JP2008117994A - Component joining device, and ultrasonic horn - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component joining device which can favorably hold a vibration stability of an ultrasonic horn whose widthwise directional size against a longitudinally directional size is comparatively large and can reduce a cost, and to provide its ultrasonic horn. <P>SOLUTION: The ultrasonic horn 7 is mounted on a lower surface of a lifting member 6 so that the longitudinal direction and width direction are horizontal. A plurality of fixing portions 7g, which are located on both sides 7f in the width direction of the ultrasonic horn 7 to be fixed on the lifting member 6, are opposed to the width direction of the ultrasonic horn 7 and are located at a position where a joining operation member 8 is sandwiched in the longitudinal direction of the ultrasonic horn 7. Moreover, slit portions 7k extending to the longitudinal direction of the ultrasonic horn 7 are located between each of the fixing portions 7g opposed to the width direction of the ultrasonic horn 7. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a component bonding apparatus and an ultrasonic horn that apply ultrasonic vibration to an ultrasonic horn while pressing the component against a surface to be bonded by a bonding operation portion of the ultrasonic horn and bond the component to the surface to be bonded.

  2. Description of the Related Art As a component bonding apparatus for bonding a component (electronic component) such as a semiconductor chip to a bonded surface of a substrate, an apparatus using ultrasonic vibration is known. This component joining apparatus fixes a ultrasonic horn, which is a horizontally long rod-like member, to a vertically movable elevating member so that the longitudinal direction and the width direction are horizontal, and is a joining action portion protruding downward from the lower surface of the ultrasonic horn. Ultrasonic vibration is applied to the ultrasonic horn while pressing the part against the surface to be joined, and the part is vibrated minutely to adhere to the surface to be joined.

  In this ultrasonic horn, a plurality of fixing portions provided on both side surfaces in the width direction are fixed to the elevating member. These fixing portions sandwich the joining action portion in the longitudinal direction of the ultrasonic horn, and the ultrasonic horn. Because it is provided at the position of the node of the standing wave that is generated inside (the combined wave of the longitudinal vibration and the reflected wave that travels in the longitudinal direction in the ultrasonic horn), the joint action part located at the antinode of the standing wave is It vibrates (oscillates) in the longitudinal direction with a large amplitude, and the parts are joined efficiently (Patent Document 1).

Since the joining part of the ultrasonic horn needs to be sized according to the parts to be joined, the dimension in the width direction relative to the longitudinal dimension is required for parts with a large aspect ratio such as a semiconductor chip for driving a liquid crystal display. A relatively large ultrasonic horn is used. If the width dimension of the ultrasonic horn is large, the vibration component (amplitude) in the width direction, which is hardly a problem when the width dimension is small, increases, and this vibration in the width direction is transmitted from the fixed part to the lifting member. The vibration stability of the sonic horn is lowered, resulting in poor joining of parts. In order to eliminate such an inconvenience, it is necessary to form a slit in the fixed part of the ultrasonic horn so as to block the vibration transmitted from the ultrasonic horn to the lifting member by allowing elastic deformation of the fixed part. It is effective (patent document 2).
JP 2005-347505 A Japanese Patent Laid-Open No. 2004-40014

  However, as described above, it is difficult to form a slit in the fixed part which is a minute part, and if the slit is formed in the fixed part, the rigidity of the fixed part is reduced, so that the reinforcement is necessary. There has been a problem that the manufacturing cost of the sonic horn and, in turn, the component joining apparatus is increased.

  Accordingly, the present invention provides a component joining apparatus and an ultrasonic horn that can maintain the vibration stability of an ultrasonic horn having a relatively large width-direction dimension relative to the longitudinal dimension, and can also reduce the cost. The purpose is to do.

The component joining apparatus according to claim 1 includes an elevating member that can be moved up and down, and an ultrasonic horn fixed to the elevating member, and the component is a surface to be bonded by a bonding operation portion provided on a lower surface of the ultrasonic horn. A component joining apparatus for joining a component to a surface to be joined by applying vibration to the ultrasonic horn while being pressed against the ultrasonic horn, and having a plurality of fixing portions that are provided on both side surfaces in the width direction of the ultrasonic horn and are fixed to the lifting member The groove-shaped portion that is disposed in a position facing the width direction and sandwiching the bonding action portion in the longitudinal direction of the ultrasonic horn, and extending in the longitudinal direction between the fixed portions facing in the width direction Is provided.

  According to a second aspect of the present invention, there is provided the component joining apparatus according to the first aspect, wherein the groove-shaped portion is a groove-shaped through-hole penetrating the ultrasonic horn in the vertical direction or the upper and lower surfaces of the ultrasonic horn. It is a groove-shaped recessed part opened to at least one side.

  The component bonding apparatus according to claim 3 is the component bonding apparatus according to claim 1 or 2, wherein the ultrasonic horn includes two heaters arranged in parallel in the width direction across the groove-shaped portion. .

  The ultrasonic horn according to claim 4 is fixed to an elevating member that can be moved up and down in the component bonding apparatus, and receives a command given from the component bonding apparatus while pressing the component against a surface to be bonded by a bonding operation portion provided on a lower surface. An ultrasonic horn that joins a part to a surface to be joined by vibrating and having a plurality of fixing portions that are provided on both side surfaces in the width direction of the ultrasonic horn and are fixed to an elevating member are opposed to the width direction. In addition, the bonding action portion is disposed at a position sandwiching the ultrasonic horn in the longitudinal direction, and a groove-like portion extending in the longitudinal direction is provided between the fixing portions facing in the width direction.

  In the present invention, the groove portion is provided between the fixed portions facing in the width direction of the ultrasonic horn, and a space allowing elastic deformation is formed between the fixed portions. Even when the width dimension relative to the longitudinal dimension is relatively large, the amplitude of vibration generated in the width direction of the ultrasonic horn is extremely small, and the vibration stability of the ultrasonic horn is kept good. Moreover, the work of providing a groove-like part between the fixed parts of the ultrasonic horn is much easier than the work of forming a slit in the fixed part, which is a minute part, and the rigidity of the fixed part is not reduced and no reinforcement is required. Therefore, it is possible to reduce the manufacturing cost of the ultrasonic horn and thus the component joining apparatus.

  Embodiments of the present invention will be described below with reference to the drawings. 1 is a front view of a component bonding apparatus according to an embodiment of the present invention, FIG. 2 is a partial front view of the component bonding apparatus according to an embodiment of the present invention, and FIG. 3 is an ultrasonic wave according to an embodiment of the present invention. The bottom view of a horn and FIG. 4 are the fragmentary sectional front views of the ultrasonic horn in one embodiment of this invention.

  In FIG. 1, a component bonding apparatus 1 includes a positioning table 3 having a substrate holding portion 2 on the upper surface and a bonding mechanism 4 provided above the positioning table 3. An elevating member 6 that can be raised and lowered, and an ultrasonic horn 7 attached to the lower part of the elevating member 6 are provided. The ultrasonic horn 7 is a horizontally long rod-like member, and is fixed to the elevating member 6 so that the longitudinal direction (left-right direction parallel to the paper surface of FIG. 1) and the width direction (direction perpendicular to the paper surface of FIG. 1) are horizontal. Has been.

  In FIG. 1, a convex portion 7b protruding downward is formed at the longitudinal center of the lower surface 7a of the ultrasonic horn 7, and a lower end of the convex portion 7b has a bonding action surface 8a on the lower surface. A joining action member (joining action part) 8 is provided. The ultrasonic horn 7 is driven by receiving a command from the transducer driving unit 10 (FIG. 2) provided outside the ultrasonic horn 7 on one end side in the longitudinal direction of the ultrasonic horn 7 (left side in FIG. 1). A vibrator 9 for applying ultrasonic vibration is attached in the longitudinal direction of 7.

In FIG. 2, a suction conduit 7 c is provided inside the ultrasonic horn 7. One end of the suction pipe 7c is connected to an opening (upper surface opening 7e) of the upper surface 7d of the ultrasonic horn 7, and the other end extends in the convex portion 7b of the ultrasonic horn 7 in the vertical direction. It is connected to the suction port 8b opened on the bonding surface 8a of the bonding member 8. Furthermore, since the upper surface opening 7e of the ultrasonic horn 7 is connected to the vacuum suction source 14 via the external pipe line 13 extending outside the ultrasonic horn 7, the vacuum suction source 14 is operated and the suction port 8b is operated. By sucking air, the semiconductor chip 12 brought into contact with the bonding surface 8a can be adsorbed and held on the bonding surface 8a.

  In FIG. 3, on both side surfaces 7f in the width direction of the ultrasonic horn 7, four fixing portions 7g attached to the elevating member 6 are provided extending outward. These four fixing portions 7g are arranged at positions facing the width direction of the ultrasonic horn 7 and sandwiching the bonding member 8 in the longitudinal direction. Each fixing portion 7g is provided with a bolt hole 7h penetrating in the height direction of the ultrasonic horn 7 (vertical direction of the component joining apparatus 1), and a bolt (not shown) provided through the bolt hole 7h. ), The ultrasonic horn 7 is fixed to the elevating member 6.

  Here, the two fixing portions 7g opposed to the longitudinal direction of the ultrasonic horn 7 are provided in the ultrasonic horn 7 in order to minimize attenuation of vibration caused by fixing (constraining) the ultrasonic horn 7 to the elevating member 6. 2 is provided at the position of the adjacent node with a distance of half wavelength (L / 2) of the standing wave generated in FIG. Therefore, by providing the ultrasonic horn 7 with ultrasonic vibration having an appropriate frequency capable of creating a longitudinal vibration resonance state in the longitudinal direction of the ultrasonic horn 7, the ultrasonic horn 7 is positioned at the antinode of the standing wave of the ultrasonic vibration. The joining member 8 can be vibrated (oscillated) with a large amplitude in the longitudinal direction of the ultrasonic horn 7.

  In FIG. 3, a groove-like portion 7 k extending in the longitudinal direction of the ultrasonic horn 7 is provided between the fixed portions 7 g facing the width direction of the ultrasonic horn 7. The groove-like portion 7k is a groove-like through hole that penetrates the ultrasonic horn 7 in the vertical direction.

  3 and 4, two heater insertion holes 7 m are provided in the ultrasonic horn 7 side by side in the width direction of the ultrasonic horn 7. These two heater insertion holes 7m extend in the longitudinal direction of the ultrasonic horn 7, and the groove-like portion 7k is disposed between the two heater insertion holes 7m. A thermocouple insertion hole 7 n is provided below each heater insertion hole 7 m so as to extend in the longitudinal direction of the ultrasonic horn 7.

  In FIG. 4, a heater 15 is inserted in each heater insertion hole 7m, and a thermocouple 16 is inserted in each thermocouple insertion hole 7n. The heater lead wire 17 extending from each heater 15 extends from the heater insertion hole 7m to the outside of the ultrasonic horn 7, and the thermocouple lead wire 18 extending from each thermocouple 16 is inserted into the thermocouple insertion hole 7n. The lead wire fixing member 19 extends to the outside of the ultrasonic horn 7. The heater lead wire 17 and the thermocouple lead wire 18 extending to the outside of the ultrasonic horn 7 are held via a cushion member 22 on a bracket 21 attached to the side surface of the elevating member 6 with a bolt 20, and a heating power supply unit 23.

In order to bond the semiconductor chip 12 to the bonded surface 11 a on the upper surface of the substrate 11, the substrate 11 is held on the upper surface of the substrate holding unit 2, and the semiconductor chip 12 is sucked and held on the bonding action surface 8 a of the ultrasonic horn 7. Let Then, the elevating member 6 (that is, the ultrasonic horn 7) is lowered by the elevating and pressing mechanism 5, and the solder bump 12 a formed on the lower surface of the semiconductor chip 12 is pressed against the bonded surface 11 a of the substrate 11. In this state, the heater 15 is operated from the heating power supply unit 23 to heat the ultrasonic horn 7, and the temperature of the semiconductor chip 12 and the substrate 11 attracted and held by the ultrasonic horn 7 is increased to melt the solder bump 12 a, When the vibrator 9 is driven and ultrasonic vibration is applied to the ultrasonic horn 7, the bonding member 8 of the ultrasonic horn 7 vibrates (oscillates) in the longitudinal direction of the ultrasonic horn 7 while adsorbing the semiconductor chip 12. Therefore, the load and vibration are simultaneously applied to the semiconductor chip 12, and the semiconductor chip 12 is bonded to the bonded surface 11 a of the substrate 11 by the melted solder bump 12 a. That is, in this component bonding apparatus 1, the ultrasonic horn 7 is vibrated in response to a command given from the component bonding apparatus 1, thereby bonding the semiconductor chip 12 as a component to the bonded surface 11a.

  Here, in the component joining apparatus 1 according to the present embodiment, the groove-like portion 7k is provided between the fixing portions 7g facing each other in the width direction of the ultrasonic horn 7, and the elastic portions are provided between the fixing portions 7g. Since a space allowing deformation is formed, the amplitude of the vibration generated in the width direction of the ultrasonic horn 7 is extremely small even when the width direction dimension relative to the longitudinal dimension of the ultrasonic horn 7 is relatively large. Thus, the vibration stability of the ultrasonic horn 7 is kept good. Moreover, the operation of providing the groove-like portion 7k between the fixing portions 7g of the ultrasonic horn 7 is much easier than the operation of forming a slit in the fixing portion 7g, which is a minute part, and the rigidity of the fixing portion 7g is reduced. Since there is no need for reinforcement, the manufacturing cost of the ultrasonic horn 7 and thus the component joining apparatus 1 can be reduced.

  Moreover, in the component joining apparatus 1 in the present embodiment, the two heaters 15 are arranged in parallel in the width direction of the ultrasonic horn 7 with the groove-like portion 7k interposed therebetween, and the groove-like portion is interposed between the two heaters 15. Since the space by 7k is formed, the influence of the heating which the both heaters 15 give to the ultrasonic horn 7 does not interfere with each other, and temperature control independent of each other can be performed.

  Although the embodiments of the present invention have been described so far, the present invention is not limited to those shown in the above-described embodiments. For example, in the above-described embodiment, the groove-like portion 7k provided in the ultrasonic horn 7 is a groove-like through-hole penetrating the ultrasonic horn 7 in the vertical direction. If it is provided between the fixing portions 7g facing each other in the width direction of the horn 7 and extends in the longitudinal direction of the ultrasonic horn 7, it has a groove shape that opens to at least one of the upper surface 7d and the lower surface 7a of the ultrasonic horn 7. It may be a recess or the like. Even in such a configuration, as in the case where the groove-like portion 7k is a groove-like through-hole penetrating the ultrasonic horn 7 in the vertical direction, there is a space that allows elastic deformation between the fixed portions 7g. This is because the vibration amplitude generated in the width direction of the ultrasonic horn 7 can be made extremely small.

  In the above-described embodiment, the bonding member (bonding member) 8 is detachable from the ultrasonic horn 7, but the bonding member 8 is downward from the lower surface 7 a of the ultrasonic horn 7. What is necessary is just to have a function of projecting and pressing the semiconductor chip 12 (component) against the surface to be joined 11 a, and is not necessarily detachable from the ultrasonic horn 7.

  The vibration stability of the ultrasonic horn having a relatively large width dimension relative to the longitudinal dimension can be kept good, and the cost can be reduced.

The front view of the component joining apparatus in one embodiment of this invention The partial front view of the component joining apparatus in one embodiment of this invention The bottom view of the ultrasonic horn in one embodiment of the present invention The partial cross section front view of the ultrasonic horn in one embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component joining apparatus 6 Elevating member 7 Ultrasonic horn 7a Lower surface 7d Upper surface 7f Side surface 7g Fixed part 7k Groove part 8 Joining action member (joining action part)
11a Surface to be joined 12 Semiconductor chip (component)
15 Heater

Claims (4)

It has a lifting member that can be moved up and down and an ultrasonic horn fixed to the lifting member, and a vibration is applied to the ultrasonic horn while pressing the parts against the surface to be bonded by the bonding action part provided on the lower surface of the ultrasonic horn. A component bonding apparatus for bonding a component to a surface to be bonded,
A plurality of fixing portions provided on both side surfaces of the ultrasonic horn in the width direction and fixed to the elevating member are disposed at positions facing the width direction and sandwiching the bonding operation portion in the longitudinal direction of the ultrasonic horn. And a groove-like portion extending in the longitudinal direction is provided between the fixing portions facing in the width direction.   The groove-shaped portion is a groove-shaped through-hole penetrating the ultrasonic horn in the vertical direction or a groove-shaped concave portion opened in at least one of an upper surface and a lower surface of the ultrasonic horn. Parts joining equipment.   The component bonding apparatus according to claim 1, wherein the ultrasonic horn includes two heaters arranged in parallel in the width direction across the groove-shaped portion. In the component joining device, the component is fixed to the elevating member that can be raised and lowered, and the component is moved to the surface to be joined by oscillating in response to a command given from the component joining device while pressing the component against the surface to be joined by the joining action portion provided on the lower surface. An ultrasonic horn for joining,
A plurality of fixing portions provided on both side surfaces of the ultrasonic horn in the width direction and fixed to the elevating member are disposed at positions facing the width direction and sandwiching the bonding operation portion in the longitudinal direction of the ultrasonic horn. An ultrasonic horn characterized in that a groove-like portion extending in the longitudinal direction is provided between the fixing portions facing in the width direction.

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