JP2008123924A - Pattern forming apparatus and pattern forming method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress irregularities generated in a pattern when forming the pattern comprising a plurality of linear pattern elements by discharging a pattern forming material from a plurality of discharge ports. <P>SOLUTION: The pattern forming apparatus 1 comprises a nozzle part 5 provided with the plurality of discharge ports and a stage moving mechanism 2 for moving a substrate 9 to the nozzle part 5. Since the substrate 9 is moved while the pattern forming material is continuously discharged from the plurality of discharge ports of the nozzle part 5, the pattern comprising the plurality of linear and rib-like pattern elements arrayed at equal pitches on the substrate 9 is formed. In the pattern forming apparatus 1, the temperature of the pattern forming material to be discharged is irregularly changed by using a heater inside the nozzle part 5 while the pattern is formed, and thus the viscosity of the pattern forming material is irregularly changed. As a result, the way of spreading of the pattern forming material before it is cured on the substrate 9 is irregularly changed and the irregularities generated in a striped pattern are suppressed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a technique for forming a pattern composed of a plurality of linear pattern elements arranged on a substrate.

  In recent years, in the manufacture of display devices such as plasma display devices, organic EL display devices, and field emission display devices, a fluid material containing a resin component (hereinafter referred to as “pattern forming material”) is used from a nozzle having a plurality of discharge ports. There has been proposed a technique for continuously discharging and forming a predetermined pattern on a substrate. For example, in Patent Document 1, a back plate is moved while discharging partition material from a plurality of discharge ports, and light is applied to the partition material immediately after discharge to promote curing, thereby achieving high quality and high quality on the back plate. A technique for forming an accurate partition is disclosed.

In addition, although it is not pattern formation by continuous discharge of a fluid material, in patent document 2, as a method of manufacturing a color filter of a display device such as a liquid crystal, a plurality of droplet weights from each nozzle are applied to a glass substrate. A method for preventing unevenness of three colors of R (red), G (green), and B (blue) by randomly ejecting droplets is disclosed.
JP 2002-184303 A JP 2003-279724 A

  When a plurality of linear and rib-shaped elements constituting a pattern (hereinafter, each linear element is referred to as a “pattern element”) are arranged at an equal pitch by discharging a pattern forming material from a plurality of discharge ports. In order to obtain a uniform pattern, all the pattern elements are required to have the same cross-sectional shape.

  However, due to, for example, processing errors of the discharge port that occur during machining, changes in wettability due to uneven dispersion of fine particle components in the pattern forming material, and differences in surface characteristics due to slight dirt near the discharge port, etc. It is difficult to completely discharge the pattern forming material from the discharge port in the same manner. Further, the difference in the cross-sectional shape of the pattern elements due to these causes continues from the start to the end of pattern formation. As a result, streaky irregularities that can be easily recognized visually appear due to differences in the thickness of the pattern elements.

  The present invention has been made in view of the above problems, and when a pattern forming material that is a fluid material is continuously discharged from a plurality of discharge ports to form a pattern that is an array of a plurality of pattern elements on a substrate. Another object is to suppress unevenness in the pattern.

  The invention according to claim 1 is a pattern forming apparatus for forming a pattern on a substrate, wherein a pattern forming material whose viscosity changes due to temperature change is discharged from a plurality of discharge ports, and a pattern is formed from the nozzle portion. While the forming material is discharged, the nozzle portions are arranged at an equal pitch in the direction perpendicular to the moving direction by moving relative to the substrate in the moving direction along the substrate. A moving mechanism for forming a pattern composed of a plurality of linear pattern elements on the substrate, and a temperature changing unit for irregularly changing the temperature of the pattern forming material discharged from the plurality of discharge ports. .

  Invention of Claim 2 is the pattern formation apparatus of Claim 1, Comprising: The said temperature change part of the pattern formation material discharged from each of these discharge ports or every predetermined number of discharge ports The temperature is irregularly changed independently of the pattern forming material discharged from the other discharge ports.

  A third aspect of the present invention is the pattern forming apparatus according to the first or second aspect, wherein the temperature changing unit includes a heating element that heats the pattern forming material.

  A fourth aspect of the present invention is the pattern forming apparatus according to the first or second aspect, wherein the temperature changing section includes a Peltier element that changes the temperature of the pattern forming material.

  A fifth aspect of the present invention is the pattern forming apparatus according to any one of the first to fourth aspects, wherein a fluctuation range of the temperature of the pattern forming material by the temperature changing unit is 0.1 ° C. or more and 2.5. It is below ℃.

  A sixth aspect of the present invention is the pattern forming apparatus according to any one of the first to fifth aspects, wherein the light irradiation unit that irradiates light to the pattern forming material immediately after being discharged from the plurality of discharge ports. Furthermore, the said pattern formation material has photocurability.

  The invention according to claim 7 is a pattern forming method for forming a pattern on a substrate, and a) supplying a pattern forming material whose viscosity is changed by a temperature change to a nozzle portion having a plurality of discharge ports. A step of discharging the pattern forming material onto the substrate from the discharge port of b), and b) in parallel with the step a), the nozzle portion is moved relative to the substrate in the moving direction along the substrate. A step of forming on the substrate a pattern composed of a plurality of linear pattern elements arranged at an equal pitch with respect to a direction perpendicular to the moving direction; c) the step a) And a step of irregularly changing the temperature of the pattern forming material discharged from the plurality of discharge ports.

  According to the present invention, unevenness that occurs in a pattern formed on a substrate can be suppressed. In the invention of claim 2, the occurrence of unevenness can be effectively suppressed by irregularly changing the temperature of the pattern forming material between the discharge ports. In the invention of claim 3, the temperature of the pattern forming material can be easily changed, and in the invention of claim 4, the temperature of the pattern forming material can be changed more freely.

  FIG. 1 is a diagram showing a pattern forming apparatus 1 according to a first embodiment of the present invention. The pattern forming apparatus 1 is an apparatus for forming a stripe pattern on a glass substrate (hereinafter referred to as “substrate 9”) for a flat display device such as a plasma display device or a field emission display (Field Emission Display). The pattern is a pattern in which pattern elements that are linear and rib-shaped elements are arranged at an equal pitch. Patterns are formed by continuously discharging a relatively high-viscosity paste-like pattern forming material with a viscosity of several tens of thousands to several hundred thousand MPa · sec from a plurality of discharge ports, and plasma display through other processes. By becoming a rib of the device, a spacer of the field emission display device, or the like, the substrate 9 becomes a panel which is an assembly part of the flat display device.

  In the pattern forming apparatus 1, the stage moving mechanism 2 is provided on the base 11, and the stage unit 20 holding the substrate 9 can be moved in the moving direction that is the Y direction shown in FIG. 1 by the stage moving mechanism 2. . A frame 12 is fixed to the base 11 so as to straddle the stage portion 20, and the head portion 4 is attached to the frame 12 via the head moving mechanism 3.

  The stage moving mechanism 2 has a structure in which a ball screw 22 is connected to a motor 21 and a nut 23 fixed to the stage unit 20 is attached to the ball screw 22. When the guide rail 24 is fixed above the ball screw 22 and the motor 21 rotates, the stage portion 20 moves smoothly along the guide rail 24 in the Y direction along with the nut 23 (that is, the head portion 4 moves to the substrate 9). The main scan is relatively performed.)

  The head moving mechanism 3 includes a motor 31 supported by the frame 12, a ball screw 32 connected to the rotation shaft of the motor 31, and a nut 33 attached to the ball screw 32. 33 moves in the X direction in FIG. A base 40 of the head unit 4 is attached to the nut 33, and thus the head unit 4 can be moved (sub-scanned) in the X direction. The base 40 is connected to a guide rail 34 fixed to the frame 12 and is smoothly guided by the guide rail 34.

  The head unit 4 includes a discharge unit 42 that discharges a paste-form pattern forming material onto the substrate 9 and a light irradiation unit 43 that emits ultraviolet rays toward the substrate 9. The discharge unit 42 and the light irradiation unit 43 are It is attached to the lower part of the lifting mechanism 41 fixed to the base 40. The pattern forming material includes a photoinitiator that initiates curing (crosslinking reaction) by ultraviolet rays, a resin that is a binder, and a low softening point glass frit that is a glass powder, and a material whose viscosity changes due to temperature changes. It has become. A nozzle portion 5 having a plurality of discharge ports arranged in the X direction is detachably provided below the discharge portion 42.

  The nozzle unit 5 is connected to an air supply unit 442 that supplies high-pressure air via a supply pipe 441. The pattern forming material is supplied to the nozzle unit 5 using the pressure of air from the air supply unit 442.

  The light irradiation unit 43 is connected to the light source unit 432 through the optical fiber 431. The light source unit 432 includes a light source 433 (for example, a xenon lamp) that emits light that is ultraviolet light, and a shutter 434 that controls ON / OFF of light emission from the light source unit 432. The light from the light source 433 is guided to the light irradiation unit 43 by the optical fiber 431 and emitted from the light irradiation unit 43 toward the substrate 9 on the (−Y) side of the nozzle unit 5, and corresponds to each discharge port. Are formed on the substrate 9.

  The motor 21 of the stage moving mechanism 2, the light source unit 432, the motor 31 of the head moving mechanism 3, and the lifting mechanism 41 of the head unit 4 are connected to the control unit 8, and these configurations are controlled by the control unit 8. Then, a pattern is formed on the substrate 9 by the pattern forming apparatus 1.

  FIG. 2 is an enlarged view showing the vicinity of the tip of the nozzle portion 5. The nozzle tip 51 has a flow path 511 therein, and a plurality of discharge ports 512 arranged in a direction perpendicular to the relative movement direction of the nozzle 5 (that is, in a direction perpendicular to the paper surface) is provided at the tip. The discharge port 512 is very close to the substrate 9. The pattern forming material 91 is discharged from the plurality of discharge ports 512 in an inclined manner with respect to the main surface of the glass substrate 9 as the nozzle portion 5 moves. The pattern forming material 91 immediately after discharge is irradiated with ultraviolet rays from the light irradiation unit 43, whereby the pattern forming material 91 having photocurability is cured in a shape almost immediately after discharge.

  FIG. 3 is a cross-sectional view of the nozzle portion 5, and shows a cross section perpendicular to the arrangement direction of the discharge ports 512 (X direction in FIG. 1). The nozzle unit 5 attaches the nozzle tip 51, the first holding member 52 and the second holding member 53 that sandwich the nozzle tip 51 from above and below, and the first holding member 52 and the second holding member 53 in a direction approaching each other. An urging unit 54 is provided. The nozzle tip 51 includes a first tip 55, a second tip 56, and a third tip 57, which are three plate-like members stacked (overlapped) in the stacking direction that is the vertical direction in FIG.

  4 is a bottom view of the first tip 55 at the position of arrow A in FIG. 3 (that is, a view seen from the second tip 56 side), and the left side of FIG. 3 corresponds to the lower side of FIG. . The first tip 55 has a recess 551 on the lower surface that serves as a flow path for the pattern forming material 91, and the recess 551 is provided with an opening 552 that penetrates the first tip 55. The opening 552 is an inlet of the pattern forming material 91 and communicates with a flow path in the first holding member 52 (see FIG. 3). The recess 551 is a flow path for the pattern forming material 91 and also serves to make the pressure applied to the pattern forming material 91 uniform. The first tip 55 is made of metal at a low cost.

  As shown in FIG. 3, the second tip 56 includes a spacer 561 that contacts the first tip 55, a film-like circuit board 562 sandwiched between the third tip 57 and the spacer 561, and the circuit board 562. A heater 563 which is a heat generating element attached to the lower side is provided. The spacer 561 is formed of a member having low thermal conductivity, and the heater 563 has a structure in which a heating element such as nichrome is covered with an insulating resin. In FIG. 3, the thicknesses of the spacer 561 and the circuit board 562 are drawn thicker than the actual thickness (see FIG. 10).

  FIG. 5 is a bottom view of the spacer 561 at the position of the arrow B in FIG. 3, and FIG. 6 is a bottom view of the circuit board 562 at the position of the arrow C in FIG. The spacer 561 and the circuit board 562 have elongated openings 5661 and 5562 of the same size, and are overlapped to form the opening 566 of the second tip portion 56 shown in FIG.

  As shown in FIG. 6, a plurality of electrodes 71 are formed in the circuit board 562 so as to correspond to the discharge ports 512 (see FIG. 3) in the X direction at an equal pitch. A common electrode 72 extending in the X direction is provided on the side.

  FIG. 7 is an enlarged view showing a state in which the heater 563 is mounted on the circuit board 562, and shows one electrode 71 and a common electrode 72 with parallel oblique lines. In FIG. 7, the mounting positions of the heaters 563 are indicated by broken lines, and each heater 563 is connected to one electrode 71 and the common electrode 72. The plurality of electrodes 71 are connected to an external power source (for example, provided in the control unit 8) via a plurality of wirings penetrating the first tip portion 56, and the common electrode 72 is also grounded to penetrate the first tip portion 56. Connected to the connected wiring.

  FIG. 8 is a plan view of the third tip portion 57 at the position of the arrow D in FIG. As shown in FIGS. 3 and 8, the third tip portion 57 has an elongated recess 571, and a number of grooves 572 are formed from the recess 571 toward the tip of the nozzle tip portion 51 (downward in FIG. 8). Actually, more grooves 572 than the number shown in FIG. 8 are provided. The plurality of grooves 572 are respectively formed corresponding to the discharge ports 512 shown in FIG. 3, and the first to third tip portions 55 to 55 are overlapped by overlapping the third tip portion 57 and the second tip portion 56. A number of discharge ports 512 arranged in a direction perpendicular to the stacking direction 57 are formed.

  The groove 572 itself becomes a flow path in the vicinity of the discharge port 512 (corresponding to the flow path 511 in FIG. 2), and as shown in FIG. 3, the concave portion 551 of the first tip portion 55 and the opening 566 of the second tip portion 56. In addition, the concave portion 571 and the groove 572 of the third tip portion 57 serve as a flow path that guides the pattern forming material 91 from the opening 552 to the discharge port 512. In the following description, the groove 572 is also referred to as a flow path 572. The third tip portion 57 is a ceramic member because it is required to have wear resistance and is subjected to high-precision fine processing.

  FIG. 9 is a diagram for explaining the flow of pattern formation by the pattern forming apparatus 1. In pattern formation, first, the substrate 9 is moved in the (−Y) direction by the stage moving mechanism 2 shown in FIG. 1, so that the nozzle portion 5 is moved along the main surface of the substrate 9 at, for example, 5 mm / second. The movement in the (+ Y) direction is started relatively (step S11), and when the nozzle unit 5 reaches the discharge start position on the substrate 9, the air supply unit 442 is activated and the discharge of the pattern forming material 91 is started. (Step S12). Further, almost simultaneously with the start of ejection, a voltage is applied between the plurality of electrodes 71 and the common electrode 72, and the heater 563 generates heat.

  FIG. 10 is a view showing a cross section parallel to the flow path 572 in the vicinity of the discharge port 512. When the pattern forming material 91 is discharged, a predetermined potential is applied to the electrode 71 of the circuit board 562 for a random time of about 0.5 to 1 second, and the heater 563 is energized to generate heat. As described above, the spacer 561 is formed of a material having low thermal conductivity, and the pattern forming material 91 passing through the vicinity of the heater 563 is efficiently heated by the heater 563, and the temperature of the pattern forming material 91 rises. Thereafter, when energization of the heater 563 is stopped, the heat of the heater 563 is taken away by the flowing pattern forming material 91 in several hundred microseconds to several seconds, and the temperature of the heater 563 quickly becomes the same as the surroundings. The heater 563 is energized again after a random time when the temperature of the heater 563 sufficiently decreases. By repeating the above operation, the temperature of the pattern forming material 91 discharged from the discharge port 512 changes irregularly (step S13).

  The above heating operation is performed by a plurality of heaters 563 provided corresponding to the plurality of discharge ports 512, and the temperature of the pattern forming material 91 discharged from each discharge port 512 is discharged from the other discharge ports 512. It is irregularly changed independently from the pattern forming material 91. As described above, in the pattern forming apparatus 1, the heater 563, the circuit board 562, and the external power supply change the temperature of the pattern forming material 91 discharged from each discharge port 512 (that is, each channel) irregularly. Act as a department.

  FIG. 11 is a plan view showing how the pattern 93 is formed on the substrate 9. While the pattern forming material 91 is continuously ejected from the nozzle portion 5, the nozzle portion 5 moves relative to the substrate 9 in the moving direction along the substrate 9, thereby causing each ejection port 512 to move. The pattern forming material 91 is discharged linearly, and as described above, the pattern forming material 91 is irradiated with light and cured immediately after the discharge. As a result, a pattern 93 composed of linear and rib-shaped pattern elements 92 arranged at an equal pitch in a direction perpendicular to the moving direction of the nozzle portion 5 is formed on the substrate 9.

  Then, while the pattern forming material 91 is discharged from the nozzle portion 5, the temperature of the pattern forming material 91 is irregularly changed by the irregular heat generation of the heater 563, and thereby the viscosity of the pattern forming material 91 is several hundreds. Fluctuates about MPa · sec. As a result, a change occurs in the manner in which the pattern forming material 91 immediately after ejection spreads on the substrate 9 due to the influence of surface tension, gravity, or the like (that is, the sagging of the pattern forming material 91 changes), and the width of each pattern element 92 Further, the height (that is, the spread of the pattern element 92 in the direction perpendicular to the scanning direction) changes irregularly for each ejection port 512 with respect to the movement direction.

  When the above operation is continued and the nozzle portion 5 reaches the discharge stop position on the substrate 9, the temperature change and discharge of the pattern forming material 91 are stopped (steps S14 and S15), and the substrate 9 of the nozzle portion 5 is further stopped. The relative movement with respect to is also stopped (step S16). Thereby, a pattern 93 composed of a plurality of pattern elements 92 is formed over almost the entire area of the substrate 9 in the Y direction. In other words, a process of discharging the pattern forming material 91 from step S12 to step S15 from the nozzle part 5 in parallel with the process of moving the nozzle part 5 from step S11 to step S16 relative to the substrate 9. As a result, a pattern 93 is formed on the substrate 9 and, in parallel with the pattern formation process, between the step S13 and the step S14, the pattern forming material 91 is formed by the temperature changing unit having the heater 563 and the like. Is irregularly changed, and the spread on the substrate 9 is irregularly changed at each position where the pattern forming material 91 is discharged.

  After that, the nozzle unit 5 is moved in the sub-scanning direction (X direction) by the head moving mechanism 3 (steps S17 and S18), the substrate 9 is returned to the initial position, and further, the steps S11 to S16 are repeated and already formed. A new pattern is formed adjacent to the formed pattern. Then, by repeating the formation of the pattern by the main scanning of the nozzle unit 5 and the sub-scanning of the nozzle unit 5 as many times as necessary (steps S17 and S18), a pattern element whose cross-sectional area changes irregularly slightly over almost the entire substrate 9. A pattern constituted by 92 is formed.

  As described above, in the pattern forming apparatus 1, since the width and height of each pattern element are irregularly changed, unevenness that occurs in a striped pattern can be suppressed. In addition, since the temperature of the pattern forming material 91 discharged from each discharge port 512 is irregularly changed independently of the other discharge ports 512, unevenness generated in the pattern can be effectively suppressed. Furthermore, by using the heater 563, the temperature of the pattern forming material 91 can be easily changed.

  Note that, depending on the characteristics of the pattern forming material 91 and the discharge speed, the fluctuation range of the temperature of the pattern forming material 91 (that is, the maximum fluctuation amount) is the suppression of pattern unevenness and the pitch (number of pattern elements 92). It is preferable that the temperature is set to 0.1 ° C. or more and 2.5 ° C. or less (the same applies to other embodiments described below). More preferably, the fluctuation range is 0.1 ° C. or more and 0.2 ° C. or less. Further, it is preferable that the width of the pattern element 92 changes by about (±) 1 to (±) 5% due to temperature fluctuation.

  The variation of the viscosity per unit length of the pattern forming material 91 is controlled so that a peak (maximum or minimum) appears once every 1 to 100 times (preferably 5 to 10 times) the pitch of the pattern element 92. For example, when the pitch of the pattern elements 92 is 0.3 mm, control is performed so that a maximum or a minimum appears once in a range of 2 to 3 mm (the same applies to other embodiments below). In FIG. 11, the variation of the pattern element 92 is drawn with emphasis.

  FIG. 12 is an enlarged cross-sectional view of the nozzle tip 51 according to the second embodiment. The nozzle tip 51 is obtained by changing the structure of the second tip 56 shown in FIG. 10. The second tip 56a shown in FIG. 12 is attached to the spacer 561 and the spacer 561 in order from the first tip 55 side. Circuit board 562, Peltier element 563a mounted on circuit board 562, resin film 564 that covers Peltier element 563a and in contact with flow path 572, and circuit board 562 on the discharge port 512 side of Peltier element 563a A resin 565 provided between the film 564 and the film 564 is provided. In order to efficiently perform heating and / or heat absorption by the Peltier element 563a, the spacer 561 is formed of a material having high thermal conductivity. As the film 564, a film having insulating properties and chemical resistance is adopted and used for protecting the Peltier element 563a. The circuit board 562 is connected to an external power supply (not shown) in the same manner as the nozzle tip 51 shown in FIG.

  The operation of the pattern forming apparatus according to the second embodiment is the same as that of FIG. 9 except that the Peltier element 563a is used to change the temperature of the pattern forming material 91. However, the Peltier element 563a may only generate heat similarly to the heater 563 of the first embodiment, and heat absorption is performed by reversing the polarity of the potential of the electrode 71 with respect to the common electrode 72 on the circuit board 562. Alternatively, heat generation and endotherm may be performed.

  For example, when the viscosity of the pattern forming material 91 rapidly decreases as the temperature increases, the temperature of the pattern forming material 91 is changed by heat absorption by the Peltier element 563a. Further, when it is necessary to change the temperature of the pattern forming material 91 promptly, heat absorption is performed immediately after heat generation, and heat generation is performed quickly after heat absorption. Similarly to the first embodiment, the temperature of the pattern forming material 91 is changed to the other discharge ports 512 in the vicinity of each discharge port 512 by a plurality of Peltier elements 563 a provided corresponding to the plurality of discharge ports 512. It is irregularly changed independently from the flow path 572 leading to. In the pattern forming apparatus according to the second embodiment, the Peltier element 563a, the circuit board 562, and an external power source serve as a temperature changing unit that irregularly changes the temperature of the pattern forming material 91 discharged from each discharge port 512. To play a role.

  As described above, the temperature change of the pattern forming material 91 discharged from the nozzle unit 5 may be realized by the Peltier element 563a, and the pattern element 92 is changed by the temperature change of the pattern forming material 91 as in the first embodiment. The irregularity of the pattern can be changed irregularly, and unevenness in the pattern can be suppressed. Furthermore, unevenness is further suppressed by providing a plurality of Peltier elements 563 a corresponding to the plurality of ejection ports 512 and changing the temperature of the pattern forming material 91 independently and irregularly at each ejection port 512. Further, since the Peltier element 563a can not only generate heat but also absorb heat, the temperature can be changed more freely according to the characteristics of the pattern forming material 91 and the ambient temperature.

  Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment and can be variously modified. For example, the pattern formed by the pattern forming apparatus may be a lattice pattern. FIG. 13 is a view showing a part of the lattice pattern 93a, and FIG. 14 is a longitudinal sectional view of the pattern 93a at the position of arrow E in FIG. When the lattice-shaped pattern 93a is formed, first, a pattern composed of a plurality of stripe-shaped pattern elements 92a is formed on the substrate 9, and then the nozzle portion 5 has a different pitch of the discharge ports 512. Then, the direction of the substrate 9 is changed by 90 degrees, and a pattern composed of a plurality of pattern elements 92b is formed on the pattern element 92a. Then, the pattern 93a is fired to form, for example, a rib for a plasma display device. Even when the pattern elements 92a and 92b are formed, as in the first and second embodiments, the viscosity of the pattern forming material 91 is slightly changed over time due to the temperature change, and unevenness occurs. It is suppressed. In the case of a lattice pattern, the occurrence of unevenness can be more effectively suppressed by using the above-described minute fluctuation technology of viscosity.

  In the above embodiment, the temperature of the pattern forming material 91 flowing in the flow path 572 does not need to change in the vicinity of all the discharge ports 512, and the temperature is changed in every predetermined number (one or more) of the fine flow paths 572. It may be broken. In other words, the channel 572 that does not have the temperature changing function and one or more channels 572 in which the temperature is changed may be alternately arranged. For example, the temperature of the pattern forming material 91 may be fixed in two or three flow paths, and the temperature of the pattern forming material 91 may be changed collectively in one or several adjacent flow paths. Even in this case, it is preferable that the discharge ports 512 whose temperature is changed collectively and the other discharge ports 512 whose temperature are changed collectively are controlled independently of each other. More preferably, the temperature of the pattern forming material 91 discharged from each of the predetermined number of discharge ports 512 is irregularly changed independently of the pattern forming material 91 discharged from the other discharge ports 512. Further, it is preferable that the temperature of the pattern forming material 91 is changed in 30% or more (more preferably, 50% or more) of the entire discharge port 512.

  In the above embodiment, the heater 563 and the Peltier element 563a do not need to be arranged for each discharge port 512, and a common heater or Peltier element is provided for all the discharge ports 512, and the discharge is performed from all the discharge ports 512. The temperature of the pattern forming material 91 may be changed all at once. In this case, the heater and the Peltier element have an elongated shape extending in the arrangement direction (X direction) of the discharge ports 512 of the nozzle unit 5 shown in FIG. Further, a recess and a wiring may be provided in the spacer 561, and a heater or a Peltier element may be embedded in the recess.

  In the above embodiment, the substrate 9 moves relative to the nozzle unit 5, but the nozzle unit 5 may move relative to the substrate 9.

  The pattern forming apparatus according to the above embodiment may be used for pattern formation of a substrate of a display device other than the plasma display device or the field emission display device, and further, a glass substrate used for other than the display device, You may utilize when forming a pattern in a circuit board, a ceramic substrate, a semiconductor substrate, etc. Further, the pattern forming material 91 is not limited to the one that is cured by light immediately after ejection, and may be one that is not baked after the pattern is formed.

It is a figure which shows the pattern formation apparatus which concerns on 1st Embodiment. It is a figure which shows the front-end | tip vicinity of a nozzle part. It is a figure which shows the cross section of a nozzle part. It is a bottom view of the 1st tip part. It is a bottom view of a spacer. It is a bottom view of a circuit board. It is an enlarged view of a circuit board. It is a top view of the 3rd tip part. It is a figure which shows the flow of operation | movement of a pattern formation apparatus. It is sectional drawing of a nozzle front-end | tip part. It is a figure which shows a mode that a pattern is formed. It is sectional drawing of the nozzle front-end | tip part of the pattern formation apparatus which concerns on 2nd Embodiment. It is a figure which shows a part of lattice-like pattern. It is sectional drawing of a grid | lattice-like pattern.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pattern formation apparatus 2 Stage moving mechanism 5 Nozzle part 9 Substrate 43 Light irradiation part 91 Pattern formation material 92, 92a, 92b Pattern element 93, 93a Pattern 512 Discharge port 562 Circuit board 563 Heater 563a Peltier element S11-S16 Step

Claims (7)

A pattern forming apparatus for forming a pattern on a substrate,
A nozzle part for discharging a pattern forming material whose viscosity changes due to a temperature change from a plurality of discharge ports;
While the pattern forming material is discharged from the nozzle portion, the nozzle portion is moved relative to the substrate in the moving direction along the substrate, so that the pitch is equal to the direction perpendicular to the moving direction. A moving mechanism for forming a pattern composed of a plurality of linear pattern elements arranged on the substrate,
A temperature changing unit for irregularly changing the temperature of the pattern forming material discharged from the plurality of discharge ports;
A pattern forming apparatus comprising: The pattern forming apparatus according to claim 1,
The temperature changing unit irregularly changes the temperature of the pattern forming material discharged from each of the plurality of discharge ports or every predetermined number of discharge ports independently of the pattern forming material discharged from the other discharge ports. A pattern forming apparatus. The pattern forming apparatus according to claim 1 or 2,
The said temperature change part is provided with the heat generating element which heats pattern formation material, The pattern formation apparatus characterized by the above-mentioned. The pattern forming apparatus according to claim 1 or 2,
The said temperature change part is provided with the Peltier device which changes the temperature of pattern formation material, The pattern formation apparatus characterized by the above-mentioned. The pattern forming apparatus according to any one of claims 1 to 4,
The pattern forming apparatus is characterized in that a fluctuation range of the temperature of the pattern forming material by the temperature changing unit is 0.1 ° C. or more and 2.5 ° C. or less. The pattern forming apparatus according to any one of claims 1 to 5,
A light irradiation part for irradiating light to the pattern forming material immediately after being discharged from the plurality of discharge ports;
The pattern forming apparatus, wherein the pattern forming material has photocurability. A pattern forming method for forming a pattern on a substrate,
a) supplying a pattern forming material whose viscosity changes due to temperature change to a nozzle portion having a plurality of discharge ports, and discharging the pattern forming material onto the substrate from the plurality of discharge ports;
b) In parallel with the step a), the nozzle part is moved relative to the substrate in the moving direction along the substrate, and at a constant pitch with respect to the direction perpendicular to the moving direction. Forming a pattern composed of a plurality of linear pattern elements arranged on the substrate;
c) a step of irregularly changing the temperature of the pattern forming material discharged from the plurality of discharge ports in parallel with the step a);
A pattern forming method comprising:

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