JP2008115260A - Method for fixing element - Google Patents

Method for fixing element Download PDF

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Publication number
JP2008115260A
JP2008115260A JP2006299021A JP2006299021A JP2008115260A JP 2008115260 A JP2008115260 A JP 2008115260A JP 2006299021 A JP2006299021 A JP 2006299021A JP 2006299021 A JP2006299021 A JP 2006299021A JP 2008115260 A JP2008115260 A JP 2008115260A
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Prior art keywords
thermosetting adhesive
base
housing
adhesive
heating wire
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JP5071617B2 (en
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Hirosuke Yasuda
啓輔 保田
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Toyota Motor Corp
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Toyota Motor Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Adhesives Or Adhesive Processes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for fixing elements, improving working efficiency by shortening the curing time of a thermosetting adhesive when adhering and fixing the synthetic resin elements on a metallic substrate with a thermosetting adhesive. <P>SOLUTION: A heating wire 5 is housed in a groove 4 set on a upper surface 1a of a heatsink 1 and a thermosetting adhesive 3 is coated on the upper surface 1a of the heatsink 1 along the groove 4 to cover the heating wire 5. Then, a housing 2 is pressed over the thermosetting adhesive 3 to the heatsink 1 side with a pressuring cylinder 6 so as to closely contact a lower surface 2b of the housing 2 on the upper surface 1a of the heatsink 1, then the heating wire 5 is galvanized to generate heat and the thermosetting adhesive 3 is directly heated so that the adhesive 3 is cured and the housing 2 is adhered and fixed on the heatsink 1. Thereby, the curing time of the thermosetting adhesive 3 is shortened than that of conventionals and the working efficiency is improved. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、放熱板のような金属製の基体に、ハウジングのような合成樹脂製の部材を熱硬化型接着剤で接着固定する際、熱硬化型接着剤の硬化時間を短縮させることが可能な部材の固定方法に関するものである。   The present invention can shorten the curing time of a thermosetting adhesive when a synthetic resin member such as a housing is bonded and fixed to a metal base such as a heat sink with a thermosetting adhesive. The present invention relates to a method for fixing various members.

一般に、半導体素子搭載モジュールは、半導体素子を搭載した基板に、該半導体素子からの発熱を放熱するために、金属製の放熱板が接合されており、この放熱板に、前記基板を覆うように保護する合成樹脂製のハウジングが熱硬化型接着剤によって接着固定されて構成されている。
そこで、従来から採用されている、放熱板にハウジングを熱硬化型接着剤によって接着固定する方法を図２に基いて説明する。
すなわち、従来では、図２に示すように、放熱板１の下面にホットプレート１０を接触させて配置すると共に、放熱板１の上面に熱硬化型接着剤３を塗布する。そして、ハウジング２を熱硬化型接着剤３上に載置して、そのハウジング２を加圧シリンダ６により放熱板１側に押圧し、その後、ホットプレート１０を発熱させると共に熱硬化型接着剤３を加熱し硬化させて、放熱板１にハウジング２を接着固定している。 Generally, in a semiconductor element mounting module, a metal heat radiating plate is joined to a substrate on which a semiconductor element is mounted in order to dissipate heat generated from the semiconductor element, and the heat radiating plate covers the substrate. A synthetic resin housing to be protected is bonded and fixed by a thermosetting adhesive.
Therefore, a conventional method of adhering and fixing the housing to the heat radiating plate with a thermosetting adhesive will be described with reference to FIG.
That is, conventionally, as shown in FIG. 2, the hot plate 10 is placed in contact with the lower surface of the heat radiating plate 1, and the thermosetting adhesive 3 is applied to the upper surface of the heat radiating plate 1. Then, the housing 2 is placed on the thermosetting adhesive 3, the housing 2 is pressed against the heat radiating plate 1 by the pressure cylinder 6, and then the hot plate 10 is caused to generate heat and the thermosetting adhesive 3. The housing 2 is bonded and fixed to the heat radiating plate 1.

しかしながら、熱硬化型接着剤３は、ホットプレート１０により放熱板１を介して間接的に加熱されるために、熱硬化型接着剤３を硬化させるのに時間を要し、作業効率が非常に悪かった。   However, since the thermosetting adhesive 3 is indirectly heated by the hot plate 10 via the heat radiating plate 1, it takes time to cure the thermosetting adhesive 3 and the work efficiency is very high. It was bad.

そこで、特許文献１には、接着剤樹脂を加熱して完全に硬化させる工程において、接着剤樹脂が硬化する温度に設定したホットプレート上に半導体装置を仮圧着した回路基板を置いて、接着剤樹脂を加熱し硬化することが記載されている。
国際公開第００／４５４３１号パンフレット Therefore, in Patent Document 1, in the step of heating and completely curing the adhesive resin, a circuit board on which a semiconductor device is temporarily press-bonded is placed on a hot plate set to a temperature at which the adhesive resin is cured. It describes that the resin is heated and cured.
International Publication No. 00/45431 Pamphlet

しかしながら、特許文献１の発明では、接着剤樹脂を加熱して完全に硬化させる工程において、ホットプレート上に半導体装置を仮圧着した回路基板を置き、ホットプレートを発熱させることで、接着剤樹脂を加熱し硬化させているが、図２に示す従来の形態と同様に、接着剤樹脂は、ホットプレートにより回路基板を介して間接的に加熱されるために、接着剤樹脂を硬化させるのに時間を要し、作業効率が悪化する。   However, in the invention of Patent Document 1, in the process of heating and completely curing the adhesive resin, the circuit board on which the semiconductor device is temporarily press-bonded is placed on the hot plate, and the hot plate is caused to generate heat. Although it is heated and cured, the adhesive resin is heated indirectly via the circuit board by the hot plate, as in the conventional form shown in FIG. 2, so that it takes time to cure the adhesive resin. Work efficiency is deteriorated.

本発明は、かかる点に鑑みてなされたものであり、金属製の基体に合成樹脂製の部材を熱硬化型接着剤によって接着固定する際、熱硬化型接着剤の硬化時間を短縮させて、作業効率を向上させる部材の固定方法を提供することを目的とする。   The present invention has been made in view of the above points, and when a synthetic resin member is bonded and fixed to a metal base with a thermosetting adhesive, the curing time of the thermosetting adhesive is shortened. It aims at providing the fixing method of the member which improves work efficiency.

上記課題を解決するために、本発明の部材の固定方法は、基体の上面に熱硬化型接着剤を塗布した後、該熱硬化型接着剤上に部材を載置し、その後、前記部材を前記熱硬化型接着剤上から前記基体側に押圧して、前記基体に前記部材を密着させた後、前記熱硬化型接着剤を直接加熱し硬化させて、前記基体に前記部材を接着固定することを特徴とするものである。
これにより、熱硬化型接着剤を直接加熱して硬化させるため、熱硬化型接着剤の硬化時間を短縮することができ、作業効率を向上させることができる。
なお、本発明の部材の固定方法の各種態様およびそれらの作用については、以下の（発明の態様）の項において詳しく説明する。 In order to solve the above-mentioned problems, the member fixing method of the present invention is a method in which a thermosetting adhesive is applied to the upper surface of a substrate, and then the member is placed on the thermosetting adhesive, and then the member is mounted. After pressing the thermosetting adhesive onto the substrate side to adhere the member to the substrate, the thermosetting adhesive is directly heated and cured to bond and fix the member to the substrate. It is characterized by this.
Thereby, since the thermosetting adhesive is directly heated and cured, the curing time of the thermosetting adhesive can be shortened, and the working efficiency can be improved.
Various aspects of the fixing method of the member of the present invention and their actions will be described in detail in the following (Aspect of the Invention) section.

（発明の態様）
以下に、本願において特許請求が可能と認識されている発明（以下、「請求可能発明」という場合がある。）の態様をいくつか例示し、それらについて説明する。なお、各態様は、請求項と同様に、項に区分し、各項に番号を付して、必要に応じて他の項を引用する形式で記載する。これは、あくまでも請求可能発明の理解を容易にするためであり、請求可能発明を構成する構成要素の組み合わせを、以下の各項に記載されたものに限定する趣旨ではない。つまり、請求可能発明は、各項に付随する記載、実施の形態等に参酌して解釈されるべきであり、その解釈に従う限りにおいて、各項の態様にさらに他の構成要素を付加した態様も、また、各項の態様から構成要件を削除した態様も、請求可能発明の一態様となり得るのである。なお、以下の各項において、（１）項乃至（３）項の各々が、請求項１乃至請求項３の各々に相当し、（５）項が請求項４に相当する。 (Aspect of the Invention)
In the following, some aspects of the invention that can be claimed in the present application (hereinafter sometimes referred to as “claimable invention”) will be exemplified and described. In addition, each aspect is divided into a term like a claim, it attaches | subjects a number to each term, and is described in the format which quotes another term as needed. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description, embodiment, etc. accompanying each section, and as long as the interpretation is followed, there may be a mode in which other components are added to the mode of each section. In addition, an aspect in which the constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention. In the following items, each of items (1) to (3) corresponds to each of claims 1 to 3, and item (5) corresponds to claim 4.

（１）金属製の基体に、合成樹脂製の部材を熱硬化型接着剤により接着固定する部材の固定方法であって、前記基体の上面に前記熱硬化型接着剤を塗布した後、該熱硬化型接着剤上に前記部材を載置し、その後、前記部材を前記熱硬化型接着剤上から前記基体側に押圧して、前記基体に前記部材を密着させた後、前記熱硬化型接着剤を直接加熱し硬化させて、前記基体に前記部材を接着固定することを特徴とする部材の固定方法。
従って、（１）項に記載の部材の固定方法では、熱硬化型接着剤を直接加熱して硬化させているので、熱硬化型接着剤の硬化時間を従来に比べて短縮させて、作業効率を向上させることができる。 (1) A member fixing method in which a synthetic resin member is bonded and fixed to a metal base with a thermosetting adhesive, and after the thermosetting adhesive is applied to the upper surface of the base, the heat The member is placed on a curable adhesive, and then the member is pressed onto the substrate side from the thermosetting adhesive to bring the member into close contact with the substrate, and then the thermosetting adhesion A member fixing method, wherein the agent is directly heated and cured to bond and fix the member to the substrate.
Therefore, in the member fixing method described in the item (1), since the thermosetting adhesive is directly heated and cured, the curing time of the thermosetting adhesive is shortened compared to the conventional method, and the work efficiency is improved. Can be improved.

（２）金属製の基体に、合成樹脂製の部材を熱硬化型接着剤により接着固定する部材の固定方法であって、前記基体の上面に設けた溝部に発熱手段を収容した後、前記熱硬化型接着剤を前記溝部に沿って前記発熱手段を覆うように前記基体の上面に塗布して、その後、前記熱硬化型接着剤上に前記部材を載置した後、前記部材を前記熱硬化型接着剤上から前記基体側に押圧して、前記基体に前記部材を密着させた後、前記発熱手段を発熱させることで前記熱硬化型接着剤を直接加熱し硬化させて、前記基体を前記部材に接着固定することを特徴とする部材の固定方法。
従って、（２）項に記載の部材の固定方法では、熱硬化型接着剤を基体の溝部に沿って発熱手段を覆うように基体の上面に塗布しているので、発熱手段を発熱させることで熱硬化型接着剤を直接加熱して硬化させることができ、熱硬化型接着剤の硬化時間を従来に比べて短縮させて、作業効率を向上させることができる。 (2) A member fixing method in which a synthetic resin member is bonded and fixed to a metal base with a thermosetting adhesive, and after the heat generating means is accommodated in a groove provided on the upper surface of the base, the heat A curable adhesive is applied to the upper surface of the base so as to cover the heat generating means along the groove, and then the member is placed on the thermosetting adhesive, and then the member is thermoset. After pressing the mold adhesive onto the substrate side and bringing the member into close contact with the substrate, the heat-generating adhesive is directly heated to cure the thermosetting adhesive, and the substrate is A method for fixing a member, wherein the member is adhesively fixed to the member.
Therefore, in the member fixing method described in the item (2), since the thermosetting adhesive is applied to the upper surface of the base so as to cover the heat generating means along the groove portion of the base, the heat generating means can generate heat. The thermosetting adhesive can be directly heated and cured, and the curing time of the thermosetting adhesive can be shortened as compared with the conventional one to improve the working efficiency.

（３）前記発熱手段は、前記溝部に前記熱硬化型接着剤により接着固定されることを特徴とする（２）項に記載の部材の固定方法。
従って、（３）項に記載の部材の固定方法では、発熱手段は、基体の溝部に熱硬化型接着剤を介して一体化されるので、基体に部材を接着固定した後、発熱手段を取り除く等の後処理を省くことが可能となる。 (3) The member fixing method according to (2), wherein the heat generating means is bonded and fixed to the groove portion by the thermosetting adhesive.
Therefore, in the member fixing method described in the item (3), since the heat generating means is integrated with the groove portion of the base body through the thermosetting adhesive, the heat generating means is removed after the member is bonded and fixed to the base body. It is possible to omit post-processing such as.

（４）前記発熱手段は、電熱線であることを特徴とする（２）または（３）項に記載の部材の固定方法。
従って、（４）項に記載の部材の固定方法では、発熱手段を電熱線で構成しているので、基体に設けた溝部への配置が簡易となる。 (4) The member fixing method according to (2) or (3), wherein the heat generating means is a heating wire.
Therefore, in the member fixing method described in the item (4), since the heat generating means is constituted by the heating wire, the arrangement in the groove portion provided in the base becomes simple.

（５）前記基体は、半導体素子からの発熱を放熱させる放熱板であり、また、前記部材は、前記半導体素子を覆って保護するハウジングであることを特徴とする（１）〜（４）項のいずれかに記載の部材の固定方法。
従って、（５）項に記載の部材の固定方法では、半導体素子搭載モジュールを製造する際、放熱板にハウジングを熱硬化型接着剤で接着固定する工程の作業効率が向上する。 (5) Item (1) to (4), wherein the base body is a heat radiating plate that dissipates heat generated from the semiconductor element, and the member is a housing that covers and protects the semiconductor element. The fixing method of the member in any one of.
Therefore, in the member fixing method described in the item (5), when manufacturing the semiconductor element mounting module, the work efficiency of the process of bonding and fixing the housing to the heat sink with the thermosetting adhesive is improved.

本発明によれば、金属製の基体に合成樹脂製の部材を熱硬化型接着剤によって接着固定する際、熱硬化型接着剤の硬化時間を短縮させて、作業効率を向上させる部材の固定方法を提供することができる。   According to the present invention, when a synthetic resin member is bonded and fixed to a metal base with a thermosetting adhesive, the fixing method of the member that improves the working efficiency by shortening the curing time of the thermosetting adhesive. Can be provided.

以下、本発明を実施するための最良の形態を図１に基いて詳細に説明する。なお、従来例と同一部材及び相当する部材は同一符号を使用して説明する。
本発明の実施の形態は、半導体素子搭載モジュールを製造する際、銅モリブデン等の金属製の放熱板（基体）１上に、ＰＰＳ（ポリフェニレンサルファルド）等の合成樹脂製のハウジング（部材）２を熱硬化型接着剤により接着固定する工程時、熱硬化型接着剤の硬化時間を短縮させて、作業効率を向上させるように構成したものである。
すなわち、図１に示すように、放熱板１のハウジング２が固定される上面１ａには溝部４が形成されている。この溝部４は、開口が上向きとなる断面コ字状に形成されており、後述する電熱線５が放熱板１の上面１ａから突出しないように、電熱線５を収容できる深さを有している。なお、この溝部４はＵ字状に形成されても良く、電熱線５を収容可能な形状であれば良い。
発熱手段である電熱線５は、放熱板１に設けた溝部４に収容された状態で放熱板１の上面１ａから突出しない形状に形成されており、電気抵抗が高く電流を流すことにより熱を発生させる。
なお、この実施の形態では、円形断面形状の電熱線５を使用しているが、電熱線５の断面形状は矩形断面形状などの適宜の断面形状にすることができる。また、溝部４を放熱板１の上面１ａに１ヶ所だけ設けているが複数の溝部４を設けてもよいし、放熱板１の上面１ａの側縁に沿って設けてもよい。 Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to FIG. In addition, the same member and a corresponding member as a prior art example are demonstrated using the same code | symbol.
In the embodiment of the present invention, when a semiconductor element mounting module is manufactured, a housing (member) 2 made of a synthetic resin such as PPS (polyphenylene sulfide) is placed on a heat sink (base) 1 made of metal such as copper molybdenum. In the process of bonding and fixing with a thermosetting adhesive, the curing time of the thermosetting adhesive is shortened to improve the working efficiency.
That is, as shown in FIG. 1, the groove part 4 is formed in the upper surface 1a to which the housing 2 of the heat sink 1 is fixed. The groove 4 is formed in a U-shaped cross-section with the opening facing upward, and has a depth that can accommodate the heating wire 5 so that the heating wire 5 described later does not protrude from the upper surface 1 a of the heat radiating plate 1. Yes. In addition, this groove part 4 may be formed in U shape, and should just be a shape which can accommodate the heating wire 5. FIG.
The heating wire 5 that is a heat generating means is formed in a shape that does not protrude from the upper surface 1a of the heat sink 1 while being accommodated in the groove 4 provided in the heat sink 1 and has a high electrical resistance to generate heat. generate.
In this embodiment, the heating wire 5 having a circular cross-sectional shape is used, but the cross-sectional shape of the heating wire 5 can be an appropriate cross-sectional shape such as a rectangular cross-sectional shape. Moreover, although the groove part 4 is provided only in one place in the upper surface 1a of the heat sink 1, you may provide a some groove part 4 and may provide along the side edge of the upper surface 1a of the heat sink 1. FIG.

次に、放熱板１にハウジング２を接着固定する方法を説明する。
放熱板１にハウジング２を熱硬化型接着剤３で接着固定する際には、まず、図１（ａ）に示すように、放熱板１に設けた溝部４に電熱線５を収容して、その後、熱硬化型接着剤３を溝部４に沿って該溝部４の幅長よりも幅広となるように放熱板１の上面１ａに塗布する。すると、熱硬化型接着剤３は溝部４内の電熱線５の周りに流動して電熱線５を覆うようになる。
次に、図１（ｂ）に示すように、ハウジング２を熱硬化型接着剤３上に載置して、図１（ｃ）に示すように、ハウジング２の上面２ａを加圧シリンダ６により放熱板１側に押圧して、ハウジング２の下面２ｂを放熱板１の上面１ａに密着させる。その後、電熱線５に電流を流して発熱させる。
すると、電熱線５の周回に熱硬化型接着剤３が接触しているため、熱硬化型接着剤３が電熱線５により直接加熱されて硬化し、放熱板１にハウジング２が接着固定されると共に、電熱線５が溝部４に接着固定されて放熱板１及びハウジング２と共に一体化される。この時、熱硬化型接着剤３は電熱線５により直接加熱されるため、熱硬化型接着剤３の硬化時間は、従来のホットプレート１０の加熱による硬化時間に比べて大幅に短縮される。 Next, a method for bonding and fixing the housing 2 to the heat radiating plate 1 will be described.
When the housing 2 is bonded and fixed to the heat radiating plate 1 with the thermosetting adhesive 3, first, as shown in FIG. 1A, the heating wire 5 is accommodated in the groove portion 4 provided in the heat radiating plate 1. Thereafter, the thermosetting adhesive 3 is applied to the upper surface 1 a of the heat radiating plate 1 so as to be wider than the width of the groove 4 along the groove 4. Then, the thermosetting adhesive 3 flows around the heating wire 5 in the groove 4 and covers the heating wire 5.
Next, as shown in FIG. 1B, the housing 2 is placed on the thermosetting adhesive 3, and the upper surface 2 a of the housing 2 is moved by the pressure cylinder 6 as shown in FIG. The lower surface 2b of the housing 2 is brought into close contact with the upper surface 1a of the heat sink 1 by pressing toward the heat sink 1 side. Thereafter, a current is passed through the heating wire 5 to generate heat.
Then, since the thermosetting adhesive 3 is in contact with the circumference of the heating wire 5, the thermosetting adhesive 3 is directly heated and cured by the heating wire 5, and the housing 2 is bonded and fixed to the radiator plate 1. At the same time, the heating wire 5 is bonded and fixed to the groove 4 and integrated with the heat radiating plate 1 and the housing 2. At this time, since the thermosetting adhesive 3 is directly heated by the heating wire 5, the curing time of the thermosetting adhesive 3 is greatly shortened compared to the curing time by heating the conventional hot plate 10.

以上説明した本発明の実施の形態によれば、放熱板１のハウジング２が固定される上面１ａに設けた溝部４に電熱線５を収容して、その後、熱硬化型接着剤３を、溝部４に沿って溝部４内の電熱線５を覆うように溝部４の幅長よりも幅広で基体１の上面１ａに塗布する。そして、ハウジング２を熱硬化型接着剤３上から加圧シリンダ６により放熱板１側に押圧して、ハウジング２の下面２ｂを放熱板１の上面１ａに密着させた後、電熱線５に電流を流して発熱させる。すると、熱硬化型接着剤３が電熱線５により直接加熱されて硬化し、放熱板１にハウジング２が接着固定される。   According to the embodiment of the present invention described above, the heating wire 5 is accommodated in the groove portion 4 provided on the upper surface 1a to which the housing 2 of the heat radiating plate 1 is fixed, and then the thermosetting adhesive 3 is attached to the groove portion. 4 is applied to the upper surface 1 a of the substrate 1 so as to cover the heating wire 5 in the groove 4 along the width 4 and wider than the width of the groove 4. The housing 2 is pressed onto the heat radiating plate 1 from the thermosetting adhesive 3 by the pressure cylinder 6 to bring the lower surface 2b of the housing 2 into close contact with the upper surface 1a of the heat radiating plate 1, and then the electric current is applied to the heating wire 5. To generate heat. Then, the thermosetting adhesive 3 is directly heated by the heating wire 5 to be cured, and the housing 2 is bonded and fixed to the heat radiating plate 1.

このように、本発明の実施の形態では、熱硬化型接着剤３は電熱線５により直接加熱されるため、従来よりもその硬化時間が短縮され、ひいては作業効率が向上される。しかも、従来のようにホットプレート１０を長時間設定温度に保持する必要が無いので、消費電力が従来の２／３程度に低減される。
また、熱硬化型接着剤３は、電熱線５により局所的に加熱されるので、放熱板１の部位で、加熱を避けたい部位への影響を最小限にし、放熱板１が常温に戻るまでの時間も短縮することができる。 As described above, in the embodiment of the present invention, since the thermosetting adhesive 3 is directly heated by the heating wire 5, the curing time is shortened compared to the conventional case, and the working efficiency is improved. In addition, since it is not necessary to keep the hot plate 10 at the set temperature for a long time unlike the prior art, the power consumption is reduced to about 2/3 of the prior art.
In addition, since the thermosetting adhesive 3 is locally heated by the heating wire 5, the influence on the part of the heat radiating plate 1 that is desired to avoid heating is minimized, and the heat radiating plate 1 is returned to room temperature. This time can also be shortened.

図１は、本発明の実施の形態に係る部材の固定方法を段階的に示した図である。FIG. 1 is a diagram showing stepwise a method of fixing a member according to an embodiment of the present invention. 図２は、従来の部材の固定方法を示す図である。FIG. 2 is a diagram illustrating a conventional method for fixing a member.

符号の説明Explanation of symbols

１ 放熱板（基体），２ ハウジング（部材），３ 熱硬化型接着剤，４ 溝部，５ 電熱線（発熱手段），６ 加圧シリンダ
DESCRIPTION OF SYMBOLS 1 Heat sink (base | substrate), 2 Housing (member), 3 Thermosetting adhesive, 4 Groove part, 5 Heating wire (heating means), 6 Pressure cylinder

Claims (4)

金属製の基体に、合成樹脂製の部材を熱硬化型接着剤により接着固定する部材の固定方法であって、
前記基体の上面に前記熱硬化型接着剤を塗布した後、該熱硬化型接着剤上に前記部材を載置し、その後、前記部材を前記熱硬化型接着剤上から前記基体側に押圧して、前記基体に前記部材を密着させた後、前記熱硬化型接着剤を直接加熱し硬化させて、前記基体に前記部材を接着固定することを特徴とする部材の固定方法。 A fixing method for a member that is bonded and fixed to a metal substrate with a thermosetting adhesive on a synthetic resin member,
After applying the thermosetting adhesive on the upper surface of the substrate, the member is placed on the thermosetting adhesive, and then the member is pressed from the thermosetting adhesive toward the substrate. Then, after the member is brought into close contact with the base, the thermosetting adhesive is directly heated and cured to bond and fix the member to the base. 金属製の基体に、合成樹脂製の部材を熱硬化型接着剤により接着固定する部材の固定方法であって、
前記基体の上面に設けた溝部に発熱手段を収容した後、前記熱硬化型接着剤を前記溝部に沿って前記発熱手段を覆うように前記基体の上面に塗布して、その後、前記熱硬化型接着剤上に前記部材を載置した後、前記部材を前記熱硬化型接着剤上から前記基体側に押圧して、前記基体に前記部材を密着させた後、前記発熱手段を発熱させることで前記熱硬化型接着剤を直接加熱し硬化させて、前記基体を前記部材に接着固定することを特徴とする部材の固定方法。 A fixing method for a member that is bonded and fixed to a metal substrate with a thermosetting adhesive on a synthetic resin member,
After the heat generating means is accommodated in the groove provided on the upper surface of the base, the thermosetting adhesive is applied to the upper surface of the base so as to cover the heat generating means along the groove, and then the thermosetting mold is applied. After placing the member on the adhesive, pressing the member from the thermosetting adhesive toward the base, bringing the member into close contact with the base, and then causing the heating means to generate heat. A method of fixing a member, wherein the thermosetting adhesive is directly heated and cured to bond and fix the base to the member. 前記発熱手段は、前記溝部に前記熱硬化型接着剤により接着固定されることを特徴とする請求項２に記載の部材の固定方法。   The member fixing method according to claim 2, wherein the heat generating unit is bonded and fixed to the groove portion by the thermosetting adhesive. 前記基体は、半導体素子からの発熱を放熱させる放熱板であり、また、前記部材は、前記半導体素子を覆って保護するハウジングであることを特徴とする請求項１〜３のいずれかに記載の部材の固定方法。

The said base | substrate is a heat sink which radiates the heat_generation | fever from a semiconductor element, Moreover, the said member is a housing which covers and protects the said semiconductor element, The Claim 1 characterized by the above-mentioned. Fixing method of member.

JP2006299021A 2006-11-02 2006-11-02 Fixing method of member Expired - Fee Related JP5071617B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015505945A (en) * 2011-12-16 2015-02-26 サムスン ヘビー インダストリーズ カンパニー リミテッド Auxiliary secondary barrier, liquefied natural gas storage tank including the same, and method for producing the same

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5981373A (en) * 1982-10-30 1984-05-11 Toyota Motor Corp Method for accelerating curing of thermosetting adhesive
JPS60152580A (en) * 1984-01-20 1985-08-10 Japanese National Railways<Jnr> Planar adhesive
JPS6310683A (en) * 1986-06-19 1988-01-18 アツシユランド・オイル・インコ−ポレ−テツド Adhesive composition
JPS63120786A (en) * 1986-11-08 1988-05-25 Michie Miyamoto Method of executing bonding, crosslinkable resin composite used for said method and bonding device
JPH0447090A (en) * 1990-06-13 1992-02-17 Tokai Kogyo Kk Method of fixing glass pane to window frame
JPH0582686A (en) * 1991-09-20 1993-04-02 Oki Electric Ind Co Ltd Semiconductor heat sink structure
JPH10212812A (en) * 1997-01-31 1998-08-11 Haitatsuchi Futaba:Kk Construction material and adhering method thereof
JPH10219821A (en) * 1997-02-03 1998-08-18 Haitatsuchi Futaba:Kk House and its manufacture method
JPH10223813A (en) * 1997-02-07 1998-08-21 Canon Inc Semiconductor device and its manufacture
JPH11199849A (en) * 1998-01-16 1999-07-27 Dainippon Ink & Chem Inc Adhesive composition, its production and bonding
JP2000082206A (en) * 1995-01-24 2000-03-21 Tdk Corp Method for fixing member and method for fixing magnetic head slider
JP2001040854A (en) * 1998-10-07 2001-02-13 Sekisui Chem Co Ltd Structure for attachment of building member and attachment method therefor
JP2004253689A (en) * 2003-02-21 2004-09-09 Toyota Motor Corp Manufacturing method of semiconductor device mounting module
JP2004281675A (en) * 2003-03-14 2004-10-07 Toyota Motor Corp Method for bonding heat radiator and casing
JP2004296645A (en) * 2003-03-26 2004-10-21 Toyota Motor Corp Method for curing adhesive and curing jig
JP2006143876A (en) * 2004-11-19 2006-06-08 Seiko Precision Inc Adhesive process, adhesion apparatus and compound product

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5981373A (en) * 1982-10-30 1984-05-11 Toyota Motor Corp Method for accelerating curing of thermosetting adhesive
JPS60152580A (en) * 1984-01-20 1985-08-10 Japanese National Railways<Jnr> Planar adhesive
JPS6310683A (en) * 1986-06-19 1988-01-18 アツシユランド・オイル・インコ−ポレ−テツド Adhesive composition
JPS63120786A (en) * 1986-11-08 1988-05-25 Michie Miyamoto Method of executing bonding, crosslinkable resin composite used for said method and bonding device
JPH0447090A (en) * 1990-06-13 1992-02-17 Tokai Kogyo Kk Method of fixing glass pane to window frame
JPH0582686A (en) * 1991-09-20 1993-04-02 Oki Electric Ind Co Ltd Semiconductor heat sink structure
JP2000082206A (en) * 1995-01-24 2000-03-21 Tdk Corp Method for fixing member and method for fixing magnetic head slider
JPH10212812A (en) * 1997-01-31 1998-08-11 Haitatsuchi Futaba:Kk Construction material and adhering method thereof
JPH10219821A (en) * 1997-02-03 1998-08-18 Haitatsuchi Futaba:Kk House and its manufacture method
JPH10223813A (en) * 1997-02-07 1998-08-21 Canon Inc Semiconductor device and its manufacture
JPH11199849A (en) * 1998-01-16 1999-07-27 Dainippon Ink & Chem Inc Adhesive composition, its production and bonding
JP2001040854A (en) * 1998-10-07 2001-02-13 Sekisui Chem Co Ltd Structure for attachment of building member and attachment method therefor
JP2004253689A (en) * 2003-02-21 2004-09-09 Toyota Motor Corp Manufacturing method of semiconductor device mounting module
JP2004281675A (en) * 2003-03-14 2004-10-07 Toyota Motor Corp Method for bonding heat radiator and casing
JP2004296645A (en) * 2003-03-26 2004-10-21 Toyota Motor Corp Method for curing adhesive and curing jig
JP2006143876A (en) * 2004-11-19 2006-06-08 Seiko Precision Inc Adhesive process, adhesion apparatus and compound product

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015505945A (en) * 2011-12-16 2015-02-26 サムスン ヘビー インダストリーズ カンパニー リミテッド Auxiliary secondary barrier, liquefied natural gas storage tank including the same, and method for producing the same
CN107035962A (en) * 2011-12-16 2017-08-11 三星重工业株式会社 LNG storage containers and its manufacture method
US9939111B2 (en) 2011-12-16 2018-04-10 Samsung Heavy Ind. Co., Ltd. Auxiliary secondary barrier, liquefied natural gas storage tank including same and method for manufacturing the liquefied natural gas storage tank

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