JP2008123932A - Method of manufacturing organic el device, and device for manufacturing organic el device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an organic EL device and a device for manufacturing the organic EL device superior in sealing performance and excellent in light-emitting characteristics. <P>SOLUTION: Since an organic buffer layer is formed by using a printing material (organic material) of viscosity of 3,000 mPa s to 100,000 mPa s on a cathode protection layer, even if the cathode protection layer is damaged at a level difference part, it is possible to evade the printing material from soaking from the damaged part. By this, since degeneration of the organic layer can be evaded and reduction of the light-emitting characteristics of the light-emitting layer can be evaded, the organic EL device 1 superior in sealing performance and high in light-emitting characteristics becomes manufacturable. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an organic EL device manufacturing method and an organic EL device manufacturing apparatus.

  With the diversification of information equipment, the need for flat display devices that consume less power and are lighter is increasing. As one of such flat display devices, an organic electroluminescence device (hereinafter referred to as “organic EL device”) having an organic light emitting layer is known.

  In many cases, an organic EL device has a structure in which an anode, a light emitting layer, and a cathode are sequentially stacked for each pixel separated by a partition, and the cathode is covered with a cathode protective layer made of an inorganic material. When the partition is formed of an organic material, the partition is generally formed so that the upper surface of the partition is higher than the upper surface of the anode. In recent years, in order to improve the hole injection property and electron injection property, a configuration in which a hole injection layer is disposed between the anode and the light emitting layer and a configuration in which an electron injection layer is disposed between the light emitting layer and the cathode are known. ing.

  Many of the materials used for the light emitting layer, the hole injection layer, and the electron injection layer of the organic EL device react with moisture in the atmosphere and are easily deteriorated. When these layers deteriorate, a non-light emitting region called a “dark spot” is formed in the organic EL device, and the lifetime of the light emitting element is shortened.

On the other hand, a technique called thin film sealing is used in which a thin film made of an inorganic material such as silicon nitride, silicon oxide, ceramics, etc., which is transparent and has excellent gas barrier properties, is formed on the light emitting element as a gas barrier layer. (For example, refer to Patent Document 1). When the gas barrier layer is directly formed on the element substrate having the pixel partition walls or the like, cracks or the like are generated due to the uneven shape on the surface. For this reason, an organic buffer layer is formed on the element substrate (on the cathode protective layer), and then a gas barrier layer is formed.
JP 2003-243171 A

  However, when the upper surface of the partition wall is formed so as to be higher than the upper surface of the anode, a step is formed in each layer when the hole injection layer, the light emitting layer, and the cathode are formed on the partition wall and the anode. By forming the step, a step is also formed in the cathode protective layer formed on the cathode, and the cathode protective layer may be damaged at the step. When the organic buffer layer is formed, if the organic material constituting the organic buffer layer permeates from the damaged portion, the light emitting layer and the hole injection layer are deteriorated, and the light emitting characteristics are deteriorated.

  In view of the circumstances as described above, an object of the present invention is to provide an organic EL device manufacturing method and an organic EL device manufacturing apparatus capable of manufacturing an organic EL device with good sealing performance and high light emission characteristics. .

In order to achieve the above object, an organic EL device manufacturing method according to the present invention includes an anode forming step for forming an anode on a substrate, and a partition wall for forming a partition wall in a predetermined region on the substrate after the anode forming step. A forming step; an organic layer forming step for forming an organic layer including a light emitting layer on the anode after the partition forming step; a cathode forming step for forming a cathode on the organic layer; and a cathode protective layer on the cathode. And a step of forming an organic buffer layer using an organic material having a predetermined viscosity range on the cathode protective layer.
According to the present invention, since the organic buffer layer is formed on the cathode protective layer using an organic material having a predetermined viscosity range, even if the cathode protective layer is damaged at the stepped portion, the organic material penetrates from the damaged portion. Can be avoided. As a result, the organic layer can be prevented from being deteriorated and the light emission characteristics of the light emitting layer can be prevented from deteriorating, so that an organic EL device having good sealing performance and high light emission characteristics can be manufactured.

In the method for manufacturing the organic EL device, the organic buffer layer forming step includes a heating step of heating the organic material, and a detection step of detecting whether the viscosity of the organic material is within the predetermined viscosity range by heating. And an application step of applying the organic material onto the cathode protective layer by a screen printing method when it is detected that the viscosity of the organic material is in the predetermined viscosity range.
According to the present invention, in the organic buffer layer forming step, the organic material is heated, and it is detected whether or not the viscosity of the organic material is in a predetermined viscosity range by heating, and the viscosity of the organic material is in the predetermined viscosity range. When it is detected that the organic material is applied to the cathode protective layer by screen printing, the organic material can be efficiently made to have a predetermined viscosity. Thereby, the manufacturing efficiency of the organic EL device can be improved.

The method for manufacturing the organic EL device includes a heating step in which the organic buffer layer forming step heats the organic material, and a predetermined time after the heating step is started, and then the organic material is removed by screen printing. And a coating step of coating on the cathode protective layer.
According to the present invention, in the organic buffer layer forming step, the organic material is heated, and after the predetermined time has elapsed since the start of heating, the organic material is applied onto the cathode protective layer by a screen printing method. It is possible to achieve a predetermined viscosity well. Thereby, the manufacturing efficiency of the organic EL device can be improved. The predetermined time can be set based on the data obtained by previously extracting the relationship between the heating time and the viscosity of the organic material as data.

An organic EL device manufacturing apparatus according to the present invention includes an anode provided on a substrate, an organic layer including a light emitting layer provided on the anode, a cathode provided on the organic layer, and the cathode. An apparatus for manufacturing an organic EL device having a cathode protective layer provided and an organic buffer layer provided on the cathode protective layer, the substrate holding unit holding the substrate, and the organic buffer on the substrate An organic material holding unit for holding the organic material constituting the layer, a heating unit for heating the organic material, and a control unit for controlling the heating time of the organic material so that the viscosity of the organic material falls within a predetermined viscosity range And printing means for screen printing the organic material on the cathode protective layer.
According to the present invention, the organic material holding unit that holds the organic material that constitutes the organic buffer layer, the heating unit that heats the organic material, and the heating time of the organic material so that the viscosity of the organic material falls within a predetermined viscosity range And a printing unit for screen printing the organic material on the cathode protective layer, the viscosity of the organic buffer layer formed on the cathode protective layer can be within a predetermined viscosity range, Even if the cathode protective layer is damaged at the step portion when the organic buffer layer is formed, it is possible to prevent the organic material from permeating from the damaged portion. As a result, the organic layer can be prevented from being deteriorated and the light emission characteristics of the light emitting layer can be prevented from deteriorating, so that an organic EL device having good sealing performance and high light emission characteristics can be manufactured.

[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. In each of the drawings shown below, the scale is different for each layer and each member so that the size can be recognized on the drawing.

(Organic EL device)
FIG. 1 is a plan view showing a configuration of an organic EL device 1 according to the present embodiment. In the present embodiment, an organic EL device having a top emission structure will be described as an example. The top emission structure is a structure in which light is extracted from the sealing substrate side instead of the element substrate side, and has an advantage that a wide light emitting area can be secured without being affected by the size of various circuits arranged on the element substrate. Luminance can be ensured while suppressing voltage and current, and the lifetime of the light-emitting element can be maintained long.

  As shown in the figure, the organic EL device 1 has a configuration in which an element substrate 10 has a display area (area inside the dashed line in the figure) 2 and a non-display area (area outside the dashed line in the figure) 3. It has become.

  The display area 2 is provided with an actual display area 4 (area inside the two-dot chain line in the figure) and a dummy area (area outside the two-dot chain line in the figure).

  In the actual display area 4, sub pixels from which red (R), green (G), and blue (B) light is emitted are arranged in a matrix. The red sub-pixel, the green sub-pixel, and the blue sub-pixel are provided in stripes one column at a time, and this stripe is repeatedly formed in the row direction. Adjacent red subpixels, green subpixels, and blue subpixels are combined to form a pixel, and full color display is possible by mixing red, green, and blue light in one pixel. Yes.

  The dummy area 5 is provided with a circuit mainly for causing each sub-pixel to emit light. For example, the scanning line driving circuit 80 is disposed along the left side and the right side of the actual display region 4 in the drawing, and the inspection circuit 90 is disposed along the upper side of the actual display region 4 in the drawing. The inspection circuit 90 is a circuit for inspecting the operating state of the organic EL device 1. For example, the inspection result is output to an external driver or the like so that the quality and defects of the organic EL device 1 can be inspected during manufacturing or at the time of shipment.

FIG. 2 is a cross-sectional view showing the configuration of the organic EL device 1 and shows one set of pixels.
As shown in the figure, the organic EL device 1 has a configuration in which a drive circuit layer 6, an organic EL layer 7, a sealing layer 8, and a sealing substrate 9 are sequentially stacked on an element substrate 10. Yes.

  The drive circuit layer 6 is provided with a semiconductor layer 30 constituting a TFT (Thin Film Transistor) element. The semiconductor layer 30 is made of a semiconductor such as silicon and is provided on the element substrate 10. The insulating layer 11 is provided on the element substrate 10 so as to cover at least a region where the above-described subpixel is provided and a part of the semiconductor layer 30, and the insulating layer 11 is interrupted in a region between the subpixels. .

The organic EL layer 7 is provided with a light reflecting film 12, an anode 13, a partition wall 14, a hole injection layer 15, a light emitting layer 16, and a cathode 17.
The light reflecting film 12 is a reflecting member that reflects the light emitted from the light emitting layer 16 toward the sealing layer 8. The light reflecting film 12 is made of a light reflecting material such as aluminum, copper, or silver, and is provided on the insulating layer 11. The light reflection film 12 is disposed in a region overlapping the above-described subpixel in plan view.

  The anode 13 is made of a light-transmitting conductive material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide: registered trademark), and overlaps the above-described sub-pixels in plan view so as to cover the light reflection film 12. Arranged in the area. One end of the anode 13 extends into the insulating layer 11, and this extended portion is connected to the drain region of the semiconductor layer 30.

  Since the organic EL device 1 of the present embodiment has a top emission structure, it is not necessary to use a light transmissive material as the material of the anode 13. For example, a metal material such as aluminum may be used. When a metal material is used, the light reflecting film 12 may not be provided.

  The partition wall 14 is made of an organic insulating material such as acrylic resin, and is disposed in a region between the sub-pixels described above. The partition wall 14 is stacked above the portion of the anode 13 that is connected to the drain region of the semiconductor layer 30.

  The hole injection layer 15 is provided on almost the entire surface of the element substrate 10 so as to cover the partition wall 14 and the anode 13. The hole injection layer 15 is made of, for example, a triarylamine (ATP) multimer or a TDP (triphenyldiamine) -based material.

  The light emitting layer 16 is made of a light emitting material that emits white light, and is provided so as to cover the hole injection layer 15. As the luminescent material, for example, a styrylamine-based luminescent material, anthracene-based dopamine (blue), a styrylamine-based luminescent material, or rubrene-based dopamine (yellow) is used. The hole injection layer 15 and the light emitting layer 16 constitute an organic layer 25.

  The cathode 17 is made of a light-transmitting conductive material such as ITO or IZO, and is provided so as to cover the light emitting layer 16. Since the present embodiment has a top emission structure, the cathode 17 needs to be made of a material having optical transparency. For the cathode 17, a material having a large electron injection effect (a work function of 4 eV or less) is preferably used. For example, calcium, magnesium, sodium, lithium metal, or a metal compound thereof is used by adjusting the film thickness to obtain transparency. Examples of the metal compound include metal fluorides such as calcium fluoride, metal oxides such as lithium oxide, and organometallic complexes such as acetylacetonato calcium.

  In addition to these materials, in order to reduce electrical resistance, a metal layer such as aluminum, gold, silver, or copper is patterned in the region between the sub-pixels, or a transparent metal such as ITO or tin oxide. You may use it in combination with the laminated body with an oxide conductive layer. Examples of the combination include lithium fluoride and a magnesium-silver alloy, an ITO laminate, and the like.

The sealing layer 8 is provided with a cathode protective layer 18, an organic buffer layer 19, and a gas barrier layer 20.
The cathode protective layer 18 is provided so as to cover the cathode 17. The cathode protective layer 18 is preferably composed of an inorganic compound such as silicon oxynitride from the aspects of transparency, adhesion, and water resistance. The thickness of the cathode protective layer 18 is preferably 100 nm or more and 200 nm or less.

  The organic buffer layer 19 is provided so as to cover the cathode protective layer 18. The organic buffer layer 19 has a function of relieving stress generated by warping or volume expansion of the element substrate 10 and preventing the cathode protective layer 18 from peeling from the cathode 17. The elastic modulus of the organic buffer layer 19 is preferably 1 to 10 GPa. If it is 10 GPa or more, the stress when the partition 14 is flattened cannot be absorbed, and if it is 1 GPa or less, the wear resistance, heat resistance, and the like are insufficient.

  The optimum film thickness of the organic buffer layer 19 is preferably 3 to 10 μm. When the organic buffer layer 19 is thicker, foreign matter is mixed in to prevent defects in the gas barrier layer 20. However, if the combined thickness of the organic buffer layer 19 exceeds 10 μm, the coloring layer 23 and the light emitting layer 16 described later This is because the efficiency of extracting light decreases because the distance increases and the amount of light escaping to the side increases.

  The gas barrier layer 20 is provided so as to cover the organic buffer layer 19. The gas barrier layer 20 is for preventing oxygen and moisture from entering, so that deterioration of the organic layer 25 due to oxygen and moisture can be suppressed. The gas barrier layer 20 is preferably formed of a silicon compound containing nitrogen, that is, silicon nitride or an inorganic compound in consideration of transparency, gas barrier properties, and water resistance. The elastic modulus of the gas barrier layer 20 is preferably 100 GPa or more, specifically about 200 to 250 GPa.

  The film thickness of the gas barrier layer 20 is preferably about 200 to 600 nm. This is because if it is less than 200 nm, the coverage with respect to foreign matter is insufficient and a through-hole is partially formed, and the gas barrier property may be impaired. If it exceeds 600 nm, a crack due to stress occurs. Because there is a fear.

  The gas barrier layer 20 may have a structure in which a plurality of layers are laminated, or may have a configuration in which the composition is nonuniform and the oxygen concentration changes continuously or discontinuously. The film thickness when the gas barrier layer 20 has a laminated structure is preferably 200 to 400 nm as the first gas barrier layer, and if it is less than 200 nm, the surface and side surface coating of the organic buffer layer 19 will be insufficient. As a 2nd gas barrier layer which improves the coating | covering property, such as a foreign material, 200-800 nm is preferable.

  In this embodiment, since the organic EL device 1 has a top emission structure, the gas barrier layer 20 needs to have light transmittance. For this reason, it is necessary to adjust a material and a film thickness suitably. In the present embodiment, the light transmittance in the visible light region is adjusted to, for example, 80% or more.

  The sealing substrate 9 has a configuration in which the light shielding layer 22 and the colored layer 23 are provided on the surface 24 a of the transparent substrate 24, and the surface 24 a side is connected to the gas barrier layer 20 of the sealing layer 8 via the adhesive layer 21. The configuration is pasted. As the adhesive layer 21, for example, an epoxy monomer / oligomer having an epoxy group and a molecular weight of 3000 or less is suitably used as in the organic buffer layer 19 (monomer definition: molecular weight 1000 or less, oligomer definition: molecular weight 1000 to 3000).

  The transparent substrate 24 is made of a light transmissive material such as glass or transparent plastic (polyethylene terephthalate, acrylic resin, polycarbonate, polyolefin, etc.).

  The colored layer 23 is disposed in a region overlapping the above-described sub-pixels in plan view. The red sub-pixel has a red colored layer 23R, the green sub-pixel has a green colored layer 23G, and the blue sub-pixel has a red color. Are each provided with a blue colored layer 23B. The light shielding layer 22 is formed in a region between the sub-pixels.

FIG. 3 is a schematic diagram showing a circuit structure of the organic EL device 1.
The organic EL device 1 includes a plurality of scanning lines 101, a plurality of signal lines 102 extending in a direction perpendicular to the scanning lines 101, and a plurality of power supply lines 103 extending in parallel to the signal lines 102. The wiring configuration consists of Pixel regions (sub-pixels) X are formed in the vicinity of the intersections of the scanning lines 101 and the signal lines 102.

  A data line driving circuit 100 including a shift register, a level shifter, a video line, and an analog switch is connected to the signal line 102. A scanning line driving circuit 80 including a shift register and a level shifter is connected to the scanning line 101.

  In each pixel region X, a switching TFT (switching element) 112 to which a scanning signal is supplied to the gate electrode via the scanning line 101 and a pixel signal shared from the signal line 102 via the switching TFT 112 are received. A holding capacitor 113 to be held, a driving TFT 30 to which a pixel signal held by the holding capacitor 113 is supplied to the gate electrode, and the power source line 103 when electrically connected to the power source line 103 through the driving TFT 30 An anode 13 into which a driving current flows from 103 and a hole injection layer 15 and a light emitting layer 16 sandwiched between the anode 13 and the cathode 17 are provided.

  In the organic EL device 1, when the scanning line 101 is driven and the switching TFT 112 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor 113, and the driving line is driven according to the state of the holding capacitor 113. The on / off state of the TFT 30 is determined. When the driving TFT 30 is in an on state, a current flows from the power supply line 103 to the anode 13 through the channel, and holes are injected into the light emitting layer 16 through the hole injection layer 15. On the other hand, electrons are injected from the cathode 17 into the light emitting layer 16. The holes and electrons injected in the light emitting layer 16 are combined to emit light.

(Organic EL device manufacturing equipment)
Next, the screen printing apparatus which is a manufacturing apparatus of said organic EL apparatus 1 is demonstrated. FIG. 4 is a diagram schematically illustrating the configuration of the screen printing apparatus 41.
As shown in the figure, the screen printing apparatus 41 is mainly composed of a stage 49, a screen mesh 51, a scraper 52, a squeegee 53, a heating device 54, and a control unit 55.

  The stage 49 is a substrate holding unit that holds an element substrate that constitutes the organic EL device 1 and is provided so as to be movable up and down. A screen mesh (organic material holding unit) 51 for printing a predetermined pattern is provided above the holding surface of the stage 49. The screen mesh 51 holds the printing material 56.

  Above the screen mesh 51, a scraper 52 for leveling and spreading the printing material 56 on the screen mesh 51 and a squeegee 53 for transferring the printing material 56 on the screen mesh 51 to the element substrate are installed. . The scraper 52 and the squeegee 53 are configured to move in a direction orthogonal to the substrate conveyance direction, that is, in a direction penetrating the paper surface on the screen mesh 51. However, in FIG. 9, for the convenience of illustration, the scraper 52 and the squeegee 53 are shown separately in the left-right direction of the drawing. The scraper 52 and the squeegee 53 constitute printing means.

  The heating device 54 is provided above the screen mesh 51 so as to heat the printing material 56. A heating means such as a heating wire is provided in the heating device 54.

  The control unit 55 is attached to the heating device 54 and controls the heating time and the heating temperature by the heating device 54. For example, the heating time and the heating temperature can be controlled by adjusting the current flowing through the heating wire. The controller 55 stores data indicating the relationship between the heating temperature and heating time of the printing material 56 and the viscosity.

(Method for manufacturing organic EL device)
Next, a method for manufacturing the organic EL device 1 configured as described above will be described.
First, the semiconductor layer 30 constituting the TFT is formed on the element substrate 10, and the insulating layer 11 is formed. When the insulating layer 11 is formed, the light reflecting film 12 and the anode 13 are formed. The anode 13 is formed by sputtering, for example, by covering a region other than a region overlapping the subpixel in a plan view with a mask. An extending portion connected to the drain region of the semiconductor layer 30 is also formed.

  When the anode 13 is formed, the partition wall 14 is formed. After the partition wall 14 is formed, the hole injection layer 15, the light emitting layer 16, and the cathode 17 are formed so as to cover the partition wall 14 and the anode 13. The hole injection layer 15, the light emitting layer 16, and the cathode 17 are formed on almost the entire surface of the element substrate 10 by vapor deposition. Since a step is formed between the partition wall 14 and the anode 13, a step is also formed on the surface of the cathode 17. When the cathode 17 is formed, a cathode protective layer 18 is formed on the cathode 17. Damaged portions (cracks) are formed in some parts of the cathode protective layer 18 on the steps of the cathode 17.

  After the cathode protective layer 18 is formed, the element substrate 10 is placed on the stage 49 of the screen printing apparatus 41 described above. The screen mesh 51 of the screen printing apparatus 41 is provided with a material constituting the organic buffer layer 19 as the printing material 56. The printing material 56 is heated at a predetermined temperature for a predetermined time by the heating device 54 so that the viscosity of the printing material 56 is in a range of 3000 mPa · s to 100000 mPa · s. The control unit 55 controls the heating time and the heating temperature of the printing material 56 using data indicating the relationship between the heating time and the viscosity of the printing material 56.

  Here, the viscosity of the printing material 56 is set to the range of 3000 mPa · s to 100000 mPa · s. If the viscosity of the printing material 56 is 3000 mPa · s or less, the printing material 56 penetrates into the crack of the cathode protective layer 18. This is because it has been empirically known that there is a possibility of infiltrating the lower layer side. This is because if the viscosity is 100000 mPa · s or more, the viscosity is too high and the printing material 56 cannot be screen printed.

  When the viscosity of the printing material 56 is in the range of 3000 mPa · s to 100000 mPa · s, the printing material 56 is printed on the cathode protective layer 18 by the scraper 52 and the squeegee 53 to form the organic buffer layer 19. Thereafter, the transparent substrate 24 is attached via the adhesive layer 21 to complete the organic EL device 1.

  According to the present embodiment, since the organic buffer layer 19 is formed on the cathode protective layer 18 using the printing material (organic material) 56 having a viscosity of 3000 mPa · s to 100,000 mPa · s, the cathode protective layer 18 has a stepped portion. Even if damaged, it is possible to prevent the printing material 56 from penetrating from the damaged portion. As a result, the organic layer 25 can be prevented from being deteriorated, and the light emission characteristics of the light emitting layer 16 can be prevented from being deteriorated. Therefore, the organic EL device 1 having good sealing performance and high light emission characteristics can be manufactured. Become.

  Further, according to the present embodiment, the screen mesh 51 that holds the printing material 56 constituting the organic buffer layer 19, the heating device 54 that heats the printing material 56, and the printing material 56 of 3000 mPa · s to 100000 mPa · s. Since the controller 55 controls the heating temperature and the heating time of the printing material 56 so as to obtain a viscosity, and the scraper 52 and the squeegee 53 for screen-printing the printing material 56 on the cathode protection layer 18, the cathode protection layer 18 is provided. The viscosity of the organic buffer layer 19 formed thereon can be set to 3000 mPa · s to 100,000 mPa · s. Even when the cathode protective layer 18 is damaged at the stepped portion when the organic buffer layer 19 is formed, the printing material 56 starts from the damaged portion. Can be avoided. As a result, the organic layer 25 can be prevented from being deteriorated, and the light emission characteristics of the light emitting layer 16 can be prevented from being deteriorated. Therefore, the organic EL device 1 having good sealing performance and high light emission characteristics can be manufactured. Become.

[Second Embodiment]
Next, a second embodiment of the present invention will be described. In the present embodiment, an example of an electronic apparatus including the organic EL devices 1 and 201 described above will be described.

  FIG. 5A is a perspective view showing an example of a mobile phone. In FIG. 5A, reference numeral 350 indicates a mobile phone body, and reference numeral 351 indicates a display unit including the organic EL device 1.

  FIG. 5B is a perspective view showing an example of a portable information processing apparatus such as a word processor or a personal computer. In FIG. 5B, reference numeral 360 denotes an information processing apparatus, reference numeral 361 denotes an input unit such as a keyboard, reference numeral 363 denotes an information processing body, and reference numeral 362 denotes a display unit including the organic EL device 1.

  FIG. 5C is a perspective view showing an example of a wristwatch type electronic device. In FIG. 5C, reference numeral 370 indicates a watch body, and reference numeral 371 indicates a display unit including the organic EL device 1.

  The electronic devices shown in FIGS. 5A to 5C are provided with the organic EL device 1 shown in the previous embodiment, so that the electronic devices have good display characteristics.

  The electronic device is not limited to the electronic device, and can be applied to various electronic devices. For example, a desktop computer, a liquid crystal projector, a multimedia personal computer (PC) and an engineering workstation (EWS), a pager, a word processor, a television, a viewfinder type or a monitor direct view type video tape recorder, an electronic notebook, an electronic The present invention can be applied to electronic devices such as a desktop computer, a car navigation device, a POS terminal, and a device having a touch panel.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
In the above embodiment, the light emitting layer 16 that emits white light is provided. However, the present invention is not limited to this. For example, a red light emitting layer is provided in a red subpixel, and a green subpixel is provided. May be configured such that a light emitting layer that emits green light is provided, and a light emitting layer that emits blue light is provided in the blue sub-pixel.

  In this case, as a material constituting the light emitting layer, for example, as a polymer material, (poly) fluorene derivative (PF), (poly) paraphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP) ), Polyvinyl carbazole (PVK), polythiophene derivatives, polysilanes such as polymethylphenylsilane (PMPS), and the like are preferably used.

  In addition, these polymer materials include polymer materials such as perylene dyes, coumarin dyes, rhodamine dyes, rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, and quinacridone. It can also be used by doping a low molecular weight material such as.

  As a low molecular weight material, a host material such as Alq3 or DPVBi, doped with Nile Red, DCM, rubrene, perylene, rhodamine, or the like, or a host alone can be used in a vapor deposition method.

  Moreover, in the said embodiment, although the hole injection layer 15 and the light emitting layer 16 were mentioned as an example and demonstrated as a layer which comprises the organic layer 25, it is not restricted to this, For example, the upper layer side of the light emitting layer 16 Further, an electron injection layer made of aluminum quinolinol (Alq3) or the like may be further provided.

  In the above embodiment, the organic EL device having the top emission structure has been described as an example. However, the present invention is not limited thereto, and the present invention can be applied to the organic EL device having the bottom emission structure.

1 is a plan view showing a configuration of an organic EL device according to a first embodiment of the present invention. Sectional drawing which shows the structure of the organic electroluminescent apparatus concerning this embodiment. The circuit diagram which shows the wiring structure of the organic electroluminescent apparatus which concerns on this embodiment. The figure which shows the structure of the manufacturing apparatus of the organic EL apparatus which concerns on this embodiment. The figure which shows the structure of the electronic device which concerns on 2nd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Organic EL device 41 ... Screen printing device 49 ... Stage 51 ... Screen mesh 52 ... Scraper 53 ... Squeegee 54 ... Heating device 55 ... Control part 56 ... Printing material

Claims (4)

An anode forming step of forming an anode on the substrate;
After the anode formation step, a partition formation step of forming a partition in a predetermined region on the substrate;
After the partition formation step, an organic layer formation step of forming an organic layer including a light emitting layer on the anode;
A cathode forming step of forming a cathode on the organic layer;
A cathode protective layer forming step of forming a cathode protective layer on the cathode; and
An organic buffer layer forming step of forming an organic buffer layer on the cathode protective layer using an organic material having a predetermined viscosity range. The organic buffer layer forming step includes
A heating step of heating the organic material;
A detection step of detecting whether the viscosity of the organic material is in the predetermined viscosity range by heating; and
2. A coating step of coating the organic material on the cathode protective layer by a screen printing method when it is detected that the viscosity of the organic material is within the predetermined viscosity range. The manufacturing method of the organic electroluminescent apparatus of description. The organic buffer layer forming step includes
A heating step of heating the organic material;
The manufacturing method of the organic EL device according to claim 1, further comprising: a coating step of coating the organic material on the cathode protective layer by a screen printing method after a predetermined time has elapsed since the heating step was started. Method. An anode provided on a substrate, an organic layer provided on the anode and including a light emitting layer, a cathode provided on the organic layer, a cathode protective layer provided on the cathode, and the cathode protective layer An organic EL device manufacturing apparatus having an organic buffer layer provided thereon,
A substrate holder for holding the substrate;
An organic material holding unit for holding an organic material constituting the organic buffer layer on the substrate;
A heating unit for heating the organic material;
A control unit for controlling the heating time of the organic material so that the viscosity of the organic material falls within a predetermined viscosity range;
An organic EL device manufacturing apparatus, comprising: a printing unit that screen-prints the organic material on the cathode protective layer.

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