JP2008124109A - Semiconductor laser, method of manufacturing semiconductor laser, optical pickup, optical disk device, semiconductor device, and method of manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor laser wherein an electrode can be effectively prevented from being peeled off during cleavage for forming the end face of a resonator in case when alloying process is not conducted after the electrode is formed on a nitride-based III-V group compound semiconductor layer. <P>SOLUTION: The semiconductor laser is provided with an electrode 13 that is formed on the boundary of a nitride-based III-V group compound semiconductor layer 9 constituting a laser structure without being alloyed. In this case, at least a part of the electrode 13 is a metal laminated film containing metal films with n layers (n; integer of two or more), wherein the total thickness of the metal laminated film is 300 nm or more and, when assuming that rigidity and thickness of i-th metal film from the bottom of the metal laminated film are G<SB>i</SB>and t<SB>i</SB>, respectively, and the equivalent average rigidity G<SB>e</SB>of the metal laminated film is defined as [total sum of (G<SB>i</SB>×t<SB>i</SB>)]/total film thickness, G<SB>e</SB>≤55 GPa is established. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a semiconductor laser, a method for manufacturing a semiconductor laser, an optical pickup, an optical disk device, a semiconductor device, and a method for manufacturing a semiconductor device, and in particular, alloying after forming an electrode on a nitride III-V compound semiconductor layer. (Alloy) The present invention is suitable for application to a semiconductor laser using a nitride III-V compound semiconductor without an (alloy) treatment, and an optical pickup and optical disk apparatus using the semiconductor laser as a light source.

In a high-density optical disk apparatus, a GaN-based semiconductor laser having an emission wavelength of 400 nm is used as a light source. FIG. 14 shows an example of such a conventional GaN-based semiconductor laser (see, for example, Non-Patent Document 1). As shown in FIG. 14, in this GaN-based semiconductor laser, on an n-type GaN substrate 101, an n-type AlGaN cladding layer 102, an n-type GaN optical waveguide layer 103, an undoped Ga _1-x In _x N (quantum well). Layer) / Ga _{1 -y} In _y N (barrier layer, x> y) active layer 104 having a multiple quantum well structure, undoped InGaN optical waveguide layer 105, undoped AlGaN optical waveguide layer 106, p-type AlGaN electron barrier layer 107, p A type GaN / undoped AlGaN superlattice cladding layer 108 and a p-type GaN contact layer 109 are sequentially stacked. On the p-type GaN / undoped AlGaN superlattice clad layer 108 and the p-type GaN contact layer 109, a ridge stripe 110 is formed extending linearly in one direction (resonator length direction). A SiO ₂ film 111 and an undoped Si film 112 thereon are formed extending on the p-type GaN / undoped AlGaN superlattice clad layer 108 on both side surfaces and the outside of the ridge stripe 110. A p-side electrode 113 is formed in ohmic contact with the p-type GaN contact layer 109 of the ridge stripe 110. The p-side electrode 113 is formed to extend on the undoped Si film 112, and is formed from one resonator end surface to the other resonator end surface, that is, the entire length in the resonator length direction. On the other hand, an n-side electrode 114 is formed in ohmic contact with the back surface of the n-type GaN substrate 101.

  Conventionally, as a p-side electrode of a GaN-based semiconductor laser, a Ni-based electrode or a Pd, Pt-based electrode (see, for example, Patent Documents 1, 2, and 3) is mainly used. Among these, in the case of Ni-based electrodes, the contact resistance of the p-side electrode can be reduced by performing the alloying process after the electrodes are formed, but in the case of Pd and Pt-based electrodes, the alloying process is performed at a temperature of 300 ° C. On the contrary, the contact resistance of the p-side electrode increases. For this reason, when a Pd or Pt electrode is used as the p-side electrode 113 of the GaN-based semiconductor laser shown in FIG. 14, the alloy process is not performed after the electrode is formed.

Takahashi Kiyoshi (supervised), Wide Gap Semiconductor Optical / Electronic Devices, Morikita Publishing (2006), pages 209-212 JP-A-10-303504 Japanese Patent Laid-Open No. 10-41254 JP 2002-335048 A

  However, according to the knowledge of the present inventors, when the alloy process is not performed after the formation of the p-side electrode 113 as described above, the adhesion of the p-side electrode 113 to the p-type GaN contact layer 109 is insufficient. Therefore, when the n-type GaN substrate 101 on which the laser structure is formed is cleaved from the n-type GaN substrate 101 side to form the resonator end face, the p-side electrode 113 near the end face of the resonator is peeled off or peeled off. Due to this state, there is a problem that heat is generated in the portion of the p-side electrode 113 when energized, leading to failure of the GaN-based semiconductor laser. This problem is particularly serious when a GaN semiconductor laser is used at a high output. As an example, resonance when the p-side electrode 113 is made of a laminated metal film of five metal films of (Pd / Pt) / (Ti / Pt / Ni) = (50 nm / 100 nm) / (10 nm / 100 nm / 100 nm). FIG. 15 shows a cross-sectional transmission electron microscope (TEM) photograph of the p-side electrode 113 and the ridge stripe 110 near the end face of the vessel. As shown in FIG. 15, in the vicinity of the end face of the resonator formed by cleavage, a trace of the p-side electrode 113 (shown simply as an electrode in FIG. 15) pulled during cleavage is observed, and the p-side electrode 113 and A gap with a thickness of about 10 nm is observed with the p-type GaN contact layer 109. Further, when the current is increased in order to obtain a high output in the GaN semiconductor laser having the structure shown in FIG. 15, the p-side electrode 113 in the vicinity of the resonator end face is almost peeled off and destroyed as shown in FIG. It was seen.

Therefore, the problem to be solved by the present invention is that when the electrode is formed on the ridge stripe, more generally, the nitride-based III-V compound semiconductor layer, the alloy is not connected to the resonator end face. Using a nitride III-V compound semiconductor that can effectively prevent peeling or about peeling at the time of cleaving to form an electrode and prevent failure due to this electrode. The present invention provides a semiconductor laser and a method of manufacturing the same.
Another problem to be solved by the present invention is to provide an optical pickup and an optical disk apparatus using the semiconductor laser as a light source.
Still another problem to be solved by the present invention is that, when an alloy process is not performed after forming an electrode on a nitride III-V compound semiconductor layer, the electrode may be peeled off or about to be peeled off. A semiconductor device including a semiconductor laser, a light emitting diode, an electron transit device, etc. using a nitride III-V compound semiconductor capable of effectively preventing the failure and preventing failure due to the electrode And a method of manufacturing the same.

As a result of intensive studies to solve the above problems, the present inventors have come up with the present invention. The outline is as follows.
In order to prevent the p-side electrode 113 in the vicinity of the resonator end face from being peeled off or being peeled off when the n-type GaN substrate 101 with the laser structure is cleaved to form the end face of the resonator. (1) Introducing an alloy process after the formation of the p-side electrode 113 to improve the adhesion between the p-type GaN contact layer 109 and the p-side electrode 113, and (2) reducing the stress during cleavage. (3) Measures such as preventing the stress during cleavage from being transmitted to the interface between the p-side electrode 113 and the p-type GaN contact layer 109 can be considered. In (1), the adhesion can generally be improved by alloying (alloying) the p-type GaN contact layer 109 and the p-side electrode 113, but as described above, the p-side electrode There is an adverse effect that the contact resistance of 113 deteriorates. Further, in (2) and (3), a hard GaN-based semiconductor crystal is broken at the time of cleavage, so that it is necessary to generate a certain amount of stress, and there is a limit in reducing the stress. Although the stress can be reduced by reducing the thickness, the n-type GaN substrate 101 is liable to be cracked and the yield is significantly reduced. Therefore, it is peculiar to realize the reduction of the contact resistance of the p-side electrode 113 without transmitting the cleavage stress to the interface between the p-side electrode 113 and the p-type GaN contact layer 109 under the non-alloying condition. The electrode structure is required.

As a result of intensive studies in view of this point, the present inventors have found that an n layer (n is an integer of 2 or more) is formed on the nitride-based III-V compound semiconductor layer without an alloy process. In addition to setting the total thickness of the metal laminated film to 300 nm or more, the equivalent average rigidity defined as follows for the metal laminated film is 55 GPa It has been found that the p-side electrode 113 in the vicinity of the cavity end face after cleavage is prevented from being peeled off from the p-type GaN contact layer 109 by being set as follows.
This measure is not limited to the case where the p-side electrode 113 is formed on the ridge stripe 110, but also in the case of a semiconductor laser that forms an electrode on the nitride III-V compound semiconductor layer without an alloy process. It is effective, and more generally, in various semiconductor devices including not only semiconductor lasers but also electron transit elements such as light emitting diodes and FETs, without an alloy process on the nitride-based III-V compound semiconductor layer. This is effective when forming an electrode.

と定義したとき、Ｇ_e ≦５５ＧＰａである
ことを特徴とするものである。 That is, in order to solve the above problem, the first invention
In a semiconductor laser in which an electrode is provided on a nitride-based III-V compound semiconductor layer forming a laser structure without alloying at an interface thereof,
At least a part of the electrode is composed of a metal laminated film including an n-layer (n is an integer of 2 or more) metal film,
The total thickness of the metal multilayer film is 300 nm or more, and the rigidity and thickness of the i-th metal film from the bottom of the metal multilayer film are G _i and t _i , respectively. Average stiffness

When defined as: G _e ≦ 55 GPa.

と定義したとき、Ｇ_e ≦５５ＧＰａであるものにより形成する工程とを有する
ことを特徴とする半導体レーザの製造方法である。 The second invention is
Growing a nitride III-V compound semiconductor layer forming a laser structure on a substrate;
An electrode is formed on the nitride III-V compound semiconductor layer without an alloying treatment. At this time, at least a part of the electrode is formed with an n-layer (n is an integer of 2 or more) metal film. And the total thickness of the metal multilayer film is 300 nm or more, and the rigidity and thickness of the i-th metal film from the bottom of the metal multilayer film are set to G _i and t _i , respectively. And the equivalent average rigidity of the metal laminate film is

And a step of forming the semiconductor laser with G _e ≦ 55 GPa.

と定義したとき、Ｇ_e ≦５５ＧＰａであるものを用いた
ことを特徴とするものである。 The third invention is
In an optical pickup using a semiconductor laser as a light source,
As the semiconductor laser,
In a semiconductor laser in which an electrode is provided on a nitride-based III-V compound semiconductor layer forming a laser structure without alloying at an interface thereof,
At least a part of the electrode is composed of a metal laminated film including an n-layer (n is an integer of 2 or more) metal film,
The total thickness of the metal multilayer film is 300 nm or more, and the rigidity and thickness of the i-th metal film from the bottom of the metal multilayer film are G _i and t _i , respectively. Average stiffness

When G _e ≦ 55 GPa, it is characterized in that it is defined as

と定義したとき、Ｇ_e ≦５５ＧＰａであるものを用いた
ことを特徴とするものである。 The fourth invention is:
In an optical disc apparatus using a semiconductor laser as a light source,
As the semiconductor laser,
In a semiconductor laser in which an electrode is provided on a nitride-based III-V compound semiconductor layer forming a laser structure without alloying at an interface thereof,
At least a part of the electrode is composed of a metal laminated film including an n-layer (n is an integer of 2 or more) metal film,
The total thickness of the metal multilayer film is 300 nm or more, and the rigidity and thickness of the i-th metal film from the bottom of the metal multilayer film are G _i and t _i , respectively. Average stiffness

When G _e ≦ 55 GPa, it is characterized in that it is defined as

In the above semiconductor laser, typically, a nitride-based III-V compound semiconductor layer has a ridge stripe on the upper part, and at least an electrode is provided on the ridge stripe. However, the present invention is not limited to this. Absent. The upper part of the nitride III-V compound semiconductor layer that is in direct contact with the electrode is usually a contact layer, but is not limited thereto. This contact layer may be p-type or n-type.
Preferably, the total thickness of the metal laminated films constituting the electrode is 500 nm or more and G _e ≦ 50 GPa, but is not limited thereto.

The total thickness of the metal laminated film constituting the electrode is 300 nm or more, and G _e ≦ 55 GPa, and is formed on the nitride III-V compound semiconductor layer without alloying treatment. As long as they can be contacted, the number n of metal films included in the metal laminated film, the type and thickness of the constituent metal of each metal film can basically be freely selected. The Young's modulus and the rigidity of several metals are as follows. The relationship between the Young's modulus and the rigidity is shown in FIG. For reference, the linear expansion coefficients of these metals are shown in FIG.

Young's modulus (× 10 ¹⁰ Pa) Rigidity factor (× 10 ¹⁰ Pa)
Pd 11.3 5.11
Pt 16.8 6.1
Au 7.8 2.7
Ti 11.57 4.38
Ni 21.9 8.39
Al 7.03 2.61
Ag 8.27 3.03
Sn 4.99 1.84
GaN (reference) 15

  The metal laminated film constituting the electrode typically includes at least one or two kinds of metals selected from the group consisting of Pd, Pt and Ni, and typically, n constituting the metal laminated film. The metal films of the layers are not mixed with each other. Further, the n-layer metal film included in the metal laminated film may be made of different metals, or may include two or more metal films made of the same metal. The lowermost metal film of the metal laminate film is made of a metal that can be in ohmic contact with the underlying nitride III-V compound semiconductor layer without performing an alloy process, and is typically Pd or Although it consists of Pt, it is not limited to this.

The electrode is typically provided from one resonator end surface to the other resonator end surface, that is, over the entire length in the resonator length direction, but in the resonator length direction, a metal multilayer film that does not satisfy the above-described conditions. It may include a configured part. The electrode may also include a portion formed of a metal multilayer film that does not satisfy the above-described conditions in the direction perpendicular to the resonator length direction. Specifically, for example, the electrode may include a portion constituted by a metal multilayer film having a total thickness of less than 300 nm, or may include a portion constituted by a metal multilayer film with G _e > 55 GPa. . From the viewpoint of effectively preventing peeling of the electrode during cleavage for forming the resonator end face, preferably, a portion of the electrode within 100 μm from the resonator end face in the resonator length direction satisfies the above conditions. Although it consists of a metal laminated film which fills, it is not limited to this.

The nitride-based III-V compound semiconductor layer forming the laser structure may have the same configuration as a conventionally known semiconductor laser using a nitride-based III-V compound semiconductor, and generally, Including, but not limited to, an n-side cladding layer, an n-side optical waveguide layer, an active layer, a p-side optical waveguide layer, an electron barrier layer, a p-side cladding layer, and a contact layer. Nitride III-V compound semiconductor is most _{generally, Al X B y Ga 1-} xyz In z As u N 1-uv P v ( however, 0 ≦ x ≦ 1,0 ≦ y ≦ 1, 0 ≦ z ≦ 1,0 ≦ u ≦ 1,0 ≦ v ≦ 1,0 ≦ x + y + z <1,0 ≦ u + v consists <1), more _{specifically, Al X B y Ga 1-} xyz in z N (However, 0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ z ≦ 1, 0 ≦ x + y + z <1), and typically Al _X Ga _1-xz In _z N (where 0 ≦ x ≦ 1, 0 ≦ z ≦ 1), and specific examples include GaN, InN, AlN, AlGaN, InGaN, and AlGaInN. This nitride III-V compound semiconductor layer is generally formed of, for example, metal organic chemical vapor deposition (MOCVD), hydride vapor phase epitaxial growth or halide vapor phase epitaxial growth (HVPE), molecular beam epitaxy (MBE), etc. Epitaxial growth is performed on the substrate by various epitaxial growth methods. This substrate may be a conductive substrate, particularly a conductive semiconductor substrate, or an insulating substrate such as a sapphire substrate. As the conductive semiconductor substrate, for example, a nitride-based III-V compound semiconductor substrate, most typically a GaN substrate can be used.

Incidentally, in the conventional GaN-based semiconductor laser shown in FIG. 14, in order to reduce the internal loss, that is, to improve the threshold current and the slope efficiency, the well layer of the active layer 104 and the p-type AlGaN electron barrier layer 107 are used. The internal loss is successfully reduced from 30 cm ⁻¹ to 12 cm ⁻¹ . Accordingly, the threshold current is reduced from 38 mA to 30 mA, and the slope efficiency is improved from 1 W / A to 1.4 W / A. However, this conventional GaN-based semiconductor laser has a problem that the lifetime is shortened due to variations in the manufacturing process. Therefore, when a deterioration analysis was performed on this conventional GaN-based semiconductor laser having a short lifetime, the ridge stripe was obtained by dry etching the upper portions of the p-type GaN contact layer 109 and the p-type GaN / undoped AlGaN superlattice cladding layer 108. When 110 is formed, the p-type AlGaN electron barrier layer 107 on both sides of the ridge stripe 110 and the undoped AlGaN optical waveguide layer 106 underneath are damaged by dry etching to form defects (FIG. 19 shows a damaged area as a dotted area), and when current is passed between the p-side electrode 113 and the n-side electrode 114 during operation, The flowing current is the p-type AlGaN electron barrier layer 107 and the undoped AlGaN light below it. Defects such as wave layer 106 grown, the deterioration of the GaN-based semiconductor lasers have found to be promoted. The amount of damage due to dry etching varies depending on the difference in how the damage occurs due to etching variations in the dry etching process and the crystal quality variation in the crystal growth process of the layer forming the laser structure, and is extremely difficult to control. . As a result of examining the deterioration of the GaN-based semiconductor laser by changing the depth of the ridge stripe 110 based on the above-described knowledge obtained independently, the deeper the ridge stripe 110 is, the more the deterioration tends to be reduced. It has been found that the degradation is drastically reduced when the AlGaN electron barrier layer 107 is completely penetrated and the bottom surfaces of both sides of the ridge stripe 110 are at a depth of 10 nm or more from the lower surface of the p-type AlGaN electron barrier layer 107. . Therefore, in order to prevent the deterioration of the semiconductor laser, as the nitride III-V compound semiconductor layer in the first to fourth inventions, an n-side cladding layer and an n-side optical waveguide on the n-side cladding layer are provided. An active layer on the n-side optical waveguide layer, a p-side optical waveguide layer on the active layer, an electron barrier layer on the p-side optical waveguide layer, and a p-side cladding layer on the electron barrier layer Are formed on the p-side optical waveguide layer, the electron barrier layer, and the p-side cladding layer, and the distance between the electron barrier layer and the bottom surfaces of both sides of the ridge stripe is The thickness is preferably 10 nm or more. In this case, the p-side electrode is typically formed on a p-type contact layer provided on the p-side cladding layer. From the viewpoint of more reliably preventing the semiconductor laser from being deteriorated, the distance between the electron barrier layer and the bottom surfaces of both sides of the ridge stripe is preferably 20 nm or more. On the other hand, from the viewpoint of preventing deterioration of the active layer due to damage entering the bottom surfaces of both sides of the ridge stripe when forming the ridge stripe, the distance between the bottom surface of the both sides of the ridge stripe and the active layer is 100 nm or more. It is preferable to do this. Further, from the viewpoint of reducing the internal loss of the semiconductor laser, reducing the threshold current, and improving the slope efficiency, the distance between the electron barrier layer and the active layer is preferably 110 nm or more. When the distance between the barrier layer and the active layer exceeds 300 nm, the internal quantum efficiency is lowered, so that the thickness is preferably 300 nm or less. In a preferred example, the p-side optical waveguide layer is an undoped or n-type (preferably light-doped) nitride-based III-V compound semiconductor layer (for example, undoped or n-type InGaN containing In and Ga). Layer) and an undoped or n-type (preferably light-doped) nitride III-V compound semiconductor layer (for example, an undoped or n-type AlGaN layer) containing Al and Ga thereon. In general, it is composed of one or a combination of two or more layers of an undoped or n-type AlGaN layer, GaN layer, InGaN layer, AlGaInN layer, and the like. The electron barrier layer is generally a p-type nitride-based III-V compound semiconductor layer containing Al and Ga, preferably an Al _x Ga _1-x N layer (0.15 ≦ x <1). It is.

  On the other hand, in a GaN-based semiconductor laser used as a light source of a high-density optical disk apparatus, it is necessary to reduce the return light noise. As one of the measures, there is a method of causing a self-pulsation operation. In order to realize such a self-pulsation operation, a method has been proposed in which a saturable absorption layer is provided in an optical waveguide layer or a cladding layer, and doping is performed on the saturable absorption layer (for example, Japanese Patent Laid-Open No. 9-191160). No. publication). However, the instability of the self-pulsation operation with respect to temperature has been pointed out as a problem for this method (see, for example, JP-A-2003-31898). Furthermore, self-pulsation is achieved by selecting the thickness of the saturable absorber layer, optical confinement factor, the distance between the active layer and the saturable absorber layer, and inserting a wide gap semiconductor between the active layer and the saturable absorber layer. It has been proposed to enable operation (see, for example, Japanese Patent Application Laid-Open Nos. 2003-31898 and 2003-218458). However, even if these conditions are used, a semiconductor laser that performs a self-pulsation operation cannot be obtained stably. For example, it has been reported that the self-pulsation operation does not occur just by introducing a p-type GaN layer between the saturable absorption layer and the p-type AlGaN layer (for example, Appl. Phys. Lett. 83, 1098). (See 2003)), the promotion of carrier recombination at the interface between the p-type AlGaN layer and the saturable absorbing layer and the tunneling of carriers due to the piezo effect effectively shorten the carrier lifetime of the saturable absorbing layer, We conclude that it contributes to self-pulsation movement. In any case, such instability becomes a major issue when mass-producing GaN-based semiconductor lasers that perform self-pulsation operation. Therefore, intensive study was conducted to solve this problem. The outline is as follows. That is, in Appl. Phys. Lett. 83, 1098 (2003), the reason why the self-pulsation operation is unstable is that the carrier lifetime of the saturable absorbing layer is not sufficiently reduced. Therefore, in order to solve the above problem, it is necessary to effectively shorten the carrier lifetime in the saturable absorbing layer. In order to shorten the carrier lifetime, it is important to increase the carrier recombination process. For this purpose, the present inventor is most effective and positively introduces damage caused by dry etching into the saturable absorber layer. The optimum condition was found experimentally because it was considered simple. Specifically, in a semiconductor laser in which a saturable absorption layer is provided between an active layer and a clad layer, this ridge is formed when a ridge stripe is formed by dry etching from the clad layer side for lateral mode control. By making the distance from the bottom surface of the both sides of the stripe to the upper surface of the active layer 105 nm or more and the distance from the bottom surface of the both sides of the ridge stripe to the upper surface of the saturable absorber layer being 100 nm or less, the average failure life It has been found that (mean time to failure, MTTF) is maximized, a stable self-pulsation operation is possible, and a long-life semiconductor laser can be realized. Therefore, in order to obtain a long-life semiconductor laser capable of stable self-pulsation operation, the nitride type III-V compound semiconductor layer in the first to fourth inventions is provided on the first conductivity type side. 1 clad layer, an active layer on the first clad layer, a saturable absorber layer on the active layer, and a second clad layer on the second conductivity type side on the saturable absorber layer. In the case where a ridge stripe is formed in at least the second cladding layer, a pair of grooves are formed in the second cladding layer parallel to each other and spaced apart from each other by a predetermined distance, and the ridge stripe is interposed therebetween. When a pair of grooves are formed from the bottom surface of both sides of the ridge stripe or in parallel to each other and at a predetermined distance from each other, and the ridge stripe is formed between them. The distance from the bottom of these grooves to the upper surface of the active layer is 105 nm or more, and the distance from the bottom of the portions on both sides of the ridge stripe or from the bottom of these grooves to the upper surface of the saturable absorbing layer is 100 nm or less. Is preferable. Here, the distance from the bottom of the ridge stripe on the both sides of the ridge stripe or the bottom of the groove to the top surface of the active layer and the distance from the bottom of the both sides of the ridge stripe or the bottom of the groove to the top surface of the saturable absorber layer are Is a distance when taking a coordinate system in which the direction toward the active layer is a positive direction with one point at the bottom of the both sides of the groove or the bottom of the groove as the origin. The distance from the bottom surface of the both sides of the ridge stripe or the bottom surface of the groove to the top surface of the saturable absorbing layer is 100 nm or less. This distance is not only positive or zero (0 nm to 100 nm) but also negative. There is also. When this distance is negative, the bottom surface of the both sides of the ridge stripe or the bottom surface of the groove is located between the upper surface and the lower surface of the saturable absorber layer (including the case where it is positioned on the lower surface). And the bottom surface of both sides of the ridge stripe or the bottom surface of the groove may be located deeper than the lower surface of the saturable absorbing layer and shallower than the upper surface of the active layer.

  Typically, damage has occurred in the saturable absorption layer in the vicinity of the bottom surface of both sides of the ridge stripe or the bottom surface and / or the side surface of the groove. The cause of this damage does not matter, but this damage typically occurs when the bottom surface or groove on both sides of the ridge stripe is formed by dry etching at least the second cladding layer. It is damage. When the distance from the bottom surface of the ridge stripe on both sides or the bottom surface of the groove to the top surface of the saturable absorber layer is 100 nm or less and 0 nm or more, the saturable region near the bottom surface of the ridge stripe or the bottom surface of the groove is exclusively used. When the absorption layer is damaged and the distance from the bottom surface of the ridge stripe or the bottom surface of the groove to the top surface of the saturable absorption layer is smaller than 0 nm, in other words, the bottom surface or groove of the ridge stripe on both sides Is located between the upper surface and the lower surface of the saturable absorbing layer, or the bottom surface of the both sides of the ridge stripe or the bottom surface of the groove is deeper than the lower surface of the saturable absorbing layer, and the upper surface of the active layer If it is located at a shallower depth than the bottom of the ridge stripe and the bottom of the side or near the side of the ridge stripe Alternatively, damage occurs in the saturable absorbing layer in the vicinity of the side surface in the vicinity or grooves of the bottom and the lower side surface of the groove. The saturable absorber layer is doped with impurities as necessary (generally, high concentration doping) to form non-radiative recombination centers.

Adjacent layers in the first cladding layer, the active layer, the saturable absorption layer, and the second cladding layer may be in direct contact with each other, and one or two layers having some other function are interposed between them. More than one layer may be interposed. For example, an optical waveguide layer on the first conductivity type side is provided between the first cladding layer and the active layer, and an optical waveguide layer on the second conductivity type side is provided between the second cladding layer and the active layer. It may be done. Moreover, in order to shorten the carrier lifetime, it is important to suppress the injection of carriers other than the carriers generated by light absorption into the active layer in addition to increasing the carrier recombination process. Is for preventing carriers injected from the first cladding layer side into the active layer between the active layer and the second cladding layer from moving beyond the active layer to the second cladding layer side. A barrier layer may be provided. Specifically, for example, the barrier layer is provided so as to include at least two layers of an undoped layer and a p-type layer having a composition capable of obtaining a sufficient barrier height between the active layer and the saturable absorbing layer. In this case, the undoped layer is provided on the active layer side, and the p-type layer is provided on the saturable absorption layer side. These undoped layers and p-type layers can be easily obtained by changing the Al composition or In composition of AlGaN or AlGaInN, for example. If the band gap energy of the undoped layer is E _g1 and the band gap energy of the p-type layer is E _g2 , then preferably E _g1 <E _g2 .

Preferably, an insulating film is formed on the layer of the side surface of the ridge stripe, the inside of the groove, and the portion outside the groove. This insulating film may be basically made of any material as long as it has an electrical insulating property or is made of a sufficiently high resistance material, but it can reduce the capacitance of the semiconductor laser. From this point of view, those having a low dielectric constant are preferred. The insulating film may have a single layer structure or a multilayer structure of two or more layers. When this insulating film has a two-layer structure, an upper layer having a high absorption coefficient for light having an oscillation wavelength, for example, an undoped Si film is preferable when the wavelength of the laser light is in a blue-violet wavelength band, and the lower layer is, for example, a SiO ₂ film Etc.

The electrode on the second conductivity type side is typically formed on a contact layer provided on the second cladding layer. An electrode on the first conductivity type side is formed on the back surface of the conductive semiconductor substrate, and the electrode on the second conductivity type side is extended to the outside of the groove on the contact layer provided on the second cladding layer. When forming, preferably, the thickness of the portion on the contact layer of the outer portion of the groove of the insulating film formed on the contact layer of the side surface of the ridge stripe, the inner portion of the groove and the outer portion of the groove Make it big enough. By doing so, the distance between the first conductivity type side electrode and the second conductivity type side electrode in the outer part of the groove can be made larger than the distance in the ridge stripe or groove part. Therefore, the capacitance between these electrodes can be reduced, the high frequency characteristics of the semiconductor laser can be improved, and electrostatic leakage and electrostatic breakdown can be prevented.
The optical disk device includes any one for reproduction (reading) only, one for recording (writing), and one capable of reproduction and recording, and the reproduction and / or recording system is not particularly limited. The optical pickup is suitable for use in such an optical disc apparatus.

と定義したとき、Ｇ_e ≦５５ＧＰａである
ことを特徴とするものである。 The fifth invention is:
In the semiconductor device in which the electrodes are provided on the nitride-based III-V compound semiconductor layer without being alloyed at their interfaces,
At least a part of the electrode is composed of a metal laminated film including an n-layer (n is an integer of 2 or more) metal film,
The total thickness of the metal multilayer film is 300 nm or more, and the rigidity and thickness of the i-th metal film from the bottom of the metal multilayer film are G _i and t _i , respectively. Average stiffness

When defined as: G _e ≦ 55 GPa.

と定義したとき、Ｇ_e ≦５５ＧＰａであるものにより形成する工程とを有する
ことを特徴とする半導体装置の製造方法である。 The sixth invention is:
Growing a nitride III-V compound semiconductor layer on a substrate;
An electrode is formed on the nitride III-V compound semiconductor layer without an alloying treatment. At this time, at least a part of the electrode is formed with an n-layer (n is an integer of 2 or more) metal film. And the total thickness of the metal multilayer film is 300 nm or more, and the rigidity and thickness of the i-th metal film from the bottom of the metal multilayer film are set to G _i and t _i , respectively. And the equivalent average rigidity of the metal laminate film is

And a step of forming the semiconductor device with G _e ≦ 55 GPa.

In the fifth and sixth inventions, the semiconductor device includes various devices such as a semiconductor light emitting element such as a semiconductor laser and a light emitting diode, and an electron traveling element such as an FET. The structure of the semiconductor layer is appropriately designed according to these elements.
In the fifth and sixth inventions, what has been described in relation to the first to fourth inventions is valid, as long as it is not contrary to the nature thereof.

In the first to sixth inventions configured as described above, when an electrode is formed on the nitride-based III-V compound semiconductor layer without an alloying treatment, at least a part of the electrode is formed. , A metal laminated film in which n layers of metal films are laminated, and the total thickness of the metal laminated films is 300 nm or more, and G _e ≦ 55 GPa. Even when a force in the direction of peeling from the nitride-based III-V compound semiconductor layer is applied to the metal laminated film, the stress generated at this time causes the interface between the electrode and the nitride-based III-V compound semiconductor layer. It becomes difficult to be transmitted to.

  According to the present invention, when the alloy process is not performed after the electrode is formed on the nitride-based III-V compound semiconductor layer, the electrode is peeled off at the time of cleavage for forming the resonator end face or the like. Therefore, it is possible to obtain a semiconductor laser using a nitride-based III-V group compound semiconductor that can effectively prevent the occurrence of failure and prevent failure due to the electrode. By using this semiconductor laser as a light source, a high-performance optical disk device can be realized.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings of the embodiments, the same or corresponding parts are denoted by the same reference numerals.
FIG. 1 shows a GaN semiconductor laser according to the first embodiment of the present invention.
As shown in FIG. 1, in this GaN-based semiconductor laser, an n-type AlGaN cladding layer 2, an n-type GaN optical waveguide layer 3, an undoped Ga _1-x In _x N (quantum well) Layer) / Ga _{1 -y} In _y N (barrier layer, x> y) active layer 4 with multiple quantum well structure, undoped InGaN optical waveguide layer 5, undoped AlGaN optical waveguide layer 6, p-type AlGaN electron barrier layer 7, p A type GaN / undoped AlGaN superlattice cladding layer 8 and a p-type GaN contact layer 9 are sequentially stacked. The n-type AlGaN cladding layer 2 and the n-type GaN optical waveguide layer 3 are doped with, for example, Si as an n-type impurity. The p-type AlGaN electron barrier layer 7, the p-type GaN layer constituting the p-type GaN / undoped AlGaN superlattice cladding layer 8, and the p-type GaN contact layer 9 are doped with, for example, Mg as a p-type impurity. On the p-type GaN / undoped AlGaN superlattice cladding layer 8 and the p-type GaN contact layer 9, a ridge stripe 10 is formed extending linearly in one direction (resonator length direction). A SiO ₂ film 11 and an undoped Si film 12 thereon are formed extending on the p-type GaN / undoped AlGaN superlattice cladding layer 8 on both side surfaces of the ridge stripe 10 and on the outside thereof. A p-side electrode 13 is formed in ohmic contact with the p-type GaN contact layer 9 of the ridge stripe 10. The p-side electrode 13 is formed to extend on the undoped Si film 12, and is formed from one resonator end face to the other resonator end face, that is, over the entire length in the resonator length direction. On the other hand, an n-side electrode 14 is formed in ohmic contact with the back surface of the n-type GaN substrate 1.

In this GaN-based semiconductor laser, a portion of the p-side electrode 13 within at least 100 μm from the cavity end face in the cavity length direction, preferably the entire p-side electrode 13 is an n layer (n is 2 or more). (Integral) metal film, and the total thickness of the metal film is 300 nm or more and G _e ≦ 55 GPa. By doing so, it is possible to effectively prevent the p-side electrode 13 from being peeled off from the p-type GaN contact layer 9 at the time of cleavage for forming the resonator end face.

Next, a method for manufacturing this GaN semiconductor laser will be described.
First, an n-type AlGaN cladding layer 2, an n-type GaN optical waveguide layer 3, an active layer 4, an undoped InGaN optical waveguide layer 5, an undoped layer, for example, by metal organic chemical vapor deposition (MOCVD) method. The AlGaN optical waveguide layer 6, the p-type AlGaN electron barrier layer 7, the p-type GaN / undoped AlGaN superlattice clad layer 8 and the p-type GaN contact layer 9 are epitaxially grown sequentially. Here, the n-type AlGaN cladding layer 2, the n-type GaN optical waveguide layer 3, the undoped AlGaN optical waveguide layer 6, the p-type AlGaN electron barrier layer 7, and the p-type GaN / undoped AlGaN superlattice cladding layer which are layers not containing In The growth temperature of the 8 and p-type GaN contact layer 9 is, for example, about 1000 ° C., and the active layer 4 having a Ga _1-x In _x N / Ga _{1 -y} In _y N multiple quantum well structure and an undoped InGaN layer including In. The growth temperature of the optical waveguide layer 5 is, for example, 700 to 800 ° C., for example, 730 ° C., but is not limited thereto.

The growth raw materials for these GaN-based semiconductor layers include, for example, triethylgallium ((C ₂ H ₅ ) ₃ Ga, TEG) or trimethyl gallium ((CH ₃ ) ₃ Ga, TMG), and Al as the Ga raw material Is trimethylaluminum ((CH ₃ ) ₃ Al, TMA), the source of In is triethylindium ((C ₂ H ₅ ) ₃ In, TEI) or trimethylindium ((CH ₃ ) ₃ In, TMI), N Ammonia (NH ₃ ) is used as a raw material. As for the dopant, for example, silane (SiH ₄ ) is used as the n-type dopant, and bis (methylcyclopentadienyl) magnesium ((CH ₃ C ₅ H ₄ ) ₂ Mg), bis (ethylcyclopenta) is used as the p-type dopant. Although dienyl) magnesium ((C ₂ H ₅ C ₅ H ₄ ) ₂ Mg) or bis (cyclopentadienyl) magnesium ((C ₅ H ₅ ) ₂ Mg) is used, it is not limited to this. Further, as the carrier gas atmosphere during the growth of the GaN-based semiconductor layer, for example, H ₂ gas is used, but is not limited thereto.

Next, after an insulating film (not shown) such as a SiO ₂ film is formed on the entire surface, this insulating film is patterned into a predetermined shape by etching. Next, by using this insulating film as an etching mask, the upper part of the p-type GaN contact layer 9 and the p-type GaN / undoped AlGaN superlattice cladding layer 8 is etched by dry etching such as reactive ion etching (RIE). A ridge stripe 10 is formed. Next, after removing the insulating film used as the etching mask by etching, the SiO ₂ film 11 and the undoped Si film 12 are sequentially formed on the entire surface, and then these films on the ridge stripe 10 are selectively etched. The upper surface of the ridge stripe 10 is exposed by removing. Next, the p-side electrode 13 is formed on the undoped Si film 12 by a lift-off method or the like. Next, if necessary, the n-type GaN substrate 1 is polished from its back surface to be thinned to a predetermined thickness. Next, the n-side electrode 14 is formed on the back surface of the n-type GaN substrate 1 by a lift-off method or the like.
Thereafter, the n-type GaN substrate 1 on which the laser structure is formed is processed into a bar shape by cleaving to form a pair of resonator end faces, and if necessary, end face coating is applied, and the bar is further chipped. At the time of cleavage for forming the resonator end face, the portion of the p-side electrode 13 within at least 100 μm from the resonator end face in the resonator length direction has a total thickness of 300 nm or more as described above and G _e By being comprised by the metal laminated film of ≦ 55 GPa, it is possible to effectively prevent the p-side electrode 13 from peeling off.
As described above, the GaN-based semiconductor laser shown in FIG. 1 is manufactured.

Specific examples of the thickness and composition of the GaN-based semiconductor layer forming the laser structure are as follows. The n-type AlGaN cladding layer 2 has a thickness of 1.3 μm and an Al composition of 0.07. The thickness of the n-type GaN optical waveguide layer 3 is 0.1 μm. The thickness of the Ga _1-x In _x N layer constituting the quantum well layer of the active layer 4 is 3 nm, the In composition x is 0.08, and the thickness of the Ga _1-y In _y N layer constituting the barrier layer is 7 nm. The In composition y is 0.02 and the number of wells is 3. The undoped InGaN optical waveguide layer 5 has a thickness of 40 nm and an In composition of 0.02. The undoped AlGaN optical waveguide layer 6 has a thickness of 60 nm and an Al composition of 0.02. The p-type AlGaN electron barrier layer 7 has a thickness of 20 nm and an Al composition of 0.20. The thickness of the p-type GaN / undoped AlGaN superlattice cladding layer 8 is 0.5 μm, and the Al composition of the undoped AlGaN layer of the p-type GaN / undoped AlGaN superlattice cladding layer 8 is 0.10. The p-type GaN contact layer 9 has a thickness of 0.1 μm. The width of the ridge stripe 10 is, for example, 1.5 to 2 μm. The thickness of the n-type GaN substrate 1 is 85 μm.

<Example>
The p-side electrode 13 was formed of a metal multilayer film of six layers of (Pd / Pt) / (Ti / Pt / Au / Pt) = (50 nm / 100 nm) / (10 nm / 100 nm / 200 nm / 100 nm). The total thickness of the metal multilayer film is 50 + 100 + 10 + 100 + 200 + 100 = 560 nm, and the equivalent average rigidity of the metal multilayer film is G _e = (5.11 × 10 ¹⁰ × 50 × 10 ⁻⁹ + 6.1 × 10 ¹⁰ × 100 × 10 ^-9 + 4.38 × 10 ¹⁰ × 10 × 10 ⁻⁹ + 6.1 × 10 ¹⁰ × 100 × 10 ⁻⁹ + 2.7 × 10 ¹⁰ × 200 × 10 ⁻⁹ + 6.1 × 10 ¹⁰ × 100 × 10 ⁻⁹ ) / (50 × 10 ⁻⁹ + 100 × 10 ⁻⁹ + 10 × 10 ⁻⁹ + 100 × 10 ⁻⁹ + 200 × 10 ⁻⁹ + 100 × 10 ⁻⁹ )
= 26693 / (560 × 10 ⁻⁹ )
= 4.766 × 10 ¹⁰ Pa
= 47.66 GPa
And the total thickness of the metal multilayer film satisfies the condition of 300 nm or more and G _e ≦ 55 GPa.
In this way, the p-side electrode 13 is formed from a metal multilayer film of six layers of (Pd / Pt) / (Ti / Pt / Au / Pt) = (50 nm / 100 nm) / (10 nm / 100 nm / 200 nm / 100 nm). FIG. 2 shows a cross-sectional TEM photograph of the p-side electrode 13 and the ridge stripe 10 in the vicinity of the resonator end face. As shown in FIG. 2, a p-side electrode 13 (simply shown as an electrode in FIG. 2) and a p-type GaN contact layer 9 (simply shown as a semiconductor in FIG. 2) near the cavity end face formed by cleavage. No gap is observed between them. Further, when the state of the p-side electrode 13 in the vicinity of the cavity end face when the current is increased in order to obtain a high output in the GaN-based semiconductor laser having the structure shown in FIG. 2, the p-side electrode 13 is peeled off. No observation was made, and no destruction of the p-side electrode 13 was observed.

<Comparative example>
The p-side electrode 13 was formed of a conventional metal multilayer film composed of five layers of metal films of (Pd / Pt) / (Ti / Pt / Ni) = (50 nm / 100 nm) / (10 nm / 100 nm / 100 nm). The total thickness of the metal multilayer film is 50 + 100 + 10 + 100 + 100 = 360 nm, and the equivalent average rigidity of the metal multilayer film is G _e = (5.11 × 10 ¹⁰ × 50 × 10 ⁻⁹ + 6.1 × 10 ¹⁰ × 100 × 10 ⁻⁹ + 4.38 × 10 ¹⁰ × 10 × 10 ⁻⁹ + 6.1 × 10 ¹⁰ × 100 × 10 ⁻⁹ + 8.39 × 10 ¹⁰ × 100 × 10 ⁻⁹ ) / (50 × 10 ⁻⁹ + 100 × 10 ^{− 9} + 10 × 10 ⁻⁹ + 100 × 10 ⁻⁹ + 100 × 10 ⁻⁹ )
= 23583 / (360 × 10 ⁻⁹ )
= 6.55 × 10 ¹⁰ Pa
= 65.5GPa
And the total thickness of the metal multilayer film is 300 nm or more and does not satisfy the condition of G _e ≦ 55 GPa.
Thus, the resonance in the case where the p-side electrode 13 is made of a metal multilayer film of five layers of (Pd / Pt) / (Ti / Pt / Ni) = (50 nm / 100 nm) / (10 nm / 100 nm / 100 nm) A cross-sectional TEM photograph of the p-side electrode 13 near the cavity end face and the portion of the ridge stripe 10 is as shown in FIG. 15. As described above, the p-side electrode 13 near the cavity end face formed by cleavage is cleaved. A pulled trace was observed, and a gap with a thickness of about 10 nm was observed between the p-side electrode 13 and the p-type GaN contact layer 9. Further, as shown in FIG. 16, when the current is increased in order to obtain a high output in the GaN-based semiconductor laser having this structure, the state of the p-side electrode 13 in the vicinity of the resonator end surface is observed. The p-side electrode 13 was almost peeled off and destroyed.

As described above, according to the first embodiment, a portion of the p-side electrode 13 within at least 100 μm from the cavity end face in the cavity length direction is an n-layer (n is an integer of 2 or more) metal. Since the total thickness of the metal laminated film is 300 nm or more and G _e ≦ 55 GPa, the p-side electrode is formed at the time of cleavage for forming the resonator end face. It is possible to effectively prevent 13 from being peeled off from the p-type GaN contact layer 9 or coming off. The p-side electrode 13 is prevented from being peeled off from the p-type GaN contact layer 9 even when the current passed through the GaN-based semiconductor laser is increased in order to produce a high output, for example, an output of 100 mW or more. And the destruction of the p-side electrode 13 can be prevented. For this reason, failure of the GaN-based semiconductor laser due to destruction of the p-side electrode 13 can be prevented, and reliability can be improved.

Next explained is a GaN compound semiconductor laser according to the second embodiment of the invention. FIG. 3 shows this GaN semiconductor laser.
As shown in FIG. 3, the GaN-based semiconductor laser is formed on the upper part of the undoped AlGaN optical waveguide layer 6, the p-type AlGaN electron barrier layer 7, the p-type GaN / undoped AlGaN superlattice cladding layer 8, and the p-type GaN contact layer 9. Except that the ridge stripe 10 is formed, it has the same configuration as that of the GaN-based semiconductor laser according to the first embodiment.

In this GaN-based semiconductor laser, when the distance between the p-type AlGaN electron barrier layer 7 and the bottom surfaces of both sides of the ridge stripe 10 is d ₁ , the depth of the ridge stripe 10 is set so that d ₁ ≧ 10 nm. Is set. In this case, the p-type AlGaN electron barrier layer 7 is completely contained in the ridge stripe 10. In addition, the distance between the bottom surface of both sides of the ridge stripe 10 and the closest one of the quantum well layers included in the active layer 5 to the p-type AlGaN electron barrier layer 7 is d ₂ , and the p-type AlGaN electron barrier layer. when the distance between the closest and the d ₃ in the p-type AlGaN electron barrier layer 7 of the quantum well layers included in the 7 and the active layer 5, a d ₂ ≧ 100 nm and 300nm ≧ d ₃ ≧ 110nm As described above, the depth of the ridge stripe 10 and the thicknesses of the undoped InGaN optical waveguide layer 5 and the undoped AlGaN optical waveguide layer 6 are set.

  This GaN-based semiconductor laser manufacturing method includes a p-type GaN contact layer 9, a p-type GaN / undoped AlGaN superlattice cladding layer 8, a p-type AlGaN electron barrier layer 7 and an undoped AlGaN optical waveguide layer 6 by dry etching such as RIE. Except for forming the ridge stripe 10 by etching the upper part, the method is the same as that of the GaN-based semiconductor laser according to the first embodiment.

Here, an n value is defined by an expression I _op = A × t ⁿ (I _op is an operating current, A is a constant, and t is a time) of the current deterioration rate of the semiconductor laser. FIG. 4 shows a coordinate system in which GaN-based semiconductor lasers are manufactured by changing the depth of the ridge stripe 10 in various ways, and the direction away from the active layer 4 is a positive direction with one point on the lower surface of the p-type AlGaN electron barrier layer 7 as the origin. 2 shows the correlation between the distance d ₁ from the lower surface of the p-type AlGaN electron barrier layer 7 to the bottom surfaces of both sides of the ridge stripe 10 and the n value. However, d ₁ is measured by cleaving a GaN-based semiconductor laser along a plane perpendicular to the cavity length direction and observing the cross section with a scanning electron microscope (SEM) (cross section SEM observation). There is an error of about 10 nm because of variations in the thickness of the layer forming the laser structure or etching variations when the ridge stripe 10 is formed by dry etching. As can be seen from FIG. 4, when d ≦ −10 nm, the n value is almost 0, and when d ≦ −20 nm, the n value can be more reliably reduced to almost 0, and a GaN-based semiconductor laser with little current deterioration can be obtained. I understand.

FIG. 5 shows that a long-term life test was performed on five GaN semiconductor lasers (samples a, b, c, d, and e) with d ₁ = −30 nm under conditions of 75 ° C., 17 mW, and CW (continuous oscillation). Results are shown. The initial I _op values are 41.69 mA, 43.95 mA, 44.62 mA, 42.86 mA, and 42.68 mA for samples a, b, c, d, and e, respectively. From FIG. 5, it is understood that in these GaN-based semiconductor lasers, I _op maintains an initial value even after 1000 hours, and no current deterioration has occurred for 1000 hours.

According to the second embodiment, the same advantages as those of the first embodiment can be obtained, and the following advantages can be obtained. That is, when the ridge stripe 10 is formed so as to completely penetrate the p-type AlGaN electron barrier layer 7 and the distance between the p-type AlGaN electron barrier layer 7 and the bottom surfaces of both sides of the ridge stripe 10 is d _1. By setting the depth of the ridge stripe 10 so that d ₁ ≧ 10 nm, current deterioration of the GaN-based semiconductor laser is suppressed regardless of variations in etching due to dry etching when the ridge stripe 10 is formed. Therefore, it is possible to obtain a GaN-based semiconductor laser having a long lifetime and high reliability. Further, the distance d ₂ between the bottom surface of both sides of the ridge stripe 10 and the well layer included in the active layer 5 that is closest to the p-type AlGaN electron barrier layer 7 is d ₂ ≧ 100 nm. A low threshold current and a high slope efficiency characteristic can be obtained.

Next explained is a GaN compound semiconductor laser according to the third embodiment of the invention. This GaN-based semiconductor laser is a self-pulsation type GaN-based semiconductor laser. FIG. 6 shows this GaN-based semiconductor laser.
As shown in FIG. 6, in this GaN-based semiconductor laser, a p-type InGaN layer is interposed between the p-type AlGaN electron barrier layer 7 and the p-type GaN / undoped AlGaN superlattice cladding layer 8 and between the p-type GaN layers. A saturable absorbing layer 15 having a structure with a sandwiched therebetween is provided. Grooves 16 and 17 are formed on both sides of the ridge stripe 10 formed in the p-type GaN / undoped AlGaN superlattice cladding layer 8 and the p-type GaN contact layer 9. An insulating film 18 such as a SiO ₂ film is formed on the p-type GaN contact layer 9 outside the grooves 16 and 17. Further, an SiO ₂ film 11 and an undoped Si film 12 thereon are formed extending on both side surfaces of the ridge stripe 10, the grooves 16 and 17, and the insulating film 18 on the outer portion thereof. A p-side electrode 13 is formed in ohmic contact with the p-type GaN contact layer 9 of the ridge stripe 10. The p-side electrode 13 is formed so as to extend on the undoped Si film 12 outside the grooves 16 and 17.
Other configurations of the GaN-based semiconductor laser are the same as those of the GaN-based semiconductor laser according to the first embodiment.

The distance from the bottom surface of the grooves 16, 17 to the upper surface of the active layer 4 in the coordinate system in which the direction toward the active layer 4 is a positive direction with one point on the bottom surface of the grooves 16, 17 as the origin is t ₁ , the groove 16 The depths of the grooves 16 and 17 are set so that t ₁ ≧ 105 nm and 0 ≦ t ₂ ≦ 100 nm, where t ₂ is the distance from the bottom surface of 17 to the upper surface of the saturable absorbing layer 15. The reason will be described later. In general, t ₁ <0.6 μm and typically t ₁ <200 nm. The width of the grooves 16 and 17 is generally 250 μm or less, more generally 100 μm or less, and typically 20 μm or less.

Specific examples of the thickness and composition of the GaN-based semiconductor layer forming the laser structure are the same as those in the first embodiment. For example, the thickness of the p-type AlGaN electron barrier layer 7 is 10 nm and the Al composition is 0.20. The saturable absorption layer 15 has a structure in which a p-type In _0.02 Ga _0.98 layer having a thickness of 2 nm is sandwiched by a p-type GaN layer having a thickness of 3 nm. The p-type AlGaN electron barrier layer 7 is doped with, for example, 1 × 10 ¹⁹ cm ⁻³ or more of Mg. The p-type layer constituting the saturable absorbing layer 15 is doped with, for example, 5 × 10 ¹⁸ cm ⁻³ or more and 1 × 10 ²⁰ cm ⁻³ or less of Mg.

In order to manufacture this GaN-based semiconductor laser, after the completion of the growth of the p-type GaN contact layer 9 as in the first embodiment, an insulating film 18 such as a SiO ₂ film is formed on the entire surface. The insulating film 18 is patterned into a predetermined shape by etching. Next, by using this insulating film 18 as an etching mask, the p-type GaN contact layer 9 and the p-type GaN / undoped AlGaN superlattice cladding layer 8 are etched by dry etching such as RIE to form grooves 16 and 17. Thus, the ridge stripe 10 is formed. Next, for example, an SiO ₂ film 11 and an undoped Si film 12 are sequentially formed on the entire surface while leaving the insulating film 18 used as an etching mask, and these films on the ridge stripe 10 are selectively etched. The upper surface of the ridge stripe 10 is exposed by removing. Next, the p-side electrode 13 is formed on the ridge stripe 10 and the undoped Si film 12. Next, if necessary, the n-type GaN substrate 1 is polished from its back surface to be thinned to a predetermined thickness.
Thereafter, the processes after the cleavage are advanced in the same manner as in the first embodiment, and the target GaN-based semiconductor laser is manufactured.

In this GaN-based semiconductor laser, a saturable layer including a p-type InGaN layer doped with Mg by dry etching to form the grooves 16 and 17 in order to shorten the carrier lifetime of the saturable absorbing layer 15. Etching damage is positively introduced into the absorption layer 15. In this case, in order to reliably introduce etching damage into the saturable absorbing layer 15, 0 ≦ t ₂ ≦ 100 nm is set as described above. In the saturable absorber layer 15 in which etching damage is introduced in this way, more intermediate levels are formed, the non-radiative recombination process through the intermediate rank is increased, and the non-radiative recombination lifetime is shortened. . In general, the carrier lifetime τ _s can be expressed by the following equation using the luminescent recombination lifetime τ _r and the non-radiative recombination lifetime τ _nr .
1 / τ _s = 1 / τ _r + 1 / τ _nr
From this equation, it can be seen that when the non-radiative recombination lifetime τ _nr is shortened, the carrier lifetime τ _s is also shortened.

FIG. 7 shows the results of measuring the relationship between the distance t ₁ and the MTTF (average element lifetime) of the GaN-based semiconductor laser. However, the thickness and composition of the GaN-based semiconductor layer forming the laser structure in this GaN-based semiconductor laser are the same as those in the above specific example. FIG. 7 shows that MTTF becomes shorter at t ₁ ≦ 100 nm. This is because, in a GaN-based semiconductor laser with t ₁ ≦ 100 nm, etching damage is introduced into the active layer 4 during dry etching for forming the grooves 16 and 17, and as a result, the lifetime is rapidly deteriorated. To do. Therefore, the carrier life time of the saturable absorbing layer 15 is shortened by setting the distance t ₂ from the bottom surfaces of the grooves 16 and 17, that is, the dry etching processed surface to the upper surface of the saturable absorbing layer 15 to t ₂ ≦ 100 nm or less. By setting t ₁ ≧ 105 nm or more, it is possible to sufficiently secure the MTTF of the GaN-based semiconductor laser.

  Further, in this GaN-based semiconductor laser, in order to suppress electrons that are injected into the active layer 4 from the n-type AlGaN cladding layer 2 side and leak from the active layer 4, a gap between the saturable absorbing layer 15 and the active layer 4 is obtained. Further, for example, two layers of an undoped AlGaN optical waveguide layer 6 having a thickness of 60 nm and an Al composition of 0.02 and a p-type AlGaN electron barrier layer 7 having a thickness of 10 nm and an Al composition of 0.20 are provided. Yes. Here, since the undoped AlGaN optical waveguide layer 6 is undoped, the energy band near the active layer 4 is flattened, and even if the Al composition is low, the carrier barrier energy seen from the electrons leaking from the active layer 4 is effective. And serves to block electrons leaking from the active layer 4. Further, the p-type AlGaN electron barrier layer 7 serves to block electrons that have passed over the undoped AlGaN optical waveguide layer 6. Thus, by forming the electron block layer in two stages of the undoped AlGaN optical waveguide layer 6 and the p-type AlGaN electron barrier layer 7, it becomes possible to effectively suppress carrier overflow from the active layer 4, Electrons injected into the saturable absorber layer 15 due to this overflow can be greatly reduced. For this reason, the effect of effectively shortening the carrier lifetime of the saturable absorber layer 15 can be obtained. A GaN-based semiconductor laser having such a configuration is highly reliable and can perform a stable self-pulsation operation.

8 and 9 show the measurement results of spectral characteristics and coherent characteristics of this GaN-based semiconductor laser. However, the thickness and composition of the GaN-based semiconductor layer forming the laser structure in the GaN-based semiconductor laser used for measurement are the same as those in the above specific example, and t ₁ = 145 nm and t ₂ = 13 nm. The coherent characteristics were measured with an optical output of 15 mW. γ = 20%. As is clear from FIG. 8, multimode oscillation unique to the self-pulsation laser is confirmed. Further, as shown in FIG. 9, a coherence reduction (γ characteristic) peculiar to the self-pulsation laser is also confirmed.

10 and 11 show the measurement results of the spectral characteristics and coherent characteristics of the GaN-based semiconductor laser according to the comparative example. The thickness and composition of the GaN-based semiconductor layer forming the laser structure in the GaN-based semiconductor laser according to this comparative example are the same as those in the above specific example, but t ₁ = 145 nm and t ₂ = 102 nm, and t ₁ is t Although the condition of ₁ ≧ 105 nm is satisfied, t ₂ does not satisfy the condition of 0 ≦ t ₂ ≦ 100 nm. The coherent characteristics were measured with an optical output of 15 mW. As is clear from FIG. 10, the self-pulsation operation is performed because multimode oscillation is confirmed. However, as is clear from FIG. 11, the coherence reduction (γ characteristic) is insufficient.

According to the third embodiment, the same advantages as those of the first embodiment can be obtained, and the following advantages can be obtained. That is, it is possible to easily realize a GaN-based semiconductor laser that can perform a stable self-pulsation operation, has high reliability, and has a long lifetime. Further, since the upper p-type GaN contact layer 9 of the outer portions of the grooves 16, 17 are formed an insulating film 18, SiO ₂ film 11 and the undoped Si film 12, these insulating films 18, SiO ₂ film 11 In addition, the distance between the p-side electrode 13 and the n-side electrode 14 in the outer portion of the grooves 16 and 17 is larger than the distance in the ridge stripe 10 and the grooves 16 and 17 by the total thickness of the undoped Si film 12. can do. As a result, the capacitance between the p-side electrode 13 and the n-side electrode 14 can be reduced, the high-frequency characteristics of the GaN-based semiconductor laser can be improved, and electrostatic leakage and electrostatic breakdown can be achieved. Can be prevented.

Next explained is a GaN compound semiconductor laser according to the fourth embodiment of the invention.
As shown in FIG. 12, the GaN-based semiconductor laser has the GaN semiconductor laser according to the third embodiment except that the bottom surfaces of the grooves 16 and 17 are located between the upper surface and the lower surface of the saturable absorbing layer 15. The configuration is the same as that of the semiconductor laser. In this case, etching damage is generated in the saturable absorbing layer 15 in the vicinity of the bottom surfaces of the grooves 16 and 17 and the lower portions of the side surfaces.
According to the fourth embodiment, the same advantages as those of the first and third embodiments can be obtained.

Next explained is a GaN compound semiconductor laser according to the fifth embodiment of the invention.
As shown in FIG. 13, this GaN-based semiconductor laser is a GaN-based semiconductor according to the third embodiment except that the bottom surfaces of the grooves 16 and 17 are located below the lower surface of the saturable absorbing layer 15. It has the same configuration as the laser. In this case, etching damage has occurred in the saturable absorbing layer 15 in the vicinity of the side surfaces of the grooves 16 and 17.
According to the fifth embodiment, the same advantages as those of the first and third embodiments can be obtained.

As mentioned above, although embodiment of this invention was described concretely, this invention is not limited to the above-mentioned embodiment, The various deformation | transformation based on the technical idea of this invention is possible.
For example, the numerical values, structures, substrates, processes, and the like given in the above-described embodiments are merely examples, and different numerical values, structures, substrates, processes, and the like may be used as necessary.
Moreover, you may combine 2 or more of the above-mentioned 1st-5th embodiment as needed.
The distance t ₂ from the bottom surface of the grooves 16 and 17 to the top surface of the saturable absorbing layer 15 is selected as t ₂ > 105 nm, and ion implantation is performed on these grooves 16 and 17 to thereby obtain the bottom surfaces of these grooves 16 and 17. It is also possible to sufficiently reduce the carrier lifetime of the saturable absorbing layer 15 by causing damage to the saturable absorbing layer 15 below the same as that caused by, for example, dry etching.

1 is a cross-sectional view showing a GaN-based semiconductor laser according to a first embodiment of the present invention. It is a drawing substitute photograph which shows the cross-sectional TEM photograph of the Example of the GaN-type semiconductor laser by 1st Embodiment of this invention. It is sectional drawing which shows the GaN-type semiconductor laser by 2nd Embodiment of this invention. It is a schematic diagram showing the correlation between d ₁ and the n value in the GaN semiconductor laser according to the second embodiment of the present invention. It is a basic diagram which shows the result of the long-term life test of the GaN-type semiconductor laser by 2nd Embodiment of this invention. It is sectional drawing which shows the GaN-type semiconductor laser by 3rd Embodiment of this invention. Is a schematic diagram illustrating measurement results of the relationship between the distance t ₁ and MTTF from the bottom of the groove in the GaN semiconductor laser to the upper face of the active layer according to a third embodiment of the present invention. It is a basic diagram which shows the measurement result of the spectral characteristic of the GaN-type semiconductor laser by 3rd Embodiment of this invention. It is a basic diagram which shows the measurement result of the coherent characteristic of the GaN-type semiconductor laser by 3rd Embodiment of this invention. It is a basic diagram which shows the measurement result of the spectral characteristic of the GaN-type semiconductor laser by a comparative example. It is a basic diagram which shows the measurement result of the coherent characteristic of the GaN-type semiconductor laser by a comparative example. It is sectional drawing which shows the GaN-type semiconductor laser by 4th Embodiment of this invention. It is sectional drawing which shows the GaN-type semiconductor laser by 5th Embodiment of this invention. It is sectional drawing which shows the conventional GaN-type semiconductor laser. It is a drawing substitute photograph which shows the cross-sectional TEM photograph of the conventional GaN-type semiconductor laser. It is a drawing substitute photograph which shows the SEM photograph of the conventional GaN-type semiconductor laser. It is a basic diagram which shows the relationship between the Young's modulus and rigidity of various metals. It is a basic diagram which shows the linear expansion coefficient of various metals. It is sectional drawing which shows the conventional GaN-type semiconductor laser.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... n-type GaN board | substrate, 2 ... n-type AlGaN clad layer, 3 ... n-type GaN optical waveguide layer, 4 ... Active layer, 5 ... Undoped InGaN optical waveguide layer, 6 ... Undoped AlGaN optical waveguide layer, 7 ... p-type AlGaN Electron barrier layer, 8 ... p-type GaN / undoped AlGaN superlattice cladding layer, 9 ... p-type GaN contact layer, 10 ... ridge stripe, 11 ... SiO ₂ film, 12 ... undoped Si film, 13 ... p-side electrode, 14 ... n-side electrode, 15 ... saturable absorption layer, 16, 17 ... groove, 18 ... insulating film

Claims (13)

In a semiconductor laser in which an electrode is provided on a nitride-based III-V compound semiconductor layer forming a laser structure without alloying at an interface thereof,
At least a part of the electrode is composed of a metal laminated film including an n-layer (n is an integer of 2 or more) metal film,
The total thickness of the metal multilayer film is 300 nm or more, and the rigidity and thickness of the i-th metal film from the bottom of the metal multilayer film are G _i and t _i , respectively. Average stiffness

A semiconductor laser, wherein G _e ≦ 55 GPa.   2. The semiconductor laser according to claim 1, wherein a ridge stripe is formed on the nitride-based III-V group compound semiconductor layer, and the electrode is provided on the ridge stripe. 2. The semiconductor laser according to claim 1, wherein a total thickness of the metal laminated films is 500 nm or more and G _e ≦ 50 GPa.   2. The semiconductor laser according to claim 1, wherein the metal laminated film contains at least one metal selected from the group consisting of Pd, Pt and Ni.   5. The semiconductor laser according to claim 4, wherein the n-layer metal films constituting the metal laminated film are not mixed with each other.   2. The semiconductor laser according to claim 1, wherein the metal laminated film contains at least two kinds of metals selected from the group consisting of Pd, Pt and Ni.   7. The semiconductor laser according to claim 6, wherein the n-layer metal films constituting the metal laminated film are not mixed with each other.   2. The semiconductor laser according to claim 1, wherein at least a portion within 100 [mu] m in the cavity length direction from the cavity end face of the electrode is made of the metal laminated film. Growing a nitride III-V compound semiconductor layer forming a laser structure on a substrate;
An electrode is formed on the nitride III-V compound semiconductor layer without an alloying treatment. At this time, at least a part of the electrode is formed with an n-layer (n is an integer of 2 or more) metal film. And the total thickness of the metal multilayer film is 300 nm or more, and the rigidity and thickness of the i-th metal film from the bottom of the metal multilayer film are set to G _i and t _i , respectively. And the equivalent average rigidity of the metal laminate film is

And a step of forming the semiconductor laser with G _e ≦ 55 GPa. In an optical pickup using a semiconductor laser as a light source,
As the semiconductor laser,
In a semiconductor laser in which an electrode is provided on a nitride-based III-V compound semiconductor layer forming a laser structure without alloying at an interface thereof,
At least a part of the electrode is composed of a metal laminated film including an n-layer (n is an integer of 2 or more) metal film,
The total thickness of the metal multilayer film is 300 nm or more, and the rigidity and thickness of the i-th metal film from the bottom of the metal multilayer film are G _i and t _i , respectively. Average stiffness

An optical pickup using G _e ≦ 55 GPa when defined as In an optical disc apparatus using a semiconductor laser as a light source,
As the semiconductor laser,
In a semiconductor laser in which an electrode is provided on a nitride-based III-V compound semiconductor layer forming a laser structure without alloying at an interface thereof,
At least a part of the electrode is composed of a metal laminated film including an n-layer (n is an integer of 2 or more) metal film,
The total thickness of the metal multilayer film is 300 nm or more, and the rigidity and thickness of the i-th metal film from the bottom of the metal multilayer film are G _i and t _i , respectively. Average stiffness

An optical disc device characterized by using G _e ≦ 55 GPa. In the semiconductor device in which the electrodes are provided on the nitride-based III-V compound semiconductor layer without being alloyed at their interfaces,
At least a part of the electrode is composed of a metal laminated film including an n-layer (n is an integer of 2 or more) metal film,
The total thickness of the metal multilayer film is 300 nm or more, and the rigidity and thickness of the i-th metal film from the bottom of the metal multilayer film are G _i and t _i , respectively. Average stiffness

G _e ≦ 55 GPa when defined as: Semiconductor device, characterized in that Growing a nitride III-V compound semiconductor layer on a substrate;
An electrode is formed on the nitride III-V compound semiconductor layer without an alloying treatment. At this time, at least a part of the electrode is formed with an n-layer (n is an integer of 2 or more) metal film. And the total thickness of the metal multilayer film is 300 nm or more, and the rigidity and thickness of the i-th metal film from the bottom of the metal multilayer film are set to G _i and t _i , respectively. And the equivalent average rigidity of the metal laminate film is

And a step of forming the semiconductor device with G _e ≦ 55 GPa.

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