JP2008108616A - Lamination type display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lamination type display device capable of connecting electrodes of respective display panels to one wiring member even when lead-out wirings of the plurality of the display panels are simply connected, and especially three or more display panels are laminated. <P>SOLUTION: The respective laminated display panels are arranged so that display elements 16, 26, 36 are separated from each other in an insulating state. The two display panels 10, 20 arranged outermost have element forming surfaces facing with each other. The respective lead wirings 14, 24 are arranged to project from one end part of the intermediate display panel arranged between the two display panels, and are respectively connected to wiring circuits 17a, 17b of the wiring member 13 arranged therebetween through conductive materials 19a, 19b. One end part of the lead wiring of the intermediate display panel 30 of the lamination type display device 31 projects from the lead wiring, and the display panel 30 is connected to another opposite display panel without through the other display panel. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a multilayer display device in which a plurality of display panels are stacked.

  In recent years, development of liquid crystal displays, plasma displays, organic electroluminescence (organic EL) displays, etc. has progressed as thin display devices.

  Such a thin display device basically has a display panel in which a display element and a lead-out wiring are formed on a substrate such as glass, and performs image display by applying a voltage to the display element. In some cases, a multilayer display device in which a plurality of display panels are stacked is used for the purpose of improving color display, double-sided display, emission intensity, and the like (see, for example, Patent Document 1).

  In the multilayer display device, the wiring portion increases as the display panels are stacked. In view of this, several stacked display devices have been proposed for the purpose of space saving or compactness of the device. For example, a double-sided display device has been proposed in which lead-out wiring portions are provided on the same side of two stacked display panels, and cut-out portions are provided so that the lead-out wiring portions do not overlap each other (for example, Patent Documents). 2). However, in such a double-sided display device, it is necessary to provide independent lead-out wiring for each display panel, and it is not compatible with a multilayer display device provided with three or more display panels.

  As a multi-layer display device corresponding to three or more display panels, a plurality of display panels are stacked so that the end portions of the electrodes protrude in the same direction, wiring members are connected to the protruding electrode terminals, There has been proposed a display device in which another display panel is connected to one display panel to be connected via the wiring member (see Patent Document 3). In this multilayer display device, all the display panels can be driven by a drive circuit provided in one display panel. However, since the wiring members are connected to all the display panels, if the number of display panels to be stacked increases, the wiring becomes complicated and the drive control may be complicated.

JP 2001-42353 A JP 2005-257866 A JP 2002-297050 A

  The present invention provides a multilayer type in which the lead wirings of a plurality of display panels are simply connected, and in particular, even when three or more display panels are laminated, the electrodes of each display panel can be connected to one wiring member. An object is to provide a display device.

In order to achieve the above object, the present invention provides the following multilayer display device.
<1> A laminated display device in which two display panels are laminated,
Two display panels each having a display element including an electrode and a lead wiring connected to the electrode of the display element formed on the substrate;
Including a wiring member having a wiring circuit formed on both sides of the insulating base,
The two display panels are arranged such that the surfaces on which the display elements and the lead-out lines are formed face each other, and the display elements are separated from each other in an insulated state.
The wiring member is disposed between the lead wires of the two display panels, and the wiring circuit of the wiring member is connected to the lead wires of the display panels via conductive materials, respectively. A multilayer display device characterized by comprising:

<2> A laminated display device in which three or more display panels are laminated,
Three or more display panels each having a display element including an electrode and a lead wiring connected to the electrode of the display element formed on the substrate;
Including a wiring member having a wiring circuit formed on both sides of the insulating base,
Each of the stacked display panels is arranged so that the display elements are separated from each other in an insulated state,
The two display panels arranged on the outermost sides face each other on which the display elements and lead wires are formed, and each lead wire of the two display panels is between the two display panels. It is arranged so as to protrude from one end of the middle display panel,
The wiring member is disposed between the lead-out wirings of the two display panels disposed on the outermost side, and the wiring circuit of the wiring member is disposed on the outermost two displays. The intermediate display panel is connected to the lead-out wiring of the panel through a conductive material. One end of the lead-out wiring of the display panel protrudes from the lead-out wiring and is opposed to the other display panel. A laminated display device, wherein the display device is connected to a lead-out wiring of another display panel via a conductive material.

<3> A through hole is formed in a thickness direction of an insulating base material constituting the wiring member, and wiring circuits on both sides are connected through the through hole. <1> or <2> The multilayer display device described in 1.

<4> In the multi-layer display device in which the three or more display panels are stacked, either one of the anode and the cathode of the display panel on at least one substrate of the two outermost display panels. In addition to the lead wire connected to the electrode, a lead wire for another display panel insulated from the display element of the display panel is formed and connected to the one electrode of the intermediate display panel. The multilayer display device according to <2> or <3>, wherein the lead-out wiring is connected to the lead-out wiring for the other display panel via a conductive material.

<5> The multilayer display device according to any one of <1> to <4>, wherein the substrate is flexible.

<6> The multilayer display device according to any one of <1> to <5>, wherein a portion connected via the conductive material is pressure-bonded.

<7> The multilayer display device according to any one of <1> to <6>, wherein the multilayer display device is a passive matrix type.

<8> The multilayer display device according to any one of <1> to <7>, wherein the display panels are stacked such that display elements overlap each other.

<9> The stacked display device according to any one of <1> to <7>, wherein the stacked display panels are stacked such that display elements do not overlap each other.

<10> The multilayer display device according to any one of <1> to <9>, wherein the display element is an organic EL element.

<11> The multilayer display device according to <10>, wherein an anode and a cathode of the organic EL element are formed of a transparent conductive film.

  According to the present invention, the lead-out wirings of a plurality of display panels are simply connected. In particular, even when three or more display panels are stacked, the electrodes of each display panel can be connected to one wiring member. A multilayer display device is provided.

  Hereinafter, as a preferred embodiment of the present invention, a laminated display device in which organic EL display panels are laminated will be described in detail with reference to the accompanying drawings.

  FIG. 1 shows an example of the structure of a display panel that can be used in a multilayer display device according to the present invention. In this display panel 1, an anode 3, a hole transport layer 4, a light emitting layer 5, an electron transport layer 6, a cathode 7, and the like are formed on a substrate 2 as organic EL elements. The ends of the electrodes 3 and 7 are lead wires 9 and are connected to the drive circuit via the lead wires 9. By applying an electric field to both electrodes 3 and 7, the organic EL layer 8 (hole transport layer 4, light emitting layer 5, and electron transport layer 6) sandwiched between the electrodes 3 and 7 emits light.

  The substrate 2 is not particularly limited as long as it is a known substrate used in an organic EL display device, and an opaque substrate made of metal or the like may be used in addition to a transparent or translucent substrate such as a glass substrate or a resin substrate. it can. In the multilayer display device according to the present invention, at least two display panels 1 having the above-described configuration are stacked. For example, in the case of a double-sided display device, the substrates of the two display panels arranged on the outermost side. Can be a transparent substrate, and in the case of a single-sided display device, the substrate of the display panel on one side can be an opaque substrate such as metal. Note that when a metal substrate is used, an insulating layer is provided to ensure electrical insulation. In addition, in the case where the multilayer display device is flexible, a flexible substrate such as resin or stainless steel is used.

When employing a film-like resin substrate, for example, polyesters such as polyethylene terephthalate, polybutylene phthalate, polyethylene naphthalate, polystyrene, polycarbonate, polyethersulfone, polyarylate, polyimide, polycycloolefin, norbornene resin, poly (chloro A resin substrate such as (trifluoroethylene) can be preferably used.
In addition, such a resin substrate has a gas barrier layer for preventing moisture and oxygen permeation, a hard coat layer for preventing scratches on the organic EL element, and improved flatness of the substrate and adhesion to the anode. It is also possible to appropriately provide an undercoat layer or the like.

  The organic EL element formed on the substrate 2 is not particularly limited. For example, after an anode 3 such as ITO is formed on the substrate 2 such as glass by vacuum deposition, an insulating film or a partition (not shown) is formed. Form. Next, an organic EL layer 8 such as a hole transport layer 4, a light emitting layer 5, and an electron transport layer 6 is sequentially formed by vacuum deposition, and a cathode 7 such as Al or MgAg is further formed to form an organic EL element. can do. For example, in the case of a double-sided display device, the anode 3 and the cathode 7 are formed of a transparent conductive film such as ITO.

  The lead-out wiring 9 is formed so as to be connected to the electrodes 3 and 7 of the organic EL element, and the organic EL element is connected to a drive circuit that performs drive control via the lead-out wiring 9. As shown in FIG. 1, the lead wiring 9 can be formed so as to extend from the electrodes 3 and 7 with the same material as the electrodes 3 and 7. In addition to the electrodes 3 and 7, for example, the lead wiring may be formed of a chemically stable material having a low specific resistivity such as Au, Cr, Al, or Cu.

Next, a specific example of the multilayer display device according to the present invention in which the above display panels are laminated will be described.
FIG. 2 schematically shows an example of how to connect the lead-out lines of the display panel constituting the multilayer display device according to the present invention. In the multilayer display device 11, two display panels (the first display panel 10 and the second display panel 20) are stacked. In each display panel 10, 20, organic EL elements are provided on the substrates 12, 22, and organic EL layers 16, 26 are formed on the anodes connected to the lead wires 14, 24. As described with reference to FIG. 1, an organic EL element (display element) is configured including electrodes (lead wirings) arranged above and below the organic EL layer. In FIG. The parts 16 and 26 will be described as display elements.

The two display panels 10 and 20 face each other (the surface on which the organic EL layer elements including the organic EL layers 16 and 26 and the electrodes and the lead-out wirings 14 and 24 are formed) (element formation surfaces) and display each other. The elements 16 and 26 are arranged so as to be separated in an insulating state via the insulating layer 18. A wiring member 13 is disposed between the lead wires 14 and 24 of the two display panels 10 and 20. In the wiring member 13, wiring circuits 17 a and 17 b are formed on both surfaces of the insulating base material 15. The wiring circuits 17a and 17b of the wiring member 13 are connected to the lead wires 14 and 24 of the display panels 10 and 20 through conductive materials (conductive pads) 19a and 19b, respectively. With such a configuration, the first and second display panels 10 and 20 can be independently driven and controlled via the wiring circuits 17a and 17b of the wiring member 13, respectively.
The sizes of the display panels 10 and 20 and the lengths of the lead wires 14 and 24 are not particularly limited. For example, the display panels 10 and 20 and the lead wires 14 and 24 may have the same size (length). One display panel may protrude.

  As the insulating layer 18 for separating the display elements 16 and 26 of each display panel in an insulating state, a known insulating material, for example, an acrylic resin, a polyimide resin, a fluorine resin, or the like can be used. The insulating layer 18 may be provided between the display panels 10 and 20 when the display panels 10 and 20 are laminated, or is previously formed as a protective layer on one or both of the laminated display panels 10 and 20. You may keep it.

  Further, the conductive materials 19a and 19b for connecting the lead wires 14 and 24 and the wiring circuits 17a and 17b of the wiring member 13 are not particularly limited as long as they can be electrically connected. A conductive material such as ACF (anisotropic conductive film), ACP (anisotropic conductive paste), solder, or the like can be used.

  FIG. 3 shows an example of a stacked display device in which three display panels are stacked. In the multilayer display device 31, a third display panel 30 is disposed as an intermediate display panel between the first display panel 10 and the second display panel 20 positioned on the outside. In the second and third display panels 20 and 30, the surface on which the display elements 26 and 36 and the lead wires 24 and 34 are formed (element formation surface) is opposed to the element formation surface of the first display panel 10. Are oriented in the same direction. Further, the lead wires 14 and 24 of the first and second display panels 10 and 20 are both arranged so as to protrude from one end of the third display panel 30.

In the first and third display panels 10 and 30, the display elements 16 and 36 are separated from each other in an insulating state via the insulating layer 29, and the lead-out wiring 34 of the third display panel 30 is provided. Is connected to the lead-out wiring 14 of the opposing first display panel 10 via the conductive material 53. It should be noted that one end portion of the lead-out wiring in the present invention is not limited to the end portion, and as shown in FIG. 3, it is connected at the inner portion not including the end as long as it is a portion located outside the organic EL layer 34. Alternatively, it may be connected at a portion including the end.
On the other hand, in the first and second display panels 10 and 20, the display elements 16 and 26 are separated from each other in an insulating state via the insulating layer 29 and the substrate 32 constituting the third display panel 30. . The lead wires 14 and 24 of the first and second display panels 10 and 20 are linearly connected to the wiring circuits 17a and 17b of the wiring member 13 through conductive materials (conductive pads) 19a and 19b, respectively. ing. With such a configuration, the lead wires 14 and 24 of the first and second display panels 10 and 20 are connected simply and with high strength, and via the wiring circuits 17a and 17b of the wiring member 13, respectively. The drive can be controlled independently. Further, since the third display panel 30 is connected to the first display panel 10 via the conductive material 53, the third display panel 30 has the same potential and can be driven and controlled through the wiring circuit 17a.

  FIG. 4 shows a state in which the portions connected via the conductive materials 19a, 19b, and 53 are pressure-bonded in the stacked display panels 10, 20, and 30 shown in FIG. In the present invention, the portions to be connected via the conductive materials 19a, 19b, and 53 are not necessarily crimped, but in particular, as the substrates 12, 22, and 32 constituting the display panels 10, 20, and 30, respectively. When a flexible substrate made of resin, stainless steel, or the like is employed, the ends of the substrates 12, 22, and 32 are curved and can be easily crimped. Thus, if the lead wires 14 and 34 are further crimped between the lead wires 14 and 24 of the first and second display panels 10 and 20 and the wiring member 13, the strength is more surely increased. Can be connected with. In the case of pressure bonding, a conductive adhesive such as ACP or ACF can be suitably used as the conductive material.

In the multilayer display device 51 shown in FIG. 5, the display elements 16, 26, 36 of each display panel 10, 20, 30 are in an insulated state via the insulating layer 52 and the substrate 32 constituting the third display panel 30. One end portion of the lead wiring 34 of the third display panel 30 that is spaced apart and located in the middle is connected to the lead wiring 24 of the opposing second display panel 20 via the conductive material 54.
The lead wires 14 and 24 of the first and second display panels 10 and 20 protruding outside are connected to the wiring circuits 17a and 17b of the wiring member 13 through conductive materials (conductive pads) 19a and 19b, respectively. Has been. With such a configuration, the first and second display panels 10 and 20 can be independently driven and controlled via the wiring circuits 17a and 17b of the wiring member 13, respectively. Further, since the third display panel 30 is connected to the second display panel 20 via the conductive material 54, the third display panel 30 has the same potential and can be driven and controlled through the wiring circuit 17b. In other words, the lead-out wirings of all the display panels are electrically connected to one wiring member 13, so that the wiring is simplified and the drive control can be easily performed.

In the multilayer display device according to the present invention, the number of display panels to be stacked is not limited, and four or more display panels may be stacked.
The multilayer display device 61 shown in FIG. 6 is disposed such that the first and second display panels 10 and 20 protrude from each other on the outermost side and the element formation surfaces face each other. In addition, between these display panels 10 and 20, the third and fourth display panels 30 and 40 are intermediate display panels, and each element formation surface faces the element formation surface of the first display panel 10. Are oriented in the same direction and arranged in stages. The display elements 16, 26, 36, 46 of each display panel are separated in an insulating state via the insulating layer 62 and the substrates 32, 42 constituting the third and fourth display panels 30, 40. .

  On the other hand, one end portion of each lead-out line of the third and fourth display panels 30 and 40 and the lead-out line 14 of the first display panel 10 facing each other without passing through another display panel are respectively connected to the conductive material 66, respectively. 64 is connected. The lead wires 14 and 24 of the first and second display panels are connected to the wiring circuits 17a and 17b of the wiring member 13 through conductive materials (conductive pads) 19a and 19b, respectively. With such a configuration, the first and second display panels 10 and 20 can be independently driven and controlled via the wiring circuits 17a and 17b of the wiring member 13, respectively. In addition, the lead wires 34 and 44 of the third and fourth display panels 30 and 40 are connected to the lead wire 14 of the first display panel 10 via the conductive materials 66 and 64, respectively. It becomes a potential and can be driven and controlled through the wiring circuit 17a. Also in this case, the lead-out wirings of all the display panels are electrically connected to the single wiring member 13, so that the wiring is simplified and the drive control can be easily performed.

  In the multilayer display device 71 shown in FIG. 7, the third and fourth display panels 30 and 40 are arranged between the first display panel 10 and the second display panel 20 that protrude on the outermost side. Yes. Between the display elements 16, 26, 36, and 46 of the display panels 10, 20, 30, and 40, an insulating layer 72 and substrates 32 and 42 that constitute the third and fourth display panels 30 and 40, respectively, are interposed. Are separated in an insulated state. The end portion of the lead wiring 44 of the fourth display panel 40 is opposed to the lead wiring 44 and is arranged so as to protrude from the lead wiring 44 and the lead wiring 34 of the third display panel 30. They are connected via a conductive material 74. Further, one end portion of the lead wiring 34 of the third display panel 30 is opposed (facing) to the lead wiring 14 of the first display panel 10 without passing through the fourth display panel 40, and the conductive material 76. Connected through. Further, the lead wires 14 and 24 of the first and second display panels are connected to the wiring circuits 17a and 17b of the wiring member 13 through conductive materials (conductive pads) 19a and 19b, respectively. With such a configuration, the first and second display panels 10 and 20 can be independently driven and controlled through the wiring circuits 17a and 17b of the wiring member 13, respectively, and further, the third and fourth display panels 30 can be controlled. , 40 are directly or indirectly connected to the first display panel 10 via conductive materials 76, 74, respectively, and therefore have the same potential and can be driven and controlled through the wiring circuit 17a.

  In each of the above examples, the display panels 10 and 20 positioned on the outside can be separately driven and controlled by the wiring circuits 17a and 17b formed on each surface of the wiring member 13. For example, as shown in FIG. Common wiring member 23 can be used for common control. In the wiring member 23, a through hole 21 is formed in the thickness direction of the insulating substrate 25, and wiring circuits 27 a and 27 b on both sides are connected through the through hole 21. The shape, position, size, number, and the like of the through holes 21 are not particularly limited as long as the double-sided wiring circuits 27a and 27b can be connected. If the lead wires 14 and 24 of the first and second display panels are connected to the wiring circuits 27a and 27b of the wiring member 23 via the conductive materials (conductive pads) 19a and 19b, respectively, each display panel 10 , 20 lead wires 14 and 24 have the same potential and can be controlled in common. Even when three or more display panels as shown in FIGS. 3 to 7 are stacked, by using the wiring member 23 as described above, it is possible to drive and control all the display panels in common. .

  As described above, in the multilayer display device according to the present invention, the two display panels arranged on the outermost side are arranged so that the surfaces on which the display elements and the lead-out lines are formed face each other, Each lead-out wiring is connected to a wiring circuit of a wiring member disposed between these display panels via a conductive material. When three or more display panels are stacked, the intermediate display panel has one end portion of the lead-out wiring of the display panel that protrudes from the lead-out wiring and is opposed to the other display panel. It is connected to the lead-out wiring of another display panel via a conductive material. In any of the examples, it is preferable that the portion connected via the conductive material is crimped. In particular, when a display panel using a flexible substrate is stacked, a portion connected through a conductive material can be easily pressure-bonded, and can be securely connected. In such a multilayer display device, the lead-out wiring of each display panel is simply connected directly or indirectly to one wiring member, and drive control becomes easy. In addition, the manufacturing becomes easy and the cost can be kept low.

2 to 8 described the case where the lead-out wiring on the anode side of each display panel is connected. In the present invention, at least one lead-out wiring (electrode) of the anode and the cathode is 1 as described above. If connected to one wiring member, the wiring is simplified, and manufacturing and drive control are facilitated. Hereinafter, a passive matrix stacked display device capable of full color display will be described in more detail.
9 to 15 show a procedure for manufacturing a multilayer display device according to the present invention using three display panels.
FIG. 9 shows a display panel 90 for red (R) (hereinafter referred to as “R display panel”). On the film-like resin substrate 91 (film substrate), transparent anodes made of ITO are formed at predetermined intervals, and an organic EL layer 93 for red is formed on the anodes. Further, a transparent cathode 92 made of ITO is formed on the organic EL layer 93 in a direction orthogonal to the organic EL layer 93, and an insulating layer 98 for protecting the organic EL element is further formed. Each electrode is connected to ITO terminal portions (lead wirings) 95 and 94, respectively. Further, on the substrate 91, apart from the lead wires 94 and 95 connected to the display element 93 of the R display panel 90, lead wires 96 insulated from the display element 93 of the R display panel 90 are formed at a predetermined interval. Yes. These lead wires 96 are connected to lead wires (anode terminals) 105 of other display panels 100 described later.

  FIG. 10 shows a display panel 100 for green (G) (hereinafter referred to as “G display panel”). A transparent anode made of ITO is formed on the film substrate 101, and an organic EL layer 103 for green is formed on the anode. Further, on the organic EL layer 103, a transparent cathode 102 made of ITO is formed in a direction perpendicular to the organic EL layer 103, and an insulating layer 108 is further formed. Further, similar to the R display panel 90, ITO terminal portions (lead wirings) 105 and 104 are connected to the respective electrodes.

  FIG. 11 shows a state in which the R display panel 90 and the G display panel 100 are stacked with the respective lead wires facing in the same direction. The G display panel 100 shown in FIG. 10A is turned upside down, and the element formation surface (display element 103 and the lead-out wirings 104 and 105) of the G display panel 100 becomes the element formation surface (display element 93 and The lead wires 94 and 95) are laminated so as to face each other. The ends of the lead-out wirings 95 and 96 for the anode of the R display panel 90 protrude from the G display panel 100. Then, the lead-out wiring (anode terminal) 105 for the anode of the G display panel 100 is crimped to the lead-out wiring (anode terminal) 96 formed in advance on the substrate 91 of the R display panel 90 via a conductive material.

  FIG. 12 shows a display panel 110 for blue (B) (hereinafter referred to as “B display panel”). A transparent anode made of ITO is formed on the film substrate 111. A blue organic EL layer 113 is formed on the anode. Further, like the R display panel 90, a transparent cathode 112 made of ITO and an insulating layer 118 are sequentially laminated, and ITO terminal portions (lead wirings) 115 and 114 are connected to the respective electrodes. ing.

  FIGS. 13 to 15 show that the display elements 93, 103, and 113 of the display panels 90, 100, and 110 do not overlap each other on the laminate of the R display panel 90 and the G display panel 100 shown in FIG. A multilayer display device 120 in which display panels 110 are stacked is shown. The B display panel 110 shown in FIG. 12A is turned upside down, and the display element 93 and the lead lines 94 and 95 of the R display panel 90 are formed on the surface on which the display element 113 and the lead lines 114 and 115 are formed, respectively. It is laminated so as to face the surface that has been formed. As with the R display panel 90, the lead wires 114 and 115 of the B display panel 110 protrude from the intermediate G display panel 100. And as FIG. 14 shows, the one end part (anode terminal) 115 of the lead-out wiring for anodes of B display panel 110 is connected with the wiring circuit of the wiring member 132 through the electroconductive material. A through hole is formed in the wiring member 132, and the lead-out wiring 115 of the B display panel 110 is electrically connected to the wiring circuit on the R display panel 90 side. Further, the lead-out wiring 95 connected to the display element 93 of the R display panel 90 and the lead-out wiring 96 connected to the display element 103 of the intermediate G display panel 100 are also electrically conductive with another wiring circuit of the same wiring member 132, respectively. Independently connected through the material. With such connection, the lead-out wirings 95, 105, 115 for the anodes of the display panels 90, 100, 110 can be drawn to the same surface side as the driver (not shown). The anode can be easily controlled independently by a driver.

  On the other hand, FIG. 15 shows the positional relationship and connection state of the lead-out wiring (cathode terminal) for the cathode of each display panel 90, 100, 110. As shown in FIG. 15, one end portion of the lead wiring 104 of the intermediate G display panel 100 is pressure-bonded with the lead wiring 94 of the opposite R display panel 90 and the conductive material 134. On the other hand, the lead-out wiring 94 of the outer R display panel 90 and the lead-out wiring 114 of the B display panel 110 are connected to the wiring circuits 136a and 136b of the wiring member 133 arranged therebetween and the conductive materials 135a and 135b, respectively. Connected. Further, the wiring circuits 136 a and 136 b on both sides of the wiring member 133 are connected through the through hole 137. By such connection, the cathodes of all the display panels 90, 100, 110 can be controlled in common through the circuit on one side of the wiring circuits 136a, 136b of the wiring member 133.

  With the connection as described above, the passive matrix stacked display device 120 capable of independently controlling the driving of the display elements 93, 103, and 113 of each display panel is obtained. With such a passive matrix stacked display device 120, each display panel 90, 100, 110 is connected to one wiring member 132, 133 at each electrode, simplifying the connection of wiring. Drive control becomes easy. Moreover, it can be manufactured at low cost.

In the multilayer display device 120, the display elements 93, 103, and 113 of the three display panels are stacked without overlapping, but may be stacked so that the display elements of the display panels overlap each other.
FIG. 16 shows an example of each anode (ITO) pattern in the case of forming red (R), green (G), and blue (B) display elements. On each of the substrates 148, 158, and 168, anode patterns 141, 151, and 161 are formed so as to overlap each other. Furthermore, anode lead wires 142, 152, and 162, and cathode lead wires 145 and 155, respectively. 165 is formed. In addition, a lead wire 143 for the G display panel is also formed on the substrate 148 of the R display panel.

  Next, as shown in FIG. 17, organic EL layers 146, 156, and 166 of corresponding colors are formed on the respective anodes 141, 151, and 161, and further, cathodes 147, 157, 167 is formed. The G display panel 150 and the B display panel 160 are turned upside down and sequentially stacked on the R display panel 140 so that the display elements 146, 156, and 166 overlap as shown in FIGS. Insulating layers 149, 159, and 169 are formed on the outermost layers of the display panels 140, 150, and 160, respectively. The lead-out wiring 162 for the anode of the B display panel 160 is connected to the wiring 173b of the wiring member 171 by the conductive material 172b, and the wirings 173a and 173b on both surfaces of the wiring member 171 are connected through the through hole 174. On the other hand, the lead-out wiring 152 for the anode of the G display panel 150 is pressure-bonded to the lead-out wiring 143 for the G display panel formed on the R display panel 140 via a conductive material. In addition, the lead-out wirings 142 and 143 of the R display panel 140 are connected to other wiring circuits of the wiring member 171 via conductive materials on the side opposite to the B display panel 160, respectively. With such connection, the lead-out wirings 142, 152, 162 for the anodes of the display panels 140, 150, 160 can be drawn to the same surface side as the driver (not shown). The anode can be easily controlled independently by a driver.

  As shown in FIG. 20, the lead-out wiring 155 for the cathode of the G display panel 150 is connected to the lead-out wiring 145 of the opposing R display panel 140 via the conductive material 175, and is connected to the outer R display panel 140. The lead-out wirings 145 and 165 for the cathodes of the B display panel 160 are connected to the wiring circuits 177a and 177b of the wiring member 178 via the conductive materials 176a and 176b, respectively. These wiring circuits 177a and 177b are through holes 179. Connected through. With such connection, the cathodes of all the display panels 140, 150, 160 can be controlled in common through the wiring circuit on one side of the wiring member 178.

  Also in this multi-layer display device 170, the driving of each display panel 140, 150, 160 can be controlled independently via the wiring members 171, 178, and the display elements 146, 146 of each display panel 140, 150, 160 are also possible. Since 156 and 166 are stacked so as to overlap, high-definition display is possible.

The multilayer display device according to the present invention can also be manufactured by other methods.
For example, as shown in FIG. 21, organic EL elements 182 and 183 corresponding to R and B, and lead wires 184 and 185 corresponding to elements of these two colors (RB) are formed on one substrate 181 respectively. The formed display panel (RB display panel) 180 is manufactured. On the other hand, as shown in FIG. 22, a G display panel 190 having an element 192 corresponding to G on another substrate 191 is manufactured. The RG display panel 180 and the G display panel 190 are overlapped so that the element formation surfaces face each other and the display elements 182, 183, and 192 face in the same direction. Then, the wiring circuits 27a and 27b of the wiring member 23 in which, for example, double-sided wirings as shown in FIG. 8 are connected to the lead-out wiring 197 for the cathode of the G display panel 190 and the corresponding extraction wiring 187 of the RG display panel 180. And connect respectively. On the other hand, the lead-out wirings (anode terminals) 184, 185, and 196 for the anodes of the RG display panel 180 and the G display panel 190 are connected to the anode wiring member, for example, in the same manner as in FIG. With this connection, the anode lead wires 184 and 185 of the RB display panel 180 and the anode lead wire (anode terminal) 196 of the G display panel 190 are connected to the wiring circuit on the same side of the wiring member. Thus, connection with the driver is facilitated, and each display element 182, 183, 192 can be controlled independently.

The present invention is not limited to the case where the anode and the cathode of the organic EL element are formed of a transparent conductive film, but can also be applied to the case where an opaque electrode is used.
FIG. 23 shows an example of a multilayer display device using an opaque cathode. When an opaque cathode is used in each display panel, the aperture ratio in one pixel 209 is slightly reduced, but full color display is possible by stacking so that the cathodes 204, 205, and 206 of each display panel do not overlap. Then, the lead wires 211, 212, and 213 of the adjacent three-color display elements 201, 202, and 203 in the same direction are controlled in the pressure-bonding region 214 by using a common cathode through a wiring circuit on one side as shown in FIG. Connect as you can. On the other hand, the lead wires 215, 216, and 217 for the anode are connected in the same manner as in FIG. 14, for example. In such a multilayer display device 200, the lead-out wiring of each display panel is simply connected, and the lead-out wirings 215, 216, and 217 for the anode are independently connected to the wiring member 208. Therefore, the display elements 201, 202, and 203 of each display panel can be controlled independently.

As mentioned above, although this invention was demonstrated, this invention is not limited to the said embodiment and Example. For example, in the above-described embodiment, the passive matrix organic EL display device has been described. However, the present invention can be applied to an active matrix stacked display device, and the display is not limited to a full color display. It can also be. Further, a double-sided display device or a single-sided display device may be used.
Moreover, although the said embodiment demonstrated the case where the lead-out wiring for cathodes was shared and controlled, the connection method is not limited to this. For example, in the multilayer display device 120 shown in FIG. 13, the lead-out wirings 94, 104, 114 for the cathodes of the display panels 90, 100, 110 are connected as shown in FIG. The cathode can also be controlled independently.
Further, in the display device shown in FIG. 13, as shown in FIG. 9, the lead wire connected to the lead wire of the anode of the intermediate G display panel 100 is provided on the anode side of the R display panel 90. The lead-out wiring for the display panel may be provided on the anode side of the B display panel 110, or may be provided on the cathode side of the R display panel 90 or the B display panel 110. In the case where four or more display panels are stacked, an extraction wiring for an intermediate display panel can be provided for either one of the anode and cathode of both outer display panels.
Furthermore, the present invention is not limited to stacking display panels on which organic EL elements are formed, and is a display element that emits light by application of an electric field or changes in optical characteristics, such as an inorganic EL element, a liquid crystal display element, or a plasma element. The present invention can also be applied to a multilayer display device in which display panels on which electrophoretic elements or the like are formed are stacked.

It is the schematic which shows an example of a structure of an organic electroluminescent display panel. It is the schematic which shows an example of arrangement | positioning and a connection state of the display panel of the multilayer display apparatus which concerns on this invention. It is the schematic which shows the other example of arrangement | positioning and a connection state of the display panel which comprises the multilayer display apparatus which concerns on this invention. It is the schematic which shows the state which crimped | bonded the part connected through the electroconductive material of each display panel shown in FIG. It is the schematic which shows the further another example of arrangement | positioning and the connection state of the display panel which comprise the multilayer display apparatus which concerns on this invention. It is the schematic which shows the further another example of arrangement | positioning and the connection state of the display panel which comprise the multilayer display apparatus which concerns on this invention. It is the schematic which shows the further another example of arrangement | positioning and the connection state of the display panel which comprise the multilayer display apparatus which concerns on this invention. It is the schematic which shows the further another example of arrangement | positioning and the connection state of the display panel which comprise the multilayer display apparatus which concerns on this invention. It is the schematic which shows an example of R display panel which comprises the laminated display apparatus which concerns on this invention. (A) Top view (b) AA 'line sectional view It is the schematic which shows an example of G display panel which comprises the laminated display apparatus which concerns on this invention. (A) Plan view (b) BB 'sectional view It is the schematic which shows the state which laminated | stacked R display panel and G display panel. (A) Plan view (b) CC 'sectional view It is the schematic which shows an example of B display panel which comprises the laminated display apparatus which concerns on this invention. (A) Top view (b) DD 'line sectional view It is a schematic plan view which shows the multilayer display apparatus which laminated | stacked each display panel of RGB. It is the schematic which shows the EE 'line cross section of each laminated RGB display panel shown in FIG. It is the schematic which shows the FF 'line cross section of each laminated RGB display panel shown in FIG. It is the schematic which shows an example of the anode pattern of each display panel. (A) R display panel (b) G display panel (c) B display panel It is the schematic which shows each display panel in which the display element and the cathode were formed. (A) R display panel (b) G display panel (c) B display panel It is the schematic which shows the laminated display panel which laminated | stacked each display panel of RGB so that each display element might overlap. It is a figure which shows the GG 'line cross section shown in FIG. It is a figure which shows the HH 'line cross section shown in FIG. It is a schematic plan view which shows the display panel which formed each display element of RB on one board | substrate. FIG. 22 is a schematic plan view showing a display panel in which G display elements to be stacked on the display panel of FIG. 21 are formed. It is a schematic plan view showing an example of a multilayer display device using an opaque cathode.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Organic EL display panel 2 ... Substrate 3 ... Anode 7 ... Cathode 8 ... Organic EL layer 9 ... Lead-out wiring 10, 20, 30, 40 ... Display panel 11, 31, 51, 61, 71... Multilayer display device 12, 22, 32, 42... Substrate 13, 23 ... Wiring member 14, 24, 34, 44.
16, 26, 36, 46 ... organic EL layers 17a, 17b, 27a, 27b ... wiring circuits 18, 29, 52, 62, 72 ... insulating layers 19a, 19b, 53, 54, 64, 66 , 74, 76 ... conductive material 90 ... R display panel 100 ... G display panel 110 ... B display panel 120 ... stacked display device (passive matrix type)

Claims (11)

A laminated display device in which two display panels are laminated,
Two display panels each having a display element including an electrode and a lead wiring connected to the electrode of the display element formed on the substrate;
Including a wiring member having a wiring circuit formed on both sides of the insulating base,
The two display panels are arranged such that the surfaces on which the display elements and the lead-out lines are formed face each other, and the display elements are separated from each other in an insulated state.
The wiring member is disposed between the lead wires of the two display panels, and the wiring circuit of the wiring member is connected to the lead wires of the display panels via conductive materials, respectively. A multilayer display device characterized by comprising: A laminated display device in which three or more display panels are laminated,
Three or more display panels each having a display element including an electrode and a lead wiring connected to the electrode of the display element formed on the substrate;
Including a wiring member having a wiring circuit formed on both sides of the insulating base,
Each of the stacked display panels is arranged so that the display elements are separated from each other in an insulated state,
The two display panels arranged on the outermost sides face each other on which the display elements and lead wires are formed, and each lead wire of the two display panels is between the two display panels. It is arranged so as to protrude from one end of the middle display panel,
The wiring member is disposed between the lead-out wirings of the two display panels disposed on the outermost side, and the wiring circuit of the wiring member is disposed on the outermost two displays. The intermediate display panel is connected to the lead-out wiring of the panel through a conductive material. One end of the lead-out wiring of the display panel protrudes from the lead-out wiring and is opposed to the other display panel. A laminated display device, wherein the display device is connected to a lead-out wiring of another display panel via a conductive material.   The through-hole is formed in the thickness direction of the insulating base material which comprises the said wiring member, The wiring circuit of both surfaces is connected through this through-hole, The Claim 1 or Claim 2 characterized by the above-mentioned. Multilayer display device.   In the multi-layer display device in which the three or more display panels are stacked, on at least one substrate of the two outermost display panels, one of the anode and the cathode of the display panel In addition to the lead wire connected to the electrode, a lead wire for another display panel insulated from the display element of the display panel is formed, and the lead wire connected to the one electrode of the intermediate display panel 4. The multilayer display device according to claim 2, wherein the display device is connected to a lead-out wiring for the other display panel via a conductive material. 5.   The multilayer display device according to claim 1, wherein the substrate has flexibility.   The multilayer display device according to claim 1, wherein a portion connected through the conductive material is pressure-bonded.   The multilayer display device according to any one of claims 1 to 6, wherein the multilayer display device is a passive matrix type.   The multilayer display device according to any one of claims 1 to 7, wherein the display panels are stacked such that display elements overlap each other.   8. The multilayer display device according to claim 1, wherein the stacked display panels are stacked such that display elements do not overlap each other. 9.   The multilayer display device according to any one of claims 1 to 9, wherein the display element is an organic EL element.   The multilayer display device according to claim 10, wherein an anode and a cathode of the organic EL element are formed of a transparent conductive film.

Images