JP2008118057A - Flexible printed wiring substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent disconnection failure of a wiring pattern caused by substrate flexure that is easy to occur when the substrate is equipped in a housing. <P>SOLUTION: In an FPC substrate 1C, a square contact land 3, a wiring 4, a covered region 6b consisting of a cover coat 6 for covering the wiring 4 except an exposure region 3b which exposures the contact land 3, and an attaching opening 9 engaging with a projection provided for attaching the substrate at a frame 7 of an equipment, are formed on a substrate surface. Ends of the wiring 4 are tailed out from one side S2 orthogonal to the other side S1 located at a side which faces the attaching opening 9 among peripheral ends consisting of four sides of the contact land 3. A covered border line L2 between the exposure region 3b and the covered region 6b is set to almost coincide with the one side S2 orthogonal to the other side S1 among the four sides forming the contact land 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flexible printed wiring board suitable for use in, for example, a portable electronic device, and more specifically, a flexible wiring board that can prevent a wiring pattern from being broken due to board bending that easily occurs when the board is mounted on a housing. The present invention relates to a printed wiring board.

  As circuit boards for small devices such as mobile phones, flexible printed circuit boards (FPC boards) that can be folded and stored in a narrow space inside the casing have been used in many cases. Even when there is sufficient free space, flexible printed wiring boards are increasingly used from the viewpoint of reducing the weight of equipment or in anticipation of future multifunctionalization.

  FIG. 6 is a partial plan view schematically showing an example of a conventional flexible printed wiring board (hereinafter also simply referred to as an FPC board) used in a mobile phone or the like, and FIG. 7 is a vertical cross section taken along the line AA in FIG. FIG. 8 is a cross-sectional view showing a state in which the FPC board is mounted on a frame (housing) of the electronic device. As shown in FIGS. 6 to 8, the conventional FPC board 1A has, for example, an electric component such as a small speaker and an electric circuit on the surface of the flexible board 2 made of a material having excellent bending resistance such as polyimide and polyester. A pair of left and right contact lands 3 and 3 for contact, wirings 4 and 4 connected to the contact lands 3 and 3, a solid layer 5 outside the wirings 4 and 4, and at least the contact lands 3 and 3 are exposed. Except for the exposed regions 3a and 3a, the cover coat 6 (covered region 6a) made of an insulating material such as polyimide that covers the wirings 4 and 4 and the solid layer 5 and the frame (housing) 7 have a pair of left and right structures. The FPC board mounting protrusions 8 and 8 provided for mounting the FPC board are generally configured from mounting holes 9 and 9 to be fitted.

  Here, the contact lands 3 and 3 have a two-layer configuration of a lower copper foil and an upper gold plating layer, and have a square shape with a dimensional size of approximately 3 × 3 mm. It is formed in a symmetric configuration. The wirings 4 and 4 are formed of a copper foil having a line width of approximately 0.1 mm. Further, conventionally, the wirings 4 and 4 are, as shown in FIG. 6, from the viewpoint of rationality that wiring is performed at the shortest distance, among the four sides constituting the peripheral edge of each contact land 3, 3 is derived from one side (S1 in the figure) opposite to 3, and is then bundled and extended forward at the meeting point where they meet each other. The lower layer portions of the contact lands 3, 3, the wirings 4, 4 and the solid layer 5 are formed at the same time by etching a copper foil previously stretched on the surface of the flexible substrate 2 into a predetermined pattern. Is separated from the solid layer 5 by the groove 10 from which the copper foil has been removed. Further, the attachment holes 9 are formed as through holes between the contact land 3 at the left end and the contact land 3 at the right end. Here, the covering boundary line L1 between the exposed regions 3a, 3a and the covering region 6a, which corresponds to the edge (edge) of the cover coat 6, opposes among the four sides that define the contact lands 3, 3. It is set so as to overlap with one side S1.

  When assembling and mounting the FPC board 1A having the above-described configuration at the time of assembling the electronic device, as shown in FIG. 8, the mounting holes 9 and 9 are formed in the protrusions 8 and 8 provided in the frame 7 of the electronic device. Just plug it in. Then, when a lid portion (not shown) is put on the frame 7 in the final process of assembling the device, the FPC board 1A is confined in a narrow space with a low ceiling between the frame 7 and the lid portion (not shown). Cannot escape from the protrusions 8 and 8, and is in a fixed state.

  However, when the FPC board 1A having the above configuration is mounted on an electronic device, a force is applied to the projections 8 and 8 of the frame 7 from the direction indicated by the arrow B in FIG. As shown in the figure, there is a phenomenon that the FPC board 1A is temporarily bent like a bow in the X direction. As a result of this bending, the vicinity of the connection boundary line K1 with the contact lands 3, 3 The wirings 4 and 4 are disconnected.

Therefore, as a means for preventing disconnection due to bending when the FPC board is mounted, a wiring shape described in Japanese Patent Application Laid-Open No. 2005-151867 is known. FIG. 10 is a plan view showing the configuration of a flexible printed wiring board (FPC board) prepared according to the wiring shape described in Patent Document 1, and this FPC board 1B is a copper foil wiring as shown in FIG. 12 is derived from the contact land 13 so as to be substantially parallel to the deflection center line C, and the connection boundary line K2 between the contact land 13 and the wiring 12 is substantially perpendicular to the deflection center line C.
This is because when the connection boundary line between the contact land 13 and the wiring 12 is set in a direction parallel to the bending center line C (part K1 in the same figure) as shown in FIG. This is because it concentrates on the connection boundary line K1 between the contact land 13 and the wiring 12, and therefore it is considered that the disconnection is likely to occur at the site of the connection boundary line K1. Then, as shown in FIG. 10, the connecting boundary line K2 between the contact land 13 and the wiring 12 is deflected in a direction perpendicular to the center line C (the other side S2 among the four sides constituting the peripheral edge of the contact lands 3 and 3). ) Is set to avoid stress concentration on the boundary. In the case of the configuration of FIG. 10 as well, the coating boundary lines L1, L1 between the exposed regions 3a, 3a and the coating region 6a, which correspond to the edge of the cover coat 6, are the same as in the configuration of FIG. Of the four sides defining three and three, they are set so as to overlap with opposite sides S1 and S1.
Japanese Utility Model Publication No. 60-13764

  By the way, in the case of an FPC board that is applied to a mounting technology in which molten solder is brought into contact with a land, solder adheres as a large lump on the land and is hardened. Since it is certain that a large stress is concentrated on the boundary between the land and the wiring (copper foil) and the disconnection is likely to occur, in order to avoid this, the wiring shape described in Patent Publication 1 should be adopted. Is effective.

  However, a large solidified mass of solder, such as a reflow soldering land provided with a solder layer in advance, or a contact land used simply for contact with an electrical component (for example, a leaf spring of a small speaker). In the case of an FPC board having a land not accompanied by a land, a relatively thin flexible board tends to be used. In such a thin FPC board, even if it is made according to the wiring shape shown in FIG. It was found that this disconnection cannot be resolved.

  The present invention has been made in view of the above-described circumstances, and provides an FPC board (flexible printed wiring board) that can prevent a disconnection failure of a wiring pattern caused by board bending that easily occurs when the board is mounted on a housing. The purpose is that.

  In order to solve the above-mentioned problems, the invention described in claim 1 is directed to a land for mounting and connecting an electric / electronic component to or in electrical contact with an electric / electronic component on the surface of a flexible substrate. The present invention relates to an FPC board in which a wiring pattern to be connected and at least a cover coat that covers the wiring pattern are formed except for an exposed area that exposes the land, and the covered area by the cover coat and at least the land Of the boundary line that is in contact with the exposed region that exposes the FPC board, the covering boundary line that crosses the wiring pattern or in the vicinity thereof has a direction substantially the same as the bending direction of the FPC board that occurs when the FPC board is mounted on the frame. It is characterized in that it is defined in a facing manner.

  According to a second aspect of the present invention, there is provided a land for mounting and connecting an electric / electronic component to or in electrical contact with the surface of the flexible substrate, a wiring pattern connected to the land, and at least The present invention relates to an FPC board on which at least a cover coat that covers the wiring pattern is formed except for an exposed region that exposes the land, and an end portion of the wiring pattern is an FPC of the peripheral edge portion of the land. Connected to an edge that extends in substantially the same direction as the bending direction of the FPC board that occurs when the board is mounted on the frame, and is covered with the cover coat and the exposed area that exposes at least the land. Of the border lines that touch each other, the covering border line that crosses the wiring pattern or the vicinity thereof is a connection border between the land and the wiring pattern. And schematically overlapping manner or in a manner that parallel and adjacent to the connection border, it is characterized in that it is defined.

  According to a third aspect of the present invention, there is provided a land for mounting and connecting an electric / electronic component to or in electrical contact with the surface of the flexible substrate, a wiring pattern connected to the land, and at least An FPC board in which a cover coat that covers at least the wiring pattern except for an exposed area that exposes the land, and a mounting hole that is fitted to a board mounting protrusion provided in a frame are formed. Of the boundary lines where the covering area of the cover coat and at least the exposed area that exposes the lands are in contact, the covering boundary line that crosses the wiring pattern or the vicinity thereof, the mounting hole is the protrusion of the frame It is defined in such a manner that it faces in a direction substantially the same as the bending direction of the FPC board that is generated when the FPC board is fitted to the part. There.

  According to a fourth aspect of the present invention, there is provided a land for mounting and connecting an electric / electronic component to or in electrical contact with the surface of the flexible substrate, and a wiring pattern connected to the land. The FPC is formed with a cover coat covering at least the wiring pattern, except for an exposed region exposing at least the land, and a mounting hole fitted to a board mounting projection provided on the frame. The end of the wiring pattern is substantially the same direction as the bending direction of the FPC board that occurs when the mounting hole is fitted to the projection of the frame, of the peripheral edge of the land. A boundary line that is connected to an edge that extends to the edge of the cover coat and that is in contact with the covered region of the cover coat and at least the exposed region that exposes the land. A covering boundary line that crosses the wiring pattern or in the vicinity thereof is defined in such a manner that it substantially overlaps the connection boundary line between the land and the wiring pattern, or in an aspect that is parallel and close to the connection boundary line. It is a feature.

  According to a fifth aspect of the present invention, there is provided a land for mounting and connecting an electric / electronic component to or in electrical contact with the surface of the flexible substrate, and a wiring pattern connected to the land. The FPC is formed with a cover coat covering at least the wiring pattern, except for an exposed region exposing at least the land, and a mounting hole fitted to a board mounting projection provided on the frame. An end of the wiring pattern is connected to a desired other edge of the peripheral edge of the land excluding an edge located on the side facing the mounting hole; and Of the boundary line between the covering region by the cover coat and the exposed region exposing at least the land, the covering boundary line crossing the wiring pattern or the vicinity thereof is In connection border and outline overlapping aspects of command and the wiring pattern, or, in a manner that parallel and adjacent to the connection border, is characterized in that it is defined.

  The invention according to claim 6 is a substantially quadrangular land for mounting and connecting electrical / electronic components to or in electrical contact with the surface of the flexible substrate, and a wiring pattern connected to the lands. And at least a cover coat that covers the wiring pattern, except for an exposed region that exposes the land, and a mounting hole that is fitted to a board mounting protrusion provided on the frame. In the FPC board, a boundary line that crosses the wiring pattern or in the vicinity thereof is formed by four sides of the land, among boundary lines that contact the cover region covered with the cover coat and at least the exposed region that exposes the land. It is characterized in that it is demarcated so as to be substantially orthogonal to one side located on the side facing the mounting hole in the peripheral edge. .

  The invention according to claim 7 is connected to the land of the substantially rectangular land for mounting and connecting the electric / electronic component to or in electrical contact with the electric / electronic component on the surface of the flexible substrate. A wiring pattern, a cover coat that covers at least the wiring pattern except at least an exposed region that exposes the land, and a mounting hole that is fitted to a board mounting projection provided on the frame are formed. In the FPC board, the end portion of the wiring pattern is not desired to face the mounting hole orthogonal to one side located on the side facing the mounting hole in the peripheral edge portion including the four sides of the land. Of the boundary line that is connected to the side and is in contact with the covering region of the cover coat and at least the exposed region that exposes the land, the wiring pattern A covering boundary line that crosses over or in the vicinity thereof is defined in such a manner that it substantially overlaps with a connection boundary line between the land and the wiring pattern, or in an aspect parallel and close to the connection boundary line. Yes.

  The invention according to claim 8 relates to the FPC board according to claim 2, 4, 5 or 7, wherein the connection boundary line between the land and the wiring pattern is longer than a line width of the wiring pattern, And it is set to the length equal to or less than the length of the said edge part of the said land which is a site | part to which the said wiring pattern is connected, It is characterized by the above-mentioned.

  According to the configuration of the present invention, when the FPC board is attached to the frame, the covering boundary line that crosses the wiring pattern or in the vicinity thereof among the boundary line where the covering region by the cover coat and the exposed region that exposes the land contact. Since it is defined in such a manner that it faces in the direction substantially the same as the direction in which the FPC board is bent, stress can be prevented from concentrating on the coating boundary line when the board is bent, and thus disconnection of the wiring pattern can be prevented.

  In the best mode for carrying out the present invention in a portable electronic device, a substantially rectangular contact land for making electrical contact with an electrical component such as a small speaker on the surface of a flexible substrate, and wiring connected to the contact land A cover coat that covers at least the wiring, and an attachment hole that is fitted to a board mounting protrusion provided in a frame of the device, except at least an exposed region that exposes the contact land. Out of the boundary lines where the covering area by the cover coat and at least the exposed area that exposes the contact land contact, the covering boundary line that crosses on or near the wiring is a peripheral edge formed by four sides of the contact land. It is demarcated in the aspect which is substantially orthogonal to one side located in the fixing | fixed part side which faces the said attachment hole among the parts. Here, the “cover boundary line crossing the vicinity of the wiring” means that the cover boundary line coincides with the boundary line between the wiring and the contact land, or may be somewhat inside the contact land. It is supposed to be obtained.

FIG. 1 is a plan view schematically showing the configuration of an FPC board according to a first embodiment of the present invention.
The FPC board 1C of this example relates to a relatively thin FPC board for mounting a pair of left and right small speakers mounted on a portable electronic device. As shown in FIG. The contact lands 3, 3 having a substantially square shape for electrical contact with the leaf springs attached to the wire springs, the wires 4, 4 connected to the contact lands 3, 3, and the wires 4, 4 are separated from the wires 4, 4. A covered region 6b made of a cover coat (polyimide layer) 6 covering the wirings 4 and 4 and the solid layers 5 and 5 except the exposed layers 5 and 5 and the exposed region 3b exposing the contact lands 3 and 3; Mounting holes 9 and 9 are formed to be fitted into board mounting projections 8 and 8 (FIG. 8) provided on the device frame 7 (FIG. 8).

  As shown in FIG. 1, the FPC board 1 </ b> C in this example has a configuration in which the ends of the wirings 4, 4 face the mounting holes 9, 9 out of the peripheral edges formed by the four sides of the contact lands 3, 3. Is substantially the same as the conventional configuration (FIG. 10) in that it is derived from the other sides S2 and S2 orthogonal to the one side S1 and S1. On the other hand, the configuration of this example is greatly different from the conventional configuration described above, in the past, the coating boundary line L1 between the exposed regions 3a, 3a and the coating region 6a, which corresponds to the edge of the cover coat 6, L1 is set so as to overlap one of the opposing sides S1 and S1 among the four sides defining the contact lands 3 and 3, whereas in this example, the conventional configuration is abolished and the exposed region 3b, The boundary lines L2 and L2 between 3b and the coating region 6b are set so as to substantially overlap the other sides S2 and S2 orthogonal to the one side S1 and S1 among the four sides that define the contact lands 3 and 3. is there. Here, the one side S1 and S1 that define the contact lands 3 and 3 are located on the fixed end side, and the other sides S2 and S2 can be regarded as free ends. In FIG. 1, the same or corresponding parts as those in FIG. 6 to FIG. 10 are denoted by the same reference numerals or corresponding reference numerals, and description thereof is omitted or simplified.

  When the portable electronic device is assembled, as shown in FIG. 2, the FPC board 1C having the above-described configuration is mounted by attaching the mounting holes 9 and 9 on the FPC board 1C side to the projections 8 and 8 provided on the frame 7 side of the device. This is done by pushing in and fitting. At this time, when the mounting holes 9 and 9 on the FPC board 1C side are pushed into the protrusions 8 and 8 on the frame 7 side, the FPC board 1C is temporarily bent in a bow shape in the X direction as shown in FIG. . Due to this bending, in the conventional configuration (FIG. 10), the covering boundary lines L1 and L1 between the exposed regions 3a and 3a and the covering region 6a corresponding to the edge of the cover coat 6 become the bending direction X of the FPC board 1C. Since it is defined in a mode that faces in a substantially orthogonal direction, stress concentrates on the portions of the coating boundary lines L1, L1, cracks are generated in the portions of the coating boundary lines L1, L1, and disconnection failure often occurs. There was a problem that. It should be noted that no disconnection occurs at the connection boundary lines K2, K2 between the contact lands 3, 3 and the wirings 4, 4.

  However, according to the configuration of this example, the covering boundary line L2 crossing the wirings 4 and 4 among the boundary lines where the covering region 6b by the cover coat 6 and the exposed regions 3b and 3b exposing the contact lands 3 and 3 are in contact with each other. , L2 is defined so as to face the direction substantially the same as the bending direction X of the FPC board 1C, so that when the FPC board 1C is bent, stress can be prevented from concentrating on the coating boundary lines L2, L2, Therefore, disconnection failure of the wirings 4 and 4 can be prevented.

FIG. 3 is a plan view schematically showing the configuration of the FPC board according to the second embodiment of the present invention.
In the first embodiment described above, the windows opened in the covered area 6b by the cover coat 6, that is, the exposed areas 3b and 3b are made to coincide with the areas of the contact lands 3 and 3. In the example FPC board 1 </ b> D, as shown in FIG. 3, the exposed areas 3 c and 3 c are set wider than the area of the contact lands 3 and 3.

  However, even in the configuration of this example, the covering boundary line L2 that crosses the wirings 4 and 4 out of the boundary lines where the covering region 6c by the cover coat 6 and the exposed regions 3c and 3c that expose the contact lands 3 and 3 contact each other, Since L2 is defined in such a manner that it is oriented in substantially the same direction as the bending direction X of the FPC board 1D, it is possible to avoid stress concentration on the coating boundary lines L2 and L2 when the FPC board 1D is bent. The disconnection failure of the wirings 4 and 4 can be prevented.

FIG. 4 is a plan view schematically showing the configuration of the FPC board according to the third embodiment of the present invention.
The FPC board 1E of this example is greatly different from the configuration of the first embodiment described above. In the first embodiment, the connection boundary lines K2, K2 between the contact lands 3, 3 and the wirings 4, 4 are connected to the wiring 4 4 is set to be as narrow as the line width of FIG. 4 (FIG. 1), but in the configuration of this example, the connection boundary lines K2 and K2 are connected to the contact lands 3 and 3 as shown in FIG. The length is set to the same length as the sides S2 and S2 to be defined.

According to the configuration of this example, since the connection boundary line between the contact lands 3 and 3 and the wirings 4 and 4 is long, the disconnection failure of the wirings 4 and 4 due to the bending of the FPC board 1E can be prevented more reliably.
In short, the connection boundary lines K2, K2 between the contact lands 3, 3 and the wires 4, 4 are equal to or longer than the line width of the wires 4, 4, and the sides S2, S2 that define the contact lands 3, 3 If the length is set to be equal to or less than the length, substantially the same effect as described in the first embodiment can be obtained.

FIG. 5 is a plan view schematically showing the configuration of the FPC board according to the fourth embodiment of the present invention.
In the configuration of the FPC board 1F of this example, as shown in FIG. 5, the end of the wiring 4, 4 is the side facing the mounting holes 9, 9 among the peripheral ends of the four sides of the contact lands 3, 3. This is greatly different from any of the configurations of the first to third embodiments described above in that it is derived from the sides S1 and S1 located on the (fixed end side).

  However, according to the configuration in this example, the covering boundary lines L2 and L2 between the exposed regions 3d and 3d and the covering region 6d are orthogonal to one side S1 and S1 among the four sides that define the contact lands 3 and 3, respectively. It is set to be approximately parallel to the sides S2 and S2.

  Therefore, even in the configuration of this example, the covering boundary line L2 that crosses the wirings 4 and 4 out of the boundary lines where the covering region 6d by the cover coat 6 and the exposed regions 3d and 3d that expose the contact lands 3 and 3 are in contact with each other. , L2 is defined so as to face the direction substantially the same as the bending direction X of the FPC board 1C, so that when the FPC board 1C is bent, stress can be prevented from concentrating on the coating boundary lines L2, L2, Therefore, disconnection failure of the wirings 4 and 4 can be prevented.

  Since the contact land of the fourth embodiment is not a land with a large solidified mass of solder, the end of the wiring 4, 4 is the mounting hole in the peripheral end composed of the four sides of the contact land 3, 3. 9 and 9 are connected from the contact lands 3 and 3 and the wirings 4 and 4 on the one side S1 and S1 even when the one is derived from the one side S1 and S1 located on the side facing the fixed side (fixed end side). No disconnection failure occurs at the boundary lines K2 and K2. In short, in this type of FPC board, the cover coat 6 does not depend on the orientation of the connection boundary line between the contact lands 3 and 3 and the wirings 4 and 4 with respect to the direction of bending. Of the boundary line where the covering boundary line that crosses the wirings 4 and 4 is set with respect to the direction of bending, among the boundary lines where the covering area by the contact area and the exposed area that exposes the contact lands 3 and 3 are in contact with each other It depends.

The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and there are design changes and the like without departing from the gist of the present invention. Are also included in the present invention.
For example, the materials, dimensions, etc. of the flexible substrate, wiring, contact land, cover coat, etc. are not limited to those of the embodiments. The land is not limited to the contact land, and the present invention can be applied to, for example, a reflow soldering land. Further, the shape of the land is not limited to a rectangular shape, and may be an arbitrary shape.
In short, the FPC board that occurs when the FPC board is mounted on the frame, the covering border line that crosses the wiring pattern or in the vicinity thereof among the border line where the covering area by the cover coat contacts with the exposed area that exposes at least the land. If it is demarcated in a mode that faces substantially the same direction as the bending direction, the problem of the present invention can be solved.
Furthermore, the present invention is not limited to the case where the covering boundary lines L1, L2 and the connection boundary lines K1, K2 coincide with each other, and the case where the covering boundary line exists on the extension line of the connection boundary line. A coating boundary line may be provided slightly inside the contact land.

1 is a plan view schematically showing a configuration of an FPC board according to a first embodiment of the present invention. It is sectional drawing which shows the state of the bending which arises temporarily when the same FPC board is mounted | worn with the flame | frame of an electronic device. It is a top view which shows roughly the structure of the FPC board which is 2nd Example of this invention. It is a top view which shows roughly the structure of the FPC board which is 3rd Example of this invention. It is a top view which shows roughly the structure of the FPC board which is 4th Example of this invention. It is a partial top view which shows an example of the conventional FPC board | substrate used for a mobile telephone etc. FIG. 7 is a vertical sectional view taken along line AA in FIG. 6. It is sectional drawing which shows the state with which the conventional FPC board was mounted | worn with the flame | frame (casing) of the electronic device. It is sectional drawing which shows the state of the bending which arises temporarily when the conventional FPC board | substrate is mounted | worn with the flame | frame of an electronic device. It is a top view which shows the structure of the FPC board produced according to the prior art.

Explanation of symbols

1C, 1D, 1E, 1F FPC board (flexible printed wiring board)
2 Flexible substrate 3 Contact land (land)
4 Wiring (wiring pattern)
3b, 3c, 3d Exposed area 6 Cover coat 6b, 6c, 6d Covered area 7 Frame 8 Projection part for mounting board 9 Mounting hole S1, S2 One side of contact land, other side (land edge, other edge) Part)
K1, K2 Connection boundary line L1, L2 Covering boundary line X Deflection direction

Claims (8)

On the surface of the flexible substrate, there are lands for mounting and connecting electrical / electronic components or making electrical contact with the electrical / electronic components, a wiring pattern connected to the lands, and an exposed region exposing at least the lands. Except, a flexible printed wiring board formed with at least a cover coat covering the wiring pattern,
A boundary line between the covering region by the cover coat and at least the exposed region exposing the land, and a covering boundary line crossing the wiring pattern or the vicinity thereof,
It is demarcated in an aspect that faces substantially the same direction as the bending direction of the flexible printed wiring board that occurs when the flexible printed wiring board is mounted on the frame.
A flexible printed wiring board characterized by that. On the surface of the flexible substrate, there are lands for mounting and connecting electrical / electronic components or making electrical contact with the electrical / electronic components, a wiring pattern connected to the lands, and an exposed region exposing at least the lands. Except, a flexible printed wiring board formed with at least a cover coat covering the wiring pattern,
The end of the wiring pattern is connected to the edge of the peripheral edge of the land that extends in the direction substantially the same as the direction of bending of the flexible printed wiring board that occurs when the flexible printed wiring board is mounted on the frame. And
Of the boundary line between the covering region by the cover coat and the exposed region exposing at least the land, the covering boundary line crossing on or near the wiring pattern is
It is defined in an aspect that substantially overlaps with a connection boundary line between the land and the wiring pattern, or in an aspect that is parallel and close to the connection boundary line.
A flexible printed wiring board characterized by that. On the surface of the flexible substrate, there are lands for mounting and connecting electrical / electronic components or making electrical contact with the electrical / electronic components, a wiring pattern connected to the lands, and an exposed region exposing at least the lands. Except for a flexible printed wiring board in which a cover coat covering at least the wiring pattern and a mounting hole fitted to a board mounting projection provided in a frame are formed,
Of the boundary line between the covering region by the cover coat and the exposed region exposing at least the land, the covering boundary line crossing on or near the wiring pattern is
The mounting hole is defined in such a manner that the mounting hole faces a direction substantially the same as a bending direction of the flexible printed circuit board that is generated when the mounting hole is fitted to the protrusion of the frame.
A flexible printed wiring board characterized by that. On the surface of the flexible substrate, there are lands for mounting and connecting electrical / electronic components or making electrical contact with the electrical / electronic components, a wiring pattern connected to the lands, and an exposed region exposing at least the lands. Except for a flexible printed wiring board in which a cover coat covering at least the wiring pattern and a mounting hole fitted to a board mounting projection provided in a frame are formed,
An end of the wiring pattern is connected to an edge of the peripheral edge of the land that extends in a direction substantially the same as the bending direction that occurs when the mounting hole is fitted to the protrusion of the frame. ,And,
Of the boundary line between the covering region by the cover coat and the exposed region exposing at least the land, the covering boundary line crossing on or near the wiring pattern is
It is defined in an aspect that substantially overlaps with a connection boundary line between the land and the wiring pattern, or in an aspect that is parallel and close to the connection boundary line.
A flexible printed wiring board characterized by that. On the surface of the flexible substrate, there are lands for mounting and connecting electrical / electronic components or making electrical contact with the electrical / electronic components, a wiring pattern connected to the lands, and an exposed region exposing at least the lands. Except for a flexible printed wiring board in which a cover coat covering at least the wiring pattern and a mounting hole fitted to a board mounting projection provided in a frame are formed,
An end portion of the wiring pattern is connected to a desired other edge portion excluding an edge portion located on a side facing the mounting hole among the peripheral edge portions of the land; and
Of the boundary line between the covering region by the cover coat and the exposed region exposing at least the land, the covering boundary line crossing on or near the wiring pattern is
It is defined in a manner that substantially overlaps with a connection boundary between the land and the wiring pattern, or in a manner that is parallel and close to the connection boundary.
A flexible printed wiring board characterized by that. On the surface of the flexible substrate, a substantially rectangular land for mounting and connecting an electric / electronic component, or an electric contact with the electric / electronic component, a wiring pattern connected to the land, and at least the land are exposed. A flexible printed wiring board in which a cover coat covering at least the wiring pattern except for an exposed region and a mounting hole fitted to a board mounting projection provided in a frame are formed,
Of the boundary line between the covering region by the cover coat and the exposed region exposing at least the land, the covering boundary line crossing on or near the wiring pattern is
Of the peripheral edge portion consisting of the four sides of the land, it is defined in a mode substantially orthogonal to one side located on the side facing the mounting hole,
A flexible printed wiring board characterized by that. On the surface of the flexible substrate, a substantially rectangular land for mounting and connecting an electric / electronic component, or an electric contact with the electric / electronic component, a wiring pattern connected to the land, and at least the land are exposed. A flexible printed wiring board in which a cover coat covering at least the wiring pattern except for an exposed region and a mounting hole fitted to a board mounting projection provided in a frame are formed,
The end portion of the wiring pattern is connected to a desired other side that does not face the mounting hole orthogonal to one side located on the side facing the mounting hole, of the peripheral edge portion composed of the four sides of the land, and
Of the boundary line between the covering region by the cover coat and the exposed region exposing at least the land, the covering boundary line crossing on or near the wiring pattern is
It is defined in a manner that substantially overlaps with a connection boundary between the land and the wiring pattern, or in a manner that is parallel and close to the connection boundary.
A flexible printed wiring board characterized by that.   The connection boundary line between the land and the wiring pattern is longer than the line width of the wiring pattern, and is equal to or less than the length of the edge portion of the land that is a part to which the wiring pattern is connected. The flexible printed wiring board according to claim 2, wherein the flexible printed wiring board is set to a length of 10 mm.

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