JP2008100307A - Substrate dividing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate dividing device capable of cutting bridges connecting substrates one by one by easily and automatically detecting them without carrying out numerical control, image processing, etc. regardless of their number, positions and size, etc. of substrate materials. <P>SOLUTION: This substrate dividing device is furnished with a main slider 28 free to move along a guide rail 26, a subsidiary slider 30 free to displace in the same direction on the main slider, a vertical motion cylinder 32 provided on it, a hook type upper blade 36 mounted on its movable part, a pair of lower blades to support a lower surface of the substrate material 16 by a top board part 20, a driving mechanism to move the main slider, a spring 46 to push the subsidiary slider in the forwarding direction of the main slider and a displacement sensor 48 to detect relative displacement of the subsidiary slider against the main slider and is devised to cut the bridges one by one by detecting contact of the upper blade with the bridges 14 by the displacement sensor and lowering the upper blade. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an apparatus for dividing a substrate material in which a plurality of substrates are continuous by bridges by cutting each bridge one by one. More specifically, the present invention relates to a plurality of devices arranged linearly in a substrate material. The present invention relates to a substrate dividing apparatus that automatically cuts a bridge by a combination of an upper blade and a lower blade regardless of the number of bridges, the position, the size of the substrate material, and the like.

  As the circuit board (printed circuit board) incorporated in the electronic equipment is highly functional and the high-density mounting of the components, the circuit board on which the chip parts are mounted is inspected. In some cases, a substrate material 16 having a shape in which a discarding substrate 12 for inspection is arranged adjacent to the circuit board 10 and continuous with a plurality of bridges 14 is used. A separation slit 18 is formed between the bridges 14, and the circuit board 10 and the discard board 12 are partitioned by the separation slit 18. After the inspection is finished, each bridge 14 is cut to divide the board, and the circuit board 10 is separated. Take out.

  Conventionally, for cutting bridges, using a press machine or the like, a mold is placed under the substrate material and the upper punch is lowered from above to cut, and the saw blade is moved up and down to cut. There are a saw blade method, a cutting blade rotation method in which a small diameter rotary cutting blade is applied for cutting (see Patent Document 1), and the like.

  However, the saw blade method and the cutting blade rotation method generate a large amount of cutting powder, which scatters, so that there is a problem of soiling not only the periphery of the apparatus but also the circuit board. On the other hand, the die method generates a small amount of cutting powder, but the die is expensive and may cause great stress on the board material. There is a possibility that problems such as peeling off of the part may occur, which causes a decrease in reliability.

In addition, in the prior art, there is also a manual method for visually confirming the position of the bridge, but in order to perform this automatically, it is necessary to input the bridge position as numerical data in advance or to detect the bridge by image processing. In any case, the control device is complicated and expensive. For example, when the bridge position is detected by numerical control using a stepping motor or the like, all the bridge position data must be input in advance for each substrate material, and the high-precision two-dimensional substrate material is used. Position adjustment is also necessary, so that the setup change by changing the model is troublesome and requires time and effort. Therefore, this method is not suitable for high-mix low-volume production.
JP-A-6-190620

  The problem to be solved by the present invention is to automatically detect the bridge connecting the substrates regardless of the number, position, size of the substrate material, etc., and without performing numerical control or image processing. And it is to be able to cut one by one. Accordingly, the apparatus can be configured at low cost, and the setup change by changing the model can be easily and quickly performed.

  The present invention capable of achieving the above object is an apparatus frame in which a plurality of substrates are partitioned by separation slits, and a substrate material continuous by a bridge between the separation slits is divided by cutting the bridge. A main slider that is movable in a horizontal direction along a guide rail fixed to a lower portion of the main slider, a sub slider mounted on the main slider so as to be displaceable in the same direction as the movement direction, and on the sub slider An installed vertical motion cylinder, a bowl-shaped upper blade attached to the movable part of the vertical motion cylinder, and a separation slit for the substrate material extending horizontally to support the lower surface of the substrate material at the top plate portion of the apparatus frame A pair of lower blades facing each other at an interval of a width or less, a drive mechanism for moving the main slider, and a repelling force that pushes the sub slider in the forward direction of the main slider. And a displacement sensor for detecting the relative displacement of the slave slider with respect to the main slider. The displacement sensor detects contact of the upper blade that has advanced from the relative displacement with the bridge, and the upper blade is moved by the vertical movement cylinder. Is a substrate dividing apparatus that cuts one bridge at a time by a combination of an upper blade and a lower blade.

  The board material is, for example, a shape in which a circuit board for device assembly and a discard board for inspection are continuous by a plurality of bridges arranged linearly, and a chip component faces on the circuit board. It may be implemented.

  In the substrate dividing apparatus according to the present invention, the movement of the slave slider stops when the advanced upper blade hits the bridge, and the relative displacement (positional deviation) between the slave slider and the main slider caused by the main slider continuing to move relative thereto. Is detected by a displacement sensor and it is recognized that the upper blade is in contact with the bridge. Therefore, the position of the bridge can be easily detected regardless of the number and position of the bridges. Therefore, an expensive image processing apparatus is not required, and troublesome numerical control is not required. Then, by lowering the upper blade in this state, the bridge can be cut with the upper blade and the lower blade, and by sequentially performing the operation for each bridge, generation of cutting powder can be suppressed to a small amount and the substrate can be divided. For this reason, the board can be divided regardless of the number and position of the bridges, the size of the board material, etc., the setup change accompanying the model change is facilitated, and the high-mix low-volume production can be efficiently performed.

  FIG. 1 is a schematic perspective view of a substrate dividing apparatus according to an embodiment of the present invention with a part removed. 2A is a detailed view of the main part viewed from the front, and B is a side view showing the details of the upper blade and the lower blade (the portion surrounded by a dot-dash line circle in A) (advance of the upper blade). It is sectional drawing seen from (direction). The substrate dividing apparatus is an apparatus that performs substrate division by cutting the bridges 14 formed on the substrate material 16 one by one. Here, the substrate material 16 is a glass epoxy resin substrate or the like, and, as shown in FIG. 4, for example, a plurality of bridges in which a circuit board for assembling equipment and a discard board for inspection are linearly arranged. It is a continuous plate-like body. A chip component or the like may be surface-mounted on the circuit board.

  Here, the apparatus frame has a structure in which the top plate portion 20 is positioned above the bottom plate portion 22 and is held horizontally by a plurality of support columns 24 arranged around the top plate portion 20. A guide rail 26 is fixed on the bottom plate 22 so as to extend almost the entire length in the longitudinal direction near the center in the width direction. The guide rail 26 engages with the guide rail 26 and is movable along the guide rail 26 in the horizontal direction. The slider 28 is installed. A slider 30 is mounted on the main slider 28 so as to be displaceable in the same direction as the movement direction of the main slider 28. Further, a vertical movement cylinder 32 is installed on the sub slider 30, and a vertical upper blade 36 is attached to a movable portion of the vertical movement cylinder 32 by a chuck 34. On the other hand, the top plate portion 20 of the apparatus frame extends in the horizontal direction to support the lower surface of the substrate material, and as shown in FIG. 2B, the width W of the separation slit 18 of the substrate material 16 (FIG. 4). A pair of lower blades 38 that are opposed to each other with an interval of (see) are provided. The blade width of the upper blade 36 is just such a dimension that it can slide between a pair of lower blades, and the length of the collar (blade length) is the length that can cut the bridge of the substrate material (of the separation slit 18). The length L of the bridge 14 in the length direction (see FIG. 4 or more).

  A drive mechanism for moving the main slider 28 is provided on the bottom plate portion 22 of the apparatus frame. Here, a drive motor 40 installed on one end side of the bottom plate portion 22 is used, and transmission means such as a belt 44 is bridged between the drive shaft and a pulley 42 held on the other end side of the bottom plate portion 22. The belt 44 is coupled to the main slider 28. By actuating the drive motor 40, the belt 44 rotates, and the main slider 28 coupled thereto can move along the guide rail 26. In the bridge cutting process, the main slider 28 moves forward in the direction of arrow M.

  Mounted on the main slider 28 are a spring 46 for imparting an elastic force to press the sub slider 30 in the forward direction of the main slider 28, and a displacement sensor 48 for detecting relative displacement of the sub slider 30 with respect to the main slider 28. . As the displacement sensor 48, for example, a photo sensor is used. A displacement sensor 48 is attached to the main slider 28 side, and a dog 50 is projected on the secondary slider 30 side. When the dog 50 covers the displacement sensor 48, the light is interrupted and the displacement is detected. It is also possible to use a magnetic sensor or a proximity switch instead of the photo sensor. A stopper 52 is provided on the front end side of the main slider 28 so that the front end surface of the sub slider 30 is kept in contact with the stopper 52 even when the spring force of the spring 46 is applied. It has become. In such a configuration, the slave slider 30 usually moves forward with the main slider 28 (without relative displacement), but when the slave slider 30 cannot move forward together for some reason, the slave slider 30 stops. On the other hand, the main slider 28 tries to move further against the resilience of the spring 46, and the displacement (positional deviation) between the slave slider 30 and the main slider 28 generated thereby is detected by the displacement sensor 48. It will be.

  The vertical movement cylinder 32 installed on the sub slider 30 is an air cylinder here, and is configured so that the movable portion can be lowered and raised by alternately supplying pressurized air to the upper and lower air pipes 54. A chuck 34 is attached to the movable portion of the vertical movement cylinder 32, and the upper blade 36 is fixed by the chuck 34. The upper blade 36 is attached so that its hook-shaped portion faces forward in the forward direction. Above the chuck 34, the base of the upper blade 36 is surrounded by a cutting waste receiving container 56 with a space therebetween, and the receiving container 56 receives the falling cutting waste and vacuums it from the side of the receiving container 56. Thus, the cutting waste received can be sucked out to the outside. Although not shown in FIG. 1, a bellows-shaped receiving container cover 58 made of rubber or the like is attached between the lower blade 38 and the receiving container 56 to prevent scattering of cutting waste and cutting powder.

  Next, a series of operations of the device of the present invention will be described with reference to FIG. In FIG. 3, in order to explain the operation, some of the detailed parts are omitted. First, the substrate material 16 is set on the top plate portion 20. At this time, the dividing slit 18 of the substrate material 16 is made to coincide between the pair of lower blades 38. When the substrate material 16 is set, the width direction of the division slit 18 needs to be accurately positioned as described above, but the length direction of the division slit 18 does not need to be particularly strictly positioned. That is, it is only necessary to adjust the position in one direction and hold it in that state.

  As shown in A of FIG. 3, the upper blade 36 is moved in the dividing line direction (direction in which the dividing slits 18 are connected) from one end side to the other end side of the substrate material 16. When the belt 44 is rotated by the drive motor 40, the main slider 28 coupled to the belt 44 moves along the guide rail 26. Since the sub slider 30 is pressed in the forward direction of the main slider 30 by the spring 46, the sub slider 30 and the vertical movement cylinder 32, as well as the upper blade 36, etc., move forward together with the main slider 28. At this time, the upper blade 36 moves along the divided slit 18 in a state where the hook-shaped portion at the tip protrudes above the substrate material 16 between the pair of lower blades 38 and the divided slit 18.

  As shown in FIG. 3B, when the upper blade 36 hits the bridge 14, the advancement of the upper blade 36 is forcibly stopped by the bridge 14. Accordingly, the advancement of the secondary slider 30 is also stopped. However, since the main slider 28 continues to move forward, the spring 46 contracts and a relative displacement (displacement) occurs between the main slider 28 and the sub slider 30. Thus, when the displacement sensor 48 overlaps with the dog 50, light is blocked by the dog 50, so that the occurrence of displacement is detected. Thereby, it can be seen that the upper blade 36 is in contact with the bridge 14. In response to the displacement detection signal from the displacement sensor 48, the operation of the drive motor 40 is temporarily stopped, whereby the forward movement of the main slider 28 is also stopped.

  As shown in FIG. 3C, in this state, the vertical movement cylinder 34 is operated and the upper blade 36 is lowered. As a result, the bridge 14 is cut by the upper blade 36 (the saddle portion) and the lower blades 38 on both sides. The cutting waste falls into the receiving container 56.

  After the bridge is cut, nothing obstructs the forward movement of the upper blade 36 is eliminated, so that the secondary slider 30 is automatically advanced by the elastic force of the spring 46 and passes through the bridge cutting mark. After the displacement detection state by the displacement sensor 48 is released, the vertical movement cylinder 34 is operated to raise the upper blade 36. As a result, the original state (the state shown in FIG. 3A) is restored. Thereafter, the main slider 28 is moved forward again by the drive motor 40. By repeating this series of operations, even an irregular multipoint bridge can be automatically detected and cut one by one. The substrate is divided by cutting all the bridges. Thereafter, the drive motor is reversed, the main slider is retracted and returned to the initial position, and a new substrate material is set, so that the substrate can be divided again.

  In the device of the present invention, as described above, since the bridge is sheared one by one with the upper blade and the lower blade, the generation of cutting powder can be suppressed to a small amount, and the cut cutting waste is received by the receiving container. Since the vacuum is exhausted from the receptacle, the surroundings are hardly contaminated. Further, since the bridges are cut one by one, the stress applied to the substrate material at the time of cutting is small, and the reliability can be improved without fear that the mounted components are damaged or the soldering is peeled off.

The schematic perspective view which removed a part which shows one Example of the board | substrate division | segmentation apparatus which concerns on this invention. Detailed view seen from the front. FIG. The top view which shows an example of a board | substrate material.

Explanation of symbols

14 Bridge 16 Substrate material 20 Top plate portion 22 Bottom plate portion 26 Guide rail 28 Main slider 30 Sub slider 32 Vertical movement cylinder 34 Chuck 36 Upper blade 38 Lower blade 40 Drive motor 44 Belt 46 Spring 48 Displacement sensor 50 Dog

Claims (2)

In an apparatus in which a plurality of substrates are partitioned by separation slits and a substrate material that is continuous by a bridge between the separation slits is divided by cutting the bridge,
A main slider which is movable in the horizontal direction along a guide rail fixed to the lower part of the apparatus frame, a sub slider mounted on the main slider so as to be displaceable in the same direction as the movement direction, and the sub slider Vertically moving cylinder installed above, vertical upper blade attached to the movable part of the vertically moving cylinder, and horizontally extending so as to support the lower surface of the substrate material by the top plate portion of the apparatus frame. A pair of lower blades facing each other at an interval equal to or smaller than the width of the slit, a drive mechanism for moving the main slider, a spring for applying a repelling force to press the sub slider in the forward direction of the main slider, and the main slider A displacement sensor for detecting relative displacement with respect to the slider, the contact of the upper blade that has advanced from the relative displacement with the bridge is detected by the displacement sensor, and the upper blade is moved by the vertical movement cylinder. Fusa allowed, substrate dividing apparatus being characterized in that so as to sever said bridge by a combination of upper and lower blades one by one.   The board material has a shape in which a circuit board for device assembly and a discarded board for inspection are continuous by a plurality of bridges arranged linearly, and chip components are surface-mounted on the circuit board. The substrate dividing apparatus according to claim 1, wherein

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