JP2008107458A - Photosensitive resin composition and photosensitive element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of efficiently forming a cured film excellent in alkali developability and flame retardancy with high resolution. <P>SOLUTION: The photosensitive resin composition contains (A) a resin soluble in a dilute alkaline aqueous solution, which is a reaction product of (a) an epoxy resin represented by general formula (1), (b) an unsaturated bond-containing monocarboxylic acid and (c) a polybasic carboxylic acid anhydride, (B) a phenoxyphosphazene compound, (C) a compound having at least one ethylenically unsaturated bond, (D) a photopolymerization initiator and (E) a heat curing agent, wherein n represents an average and a number of 0-10; P and R represent H, a 1-8C alkyl group or an aryl group, P and R may be the same or different; and G represents a glycidyl group. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a photosensitive resin composition and a photosensitive element.

  In the printed wiring board manufacturing industry, conventionally, a solder resist is formed on a printed wiring board. This solder resist has a role to prevent solder from adhering to unnecessary portions of the conductor layer of the printed wiring board in the soldering process for bonding the mounted part to the printed wiring board. When the printed wiring board is used later, it also serves as a permanent mask for preventing corrosion of the conductor layer and maintaining electrical insulation between the conductor layers.

  As a method for forming a solder resist, for example, a method of screen printing a thermosetting resin on a conductor layer of a printed wiring board is known. However, since such a method has a limit in increasing the resolution of a resist pattern. However, it has become difficult to cope with the recent increase in the density of printed wiring boards.

  Therefore, in order to achieve high resolution of the resist pattern, the photoresist method has been actively used. In this photoresist method, a photosensitive layer made of a photosensitive resin composition is formed on a substrate, the photosensitive layer is cured by exposure of a predetermined pattern, and an unexposed portion is removed by development to form a cured film of a predetermined pattern. To do. In addition, the photosensitive resin composition used in such a method is mainly an alkali development type that can be developed with a dilute aqueous alkali solution such as an aqueous sodium carbonate solution from the viewpoint of conservation of the working environment and global environment. . As such a photosensitive resin composition, for example, a liquid resist ink composition described in Patent Document 1 below and a photosensitive thermosetting resin composition described in Patent Document 2 below are known.

JP-A 61-243869 JP-A-1-141904

  By the way, in recent years, regulations on flame retardancy of various industrial products against fire have become stricter, and materials used for printed wiring boards and the like are no exception. As a flame retardant method, a method of adding a halogen compound, an antimony compound, a phosphorus compound, a boron compound, an inorganic filler or the like is generally known. However, recently, with increasing interest in environmental issues and human safety issues, the focus has shifted to non-polluting, low toxic and safety, not only flammable but also harmful gases and fuming substances. Reduction is being demanded. In response, flame retardant substrates that do not use halogen compounds or antimony compounds have already been developed and put into practical use.

  However, when a cured film is formed on the above flame retardant substrate using the conventional photosensitive resin composition as described in Patent Documents 1 and 2, sufficient flame retardancy (UL94 V- It has been found by the examination of the present inventors that 0) cannot be secured.

  Then, this invention is made | formed in view of the said situation, and it aims at providing the photosensitive resin composition excellent in alkali developability and a flame retardance. Another object of the present invention is to provide a photosensitive element having a photosensitive layer made of such a photosensitive resin composition.

  As a result of intensive studies to achieve the above object, the present inventors have made the photosensitive resin composition contain a resin soluble in a dilute alkaline aqueous solution having a specific structure and a phosphorus-containing flame retardant. The inventors have found that the object can be achieved and have completed the present invention.

The present invention relates to the following.
1. (A) (a) a dilute alkaline aqueous solution that is a reaction product of an epoxy resin represented by the following general formula (1), (b) an unsaturated bond-containing monocarboxylic acid, and (c) a polybasic carboxylic acid anhydride. A soluble resin, (B) a phenoxyphosphazene compound, (C) a compound having at least one ethylenically unsaturated bond, (D) a photopolymerization initiator, and (E) a thermosetting agent. A photosensitive resin composition characterized by containing.

[In the formula (1), n represents an average value and represents a number of 0 to 10, P and R each represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an aryl group, and P and R represent one another. May be the same or different, and G represents a glycidyl group. ]

2. (B) The phenoxyphosphazene compound contains a compound having a cyclic structure represented by the following general formula (2) and / or a compound having a chain structure represented by the following general formula (3): Item 2. The photosensitive resin composition according to Item 1.

(In formula (2), m represents an integer of 1 to 20.)

(In formula (3), n represents an integer of 1 to 20)

3. Item 3. The photosensitive resin composition according to Item 1 or 2, further comprising (F) a phosphate ester.
4). Item 1-3, wherein the content of the component (A) in the photosensitive resin composition is 35 to 70% by weight and the phosphorus content is 1.5 to 5.0% by weight. The photosensitive resin composition in any one.
5. The board | substrate which formed the cured film using the photosensitive resin composition in any one of claim | item 1 -4 on the flexible base material.
6). Item 5. The photosensitive resin composition according to any one of Items 1 to 4, which is used for forming a permanent mask of a printed wiring board.
7). A photosensitive element comprising: a support; and a photosensitive layer made of the photosensitive resin composition according to any one of Items 1 to 4 formed on the support.

  ADVANTAGE OF THE INVENTION According to this invention, the photosensitive resin composition and photosensitive element which can form efficiently the cured film excellent in alkali developability, a flame retardance, and flexibility with high resolution can be provided.

  That is, the photosensitive resin composition of the present invention comprises (A) (a) an epoxy resin represented by the general formula (1), (b) an unsaturated bond-containing monocarboxylic acid, and (c) a polybasic carboxylic acid anhydride. A resin soluble in a dilute alkaline aqueous solution, (B) a phenoxyphosphazene compound, (C) a compound having at least one ethylenically unsaturated bond, and (D) initiation of photopolymerization. And (E) a thermosetting agent.

  When the photosensitive resin composition of the present invention contains the components (A) to (E), development with a dilute alkaline aqueous solution is possible, and a cured film obtained by curing the photosensitive resin composition. The flame retardancy of can be satisfied at a high level. Therefore, according to the photosensitive resin composition of the present invention, a cured film having sufficient flame retardancy can be efficiently formed with high resolution.

  Further, according to the photosensitive resin composition of the present invention, since the flame retardancy of the cured film can be made sufficiently high without containing a halogen compound or an antimony compound, for example, the environmental load of a printed wiring board And toxicity can be reduced. In particular, when the photosensitive resin composition of the present invention is applied to a non-halogen-based or non-antimony-based flame retardant substrate, the above-described effects are more effectively exhibited.

  In the photosensitive resin composition of the present invention, the resin soluble in the dilute aqueous alkali solution (A) is (a) an epoxy resin represented by the general formula (1) and (b) an unsaturated bond-containing monocarboxylic acid. It is a reaction product of an acid and (c) a polybasic carboxylic acid anhydride. By making the photosensitive resin composition contain a resin soluble in a dilute alkaline aqueous solution having the structure of the above general formula (1), both alkali developability and flame retardancy can be achieved.

  Further, the phenoxyphosphazene compound as the component (B) is more preferably a compound having a cyclic structure represented by the general formula (2) and / or a compound having a chain structure represented by the general formula (3). . Thereby, the cured film obtained by hardening | curing the photosensitive resin composition can have sufficient flame retardance. Further, the phenoxyphosphazene compound represented by the general formula (2) has a structure that is difficult to hydrolyze, and can effectively prevent the generation of ionic impurities that lower the electrical insulation, so that the cured film is excellent. It can have insulation reliability.

  The photosensitive resin composition may further contain (F) a phosphate ester. Thereby, the flame retardance of the cured film can be further improved, and since the phosphate ester functions as a plasticizer, the flexibility of the cured film can be further improved.

  In order for the cured film of the photosensitive resin composition to have good flame retardancy, the content of the component (A) in the photosensitive resin composition is preferably 35 to 70% by weight. Moreover, it is preferable in the photosensitive resin composition that phosphorus content is 1.5 to 5.0 weight%.

  The board | substrate which formed the cured film of this photosensitive resin composition on flexible base materials, such as a polyimide, has a flame retardance, It is characterized by the above-mentioned. The photosensitive resin composition does not contain a halogen-based compound or an antimony-based compound and can make the cured film sufficiently high in flame retardancy. For example, it reduces the environmental load and toxicity of a printed wiring board. Is possible.

  Since the photosensitive resin composition of the present invention can form a cured film having sufficient flame retardancy with high resolution and has sufficient flexibility, it is suitable for forming a permanent mask of a printed wiring board, particularly a flexible printed wiring board. It is preferable to be used.

  Moreover, this invention provides the photosensitive element characterized by including a support body and the photosensitive layer which consists of the said photosensitive resin composition of this invention formed on this support body.

  According to the photosensitive element of the present invention, it is possible to efficiently form a cured film having sufficient flame retardancy with high resolution by including the photosensitive layer made of the photosensitive resin composition of the present invention.

  Further, according to the photosensitive element of the present invention, since it has sufficient flame retardancy without using a halogen-based compound or an antimony-based compound, it is possible to efficiently produce a printed wiring board with low environmental load, low toxicity, and high resolution. Production becomes possible.

  Hereinafter, embodiments of the present invention will be described in detail. In the present invention, (meth) acrylic acid means acrylic acid and methacrylic acid corresponding thereto, (meth) acrylate means acrylate and corresponding methacrylate, and (meth) acryloyl group means acryloyl group. And the corresponding methacryloyl group.

[Photosensitive resin composition]
First, the photosensitive resin composition of the present invention will be described. The photosensitive resin composition of the present invention comprises (A) (a) an epoxy resin represented by the general formula (1), (b) an unsaturated bond-containing monocarboxylic acid, (c) a polybasic carboxylic acid anhydride, A resin soluble in a dilute aqueous alkali solution, (B) a phenoxyphosphazene compound, (C) a compound having at least one ethylenically unsaturated bond, and (D) a photopolymerization initiator, (E) a thermosetting agent.

Hereinafter, each component contained in the photosensitive resin composition of the present invention will be described.
<(A) component: resin soluble in dilute alkaline aqueous solution>
The (a) epoxy resin constituting the resin soluble in the dilute alkaline aqueous solution as the component (A) is represented by the following general formula (1).

［式（１）中、ｎは平均値を示し０〜１０の数を示し、Ｐ、Ｒは水素原子、炭素数１〜８のアルキル基、アリール基のいずれかを示し、Ｐ、Ｒはお互いに同一であっても異なっていてもよく、Ｇはグリシジル基を示す。］

[In the formula (1), n represents an average value and represents a number of 0 to 10, P and R each represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an aryl group, and P and R represent one another. May be the same or different, and G represents a glycidyl group. ]

  Specific examples of the (b) unsaturated bond-containing monocarboxylic acid constituting the resin soluble in the dilute alkaline aqueous solution as the component (A) include, for example, acrylic acid, a dimer of acrylic acid, methacrylic acid, β- Styrylacrylic acid, β-furfurylacrylic acid, crotonic acid, α-cyanocinnamic acid, cinnamic acid and saturated or unsaturated dibasic acid anhydride and (meth) acrylate derivative having one hydroxyl group in one molecule Examples thereof include half-esters that are reactants, and half-esters that are reactants of a saturated or unsaturated dibasic acid and an unsaturated group-containing monoglycidyl compound.

  Half esters include, for example, succinic anhydride, maleic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, itaconic anhydride, methylendomethylenetetrahydroanhydride. Saturated and unsaturated dibasic acid anhydrides such as phthalic acid, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, polyethylene glycol mono (meth) acrylate, glycerin di (meth) acrylate , Trimethylolpropane di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, (meth) acrylate of phenylglycidyl ether Half-esters obtained by reacting equimolar amounts of (meth) acrylate derivatives having one hydroxyl group in one molecule, or saturated or unsaturated dibasic acids (for example, succinic acid, maleic acid, adipine Acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, itaconic acid, fumaric acid, etc.) and an unsaturated group-containing monoglycidyl compound (for example, glycidyl (meth) acrylate) in an equimolar ratio. These (b) mornobonic acids can be used alone or in combination, and a particularly preferred monocarboxylic acid is acrylic acid.

  Specific examples of the (a) polybasic carboxylic acid anhydride constituting the resin soluble in the dilute alkaline aqueous solution as the component (A) include, for example, maleic anhydride, succinic anhydride, phthalic anhydride, and tetrahydrophthalic anhydride. Examples thereof include acid, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and head acid anhydride.

  The acid value of the resin soluble in the dilute alkaline aqueous solution as the component (A) is preferably 60 to 150 mgKOH / g, and more preferably 80 to 120 mgKOH / g. When the acid value is less than 60 mgKOH / g, development with dilute alkali aqueous solution tends to be difficult, and when it exceeds 150 mgKOH / g, the insulation reliability, chemical resistance and plating resistance of the resulting cured film tend to be insufficient. There is.

In addition, the acid value of (A) component can be measured with the following method. First, about 1 g of the resin solution as the component (A) is precisely weighed, 30 g of acetone is added to the resin solution, and the resin solution is uniformly dissolved. Next, an appropriate amount of phenolphthalein as an indicator is added to the solution, and titration is performed using a 0.1N aqueous KOH solution. And from the titration result, the following general formula (4);
A = 10 × Vf × 56.1 / (Wp × I) (4)
To calculate the acid value. In the formula, A represents the acid value (mgKOH / g), Vf represents the titration amount (mL) of phenolphthalein, Wp represents the weight (g) of the resin solution as component (A), and I represents (A) The ratio (mass%) of the non volatile matter of the resin solution as a component is shown.

  Resins that are soluble in the dilute alkaline aqueous solution that is component (A) can also be purchased. For example, ZCR-1569H, ZCR-1596H, ZCR-1611H, ZCR-1610H (all manufactured by Nippon Kayaku Co., Ltd., trade name) Can also be used.

<(B) component: Phenoxyphosphazene compound>
The phenoxyphosphazene compound as component (B) is a compound having a cyclic structure represented by the following general formula (2) and / or a compound having a chain structure represented by the following general formula (3). preferable.

（式（２）中、ｍは１〜２０の整数を示す。）

(In formula (2), m represents an integer of 1 to 20.)

（式（３）中、ｎは１〜２０の整数を示す。）

(In formula (3), n represents an integer of 1 to 20)

  Preferable examples of the phenoxyphosphazene compound include a compound having a cyclic structure represented by the general formula (2) and a compound having a chain structure represented by the general formula (3).

<(C) component: a compound having at least one ethylenically unsaturated bond>
(C) Specific examples of the compound having at least one ethylenically unsaturated bond include, for example, a bisphenol A-based (meth) acrylate compound; a compound obtained by reacting a polyhydric alcohol with an α, β-unsaturated carboxylic acid. A compound obtained by reacting a glycidyl group-containing compound with an α, β-unsaturated carboxylic acid; a urethane monomer or urethane oligomer such as a (meth) acrylate compound having a urethane bond; in addition to these, nonylphenoxypoly Phthalic acid systems such as oxyethylene acrylate; γ-chloro-β-hydroxypropyl-β ′-(meth) acryloyloxyethyl-o-phthalate, β-hydroxyalkyl-β ′-(meth) acryloyloxyalkyl-o-phthalate Compound; (meth) acrylic acid alkyl ester, EO modified Nirufeniru (meth) acrylate or the like can be exemplified. These can be used individually by 1 type or in combination of 2 or more types.

  Examples of bisphenol A-based (meth) acrylate compounds include 2,2-bis (4-((meth) acryloxypolyethoxy) phenyl) propane and 2,2-bis (4-((meth) acryloxypolypropoxy). ) Phenyl) propane, 2,2-bis (4-((meth) acryloxypolybutoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxypolyethoxypolypropoxy) phenyl) propane, etc. Can be mentioned.

  Examples of 2,2-bis (4-((meth) acryloxypolyethoxy) phenyl) propane include 2,2-bis (4-((meth) acryloxydiethoxy) phenyl) propane, 2,2- Bis (4-((meth) acryloxytriethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxytetraethoxy) phenyl) propane, 2,2-bis (4-((meth)) Acryloxypentaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxyhexaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxyheptaethoxy) phenyl) propane 2,2-bis (4-((meth) acryloxyoctaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxy nonaethoxy) ) Phenyl) propane, 2,2-bis (4-((meth) acryloxydecaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxyundecaethoxy) phenyl) propane, 2, 2-bis (4-((meth) acryloxydodecaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxytridecaethoxy) phenyl) propane, 2,2-bis (4- ( (Meth) acryloxytetradecaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxypentadecaethoxy) phenyl) propane and 2,2-bis (4-((meth) acryloxyhexa) Decaethoxy) phenyl) propane and the like, and 2,2-bis (4- (methacryloxypentaethoxy) phenyl) propane is BPE-5. 0 (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name) and 2,2-bis (4- (methacryloxypentadecaethoxy) phenyl) propane is BPE-1300 (manufactured by Shin-Nakamura Chemical Co., Ltd., (Commercial name) is commercially available. These can be used individually by 1 type or in combination of 2 or more types.

  Examples of 2,2-bis (4-((meth) acryloxypolypropoxy) phenyl) propane include 2,2-bis (4-((meth) acryloxydipropoxy) phenyl) propane, 2,2- Bis (4-((meth) acryloxytripropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxytetrapropoxy) phenyl) propane, 2,2-bis (4-((meth)) Acryloxypentapropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxyhexapropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxyheptapropoxy) phenyl) propane 2,2-bis (4-((meth) acryloxyoctapropoxy) phenyl) propane, 2,2-bis (4-((meth) acrylic) Xinonapropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxydecapropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxyundecapropoxy) phenyl) propane 2,2-bis (4-((meth) acryloxydodecapropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxytridecapropoxy) phenyl) propane, 2,2-bis ( 4-((meth) acryloxytetradecapropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxypentadecapropoxy) phenyl) propane and 2,2-bis (4-((meth)) And acryloxyhexadecapropoxy) phenyl) propane. These can be used individually by 1 type or in combination of 2 or more types.

  Examples of 2,2-bis (4-((meth) acryloxypolyethoxypolypropoxy) phenyl) propane include 2,2-bis (4-((meth) acryloxydiethoxyoctapropoxy) phenyl) propane, Examples include 2,2-bis (4-((meth) acryloxytetraethoxytetrapropoxy) phenyl) propane and 2,2-bis (4-((meth) acryloxyhexaethoxyhexapropoxy) phenyl) propane. These can be used individually by 1 type or in combination of 2 or more types.

  Examples of the compound obtained by reacting an α, β-unsaturated carboxylic acid with a polyhydric alcohol include 2 to 14 polyethylene glycol di (meth) acrylate propylene groups having 2 to 14 ethylene groups. Polypropylene glycol di (meth) acrylate, polyethylene polypropylene glycol di (meth) acrylate having 2 to 14 ethylene groups and 2 to 14 propylene groups, trimethylolpropane di (meth) acrylate, trimethylol Propane tri (meth) acrylate, EO-modified trimethylolpropane tri (meth) acrylate, PO-modified trimethylolpropane tri (meth) acrylate, EO / PO-modified trimethylolpropane tri (meth) acrylate, tetramethylol methanetri (meth) acrylate Examples include relate, tetramethylolmethane tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, and dipentaerythritol hexa (meth) acrylate. These can be used individually by 1 type or in combination of 2 or more types.

  “EO” refers to “ethylene oxide”, and “PO” refers to “propylene oxide”. “EO modified” means having a block structure of ethylene oxide units (—CH 2 CH 2 O—), and “PO modified” means having a block structure of propylene oxide units (—CH 2 CH (CH 3) O—). means.

  Examples of the compound obtained by reacting a glycidyl group-containing compound with an α, β-unsaturated carboxylic acid include trimethylolpropane triglycidyl ether tri (meth) acrylate and 2,2-bis (4- (meth) acryloxy- 2-hydroxy-propyloxy) phenyl and the like. Examples of the α, β-unsaturated carboxylic acid include (meth) acrylic acid. These can be used individually by 1 type or in combination of 2 or more types.

  Examples of the urethane monomer or urethane oligomer include (meth) acrylic monomers having an OH group at the β-position and diisocyanates such as isophorone diisocyanate, 2,6-toluene diisocyanate, 2,4-toluene diisocyanate, and 1,6-hexamethylene diisocyanate. Addition reaction product with compound, tris ((meth) acryloxytetraethylene glycol isocyanate) hexamethylene isocyanurate, EO modified urethane di (meth) acrylate, EO or PO modified urethane di (meth) acrylate, carboxyl group-containing urethane (meth) acrylate Etc. These can be used individually by 1 type or in combination of 2 or more types.

  Furthermore, examples of the (meth) acrylic acid alkyl ester include (meth) acrylic acid methyl ester, (meth) acrylic acid ethyl ester, (meth) acrylic acid butyl ester, and (meth) acrylic acid 2-ethylhexyl ester. It is done. These can be used individually by 1 type or in combination of 2 or more types.

<(D) component: Photopolymerization initiator>
Specific examples of the photopolymerization initiator as component (D) include, for example, benzophenone, 4,4′-bis (dimethylamino) benzophenone (Michler ketone), 4,4′-bis (diethylamino) benzophenone, 4-methoxy- 4′-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1-morpholinophenone) -butanone-1,2-ethylanthraquinone, phenanthrenequinone and other aromatic ketones, alkylanthraquinone and other quinones, benzoin methyl ether, Benzoin ethers such as benzoin ethyl ether and benzoin phenyl ether, benzoins such as methyl benzoin and ethyl benzoin, benzyl derivatives such as benzyl dimethyl ketal, 9-phenylacridine, 1,7-bis (9,9′-acridinyl) hepta And acridine derivatives such as N-phenylglycine, N-phenylglycine derivatives, and coumarin compounds. These can be used alone or in combination of two or more.

<(E) component: thermosetting agent>
Specific examples of the thermosetting agent as component (E) include thermosetting compounds such as epoxy resins, phenol resins, urea resins, and melamine resins. Examples of the epoxy resin include bisphenol A type tertiary fatty acid-modified polyol epoxy resin; diglycidyl esters such as diglycidyl phthalate and diglycidyl tetrahydrophthalate, and diglycidyl amines such as diglycidyl aniline and diglycidyl toluidine. Etc. These may be used alone or in combination of two or more.

  Moreover, the block isocyanate compound which is a latent thermosetting agent can also be used as a thermosetting agent which is (E) component. Examples of the blocked isocyanate compound include polyisocyanate compounds blocked with a blocking agent such as an alcohol compound, a phenol compound, ε-caprolactam, an oxime compound, and an active methylene compound. Examples of blocked polyisocyanate compounds include 4,4-diphenylmethane disissocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene 1,5-diisocyanate, o-xylene diisocyanate, m-xylene. Aromatic polyisocyanates such as diisocyanates and 2,4-tolylene dimers, aliphatic polyisocyanates such as hexamethylene diisocyanate, 4,4-methylenebis (cyclohexyl isocyanate) and isophorone diisocyanate, and alicyclic polyisocyanates such as bicycloheptane triisocyanate An aromatic polyisocyanate is preferable from the viewpoint of heat resistance, and an aliphatic polyisocyanate or an alicyclic polyisocyanate is preferable from the viewpoint of preventing coloring.

<(F) component: Phosphate ester>
In order to improve the flame retardancy and flexibility of the cured film, the photosensitive resin composition may further contain (F) a phosphate ester. Specific examples of phosphate esters include, for example, triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, 1,3-dihydroxybenzene / trichlorophosphine polycondensate phenol Examples include condensates and phenol condensates of 2,2-bis (p-hydroxyphenyl) propane / trichlorophosphine oxide polycondensate. These are commercially available, for example, TPP, TCP, TXP, CDP, XDP, CR-733S, CR-741, CR-747 (all are trade names manufactured by Daihachi Chemical Co., Ltd.), PFR, FP -600 and FP-700 (both manufactured by Adeka, trade names) and the like.

  In order for the photosensitive resin composition to have good flame retardancy, the content of the component (A) in the photosensitive resin composition is preferably 35 to 70% by weight, and preferably 40 to 65% by weight. And more preferred. When the component (A) is less than 35% by weight, the flame retardancy tends to decrease, and when it is more than 70% by weight, development with a dilute alkaline aqueous solution tends to be difficult. Further, the phosphorus content in the photosensitive resin composition for having good flame retardancy is preferably 1.5 to 5.0% by weight, and further preferably 2.0 to 4.5% by weight. preferable. When the amount is less than 1.5% by weight, the flame retardancy tends to decrease, and when the amount is more than 5.0% by weight, the folding resistance of the cured film tends to decrease.

  (B) It is preferable to contain a component so that it may become the range of the said phosphorus content.

  The content of the component (C) is preferably 7 to 30% by weight from the viewpoint of resolution and flame retardancy, and the content of the component (C) in the photosensitive resin composition is preferably 10 to 25%. More preferably, it is% by weight. When the content of the component (C) is less than 7% by weight, the resolution tends to be inferior, and when it is more than 30% by weight, the flame retardancy tends to decrease.

  From the viewpoint of photosensitivity, the content of the component (D) is preferably 0.1 to 10% by weight, preferably 0.2 to 5% by weight, of the component (D) in the photosensitive resin composition. % Is more preferable.

  The content of the component (E) is preferably 5 to 20% by weight of the component (E) in the photosensitive resin composition from the viewpoint of flame retardancy and insulation reliability, and 8 to 15 More preferably, it is% by weight.

  In addition, the photosensitive resin composition of the present invention includes a dye such as malachite green, a photochromic agent such as leuco crystal violet, a plasticizer such as a thermochromic inhibitor or p-toluenesulfonamide, phthalocyanine blue, if necessary. Phthalocyanine-based organic pigments such as azo-based pigments, inorganic pigments such as titanium dioxide, silica, alumina, talc, calcium carbonate or barium sulfate, and other fillers, antifoaming agents, stabilizers, and adhesion-imparting agents , A leveling agent, an antioxidant, a fragrance, an imaging agent, or the like. These components are each preferably contained in the photosensitive resin composition in an amount of about 0.01 to 20% by weight. Moreover, said component can be used individually by 1 type or in combination of 2 or more types.

  Furthermore, the photosensitive resin composition of the present invention may contain a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, propylene glycol monomethyl ether or the like as necessary. It can melt | dissolve in a mixed solvent and can apply | coat as a solution of solid content about 30-70 mass%.

  The photosensitive resin composition of the present invention as described above is applied as a liquid resist on a metal surface such as copper, a copper-based alloy, iron, and an iron-based alloy, and then dried, and a protective film is provided as necessary. It can be used by coating or in the form of a photosensitive element described later.

[Photosensitive element]
Next, the photosensitive element using the photosensitive resin composition of the present invention described above will be described.

  FIG. 1 is a schematic cross-sectional view showing a preferred embodiment of the photosensitive element of the present invention. The photosensitive element 1 shown in FIG. 1 includes a support 10 and a photosensitive layer 14 provided on the support 10. The photosensitive layer 14 is made of the above-described photosensitive resin composition of the present invention. In the photosensitive element of the present invention, the surface F1 on the opposite side of the support 10 on the photosensitive layer 14 may be covered with a protective film.

  The photosensitive layer 14 is formed by dissolving the photosensitive resin composition of the present invention in the above solvent or mixed solvent to obtain a solution having a solid content of about 30 to 70% by mass, and then applying the solution onto the support 10. It is preferable. Although the thickness of the photosensitive layer 14 changes with uses, it is the thickness after drying which removed the solvent by heating and / or hot air blowing, and it is preferable that it is 10-100 micrometers, and it is more preferable that it is 20-60 micrometers. If the thickness is less than 10 μm, it tends to be difficult to apply industrially, and if it exceeds 100 μm, the above-described effects produced by the present invention tend to be reduced, and in particular, flexibility and resolution tend to decrease.

  Examples of the support 10 included in the photosensitive element 1 include polymer films having heat resistance and solvent resistance such as polyethylene terephthalate, polypropylene, polyethylene, and polyester.

  The thickness of the support 10 is preferably 5 to 100 μm, and more preferably 10 to 30 μm. If the thickness is less than 5 μm, the support tends to be broken when the support is peeled off before development, and if it exceeds 100 μm, the resolution and flexibility tend to decrease.

  The photosensitive element 1 composed of two layers of the support 10 and the photosensitive layer 14 as described above or the photosensitive element composed of three layers of the support 10, the photosensitive layer 14 and the protective film can be stored as it is, for example. Alternatively, it may be wound around a roll core and stored with a protective film interposed.

  The method for forming a resist pattern using the photosensitive element of the present invention includes a removing step of removing the protective film from the photosensitive element as necessary, and a circuit for forming the photosensitive element in the order of the photosensitive layer and the support. A lamination process for laminating on the substrate, an exposure process for irradiating a predetermined portion of the photosensitive layer with an actinic ray through a support as necessary to form a photocured portion on the photosensitive layer, and a photosensitivity other than the photocured portion. And a developing step for removing the layer. The circuit-forming substrate is an insulating layer and a conductor layer (copper, copper-based alloy, iron-based alloy such as nickel, chromium, iron, stainless steel, preferably copper, copper-based alloy) formed on the insulating layer. , Made of an iron-based alloy).

  Examples of the laminating method in the laminating step after the removing step of removing the protective film as needed include a method of laminating by pressure-bonding to the circuit forming substrate while heating the photosensitive layer. The atmosphere during the lamination is not particularly limited, but the lamination is preferably performed under reduced pressure from the viewpoint of adhesion and followability. The surface to be laminated is usually the surface of the conductor layer of the circuit forming substrate, but may be a surface other than the conductor layer. The heating temperature of the photosensitive layer is preferably 70 to 130 ° C., the pressure bonding pressure is preferably about 0.1 to 1.0 MPa, and the ambient atmospheric pressure is more preferably 4000 Pa or less. There are no particular restrictions. Further, if the photosensitive layer is heated to 70 to 130 ° C. as described above, it is not necessary to pre-heat the circuit forming substrate in advance. However, in order to further improve the laminating property, the pre-heat treatment of the circuit forming substrate is performed. Can also be done.

  After the lamination is completed in this way, a photocured portion is formed by irradiating a predetermined portion of the photosensitive layer with actinic rays in the exposure step. Examples of the method for forming the photocured portion include a method of irradiating an actinic ray in an image form through a negative or positive mask pattern called an artwork. At this time, when the support on the photosensitive layer is transparent, it can be irradiated with actinic rays as it is, but when it is opaque, it is irradiated with actinic rays after removing the support.

  As the light source of actinic light, a known light source such as a carbon arc lamp, a mercury vapor arc lamp, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a xenon lamp, or the like that can effectively emit ultraviolet rays can be used. Moreover, what can radiate | emit visible light effectively, such as a flood bulb for photography, a solar lamp, can also be used.

  Next, after the exposure, if a support is present on the photosensitive layer, the support is removed, and then the development is performed by removing the photosensitive layer other than the photocured portion by wet development, dry development, or the like. Then, a resist pattern is formed. In the case of wet development, development is performed using a developer such as an alkaline aqueous solution by a known method such as spraying, rocking immersion, brushing, or scraping. As the developer, a developer that is safe and stable and has good operability is used. For example, a dilute solution (1 to 5% by mass aqueous solution) of sodium carbonate at 20 to 50 ° C. is used.

For example, when the resist pattern obtained by the above-described forming method is used as a solder resist for a printed wiring board, a high pressure is used for the purpose of improving solder heat resistance, chemical resistance, etc. as the solder resist after completion of the development process. It is preferable to perform ultraviolet irradiation with a mercury lamp or heating with an oven. In the case of irradiating ultraviolet rays, the irradiation amount can be adjusted as necessary. For example, the irradiation can be performed at an irradiation amount of about 0.2 to 10 J / cm ² . Moreover, when heating, it is preferable to carry out for about 15 to 90 minutes in the range of about 100-170 degreeC. Furthermore, both ultraviolet irradiation and heating may be performed, and after either one is performed, the other can also be performed.

  The resist pattern obtained by the above-described forming method is preferably used as a permanent mask formed on a printed wiring board. Since the cured film formed from the photosensitive resin composition of the present invention has excellent flame retardancy, it is effective as a permanent mask for a printed wiring board that also serves as a protective film for wiring after soldering to the substrate. is there.

EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples.
(Examples 1-3, Comparative Examples 1-2)
First, the photosensitive resin composition solution was obtained by mixing each component shown in Table 1 by the compounding ratio (weight basis) (however, methyl ethyl ketone is a mass basis as a liquid) shown there.

  In Table 1, component (A-1) is biphenyl type epoxy acrylate (manufactured by Nippon Kayaku Co., Ltd., trade name “ZCR-1569H”, acid value = 98, Mw = 4.5K), and (A-2 ) Component is bisphenol A type epoxy acrylate (manufactured by Nippon Kayaku Co., Ltd., trade name “ZAR-2001H”, acid value = 103, Mw = 13K), and (A-3) component is bisphenol F type epoxy acrylate ( Nippon Kayaku Co., Ltd., trade name “ZFR-1516”, acid value = 73, Mw = 11K).

  The component (B-1) is a phenoxyphosphazene compound (trade name SPB-100, phosphorus content = 13, manufactured by Otsuka Chemical Co., Ltd.), and the component (B-2) is a phosphate ester (manufactured by Adeka Corporation, product) Name “Adeka Stab FP-600”, phosphorus content = 8.9 wt%).

  The component (C) is bisphenol A polyoxyethylene dimethacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name “BPE-10”).

  The component (D) is 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1 (trade name “I-369” manufactured by Ciba Specialty Chemicals).

  The component (E) is a 75 mass% methyl ethyl ketone solution (trade name “BL3175”, manufactured by Sumika Bayer Urethane Co., Ltd.) of an isocyanurate methylethylketone oxime block having hexamethylene diisocyanate as a base isocyanate.

Note) The values in Table 1 are the blending ratio of the solid content of each component. (Excluding methyl ethyl ketone)
Moreover, the symbol “-” in the table indicates that the corresponding component is not contained.

[Production of photosensitive element]
Subsequently, these photosensitive resin composition solutions are separately and uniformly applied onto a 16 μm-thick polyethylene terephthalate film (manufactured by Teijin Ltd., trade name “G2-16”) as a support layer, thereby photosensitive resin composition. A layer was formed and dried for about 10 minutes at 100 ° C. using a hot air convection dryer. The film thickness after drying of the photosensitive resin composition layer was 38 μm.

  Subsequently, on the surface of the photosensitive resin composition layer opposite to the side in contact with the support layer, a polyethylene film (manufactured by Tamapoly Co., Ltd., trade name “NF-13”) is bonded as a protective film, and photosensitive. Got the element.

[Preparation of evaluation laminate]
And the copper surface of the board | substrate for flexible printed wiring boards (Nikkan Kogyo company make, brand name "F30VC1") which laminated | stacked 18-micrometer-thick copper foil on the polyimide base material was grind | polished with the abrasive brush, and it dried after washing with water. Using a continuous vacuum laminator (manufactured by Hitachi Chemical Co., Ltd., trade name “HLM-V570”) on this flexible printed wiring board substrate, a heat shoe temperature of 100 ° C., a laminating speed of 0.5 m / min, and a pressure of 4000 Pa or less, Under the condition of a pressure bonding pressure of 0.3 MPa, the obtained photosensitive element was laminated while peeling the polyethylene film to obtain a laminate for evaluation.

[Evaluation of light sensitivity]
On the obtained laminate for evaluation, a photo tool having a stove 21-step tablet as a negative was brought into close contact, and an HMW-201GX type exposure machine manufactured by Oak Manufacturing Co., Ltd. was used. The exposure was performed with an energy amount such that the number of steps remaining after development was 8.0. Then, after leaving still at normal temperature for 1 hour and peeling a PET film, it developed by spraying 1 weight% sodium carbonate aqueous solution of 30 degreeC for 40 second, and was heated (dried) at 80 degreeC for 10 minutes. The above energy amount was used as a numerical value for evaluating the photosensitivity. The lower this value, the higher the photosensitivity. The results are shown in Table 2.

[Resolution evaluation]
A phototool having a stove 21-step tablet and a phototool having a wiring pattern with a line width / space width of 30/30 to 200/200 (unit: μm) as a negative for resolution evaluation are provided on the evaluation laminate. Using the above-described exposure apparatus, the exposure was performed with an energy amount such that the number of remaining steps after development of the stove 21-step tablet was 8.0. Then, after leaving still at normal temperature for 1 hour and peeling a PET film, it developed by spraying 1 weight% sodium carbonate aqueous solution of 30 degreeC for 40 second, and was heated (dried) at 80 degreeC for 10 minutes. Here, the resolution was evaluated based on the smallest value (unit: μm) of the space width between the line widths in which a rectangular resist shape was obtained by development processing. It shows that it is excellent in the resolution, so that this value is small. The results are shown in Table 2.

[Production of evaluation FPC]
Further, on the obtained evaluation laminate, a phototool having a stove 21-step tablet and a phototool having a wiring pattern as a negative for coverlay reliability evaluation are used, and the above-described exposure machine is used. Then, the exposure was performed with an energy amount such that the number of remaining step stages after development of the stove 21-step tablet was 8.0. Next, after standing at room temperature for 1 hour, the polyethylene terephthalate on the laminate is peeled off, spray development is performed under the same developer and development conditions as in the photosensitivity evaluation, and heating (drying) at 80 ° C. for 10 minutes. did. Subsequently, the FPC for evaluation in which a coverlay was formed was obtained by performing ultraviolet irradiation with an energy amount of 1 J / cm ² using an ultraviolet irradiation device manufactured by Oak Manufacturing Co., Ltd., and further performing heat treatment at 160 ° C. for 60 minutes. It was.

[Evaluation of flexibility (folding resistance)]
The evaluation FPC obtained as described above was repeatedly folded 180 ° by goblet folding, and the number of times until cracks in the coverlay were generated was observed with a microscope, and evaluated according to the following criteria. That is, if the coverlay is not cracked even if it is bent 5 times or more, it is “A”, and if the number of times until the crack is generated is 2 times or more and 5 times or less, it is “B”. The number of times until 2 or less was designated as “C”. The results are shown in Table 2.

[Evaluation of flame retardancy]
The copper foil of the copper foil-clad laminate (manufactured by Nippon Steel Chemical Co., Ltd., product name “ESPANEX MB” series) was removed by etching to obtain a PI film having a thickness of 25 μm. Next, on both sides of the PI film, using a continuous vacuum laminator (manufactured by Hitachi Chemical Co., Ltd., trade name “HLM-V570”), a heat shoe temperature of 100 ° C., a laminating speed of 0.5 m / min, an atmospheric pressure of 4000 Pa or less, Under the conditions of a pressure bonding pressure of 0.3 MPa, the above-described photosensitive element was laminated while peeling the polyethylene film to obtain a laminate. Next, using the HMW-201GX type exposure machine manufactured by Oak Manufacturing Co., Ltd., the exposure of the photosensitive layer of the photosensitive element described above is such that the number of remaining steps after development of the stove 21-step tablet becomes 8.0. Done in quantity. Then, after leaving still at room temperature for 1 hour and peeling a polyethylene terephthalate film from a laminated body, a 1 weight% sodium carbonate aqueous solution of 30 degreeC is sprayed on a laminated body for 40 seconds, and it develops at 80 degreeC for 10 minutes. Heated (dried). Next, the laminate was subjected to ultraviolet irradiation with an energy amount of 1 J / cm ² using an ultraviolet irradiation device manufactured by Oak Manufacturing Co., Ltd., and further subjected to heat treatment at 160 ° C. for 60 minutes to form a coverlay. A sample for flame retardancy evaluation was obtained. This flame retardant evaluation sample was subjected to a thin material vertical combustion test based on the UL94 standard. Evaluation was expressed as VTM-0 or VTM-1 based on the UL94 standard. The results are shown in Table 2. Note that “NOT” in Table 2 indicates that the flame retardancy evaluation sample did not fall under VTM-0, VTM-1, or VTM-2 in the combustion test and was completely burned.

  As is clear from Table 2, it was confirmed that the photosensitive resin compositions of Examples 1, 2, and 3 can provide sufficient photosensitivity and resolution. Moreover, it was confirmed that the laminated board provided with the cured film formed from the photosensitive resin composition of Example 1, 2, and 3 has sufficient flame retardance (VTM-0). Furthermore, it turned out that the cured film formed from the photosensitive resin composition of Example 2 and 3 has the outstanding flexibility (folding resistance).

It is sectional drawing which shows one Embodiment of the photosensitive film of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Photosensitive element 10 ... Support body 14 ... Photosensitive layer F1 ... The surface on the opposite side of the support body on a photosensitive layer

Claims (7)

(A) (a) a dilute alkaline aqueous solution that is a reaction product of an epoxy resin represented by the following general formula (1), (b) an unsaturated bond-containing monocarboxylic acid, and (c) a polybasic carboxylic acid anhydride. A soluble resin, (B) a phenoxyphosphazene compound, (C) a compound having at least one ethylenically unsaturated bond, (D) a photopolymerization initiator, and (E) a thermosetting agent. A photosensitive resin composition characterized by containing.

[In the formula (1), n represents an average value and represents a number of 0 to 10, P and R each represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an aryl group, and P and R represent one another. May be the same or different, and G represents a glycidyl group. ] (B) The phenoxyphosphazene compound contains a compound having a cyclic structure represented by the following general formula (2) and / or a compound having a chain structure represented by the following general formula (3): The photosensitive resin composition according to claim 1.

(In formula (2), m represents an integer of 1 to 20.)

(In formula (3), n represents an integer of 1 to 20)   Furthermore, the photosensitive resin composition of Claim 1 or 2 containing (F) phosphate ester.   The content of the component (A) in the photosensitive resin composition is 35 to 70% by weight, and the phosphorus content is 1.5 to 5.0% by weight. The photosensitive resin composition in any one of 1.   The board | substrate which formed the cured film on the flexible base material using the photosensitive resin composition in any one of Claims 1-4.   The photosensitive resin composition in any one of Claims 1-4 used for permanent mask formation of a printed wiring board.   A photosensitive element comprising: a support; and a photosensitive layer made of the photosensitive resin composition according to claim 1 formed on the support.

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