JP2008127215A - Method for manufacturing glass base material having projected part, and glass component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently manufacture a projected part having a desired multistage shape with a high precision, on the surface of a glass base material or of a thin film by a simple process. <P>SOLUTION: A method for manufacturing a glass base material having a projected part includes a compressive stress part forming process for forming compressive stress parts 3, where the etching rate to an etching solution is different from that of a part whereto no pressure is applied, in such a manner that the depths of the compressive stress parts 3 from the surface 1a of the glass base material 1 are changed in multiple stages, on the surface 1a and in the vicinity of the surface 1a of the glass base material 1 by locally applying pressure onto the glass base material 1, and an etching treatment process for forming the projected part 2 having a multistage shape on the surface 1a of the glass base material 1 by chemically etching the glass base material 1 after the compressive stress part forming process. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention provides a method for producing a glass substrate having a convex portion that forms a convex portion having a desired multi-stage shape on the surface of a glass substrate or a thin film formed on the glass substrate, and this method. The present invention relates to a produced glass part having a multi-stage convex portion.

Conventionally, various methods have been provided as methods for producing various step structures (multi-stage shapes) such as diffraction patterns on a substrate. For example, as one of them, a method is known in which a step structure is formed on a corrosion-resistant substrate by performing alignment step by step while using a photoresist as an etching mask (see Patent Document 1). As another method, there is known a method in which a resist on a glass substrate is formed in a step shape by adjusting the dose of an electron beam when patterning a resist (see Patent Document 2).
JP-A-6-160610 JP-A 62-265601

However, the conventional methods described above still have the following problems.
That is, in the conventional method, since the manufacturing process is many and complicated, the work time is long and the workability is poor. In particular, in the case of the method described in JP-A-6-160610, a large number of etching masks having different predetermined patterns are required, which is troublesome. Further, when the photoresist used as a mask is changed, an error due to alignment occurs, and there is a concern that the processing accuracy may be lowered.

  The present invention has been made in view of the above-mentioned problems of the prior art, and its purpose is to produce a convex portion having a desired multi-stage shape on a glass substrate surface or a thin film surface with high accuracy with a simple method. It is providing the manufacturing method of the glass base material which has a convex part which can do, and the glass component which has the convex part which consists of the multistage shape produced by this method.

In order to achieve the above object, the present invention provides the following means.
In the present invention, when a pressure is locally applied to the glass substrate, a compressive stress portion different from a portion where the etching rate with respect to the etching solution does not apply pressure on the surface of the glass substrate and the vicinity thereof is described above. A compressive stress portion forming step for forming the depth from the surface of the glass base material to change stepwise, and after the compressive stress portion forming step, a chemical etching process is performed on the glass base material to form the glass An etching treatment step for forming a multi-stage convex portion on the surface of the base material is provided.

In the method for producing a glass substrate having a convex portion according to the present invention, first, a compressive stress portion forming step of locally applying (applying) pressure to the glass substrate using a processing tool or the like is performed. As a result, a compressive stress portion having a different etching rate with respect to the etchant, and more specifically, a compressive stress portion having a lower etching rate than other portions, on the surface of the glass substrate and in the vicinity thereof. It is formed. At this time, the pressure is applied so that the depth of the compressive stress portion from the surface of the glass substrate changes stepwise.
After this compressive stress part formation process is complete | finished, the chemical etching process by an etching liquid is performed with respect to a glass base material in an etching process process. At this time, the glass substrate is formed with a compressive stress portion having an etching rate different from that of the other portion as described above so that the depth from the glass substrate surface changes stepwise. The convex part which consists of a multistage shape is formed in the glass base material surface according to a process.

  Thus, the convex part which consists of a multistage shape can be simply produced in the position which the glass base-material surface desires by performing a compression stress part formation process and an etching process process. In particular, unlike conventional ones, it is not necessary to use an etching mask at all, and it is not necessary to adjust the dose of the electron beam. Can do. Moreover, conventionally, there has been a problem of etching mask alignment error, but according to the method according to the present invention, the depth from the glass substrate surface follows the compressive stress portion formed so as to change stepwise. Since a multi-stage shape can be produced, a convex portion having a multi-stage shape can be produced with high accuracy.

  In the above invention, the compressive stress portion forming step includes a pressure applying step of applying the pressure in a state where the glass substrate is heated to a predetermined temperature or higher, and cooling the glass substrate after the pressure applying step. A cooling step.

  In the method according to the present invention, in the pressure application step, since the pressure is applied in a state where the glass substrate is heated to a predetermined temperature or higher, it is possible to prevent the occurrence of cracks and the like due to the pressure application with a high probability. it can. And a compressive-stress part is formed by cooling a glass base material by a cooling process. Thus, by applying the pressure in a state where the temperature has been raised, the compressive stress portion can be more easily formed in a state where the influence on the glass substrate is reduced as much as possible.

  In the present invention, pressure is locally applied to a thin film made of one or more inorganic materials formed on a glass substrate, and the etching rate with respect to the etching solution does not apply pressure to the thin film surface and its vicinity. A compression stress portion forming step for forming a compression stress portion different from the portion so that a depth of the compression stress portion from the thin film surface changes stepwise; and after the compression stress portion formation step, The manufacturing method of the glass base material which has a convex part provided with the etching process process which performs a chemical etching process and forms the convex part which consists of a multistage shape in the said thin film surface is provided.

In the method for producing a glass substrate having a convex portion according to the present invention, first, a compressive stress portion forming step of locally applying (applying) pressure to the thin film using a processing tool or the like is performed. As a result, a compressive stress portion having a different etching rate with respect to the etching solution, and more specifically a compressive stress portion having a lower etching rate than the other portions, is formed on the thin film surface and in the vicinity thereof. The At this time, pressure is applied so that the depth of the compressive stress portion from the thin film surface changes stepwise.
After this compressive stress portion forming step is completed, a chemical etching process using an etchant is performed on the thin film in the etching process step. At this time, as described above, the compressive stress portion having an etching rate different from that of the other portion is formed in the thin film so that the depth from the thin film surface changes stepwise. A convex portion having a shape is formed.

Thus, the convex part which consists of a multistage shape can be simply produced in the desired position on the surface of a thin film by performing a compression stress part formation process and an etching process process. In particular, unlike conventional ones, it is not necessary to use an etching mask at all, and it is not necessary to adjust the dose of the electron beam. Can do. Moreover, in the past, there was a problem of alignment error of the etching mask, but according to the method of the present invention, the multistage shape is formed following the compressive stress portion formed so that the depth from the thin film surface changes stepwise. Therefore, it is possible to produce a convex portion having a multistage shape with high accuracy.
In the present invention, the “thin film” is not defined by its thickness, but is a generic term for “those formed on a glass substrate and applied with pressure instead of the glass substrate”.

  In the above invention, the compressive stress portion forming step includes a pressure applying step of applying the pressure in a state where the thin film is heated to a predetermined temperature or more, and a cooling step of cooling the thin film after the pressure applying step. You may have.

  In the method according to the present invention, since the pressure is applied in a state in which the thin film is heated to a predetermined temperature or higher by the pressure application step, the occurrence of cracks and the like due to the pressure application can be prevented with a high probability. And a compressive-stress part is formed by cooling a thin film by a cooling process. In this way, by applying pressure while the temperature is raised, the compressive stress portion can be more easily formed with the influence on the thin film being reduced as much as possible.

  Further, in the above invention, after the etching treatment step, the thin film and the glass substrate are subjected to etching treatment, and the multi-stage projections formed on the thin film surface are reflected on the glass substrate, You may provide the reflection process which produces the convex part which consists of multistage shape on the said glass base material surface.

  In the method according to the present invention, by performing an etching process on the thin film and the glass base material in the reflection step, the multi-stage shape formed on the thin film is used to produce a multi-stage convex portion on the surface of the glass base material. can do.

  In the above invention, the glass substrate may have a higher etching rate than the thin film.

  In the method according to the present invention, since the glass substrate is etched faster than the thin film, it becomes easy to produce a convex portion having a multi-stage shape with a high aspect ratio on the surface of the glass substrate.

  Further, in the above invention, at the time of the compressive stress portion forming step, control is performed so as to change at least one of the value of the pressure to be applied, the number of times the pressure is applied to the same region, and the temperature. May be.

  In the method according to the present invention, at least any one of the value of applied pressure (for example, indentation load), the number of times pressure is applied in the same region and the temperature of the glass substrate or thin film is changed. Therefore, the width, height, etc. of the multistage shape to be manufactured can be easily controlled. Thus, the convex part which consists of multistage shape of a desired shape can be produced by a comparatively simple method, and the freedom degree of design can be improved.

  Moreover, this invention provides the glass component produced by the manufacturing method of the glass base material which has a convex part of the said invention.

  Since the glass component according to the present invention has a multi-stage convex portion manufactured by the above-described manufacturing method, the glass component has a relatively complicated structure.

  According to the method for producing a glass substrate having a convex portion according to the present invention, a multistage shape can be produced only by a compressive stress portion forming step and an etching treatment step, so that a convex portion having a highly accurate multistage shape is formed on the glass substrate. It can be produced simply and efficiently.

(First embodiment)
Hereinafter, a first embodiment according to the present invention will be described with reference to FIGS. 1 and 2.
The manufacturing method of the glass base material which has a convex part of this embodiment performs the chemical etching process by the hydrofluoric acid (HF) (etching liquid) which is an acidic liquid with respect to the glass base material 1, and the glass base material surface 1a A method of producing a convex multi-stage part (convex part having a multi-stage shape) 2, comprising a compressive stress part forming step and an etching process step.
In the compressive stress portion forming step, pressure is locally applied to the glass substrate 1, and the etching rate for hydrofluoric acid on the glass substrate surface 1a and its vicinity is different from other portions (portions where no pressure is applied). This is a step of forming the compressive stress portion 3 so that the depth from the glass substrate surface 1a changes stepwise (hereinafter referred to as “forming in a multi-stage shape”). Moreover, an etching process process is a process of performing the chemical etching process with respect to the glass base material 1 after the compression stress part formation process, and forming the multistage shape part 2 in the glass base-material surface 1a. Each of these steps will be described in detail below.

In the present embodiment, as the glass substrate 1 to be processed, chemical etching treatment with hydrofluoric acid that is an acidic liquid is performed, which is advantageous in effectively forming the multistage shaped portion 2 on the surface. A glass base material containing SiO ₂ and 1 mol% or more of Al ₂ O _{3 and} having (SiO ₂ content-Al ₂ O ₃ content) of 40 to 67 mol% is used.
This glass base material is multi-component glass and contains SiO ₂ as a main component and contains 1 mol% or more of Al ₂ O ₃ . In such a glass base material, Al ₂ O ₃ is easily eluted into the acidic solution, so that the etching process is promoted, and the difference in molar concentration between SiO ₂ and Al ₂ O ₃ contained therein (SiO ₂ − As (Al ₂ O ₃ ) becomes smaller (as Al ₂ O ₃ having weak acid resistance becomes relatively larger), the elution is promoted and the etching rate is remarkably increased.

  Moreover, in this embodiment, as a method of applying a pressure locally to the glass substrate 1, the processing tool 4 made of single crystal diamond is used so that the multistage shape portion 2 to be finally produced has a desired shape. This is done by scanning the glass substrate surface 1a while pressing. As the processing tool 4, the shape of the tip thereof is a part of a sphere (for example, the radius is 5 μm).

  First, the compression stress portion forming step of locally applying (applying) pressure to the glass substrate 1 using the processing tool 4 is performed. That is, first, as shown in FIG. 1A, the processing tool 4 is positioned on the glass substrate 1 where the compressive stress portion 3 is to be formed. Subsequently, as shown in FIG. 1 (b), the processing tool 4 is lowered toward the glass substrate surface 1 a (in the direction of arrow A), and the tip of the processing tool 4 is pressed against the glass substrate 1. At this time, the working tool 4 is pressed so as to apply a load of 16 gf (about 0.16 N). Subsequently, as shown in FIG. 2, the processing tool 4 is linearly scanned while being pressed. Thereby, the first compressive stress portion 3a having a depth of about 0.1 μm can be formed.

Subsequently, as shown in FIG. 1C, the processing tool 4 is once raised (in the direction of arrow B) so as to be separated from the glass substrate 1 and moved to a position adjacent to the first compressive stress portion 3 a. That is, the application point for applying pressure is shifted. Further, as shown in FIG. 1 (d), the processing tool 4 is lowered again (in the direction of arrow A) toward the glass substrate surface 1 a, and the tip of the processing tool 4 is pressed against the glass substrate 1. At this time, the working tool 4 is pressed so as to apply a load of 22 gf (about 0.22 N) which is larger than the previous one. Then, the machining tool 4 is linearly scanned while pressing in the same manner. Thereby, the second compressive stress portion 3b having a depth of about 0.2 μm can be formed.
As a result, as shown in FIG.1 (e), the multistage (step shape) compressive-stress part 3 is formed in the glass substrate surface 1a.

The compressive stress part 3 formed in this way showed chemical properties different from those of other parts to which no pressure was applied (normal part, that is, non-compressed part), and was subjected to chemical etching treatment with an acidic solution. In this case, an etching rate difference occurs. Specifically, in the compressive stress portion 3, the etching rate is lower than the other portions (the etching rate is slow). Although this mechanism is not completely clarified, in the compressive stress portion 3, a glass structure change, a phase transformation, a density increase, and the like occur, and the densified siloxane network prevents elution of other portions. This is probably because Al ₂ O ₃ is selectively etched by the acidic solution.

  After the compression stress portion forming process described above is completed, a chemical etching process is performed on the glass substrate surface 1a in the etching process. That is, the glass substrate 1 on which the compressive stress portion 3 is formed is immersed in a 0.1% hydrofluoric acid solution at 40 ° C. to perform a 6.0 μm chemical etching process. At this time, as described above, the compression stress portions 3 having different etching rates from the other portions are formed in the glass substrate 1 in a multi-stage shape, so that the glass substrate 1 is convex on the glass substrate surface 1a due to the difference in the etching rate. A multistage shape portion 2 is formed. That is, as shown in FIG. 1 (f), the glass substrate surface 1a is a stepped protrusion having a height H1 of the first step of about 2.8 μm and a height H2 of the second step of 3.0 μm. The multistage shape part 2 can be formed.

As described above, according to the method for manufacturing a glass substrate having a convex portion according to the present embodiment, after performing the compressive stress portion forming step for forming the compressive stress portion 3 in a multi-stage shape, the etching treatment step is only performed. The multistage shaped part 2 can be easily produced at a desired position on the glass substrate surface 1a.
In particular, unlike conventional ones, the etching mask is not used at all, and the trouble of adjusting the dose amount of the electron beam is unnecessary, so that the multistage portion 2 can be easily and efficiently produced. . In addition, there has conventionally been a problem of an alignment error of the etching mask. However, according to the method of the present embodiment, the multistage shape portion 2 can be manufactured following the compression stress portion 3 formed in a multistage shape. The shape part 2 can be produced.
Moreover, since the glass base material 1 of this embodiment has the multistage shape part 2 produced with the preparation method mentioned above, it becomes a glass component with a comparatively complicated structure.

In the present embodiment, the glass substrate 1 (SiO ₂ content -Al ₂ O ₃ content) is preferably from the viewpoint that the glass substrate does not degrade the water resistance of 40 mol% or more, further Is preferably 47 mol% or more from the viewpoint of obtaining a glass substrate that can provide a high protrusion efficiently with respect to the etching amount.
On the other hand, a decrease in acid resistance caused by the addition of a large amount of Al ₂ O _{3 into} the glass substrate is suppressed, and an increase in the melting temperature of the glass substrate is suppressed. From the viewpoint of a high glass substrate, the above-mentioned (SiO ₂ content-Al ₂ O ₃ content) is preferably 67 mol% or less, and furthermore, a high protrusion can be obtained efficiently with respect to the etching amount. From the viewpoint of forming a glass substrate, it is preferably 57 mol% or less.

Further, the SiO ₂ content is preferably 40 mol% or more, while the Al ₂ O ₃ content is preferably 1 mol% or more, but the upper limit is preferably 15 mol% or less. SiO ₂ is a basic component of the glass substrate, and is preferably 40 mol% or more from the viewpoint of imparting chemical durability and forming protrusions. In addition, Al ₂ O ₃ is preferably 15 mol% or less from the viewpoint that the solubility of the glass substrate is ensured and a homogeneous glass substrate is obtained, thereby making it possible to reduce variation depending on the location of protrusion formation.

As described above, the glass substrate 1 includes SiO ₂ and Al ₂ O ₃ in the above-described proportions, and the compression stress portion 3 having a low etching rate is easily formed by applying pressure by the processing tool 4. There is no particular limitation as long as it can form protrusions by performing an etching process thereafter.
If the example of the kind of such glass base material 1 is given, it can select from aluminosilicate glass, aluminoborosilicate glass, borosilicate glass, etc. Incidentally, B ₂ O ₃ contained in the borosilicate glass and the like is considered to show the same action as the Al ₂ O ₃ in the glass substrate, which is no problem at all be contained in the glass substrate .

Moreover, in this embodiment, hydrofluoric acid (HF) was used as an etching solution, and the reason is as follows.
That is, it is necessary for the acidic solution used to selectively elute components other than SiO ₂ from the glass substrate 1, and further, the compressive stress portion 3 and the other normal portions are obtained by chemical etching treatment with the etching solution. And the above-mentioned selective elution amount is required to be different. Therefore, the etching solution is preferably an aqueous solution having a pH of 5 or less. It is selectively eluted from the glass substrate 1 by etching, since an acid-resistant low component such as Al ₂ O _3, the etching solution is required to be acidic closer. As such an etchant, an acidic aqueous solution containing fluorine ions, for example, a hydrofluoric acid solution can be used. The acidic etching solution may be one containing at least one selected from sulfuric acid, hydrochloric acid, nitric acid, phosphoric acid, sulfamic acid, oxalic acid, tartaric acid, malic acid and citric acid. .

(Second Embodiment)
Next, a second embodiment according to the present invention will be described with reference to FIG. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
The difference between the second embodiment and the first embodiment is that, in the first embodiment, the second compressive stress portion 3b is adjacent to the first compressive stress portion 3a in the compressive stress portion forming step. Although formed, the second embodiment is that the second compressive stress portion 3b is formed in the first compressive stress portion 3a.
This embodiment is a method particularly suitable for producing a relatively complicated multistage shape portion 2.

  Further, in the present embodiment, as in the first embodiment, as a method of locally applying a pressure to the glass substrate 1, the multistage shaped portion 2 finally produced has a desired shape. This is performed by scanning the glass substrate surface 1a while pressing the processing tool 4 made of single crystal diamond. As the processing tool 4, a tool whose tip is a part of a sphere (for example, a radius of 5 μm) is used as in the first embodiment.

  First, the compression stress portion forming step of locally applying (applying) pressure to the glass substrate 1 using the processing tool 4 is performed. That is, first, as shown in FIG. 3A, the processing tool 4 is positioned on the glass substrate 1 where the compressive stress portion 3 is to be formed. Subsequently, as shown in FIG. 3B, the processing tool 4 is lowered toward the glass substrate surface 1 a (in the direction of arrow A), and the tip of the processing tool 4 is pressed against the glass substrate 1. At this time, the processing tool 4 is pressed so as to apply a load of 22 gf (about 0.22 N). Subsequently, the processing tool 4 is linearly scanned while being pressed. Thereby, the 1st compression stress part 3a whose width is about 6.5 micrometers can be formed.

Subsequently, as shown in FIG. 3C, the processing tool 4 is once raised (in the direction of arrow B) so as to be separated from the glass substrate 1, and moved to the center position with respect to the width direction of the first compressive stress portion 3a. Let Subsequently, as shown in FIG. 3 (d), the processing tool 4 is lowered again (arrow A direction) toward the glass substrate surface 1 a, and the tip of the processing tool 4 is pressed against the glass substrate 1. At this time, the working tool 4 is pressed so as to apply a load of 16 gf (about 0.16 N) smaller than the previous one. Then, the processing tool 4 is linearly scanned while pressing in the same manner. Thereby, the 2nd compression stress part 3b whose width is about 5.0 micrometers can be formed in the 1st compression stress part 3a.
As a result, as shown in FIG. 3 (e), a multistage (step shape) compressive stress portion 3 is formed on the glass substrate surface 1 a. This is because the compressive stress part extends deeper from the glass substrate surface 1a than the first compressive stress part 3a because the second compressive stress part 3b is pressed twice. by.

After the compression stress portion forming process described above is completed, a chemical etching process is performed on the glass substrate surface 1a in the etching process. That is, the glass substrate 1 on which the compressive stress portion 3 is formed is immersed in a 0.05% hydrofluoric acid solution at 50 ° C. to perform a 4.0 μm chemical etching process. At this time, as described above, the compression stress portions 3 having different etching rates from the other portions are formed in the glass substrate 1 in a multi-stage shape, so that the glass substrate 1 is convex on the glass substrate surface 1a due to the difference in the etching rate. A multistage shape portion 2 is formed. That is, as shown in FIG. 3 (f), the glass substrate surface 1a is a stepped protrusion having a height H3 of the first step of about 2.7 μm and a height H4 of the second step of 3.0 μm. The multistage shape part 2 can be formed. At this time, the multistage shape portion 2 of the present embodiment is a step-like convex portion in which a narrow bank shape is formed on a wide bank shape.
Thus, according to the manufacturing method of the glass base material which has a convex part of this embodiment, it is comparatively complicated by forming so that the 2nd compression stress part 3b may be piled up on the 1st compression stress part 3a. The multistage shape part 2 can be formed.

(Third embodiment)
Next, a third embodiment according to the present invention will be described with reference to FIGS. In the third embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
The difference between the third embodiment and the first embodiment is that, in the first embodiment, the multistage shape portion 2 is directly formed on the glass substrate surface 1a, but in the third embodiment, a thin film is formed on the glass substrate 10. 11 is formed, and after the multistage shape portion 12 is once produced on the thin film surface 11a, the multistage shape portion 12 is reflected on the glass substrate 10 to produce the multistage shape portion 22 on the glass substrate surface 10a. .

In particular, the method for producing a glass substrate having convex portions according to the present embodiment is particularly suitable when the glass substrate 10 to be processed is difficult to be thermally deformed. Examples of such a glass substrate 10 include crystallized glass, quartz glass, athermal glass and the like that have low thermal expansion and high transparency.
In the heat deformation process, after glass is softened by heating, for example, it is pressed with a molding die that has processed a desired shape to transfer the shape, and then cooled to solidify the glass to obtain a desired shape. Say the method. Therefore, those that are difficult to press-mold include those that are difficult to form the compressive stress portion 13 by applying pressure as described above or cooling after applying pressure and heat. It is.

The manufacturing method of the glass base material which has a convex part of this embodiment performs the chemical etching process by an acidic liquid with respect to the thin film 11 which consists of the one or more inorganic material formed into a film on the glass base material 10, and is a thin film A method of producing a convex multi-stage part 12 on the surface 11a, and further a convex multi-stage part 22 on the glass substrate surface 10a, comprising a compression part stress part forming step, an etching process step, a reflection step, It has.
In the compressive stress portion forming step, a pressure is locally applied to the thin film 11, and the compressive stress portion 13 having a different etching rate for hydrofluoric acid from the thin film surface 11a and its vicinity is different from the thin film surface 11a. This is a step of forming the depth so as to change stepwise (hereinafter referred to as “forming in multiple stages”). In addition, the etching process is a process of performing a chemical etching process on the thin film 11 to form the multistage shape portion 12 on the thin film surface 11a. In addition, the reflecting step performs etching on the thin film 11 and the glass substrate 10 to reflect the multistage shape portion 12 produced on the thin film surface 11a on the glass substrate 10, and multistage shape on the glass substrate surface 10a. This is a process for producing the portion 22.
Each of these steps will be described in detail below.

  In the present embodiment, crystallized glass is used as the glass substrate 10 on which the multistage shaped portion 22 is finally formed on the surface (hereinafter referred to as crystallized glass 10). In order to produce the multistage shape portion 22 on such a crystallized glass (glass substrate) surface 10a, first, as shown in FIG. 4A, a thin film made of an inorganic material serving as a processed layer on the crystallized glass 10 11 is formed. The thin film 11 may be made of any material as long as it can form a compressive stress portion 13 having an etching rate different from that of other portions by applying heat and applying pressure locally and cooling. For example, the glass substrate 10 or the like that has been processed in the first embodiment.

  Then, the said compression stress part formation process which applies a pressure locally with respect to the thin film 11 using the processing tool 4 is performed. That is, as shown in FIG. 4B, the processing tool 4 is positioned on the thin film 11 where the compressive stress portion 13 is to be formed. Subsequently, as illustrated in FIG. 4C, the processing tool 4 is lowered toward the thin film surface 11 a (in the direction of arrow A), and the tip of the processing tool 4 is pressed against the thin film 11. At this time, the working tool 4 is pressed so as to apply a load of 16 gf (about 0.16 N). Subsequently, as shown in FIG. 5, the processing tool 4 is linearly scanned while being pressed. Thereby, the first compressive stress portion 13a having a depth of about 0.1 μm can be formed.

Subsequently, as shown in FIG. 4D, the processing tool 4 is once raised (in the direction of arrow B) so as to be separated from the thin film 11, and moved to a position adjacent to the first compressive stress portion 13a. That is, the application point for applying pressure is shifted. Further, as shown in FIG. 4E, the processing tool 4 is lowered again (in the direction of arrow A) toward the thin film surface 11a, and the tip of the processing tool 4 is pressed against the thin film 11. At this time, the working tool 4 is pressed so as to apply a load of 22 gf (about 0.22 N) which is larger than before. Then, the processing tool 4 is linearly scanned while pressing in the same manner. Thereby, the second compressive stress portion 13b having a depth of about 0.2 μm can be formed.
As a result, as shown in FIG. 4F, a multistage (stepped shape) compressive stress portion 13 is formed on the thin film surface 11a.

  After the compressive stress portion forming step described above is completed, a chemical etching process is performed on the thin film surface 11a in the etching process. That is, the glass substrate 10 having the compressive stress portion 13 formed on the thin film surface 11a is immersed in a 0.1% hydrofluoric acid solution at 40 ° C., thereby performing a chemical etching process of 6.0 μm. At this time, the thin film 11 is formed with the multi-stage compression stress portions 13 having different etching rates from the other portions as described above. Therefore, the multi-stage portions 12 having a convex shape on the thin film surface 11a due to the difference in the etching rates. Is formed. That is, as shown in FIG. 4G, the thin film surface 11a has a multi-step shape that is a stepped protrusion having a first step height H5 of about 2.8 μm and a second step height H6 of 3.0 μm. The portion 12 can be formed.

  Thus, according to the manufacturing method of the glass base material which has a convex part of this embodiment, after performing the compressive-stress part formation process which forms the compressive-stress part 13 in multistage shape, only by performing an etching process process, it is thin film The multistage shaped portion 12 can be easily produced at a desired position on the surface 11a.

  Subsequently, the reflection process is performed. That is, as shown in FIG. 4H, ion etching is performed on the crystallized glass 10 on which the thin film 11 on which the multistage shape portion 12 is formed is formed. This ion etching is excellent in reproducibility and uniformity, and is effective for etching inactive materials (materials that are difficult to be etched by chemical etching treatment using an acid solution), and is also effective for etching composite materials. It has characteristics. Therefore, by performing ion etching on the crystallized glass 10 on which the thin film 11 having the multi-stage portion 12 formed on the surface is formed, as shown in FIG. The multistage shape portion 12 formed in 11a is directly reflected in the crystallized glass 10, and the multistage shape portion 22 is formed on the crystallized glass surface 10a.

As described above, according to the method for manufacturing a glass substrate having a convex portion according to the present embodiment, after performing the compressive stress portion forming step of forming the compressive stress portion 13 in a multistage shape, the etching process step is performed only. The multi-stage shaped portion 12 can be easily produced at a desired position on the thin film surface 11a. In particular, unlike conventional ones, the etching mask is not used at all, and the trouble of adjusting the dose amount of the electron beam is unnecessary, so that the multistage shape portion 12 can be easily and efficiently produced. . In addition, there has conventionally been a problem of an alignment error of the etching mask. However, according to the method of this embodiment, the multistage shape portion 12 can be produced following the compressive stress portion 13 formed in a multistage shape. The shape part 12 can be produced.
Moreover, since the reflection process is performed, even if it is the crystallized glass 10 in which it is difficult to form the compressive stress part in which an etching rate differs from another part, the multistage shape part 22 is reliably produced in the crystallized glass surface 10a. be able to.

  In the present embodiment, in order to reflect the multistage shape portion 12 formed on the thin film surface 11a on the crystallized glass 10 as it is, the thin film 11 is completely removed by ion etching. You may make it leave a part.

  In the invention according to claim 5, “reflecting” is not limited to the form shown in FIG. For example, in the present embodiment, the crystallized glass 10 may have a form having a higher etching rate for the above-described ion etching than the thin film 11. By doing so, the crystallized glass 10 is etched faster than the thin film 11, so that it becomes easy to produce the multi-stage portion 22 having a high aspect ratio on the crystallized glass surface 10a.

  In this embodiment, dry etching processing such as ion etching is employed as the etching processing means used in the reflection process. However, wet etching may be used as long as both the thin film 11 and the crystallized glass 10 can be removed. The chemical etching process used in the etching process may be performed as it is.

  Furthermore, in the present embodiment, similarly to the second embodiment, the multistage shaped portion 12 can be produced by forming the second compressive stress portion 13b so as to overlap the first compressive stress portion 13a. Is possible.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

For example, in each of the above embodiments, only the pressure is applied without heating, but the pressure may be applied while heating the glass substrate or the thin film with a substrate heating device or the like. In this case, in the compressive stress portion forming step, a pressure applying step of applying pressure in a state where the glass substrate or thin film is heated to a predetermined temperature or higher, and after the pressure applying step, the glass substrate or thin film A cooling process for cooling the substrate may be performed.
Note that the heat application at this time may be raised within a range in which the shape of the compressive stress portion can be controlled so that a desired multistage shape is obtained at least when a pressure is applied by a processing tool.

  Thus, by applying pressure in a state where the temperature of the glass substrate or thin film is raised, the occurrence of cracks and the like due to pressure application can be prevented with high probability, and the effect on the glass substrate or thin film It is possible to more easily form the compressive stress portion in a state where is reduced as much as possible. In addition, you may make it apply a heat | fever and a pressure simultaneously by pressing the heated processing tool. Even in this case, the same effects can be achieved.

  In addition, during the compressive stress portion forming process, the shape control of the compressive stress portion includes the value of the pressure to be applied (indentation load by the processing tool), the number of times the pressure is applied in the same region, the temperature of the glass substrate or thin film Of these, it is only necessary to change at least one of the conditions, and the number of times the pressure is superimposed and applied may be within a range in which the shape of the compressive stress portion can be controlled so as to obtain a desired multistage shape. Thus, the convex part which consists of multistage shape of a desired shape can be produced by a comparatively simple method, and the freedom degree of design can be improved.

In each of the above embodiments, the tip of the processing tool is spherical, but the present invention is not limited to this. For example, the shape may be changed to a pyramid, a cone, or a drill according to the desired shape of the compressive stress portion. I do not care.
In each of the above embodiments, the processing tool is scanned so as to form a two-step staircase-shaped compressive stress portion when pressure is applied. However, the present invention is not limited to this, and the shape of the compressive stress portion to be formed is not limited thereto. For example, it is possible to scan in a stepped shape of three or more steps.

In the first embodiment and the third embodiment, the second compressive stress portion is formed so as to be adjacent to the first compressive stress portion. However, the present invention is not limited to this, and according to a desired multistage shape. It is also possible to form the second compressive stress portion at a position away from the first compressive stress portion.
In addition, the methods of the first embodiment and the second embodiment can be used in combination to form the compressive stress portion in multiple stages.
Furthermore, in each said embodiment, although the processing tool was made from the single crystal diamond, it is not restricted to this, It is also possible to change into the processing tool which can form a desired compressive-stress part.

It is a figure which shows 1st Embodiment of the manufacturing method of the glass base material which has a convex part which concerns on this invention, Comprising: It is process drawing which shows the flow at the time of producing the convex part which consists of a multistage shape on the glass substrate surface. It is a perspective view of the processing tool and glass base material shown in FIG. 1, Comprising: It is a figure which shows the state which is scanning linearly in the state which pressed the processing tool on the glass base material surface. It is a figure which shows 2nd Embodiment of the manufacturing method of the glass base material which has a convex part which concerns on this invention, Comprising: It is process drawing which shows the flow at the time of producing the convex part which consists of a multistage shape on the glass substrate surface. It is a figure which shows 3rd Embodiment of the manufacturing method of the glass base material which has a convex part which concerns on this invention, Comprising: It is process drawing which shows the flow at the time of producing the convex part which consists of a multistage shape on the glass substrate surface. It is a perspective view of the glass base material which formed the processing tool and thin film shown in FIG. 4, Comprising: It is a figure which shows the state currently scanned linearly in the state which pressed the processing tool on the thin film surface.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass base material 1a Glass base material surface 2, 12, 22 Multistage shape part (convex part which consists of multistage shape)
3, 13 Compressive stress part 11 Thin film 11a Thin film surface 10 Crystallized glass (glass substrate)
10a Crystallized glass surface (glass substrate surface)

Claims (8)

A pressure is locally applied to the glass substrate, and a compressive stress portion different from a portion where the etching rate with respect to the etching solution is not applied to the surface of the glass substrate and the vicinity thereof is the surface of the glass substrate of the compressive stress portion. A compressive stress part forming step for forming the depth from the step to change stepwise,
After the compressive stress portion forming step, the glass base material is subjected to a chemical etching treatment to form a multi-stage convex portion on the glass base material surface, and an etching processing step is provided. The manufacturing method of the glass base material which has a convex part. In the manufacturing method of the glass base material which has a convex part of Claim 1,
The compressive stress portion forming step includes a pressure applying step of applying the pressure in a state where the glass substrate is heated to a predetermined temperature or more, a cooling step of cooling the glass substrate after the pressure applying step, The manufacturing method of the glass base material which has a convex part characterized by comprising. A compressive stress portion in which a pressure is locally applied to a thin film made of one or more inorganic materials formed on a glass substrate, and an etching rate with respect to an etchant is different from a portion where no pressure is applied to the surface of the thin film and its vicinity. Forming a compressive stress portion so that the depth of the compressive stress portion from the surface of the thin film changes stepwise,
A convex portion, comprising: a chemical etching process performed on the thin film after the compressive stress portion forming step to form a multi-stage convex portion on the surface of the thin film. The manufacturing method of the glass substrate which has this. In the manufacturing method of the glass base material which has a convex part of Claim 3,
The compressive stress portion forming step includes a pressure applying step of applying the pressure in a state where the thin film is heated to a predetermined temperature or higher, and a cooling step of cooling the thin film after the pressure applying step. The manufacturing method of the glass base material which has a convex part characterized by the above-mentioned. In the manufacturing method of the glass base material which has a convex part of Claim 3 or 4,
After the etching treatment step, the thin film and the glass base material are etched to reflect the multi-stage convex portions produced on the thin film surface on the glass base material, The manufacturing method of the glass substrate which has a convex part characterized by including the reflection process which produces the convex part which consists of a multistage shape. In the manufacturing method of the glass substrate which has a convex part according to claim 5,
The method for producing a glass substrate having convex portions, wherein the glass substrate has a higher etching rate than the thin film. In the manufacturing method of the glass base material which has a convex part of any one of Claim 1 to 6,
In the compressive stress portion forming step, control is performed so as to change at least one of the value of the pressure to be applied, the number of times the pressure is applied to the same region, and the temperature. The manufacturing method of the glass substrate which has a part.   A glass part produced by the method for producing a glass substrate having a convex portion according to any one of claims 1 to 7.

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