JP2008112864A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device in which long-term reliability can be improved. <P>SOLUTION: In the light-emitting device 1, a package for an LED 10 is formed by a mounting substrate 20 on which the LED chip 10 irradiating a visible light is mounted and a color converting member 70, and the LED chip 10 mounted on the mounting substrate 20 is sealed with a sealing portion 50 made of a sealing resin. The sealing portion 50 is formed of a sealing resin made of a silicone resin not containing aromatic functional group in a molecular structure. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting device using an LED chip (light emitting diode chip).

  In recent years, in a light emitting device including an LED chip and a package for the LED chip, light emitting devices capable of increasing the heat radiation from the package and increasing the light output have been researched and developed in various places (for example, Patent Document 1).

  Here, in Patent Document 1, as shown in FIG. 5, the LED chip 10 ′, the mounting substrate 20 ′ on which the LED chip 10 ′ is mounted, and the mounting surface side of the LED chip 10 ′ on the mounting substrate 20 ′. The frame body 40 ′ surrounding the LED chip 10 ′ and the LED chip 10 ′ and the two bonding wires 14 ′ and 14 ′ electrically connected to the LED chip 10 ′ inside the frame body 40 ′ are sealed. There has been proposed a light emitting device 1 ′ including a sealed portion 50 ′ made of a stopped transparent sealing resin (epoxy resin or silicone resin) (see Patent Document 1).

  The light emitting device 1 ′ shown in FIG. 5 includes a submount member 30 ′ in which the mounting substrate 20 ′ is formed of ceramics (for example, AlN) and the LED chip 10 ′ is mounted on one surface side, Cu, Al, or the like. The heat transfer plate 21 'is formed of a metal having high heat conductivity and the submount member 30' is fixed to the central portion on one surface side, and the glass epoxy substrate is fixed to the one surface side of the heat transfer plate 21 '. It is comprised by wiring board 22 'which has window hole 24' for exposing LED chip 10 'in the center part, and package for LED chips is constituted by mounting board 20' and frame 40 '. . Here, the wiring board 22 ′ is provided with a pair of wiring patterns 23 ′ and 23 ′ for supplying power to the LED chip 10 ′ on the surface opposite to the heat transfer plate 21 ′, as shown in FIG. A cathode electrode (not shown) provided on the upper surface of the LED chip 10 ′ is directly connected to one wiring pattern 23 ′ via a bonding wire 14 ′, and an anode electrode (not shown) provided on the lower surface of the LED chip 10 ′. (Not shown) is connected to the other wiring pattern 23 ′ via an electrode pattern (not shown) formed on one surface of the submount member 30 ′ and a bonding wire 14 ′.

  By the way, the above-mentioned Patent Document 1 describes that white light can be emitted by using a LED chip 10 ′ that emits blue light and containing a YAG phosphor in the sealing portion 50 ′. ing. It also describes that a reflective film made of a metal film is provided on the inner peripheral surface of the frame 40 '. It has been proposed to employ Ag or Ni, which is a metal having a high blue light reflectance, as the material of the metal film constituting this type of reflective film (see, for example, Patent Document 2). Here, Patent Document 2 also describes that the frame is formed of a metal such as Al or Cu and used as a reflecting member.

Further, as in the light emitting device 1 ′ shown in FIG. 5, when the LED chip 10 ′ is bonded to the electrode pattern on the one surface side of the ceramic submount member 30 ′, the submount member 30 ′ By providing a reflective film made of a metal such as Al, Ag, or Ni around the electrode pattern on the one surface, light emitted from the side surface of the LED chip 10 ′ is absorbed by the submount member 30 ′. In order to prevent this, it is conceivable to further increase the optical output.
Japanese Patent Laying-Open No. 2006-5290 (paragraphs [0020], [0011]-[0015], and FIGS. 5 and 1) Japanese Patent Laying-Open No. 2005-294292 (paragraph [0033] and FIG. 1)

  By the way, in light-emitting device 1 'provided with sealing part 50' which consists of sealing resin which sealed LED chip 10 'as mentioned above, when used for a long term, the transmittance | permeability of sealing part 50' is gradually. Although there is a concern that the luminous flux decreases due to the decrease, the decrease in the transmittance of the sealing portion 50 ′ is caused by the decomposition of the sealing resin due to light, heat, moisture, etc. Under these conditions, the decomposition reaction of the sealing resin is likely to occur during energization, so there was a problem in long-term reliability.

  Here, the inventors of the present application include an LED chip that emits blue light, a mounting substrate having a submount member made of AlN, and a gel-like sealing portion formed of silicone resin. For light-emitting devices that have a reflective film made of an Al film on one surface, silicone resin with an increased refractive index is sealed by including an aromatic functional group in the molecular structure for the purpose of improving light extraction efficiency. For the resin used, a reliability acceleration test was performed under the conditions of temperature: 85 ° C., relative humidity: 85% RH, intermittent energization, and analysis results using an optical microscope, SEM, XPS, SIMS, AES, XMA, etc. As a result of examining the cause of the decrease in luminous flux based on the above, when Al is deposited on the light extraction surface of the LED chip, the sealing portion in the vicinity of the light extraction surface is blackened Was obtained cormorants findings (as an example in FIG. 6 shows a photograph of a state where blackened portion X on the light extraction surface of the LED chip 10 is formed in the sealing portion 50). In addition, the inventors of the present application also made the sealing portion black when a reliability acceleration test under the same conditions was performed on a light emitting device employing Ag as a material of the reflective film formed on one surface of the submount member. I got the knowledge that happens.

  In addition, the light emitting device of Comparative Example 1 provided with a gel-like sealing portion formed of a silicone resin containing a dimethyl group in the molecular structure, and a rubber-like shape formed of a silicone resin containing a dimethyl group in the molecular structure Acceleration test for each of the light emitting device of Comparative Example 2 provided with the sealing part and the light emitting device of Comparative Example 3 provided with a gel-like sealing part formed of a silicone resin containing a phenyl group in the molecular structure. As a result, in the light emitting device of Comparative Example 3, the light output decreased due to the coloring of the sealing portion, whereas in each of the light emitting devices of Comparative Examples 1 and 2, coloring of the sealing portion did not occur. There wasn't.

  Therefore, the inventors of the present application have encapsulated a case where Al or Ag, which is frequently used for wiring materials, electrode materials, substrate materials, reflective film materials, etc., is used as a material for a portion in contact with a sealing portion in a package. As the mechanism of blackening of the stop portion, (1) “When the LED chip is energized, the metal in the part in contact with the sealing portion in the package elutes into the sealing portion as metal ions, and the inside of the sealing portion "Diffusion movement", (2) "Particularly promoted decomposition of the sealing resin by the metal ions on the light extraction surface side of the LED chip with strong light energy, resulting in coloring", (3) "Part colored in the sealing part Absorbs light from the LED chip and locally generates heat ”, (4)“ decomposition of the sealing resin is promoted in the generated heat portion, and a colored portion spreads ”, (5)“ (3) → (4 ) → (3) → (4) → · The sealing portion is blackened by occurring chained ", considering the mechanism of.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide a light emitting device capable of improving long-term reliability.

  The invention of claim 1 includes an LED chip that emits visible light, a package for the LED chip, and a sealing portion that seals the LED chip mounted on a predetermined portion of the package, It is characterized by being formed of a sealing resin made of a silicone resin that does not contain an aromatic functional group in the molecular structure.

  According to this invention, since the sealing part which sealed the LED chip mounted in the predetermined site | part of the package is formed with sealing resin which consists of silicone resin which does not contain an aromatic functional group, sealing is carried out. Absorption of visible light does not occur only by decomposing the resin, so that blackening of the sealing portion is difficult to occur, and long-term reliability can be improved.

  In the invention of claim 1, there is an effect that long-term reliability can be improved.

  Hereinafter, the light-emitting device 1 of the present embodiment will be described with reference to FIGS.

  The light emitting device 1 of the present embodiment includes an LED chip 10 that emits visible light (blue light in the present embodiment), a mounting substrate 20 on which the LED chip 10 is mounted, and a distribution of light emitted from the LED chip 10. An optical member that controls light and is a dome shape made of a translucent material fixed to one surface side (the upper surface side in FIG. 1) of the mounting substrate 20 so as to house the LED chip 10 between the mounting substrate 20. Of the optical member 60 and the space surrounded by the optical member 60 and the mounting substrate 20, and the LED chip 10 and the two bonding wires 14 and 14 electrically connected to the LED chip 10 are sealed. Different from the emission color of the LED chip 10 when excited by the light emitted from the LED chip 10 and transmitted through the sealing part 50 and the optical member 60. A dome shape formed of a fluorescent material that emits light of a color and a light-transmitting material and disposed around the optical member 60 between the mounting substrate 20 and the one surface side of the mounting substrate 20. The color conversion member 70 is provided. Here, the color conversion member 70 is disposed so that an air layer 80 is formed between the light emitting surface 60 b of the optical member 60 on the one surface side of the mounting substrate 20. In the present embodiment, the mounting substrate 20 and the color conversion member 70 constitute a package for the LED chip 10, and the sealing unit 50 seals the LED chip 10 mounted on a predetermined portion of the package. .

  The light-emitting device 1 of this embodiment is used as a light source of a lighting fixture, for example. For example, a resin sheet containing a filler made of a filler such as silica or alumina and having a low viscosity when heated (for example, a fused silica having a high viscosity). Light is emitted by bonding to an instrument body 100 made of metal (for example, metal having high thermal conductivity such as Al and Cu) through an insulating layer 90 formed of an organic green sheet such as a filled epoxy resin sheet. Compared with a case where a rubber sheet-like heat radiation sheet such as Sarcon (registered trademark) is sandwiched between the apparatus 1 and the instrument body 100, the thermal resistance from the LED chip 10 to the instrument body 100 can be reduced. Since heat dissipation is improved and the temperature rise of the junction temperature of the LED chip 10 can be suppressed, the input power can be increased and the light output can be increased. That. Here, when used as a light source of a lighting fixture, a plurality of light emitting devices 1 are mounted on the fixture main body 100 so that a desired light output is obtained, and the plurality of light emitting devices 1 are connected in series or in parallel. You can do it.

  The LED chip 10 is a GaN-based blue LED chip that emits blue light. An anode electrode (not shown) is formed on one surface side in the thickness direction (the lower surface side in FIG. 1), and the other in the thickness direction. A cathode electrode (not shown) is formed on the surface side (upper surface side in FIG. 1), and the other surface side is the light extraction surface side, but blue light is also emitted from the side surface. Here, the anode electrode and the cathode electrode are formed of a laminated film of a lower layer Ni film and an upper layer Au film.

  The mounting substrate 20 is formed of a heat conductive material and the submount member 30 on which the LED chip 10 is mounted on one surface side, and the submount member 30 is fixed to the central portion on the one surface side (upper surface side in FIG. 1). A rectangular plate-shaped heat transfer plate 21 and a central portion formed by a rectangular plate-shaped flexible printed wiring board fixed to the one surface side of the heat transfer plate 21 via, for example, a polyolefin-based fixing sheet 29 (see FIG. 2). And a wiring board 22 having a rectangular window hole 24 through which the submount member 30 is exposed. Therefore, the heat generated in the LED chip 10 is transferred to the submount member 30 and the heat transfer plate 21 without passing through the wiring board 22.

  The heat transfer plate 21 is based on a metal plate made of Cu, and a coating film 21a made of an Au film is formed on one surface side (the lower surface side in FIG. 1) of the metal plate, and the other surface side (see FIG. 1 is formed with a coating film 21b made of an Au film.

  On the other hand, the wiring substrate 22 is provided with a pair of wiring patterns 23 and 23 for feeding power to the LED chip 10 on one surface side of an insulating base material 22a made of a polyimide film. A resist layer 26 made of a white resin covering a portion where the wiring patterns 23, 23 are not formed in the conductive base material 22a is laminated. Therefore, since the light emitted from the side surface of the LED chip 10 and incident on the surface of the resist layer 26 is reflected by the surface of the resist layer 26, the light emitted from the LED chip 10 is prevented from being absorbed by the wiring substrate 22. Thus, the light output can be improved by improving the light extraction efficiency to the outside. Here, in the LED chip 10, the cathode electrode is electrically connected to one wiring pattern 23 via the bonding wire 14, and the anode electrode is connected to the other via the electrode pattern 31 of the submount member 30 and the bonding wire 14. The wiring pattern 23 is electrically connected. Each of the wiring patterns 23 and 23 is formed in an outer peripheral shape slightly smaller than half of the outer peripheral shape of the insulating base material 22a. Further, FR4, FR5, paper phenol or the like may be employed as the material of the insulating base material 22a.

  The resist layer 26 is patterned so that two portions of each wiring pattern 23, 23 are exposed in the vicinity of the window hole 24 of the wiring substrate 22 and one portion of each wiring pattern 23, 23 is exposed in the peripheral portion of the wiring substrate 22. In each wiring pattern 23, 23, a portion exposed in the vicinity of the window hole 24 of the wiring substrate 22 constitutes a terminal portion 23 a to which the bonding wire 14 is connected, and a circle exposed at the peripheral portion of the wiring substrate 22. The part of the shape constitutes an electrode part 23b for external connection. In addition, the wiring patterns 23 and 23 of the wiring board 22 are comprised by the laminated film of Cu film | membrane, Ni film | membrane, and Au film | membrane, and the uppermost layer is Au film | membrane. In addition, a sign “+” is formed on the electrode portion 23b of the two electrode portions 73b to which the anode electrode of the LED chip 10 is electrically connected, and the cathode electrode of the LED chip 10 is electrically connected. Since the display of “−” is formed on the electrode portion 23b, the polarities of both the electrode portions 23b and 23b in the light emitting device 1 can be visually recognized, and erroneous connection can be prevented.

  The submount member 30 is made of AlN having a relatively high thermal conductivity and electrical insulation, and has a planar size larger than the chip size of the LED chip 10. A stress relieving function that relieves stress acting on the LED chip 10 due to a difference in linear expansion coefficient with the LED chip 10, and heat generated in the LED chip 10 in a range wider than the chip size of the LED chip 10 in the heat transfer plate 21 It has a heat conduction function to transfer heat to the. Therefore, in the light emitting device 1 of the present embodiment, the stress acting on the LED chip 10 due to the difference in linear expansion coefficient between the LED chip 10 and the heat transfer plate 21 can be relieved, and the heat generated in the LED chip 10 can be reduced. Can be efficiently radiated through the submount member 30 and the heat transfer plate 21.

  In the present embodiment, AlN having a relatively high thermal conductivity and insulating properties is adopted as the material of the submount member 30, but the material of the submount member 30 is not limited to AlN, for example, composite SiC, Si Etc. may be adopted. Further, the electrode pattern 31 is formed on one surface side of the submount member 30 to be joined to the anode electrode that is an electrode on the submount member 30 side of the LED chip 10, and the LED pattern 31 is surrounded by the LED pattern 31. A reflective film 32 that reflects light emitted from the side surface of the chip 10 is formed. Therefore, the light emitted from the side surface of the LED chip 10 can be prevented from being absorbed by the submount member 30, and the light extraction efficiency to the outside can be further increased. Here, the electrode pattern 31 is formed of an alloy of Au and Sn containing Au as a main component (for example, 80Au-20Sn, 70Au-30Sn, etc.). The reflective film 32 is made of Al, but is not limited to Al, and may be made of Ag, Ni, Au, or the like.

  In the light emitting device 1 of the present embodiment, the thickness dimension of the submount member 30 is set so that the surface of the submount member 30 is farther from the heat transfer plate 21 than the surface of the resist layer 26 of the wiring board 22. In addition, light emitted from the LED chip 10 to the side can be prevented from being absorbed by the wiring board 22 through the inner peripheral surface of the window hole 24 of the wiring board 22.

  As the sealing resin that is the material of the sealing portion 50 described above, a silicone resin that does not contain an aromatic functional group is used.

  The optical member 60 is a molded product of a translucent material (for example, silicone resin) and is formed in a dome shape. Here, in this embodiment, since the optical member 60 is formed of a silicone resin molded product, the difference in refractive index and the linear expansion coefficient between the optical member 60 and the sealing portion 50 can be reduced.

  By the way, the optical member 60 has a light emitting surface 60b formed in a convex curved surface shape that does not totally reflect the light incident from the light incident surface 60a at the boundary between the light emitting surface 60b and the air layer 80 described above. 10 and the optical axis coincide with each other. Therefore, the light emitted from the LED chip 10 and incident on the light incident surface 60a of the optical member 60 can easily reach the color conversion member 70 without being totally reflected at the boundary between the light emitting surface 60b and the air layer 80, The total luminous flux can be increased. The light emitted from the side surface of the LED chip 10 propagates through the sealing portion 50, the optical member 60, and the air layer 80 to reach the color conversion member 70 to excite the phosphor of the color conversion member 70 or to the phosphor. Passes through the color conversion member 70 without colliding. Further, the optical member 60 is formed so that the thickness is uniform along the normal direction regardless of the position.

  The color conversion member 70 is a mixture of a translucent material such as a silicone resin and a particulate yellow phosphor that emits broad yellow light when excited by the blue light emitted from the LED chip 10. It is comprised by the molded article (that is, the color conversion member 70 is formed with the fluorescent substance and the translucent material). Therefore, in the light emitting device 1 of the present embodiment, the blue light emitted from the LED chip 10 and the light emitted from the yellow phosphor are emitted through the outer surface 70b of the color conversion member 70, and white light is obtained. Can do. The translucent material used as the material of the color conversion member 70 is not limited to a silicone resin, but, for example, an epoxy resin, an acrylic resin, glass, an organic material in which an organic component and an inorganic component are mixed and bonded at the nm level or the molecular level. -Inorganic hybrid materials may be used. Further, the phosphor mixed with the translucent material used as the material of the color conversion member 70 is not limited to the yellow phosphor. For example, white light can be obtained by mixing a red phosphor and a green phosphor.

  Here, the color conversion member 70 has an inner surface 70 a formed along the light emitting surface 60 b of the optical member 60. Therefore, the distance between the light emitting surface 60b and the inner surface 70a of the color conversion member 70 in the normal direction is a substantially constant value regardless of the position of the light emitting surface 60b of the optical member 60. In addition, the color conversion member 70 is shape | molded so that the thickness along a normal line direction may become uniform irrespective of a position. In addition, the color conversion member 70 may be fixed to the mounting substrate 20 with an end edge (periphery of the opening) on the mounting substrate 20 side using, for example, an adhesive (for example, silicone resin, epoxy resin).

  In the method of manufacturing the light emitting device 1 described above, for example, after the LED chip 10 and the wiring patterns 23 and 23 are electrically connected through the bonding wires 14 and 14, respectively, the nozzle of the dispenser for sealing resin injection A part of the sealing portion 50 is inserted in the gap between the submount member 30 and the wiring board 22 so that the tip of the wiring board 22 is aligned with the resin injection hole 28 (see FIG. 3) formed continuously to the window hole 24 of the wiring board 22. After injecting the liquid silicone resin that is the basis of the liquid, the resin is cured. After that, the liquid silicone resin that is the basis of the remaining portion of the sealing portion 50 is injected into the inside of the dome-shaped optical member 60. The optical member 60 is disposed at a predetermined position on the mounting substrate 20 and the silicone resin is cured to form the gel-like sealing portion 50. At the same time, the optical member 60 is mounted on the mounting substrate 2. A manufacturing method in which the color conversion member 70 is fixed to the mounting substrate 20 and then the color conversion member 70 may be considered. However, even with such a manufacturing method, there is a possibility that bubbles (voids) may be generated in the sealing portion 50 in the manufacturing process. Therefore, it is necessary to inject a large amount of liquid silicone resin into the optical member 60.

  However, when such a manufacturing method is adopted, a part of the liquid silicone resin overflows from a space surrounded by the optical member 60 and the mounting substrate 20 when the optical member 60 is disposed at the predetermined position on the mounting substrate 20. The light emitting device 1 as a whole due to light absorption at an unnecessary portion made of the overflowed silicone resin, diffused reflection of light caused by unevenness of the unnecessary portion, etc. It is conceivable that the efficiency decreases.

  Therefore, in the light emitting device 1 of the present embodiment, between the portion overlapping the ring-shaped end edge of the optical member 60 and the portion overlapping the ring-shaped end edge of the color conversion member 70 on the one surface of the mounting substrate 20, A plurality of resin reservoir holes 27 for storing the silicone resin overflowing from the space surrounded by the optical member 60 and the mounting substrate 20 are formed apart from each other in the outer peripheral direction of the optical member 60. Here, the resin reservoir hole 27 includes a through hole 27 a formed in the wiring substrate 22 and a recess 27 b formed in a portion corresponding to the through hole 27 a in the heat transfer plate 21, and the thickness of the wiring substrate 22. Even if the thickness of the resin reservoir 27 is reduced, the depth of the resin reservoir hole 27 can be increased, and the amount of silicone resin that can be stored in the resin reservoir hole 27 can be increased. Since the cured silicone resin functions as a heat insulating portion that prevents heat transfer from the LED chip 10 to the color conversion member 70, the temperature increase of the color conversion member 70 due to heat generation of the LED chip 10 can be suppressed. It is possible to suppress a decrease in luminous efficiency of the phosphor due to the heat generation.

  Further, in the light emitting device 1 of the present embodiment, the one surface side of the mounting substrate 20 is between the portion overlapping the ring-shaped end edge of the optical member 60 and the portion overlapping the ring-shaped end edge of the color conversion member 70. A ring-shaped light absorption preventing substrate 40 that is disposed and covers each resin reservoir hole 27 is provided, and light absorption by a resin portion made of a sealing resin that has accumulated and cured in each resin reservoir hole 27 This can be prevented by the absorption preventing substrate 40. Here, the light absorption preventing substrate 40 is provided with a white resist layer that reflects light from the LED chip 10 and the color conversion member 70 on the surface side opposite to the mounting substrate 20 side. Light absorption can be prevented. The light absorption preventing substrate 40 is filled with the sealing resin overflowing when the optical member 60 is arranged at a predetermined position on the mounting substrate 20 in each resin reservoir hole 27, and What is necessary is just to mount on the said one surface side, and when hardening a silicone resin after that, it will adhere to the mounting board | substrate 20 with a silicone resin. Here, the ring-shaped light absorption preventing substrate 40 is formed with a plurality of notches 42 for exposing the minute regions of the resin reservoir holes 27, and the silicone resin in the resin reservoir holes 27 is cured. It is possible to prevent the occurrence of voids.

  In the light emitting device 1 of the present embodiment described above, the heat generated in the LED chip 10 can be radiated through the submount member 30 and the heat transfer plate 21 as described above, so the conventional example shown in FIG. The heat dissipation can be improved in the same manner as described above, and the temperature rise of the junction temperature of the LED chip 10 can be suppressed, so that the input power can be increased and the light output can be increased.

  By the way, when the sealing part 50 is formed by a sealing resin made of a silicone resin containing an aromatic functional group in the molecular structure, when the sealing resin is decomposed, the aromatic functional group causes visible light. Is absorbed, so that the sealing portion 50 is likely to be colored. On the other hand, since the decomposition of the sealing resin is promoted by Al diffused and moved to the light extraction surface side of the LED chip 10, the sealing portion 50 is blackened. However, in the light emitting device 1 of the present embodiment, the sealing portion 50 that seals the LED chip 10 mounted on a predetermined portion of the package is made of a silicone resin that does not contain an aromatic functional group. Since the resin is formed, visible light absorption does not occur just by disassembling the sealing resin. Therefore, blackening of the sealing portion 50 hardly occurs, and long-term reliability can be improved.

  In the above-described embodiment, the LED chip 10 having an anode electrode formed on one surface side and a cathode electrode formed on the other surface side is employed. However, the structure and mounting form of the LED chip 10 are as follows. There is no particular limitation, and an LED chip capable of setting the one surface side on which the anode electrode is formed as the light extraction surface side may be employed, or the anode electrode and the cathode electrode are formed on the same surface side. A thing may be adopted. Further, the light emission color of the LED chip 10 is not limited to blue, and may be, for example, red or green. That is, the material of the light emitting portion of the LED chip 10 is not limited to the GaN-based compound semiconductor material, and for example, a GaAs-based compound semiconductor material or a GaP-based compound semiconductor material may be employed according to the emission color of the LED chip 10. . In addition, when the difference in linear expansion coefficient between the LED chip 10 and the mounting substrate 20 is relatively small, the submount member 30 described in the above embodiment is not necessarily provided.

  In the light emitting device 1 of the above-described embodiment, the LED chip 10 having a chip size of 1 mm □ is used and one LED chip 10 is disposed on the submount member 30. However, the chip size of the LED chip 10 is not limited. The number of LED chips 10 is not particularly limited. For example, a plurality of LED chips 10 are arranged on one submount member 30 by adopting an LED chip 10 having a chip size of 0.3 mm □. The plurality of LED chips 10 may be connected in series via the electrode pattern 31 and bonding wires.

It is a schematic sectional drawing of the light-emitting device which shows embodiment. It is a principal part schematic disassembled perspective view of the lighting fixture using the light-emitting device same as the above. It is a general | schematic disassembled perspective view of a light-emitting device same as the above. It is a schematic perspective view of the submount member in the light emitting device same as above. It is a schematic sectional drawing which shows a prior art example. This is a color print of a photograph of a light emitting device with a blackened sealing part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 10 LED chip 14 Bonding wire 20 Mounting board 21 Heat-transfer board 22 Wiring board 23 Wiring pattern 30 Submount member 31 Electrode pattern 32 Reflective film 50 Sealing part 60 Optical member 70 Color conversion member

Claims (1)

  An LED chip that emits visible light, a package for the LED chip, and a sealing portion that seals the LED chip mounted on a predetermined portion of the package, the sealing portion being aromatic in the molecular structure A light emitting device comprising a sealing resin made of a silicone resin not containing a functional group.

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