JP2008100232A - Method and device for collecting scattering object in laser machine or plasma machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and a device for efficiently collecting scattering objects generated during the machining in a laser machine or a plasma machine having the determined machining locus. <P>SOLUTION: This invention relates to the method and the device for efficiently collecting scattering objects during the machining in the laser machine for machining a workpiece by applying laser beams from a nozzle provided on a machining head, or the plasma machine for machining the workpiece by jetting plasma gas from a nozzle provided on a machining head, wherein a blocking body which surrounds both sides of the machining locus on which the workpiece is machined and also surrounds the side of the machining head from a vicinity of a surface of the workpiece at predetermined intervals and a dust collecting hood for covering the machining head and the nozzle to the substantially same height as the nozzle are arranged, and scattering objects generated during the machining are collected by a sucking means provided inside the dust collecting hood. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method and apparatus for collecting scattered matter such as spatters and fumes generated during a processing operation in a laser processing machine or a plasma processing machine.

  When processing a workpiece with a laser processing machine or a plasma processing machine, scattered matter such as spatters and fumes is generated, and the working environment is deteriorated.

  For example, as shown in FIG. 5, the scattered matter 2 generated when piercing is performed by the laser beam or the plasma gas 3 scatters in four directions on the upper surface of the workpiece W and further diffuses into the space where the machining operation is performed. Deteriorate the working environment.

  Further, as shown in FIG. 6, most of the scattered matter 2 generated during the cutting process in the laser processing machine and the plasma processing machine passes to the lower surface of the workpiece, but a part of the scattered material 2 is on the four sides of the upper surface of the workpiece W depending on the thickness and material of the workpiece. Scatter. Although the amount of scattered matter 2 on the upper surface of the workpiece W is small, the working environment is still deteriorated.

  In order to collect such scattered matter 2 such as spatter and fume, a dust collecting duct is installed and sucked so as to cover the vicinity of the processing nozzle. However, the portion of the scattered matter 2 that flows out along the surface of the workpiece W can hardly be sucked by the duct provided above the workpiece W.

  Therefore, as shown in FIG. 7, the periphery of the processing nozzle 1 is surrounded by a curtain 5 to prevent scattering of scattered objects. Further, double curtains are provided, dust collection ducts are provided inside each curtain, and the scattered matter is sucked and collected. (See Patent Document 1)

Japanese Patent Laid-Open No. 9-271980

  However, such conventional techniques have the following problems.

  (1) In the vicinity of the processing portion, scattered matter is mixed into the assist gas for the laser processing machine and the plasma gas for the plasma processing machine, and the curtain is pushed up and scattered outside.

  (2) Since the thickness and material of the workpiece W change, the gap between the curtain and the workpiece surface changes, and sufficient scattering prevention cannot be performed.

  The object of the present invention has been made by paying attention to the problems in the prior art as described above, and in a laser processing machine and a plasma processing machine that improve the recovery efficiency of scattered matter scattered along the workpiece surface. It is an object to provide a method and an apparatus for sucking scattered objects.

In order to solve the above problems, the invention according to claim 1
In a laser processing machine that processes a workpiece by irradiating a laser beam from a nozzle provided in the processing head, or a plasma processing machine that processes a workpiece by injecting a plasma gas from a nozzle provided in the processing head,
Provide both sides of the machining trajectory where machining is performed on the workpiece, with a predetermined interval, and a shield that surrounds the side where the machining head is located from near the workpiece surface,
A dust collection hood is provided that covers the processing head and the nozzle to substantially the same height as the nozzle,
A method for collecting scattered matter in a laser processing machine and a plasma processing machine, wherein the scattered matter generated during processing is collected by suction means provided in the dust collection hood.

  Therefore, in the method for collecting scattered matter according to claim 1, the shielding matter shields the scattered matter generated when processing is performed by irradiating the workpiece with a laser beam or jetting plasma gas from the nozzle, and is substantially the same as the nozzle. It can collect | recover, when the suction means provided in the dust collection hood of height sucks.

The invention according to claim 2 of the present invention is
In a laser processing machine that processes a workpiece by irradiating a laser beam from a nozzle provided in the processing head, or a plasma processing machine that processes a workpiece by injecting a plasma gas from a nozzle provided in the processing head,
A shield that surrounds the side of the workpiece head from the vicinity of the workpiece surface on both sides of the machining locus on which the machining is performed on the workpiece;
A dust collection hood that covers the processing head and the nozzle to substantially the same height as the nozzle;
Suction means provided inside the dust collection hood;
A device for collecting scattered matter in a laser processing machine or a plasma processing machine.

  Therefore, in the scattered matter recovery apparatus according to claim 2, the shielding matter shields the scattered matter generated when processing is performed by irradiating the workpiece with a laser beam or jetting plasma gas from the nozzle, and is substantially the same as the nozzle. It can collect | recover, when the suction means provided in the dust collection hood of height sucks.

  The invention according to claim 3 of the present invention is characterized in that the interval between the shielding objects is 5 to 10 times the laser beam diameter of the laser processing machine or the plasma gas diameter of the plasma processing machine. 2. A scattered matter recovery apparatus in the laser processing machine or plasma processing machine described in 2.

  Therefore, the width of the gap between the shields of the scattered matter collecting apparatus according to claim 3 is generally guaranteed in processing accuracy, and the assist gas of the laser processing machine and the plasma gas of the plasma processing machine are stably supplied. Since it is the range which can be ejected, a laser beam and plasma gas do not hit a shield. Moreover, it is the range which can shield the scattered matter scattered with the assist gas of a laser processing machine, and the plasma gas of a plasma processing machine.

  The invention according to claim 4 of the present invention is characterized in that the height of the shield is ½ or more of the distance from the vicinity of the workpiece surface to the machining nozzle and smaller than the distance to the machining nozzle. It is a collection device of the scattered matter in the laser processing machine or plasma processing machine of Claim 2.

  Therefore, the height of the gap between the shields of the scattered matter collecting apparatus according to claim 4 is such that even when the machining head moves to a position deviating from the machining locus, It is possible to avoid physical interference. In addition, when processing is performed within the processing trajectory, it is within a range in which scattered matter such as fumes, spatter, and smoke discharged by the assist gas of the laser processing machine and the plasma gas of the plasma processing machine can be stably shielded.

  The invention according to claim 5 of the present invention is characterized in that the height of the lower end of the dust collecting hood is not less than the height of the lower end of the machining nozzle and not more than the height of the lower end of the machining head. This is a device for collecting scattered matter in the laser processing machine or plasma processing machine.

  Accordingly, the height of the lower end of the dust collection hood of the scattered matter collecting apparatus according to claim 5 is shielded from the lower end of the dust collection hood even when the machining head moves to a position deviating from the machining locus. It is possible to avoid physical interference with objects. In addition, since the distance between the dust collection hood and the scattered matter generated during processing is short, the scattered matter can be stably sucked.

  As described above, in the scattered matter recovery method and apparatus in the laser processing machine or plasma processing machine of the present invention, the scattered matter generated when processing is performed by irradiating the workpiece with a laser beam or jetting plasma gas from the nozzle. Can be recovered by suction by a suction means provided in a dust collection hood having the same height as the nozzle.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic diagram showing the whole of a general laser beam machine 10, but since its structure is already well known, only the outline will be described.

  The processing head drive type laser processing machine 10 has a fixed work table 18 laid horizontally for loading the work W, and the work W is held above the work table 18 for movement and positioning. A carriage 19 is provided.

  Above the work table 18, there is an upper frame 13 having a laser passage 12 for guiding a laser beam LB oscillated from the laser oscillator 11, and a laser beam LB is applied to the tip of the upper frame 13. A machining head 21 including a machining nozzle 20 that irradiates the workpiece W is provided.

  The upper frame 13 and the processing head 21 are provided with a bend mirror 14, a condenser lens 15, and the like, and the laser beam LB that has passed through the laser passage 12 is irradiated from the processing nozzle 20.

  Above the work table 18, an upper frame 13 having a laser passage 12 for guiding a laser beam LB oscillated from the laser oscillator 11 is provided. Laser processing is performed by irradiating the laser beam LB toward the surface.

  FIG. 2 is a front view showing the scattered matter suction device in the laser beam machine in the present embodiment. Around the processing head 21, a shield 22 is loaded on the workpiece along the processing locus of the processing head 21. The shield 22 has a weight that does not move due to the ejection of laser processing assist gas or plasma gas, vibration during processing, and the influence of suction airflow from the dust collection duct.

  In addition, a dust collection hood F having the same height as that of the processing nozzle 20 is provided so as to cover the processing head 21. A dust collection duct (not shown) is provided inside the dust collection hood F, and is connected to suction means (not shown).

  FIG. 3 is a plan view of the AA plane in FIG. As shown, the scattered matter 23 generated during processing is collected from the dust collection duct inside the dust collection hood F.

  The scattered matter 23 generated at the time of processing is shielded by the shielding object 22 and is aggregated only on the processing locus, and the number of scattered matters is reduced in other places. Further, as shown in FIG. 2, the portion of the scattered matter 23 that flows along the surface of the workpiece W moves to the dust collecting hood F along the side surface of the scattered matter 23 when blocked by the shielding object 22. It becomes easy to be collected in the dust collection duct inside the hood F.

  FIG. 4 is a plan view of the workpiece W and the shielding object 22 loaded on the workpiece W as viewed from above. The shield 22 has a structure that surrounds both sides of the machining trajectory with a predetermined interval L and covers most of the part other than the machining trajectory on the surface of the workpiece W.

  The distance L between the shields 22 is a laser beam diameter or plasma gas that is generally in a range in which processing accuracy is guaranteed and the assist gas of the laser processing machine and the plasma gas of the plasma processing machine can be stably ejected. If the diameter is set to be not less than 5 times and not more than 10 times, the shielding object 22 is not accidentally irradiated with a laser beam or plasma.

  Further, if the height H of the shield 22 is set to be ½ or more of the machining nozzle height and less than the machining nozzle height, the machining head 21 may move to a position off the machining locus. Even in this case, it is possible to avoid physical interference between the tip of the processing nozzle 20 and the shield 22.

  By the shielding object 22 having the above-described structure, the scattered matter generated during processing is collected on the processing locus, and is sucked and collected by the dust collection duct inside the dust collection hood F having the same height as the processing nozzle 20. So it can be prevented from leaking outside.

  As described above, in the present embodiment, the case of the laser processing machine has been described, but the same applies to the plasma processing machine.

  In addition, this invention is not limited to the above-mentioned embodiment, It can implement with the form by making an appropriate change. For example, in FIG. 2, the side surface of the shielding object 22 is perpendicular to the upper surface of the workpiece W. However, when the scattered object 23 is blocked and moves on the side surface of the shielding object 22, it can be easily inclined or curved. In this case, the recovery efficiency of the scattered matter 23 can be improved.

Further, although the shape of the dust collection hood F is substantially square in FIG. 3, the same working effect can be obtained as long as the flow rate and the flow velocity of the gas suction from the dust collection duct are isotropic.

It is a front view which shows the whole laser beam machine which applied the collection method and apparatus of the scattered material in the laser beam machine concerning this invention. It is a front view which shows the scattered material collection | recovery apparatus in the laser beam machine concerning this invention. It is the top view seen from the AA direction in FIG. It is the top view which showed the shield and the workpiece | work of the scattered material collection apparatus in the laser beam machine concerning this invention. It is explanatory drawing which shows the state of the cutting process by the conventional laser and a plasma processing machine. It is explanatory drawing which shows the state of the piercing process by the conventional laser and a plasma processing machine. It is explanatory drawing which shows the problem of the scattered material recovery in the conventional laser and a plasma processing machine.

Explanation of symbols

1, 20 ... Processing nozzle 2, 23 ... Scattered matter 3 ... Laser beam or plasma gas 5 ... Screening curtain 10 ... Laser processing machine 11 ... ... Laser oscillator 12 ... Laser passage 13 ... Upper frame 14 ... Bend mirror 15 ... Condensing lens 18 ... Work table 19 ... ··· Carriage 21 ··· Processing head 22 · · · Shield F · · · Dust collection hood · · · Height L · · · · Shield Interval W ··· Work LB ··· Laser beam

Claims (5)

In a laser processing machine that processes a workpiece by irradiating a laser beam from a nozzle provided in the processing head, or a plasma processing machine that processes a workpiece by injecting a plasma gas from a nozzle provided in the processing head,
Provide both sides of the machining trajectory where machining is performed on the workpiece, with a predetermined interval, and a shield that surrounds the side where the machining head is located from near the workpiece surface,
A dust collection hood is provided that covers the processing head and the nozzle to substantially the same height as the nozzle,
A method for collecting scattered matter in a laser processing machine and a plasma processing machine, wherein the scattered matter generated during processing is collected by suction means provided in the dust collection hood. In a laser processing machine that processes a workpiece by irradiating a laser beam from a nozzle provided in the processing head, or a plasma processing machine that processes a workpiece by injecting a plasma gas from a nozzle provided in the processing head,
A shield that surrounds the side of the workpiece head from the vicinity of the workpiece surface on both sides of the machining locus on which the machining is performed on the workpiece;
A dust collection hood that covers the processing head and the nozzle to substantially the same height as the nozzle;
Suction means provided inside the dust collection hood;
An apparatus for collecting scattered matter in a laser processing machine or a plasma processing machine.   The laser processing machine or plasma processing machine according to claim 2, wherein an interval between the shielding objects is 5 to 10 times the laser beam diameter of the laser processing machine or the plasma gas diameter of the plasma processing machine. Scattering material collection device.   3. The laser processing machine or plasma according to claim 2, wherein the height of the shielding object is ½ or more of the distance from the vicinity of the workpiece surface to the processing nozzle and smaller than the distance to the processing nozzle. Scatter collection device for processing machines.   The scattered matter in the laser processing machine or the plasma processing machine according to claim 2, wherein a height of the lower end of the dust collecting hood is not less than a height of the lower end of the processing nozzle and not more than a height of the lower end of the processing head. Recovery equipment.