JP2008129146A - Liquid crystal device, manufacturing method of liquid crystal device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal device which is made compact and whose cost is reduced, and which secures satisfactory display brightness by reliably preventing lifting of a display panel, and also to provide a manufacturing method of the liquid crystal device, and an electronic apparatus. <P>SOLUTION: In the liquid crystal device, an FPC substrate 10 is made of a flexible substrate, is bent and, thereby, is superimposed and fixed to the surface side opposite to the display surface of a liquid crystal panel 100, and a frame 300 has a boss pin 15 formed thereon. The FPC substrate 10 has an insertion hole 13 to insert the boss pins 15 therethrough, the boss pin 15 is made by disposing a head part having a cross-section area larger than the cross-section of the base end part more on the tip end side from at least the base end part, and the FPC substrate 10 is arranged on the base end side from the head part of the boss pin 15 which is inserted into the insertion hole 13. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a liquid crystal device, a method for manufacturing a liquid crystal device, and an electronic apparatus.

Currently, in various electronic devices such as mobile phones and portable information terminals, liquid crystal devices are used as display units for visually displaying various types of information.
As an example of such a liquid crystal device, a liquid crystal device including a liquid crystal panel which is an example of a display panel, a backlight (illumination device), and a frame for housing the liquid crystal panel and the backlight is known.

  The liquid crystal panel includes a pair of substrates, a sealing material formed between the pair of substrates along the outer periphery of the substrate, and a liquid crystal disposed in a region surrounded by the pair of substrates and the sealing material. It is what is done. The backlight generally includes a light guide plate made of a light-transmitting resin and a light source that generates light. As such a light source, for example, an LED (Light Emitting Diode), a cold cathode tube, or the like can be used, and light emitted from the light source is introduced into the light guide plate and then travels through the light guide plate. Display is performed by emitting planar light from the light exit surface of the light plate to the liquid crystal layer of the liquid crystal device.

  The liquid crystal panel is connected to a wiring board having flexibility, such as an FPC (Flexible Printed Circuit). In this wiring board, for example, a driving circuit and an input terminal necessary for driving a liquid crystal panel are formed. By connecting an external power source and various external devices to the input terminal, the wiring board A drive signal and electric power can be supplied to the liquid crystal panel via this. In addition, an LED as a light source is mounted, and the liquid crystal panel can be irradiated with transmitted light by a light guide plate or a prism sheet. Mounting the light source (LED) on the wiring board is beneficial in terms of cost.

  Such a wiring board is generally bent after being drawn straight from the liquid crystal panel (display panel) for reasons such as downsizing of the liquid crystal device and increasing design flexibility. Used in a state where stress is generated. In addition, the liquid crystal panel is housed in the frame by being attached to the backlight with an adhesive tape having light shielding properties. However, as the light shielding region of the liquid crystal panel is reduced, the liquid crystal panel is used as a light shielding region. The surface area of adhesive tape is also getting smaller.

  Therefore, as shown in FIG. 13, the liquid crystal panel 53 and the backlight 54 cannot be bonded together by the adhesive force of the adhesive tape 52 as described above due to the reaction force of the wiring substrate 51, and the liquid crystal panel 53 is not backed. There is a risk of peeling off the light 54 and floating from the frame 55.

  As described above, when the liquid crystal panel 53 is peeled off from the backlight 54, a problem such as uneven surface luminance of the liquid crystal display surface occurs. Further, when the liquid crystal panel 53 is lifted from the frame 55, the positional relationship between the backlight 54 and the liquid crystal panel 53 changes, so that the light of the backlight 54 cannot be used effectively, and the display quality of the liquid crystal device 50 is improved. There is a problem that it falls.

Therefore, as shown in FIG. 14, a configuration has been considered in which the reaction force of the wiring substrate 51 is suppressed by providing the rib 61 and the like and pressing the liquid crystal panel 53 and the wiring substrate 51 (see Patent Document 1).
JP 2006-98811 A

  However, it is often insufficient to hold only the wiring board against the floating of the liquid crystal panel. In addition, the structure for holding the liquid crystal panel may cause the panel to crack due to the ribs or the like strongly pressing the liquid crystal panel during an impact at the time of dropping. Further, a structure in which the polarizing plate is pressed by a rib or the like has been proposed. Such a structure is effective against the floating of the liquid crystal panel, but the size of the outer shape becomes large and cannot meet the current customer needs for a compact structure. For this reason, there is a demand for a structure in which the outer shape is stored compactly and the liquid crystal panel is reliably prevented from floating.

  Further, due to variations in the length of the wiring board and the design (tolerance) of the frame, there has been a problem that it becomes difficult to incorporate ribs or the like, and the pressing of the wiring board by the ribs becomes weak.

  The present invention has been made in view of the above problems, and the object thereof is to reliably prevent floating of the display panel and ensure good display luminance while achieving downsizing and cost reduction. To provide a liquid crystal device, a method for manufacturing the liquid crystal device, and an electronic apparatus.

  In order to solve the above-described problems, a liquid crystal device according to the present invention includes an electro-optical panel including an electro-optical material, a wiring board connected to the electro-optical panel, and a frame that houses at least the electro-optical panel. The device is a device, and the wiring substrate is made of a flexible substrate, and is bent and fixed on the surface opposite to the display surface of the electro-optical panel by bending the wiring substrate, and the frame is formed on the frame. In addition, the wiring board has a protrusion for fixing the wiring board, the wiring board has an insertion hole through which the wiring board fixing protrusion can be inserted, and the wiring board fixing protrusion has a cross section larger than the cross-sectional area of the base end. An enlarged portion having an area is provided at least on the distal end side relative to the proximal end side, and the wiring board is disposed on the proximal end side relative to the enlarged portion of the wiring board fixing convex portion inserted through the insertion hole. To do.

  According to the liquid crystal device of the present invention, the wiring board in a curved posture can be positioned with respect to the frame by inserting the wiring board fixing convex part integrally formed on the frame into the insertion hole of the wiring board. Bending stress (a reaction force in a transverse direction perpendicular to the optical axis) can be suppressed. In addition, even if a load such as an impact is applied and the wiring board fixing convex portion is about to come out from the insertion hole, the wiring board fixing convex portion is prevented from coming out of the insertion hole by being caught in the enlarged portion of the wiring board fixing convex portion. It has become. In this way, the wiring board is fixed to the frame while the insertion state of the wiring board fixing convex portion and the insertion hole is securely maintained, so that the bending stress of the wiring board (the reaction force in the vertical direction along the optical axis) Can be suppressed. Therefore, it is possible to prevent the electro-optical panel from floating from the inside of the frame. In this way, by reliably preventing the display panel from floating, it is possible to achieve a good display without unevenness in brightness and maintain the display quality of the image for a long period of time. In addition, it is possible to reduce the size of the entire apparatus and reduce the cost.

  A liquid crystal device according to the present invention is a liquid crystal device including an electro-optical panel including an electro-optical material, a wiring substrate connected to the electro-optical panel, and a frame that accommodates at least the electro-optical panel. The wiring board is fixed on the surface of the electro-optical panel opposite to the display surface by bending the wiring board, and the frame is formed on the frame. And the wiring board has an insertion hole through which the wiring board fixing convex part can be inserted, and the insertion state of the wiring board with the insertion hole of the wiring board is at least on the distal end side than the base end side of the wiring board fixing convex part. A retaining member to be maintained is provided, and the wiring board is disposed closer to the base end side than the retaining member of the wiring substrate fixing convex portion inserted through the insertion hole.

  According to the liquid crystal device of the present embodiment, the wiring board in a curved posture can be positioned with respect to the frame by inserting the wiring board fixing protrusion integrally formed on the frame through the insertion hole of the wiring board. The bending stress of the substrate (the reaction force in the lateral direction perpendicular to the optical axis) can be suppressed. In addition, even if a load such as an impact is applied and the wiring board fixing convex portion is about to come out from the insertion hole, the wiring board fixing convex portion is prevented from coming out of the insertion hole by being caught by the fastening member of the wiring board fixing convex portion. It has become. In this way, the wiring board is fixed to the frame while the insertion state of the wiring board fixing convex portion and the insertion hole is securely maintained, so that the bending stress of the wiring board (the reaction force in the vertical direction along the optical axis) Can be suppressed.

  Therefore, it is possible to prevent the electro-optical panel from floating from the inside of the frame. In this way, by reliably preventing the display panel from floating, it is possible to achieve a good display without unevenness in brightness and maintain the display quality of the image for a long period of time. In addition, it is possible to reduce the size of the entire apparatus and reduce the cost.

It is also preferable that the fastening member also serves as a frame member that houses the electro-optical panel, the wiring board, and the frame.
With such a configuration, the fastening member also serves as a frame member that accommodates the electro-optical panel, the lighting device, the wiring board, and the frame, so that the reaction force of the wiring board can be offset simply by housing each of the above-described components. can do. In addition, the holding state of the electro-optical panel housed in the frame can be ensured, and at the same time, the wiring substrate can be protected in addition to the electro-optical panel. Further, by being accommodated in the frame member, the wiring substrate disposed on the back surface side of the electro-optical panel is accommodated along the bottom of the frame member, so that bending of the wiring substrate is prevented. As described above, it is not necessary to separately prepare members for housing the electro-optical panel, the wiring board, and the frame, so that the number of parts can be reduced and the cost can be reduced.

It is also preferable that the wiring board fixing convex portion is provided on the display surface side surface of the electro-optical panel in the frame.
According to such a configuration, the wiring board can be fixed in the vicinity of the connection portion between the wiring board and the liquid crystal panel. As a result, it is possible to prevent the wiring board from being displaced from the frame by eliminating the bending of the wiring board at the connection portion. Therefore, the reaction force of the wiring board can be effectively suppressed, and the electro-optical panel is reliably prevented from floating.

The insertion hole is also preferably provided in a region between the region connected to the electro-optical panel in the wiring board and the curved region.
According to such a configuration, the wiring board can be fixed in the vicinity of the connection portion between the wiring board and the liquid crystal panel. As a result, it is possible to prevent the wiring board from being displaced from the frame by eliminating the bending of the wiring board at the connection portion. Therefore, the reaction force of the wiring board can be effectively suppressed, and the electro-optical panel is reliably prevented from floating.

The liquid crystal device further includes an illumination device including a light source mounted on the wiring board and a light guide plate that guides light from the light source to the electro-optical panel, and the light source is guided by the wiring board being curved. It is also preferable that it is disposed at a position facing the light incident end face.
According to such a configuration, the wiring substrate is made, so that the liquid crystal device can be made compact, and the light emitted from the light source of the illumination device can be irradiated to the electro-optical panel via the light guide plate. . Furthermore, since the positional relationship between the lighting device and the electro-optical panel is established by providing the liquid crystal device, light from the lighting device can be used effectively. Further, since the optical axis is not shifted, it is possible to prevent the display screen from becoming dark and to secure a good display luminance. As described above, by reliably preventing the electro-optical panel from floating, it is possible to perform a good display without unevenness in luminance, and to maintain the display quality of an image for a long period of time.

  The method for manufacturing a liquid crystal panel according to the present invention is a method for manufacturing a liquid crystal device including: an electro-optical panel including an electro-optical material; a wiring board connected to the electro-optical panel; and a frame containing at least the electro-optical panel. The wiring board is bent and fixed on the surface opposite to the display surface of the electro-optical panel, and the wiring board is fixed on the frame in the insertion hole formed in the wiring board. By inserting stress into the distal end side of the wiring board fixing convex part inserted through the insertion hole and the insertion step for inserting the convex part, the proximal side is at least on the distal side from the proximal side of the wiring board fixing convex part And an enlarged portion forming step of forming an enlarged portion having a cross-sectional area larger than the cross-sectional area.

  According to such a method of manufacturing a liquid crystal device, the wiring substrate fixing convex portion integrally formed on the frame is inserted into the insertion hole formed in the wiring substrate, whereby the reaction force of the wiring substrate (the transverse force orthogonal to the optical axis is obtained). Direction force) and by forming the enlarged portion on the wiring board fixing convex portion, the insertion state between the wiring board fixing convex portion and the wiring board insertion hole can be reliably maintained. Reaction force (longitudinal force along the optical axis) is suppressed.

  Therefore, it is possible to prevent the electro-optical panel from floating from the inside of the frame. In this way, by reliably preventing the display panel from floating, it is possible to achieve a good display without unevenness in brightness and maintain the display quality of the image for a long period of time. In addition, it is possible to reduce the size of the entire apparatus and reduce the cost.

In the enlarged portion forming step, it is also preferable to form the enlarged portion by heat caulking.
According to such a manufacturing method, the enlarged portion of the wiring board fixing convex portion can be formed easily and in a short time by using a method by heat caulking.

An electronic apparatus according to the present invention includes the liquid crystal device as described above.
According to the electronic apparatus of the present invention, since the above-described liquid crystal device is provided, it is possible to display a high-quality and highly reliable image without uneven brightness.

  Hereinafter, the liquid crystal device according to the present invention will be described with reference to some embodiments. Of course, the present invention is not limited to the embodiment. In the following description, various structures will be exemplified using drawings, but the structures shown in these drawings may be shown with different dimensions from the actual structures in order to show the characteristic parts in an easy-to-understand manner. There is.

(First Embodiment of Liquid Crystal Device)
The first embodiment of the liquid crystal device of the present invention will be described below.
FIG. 1 is an exploded perspective view of the liquid crystal device according to the present embodiment. 2 is a schematic plan view of the assembled liquid crystal device, and FIG. 3 is a cross-sectional view taken along the line AA of FIG. FIG. 4 is a schematic perspective view of the FPC board. FIG. 5 is a cross-sectional view showing the shape of the bospin before and after assembly.

  As shown in FIG. 1, the liquid crystal device 1 is bonded to the liquid crystal panel 100, a liquid crystal panel 100 (electro-optical panel), an FPC (flexible printed circuit) substrate 10 connected to the liquid crystal panel 100, and the liquid crystal panel 100. It includes a backlight 200 (illumination device) and a frame 300 that houses the liquid crystal panel 100 and the backlight 200. The liquid crystal panel 100 includes a first substrate 3 and a second substrate 2 and is bonded to each other with a square or rectangular shape and an annular sealing material. A gap, a so-called cell gap, is formed between the substrates 2 and 3, and a liquid crystal (electro-optic material), for example, TN (Twisted Nematic) liquid crystal is sealed in the cell gap to form a liquid crystal layer (not shown). is doing.

  As shown in FIG. 1, the frame 300 has a substantially frame shape, specifically, a frame shape in which a rectangular central portion is hollowed in the present embodiment. The frame 300 is provided with recesses 300a corresponding to the plurality of protrusions 210e of the light guide plate 210, and the light guide plate 210 is fixed to the frame 300 by fitting the protrusions 210e of the light guide plate 210 into the recesses 300a. It has come to be.

  The light guide plate 210 can evenly irradiate the liquid crystal panel 100 disposed corresponding to the light guide plate 210 with light emitted from the LED 12 to be described later on the surface of the liquid crystal panel 100, such as acrylic resin or polycarbonate. It is formed from.

  Further, a diffusion plate 222, two prism sheets 221 and 220, and a frame-shaped adhesive sheet 20 are disposed on the light guide plate 210. The adhesive sheet 20 allows the diffusion plate 222 and the two prism sheets 221 and 220 to be Fixed to the light guide plate 210. In addition, a reflection plate 223 is attached to the back side of the frame 300 so as to cover the light guide plate 210 and the frame 300. The reflection plate 223 is for reflecting the light emitted from the light guide plate 210 toward the liquid crystal panel 100. The diffusion plate 222 is for making the luminance of the light in the display region V more uniform. The two prism sheets 220 and 221 are for adjusting the orientation angle of the emitted light and improving the front luminance.

  That is, the backlight 200 is accommodated in the substantially rectangular light guide plate 210 having the light emission surface 211a facing the second substrate 2 side of the liquid crystal panel 100 and the first recess 210b of the light guide plate 210 when the liquid crystal device 1 is assembled. A rectangular sheet-like optical component arranged in order from the light guide plate 210 toward the liquid crystal panel 100 between the light source formed of the LED 12 (see FIG. 3) formed on the FPC board 10 and the liquid crystal panel 100 and the light guide plate 210. As a rectangular sheet-like optical component that is laminated and disposed on a diffusion plate 222, two prism sheets 220 and 221, and a back surface 211b opposite to the light emitting surface 211a that is the light emitting surface 211a of the light guide plate 210 The reflection plate 223 is included. Under such a configuration, the backlight 200 is accommodated in the frame 300.

  On the other hand, the liquid crystal panel 100 is bonded to the light guide plate 210 via the adhesive sheet 20. The adhesive sheet 20 is a sheet that can be bonded on both sides, and has a frame shape along the outer edge portion of the light emitting surface 211 a excluding the protruding portion 210 e of the light guide plate 210. Further, the adhesive sheet 20 has a light shielding property and prevents light leakage from the backlight 200. Thus, the liquid crystal panel 100 is accommodated in the frame 300 by being attached to the backlight 200 (light guide plate 210).

  As shown in FIGS. 2 and 3, the FPC board 10 provided in the liquid crystal panel 100 is used in a state of being bent so as to overlap the back side of the liquid crystal panel 100 when the liquid crystal device 1 is configured. Therefore, in the frame 300, a wiring board recess 300b is formed on one side of the frame 300 so that the circuit portion 10b of the bent FPC board 10 is easily located on the back surface 211b of the light guide plate 210 as shown in FIG. Has been.

  The FPC board 10 straddles the outer periphery of the liquid crystal panel 100 and is drawn to the outside of the liquid crystal panel 100, and an external device connected to a part of the FPC board 10 supplies an external control signal, power supply, etc. 100 is driven. The FPC board 10 is made of, for example, FPC having excellent bendability (flexibility) using, for example, a film made of polyimide, polyester, or the like as a base material.

  As described above, by using the FPC having excellent bendability as the FPC board 10, the FPC board 10 can be bent as shown in FIGS. 2 and 3. Therefore, the FPC board 10 provided in the liquid crystal panel 100 can be bent. It is possible to determine the direction in which the formed terminal (not shown) is pulled out in a desired direction. In this embodiment, the FPC board 10 is bent in order to arrange the LEDs 12 (see FIG. 4) formed on the FPC board 10 at predetermined positions on the light guide plate 210.

  The FPC board 10 of this embodiment is mechanically fixed to the frame 300 in a curved state. As shown in FIG. 3, this is made possible by the fact that the bospin (wiring board fixing convex part) formed integrally with the frame 300 is locked in the insertion hole 13 formed in the FPC board 10. Is fixed in the vicinity of the connection portion between the FPC board 10 and the FPC board 10. Details will be described later.

Next, each component will be described in detail with reference to FIGS.
(LCD panel)
As shown in FIGS. 1 and 3, the liquid crystal panel 100 includes a first substrate 3, a second substrate 2 having a projecting portion 2 a projecting from the first substrate 3, and the first substrate 3 and the second substrate 2. A liquid crystal (not shown) as an electro-optical material disposed in a space formed by a sealing material (not shown) provided at the peripheral edge of the substrate for bonding, the first substrate 3 and the second substrate 2 and the sealing material. And a first polarizing plate 8a and a second polarizing plate 8b provided to sandwich the pair of substrates 2 and 3. The first substrate 3 and the second substrate 2 are made of translucent glass, plastic, or the like.

  On the surface of the first substrate 3 facing the second substrate 2, stripe-shaped first transparent electrodes made of a plurality of ITO (Indium / Tin Oxide) films are provided, and polyimide is formed so as to cover the first transparent electrodes. An alignment film made of or the like is formed. On the other hand, on the surface of the second substrate 2 facing the first substrate 3, a stripe-shaped second transparent electrode made of a plurality of ITO films is provided so as to intersect the first transparent electrode. An alignment film made of polyimide or the like is formed so as to cover the surface. Here, the first transparent electrode, the second transparent electrode, and the alignment film covering them are formed by a known technique, and are not shown in FIGS. 1 and 3.

  Further, on the projecting portion 2a, for example, a driving IC 23 and an input terminal (not shown) necessary for driving the liquid crystal panel 100 are formed, and an external power source and various external devices are formed on the input terminal. Is connected to the liquid crystal panel 100 via the FPC board 10.

  In the liquid crystal panel 100 having such a configuration, pixels are formed by the first transparent electrode and the second transparent electrode facing each other and the liquid crystal layer sandwiched between them. The optical characteristics of the liquid crystal layer are changed by selectively changing the voltage applied to each pixel, and the light emitted from the backlight 200 is modulated by passing through the liquid crystal layer of each pixel. Thus, by modulating the light, an image or the like can be displayed, and the display area in the liquid crystal panel 100 is substantially equal to the display area V surrounded by the sealing material.

(FPC board)
As shown in FIG. 4, the FPC board 10 includes a circuit unit 10a and a circuit unit 10b, and a wiring 14 and a semiconductor device 11 are provided on the back surface 10c. A wiring 14 that is conductively connected to the input terminal disposed on the overhanging portion 2a by ACF (conductive adhesive) or the like is formed on the circuit portion 10a side, and is electrically connected to the wiring 14 on the circuit portion 10b side. A plurality of semiconductor devices 11 are arranged as circuit elements. In addition, a plurality of LEDs 12 (four in the present embodiment) as light source units are arranged on the back surface 10 c along the arrangement direction of the semiconductor device 11.

  The semiconductor device 11 supplies drive signals to the first transparent electrode and the second transparent electrode. Further, wiring (not shown) for supplying a control signal, a power source, and the like from the outside to the semiconductor device 11 is formed on the back surface 10c of the FPC board 10. The end of the FPC board 10 on the circuit part 10a side is fixed to the side edge of the overhanging part 2a with an ACF resin. The wiring 14 of the FPC board 10 is conductively connected to the input terminal on the projecting portion 2a by conductive particles in the ACF.

  In such an FPC board 10, a plurality of locking recesses 22 penetrating in the thickness direction are provided at predetermined positions of the circuit portion 10 a so as to avoid the wiring 14. In this embodiment, the two insertion holes 13 and 13 are arrange | positioned so that it may correspond in the extension direction (projection direction from the circuit part 10b) of the circuit part 10a. In addition, the hole diameter of the insertion hole 13 shall be set suitably.

(Light guide plate)
As shown in FIG. 1, the light guide plate 210 has a light guide region 210 d that emits light to the display region V of the liquid crystal panel 100 and a first support that supports the protruding portion 2 a when assembled as the liquid crystal device 1. A support region 210g in which the portion 210a is disposed, and an LED region 210f provided with four first recesses 210b for housing the LEDs 12 disposed in a region between the support region 210g and the light guide region 210d.

  The first support portion 210a of the light guide plate 210 has a shape in which the light guide region 210d extends, is disposed along one side 212a of the light guide plate 210, and has the light emission surface 211a on the upper side (the liquid crystal panel 100 side). It is formed to have a convex shape protruding slightly upward from the light guide region 210d when directed. In this embodiment, the height when the light guide region 210d of the first support portion 210a is used as a reference is the thickness when the second polarizing plate 8b, the prism sheet 220, the prism sheet 221 and the diffusion plate 222 are stacked. It is almost equivalent.

  The light guide region 210 d of the light guide plate 210 substantially corresponds to the display region V of the liquid crystal panel 100. On the two sides 212b and 212c orthogonal to the one side 212a of the light guide plate 210, five protrusions 210e protruding from the light guide region 210d are provided for each of the sides 212b and 212c. Each of these protrusions 210e is inserted into a corresponding recess 300a provided in the frame 300 and fixed. The protrusions 210e are arranged at approximately equal intervals.

  When the LED region 210f is assembled as the liquid crystal device 1, five second supports for supporting the FPC board 10 by bonding and fixing the light guide plate 210 and the circuit portion 10b of the FPC board 10 to the back surface 211b side via an adhesive. Part 210h and four first recesses 210b in which the LED 12 shown in FIG. 4 disposed between the adjacent second support parts 210h is accommodated. In the present embodiment, the height of the LED 12, that is, the dimension of the LED 12 along the thickness direction of the light guide plate 210 is substantially the same as the thickness of the light guide plate 210 in the light guide region 210d. It has a hole shape that penetrates through the. Thus, by providing the light guide plate 210 with the first recess 210b that accommodates the LED 12, it is not necessary to provide the LED 12 in a state of protruding from the light guide plate 210, and the liquid crystal device 1 can be downsized.

(flame)
When the liquid crystal device 1 is assembled as described above, the LED 12 is disposed in the first recess 210b formed in the light guide plate 210 by curving the FPC board 10 extending linearly from the liquid crystal panel 100, and the backlight 200. (See FIG. 3).
Bending stress is generated in the FPC board 10 bent in this way. That is, an external force is applied to the liquid crystal panel 100 to which the FPC board 10 in which bending stress is generated is connected.

As described above, the liquid crystal panel 100 is bonded to the light guide plate 210 with the frame-shaped adhesive sheet (adhesive member) 20. The adhesive sheet 20 also serves as a light shielding region of the liquid crystal panel 100. In general, the area of the light shielding region is very small, and the surface area of the adhesive sheet 20 is also small. Therefore, it is difficult for the adhesive strength of the adhesive sheet 20 to withstand the stress generated in the liquid crystal panel 100 as described above.
Therefore, the liquid crystal panel 100 accommodated in the frame 300 is in a state where a force that causes the liquid crystal panel 100 to peel from the light guide plate 210 due to the stress and to float from the frame 300 is applied.

  As shown in FIG. 1, the frame 300 according to the present embodiment includes a plurality (two in this case) of boss pins 15 (wiring substrate fixing convex portions) protruding in the depth direction of the frame 300 from the upper surface 301 of the concave portion 300 b for the wiring substrate. ) As shown in FIGS. 2 and 3, they are arranged at a predetermined interval so as to correspond to the insertion holes 13 of the FPC board 10 and are integrally formed with the frame 300. The boss pin 15 before assembly is formed in a size that can be inserted into the insertion hole 13 and has a cylindrical shape with the same axial diameter in the axial direction as shown in FIG.

  Then, when the liquid crystal device 1 is configured by bending the FPC board 10 so as to overlap the back side of the liquid crystal panel 100, the gap between the boss pin 15 of the frame 300 that penetrates the insertion hole 13 of the FPC board 10 and the FPC board 10. It is preferable to set the shaft diameter of the boss pin 15 to a size corresponding to the insertion hole 13 so that the gap is as small as possible.

  In the state after assembly shown in FIG. 3, the head 15a (tip portion) of the bospin 15 protruding from the insertion hole 13 is compressed so that the sectional area in the axial direction is larger than the sectional area of the shaft portion 15b (base end). (Refer to FIG. 5 (b) as appropriate). Specifically, since the head portion 15a of the boss pin 15 has a shape that is larger than the shaft diameter of the shaft portion 15b, that is, the hole diameter of the insertion hole 13, the boss pin 15 cannot be removed from the insertion hole 13, and the FPC board 10 is attached to the frame 300. It will be fixed to. The length in the axial direction of the bospin 15 is long enough to expand the cross-sectional area of the head portion 15a more than the shaft portion 15b by compression. The compressed head portion 15a of the bospin 15 comes into contact with the surface of the FPC board 10 so as to press the circuit portion 10a. This prevents the FPC board 10 from being bent.

  In this way, the boss pin 15 at the time of assembly is made into a shape constituted by the shaft portion 15b standing from the upper surface 301 of the wiring board recess 300b and the head portion 15a having a cross-sectional area larger than the cross-sectional area of the shaft portion 15b. As a result, the bospin 15 is prevented from coming off from the insertion hole 13. As a result, the locking state between the insertion hole 13 and the boss pin 15 is reliably maintained, and the FPC board 10 is pressed toward the frame 300 by the head 15a, so that the reaction force of the FPC board 10 (in the optical axis direction) (Longitudinal force) is suppressed. Further, since the FPC board 10 is positioned with respect to the frame 300 by locking the boss pin 15 in the insertion hole 13 of the FPC board 10, a reaction force (lateral force perpendicular to the optical axis) of the FPC board 10 is generated. It can be suppressed.

By fixing the FPC board 10 to the frame 300 in this way, the bending stress of the curved FPC board 10 can be suppressed, and the liquid crystal panel 100 is prevented from peeling off from the backlight 200 and rising from the frame 300. be able to.
Therefore, the liquid crystal device 1 according to the present embodiment reliably prevents the liquid crystal panel 100 from being lifted from the frame 300 due to the bending stress of the FPC board 10 described above.

  Thus, the liquid crystal panel 100 can be prevented from being lifted from the frame 300, and the positional relationship between the backlight 200 and the liquid crystal panel 100 can be established. Therefore, the light of the backlight 200 can be used effectively, and the liquid crystal device can be used. 1 display quality and reliability are high. In addition, since the FPC board 10 can be used in a bent state, the degree of freedom in the drawing direction of the FPC board 10 is increased.

  Further, by providing a boss pin 15 on the liquid crystal panel 100 side of the frame 300 and fixing the FPC board 10 in the vicinity of the connection part between the liquid crystal panel 100 and the FPC board 10, the FPC board 10 is prevented from being bent on the connection part side. Is done. Thereby, since the FPC board 10 extends without bending from the connection portion, the bending stress of the FPC board 10 can be effectively suppressed, and the influence on the connection portion can be eliminated. Therefore, the liquid crystal panel 100 can be reliably prevented from floating.

(Method for Manufacturing Liquid Crystal Device According to First Embodiment)
Next, a manufacturing method of the above-described liquid crystal device will be described with reference to FIGS.
In the liquid crystal device manufacturing method according to the present embodiment, the FPC board 10 is bent and the LED 12 is disposed at a position facing the light incident end face 213 of the light guide plate 210. A locking step of locking the boss pin 15 integrally formed with the frame 300, and a boss pin 15 locked to the insertion hole 13 are provided with at least a head 15a having a cross-sectional area larger than the cross-sectional area of the shaft portion 15b. And an enlarged portion forming step of forming the front end side of the bospin 15 from the base end side.
In addition, the manufacturing process in the manufacturing method of the liquid crystal device of this embodiment is shown in FIG.

  First, in S1, the liquid crystal panel 100, the FPC board 10 and the backlight 200 are manufactured by a known method, and the surface on which the driving IC 23 for the FPC board 10 and the projecting portion 2a of the liquid crystal panel 100 is provided (light emitting surface 211a). Are electrically connected to each other.

  In S2, the diffusion plate 222, the two prism sheets 221 and 220, and the frame-shaped adhesive sheet 20 are stacked in this order on the light guide plate 210, and the diffusion plate 222, Two prism sheets 221 and 220 are fixed to the light guide plate 210.

  In S <b> 3, the liquid crystal panel 100 including the FPC board 10 is disposed on the adhesive sheet 20 of the light guide plate 210. The light guide plate 210 and the liquid crystal panel 100 are bonded together by disposing the liquid crystal panel 100 on the adhesive sheet 20 to which both surfaces can be bonded.

  In S <b> 4, the reflection plate 223 is attached to the back side of the frame 300 using an adhesive (not shown). The reflector 223 may be attached before the light guide plate 210 and the liquid crystal panel 100 are accommodated in the frame 300, or may be attached after the light guide plate 210 and the liquid crystal panel 100 are accommodated in the frame 300. Also good. Select from the ease of work.

  In S <b> 5, the light guide plate 210 and the liquid crystal panel 100 are accommodated in the frame 300. At this time, the light guide plate 210 is fixed to the frame 300 by fitting the protruding portion 210 e of the light guide plate 210 into the recess 300 a of the frame 300.

  In S6, after the light guide plate 210 and the liquid crystal panel 100 are accommodated in the frame 300, the boss pins 15 of the frame 300 are inserted into the insertion holes 13 of the FPC board 10 (locking process).

  In S7, while maintaining the state where the boss pin 15 is locked in the insertion hole 13, the FPC board 10 is bent and overlapped on the back side of the liquid crystal panel 100 to fix the FPC board 10 in the bent posture. The part 10b is bonded and fixed to the back surface 211b side of the first support part 210a (not shown) (wiring board bending step). At this time, the LED 12 provided on the FPC board 10 is fitted into the first recess 210 b of the light guide plate 210, and the LED 12 is accommodated in the light guide plate 210.

  In S8, the head 15a of the bospin 15 protruding from the insertion hole 13 of the FPC board 10 is compressed by heat caulking. In other words, the boss pin 15 is heated and pressed from the distal end side to the proximal end side of the boss pin 15 so that the sectional area of the head portion 15a is larger than the sectional area of the shaft portion 15b (enlarged). Part forming step). The compression is performed so as not to damage the FPC board 10, and the head 15a is brought into contact with the surface 10d of the FPC board 10 so as to press the FPC board 10 as appropriate. In this way, the FPC board 10 is fixed to the frame 300.

  According to the manufacturing method of the liquid crystal device of the present embodiment described above, after inserting the bospin 15 into the insertion hole 13 of the FPC board 10, the head 15a of the bospin 15 is compressed, and the FPC board 10 is compressed by the compressed head 15a. Is pressed to the frame 300 side, the reaction force (vertical force along the optical axis direction) of the FPC board 10 is suppressed, and the bospin 15 formed integrally with the frame 300 is inserted into the insertion hole 13 formed in the FPC board 10. The reaction force of the FPC board 10 (the lateral force orthogonal to the optical axis) can be suppressed by engaging with the FPC board 10. Thereby, it is possible to prevent the liquid crystal panel 100 from being peeled off from the backlight 200 and being lifted from the frame 300.

  Further, since the FPC board 10 is pressed by the compressed head 15a, the FPC board 10 can be fixed to the frame 300 side without providing a separate part. Therefore, the number of parts is reduced, manufacturing efficiency is improved, and cost can be reduced.

  Therefore, since the positional relationship between the backlight 200 and the liquid crystal panel 100 is established, the light of the backlight 200 can be used effectively. Further, since there is no possibility that the optical axis is shifted, it is possible to prevent the display screen from becoming dark. In this way, by reliably preventing the liquid crystal panel 100 from floating, it is possible to achieve good display without unevenness in brightness and maintain the display quality of the image for a long period of time.

  In the present embodiment, since the boss pin 15 is compressed by heat caulking, the cross-sectional area of the head portion 15a of the boss pin 15 can be formed larger than the shaft portion 15b easily and in a short time. Thereby, the manufacturing efficiency of the liquid crystal device 1 can be improved.

  In this embodiment, the compression of the head 15a of the bospin 15 is performed using a method by heat caulking, but the method is not limited to this as long as the method can compress the head 15a of the bospin 15 satisfactorily. Not that.

  In the above description, after assembling the liquid crystal device 1, the head 15a of the bospin 15 is compressed so that the tip side has a larger cross-sectional area than the base end. Bospin 15 having a head 15a having a large cross-sectional area may be formed in advance. Then, the bospin 15 may be inserted into the insertion hole 13 of the FPC board 10 from the head portion 15a. Since the size of the insertion hole 13 is smaller than the size of the head portion 15a in plan view, if the FPC board 10 is flexible, the FPC board 10 may be cracked when the bospin is inserted. There is no worry of entering.

  The shape of the bospin 15 is not limited to the above embodiment, and may be a shape as shown in FIG. Any shape having an enlarged portion 15a having a cross-sectional area larger than that of the base end portion 15b at least on the front end side of the base end side may be used.

  On the other hand, the shape of the insertion hole of the FPC board 10 may be changed as appropriate. In the above description, the insertion hole 13 that penetrates the thickness direction of the FPC board 10 is used. However, the insertion hole 13 is not limited to this, and may have a groove shape as shown in FIG. These insertion holes 43 have a dimensional shape that allows the base end portion 15b of the boss pin 15 to be inserted and prevents the enlarged portion 15a from being inserted. In other words, the insertion hole 43 may have a configuration in which the engagement state of the boss pin 15 is not released in the axial direction of the boss pin 15 and the engagement state with the boss pin 15 is reliably maintained.

  Furthermore, in the above-described embodiment, the boss pin 15 is integrally formed with the frame 300. However, the boss pin 15 separated from the frame 300 may be used.

(Second Embodiment of Liquid Crystal Device)
The basic configuration of the liquid crystal device of the second embodiment described below is substantially the same as that of the first embodiment. This embodiment is different from the first embodiment in that a frame member 18 (fastening member) that accommodates the liquid crystal panel 100, the backlight 200, and the FPC board 10 is provided, and the boss pin 25 of the frame 300 is integrated with the frame member 18. It is a point that is formed. Therefore, below, the structure of the frame member 18 is demonstrated in detail, and description of a common location is abbreviate | omitted. Moreover, in each drawing used for description, the same code | symbol shall be attached | subjected to the same component as FIGS. FIG. 9 is a schematic configuration diagram illustrating the liquid crystal device according to the second embodiment, and FIG. 10 is a cross-sectional view taken along the line BB of FIG.

  As shown in FIGS. 9 and 10, the liquid crystal device 71 of the present embodiment is provided with a metal frame member 18 (fastening member) outside the frame 300, and the liquid crystal panel 100 and the backlight 200 are attached to the frame 300. To prevent them from falling out of the frame 300.

  The frame member 18 has an opening 19 corresponding to the display region V of the liquid crystal panel 100, covers the opposite side of the backlight 200 from the liquid crystal panel 100, and covers the sides of the liquid crystal panel 100 and the backlight 200. It has a top-opening box shape that enables this. The opening 19 is provided so as to expose the display region V of the liquid crystal panel 100 (a portion surrounded by a one-dot chain line in FIG. 9), and is large enough to expose a bonding portion between the liquid crystal panel 100 and the FPC board 10. Is formed.

  In the frame member 18 of the present embodiment, a plurality of fixing portions 21 extending vertically from the upper end of the side portion 18a covering the bent side of the FPC board 10 to the display region V side are provided along the extending direction of the side portion. It has been. As shown in FIG. 9, here, the pair of fixing portions 21 and 21 are provided at a predetermined interval and are arranged at positions corresponding to the bospins 25 (wiring board fixing convex portions) of the frame 300. The fixing portion 21 extends with a length that does not reach the connection portion between the liquid crystal panel 100 and the FPC board 10, and is recessed at the center from the extending direction distal end portion 21a toward the extending direction proximal end portion 21b. A stop recess 22 is provided. The locking recess 22 locks the boss pin 25 of the frame 300 and has a size corresponding to the shaft diameter of the boss pin 25. Further, as shown in FIG. 10, the depth dimension of the frame member 18 is set so that the fixing portion 21 functions to bring the FPC board 10 into close contact with the frame 300.

  As in the above-described embodiment, the boss pin 25 is inserted into the insertion hole 13 of the FPC board 10, and its distal end protrudes from the insertion hole 13. Then, by attaching the frame member 18 so that the front end portion of the boss pin 25 is inserted into the locking recess 22 of the fixing portion 21, the fixing portion 21 presses the FPC substrate 10 toward the frame 300 side. It will contact | abut to the upper surface. The frame 300 and the frame member 18 are positioned by locking the boss pin 25 to the locking recess 22.

  In this way, the FPC board 10 can be pressed down by providing the frame member 18 with the fixing portion 21 so that a part of the frame member 18 is wound from the outside of the FPC board 10 to the liquid crystal panel 100 side. Therefore, the reaction force (force in the vertical direction along the optical axis) of the FPC board 10 can be offset. Further, since the boss pin 25 of the frame 300 is inserted into the insertion hole 13 of the FPC board 10, the FPC board 10 is positioned with respect to the frame 300, and the reaction force of the FPC board 10 (force in the lateral direction perpendicular to the optical axis). ) Can be offset.

  Furthermore, by adopting a configuration in which the boss pin 25 is locked to the locking recess 22 of the fixing portion 21, the locked state of the insertion hole 13 and the boss pin 25 can be reliably maintained. Further, since the front end side of the boss pin 25 is configured to be locked to the locking recess 22 of the fixing portion 21, the FPC board is substantially surrounded by the periphery of the insertion hole 13 of the FPC board 10 locked to the boss pin 25. 10 can be fixed. Thereby, since the FPC board 10 can be fixed in the vicinity of the connection portion between the liquid crystal panel 100 and the FPC board 10, it is possible to prevent the FPC board 10 from being bent. Therefore, it is possible to prevent the liquid crystal panel 100 from being peeled off from the backlight 200 and being lifted from the frame 300.

  According to the present embodiment, the fastening member that fixes the FPC board 10 to the frame 300 also serves as the frame member 18 that houses the liquid crystal panel 100, the backlight 200, the FPC board 10, and the frame 300. The reaction force of the FPC board 10 can be canceled only by housing each component member. In addition, the liquid crystal panel 100 and the backlight 200 housed in the frame 300 can be reliably held, and at the same time, the FPC board 10 can be protected in addition to the liquid crystal panel 100 and the backlight 200. Furthermore, since the FPC board 10 disposed on the back surface side of the liquid crystal panel 100 is housed along the bottom of the frame member 18 by being housed in the frame member 18, bending of the FPC board 10 is prevented. Thus, by using the frame member 18, it is not necessary to separately prepare a member for housing the liquid crystal panel 100, the backlight 200, the FPC board 10, and the frame 300. Therefore, the number of parts can be reduced and the cost can be reduced.

  Further, by using the frame member 18 having electrical conductivity, it is possible to avoid the liquid crystal panel 100 from being affected by external electrical noise, and to prevent malfunction and breakage of electronic components.

  In the above embodiment, the head 15 a of the boss pin 25 is compressed, and the FPC board 10 is pressed by the compressed head 15 a, but in this embodiment, the FPC board 10 is fixed by the fixing portion 21 provided in the frame member 18. Therefore, it is not necessary to process the boss pin 25. That is, the reaction force of the FPC board 10 can be canceled by simply assembling.

(Method for Manufacturing Liquid Crystal Device According to Second Embodiment)
Next, a method for manufacturing the above liquid crystal device will be described.
In the manufacturing method of the liquid crystal device according to the present embodiment, the FPC board 10 is bent and the LED board 12 is disposed at a position facing the light incident end face 213 of the light guide plate 210 and the insertion hole 13 of the FPC board 10. A locking process for locking the bospin 25 integrally formed with the frame 300, and since these are the same processes as in the first embodiment, the description thereof will be omitted.

  In the following description, the process of housing the frame 300 housing the liquid crystal panel 100 and the backlight 200 in the frame member 18 will be described. First, the frame 300 containing the liquid crystal panel 100 and the backlight 200 is housed in the frame member 18 from the bottom side with the display region V of the liquid crystal panel 100 facing upward. The liquid crystal panel 100 is assembled so that the display area V is exposed from the opening 19 of the frame member 18. At this time, the boss pins 25 of the frame 300 are inserted into the locking recesses 22 of the fixing portions 21 provided on the frame member 18.

  With the configuration of the frame member 18 described above, the fixing portion 21 comes into contact so as to press the FPC board 10 toward the frame 300, so that the bending stress of the FPC board 10 (with respect to the optical axis) can be simply incorporated into the frame member 18. Along the vertical reaction force). Also in this embodiment, since the boss pin 25 is locked in the insertion hole 13 of the FPC board 10, the position shift of the FPC board 10 can be prevented. This also cancels the bending stress (the lateral reaction force perpendicular to the optical axis) of the FPC board 10. Furthermore, by locking the boss pin 25 to the locking recess 22 of the fixing portion 21 of the frame member 18, the locked state between the FPC board 10 and the boss pin 25 can be reliably maintained.

  Thus, in the present embodiment, the frame 300 (of course, with the boss pin 25 locked in the insertion hole 13) containing the liquid crystal panel 100, the backlight 200, and the FPC board 10 is incorporated in the frame member 18. As a result, the bending stress of the FPC board 10 can be suppressed, so that the manufacturing can be facilitated and the yield can be improved.

  In the above embodiment, the pair of fixing portions 21 corresponding to the positions of the individual boss pins 25 are provided. However, as shown in FIG. 11, the fixing portions 23 corresponding to both the boss pins 25 may be provided. . Since the fixing portion 21 can cover substantially the entire width in the direction orthogonal to the extending direction of the FPC board 10, the bending stress of the FPC board 10 can be more stably suppressed.

  Further, the length of the boss pin 25 in the axial direction is the same as the thickness direction of the FPC board 10 so as to cover the upper side of the boss pin 25 that is locked in the insertion hole 13 of the FPC board 10. And you may make it make the fixing | fixed part 21 contact | abut on the front end surface of the boss pin 25. FIG. In this case, it is not necessary to form the locking recess 22 in the fixed portion 21.

  In the above, a frame member configured in a frame shape that can accommodate the frame 300 is used as the fastening member. However, another member having a cross-sectional area larger than the cross-sectional area of the bospin 15 is provided, and the FPC board 10 is provided. You may make it press to the flame | frame 300 side.

(Other embodiments of liquid crystal device)
The present invention can also be applied to, for example, an electrophoresis apparatus as a liquid crystal device.

  Further, the liquid crystal devices 1 and 71 described above are not limited to passive devices, and can be applied to active matrix liquid crystal devices using switching elements such as TFTs and TFDs.

(Electronics)
Next, the electronic apparatus of the present invention will be described. An electronic apparatus according to the present invention includes the above-described liquid crystal device according to the present invention.
Hereinafter, a mobile phone 90 including the above-described liquid crystal device will be described as an example of an electronic apparatus.
FIG. 12 is a perspective view showing the configuration of the mobile phone 90. As shown in FIG. 12, the cellular phone 90 includes a plurality of operation buttons 91, an earpiece 92 and a mouthpiece 93, and a liquid crystal device as a display unit 94.

According to the mobile phone 90 of the present embodiment, as described above, since the liquid crystal device in which the panel 100 is securely stored in the frame 300 is provided as a display unit, the reliability is high.
In addition to the mobile phone, the electronic device of the present invention includes, for example, an electronic notebook, a personal computer, an electronic book, a viewfinder type, a monitor direct view type video tape recorder, a car navigation device, a pager, an electronic notebook, a calculator, and a word processor. , Workstations, videophones, POS terminals and the like.

1 is an exploded perspective view showing a schematic configuration of a liquid crystal device according to a first embodiment of the present invention. 1 is a plan view of a liquid crystal device according to a first embodiment. It is AA sectional drawing of FIG. 1 is a perspective view of a main part showing a schematic configuration of a liquid crystal panel and an FPC board of a liquid crystal device according to a first embodiment of the present invention. It is a principal part enlarged view which shows schematic structure of a bospin. It is a manufacturing process figure which shows the manufacturing method of the liquid crystal device in this embodiment. It is sectional drawing which shows the other shape of a wiring board fixed convex part. It is sectional drawing which shows the other shape of an insertion hole. It is a top view of the liquid crystal device concerning a 2nd embodiment. It is BB sectional drawing of FIG. It is a top view which shows other embodiment of a fixing | fixed part. It is a schematic block diagram of the mobile telephone which concerns on the electronic device of this invention. It is sectional drawing which showed the trouble of the conventional liquid crystal device. It is sectional drawing which showed the other problem of the conventional liquid crystal device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,71 ... Liquid crystal device, 100 ... Liquid crystal panel (electro-optical panel), 10 ... FPC board (wiring board), 4 ... Backlight (illumination device), 300 ... Frame, 213 ... Light incident end face, 15, 25 ... Bospin (wiring board fixing convex part), 15b ... Shaft part (base end part), 15a ... Head part (enlarged part), 18 ... Frame member ( Fastening member)

Claims (9)

A liquid crystal device comprising: an electro-optical panel including an electro-optical material; a wiring board connected to the electro-optical panel; and a frame that houses at least the electro-optical panel;
The wiring substrate is made of a flexible substrate, and is fixed by being overlapped on the surface side opposite to the display surface of the electro-optical panel by curving the wiring substrate.
The frame has a wiring board fixing convex portion formed on the frame,
The wiring board has an insertion hole through which the wiring board fixing convex portion can be inserted;
The wiring board fixing convex part is provided with an enlarged part having a cross-sectional area larger than the cross-sectional area of the base end part at least on the front end side than the base end side,
The liquid crystal device, wherein the wiring board is disposed on a proximal end side with respect to the enlarged portion of the wiring board fixing convex part inserted through the insertion hole. A liquid crystal device comprising: an electro-optical panel including an electro-optical material; a wiring board connected to the electro-optical panel; and a frame that houses at least the electro-optical panel;
The wiring substrate is made of a flexible substrate, and is fixed by being overlapped on the surface side opposite to the display surface of the electro-optical panel by curving the wiring substrate.
The frame has a wiring board fixing convex portion formed on the frame,
The wiring board has an insertion hole through which the wiring board fixing convex portion can be inserted;
A fastening member for maintaining the insertion state with the insertion hole of the wiring board at least on the front end side than the base end side of the wiring board fixing convex portion,
The liquid crystal device, wherein the wiring board is disposed on a proximal end side with respect to the fastening member of the wiring board fixing convex portion inserted through the insertion hole.     The liquid crystal device according to claim 2, wherein the fastening member also serves as a frame member that accommodates the electro-optical panel, the wiring board, and the frame.     4. The liquid crystal device according to claim 1, wherein the wiring board fixing convex portion is provided on a display surface side surface of the electro-optical panel in the frame. 5.     5. The liquid crystal according to claim 1, wherein the insertion hole is provided in a region from a region connected to the electro-optical panel to a curved region in the wiring board. apparatus. The liquid crystal device further includes a lighting device including a light source mounted on the wiring board and a light guide plate that guides light from the light source to the electro-optical panel, and the light source is obtained by bending the wiring board. The liquid crystal device according to claim 1, wherein the liquid crystal device is disposed at a position facing a light incident end surface of the light guide plate. An electro-optical panel including an electro-optical material, a wiring board connected to the electro-optical panel, and a frame that accommodates at least the electro-optical panel, and a manufacturing method of a liquid crystal device,
A wiring board bending step for bending the wiring board and fixing the wiring board to a surface opposite to the display surface of the electro-optical panel;
An insertion step of inserting the wiring board fixing convex portion formed in the frame into the insertion hole formed in the wiring board;
By applying stress to the distal end side of the wiring board fixing convex portion inserted through the insertion hole, at least the proximal end side of the wiring substrate fixing convex portion is cut larger than the sectional area of the proximal end side. And an enlarged portion forming step for forming an enlarged portion having an area. In the enlarged portion forming step,
The method for manufacturing a liquid crystal device according to claim 7, wherein the enlarged portion is formed by heat caulking.     An electronic apparatus comprising the liquid crystal device according to any one of claims 1 to 6.

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