d is larger than the width direction dimension of the base film 101a (in other words, all including the first adhesive layer 101b and the second adhesive layer 101c). The maximum width direction dimension of these layers is configured).

  As described above, the RFID circuit element To is provided so as to be sandwiched between the first adhesive layer 101b and the second adhesive layer 101c, and the print R (in this example, wireless) is provided on the surface of the base film 101a. “RF-ID” indicating the type of tag label T) is printed.

  Another feature of the present embodiment is a release process for the release paper 101d. As described above, the release paper 101d peels off the RFID label T when the RFID label T is attached to a predetermined product or the like. Therefore, the surface on the second adhesive layer 101c side (the upper side in FIG. 8) is easy to peel off. Thus, for example, a known mold release process x1 made of silicon, fluorine coating or the like is performed. In addition to this, in the heat-sensitive tape 101 of the present embodiment, the surface of the release paper 101d opposite to the second adhesive layer 101c side (the lower side in FIG. 8) is also similar to the above (however, the release treatment x1). (A process having different physical properties from that of the mold) may be performed.

  In the present embodiment configured as described above, the wireless label taken out from the cartridge 100 of the tag label producing apparatus 2 as the printed tag label tape 110 and set and held at a predetermined position (access area) facing the antenna 14 by the transport guide 13. The tag circuit element To is sequentially accessed (reading of the RFID tag information of the IC circuit unit 151 or writing to the IC circuit unit 151), and the RFID tag label T is cut by the cutter 15 for each RFID circuit element To. Is generated. The generated RFID label T is used after being peeled off by the user after the release paper 101d is peeled off and the second adhesive layer 101c is exposed, and then attached to various articles and the like through the second adhesive layer 101c. .

  As described above, in the present embodiment, in the thermal tape 101, the width direction dimension b of the first adhesive layer 101b and the width direction dimension d of the second adhesive layer 101c are set to the width direction dimension a of the base film 101a and the release paper. It is the same as or smaller than the width direction dimension e of 101d. By limiting the dimensions of the adhesive layers 101b and 101c in this way, at least the adhesive can be prevented from protruding from the base film 101a or the release paper 101d to the outside in the tape width direction. This also allows the adhesive to be in hand when the user handles the thermal tape 101 or the RFID label T manufactured therefrom, or to stick to other objects when being attached, and further, dust and dirt stick out. It will not stick to. In particular, in this embodiment, the width direction dimension b of the first adhesive layer 101a and the width direction dimension d of the second adhesive layer 101c are smaller than the width direction dimension a of the base film 101a and the width direction dimension e of the release paper 101d. Therefore, it is possible to reliably prevent the adhesive from protruding from the base film 101a or the release paper 101d. In this embodiment, since the width e of the release paper is larger than all other components, the user can easily remove the release paper 101d by hand when attaching the RFID label T. There is also.

  On the other hand, at the time of manufacturing the thermal tape roll 102, from the viewpoint of eliminating the waste of the RFID circuit element To and preventing the increase in cost, a tape (base) which is provided with a first adhesive layer 101b on the base film 101a and has a predetermined width is prepared in advance. A tape (peeling material tape) composed of the second adhesive layer 101c and the release paper 101d is attached to one side of the material tape) with the RFID circuit element To interposed therebetween, and these are paired and wound in the radial direction several times. (The second pressure-sensitive adhesive layer 101c and the first pressure-sensitive adhesive layer 101b are firmly bonded to each other, and when the tag tape is manufactured, the release material tape is once placed on the first pressure-sensitive adhesive layer 101b side. After pasting, the second adhesive layer 101c and the first adhesive layer 101b are almost integrally attached, and only the release paper 101d can be peeled). Thus, when the base tape and the release material tape are bonded together, each of the base tape wound around the base tape roll and the release material tape wound around the release tape roll is actually It has been studied to stick together while unwinding from a roll. At this time, in the base tape roll, the base film 101a, the first adhesive layer 101b, the base film 101a, the first adhesive layer 101b,... Are laminated in this order, and the second adhesive layer 101c and the release paper 101d are similarly laminated in the release material tape roll. , Second adhesive layer 101c, release paper 101d, and so on. As a result, as it is, the base tape roll has the first adhesive layer 101b attached to the surface of the base film 101a, and the release tape has the second adhesive layer 101c attached to the surface of the release paper 101d. It is necessary to separately interpose a tape for preventing sticking between them, which leads to complication of work during production.

  Therefore, in the present embodiment, not only the release treatment x1 of the release paper 101d that is normally applied to the second pressure-sensitive adhesive layer 101c side, but also the predetermined release on the side opposite to the second pressure-sensitive adhesive layer 101c (surface side). Mold processing x2 is performed. FIG. 9 is a conceptual side view showing a detailed structure of a release material tape roll 101A-R wound with the release material tape 101A (= second adhesive layer 101c + release paper 101d), and FIG. FIG. 10 is a cross-sectional view taken along the line XX ′ in FIG. 9 showing a laminated structure of two release material tapes 101A adjacent in the radial direction of the material tape roll 101A.

  As shown in FIG. 9 and FIG. 10, when the release material tape 101A having a laminated structure composed of the second adhesive layer 101c and the release paper 101d is wound to form the release material tape roll 101A, the laminated structure is the diameter of the roll. As shown in FIG. 10, the second adhesive layer 101c included in the release material tape layer on the radially inner side (lower side in FIG. 10) and adjacent to the radially outer side (upper side in FIG. 10). The release paper 101d included in the release material tape layer to be in contact comes into contact. In this embodiment, the predetermined release treatment x2 is also applied to the opposite side (front side) of the release paper 101d to the second pressure-sensitive adhesive layer 101c, so that no tape for preventing sticking is interposed. The sticking of the second adhesive layer 101c to the surface of the release paper 101d at the time of contact can be prevented. As a result, it is possible to prevent complication of work during manufacturing.

  In this example, the second pressure-sensitive adhesive layer 101c on the surface of the release paper 101d when the release material tape 101A is laminated by performing the release treatment x2 on the opposite side (front side) of the release paper 101d to the second pressure-sensitive adhesive layer 101c. However, instead of (or in addition to) this, a similar mold release treatment may be performed on the opposite side (surface side) of the first adhesive layer 101b of the base film 101a (illustrated). Is omitted). In this case, similarly to the above, the base film when the base film 101a, the first adhesive layer 101b, the base film 101a, the first adhesive layer 101b,. Sticking of the first adhesive layer 101b to the surface of 101a can be prevented, and complication of work during production can be prevented.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit and technical idea of the present invention. Hereinafter, such modifications will be described.

(1) Dimensional Variation In the above embodiment, the base film 101a (width direction dimension a), the first adhesive layer 101b (width direction dimension b), the second adhesive layer 101c (width direction dimension d), and the release paper 101d. About (width direction dimension e), although it was set as a> = b, e> = b, c> a, e> a, it is not restricted to this. The basic effect of the present invention is not limited to this as long as the effect of preventing the adhesive from protruding from the base film 101a and the release paper 101d is obtained, and a ≧ b, e ≧ b, a ≧ c, e ≧ Other modifications are also conceivable as long as c is satisfied.

  FIG. 11 is a diagram illustrating an example in which a> e is set as an example of such a modification, and FIG. 12 is a diagram illustrating an example in which a≈b is set as another example.

  FIG. 13 is a diagram illustrating an example in which a = b = d as yet another example. In this case, by making the width direction dimension a of the base film 101a, the width direction dimension b of the first adhesive layer 101b, and the width direction dimension d of the second adhesive layer 101c all equal, the width direction of the three layers excluding the release paper 101d The printed tag label tape 110 and the RFID label T having a good appearance and having good end portions can be produced. In addition, such a structure, for example, after bonding the base film 101a, the first adhesive layer 101b, the second adhesive layer 101c, and the release paper 101d, the base film 101a, the first adhesive layer 101b, the second adhesive layer 101c It can be easily formed by cutting and removing both end portions in the width direction.

(2) Dimensional alignment by removing both ends in the width direction Printed tag label satisfying a ≧ b, e ≧ b, a ≧ c, and e ≧ c as described above in the embodiment and the modified example of (1). After the tape 110 is produced, the both ends of the tape in the tape width direction are cut and removed using an appropriate cutting means (may be provided separately in the tag label producing apparatus 2 or another cutter outside the apparatus may be used). The width dimension may be trimmed.

  FIG. 14A and FIG. 14B show a case where the tag label tape 110 with print (the structure shown in FIG. 8) according to the above embodiment is cut as an example. FIG. 14A shows a state before cutting along the cutting line C, and FIG. 14B shows the cutting of the base film 101a, the first adhesive layer 101b, the second adhesive layer 101c, and the release paper 101d along the cutting line C. Thereafter, both ends in the width direction are removed as shown by broken line arrows in FIG.

  As a result, as shown in FIG. 14B, the tape and the label having a good appearance in which the end portions in the width direction of the four layers of the base film 101a, the first adhesive layer 101b, the second adhesive layer 101c, and the release paper 101d are neatly arranged. Can be created.

  15 (a) and 15 (b) show other examples, FIG. 15 (a) shows a state before cutting along the cutting line C, and FIG. 15 (b) shows the base film 101a along the cutting line C. After cutting only the 1st adhesion layer 101b and the 2nd adhesion layer 101c, the state which removed the both ends of the width direction as shown by the broken line arrow in Drawing 15 (a) is shown.

  As a result, as shown in FIG. 15B, the widthwise ends of the three layers of the base film 101a, the first adhesive layer 101b, and the second adhesive layer 101c are neatly aligned while leaving the release paper 101d wide. You can make good looking tapes and labels.

(3) Die-cut label After producing the printed tag label tape 110 satisfying a, e ≧ b, c as described above as in the above embodiment and the modified example of (1), further appropriate (tag label production) A so-called die-cut type label may be created using a separate cutter provided on the apparatus 2 or another cutter outside the apparatus.

  FIG. 16A, FIG. 16B, and FIG. 17 show a case where the printed tag label tape 110 (structure shown in FIG. 13) according to the modified example of (1) is cut as an example. FIG. 16A shows a state before cutting along the cutting line DC, and FIG. 17 shows a top view of this state as viewed from the upper side in FIG. As shown in FIGS. 16A and 17, the cutting line DC is formed to cut out a predetermined area including the RFID circuit element To as a die-cut label.

  FIG. 16B shows the remaining state after the base film 101a, the first adhesive layer 101b, and the second adhesive layer 101 are cut by the cutting line DC, and then the predetermined area (die-cut label portion) inside is peeled off. Represents.

  In this modification, in this way, when the tag label is used, the user has a three-layer structure (wireless tag circuit) of the base film 101a, the first adhesive layer 101b, and the second adhesive layer 101c in the inner region of the cutting line DC. If the element To is included, a so-called die-cut type label can be realized in which the four-layer structure) is peeled off and attached to the target article.

(4) Others In the above, printing is performed by contacting the base film 101a from the outside of the cartridge 100 with the print head 10, but the present invention is not limited to this, and printing may be performed from the inside of the cartridge 100.

  In the above description, the apparatus is not limited to a cartridge 100 that can be attached to and detached from the tag label producing apparatus 2 side, but a so-called installation type or integral type that cannot be attached to or detached from the apparatus main body side is used, and the thermal tape roll 102 is included therein. Etc. may be provided. In this case, the same effect is obtained.

  Furthermore, in the above, the tag label producing device 2 reads or writes the RFID tag information from the IC circuit unit 151 of the RFID circuit element To and identifies the RFID circuit element To by the thermal head 10. Although printing (printing) is performed, this printing is not necessarily performed, and only reading or writing of the RFID tag information may be performed.

  In addition, although not illustrated one by one, the present invention is implemented with various modifications within a range not departing from the gist thereof.

1 is a system configuration diagram showing a wireless tag generation system to which a tag label producing apparatus including a wireless tag circuit element cartridge including a tag tape according to an embodiment of the present invention is applied. It is a notional block diagram showing the detailed structure of the tag label production apparatus shown in FIG. FIG. 3 is an explanatory diagram for explaining a detailed structure of the cartridge shown in FIG. 2. It is a functional block diagram showing the detailed function of the high frequency circuit shown in FIG. It is a functional block diagram showing the functional structure of a wireless tag circuit element. It is a figure showing an example of the screen displayed on a terminal or a general purpose computer in accessing wireless tag information. It is the upper side figure and bottom view showing an example of the external appearance of the RFID label formed with the tag label production apparatus. FIG. 8 is a transverse sectional view taken along a section VIII-VIII ′ in FIG. 7. It is a conceptual side view showing the detailed structure of the peeling material tape roll shown in FIG. FIG. 10 is a cross-sectional view taken along the line XX ′ in FIG. 9 showing a laminated structure of two base tapes adjacent in the radial direction of the release material tape roll. It is a figure showing the modification set as a> e. It is a figure showing the modification which made it a = b. It is a figure showing the modification set as a = b = d. It is a figure showing the modification which cut and removed the tape width direction both ends and trimmed the width dimension. It is a figure showing the other modification which cut and removed the tape width direction both ends and trimmed the width dimension. It is sectional drawing showing the state before the cutting | disconnection of the modification which produces a die-cut label, and the state which peeled the label after cutting | disconnection. It is sectional drawing showing the state after the cutting | disconnection of the modification which produces a die-cut label.

Explanation of symbols

2 Tag label production device 100 Cartridge (Radio tag circuit element cartridge)
101 Thermal tape (tag tape)
101a Base film (tag tape base layer)
101b First adhesive layer (first adhesive layer)
101c 2nd adhesive layer (2nd adhesive layer)
101d Release paper (release material layer)
102 Thermal tape roll (tag tape roll)
C cutting line DC cutting line To RFID tag circuit element x1, x2 Release processing section

Claims (11)

A tag tape base material layer whose width direction crossing the tape longitudinal direction is a,
A first pressure-sensitive adhesive layer which is provided on one side in the thickness direction of the tag tape base material layer, and the dimension in the width direction is b;
A second pressure-sensitive adhesive layer provided on one side in the thickness direction of the first pressure-sensitive adhesive layer in order to attach the RFID circuit element to the object to be pasted, and a dimension in the width direction being d;
A release material layer covering the second pressure-sensitive adhesive layer and arranged to be peelable from the second pressure-sensitive adhesive layer, wherein the dimension in the width direction is e;
Between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer, a plurality of RFID tag circuit elements arranged at predetermined intervals in the tape longitudinal direction,
Of the other side of the tag tape base layer in the thickness direction and the one side in the thickness direction of the release material layer, at least one is subjected to a predetermined release treatment,
About a, b, d, e
a ≧ b, a ≧ d,
e ≧ b, e ≧ d
A tag tape characterized by being configured as follows. The tag tape according to claim 1, wherein
a> b, a> d,
e> b, e> d
A tag tape characterized by being configured as follows. The tag tape according to claim 1, wherein
a ≒ b
A tag tape characterized by being configured as follows. In the tag tape according to any one of claims 1 to 3,
A tag tape, wherein the predetermined release treatment is performed on one side in the thickness direction of the release material layer, and the predetermined release treatment is further performed on the other side in the thickness direction of the release material layer. In the tag tape according to any one of claims 1 to 4,
e> a
A tag tape characterized by being configured as follows. In the tag tape according to claim 1 or 5,
a = b = d
A tag tape characterized by being configured as follows. The tag tape according to any one of claims 1 to 6,
A tag tape, wherein a cut line for cutting a predetermined region including the RFID circuit element is formed in the tag tape base material layer, the first pressure-sensitive adhesive layer, and the second pressure-sensitive adhesive layer. The tag tape according to any one of claims 1 to 6,
A tag tape, wherein both end portions in the width direction of the tag tape base material layer, the first pressure-sensitive adhesive layer, the second pressure-sensitive adhesive layer, and the release material layer are cut and removed. The tag tape according to any one of claims 1 to 6,
A tag tape, wherein both end portions in the width direction of the tag tape base material layer, the first pressure-sensitive adhesive layer, and the second pressure-sensitive adhesive layer are cut and removed. A tag tape base material layer whose width direction crossing the tape longitudinal direction is a,
A first pressure-sensitive adhesive layer which is provided on one side in the thickness direction of the tag tape base material layer, and the dimension in the width direction is b;
A second pressure-sensitive adhesive layer that is provided on one side in the thickness direction of the first pressure-sensitive adhesive layer in order to attach the RFID circuit element to the object to be pasted, and that the dimension in the width direction is d;
A release material layer covering the second pressure-sensitive adhesive layer and arranged to be peelable from the second pressure-sensitive adhesive layer, wherein the dimension in the width direction is e;
Between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer, a plurality of RFID tag circuit elements arranged at predetermined intervals in the tape longitudinal direction,
Of the other side of the tag tape base layer in the thickness direction and the one side in the thickness direction of the release material layer, at least one is subjected to a predetermined release treatment,
About a, b, d, e
a ≧ b, a ≧ d,
e ≧ b, e ≧ d
A tag tape configured to be
A tag tape roll characterized by being wound around an axis substantially perpendicular to the tape longitudinal direction. A tag circuit roll cartridge comprising a tag tape roll configured by winding a tag tape and configured to be detachable from a tag label producing device,
The tag tape is
A tag tape base material layer whose width direction crossing the tape longitudinal direction is a,
A first pressure-sensitive adhesive layer which is provided on one side in the thickness direction of the tag tape base material layer, and the dimension in the width direction is b;
A second pressure-sensitive adhesive layer that is provided on one side in the thickness direction of the first pressure-sensitive adhesive layer in order to attach the RFID circuit element to the object to be pasted, and that the dimension in the width direction is d;
A release material layer covering the second pressure-sensitive adhesive layer and arranged to be peelable from the second pressure-sensitive adhesive layer, wherein the dimension in the width direction is e;
Between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer, a plurality of RFID tag circuit elements arranged at predetermined intervals in the tape longitudinal direction,
Of the other side of the tag tape base layer in the thickness direction and the one side in the thickness direction of the release material layer, at least one is subjected to a predetermined release treatment,
About a, b, d, e
a ≧ b, a ≧ d,
e ≧ b, e ≧ d
A wireless tag circuit element cartridge, characterized in that:

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