JP2008124163A5 - - Google Patents
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- Publication number
- JP2008124163A5 JP2008124163A5 JP2006304684A JP2006304684A JP2008124163A5 JP 2008124163 A5 JP2008124163 A5 JP 2008124163A5 JP 2006304684 A JP2006304684 A JP 2006304684A JP 2006304684 A JP2006304684 A JP 2006304684A JP 2008124163 A5 JP2008124163 A5 JP 2008124163A5
- Authority
- JP
- Japan
- Prior art keywords
- stem base
- plating
- stainless steel
- steel material
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006304684A JP5036280B2 (ja) | 2006-11-10 | 2006-11-10 | 気密端子およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006304684A JP5036280B2 (ja) | 2006-11-10 | 2006-11-10 | 気密端子およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008124163A JP2008124163A (ja) | 2008-05-29 |
| JP2008124163A5 true JP2008124163A5 (https=) | 2009-11-26 |
| JP5036280B2 JP5036280B2 (ja) | 2012-09-26 |
Family
ID=39508612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006304684A Expired - Fee Related JP5036280B2 (ja) | 2006-11-10 | 2006-11-10 | 気密端子およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5036280B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010135615A (ja) * | 2008-12-05 | 2010-06-17 | Nec Schott Components Corp | 屋外設置電子機器用気密端子およびその製造方法 |
| US9196303B2 (en) * | 2014-03-06 | 2015-11-24 | HGST Netherlands, B.V. | Feedthrough connector for hermetically sealed electronic devices |
| CN112573841B (zh) * | 2020-12-28 | 2022-10-18 | 西安赛尔电子材料科技有限公司 | 一种用于玻璃-金属封接多针连接器及封接工艺 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5230353B2 (https=) * | 1974-06-07 | 1977-08-08 | ||
| JPH0758743B2 (ja) * | 1986-06-27 | 1995-06-21 | 住友電気工業株式会社 | 半導体用気密封止金属パッケージの製造方法 |
| JP2001244373A (ja) * | 2000-02-29 | 2001-09-07 | Taiheiyo Cement Corp | 気密端子 |
| JP2005191558A (ja) * | 2003-12-04 | 2005-07-14 | Daishinku Corp | 気密封止型電子部品 |
| JP4483366B2 (ja) * | 2004-03-25 | 2010-06-16 | ヤマハ株式会社 | 半導体パッケージおよびその製造方法 |
-
2006
- 2006-11-10 JP JP2006304684A patent/JP5036280B2/ja not_active Expired - Fee Related
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