JP2008128076A - Fluid pump - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fluid pump capable of efficiently cooling a semiconductor element and reducing vibration transmitted to the semiconductor element. <P>SOLUTION: This fluid pump 10 is provided with a pump chamber, a holding chamber, casings 12, 50 including a bulkhead isolating the pump chamber and the holding chamber, an impeller 43 rotatably arranged in the pump chamber, a stator 33 arranged in the holding chamber and generating drive force driving and rotating the impeller, a semiconductor element 25 arranged in the holding chamber and converting electric power supplied from an outside to electric power for driving the impeller, a control device including a terminal 37 supplying the driving electric power converted by the semiconductor element to the stator, and a rubber sheet member 29a arranged in the holding chamber and keeping surface contact with the semiconductor element and keeping surface contact with the bulkhead. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a fluid pump used to circulate cooling water for cooling an engine or an inverter of an automobile or the like.

  In this type of fluid pump, a pump chamber and a storage chamber are usually formed in a casing. The pump chamber and the storage chamber are separated by a partition wall so that the fluid in the pump chamber does not flow into the storage chamber. An impeller is rotatably disposed in the pump chamber. A stator and a control device for rotationally driving the impeller are disposed in the storage chamber. The control device includes a semiconductor element that converts electric power supplied from the outside into driving power for the impeller, and a terminal that supplies driving power converted by the semiconductor element to the stator. The stator generates a driving force for rotationally driving the impeller when driving power is supplied through the terminal. When the impeller is rotationally driven by the stator, the fluid is sucked into the pump chamber and pressurized, and the pressurized fluid is discharged from the pump chamber.

In this fluid pump, the power supplied from the outside is converted into the driving power of the motor by switching driving the semiconductor element. When the semiconductor element is switched and driven, the semiconductor element generates heat, and thus the semiconductor element must be cooled. For this reason, conventionally, various techniques for cooling a semiconductor element have been proposed (for example, Patent Document 1).
In the fluid pump of Patent Document 1, a metal casing is used. The semiconductor element is pressed and held on the wall surface of the metallic casing by a holding piece having elasticity. For this reason, the heat generated in the semiconductor element is radiated to the outside air or the like through the metal housing. Thus, it is said that the semiconductor element can be efficiently cooled.
JP 2000-209810 A

  By the way, in this type of fluid pump, when the discharge flow rate or the like changes during operation, the external force that acts on the impeller from the fluid changes, and the impeller may swing around the rotation shaft and the casing may vibrate. When the fluid pump is attached to the engine room of an automobile, the vibration of the engine is transmitted to the casing, and the casing vibrates. In the conventional technique, since the semiconductor element is directly pressed against the metal casing, the vibration of the casing is transmitted to the semiconductor element, and there is a problem in that the durability and reliability of the semiconductor element are reduced.

  The present invention was created in view of the above problems, and provides a fluid pump capable of efficiently cooling a semiconductor element and reducing vibration transmitted to the semiconductor element. Objective.

The fluid pump of the present invention is disposed in a casing having a pump chamber, a storage chamber, a partition wall separating the pump chamber and the storage chamber, an impeller rotatably disposed in the pump chamber, and the storage chamber. , A stator that generates driving force for rotationally driving the impeller, a semiconductor element that is disposed in the storage chamber and converts electric power supplied from the outside into driving power for the impeller, and driving power converted by the semiconductor element A control device having a terminal that supplies the stator, and a rubber-like sheet member that is disposed in the accommodation chamber and that planarly contacts the semiconductor element and planarly contacts the partition.
In this fluid pump, the semiconductor element is in planar contact with the sheet member, and the sheet member is in planar contact with the partition wall. Therefore, the heat of the semiconductor element is transmitted to the partition via the sheet member, and is transmitted from the partition to the fluid in the pump chamber. For this reason, a semiconductor element can be cooled efficiently. The semiconductor element is connected to the partition wall through a rubber-like sheet member. For this reason, the vibration transmitted from the partition to the semiconductor element is reduced, and the durability and reliability of the semiconductor element can be improved.
In addition, the aspect which a semiconductor element and a sheet | seat member contact can take a various aspect, for example, a semiconductor element and a sheet | seat member may be partially contacting.

  In the fluid pump described above, it is preferable that the seat member is also in contact with the terminal in a planar manner. According to such a configuration, the heat of the stator is transmitted to the sheet member via the terminal, and is transmitted from the sheet member to the fluid in the partition wall and the pump chamber. Thereby, it is possible to prevent the control device (semiconductor element or the like) from being heated to a high temperature due to the heat of the stator.

  The sheet member can be formed in a planar shape. By making the sheet member planar, the contact area between the semiconductor element and the partition wall can be increased. The material of the sheet member can be a material having high thermal conductivity and elasticity, for example, silicone rubber.

  In addition, it is preferable that the semiconductor element or the terminal is disposed to face the partition wall. By arrange | positioning facing a partition, the heat | fever from a semiconductor element or a terminal can be efficiently transmitted to the fluid in a pump chamber.

The semiconductor element is not necessarily in direct contact with the sheet member. For example, when the semiconductor element is mounted on the substrate, the semiconductor element may be in thermal contact with the sheet member via the substrate. That is, another fluid pump of the present application includes a pump chamber, a housing chamber, a casing having a partition wall separating the pump chamber and the housing chamber, an impeller disposed rotatably in the pump chamber, and a housing chamber. And a stator that generates a driving force for rotationally driving the impeller, and a storage chamber, and is mounted on the substrate and the surface of the substrate opposite to the pump chamber, and the electric power supplied from the outside is supplied to the impeller. A control device having a semiconductor element for converting to drive power, a terminal connected to the substrate and supplying a drive power converted by the semiconductor element to the stator, and a storage chamber. And a rubber-like sheet member that is in flat contact with the surface on the pump chamber side and in flat contact with the partition. And the semiconductor element is arrange | positioned facing the said partition, and the sheet | seat member is contacting the position on the back side of the position where the semiconductor element was mounted.
Also with this fluid pump, the semiconductor element can be suitably cooled, and vibration transmitted from the partition to the semiconductor element can be reduced.

Moreover, this application provides the novel fluid pump which can suppress that a semiconductor element becomes high temperature. That is, another fluid pump of the present invention includes a pump chamber, a housing chamber, a casing having a partition wall separating the pump chamber and the housing chamber, an impeller rotatably disposed in the pump chamber, and a housing chamber. And a stator that generates driving force for rotationally driving the impeller, a semiconductor element that is disposed in the storage chamber and converts electric power supplied from the outside into driving power for the impeller, and is converted by the semiconductor element. A control device having a terminal for supplying driving power to the stator, and a heat insulating plate that is disposed in the storage chamber and divides the storage chamber into the stator side and the control device side. The stator is surrounded by the partition wall and the heat insulating plate.
In this fluid pump, the storage chamber is partitioned by the heat insulating plate on the stator side and the control device side, and the stator is surrounded by the partition wall and the heat insulating plate. For this reason, it is possible to prevent the heat generated in the stator from being transmitted to the control device side, and to effectively prevent the semiconductor element from reaching a high temperature.

  The fluid pump preferably further includes a sheet member that is disposed in the accommodation chamber and that planarly contacts the semiconductor element and / or the terminal and planarly contacts the partition. According to such a configuration, since the heat of the semiconductor element and / or the terminal is transmitted to the fluid in the pump chamber via the sheet member and the partition wall, the semiconductor element can be further prevented from reaching a high temperature.

  The heat insulating plate can be arranged in the vicinity of the end surface of the stator on the control device side. Further, it is preferable that the space on the stator side partitioned by the heat insulating plate of the storage chamber is filled with a potting material, and the space on the control device side is not filled with the potting material. By filling the space on the stator side with the potting material, the heat of the stator can be efficiently transmitted to the partition walls. Further, by filling the potting material only in the space on the stator side, an increase in the weight of the fluid pump can be suppressed.

First Embodiment A fluid pump according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a longitudinal sectional view of a fluid pump 10 according to the first embodiment. The fluid pump 10 is used to circulate cooling water for cooling an engine such as an automobile, and is installed in an engine room of the automobile.
As shown in FIG. 1, the fluid pump 10 includes a lower body 12 and an upper body 50 fixed to the lower body 12. Both the lower body 12 and the upper body 50 are integrally formed of a material such as resin. A cylindrical convex portion 15 is formed on the upper portion of the lower body 12 (left side in the figure). A shaft mounting hole 16 a is provided at the center of the convex portion 15. The lower end portion of the shaft 46 is fixed to the shaft mounting hole 16a. The upper end portion of the shaft 46 projects upward from the upper surface of the convex portion 15. An impeller 43 (described in detail later) is rotatably attached to the upper end portion of the shaft 46.

A cylindrical outer wall 17 is formed on the outer periphery of the convex portion 15. The convex portion 15 and the outer wall 17 are arranged concentrically. An annular groove 20 having an open top is formed by the convex portion 15 and the outer wall 17. The cylindrical portion 45 of the impeller 43 is accommodated in the groove 20.
A connector 21 is formed on the upper portion of the lower body 12 (right side in the figure). An electrical wiring 28 is disposed on the connector 21. The lower end of the electrical wiring 28 is connected to the terminal 26 of the circuit board 23. An external power supply (not shown) is connected to the upper end of the connector 21. The electric power from the external power source is supplied to the circuit board 23 via the electric wiring 28 and the terminal 26.

  The lower end of the upper body 50 is fixed to the upper end of the outer wall 17 of the lower body 12 (for example, fixed by welding). The upper body 50 is formed with a suction port 51 and a discharge port (not shown). An internal space formed by the lower body 12 and the upper body 50 (that is, an internal space formed by the outer wall 17, the convex portion 15, and the upper body 50) functions as a pump chamber. Therefore, the upper body 50 and the lower body 12 correspond to a casing referred to in the claims.

An impeller 43 is disposed in the pump chamber. The impeller 43 is integrally formed of a synthetic resin, and can be manufactured using, for example, a material containing ferrite powder in plastic. The impeller 43 includes a substantially cylindrical cylindrical portion 45 and a blade portion 44 that closes one end of the cylindrical portion 45. The cylindrical portion 45 is magnetized (magnetized) by containing magnetic powder. The blade portion 44 is provided with a plurality of fins.
A bearing 47 is disposed in the center of the blade portion 44. The impeller 43 and the bearing 47 are integrally formed by insert molding. The bearing 47 is made of a polyphenylene sulfide material (PPS material).
A shaft 46 is inserted through the bearing 47, and the impeller 43 is rotatable around the shaft 46. A washer 52 is disposed between the bearing 47 and the convex portion 15. A washer 48 is attached to the upper end of the shaft 46 by a screw screw 49. The washer 48 prevents the impeller 43 from being lifted during rotation.
When the impeller 43 is attached to the shaft 46, a gap is formed between the inner surface of the impeller 43 (the inner peripheral surface of the cylindrical portion 45 and the lower surface of the blade portion 44) and the convex portion 15 of the lower body 12. A gap is also formed between the outer peripheral surface of the cylindrical portion 45 of the impeller 43 and the outer wall 17 of the lower body 12. For this reason, the cooling water in the pump chamber comes into contact with the surface of the convex portion 15 of the lower body 12 through these gaps.

A substrate housing portion 14 is formed inside the lower body 12. A stator accommodating portion 16 is formed inside the convex portion 15. A lower portion of the stator housing portion 16 communicates with the substrate housing portion 14. Thereby, one accommodation space for accommodating the circuit board 23 is formed.
A lower portion of the substrate housing portion 14 is open, and a circuit board 23 is inserted into the lower body 12 from below the substrate housing portion 14. When the circuit board 23 is inserted into the lower body 12, the stator 33 is accommodated in the stator accommodating portion 16, and the substrate 24 is accommodated in the substrate accommodating portion 14.
In the present embodiment, the heat insulating plate 54 is disposed at the boundary between the stator housing portion 16 and the substrate housing portion 14 (specifically, near the lower end of the stator 33) with the circuit board 23 housed in the lower body 12. (That is, the stator accommodating portion 16 and the substrate accommodating portion 14 are partitioned by the heat insulating plate 54). As the heat insulating plate 54, for example, a plate made of PA (polyacetal) can be used. With the heat insulating plate 54, the stator 33 is arranged in a space surrounded by the heat insulating plate 54 and the wall surface of the convex portion 15. A potting material 41 is filled in the space (that is, the stator housing portion 16). The stator 33 is embedded in the filled potting material 41. For this reason, the heat from the stator 33 is transmitted to the wall surface of the convex portion 15 through the potting material 41.
On the other hand, the substrate housing portion 14 is not filled with a potting material, and its lower end is closed by a lid 56. By closing the lower end of the substrate housing portion 14 with the lid 56, foreign matter, moisture, etc. are prevented from entering the substrate housing portion 14.

  It is preferable to use a material having high thermal conductivity for the potting material 41. By using a material having high thermal conductivity, heat from the stator 33 and the like can be efficiently radiated to the outside. For the potting material 41, for example, heat dissipation silicon or epoxy resin can be used. Furthermore, alumina fibers (fillers) can be mixed into these resins. The thermal conductivity can be increased by adding an alumina filler.

The circuit board 23 includes a board 24 and a stator 33 fixed to the board 24. The stator 33 includes a stator core 34 and a stator coil 35. The stator core 34 is configured by laminating thin steel plates (for example, silicon steel plates) obtained by press working or the like. A plurality of slots are formed in the stator core 34. A fitting hole 34 a is formed in the center of the stator core 34. In a state where the stator 33 is housed in the stator housing portion 16, the shaft fixing portion 16b is fitted into the fitting hole 34a. As a result, the stator 33 is positioned at a predetermined position in the stator housing portion 16. In a state where the stator 33 is positioned in the stator housing portion 16, the outer peripheral surface of the stator 33 faces the inner peripheral surface of the cylindrical portion 45 of the impeller 43.
The upper end of the terminal 37 is fixed to the lower end of the stator core 34. The lower end of the terminal 37 is soldered to a terminal land 37a (see FIGS. 2 and 3) of the substrate 24. Thus, the stator 33 is fixed to the substrate 24 through the terminal land 37a. The terminal 37 has an upper end portion that penetrates the heat insulating plate 54, is bent sideways (left side in FIG. 1) at an intermediate portion thereof, and a lower end portion thereof is bent downward. For this reason, the terminal land 37 a is provided in the vicinity of the left edge of the substrate 24.
The stator coil 35 is wound around each slot of the stator core 34. One end of the winding of the stator coil 35 is connected to the terminal 37.

As shown in FIG. 2, on the upper surface of the substrate 24 (surface on the side of the stator 33), in addition to the stator 33, semiconductor elements such as power transistors 25 and 25 and power diodes 31 and 31, and electronic components such as choke coil 27. Has been implemented. The power transistors 25 and 25 are switching elements that switch power supply to the stator coil 35. The power diodes 31 are elements for absorbing surge voltage when switching power supply. The choke coil 27 is a filter that removes noise generated when the power supply is switched. These electronic components 25, 27, and 31 are heating elements that generate heat when activated.
As shown in FIG. 3, electronic components 32 such as chip transistors and chip resistors are mounted on the lower surface of the substrate 24. As is clear from FIGS. 2 and 3, a relatively large electronic component is mounted on the upper surface of the substrate 24, and a relatively small electronic component is mounted on the lower surface of the substrate 24.

  A region surrounded by two dotted lines shown in FIG. 2 (a donut-shaped region surrounded by two circular dotted lines (hereinafter referred to as a donut-shaped region)) is a second housing recess 20 of the housing 12. It is an area | region which opposes the lower surface of. Power transistors 25 and 25 and power diodes 31 and 31 are disposed in the donut-shaped region, and a choke coil 27 is disposed adjacent to the donut-shaped region. As shown in FIG. 1, the power transistors 25, 25 and the power diodes 31, 31 face the lower surface of the second housing recess 20, and the choke coil 27 faces the outer surface of the second housing recess 20. .

A donut-shaped sheet member 29a is disposed above the donut-shaped region of the substrate 24 (see FIG. 1). The sheet member 29a is formed in a flat shape, and is made of a material having high thermal conductivity and elasticity (for example, silicone rubber, silicone rubber containing alumina filler). In a state where the substrate 24 is accommodated in the substrate accommodating portion 14, the lower surface of the sheet member 29 a is in planar contact with a part of the upper surfaces of the power transistors 25, 25 and substantially all of the upper surfaces of the power diodes 31, 31. Further, as shown in FIG. 1, the lower surface of the sheet member 29 a is in planar contact with the intermediate portion of the terminal 37. On the other hand, the upper surface of the sheet member 29 a is in planar contact with the lower surface of the second housing recess 20 of the housing 12.
As shown in FIG. 1, when the substrate 24 is accommodated in the substrate accommodating portion 14, the right side surface of the choke coil 27 contacts the inner wall surface of the housing 12, and the left side surface of the choke coil 27 is the sheet member. It is in contact with the right side surface of 29b. The left side surface of the sheet member 29 b is in planar contact with the outer surface of the second housing recess 20 of the housing 12. Similarly to the sheet member 29a, the sheet member 29b is formed in a flat shape, and is made of a material having high thermal conductivity and elasticity (for example, silicone rubber, silicone rubber containing alumina filler, etc.). Yes.

  In the fluid pump 10 described above, electric power is sequentially supplied from the circuit board 23 to each stator coil 35 of the stator 33. Thereby, a magnetic force is generated in order from each stator coil 35, and the magnetic force acts on the cylindrical portion 45 of the impeller 43, and the impeller 43 rotates. When the impeller 43 rotates, cooling water is sucked into the pump chamber from the suction port 51. The sucked cooling water is pressurized by the rotation of the impeller 43 and discharged from the discharge port. At this time, the cooling water sucked into the pump chamber also enters the second housing recess 20 of the housing 12. The liquid that has entered the second housing recess 20 is agitated by the rotation of the impeller 43 and is frequently replaced.

Here, when the fluid pump 10 operates, each stator coil 35 of the stator 33 generates heat. Since the stator 33 is surrounded by the wall of the convex portion 15 of the housing 12 and the heat insulating plate 54, the heat of the stator 33 is suppressed from being transmitted to the substrate 24 side. The heat transmitted from the stator 33 to the terminal 37 is transmitted to the second housing recess 20 via the seat member 29a, and is radiated from the second housing recess 20 to the cooling water in the pump chamber. As a result, the heat of the stator 33 is transmitted to the substrate 24 side, and the semiconductor element mounted on the substrate 24 is prevented from reaching a high temperature.
Since the potting material 41 is filled in the stator accommodating portion 16, the heat of the stator 33 is transmitted to the convex portion 15 through the potting material 41, and is radiated from the convex portion 15 to the cooling water in the pump chamber. . Thereby, the heat of the stator 33 is efficiently radiated to the cooling water, and the stator 33 is also prevented from reaching a high temperature.

  When the fluid pump 10 is activated, the power transistors 25 and 25 and the choke coil 27 mounted on the substrate 24 also generate heat. The heat of the power transistors 25, 25 is transmitted to the second housing recess 20 through the seat member 29a, and is radiated from the second housing recess 20 to the cooling water in the pump chamber. The heat of the choke coil 27 is transmitted to the second housing recess 20 through the seat member 29b, and is radiated from the second housing recess 20 to the cooling water in the pump chamber. As a result, the electronic components such as the power transistors 25 and 25 and the choke coil 27 mounted on the substrate 24 are prevented from reaching a high temperature.

In the fluid pump 10 described above, the heat of the stator 33 is prevented from being transmitted to the substrate 24 side, and the heat of the power transistor 25 and the choke coil 27 is passed through the sheet members 29a and 29b and the wall of the second housing recess 20. Heat is dissipated to the cooling water in the pump chamber. Thereby, it is possible to effectively suppress the electronic components such as the power transistor 25 and the choke coil 27 from becoming high temperature.
The power transistor 25, the power diode 31, and the terminal 37 are in contact with the second housing recess 20 through the sheet member 29a. For this reason, the vibration transmitted to these electronic components 25, 31, and 37 via the housing 12 is reduced. For this reason, these electronic components 25, 31, and 37 can be suitably held in the substrate housing portion 14, and electrical contact (soldering portion) between them and the substrate 24 can be maintained well.
Furthermore, since the potting material 41 is not filled in the substrate housing portion 14, the fluid pump 10 can be reduced in weight. Further, even if the potting material is not filled in the substrate accommodating portion 14, the substrate 24 is contacted and fixed to the housing 12 via the sheet members 29a and 29b, so that the substrate 24 is suitably held in the substrate accommodating portion 14. can do.

(2nd Embodiment) Next, the fluid pump 100 which concerns on 2nd Embodiment is demonstrated. The fluid pump 100 is also installed in an engine room such as an automobile and is used for circulating cooling water for cooling the engine.
As shown in FIG. 4, the fluid pump 100 is an inner rotor type fluid pump, and includes a lower body 112, an upper body 150 fixed to the upper end of the lower body 112, and a lid 116 fixed to the lower end of the lower body 112. I have.

  A ring-shaped convex portion 121 is formed on the upper portion of the lower body 112 when viewed from above, and a concave portion 118 is formed on the inner peripheral side of the convex portion 121. The convex portion 121 and the concave portion 118 are arranged concentrically. A substrate housing portion 114 is formed inside the lower body 112. A stator accommodating portion 121 a that accommodates the stator 133 is formed in the convex portion 121. The lower end of the stator accommodating portion 121a communicates with the substrate accommodating portion 114.

A circuit board 123 is accommodated in the lower body 112. The circuit board 123 includes a board 124, power transistors 125a and 125b mounted on the board 124, and a stator 133 connected to the board 124 by a terminal (not shown). The power transistor 125 a is mounted on the upper surface of the substrate 124. The power transistor 125 b is mounted on the lower surface of the substrate 124.
In a state where the circuit board 123 is accommodated in the lower body 112, the stator 133 is accommodated in the stator accommodating portion 121a. Potting material 141 is filled between the upper surface of the stator 133 and the inner wall surface of the convex portion 121. The power transistor 125a is in contact with the inner wall surface of the recess 118 through the sheet member 129a, and the power transistor 125b is in contact with the inner wall surface of the recess 118 through the substrate 124 and the sheet member 129b. The sheet members 129a and 129b are configured in the same manner as the sheet member of the first embodiment.

  The lower end of the shaft 146 is fixed at the center of the recess 118. The upper end of the shaft 146 is fixed to the upper body 150. An impeller 143 is attached to the shaft 146. The impeller 143 includes bearings 146a and 146b, and the impeller 143 is rotatably supported on the shaft 146 by the bearings 146a and 146b. The impeller 143 includes a cylindrical magnet 145 at the lower end. In a state where the impeller 143 is attached to the shaft 146, the lower end portion of the impeller 143 is accommodated in the recess 118, and the magnet 145 is opposed to the stator 133. For this reason, when electric power is supplied from the circuit board 123 to the stator 133, a magnetic force is generated from the stator 133, whereby the impeller 143 rotates. As the impeller 143 rotates, cooling water is sucked into the pump chamber 120 (an internal space surrounded by the lower body 112 and the upper body 150) from the suction port 151. The sucked cooling water is pressurized by the rotation of the impeller 143 and discharged from the discharge port. At this time, the cooling water sucked into the pump chamber 120 also enters the recess 118 of the lower body 112. The liquid that has entered the recess 118 is agitated by the rotation of the impeller 143 and is frequently replaced.

Also in the fluid pump 100 of the second embodiment described above, the heat generated by the power transistor 125a is transmitted to the wall surface of the recess 118 of the lower body 112 via the seat member 129a, and is transferred from the wall surface of the recess 118 to the cooling water in the pump chamber 120. Heat is dissipated. The heat generated in the power transistor 125b is transmitted to the wall surface of the recess 118 of the lower body 112 through the substrate 124 and the sheet member 129b, and is radiated from the wall surface of the recess 118 to the cooling water in the pump chamber 120. Therefore, the heat generated in the power transistors 125a and 125b is efficiently radiated to the cooling water in the pump chamber 120, and the power transistors 125a and 125b are prevented from reaching a high temperature.
Further, the power transistors 125a and 125b are in contact with the wall surface of the lower body 112 via the sheet members 129a and 129b. This prevents vibration from the lower body 112 from being transmitted to the power transistors 125a and 125b.

(3rd Embodiment) Next, the fluid pump 200 which concerns on 3rd Embodiment is demonstrated. The fluid pump 200 is also installed in an engine room of an automobile or the like, and is used to circulate cooling water that cools the engine.
As shown in FIG. 5, the fluid pump 200 is an outer rotor type fluid pump, and includes a lower body 212, an upper body 250 fixed to the upper end of the lower body 212, and a lid 216 fixed to the lower end of the lower body 212. ing. An impeller 243 is accommodated in an internal space (pump chamber) 220 surrounded by the lower body 212 and the upper body 250. A circuit board 223 is accommodated in the lower body 212. A ring-shaped sheet member 229 is in contact with the upper surface of the substrate 224 of the circuit board 223. The upper surface of the sheet member 229 is in contact with a partition wall (a wall facing the lower end of the impeller 243) with the pump chamber 220.

The circuit board 223 includes a board 224 and various electronic elements mounted on the board 224. As shown in FIG. 7, the control IC 240 and other electronic components (chip transistor, chip resistor, etc.) are mounted on the upper surface of the substrate 224. As shown in FIG. 6, electronic components such as a power transistor 236, capacitors 232a, 232b, 232c, and 232d, control ICs 234a and 234b, and a choke coil 238 are mounted on the lower surface of the substrate 224.
Here, a region surrounded by two dotted lines shown in FIG. 7 indicates a region where the sheet member 229 contacts when the circuit board 223 is accommodated in the lower body 212. Moreover, the area | region enclosed with two dotted lines shown by FIG. 6 has shown the site | part of the back side of the area | region where the sheet | seat member 229 contacts. As is clear from FIG. 7, the sheet member 229 is in contact with the upper surface of the control IC 240. As is clear from FIG. 6, the lower surfaces of the power transistor 236, capacitors 232 a, 232 b, 232 c, 232 d, control IC 234 b, and choke coil 238 are in contact with the sheet member 229 via the substrate 224. Therefore, the heat generated in these electronic components is suitably radiated to the cooling water in the pump chamber 220 via the sheet member 229.

  Also in the fluid pump 200 of the third embodiment described above, the heat generated in the power transistor 236, capacitors 232 a, 232 b, 232 c, 232 d, control ICs 234 b, 240 and choke coil 238 is generated in the pump chamber 220 via the sheet member 229. The heat is dissipated in the cooling water. For this reason, the heat which generate | occur | produces in these electronic components is efficiently thermally radiated by the cooling water in a pump chamber, and it is prevented that these electronic components become high temperature. Further, since these electronic components are in contact with the lower body 212 via the sheet member 229, vibrations from the lower body 212 are prevented from being transmitted to these electronic components.

(4th Embodiment) Next, the fluid pump 300 which concerns on 4th Embodiment is demonstrated. The fluid pump 300 is also installed in an engine room such as an automobile and is used for circulating cooling water for cooling the engine.
As shown in FIG. 8, the fluid pump 300 is an inner rotor type fluid pump, and includes a lower body 312, an upper body 350 fixed to the upper end of the lower body 312, and a lid 316 fixed to the lower end of the lower body 312. ing. An impeller 353 is accommodated in an internal space (pump chamber) 320 surrounded by the lower body 312 and the upper body 350. A circuit board 323 is accommodated in the lower body 312. A sheet member 329 is in contact with the center of the upper surface of the circuit board 323. The upper surface of the sheet member 329 is in contact with a partition wall (a wall facing the lower end of the impeller 353) with the pump chamber 320.

  The circuit board 323 includes a board 324 and various electronic elements mounted on the board 324. As shown in FIG. 10, relatively small electronic components such as chip transistors and chip resistors are mounted on the upper surface of the substrate 324. As shown in FIG. 9, electronic components such as a power transistor 342, capacitors 344a, 344b, 344c, and 344d, control ICs 348a and 348b, and a choke coil 346 are mounted on the lower surface of the substrate 324. The power transistor 342 is disposed at the center of the lower surface of the substrate 324, and the back surface of the power transistor 342 is in contact with the sheet member 329 through the substrate 324.

  Also in the fluid pump 300 of the fourth embodiment described above, the heat generated in the power transistor 342 is radiated to the cooling water in the pump chamber 320 via the sheet member 329. For this reason, the heat generated in the power transistor 342 is efficiently dissipated to the cooling water in the pump chamber 320, and the power transistor 342 is prevented from reaching a high temperature. Further, since the power transistor 342 is in contact with the lower body 312 via the sheet member 329, vibration from the lower body 312 is prevented from being transmitted to the power transistor 342.

Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.
In addition, the technical elements described in the present specification or drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

It is a longitudinal cross-sectional view of the fluid pump which concerns on 1st Embodiment. It is the figure which looked at the circuit board concerning a 1st embodiment from the upper part. It is the figure which looked at the circuit board concerning a 1st embodiment from the lower part. It is a longitudinal cross-sectional view of the fluid pump which concerns on 2nd Embodiment. It is a longitudinal cross-sectional view of the fluid pump which concerns on 3rd Embodiment. It is the figure which looked at the circuit board concerning a 3rd embodiment from the lower part. It is the figure which looked at the circuit board concerning a 3rd embodiment from the upper part. It is a longitudinal cross-sectional view of the fluid pump which concerns on 4th Embodiment. It is the figure which looked at the circuit board concerning a 4th embodiment from the lower part. It is the figure which looked at the circuit board concerning a 4th embodiment from the upper part.

Explanation of symbols

10: Fluid pump 12: Lower body 33: Stator 43: Impeller 45: Cylindrical portion 46: Shaft

Claims (10)

A casing having a pump chamber, a storage chamber, and a partition wall separating the pump chamber and the storage chamber;
An impeller disposed rotatably in the pump chamber;
A stator that is disposed in the storage chamber and generates a driving force for rotationally driving the impeller;
A control device having a semiconductor element that is disposed in the storage chamber and converts electric power supplied from the outside into driving power of the impeller, and a terminal that supplies driving power converted by the semiconductor element to the stator;
A fluid pump, comprising: a rubber-like sheet member disposed in a storage chamber and in planar contact with a semiconductor element and in planar contact with the partition wall.   2. The fluid pump according to claim 1, wherein the seat member is also in planar contact with the terminal.   3. The fluid pump according to claim 1, wherein the sheet member is formed in a planar shape.   4. The fluid pump according to claim 3, wherein the material of the seat member is silicone rubber.   The fluid pump according to any one of claims 1 to 4, wherein the semiconductor element or the terminal is disposed to face the partition wall. A casing having a pump chamber, a storage chamber, and a partition wall separating the pump chamber and the storage chamber;
An impeller disposed rotatably in the pump chamber;
A stator that is disposed in the storage chamber and generates a driving force for rotationally driving the impeller;
Arranged in the accommodation chamber, a substrate, a semiconductor element mounted on the surface of the substrate opposite to the pump chamber and converting electric power supplied from the outside into driving power for the impeller, and one end of the substrate are connected to the substrate And a terminal for supplying driving power converted by the semiconductor element to the stator, and a control device,
A rubber-like sheet member that is disposed in the storage chamber and that planarly contacts the surface of the substrate on the pump chamber side and that planarly contacts the partition;
The semiconductor element is disposed so as to face the partition wall, and the sheet member is in contact with a position on the back side of the position where the semiconductor element is mounted. A casing having a pump chamber, a storage chamber, and a partition wall separating the pump chamber and the storage chamber;
An impeller disposed rotatably in the pump chamber;
A stator that is disposed in the storage chamber and generates a driving force for rotationally driving the impeller;
A control device having a semiconductor element that is disposed in the storage chamber and converts electric power supplied from the outside into driving power of the impeller, and a terminal that supplies driving power converted by the semiconductor element to the stator;
A heat insulating plate that is disposed in the storage chamber and divides the storage chamber into a stator side and a control device side;
A fluid pump, wherein a stator is surrounded by the partition wall and the heat insulating plate.   8. The fluid pump according to claim 7, further comprising a sheet member which is disposed in the accommodation chamber and which planarly contacts the semiconductor element and / or the terminal and planarly contacts the partition wall.   9. The fluid pump according to claim 7, wherein the heat insulating plate is disposed in the vicinity of the end face of the stator on the control device side.   The space on the stator side partitioned by the heat insulating plate of the storage chamber is filled with potting material, and the space on the control device side is not filled with potting material. Fluid pump.

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