JP2008109020A - Multiple chip component and substrate mounted with multiple chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiple chip part capable of suppressing the generation of cracks causing changes in the characteristics and leakage, reducing the stresses generated in a multiple capacitor, and reducing the fluctuations of the capacitance in the capacitor. <P>SOLUTION: In the multiple chip part, a plurality of units composed of external electrodes, electrically connected to an element where a plurality of ceramic layers and a plurality of internal electrodes are laminated are put side by side in ceramic sintered compacts and are then surface-mounted in the external electrode, wherein void portions where the ceramic layers are not provided are formed substantially vertically on surface to be surface mounted between the units. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a multiple chip component having a plurality of elements formed therein and a multiple chip mounting substrate having a surface mounted on the substrate.

  Along with miniaturization of electronic devices, miniaturization and high-density mounting of electronic components are being promoted. For example, for capacitors and noise filters, ultra-small monolithic ceramic parts such as 1608 type, 1005 type, and 0804 type have been developed, and a circuit in which many of these ultra-small monolithic ceramic products are mounted on a printed circuit board. A substrate is realized.

In addition, in order to mount a multilayer ceramic component at a high density, a multiple chip component in which a plurality of capacitors and noise filters are integrated is also used. In the multi-chip component, one ceramic laminate is formed by laminating a plurality of ceramic layers and a plurality of internal electrodes, and external electrodes electrically connected to the internal electrodes are formed. A via-hole conductor that connects the internal electrodes to each other is formed, and a plurality of elements such as capacitors and noise filters that are independent of each other are formed by the internal electrode and the via-hole conductor. When mounting a plurality of chip components, the adjacent electrodes may not be brought into contact with each other in the process of mounting the chip components, or the adjacent electrodes may be short-circuited during mounting by a connection conductor such as solder. Use multiple chip components because the clearance that does not cause a short circuit between elements built in multiple chip components is narrower than the clearance between adjacent chip components that is necessary to prevent this short circuit. However, the area occupied on the printed circuit board can be reduced, and the area of the circuit board can be reduced. Further, since the number of chip parts is reduced and the mounting time is shortened, the mounting cost can be reduced. The multiple capacitor is described in Patent Document 1, for example. A multiple noise filter is described in Patent Document 2, for example.
Japanese Patent Application No.6-283383 Japanese Patent Application No. 8-330138

  However, the multiple chip parts are larger in size than chip parts that are not multiple, and the size of the external electrode is smaller than chip parts of the same size that are not multiple. In the mounted printed circuit board, the printed circuit board bends due to vibration, drop, thermal expansion coefficient difference, etc., stress is applied to the multiple chip parts, cracks are generated in the multiple chip parts, characteristic changes and leakage occur There was a problem. In addition, the multi-capacitor has a problem that the capacitance of the capacitor to which stress is applied fluctuates.

  It is an object of the present invention to suppress the occurrence of cracks that cause characteristic changes and leaks, reduce the stress generated in the multiple capacitors, and reduce the variation in the capacitance of the capacitors. To provide chip parts.

  In the multiple chip component of the present invention, a plurality of units each composed of an element in which a plurality of ceramic layers and a plurality of internal electrodes are stacked and an external electrode electrically connected to the internal electrode of the element are connected. A multiple chip component that is provided on the surface of a substrate and is provided with a gap formed between adjacent units in the stacking direction of the ceramic layers.

  It is preferable that the said space | gap part has penetrated between the surfaces which the said multiple chip components oppose.

  When the adjacent units among the units of the multiple chip component and the gap formed therebetween are viewed from the direction in which the adjacent units are connected, the elements of the adjacent units are It is preferable that it is located inside.

  It is preferable that the end of the gap portion located at the connecting portion of the unit is sharp.

  It is preferable that a groove is formed on the outer surface of the connection portion corresponding to the sharp end of the gap.

  It is preferable that the end of the gap portion on the surface-mounted side is extended in parallel with the surface-mounted surface near the surface-mounted surface from the element.

  It is preferable that the element is a filter element, and the ground electrodes formed by the respective internal electrodes and external electrodes of the filter element are formed electrically independently.

  The multiple chip mounting substrate of the present invention is characterized in that the external chip of the multiple chip component and an electrode formed on the substrate are connected, and the multiple chip component is surface-mounted on the substrate. To do.

  According to the multiple chip component of the present invention, a plurality of units each composed of an element in which a plurality of ceramic layers and a plurality of internal electrodes are stacked and an external electrode electrically connected to the internal electrode of the element are connected. A multi-chip component that is mounted on the surface of the substrate and that is provided on the board, and the multi-chip component is printed by forming a gap between the adjacent units in the stacking direction of the ceramic layers. After surface mounting on a substrate such as a substrate, when an external substrate is bent and stress is applied to the multiple chip component, cracks generated in the ceramic sintered body propagate through the gap between the units, Even if a crack occurs, it is possible to prevent the internal electrode of each unit from being disconnected and greatly affecting the electrical characteristics. In addition, by generating cracks, it is possible to reduce the stress generated in the multiple chip parts, and it is possible to reduce fluctuations in electrical characteristics caused by the stress.

  Further, when the substrate on which the multiple chip component of the present invention is mounted is bent, the gap portion penetrates between the opposing surfaces of the multiple chip component. The position where the large stress is generated can be around the gap, the crack generation position and the propagation direction can be controlled more accurately, and the disconnection of the internal electrode of the unit can be suppressed.

  Further, when the adjacent units among the units of the multiple chip component and the gap formed between them are viewed from the direction in which the adjacent units are connected, the elements of the adjacent units are not in the gap. When the crack is generated, it is possible to more accurately control the direction of progress of the crack when the crack is generated. Even if it changes greatly, it can suppress that the internal electrode of the said unit breaks.

  In addition, since the end of the gap located at the connection portion of the unit is sharp, the cracked portion can be more reliably set as the end of the gap, and therefore, in a multiple chip component. When a stress is generated and a crack is generated, the generation position and direction of the crack can be controlled more accurately, and disconnection of the internal electrode of the unit can be suppressed.

  In addition, since the groove is formed on the outer surface of the connection portion corresponding to the sharp end of the gap portion, the position of the crack that is known from the outer surface portion of the multiple chip part can be controlled more reliably, and the crack Even when the progress direction of a crack changes greatly when progressing to a portion without a portion, it is possible to suppress disconnection of the internal electrode of the unit.

  In addition, since the end of the gap portion on the surface-mounted side is extended in parallel with the surface-mounted surface near the surface-mounted surface from the element, the cracks of the external electrode Even if it occurs from the outer surface of the ceramic sintered body such as the edge, the crack that propagates from the outer surface to the inside of the multiple chip component hits the gap that spreads horizontally before reaching the element, and the crack is the element Therefore, even if it occurs more frequently, the direction of crack propagation can be controlled.

  In addition, the element is a filter element, and the ground electrodes formed by the internal electrode and the external electrode of the filter element are formed independently of each other, so that each filter element is divided. Even if a crack occurs, the ground electrode and external electrode of each filter element can be kept electrically connected to the printed circuit board on which they are mounted, and the ground that occurs when the ground is not independent The fluctuation of the filter characteristics due to the fluctuation of the connection state can be suppressed.

  In the multiple chip mounting substrate of the present invention, the external chip of the multiple chip component is connected to the electrode formed on the substrate, and the multiple chip component is surface-mounted on the substrate. When stress is applied to the multiple chip parts due to bending, the cracks generated in the ceramic sintered body progress through the gaps between the units, so even if cracks occur, the internal electrodes of each unit It can suppress that a disconnection and a big influence on an electrical property arise.

  The present invention will be described with reference to the accompanying drawings.

  FIG. 5 is a schematic perspective view of the multiple chip component of the present invention, and FIG. 14 is a schematic perspective view of a part of the multiple chip mounting substrate having the multiple chip component surface-mounted on the substrate.

  In the multiple chip component 90, external electrodes 47 a to 50 a and 47 b to 50 b are formed on the ceramic sintered body 46. The external electrodes 47 a to 50 a and 47 b to 50 b are connected to the electrode 47 d formed on the substrate 91 by a connection conductor 47 e such as solder or conductive resin, so that the multiple chip component 90 is surface-mounted on the substrate 91. The

  FIG. 7A is a cross-sectional view taken along the line A-A ′ of the multiple chip part 76 of FIG. 5. In the multichip component 90, ceramic layers 1, 23, 27 and internal electrodes 2 to 5 are laminated, and an element 33 is formed by the ceramic layer 9 and the internal electrode 2. Similarly, elements 34 to 36 are formed on the multiple chip component 90. Examples of the elements 33 to 36 include capacitors, coils, noise filters, high-pass filters, and low-pass filters. In order to form such an element, a via-hole conductor may be provided to electrically connect layers between the plurality of internal electrodes 2 and 10 and the like.

  Some of the internal electrodes of the element 33 are connected to the external electrodes 77a and 77b. By connecting the external electrodes 47a and 47b to the electrodes of the substrate, the substrate can utilize the electrical characteristics of the element 33. A group capable of realizing an electrical function by combining the element 33 composed of the internal electrode 2 and the ceramic layer 1 and the external electrodes 47a and 47b is called a unit. The multiple chip component 90 is provided with four units connected to each other, and gaps 30 to 32 are formed between the units. The gaps 30 to 32 are formed in the stacking direction of the ceramic layers of the multiple chip component 90. This also means that the gaps 30 to 32 are formed perpendicular to the surface to be surface-mounted on the substrate.

  The substrate receives various forces from the usage environment. For example, vibration, impact due to dropping, and thermal stress when mounted on a housing made of a material having a different coefficient of thermal expansion. Since the substrate is easily deformed when it is a printed circuit board or the like, the substrate is bent and stress is applied to the multiple chip component 90 that is surface-mounted on the substrate. Further, since the substrate is not easily deformed when it is a ceramic circuit substrate or the like, the impact is directly applied to the multiple chip component 90 that is surface-mounted on the substrate.

  When force is applied to the multiple chip component 90 from the substrate, the multiple chip component cracks, and when the internal electrode 2 is cut, the electrical characteristics of the element may be impaired. At that time, the cracks generated in the ceramic sintered body due to the gaps 30 to 32 progress through the gaps between the units, so even if the cracks occur, the internal electrodes of each unit are disconnected. It is possible to suppress a great influence on the electrical characteristics. In addition, by generating cracks, it is possible to reduce the stress generated in the multiple chip components, and it is possible to reduce fluctuations in electrical characteristics caused by the stress.

  FIGS. 8A and 8B are schematic perspective views showing another embodiment of the present invention. In FIG. 8A, gaps 430 to 432 are formed that penetrate between the opposing surfaces 446 a to 446 b perpendicular to the mounting surface of the ceramic sintered body 446. When a surface-mounted substrate is bent, a position where a large stress is generated in the multiple chip component can be set around the gap portion, and a crack generation position and a progress direction can be controlled more accurately. It is possible to suppress the disconnection of the internal electrodes 2 to 5 of the unit. As shown in FIG. 8B, the penetrating voids 530 to 532 may be formed so as to penetrate between the opposing surfaces 546c to 546d parallel to the mounting surface.

  FIG. 9 is a cross-sectional view showing another embodiment of the present invention. Sharp portions 137 to 139 are formed at the ends of the gap portions 130 to 132 located at the connecting portions of the units. Although it is preferable that the angle of the apex is an acute angle because cracks are likely to occur, an obtuse angle may be used. Further, in the drawing, the sharp portions are formed at both ends of the gap portions 130 to 132, but they may be formed only at one end. Since the sharp portions 137 to 139 at the ends of the gap portions 130 to 132 are sharp, the cracked portion can be more reliably made the end of the gap portion, and thus stress is generated in the multiple chip component. When a crack occurs, the position and direction of crack generation can be controlled more accurately, and disconnection of the internal electrodes 102 to 105 of the unit can be suppressed.

  FIG. 10 is a cross-sectional view showing another embodiment of the present invention. Sharp portions 237 to 239 are formed at the ends of the gap portions 230 to 232, and grooves 243 to 245 are formed on the outer surface of the ceramic sintered body 446 at positions corresponding to the sharp portions 237 to 239. As a result, the position of the crack that is known from the outer surface of the multi-chip component can be controlled more reliably, and the internal electrode of the unit can be controlled even if the crack progress direction changes greatly when the crack progresses to a portion without a gap. It can suppress that 202-205 disconnects.

  FIG. 11 is a cross-sectional view showing another embodiment of the present invention. Further, the gaps 330 to 332 are extended in parallel to the surface to be surface-mounted near the surface to be surface-mounted from the elements 333 to 336 on the side surface-mounted on the substrate of the gaps 330 to 332. Installation portions 337 to 339 are formed. If this part is a type in which the electrical characteristics do not change even if it is mounted upside down on the multiple chip parts, it is preferable to form both the upper and lower spaces 330 to 332, depending on the mounting direction of the multiple chip parts. If it is a type whose electrical characteristics change, it may be formed on the side closer to the surface to be surface-mounted. As a result, even when a crack occurs from the outer surface portion of the ceramic sintered body on the mounting surface side, such as an end portion of the external electrode, the crack that propagates from the outer surface portion to the inside of the multiple chip component is reached before reaching the element portion. In addition, since the crack does not propagate to the element portion in the extending portions 337 to 339 that are horizontally extended, even if the crack is generated, the progress direction of the crack can be further controlled.

  FIG. 12 is a schematic perspective view showing another embodiment of the present invention. The element is a filter element, and the ground electrode formed by the internal electrode and the external electrodes 647c to 650c of each filter element is formed electrically independently so as to divide each filter element. Even if a crack occurs, the ground electrode and the external electrode of each filter element can be kept electrically connected to the printed circuit board on which they are mounted, and also occur when the ground is not independent. Filter characteristic fluctuations due to fluctuations in the ground connection state can be suppressed.

  The method for manufacturing the multiple chip component of the present invention will be described below.

  First, as shown in FIGS. 1A and 1B, rectangular ceramic green sheets 1 and 2 are prepared. The ceramic green sheets 1 and 2 are formed by appropriately forming a slurry obtained by kneading a dielectric ceramic powder such as a barium titanate ceramic powder with a known and common binder and an organic solvent, such as a doctor blade method. It is obtained by molding and punching by the method.

  On the upper surface of the ceramic green sheet 1, rectangular internal electrodes 2 to 5 are formed by printing a conductive paste from one end edge 1a to the other end edge 1b but not to the other end edge 1b. ing. Further, in the ceramic green sheet portion between the internal electrodes 2 to 5, elongated through holes 6 to 8 are formed from one end edge 1a to the other end edge 1b in parallel with the direction in which the internal electrodes 2 to 5 extend. Further, on the upper surface of the ceramic green sheet 2, rectangular internal electrodes 10 to 13 extending from the one end edge 9 a toward the other end edge 9 b are formed, and penetrate through the ceramic green sheet portion between the internal electrodes 10 to 13. Holes 14 to 16 are formed. The internal electrodes 2 to 5 and 10 to 13 may be formed by a thin film forming method such as plating or sputtering.

  Next, the through holes 6 to 8 and 14 to 16 of the ceramic green sheets 1 and 9 are filled with a material that can be scattered during firing performed later, for example, a carbon paste containing carbon powder and a binder. The 2A and 2B, the carbon paste layers 17 to 22 filled in the through holes 6 to 8 and 14 to 16 are drawn so that their outlines are indicated by broken lines.

  Moreover, as shown in FIG. 3, a rectangular ceramic green sheet 23 is prepared. Like the ceramic green sheets 1 and 2, the ceramic green sheet 23 is formed with an elongated through-hole from one end edge 23a to the other end edge 23b. The through hole is filled with a material that can be scattered during firing, for example, carbon paste. In FIG. 3, the carbon paste layers 24 to 26 filled in the through holes are drawn so that their outlines are indicated by broken lines.

  Next, a plurality of ceramic green sheets 1 and 9 are prepared and laminated alternately in the orientations shown in FIGS. 2 (a) and 2 (b). As shown schematically in FIG. An appropriate number of ceramic green sheets 23 are stacked below, and an appropriate number of plain ceramic green sheets 27 are stacked above and below, and pressed in the thickness direction, whereby the laminate 28 shown in FIG. can get. By firing the laminated body 28, a sintered body 29 shown in FIG. 5 is obtained. In the sintered body 29, the carbon paste layers 17 to 22 and 24 to 26 formed on the ceramic green sheets 1, 9, and 23 are scattered at the time of firing, whereby voids 30 to 32 indicated by broken lines are displayed. Is configured.

  Further, as apparent from FIG. 7 which is a cross-sectional view taken along the line AA of FIG. 5, in the sintered body 46, the first capacitor element 33 configured by overlapping the internal electrode 2, the internal electrode 3, the second capacitor element 34 configured by overlapping, the third capacitor element 35 configured by overlapping the internal electrode 4, and the fourth capacitor element 36 configured by overlapping the internal electrode 5 are configured. Has been. The above-described gap portions 30 to 32 are formed between the first to fourth capacitor elements 33 to 36.

  In addition, although the space | gap part was formed when the carbon paste layer scattered in the case of baking here, the through-holes 6-8, 14-16, and the through-hole of the ceramic green sheet 23 are suitable type | molds after ceramic green sheet lamination | stacking. It may be formed by punching in. Alternatively, the green sheets 1, 9, and 23 may be laminated, and the upper and lower green sheets 27 may be laminated separately, and these three laminated bodies may be laminated. By doing in this way, the lamination | stacking pressure is added to the junction part of all the green sheets, and a green sheet is joined.

Further, as shown in FIG. 8, in order to form the gaps 430 to 432 or the gaps 530 to 532, the position and size of the through holes may be changed in the above-described method. As shown in FIG. 9. In order to form the apex portions 137 to 139 at the ends of the gap portions 130 to 132, for example, the width of the carbon paste layers 24 to 26 formed on the ceramic green sheet 123 is asymptotically decreased as the surface approaches the surface. It can be formed by going. Moreover, when producing a space | gap part by punching out a ceramic green sheet with a type | mold, a pointed part can be formed by using the type | mold containing a pointed part. Moreover, about the form of the invention shown after this which should just press a pointed blade against the green sheet 123, a space | gap part and a point part shall be formed with the same method.

  Further, as shown in FIG. 10, it is desirable that grooves 243 to 245 are formed on the outer surface of the sintered body 246 so as to face the cusps 237 to 239 formed in the gaps 230 to 232. This is because the sharp portions 237 to 239 and the grooves 243 to 245 face each other, so that cracks can be easily generated in this portion, and cracks are generated in other portions by releasing stress due to the occurrence of cracks. This is because it can be prevented. This groove can be formed by the same method as that for the apexes 237 to 239.

  Further, as shown in FIG. 11, the gap portions 330 to 332 on the surface mounting side form portions 337 to 339 extending in parallel with the surface mounting surface near the surface mounting surface from the element. For this purpose, the size of the above-described through hole may be changed.

  Subsequently, first and second external electrodes 47a, 47b to 50a, 50b for electrically connecting the capacitor elements 33 to 36 to the outside are formed with appropriate electrodes on the end surfaces 46a and 46b of the sintered body 46. Formed by the method. The first and second external electrodes 47a to 50b can be formed by applying and baking a conductive paste, or by an appropriate conductive film forming method such as plating or sputtering. Each capacitor element and the external electrode electrically connected to each capacitor element are collectively referred to as a capacitor unit. For example, one capacitor unit is a combination of the capacitor element 33 and the external electrodes 47a and 47b.

  In the above description, the internal electrode has the shape of a capacitor. However, when forming a filter element, the shape of the internal electrode may be changed. Also, via holes for electrically connecting the internal electrodes in the stacking direction may be formed in the ceramic stack.

  In the case of a filter element, as shown in FIG. 12, ground electrodes 47c, 48c, 49c, 50c electrically connected to the ground portion of the internal electrode of each filter element are independent for each filter element. It is desirable to be formed. Thereby, even when a crack that divides each filter unit occurs, the electrical connection between the ground electrodes 47c, 48c, 49c, and 50c and the printed circuit board can be maintained, and the characteristics as a filter can be maintained. .

  A multiple capacitor shown in FIG. 5 was produced as a multiple chip component.

  In the multiple capacitor, the ceramic sintered body is configured by laminating, for example, 400 ceramic layers. Examples of the material of the ceramic green sheet include dielectric ceramics such as barium titanate, insulating ceramics such as alumina, and glass-ceramics containing insulating ceramics in a glass component. An internal electrode for forming a capacitor element is formed between the ceramic layers. Examples of the material of the internal electrode include a conductive paste containing Ag or Ag—Pd, but may be other members.

  In the multiple capacitor of this embodiment, gaps 30 to 32 are formed between the four capacitor elements 33 to 36 as shown in FIG. The method of forming the gaps 30 to 32 was formed by filling a portion desired to be a gap with a carbon paste and scattering the powder during firing.

  The size of the multiple capacitor produced in this example is 2 mm × 1.2 mm × 1.2 mm. Further, the size of the gap is represented by c and d in FIG. c is 0.1 mm.

  In this example, a multiple capacitor with the size of the gap portion and the formation position of the tip of the gap portion changed was produced, and the multiple capacitor was joined to a printed circuit board via solder, and a destructive test was performed. The state of cracks generated in the multiple capacitor was confirmed. Test conditions and test results are shown in Table 1. Test condition 1 is a conventional multiple capacitor shown in FIG. As the shape of the gap and the tip of the manufactured multiple capacitor of the present invention, the value of d is set to 0.1 mm in the test condition 2 and 0.0 mm in the test conditions 3 to 5, and the gaps 30 to 32 are sintered. The body 46 is penetrated to the end faces 46a and 46b. Further, in test conditions 2 and 3, no sharp portions are provided in the gap portions 30 to 32, but in test condition 4, sharp portions 137 to 139 are provided at the ends of the gap portions 130 to 132 as shown in FIG. Moreover, in test condition 5, as shown in FIG. 10, in addition to providing the apexes 137 to 139, apexes 243 to 24572 are provided on the outer surface of the sintered body 246 so as to face the apexes 137 to 169. In test condition 6, the value of e in FIG. 11 was set to 0.1 mm. Twenty samples of each of test conditions 1 to 6 were prepared.

The produced multiple capacitors are joined to a printed board 69 having a thickness of 1.0 mm via solder, and then a jig 70 serving as a fulcrum is provided on the printed board at intervals of 45.0 mm as shown in FIG. A destructive test was performed by pressing 2.0 mm at a speed of 5 mm / min using a jig 71 having a radius of curvature of 1.8 mm from the side where the multiple capacitors were not mounted and bending the substrate upward. The test results are shown in Table 1. In addition, the thing whose capacity | capacitance change of all the capacitors in a multiple capacitor | condenser is all 5% or less was made into the non-defective product.

  As shown in Table 1, sample no. Since 1 had no voids, 13 cracks occurred. All of the cracks were generated from the end portions of the electrodes, and the cracks reached the internal electrodes, resulting in a capacity change of 5% or more or a short circuit. Therefore, seven products that were non-defective after the test were not cracked.

  Sample No. with voids. In No. 2, 18 cracks occurred not only at the electrode end but also cracks. Ten of the 18 cracks occurred from the end of the gap, and the crack did not reach the internal electrode, and the capacity did not change by 5% or more. Of the 18 cracks, 8 cracks were generated from the end of the electrode, and the crack had reached the internal electrode, resulting in a capacity change of 5% or more or a short circuit. Therefore, it was a non-defective product after the test, that is, a total of 12 pieces, 2 pieces with no cracks and 10 pieces cracked at the gaps.

  Sample No. From sample 3, sample no. 4, Sample No. From sample 4, sample no. As it becomes 5 or 6, the probability that a crack is generated from the end of the gap increases. In 5 and 6, cracks occurred from the end of the gap with a probability of 100%, and after the test, all became good products.

  Sample No. For No. 1, when the capacitance was measured for a sample in which no crack was generated while the deflection was applied to the printed circuit board 69, the capacitance was reduced by about 1 to 2% compared to before the deflection was applied. This is because the dielectric constant is changed by the stress generated in the multiple capacitor by bending the printed circuit board 69 because the ceramic constituting the capacitor is a ferroelectric. In contrast, sample no. As for 5 and 6, similarly, when the deflection was applied to the printed circuit board 69, the change in capacitance was 0.2% or less as compared to before applying the deflection. This is sample no. In each of Nos. 5 and 6, each capacitor element is divided by a crack generated from the end of the gap. This is because it is smaller than 1.

  A multiple filter in which the ground was separated for each element was manufactured, joined to the printed circuit board via solder, and a bending test was performed to bend the printed circuit board. Further, a conventional ground-shaped multiple filter in which the ground is not separated for each element was similarly joined to a printed circuit board through solder and subjected to a deflection test. As a result, for multiple filters in which the ground is separated for each element, even if a stress occurs due to the deflection of the printed circuit board and a crack occurs, if a crack occurs so as to divide each element There was almost no change in properties. However, in the case of a conventional multiple filter in which the ground is not separated for each element, a filter element in which the bond with the ground of the printed circuit board is not maintained due to the crack is generated. There was a thing whose characteristics changed greatly.

(A) And (b) is each top view which shows the state which formed the internal electrode on the ceramic green sheet in the Example, and formed the through-hole between internal electrodes. (A) And (b) is a top view which shows the state which filled the through-hole of the ceramic green sheet shown in FIG. 1 with the carbon paste, respectively. The top view which shows the state which filled the through-hole of the ceramic green sheet with the carbon paste in the Example. The perspective view which shows the process of laminating | stacking several ceramic green sheets in an Example. The schematic perspective view of the multiple chip | tip component of this invention. The schematic perspective view which shows the internal structure of the multiple chip | tip component of this invention. Sectional drawing which follows the A-A 'line and B-B' line of FIG. The schematic perspective view which shows other embodiment of this invention. Sectional drawing which shows other embodiment of this invention. Sectional drawing which shows other embodiment of this invention. Sectional drawing which shows other embodiment of this invention. The schematic perspective view which shows other embodiment of this invention. Sectional drawing explaining the destructive test in an Example. The schematic perspective view of the multiple chip mounting substrate of this invention. The schematic perspective view of the conventional multichip component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Ceramic green sheet 1a, 1b ... End part 2-5 of ceramic green sheet 1 ... Internal electrode 6-8 ... Through-hole 9 ... Ceramic green sheet 9a, 9b ... Ceramic Ends 10 to 13 of the green sheet 9 ... internal electrodes 14 to 16 ... through holes 17 to 22 ... carbon paste 23 ... ceramic green sheets 23a and 23b ... end parts of the ceramic green sheet 1 24 to 26, carbon paste 27, ceramic green sheets 30 to 32, gaps 33 to 36, element 46, sintered bodies 47a to 50a, terminal electrodes 47b to 50b,. · Terminal electrode 47d ··· Electrode 73 on the substrate ··· Printed circuit board 74 ··· A jig 75 as a fulcrum of the printed circuit board in the destructive test Jig 90 for applying deflection to the lint substrate ... multiple chip components 91 ... substrate 92 ... multiple chip mounting substrates 137 to 139 ... ends of gaps 243 to 245 ... sintered body Grooves 337 to 339 on the outer surface, extending portions 647c to 650c, ground electrodes

Claims (8)

It is surface-mounted on a substrate provided with a plurality of units composed of an element in which a plurality of ceramic layers and a plurality of internal electrodes are laminated and an external electrode electrically connected to the internal electrode of the element. A multi-chip component, wherein a gap is formed between adjacent units in the stacking direction of the ceramic layers. 2. The multiple chip component according to claim 1, wherein the gap portion penetrates between opposing surfaces of the multiple chip component. When the adjacent units among the units of the multiple chip component and the gap formed therebetween are viewed from the direction in which the adjacent units are connected, the elements of the adjacent units are 3. The multiple chip component according to claim 1, wherein the multiple chip component is located inside. The multiple chip component according to any one of claims 1 to 3, wherein an end of the gap portion located at a connection portion of the unit is pointed. The multiple chip component according to claim 4, wherein a groove is formed on an outer surface of the connection portion corresponding to a sharp end of the gap portion. 6. The end of the gap portion on the surface mounted on the substrate is extended in parallel with the surface mounted surface near the surface mounted surface from the element. A multiple chip part according to any one of the above. 7. The element according to claim 1, wherein the element is a filter element, and the ground electrode formed by the internal electrode and the external electrode of the filter element is electrically independent from each other. Multi-chip component according to crab. The external chip of the multiple chip component according to claim 1 is connected to an electrode formed on a substrate, and the multiple chip component is surface-mounted on the substrate. Multiple chip mounting board.

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