JP2008117809A - Heat sink - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat sink that has a passive function for heat dissipation and an active function such as temperature adjustment by a thermostat. <P>SOLUTION: The heat sinks 11-1 to 11-3 are provided with heat-sink main bodies that have spiral structures each formed of a first member formed of a shape memory alloy and a second member for heat dissipation, a detection part that detects that a part of the spiral structure is touched with the detection part itself, and a signal sending part that, when the spiral structure is transformed according to a temperature rise and a part thereof is brought into contact with the detection part, sends a specified signal using the detected result as a trigger. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat sink, and more particularly, to a heat sink using a shape memory alloy that is used to dissipate heat from electronic components and electrical equipment and that varies a heat dissipating area according to temperature.

  Electrical parts, electrical devices, and the like generate heat when they operate, but if they reach a high temperature that cannot be dissipated by the parts or the device body, they may lead to damage or abnormal operation. In order to prevent this, a heat sink, such as a heat radiating fin, has been used conventionally.

  In general, a heat sink is formed of a metal such as aluminum having excellent thermal conductivity, and the heat dissipation capability is mainly determined by its surface area. That is, since the surface area is determined for each heat sink, the heat dissipation capability for each heat sink is also determined. Further, the heat sink generally has no function other than heat dissipation.

  By the way, the discharge warning system for dam facilities for the purpose of flood control and water use in public works uses radio equipment and warning / broadcasting facilities that are high heating elements. In many cases, a heat sink with a small heat dissipation capacity is used.

  Because a heat sink with low heat dissipation capability is used, if there is a change in specifications such as extending the transmission time of wireless equipment, extending the broadcasting time of alarm / broadcasting equipment, or in the unlikely event that wireless transmission or broadcasting is not terminated, continuous transmission / If an unforeseen situation occurs in continuous broadcasting, there is a risk that the radio equipment, alarm / broadcasting equipment, etc. may be damaged or fire.

  However, as described below, there has been disclosed an invention using a shape memory alloy having a property of recovering to its original shape when it is deformed below a certain temperature and heated above that temperature. Patent Documents 1 to 3 disclose inventions related to heat sinks using shape memory alloys, Patent Document 4 discloses inventions related to coil spring elements, and Patent Document 5 discloses inventions related to actuators.

  Patent Document 1 discloses a cooling device having a structure in which heat dissipation efficiency in the same required volume is improved by combining a heat sink fin and a strip plate made of a shape memory alloy to make an air flow by a fan turbulent.

  In Patent Document 2, the surface pressure applied to the heat transfer promoter filled between the heat source (electronic element or the like) and the heat sink closely attached to the heat transfer surface of the heat source is increased by a spring force made of a shape memory alloy. An electronic device mounting apparatus having a structure for improving heat dissipation efficiency by stabilizing and reducing thermal resistance is disclosed.

  In Patent Document 3, in order not to disturb the air blowing when the heat dissipation amount of the transistor is small, the heat dissipation portion of the transistor is combined with a heat sink (heat dissipation member) made of a shape memory alloy, and the heat dissipation effect increases as the amount of heat received increases. The present invention discloses a heat dissipating device for an air flow control transistor having a structure that is deformed so that the heat dissipating plate is raised.

  Patent Document 4 discloses a two-way shape memory coil spring element having a structure in which a shape memory alloy coil spring and a metal coil spring not storing a shape are double spirals to realize a two-way coil spring with a small volume. To do.

  Patent Document 5 discloses an actuator having a structure in which a shape memory alloy is formed into a coil shape, and the coil is expanded / contracted by heating / cooling of the coil by a thermoelectric element contacting the coil via an insulating material, thereby obtaining a high expansion / contraction output. . The coil includes a spiral spiral type.

  By the way, the heat dissipation capability of the heat sink is mainly determined by the material and its surface area, and cannot be changed. However, in the invention described in Patent Document 3, the heat dissipation member is made of a shape memory alloy, and according to the amount of heat, the heat dissipation member The heat dissipation efficiency is changed by changing the posture. If the operating time of the high heat generating equipment used in the above-mentioned broadcasting equipment and alarm equipment is extended by changing the specifications, the surface area can be varied based on any temperature by using a shape memory alloy for the heat sink. For this reason, it is possible to cope with the specification change without replacing the heat sink itself by mounting the one having a higher maximum heat dissipation capacity in advance of the extension of the operation time.

  On the other hand, the invention described in Patent Document 5 provides an actuator that obtains a high expansion / contraction output by making a shape memory alloy into a coil type and expanding and contracting the coil according to the amount of heat applied thereto.

Japanese Patent Laid-Open No. 10-190268 (see paragraphs [0003], [0004], [0009], FIG. 1 and abstract) JP-A-10-173112 (see paragraphs [0003], [0004], [0009], FIG. 2 and abstract) JP 59-084744 (Claims, line 19 in the right column of the first page to line 3 in the left column of the second page, see FIG. 3) JP 08-312705 (see paragraphs [0005] to [0009], [0019], FIG. 1 and abstract) JP 2001-099206 A (refer to claims 1 and 30, paragraphs [0002] to [0005], [0023], [0055], FIG. 1 and abstract)

  However, members such as heat sinks using shape memory alloys according to the prior art including the inventions described in Patent Documents 1 to 5 generally do not include functions other than the functions of the members themselves. As an exception, although some heat sinks have a structural function as a frame in addition to a heat dissipation function, all of these functions are passive. SUMMARY OF THE INVENTION An object of the present invention is to provide a heat sink that has a passive function such as heat dissipation in the heat sink and an active function such as temperature control like a thermostat.

  Another object of the present invention is to provide a heat sink provided with means for detecting temperature abnormalities of electronic components or electrical equipment cooled by the heat sink in a stepwise manner.

  It is another object of the present invention to provide a heat sink having a space that can extend in the vertical direction.

  Another object of the present invention is to provide a heat sink having a space that can extend in the horizontal direction.

  The heat sink according to the first embodiment of the present invention that achieves the above object includes a heat sink body formed by forming a spiral structure portion with a first member of shape memory alloy and a second member for heat dissipation, and the spiral structure portion. A detection unit that detects that a part of the spiral structure touches itself, and triggers the detection when the spiral structure part is transformed in response to a temperature rise and a part of the spiral structure part touches the detection unit. And a signal sending part for sending a predetermined signal.

  A heat sink according to a second embodiment of the present invention that achieves the above object comprises a plurality of pairs of the heat sink main body and the detection unit in the heat sink, each of the heat sink main bodies having a transformation temperature of the helical structure. In contrast, each of the plurality of detection units performs temperature detection according to a change at a predetermined transformation temperature of each of the spiral structure units.

  In the heat sink according to the third embodiment of the present invention that achieves the above object, in the heat sink, the helical structure portion of the heat sink main body is formed in a spiral shape.

  In the heat sink according to the fourth aspect of the present invention that achieves the above object, in the heat sink, the helical structure portion of the heat sink main body is formed in a spiral shape.

  According to the heat sink of the first aspect of the present invention, an arbitrary temperature is set to the transformation temperature of the heat sink, and the heat radiation area is increased by transforming from the predetermined temperature set to the transformation temperature as a boundary. In addition to a cooling function that varies the capacity, it also has a function of a thermostat that detects a temperature abnormality such as reaching a dangerous temperature and keeps the set temperature by sending a warning signal etc. when the temperature exceeds a predetermined temperature Can do. Further, by using the transmitted signal for alarm notification, starting of a forced cooling fan, etc., it can also serve as a security / protection function.

  In addition, according to the heat sink of the first form, if the temperature of the heat dissipating electronic components and electrical equipment rises from the initial design temperature due to unforeseen circumstances, the limit temperature should be set as the transformation temperature. It is possible to realize a safety function such as a temperature fuse.

  The second embodiment of the present invention is provided with means for transforming at various temperatures for each heat sink and detecting the temperature rise stepwise. Specifically, it has multiple pairs of heat sink main body and detector, and the operation of each heat sink main body is different for each predetermined transformation temperature, so which heat sink main body has transformed (elongated) Accordingly, temperature abnormality can be detected step by step, and temperature control in multiple steps can be performed.

  According to the third aspect of the present invention, it is possible to provide a heat sink suitable when there is no space in the horizontal direction of the heat sink and there is a space in the vertical direction.

  According to the fourth aspect of the present invention, it is possible to provide a heat sink suitable when there is no space in the vertical direction of the heat sink and there is a space in the horizontal direction.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a configuration diagram showing an outline of an electric device including a heat sink according to an embodiment of the present invention. The operation of the electric device 1 shown in FIG. 1 as a whole will be described below. The electrical equipment 1 (hereinafter simply referred to as equipment 1) includes a plurality of heat sinks 11-1, 11-2, and 11-3 using shape memory alloys that transform at different temperatures.

  Step S1: When the device 1 is operating within the design temperature range, the heat sinks 11-1 and 11-2 are contracted and perform a normal heat radiation operation.

  Step S2: When the temperature of the device 1 rises and enters the region (T ° C.) where the design temperature of the device 1 is exceeded, the heat sink 11-1 is transformed to increase the heat radiation area and enhance the heat radiation effect.

  Step S3: When the temperature of the device 1 continues to rise due to an unforeseen situation, etc., and reaches a dangerous temperature range (T + α ° C.) leading to destruction or fire, the heat sink 11-2 transforms and further increases the heat radiation area , Enhance the heat dissipation effect. At the same time, the detection of the transformation of the heat sink 11-2 detects that the tip of the spiral first member of the heat sink has touched, and the spiral first member expands as the temperature rises and the tip touches the detection unit. Then, a predetermined signal is sent using the detection as a trigger, the electrical switch is closed like a thermostat, the electric cooling FAN 15 and the like are started, and the device 1 is cooled by forced air cooling.

  Step S4: When an unexpected situation is settled and the temperature of the device 1 falls, the heat sink 11-2 returns to the normal shape. With this as a trigger, the cooling FAN 15 is stopped to return to natural air cooling.

Step S5: When the temperature of the device 1 further decreases, the heat sink 11-1 returns to the normal shape and returns to the normal operation.
Further, if the transformation temperature of the heat sink 11-3 is set to a temperature different from T and T + α ° C., this is not the two-step temperature detection by the heat sinks 11-1 and 11-2 as described above. It is possible to detect the temperature in three stages including 11-3.

  Conventionally, in order to realize a heat dissipation function, a thermostat function, and a security function, equipment was required for each function, but according to the present invention, a series of functions can be realized with one equipment. The space saving, power saving and cost reduction can be realized.

  In addition, in a heat sink with three functions of heat dissipation function, thermostat function and safety / protection function, by using the characteristics of thermostat function and safety / protection function, and realized as a system with an electric cooling fan, More reliable security is possible.

  Heat sinks with different transformation temperatures are operated in stages, and the heat dissipation efficiency is increased by the rising temperature, and the operation of the electric cooling fan and the generation of alarms are triggered by the operation of the heat sink at the final stage. By performing the reporting operation, it is possible to realize a security / protection system with improved reliability.

As described above, the heat sink of the present invention alone has the following three functions, and thus has advantages in all aspects of the space, cost, and maintenance of the device.
1. Heat dissipation function 2. Temperature detection function Equipment security / protection function at unexpected temperature rise

  Furthermore, it is not necessary to provide an operation power supply in order to realize the above three functions, and the risk of electrical failure can be reduced.

  According to the present invention, in addition to the conventional heat sink function, the function of varying the heat dissipation capability under an arbitrary temperature condition can be obtained, so that a characteristic for keeping the temperature of the heat source constant can be obtained. This characteristic shows that it can be used as a thermostat, and when used in combination with the heat dissipation operation, which is the original function, the temperature can be controlled compared to a conventional heat sink that has only a passive function. It is possible to have an active function of performing.

  According to the present invention, by setting the transformation temperature of the heat sink under the condition of set temperature ≦ dangerous temperature, it is possible to improve the heat radiation effect due to the increase in the heat radiation area of the heat sink, and damage to radio equipment, alarm / broadcasting equipment, etc. And fire can be avoided.

  In the heat sink according to the embodiment of the present invention, the main body has a spiral structure and is formed in a spiral shape or a spiral shape. First, an example of a heat sink formed in a spiral shape will be described below.

  FIG. 2 is a perspective view showing the configuration of the heat sink according to the first embodiment of the present invention. The heat sink 21 shown in FIG. 2 is attached on the electronic component 22 and is configured in the form of a helical spring made of shape memory alloy. The helical spring made of shape memory alloy has a first member 23 and a second member 24 and is air-cooled by air from the cooling FAN 25.

  The heat sink 21 has a thermostat function and a heat sink, which are additional functions that a conventional heat sink cannot have, by utilizing the transformation characteristics due to temperature change of the shape memory alloy helical spring and changing the heat radiation area. The security function of parts or equipment can be realized.

  FIG. 3 is a view showing an outline of a heat sink composed of a shape memory alloy helical spring shown in FIG. 2, wherein (A) is a material and (B) is a first constituting a shape memory alloy helical spring. (C) shows a 2nd member, respectively.

  A typical example of the first member 23 is a shape memory alloy (Ni—Ti), and the Ni—Ti alloy has a thermal conductivity similar to that of stainless steel, and there is no example of direct use for the purpose of heat dissipation. The main purpose of use is to generate a bias, that is, to apply a bias. In order to exhibit a cooling function as a heat sink, it is necessary to provide a separate heat dissipating portion and an extra space is required.

  According to the above heat sink, the structure of the helical spring is such that the first member 23 is a shape memory alloy (Ni-Ti) spring for generating a bias and the second member 24 is a dissimilar metal with high heat conductivity for heat dissipation ( Cu, Al, etc.) with a spring with a spring compensates for the poor thermal conductivity of the shape memory alloy (similar to stainless steel) and increases the heat dissipation effect, resulting in higher heat dissipation efficiency with the same volume Can be realized.

  Further, according to the heat sink, it is possible to save space by integrating the heat dissipating part and the bias part, which have been separated conventionally, and it is possible to improve the heat dissipating efficiency per unit volume.

  4 is a view showing an embodiment in which the winding ratio of the helical spring constituting the heat sink shown in FIG. 2 is changed. By changing the winding ratio of the bias generating spring and the heat dissipating spring that make up the helical spring, the surface area of the heat dissipating spring is made larger than the bias generating spring made of shape memory alloy, and the heat dissipating area is increased. A higher heat dissipation effect can be realized, and the heat dissipation efficiency of the heat sink can be improved.

  FIG. 5 is a diagram showing (A) a first member and (B) showing a second member constituting a shape memory alloy helical spring.

  For the purpose of further increasing the heat dissipation effect on the heat sink volume, the heat release area of the heat sink can be obtained by forming the bias spring of the first member (Ni-Ti) with a thin wire and the heat release spring of the second member (Cu, Al, etc.) as a strip. And a heat sink that realizes a higher heat dissipation effect with the same volume can be provided.

  Moreover, the most examples of manufacturing springs using shape memory alloys are helically wound, and are easy to manufacture and inexpensive. Further, by forming the bias generating spring constituting the shape memory alloy spring with a thin wire, it becomes possible to easily and inexpensively manufacture the shape memory alloy spring.

  FIG. 6 is a view showing an embodiment of a heat sink in which a plurality of helical springs are mounted on a metal plate having high thermal conductivity to form a module. As shown in FIG. 6, by mounting a plurality of helical springs on the metal plate 60 and modularizing it, it becomes possible to have a wide range of versatility. Especially public for heat dissipation to cool large devices.

  Further, when the metal plate 60 with a plurality of helical springs is fixed to the apparatus, the metal plate 60 is fixed to the contact portion with the heat source on the apparatus side with an adhesive heat conduction sheet and fixed. It can be retrofitted without requiring processing, and can be versatile.

  FIG. 7 is a view showing an example in which a metal is used for the upper lid of the heat sink shown in FIG. As shown in FIG. 7, by using a metal top cover, the heat dissipation effect can be enhanced and at the same time, damage to the heat sink body due to external contact and impact can be avoided.

  FIG. 8 is a diagram showing an example in which a mesh-like lid is used as the upper lid of the heat sink shown in FIG. The heat sink shown in FIG. 8 can improve heat dissipation efficiency by using an upper lid having a mesh structure made of a metal (Cu, Al, etc.) having high thermal conductivity.

  FIG. 9 is a diagram showing an example in which a lid having a structure of a thick square rod and a rough mesh is used for the upper lid of the heat sink shown in FIG. With such a structure, since the area where the object to be cooled comes into contact with the air is increased by increasing the ventilation area, the heat radiation efficiency can be improved.

  FIG. 10 is a view showing a structure in which a heat dissipation sheet is attached to a contact portion between a heat sink and an upper lid for cooling the electric apparatus shown in FIG. As shown in FIG. 10, the heat radiation plate 16 is affixed to the contact portion between the heat sink and the upper lid by a plurality of helical springs, thereby increasing the contact area between the heat sink and the upper lid and improving the heat radiation efficiency.

  FIG. 11 is a diagram showing a structure in which a heat conductive sheet is attached to a contact portion between a heat sink and an upper lid for cooling the electric device shown in FIG. As shown in FIG. 11, by attaching a heat conductive sheet 17 having a large thermal conductivity to a contact portion with a heat sink by a plurality of helical springs, the thermal conductivity of the heat conductive sheet 17 is large, so that the thermal resistance is lowered and the heat is dissipated. Efficiency can be improved.

  FIG. 12 is a diagram showing the characteristics of the thermostat function of the heat sink having the helical spring structure according to the present invention. Conventionally, when trying to keep the temperature of a heat generation source (parts, equipment, etc.) constant, the temperature of the heat source is monitored by a sensor, etc., and when the preset temperature is reached, an electric cooling fan is started by a sensor signal And cooled. On the other hand, the present invention intends to realize these series of functions (sensor function / cooling function) with only heat sinks. Conventionally, a device having a cooling function in cooperation with a thermostat has required a power source for operation. However, the heat sink according to the present invention has an advantage that a power source for a device having a cooling function becomes unnecessary.

  When the temperature rises, the heat sink according to the present invention extends from the preset transformation temperature to increase the heat dissipation area, and conversely, when the temperature decreases, the heat sink shrinks from the transformation temperature to reduce the heat dissipation area. Thus, the shape of the heat sink can be varied, and as a result, the characteristic of keeping the heat source near the transformation temperature can be obtained with the heat sink alone. This property of the heat sink replaces the function of the thermostat. The following is given as a specific example using this function. The detection unit that detects that the tip of the spiral first member of the heat sink touches the transformation of the heat sink due to the temperature rise of the components and devices that are heat generation sources, and the spiral first member is changed according to the temperature rise. When the tip extends and touches the detection part, a predetermined signal is sent using the detection as a trigger, the electrical switch is closed like a thermostat, the electric cooling FAN 15 is activated, and the heat generation source is forced air cooling. The device 1 is cooled.

FIG. 13 is a diagram showing the characteristics of the security function of the heat sink having the helical spring structure according to the present invention. Conventionally, the following countermeasures have been taken when the temperature and temperature of parts and equipment, which are heat generation sources, increase during an unforeseen event (external temperature rise, etc.) and exceed the initial design value.
(1) Forced air cooling with a sensor-linked electric fan or the like.
(2) Mount safety parts such as temperature fuses.

However, the countermeasures (1) and (2) include the following problems.
In measure (1), if a double failure occurs that causes the electric fan to fail, it cannot be dealt with, which may lead to equipment damage or fire.

  There is a measure (2) that uses a temperature fuse to solve the problem of the measure (1). However, since the temperature fuse cuts off the supply of power, which is the root cause of heat generation, the operation of parts and devices is stopped, and there are some devices that require continuous operation and are not allowed to stop. But in this case it can not be dealt with.

  On the other hand, the present invention sets the transformation temperature of the heat sink in advance to the limit temperature of the component or device that is the heat generation source, so that even if a double failure occurs when the temperature is exceeded due to an unexpected situation, And heat can be dissipated without stopping the operation of the equipment.

Next, an example of a heat sink formed in a spiral shape will be described below.
FIG. 14 is a perspective view showing the configuration of the heat sink of the second embodiment according to the present invention. The heat sink 121 shown in FIG. 14 is attached on the electronic component 122 and is formed in the shape of a spiral spring made of shape memory alloy. The spiral spring made of shape memory alloy has a first member 123 and is cooled by air from the cooling FAN 125.

  As will be described later, the present invention uses a transformation characteristic due to temperature change of a spiral spring made of a shape memory alloy to change the heat radiation area, and can realize an additional function that a conventional heat sink cannot have.

  FIG. 15 is a view showing a state in which the heat sink having the spiral spring structure shown in FIG. 14 is attached to the component. FIG. 15A shows a state in which the heat sink is vertically attached to the component, and FIG. It is a figure which shows the attached state.

  As shown in FIG. 15A, the angle of the first member 123A of the spiral heat sink heat sink is made perpendicular to the electronic component 122, and forced air cooling is performed from the side surface of the first member 123A of the heat sink by the cooling fan 125 or the like.

  As shown in FIG. 15B, the angle of the second member 123B of another aspect of the heat sink having the spiral spring structure is made horizontal to the electronic component 122 without disturbing the heat convection from the electronic component 122 that is a radiator. Efficient natural heat dissipation.

  FIG. 16 is a view showing a structure in which the heat sink base is movable and the spiral spring angle can be varied. With this structure, the heat sink can be used with optimum heat radiation efficiency regardless of the installation conditions of the heat sink.

  FIG. 17 is a view showing a specific example of a double winding structure of a spiral spring. Shape memory alloy (Ni-Ti) has the same thermal conductivity as stainless steel, and is not directly used for heat dissipation purposes, but mainly for changing the shape. In the case of applying this shape memory alloy to a heat sink, conventionally, it is necessary to separately provide a heat radiating portion, and an occupied space is required. Therefore, in the present invention, the structure of the spiral spring is a double-winding structure of a shape memory alloy (Ni-Ti) spring for variable shape and a metal (Cu, Al, etc.) with high thermal conductivity for heat dissipation. Thus, higher heat dissipation efficiency is realized with the same volume.

  In order to cover low thermal conductivity (similar to stainless steel), which is one of the characteristics of shape memory alloys, a spiral spring made of a metal (Cu or Al) with high thermal conductivity is wound in parallel. Thus, space can be saved by integrating the heat radiating part and the shape variable part, and the heat radiating efficiency per unit volume can be improved.

  FIG. 18 is a diagram showing another specific example of the double winding structure of the spiral spring. The spiral spring made of a shape memory alloy can be easily manufactured by using the spiral spring for the shape variable shown in FIG. 17 and the strip spring for the heat dissipation. Most examples of manufacturing springs using shape memory alloys are helical, which are technically easy to manufacture and inexpensive.

  FIG. 19 is a graph showing the characteristics of the thermostat function of the heat sink having the spiral spring structure according to the present invention. FIG. 19 shows the characteristics of the thermostat function when the helical spring structure heat sink shown in FIG. 12 is replaced with a spiral spring structure heat sink.

  FIG. 20 is a diagram showing the characteristics of the security function of the heat sink having the spiral spring structure according to the present invention. FIG. 19 shows the characteristics of the security function when the helical spring structure heat sink shown in FIG. 13 is replaced with a spiral spring structure heat sink.

  FIG. 21 is a perspective view of a metal case that houses a heat sink having a spiral spring structure. FIG. 21A shows a state in which the spiral spring is closed, and FIG. 21B shows a state in which the spiral spring is opened. . The center C of the heat sink 221 having a spiral spring structure is fixed to the bottom of the case 228, and the heat sink 221 is accommodated in the metal case 228, so that the main body of the heat sink 221 is damaged due to external contact or impact. Can be avoided. Further, by producing the case 228 with a metal having high thermal conductivity (Cu, Al, etc.), the heat dissipation effect can be enhanced even with the same volume.

  As shown in FIG. 21A, the heat sink 221 has a structure in which the contact portion between the spiral spring 223 and the metal case 228 is filled with a heat conductive material 227. The heat conductive material 227 reduces the thermal resistance, Heat dissipation efficiency can be improved.

  With the structure shown in FIG. 21A, a heat conductive material 227 is attached to a portion that comes into contact with the metal case 228 when the first member 223 constituting the spiral spring is opened. Resistance can be lowered and heat dissipation efficiency can be improved.

  FIG. 22 is a view showing a structure in which a heat conductive material is filled between a spiral spring and a metal case, (A) is a top view, and (B) is a side view.

  As shown in FIG. 22A, the heat sink 221 has a structure in which a heat conductive material 227 is filled between the first member 223 and the metal case 228 constituting the spiral spring (curve (R on the outermost periphery of the spiral spring). ), The heat dissipation efficiency can be improved.

  FIG. 23 is a diagram showing a structure in which a metal case structure is provided with an upper lid 230 having a mesh structure made of a metal (Cu, Al, etc.) having high thermal conductivity. Heat dissipation efficiency can be improved.

  FIG. 24 is a view showing a structure in which the upper lid of the case shown in FIG. 23 is pressed by a screw with a presser spring. (A) is a top view, (B) is a side view, and (C) is a detail of a screw with a presser spring. FIG. By pressing the upper lid 230A made of aluminum mesh of the case 228 with an appropriate pressure by the screw 240 with a presser spring, the thermal resistance can be lowered and the heat radiation efficiency can be improved without disturbing the transformation of the heat sink. As shown in FIGS. 24A to 24C, the screw 240 with a presser spring improves the adhesion between the heat sink and the heat conductive material 227 below the case 228. The screw 240 with a presser spring has a spring 241, a washer 242, and a screw tap 242 for generating an appropriate pressure.

  FIG. 25 is a diagram showing the shape of the spiral spring that changes in accordance with the temperature change in the heat sink of the first specific example using the spiral spring type memory alloy of the present invention, where (A) is the shape at room temperature, (B ) Is a shape at a preset temperature, and (C) is a diagram showing a shape at an upper limit temperature.

  Unlike the helical spring type, a heat sink using a spiral spring type memory alloy can function without fixing the heat sink body, so adjust the number of heat sinks after installation to increase or decrease the heat dissipation efficiency. Can do.

  Also, in the thermostat function, once installed with the helical spring type, it cannot be easily adjusted later, but with the spiral spring type, adjustment after installation can be performed by adding or removing heat sinks with different transformation temperatures as appropriate. It becomes easy.

  As shown in FIG. 25A, the spiral spring type memory alloy is supplied from the upper insertion portion of the case and can be taken out from the lower extraction portion of the case. When the spiral spring type memory alloys in the case have different transformation temperatures, the heat dissipation effect is low at the normal temperature shape, and when the initial set temperature is reached, as shown in FIG. As shown in FIG. 25C, when the final temperature is reached, the shape is at the upper limit temperature, and the heat dissipation effect is maximized.

  FIG. 26 is a view showing a heat sink of a second specific example using the spiral spring type memory alloy of the present invention. In the case of a helical spring type heat sink, when the heat radiation area covers a wide range, a structure in which a large number of heat sinks are fixed must be provided, and the mechanism becomes complicated and the manufacturing cost increases. On the other hand, spiral spring type heat sinks can maximize their functions by adjusting the number and width of windings even in a narrow space environment if there is space in the horizontal direction. -It can be used particularly effectively in the case of implementations that are severely restricted.

  When compared with the spiral spring type, the spiral spring type heat sink can achieve the same function with a small number of heat sinks by adjusting the number of turns and the size at the time of manufacture.

(Appendix 1)
A heat sink body formed by forming a spiral structure portion with a first member of shape memory alloy and a second member for heat dissipation;
A detection unit for detecting that a part of the helical structure touches itself;
A signal sending unit that sends a predetermined signal using the detection as a trigger when the helical structure is transformed in response to a temperature rise and a part of the helical structure touches the detection unit;
A heat sink characterized by comprising:
(Appendix 2)
A plurality of pairs of the heat sink main body and the detection unit are provided,
Each of the heat sink body portions has a different transformation temperature of the spiral structure portion,
Each of the plurality of detection units performs temperature detection according to a change at a predetermined transformation temperature of each of the spiral structure units.
The heat sink according to appendix 1.
(Appendix 3)
The helical structure portion of the heat sink body is formed in a spiral shape.
The heat sink according to appendix 1 or 2.
(Appendix 4)
The spiral structure of the heat sink body is formed in a spiral shape.
The heat sink according to appendix 1 or 2.

(Appendix 5)
A heat sink main body constituted by a spiral structure portion in which a heat-dissipating metal is aligned with a shape memory alloy;
A detection unit that detects that the tip of the helical structure of the heat sink main body is touched;
A signal sending unit that sends a predetermined signal using the detection as a trigger when the helical structure extends in response to a temperature rise and the tip of the helical structure touches the detection unit;
A heat sink characterized by comprising:
(Appendix 6)
A plurality of pairs of the heat sink body part and the detection part are provided, and each heat sink body part has a different transformation temperature,
The plurality of detection units perform temperature detection step by step according to a change at a predetermined transformation temperature of each of the plurality of heat sink body units.
The heat sink according to appendix 5.
(Appendix 7)
The helical structure portion of the heat sink body is formed in a spiral shape.
The heat sink according to appendix 5 or 6.
(Appendix 8)
The spiral structure of the heat sink body is formed in a spiral shape.
The heat sink according to appendix 5 or 6.

It is a lineblock diagram showing the outline of the electric equipment provided with the heat sink concerning one embodiment of the present invention. It is a perspective view which shows the structure of the heat sink of 1st Example by this invention. It is a figure which shows the outline | summary of the heat sink comprised with the helical spring made from the shape memory alloy shown in FIG. 2, (A) which comprises the helical spring made from a shape memory alloy, (B) is a 1st member, (C) shows a 2nd member, respectively. It is a figure which shows the Example which changed the winding ratio of the helical spring which comprises the heat sink shown in FIG. (A) A 1st member and (B) which show a shape memory alloy helical spring are the figures which show a 2nd member, respectively. It is a figure which shows the Example of the heat sink which attached the plurality of the helical spring to the metal plate with high heat conductivity, and modularized it. It is a figure which shows the example which used the metal for the upper cover of the heat sink shown in FIG. It is a figure which shows the example which used the mesh-shaped cover for the upper cover of the heat sink shown in FIG. It is a figure which shows the example using the lid | cover of the structure made into the shape of a thick square rod and a rough net | network as the upper cover of the heat sink shown in FIG. It is a figure which shows the structure which affixed the heat dissipation sheet on the contact part of the heat sink and upper cover which cool the electric equipment shown in the whole FIG. It is a figure which shows the structure which affixed the heat conductive sheet on the contact part of the heat sink and the upper cover which cool the electric equipment shown to the whole FIG. It is a figure which shows the characteristic of the thermostat function of the heat sink of the helical spring structure by this invention. It is a figure which shows the characteristic of the security function of the heat sink of the helical spring structure by this invention. It is a perspective view which shows the structure of the heat sink of 2nd Example by this invention. It is a figure which shows the state which attached the heat sink of the spiral spring structure shown in FIG. 14 to components, (A) shows the state which attached the heat sink vertically to components, and (B) the state which attached the heat sink to components horizontally FIG. It is a figure which shows the structure which makes a heat sink base part movable and makes a spiral spring angle variable. It is a figure which shows the specific example of the double winding structure of a spiral spring. It is a figure which shows the other specific example of the double winding structure of a spiral spring. It is a figure which shows the characteristic of the thermostat function of the heat sink of the spiral spring structure by this invention. It is a figure which shows the characteristic of the security function of the heat sink of the spiral spring structure by this invention. It is a perspective view of the metal case which accommodates the heat sink of a spiral spring structure, (A) shows the state which the spiral spring closed, (B) is the figure which shows the state which the spiral spring opened. It is a figure which shows the structure which filled the heat conductive material in places other than the contact part of a spiral spring and a metal case, (A) is a top view, (B) is a side view. It is a figure which shows the structure which comprises the upper cover 230 of the mesh structure which made the metal case structure the metal (Cu, Al, etc.) with high heat conductivity as a raw material. It is a figure which shows the structure which pressurizes the upper cover of the case shown in FIG. 23 with the screw with a presser spring, (A) is a top view, (B) is a side view, (C) is a detailed view of the screw with a presser spring. . It is a figure which shows the shape of the spiral spring which changes according to the temperature change in the heat sink of the 1st specific example using the spiral-spring type shape memory alloy of this invention, (A) is the shape at normal temperature, (B) is a setting The shape at the time of temperature, (C) is a diagram showing the shape at the time of the upper limit temperature. It is a figure which shows the heat sink of the 2nd specific example using the spiral spring type | mold shape memory alloy of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electric equipment 11-1, 11-2, 11-3, 21, 121, 221 Heat sink 15, 25, 125 Cooling fan 16 Heat radiating plate 17 Thermal conductive sheet 22, 122 Electronic component 23, 123, 223 First component 24, 224 Second part 60 Metal plate 227 Thermal conductive material 228 Case 230 Upper lid 240 Screw with presser spring 241 Presser spring 242 Washer 243 Screw tap

Claims (4)

A heat sink body formed by forming a spiral structure portion with a first member of shape memory alloy and a second member for heat dissipation;
A detection unit for detecting that a part of the helical structure touches itself;
A signal sending unit that sends a predetermined signal using the detection as a trigger when the helical structure is transformed in response to a temperature rise and a part of the helical structure touches the detection unit;
A heat sink characterized by comprising: A plurality of pairs of the heat sink main body and the detection unit are provided,
Each of the heat sink body portions has a different transformation temperature of the spiral structure portion,
Each of the plurality of detection units performs temperature detection according to a change at a predetermined transformation temperature of each of the spiral structure units.
The heat sink according to claim 1. The helical structure portion of the heat sink body is formed in a spiral shape.
The heat sink according to claim 1 or 2. The spiral structure of the heat sink body is formed in a spiral shape.
The heat sink according to claim 1 or 2.

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