JP2008100228A - Development apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a development apparatus capable of carrying out uniform development. <P>SOLUTION: A nozzle body 16 of a developer discharge nozzle 11 is provided with a slit like discharge port 15 extending vertically downward and opened at the bottom surface 17. The inner wall surface 21 of the slit like discharge port 15 and the bottom surface 17 of the nozzle body part 16 are formed from a hydrophilic material. A substrate is held by a substrate holding part in a standing-still state in the case of a developing process. The discharge of the developer by the developer discharge nozzle 11 is started so that the developer is continuously and vertically dropped along the slit like discharge port 15 by the time the developer discharge nozzle 11 reaches the end of the one side of the substrate held by the substrate holding part after the developer discharge nozzle 11 is moved from a movement starting position at one side of the outside of the substrate held by the substrate holding part. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a developing device that supplies a developing solution to a photosensitive film on a substrate to perform development processing.

  A developing device is used for developing a photosensitive film formed on a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, or an optical disk substrate.

  For example, the rotary developing device includes a rotation holding unit that holds a substrate horizontally and rotates it around a vertical axis, and a developer discharge nozzle that supplies a developer to the surface of the substrate. The developer discharge nozzle is attached to the tip of a nozzle arm that is rotatably provided in a horizontal plane, and can move between an upper position of the substrate and a standby position.

During the development processing, the developer discharge nozzle moves from the standby position above the substrate, and then the developer is supplied to the photosensitive film on the substrate. The supplied developer is spread on the entire surface of the substrate by the rotation of the substrate and comes into contact with the photosensitive film. The photosensitive film is developed by allowing the substrate to stand still for a certain time in a state where the developer is held on the substrate by surface tension (liquid accumulation). When the supply of the developer is completed, the developer discharge nozzle moves to a standby position where it has retreated from above the substrate by the rotation of the nozzle arm.
JP-A 63-018627

  However, in the conventional rotary developing device described above, the photosensitive film on the substrate is subjected to a large impact by the developer at the start of ejection hitting the rotating substrate. Due to the impact, bubbles may be generated in the developer, and minute bubbles remaining on the surface of the photosensitive film may cause a development defect. In addition, the photosensitive film may be damaged by the impact of the developer at the start of ejection.

  Therefore, a developing method for supplying developer onto the substrate by linearly moving the developer discharge nozzle from one end to the other end on the substrate while discharging the developer from the developer discharge nozzle having a slit-like discharge port. Has been proposed. According to this developing method, the developer is uniformly supplied onto the substrate without applying an impact to the photosensitive film on the substrate.

  However, with a developer discharge nozzle having a slit-like discharge port, it is difficult to ensure discharge uniformity over the entire area of the slit-like discharge port. If the developer is supplied onto the substrate in a state where the uniformity of discharge is not sufficient, a phenomenon that a portion where the developer does not get on the substrate (liquid running out phenomenon) occurs, or after the developer gets on the substrate once A phenomenon that the developer repels temporarily (liquid repelling phenomenon) easily occurs. As a result, the uniformity of development in the substrate surface is deteriorated, the uniformity of the pattern line width after development may be reduced, and development defects may occur.

  An object of the present invention is to provide a developing device capable of performing uniform development processing.

  A developing device according to a first aspect of the present invention is held in a stationary state by a substrate holding means for holding a substrate in a horizontal position, a developer discharge nozzle having a slit-like discharge port for discharging a developer, and a substrate holding means. A moving means for moving the developer discharge nozzle relative to the substrate and a control means for controlling the developer discharge nozzle and the moving means, and the discharge width of the slit-like discharge port is the same as the substrate width or The controller is set larger than that, and the control means starts the movement of the developer discharge nozzle from the movement start position on one side outside the substrate held by the substrate holding means, and then the developer discharge nozzle is held by the substrate holding means. The developer discharge nozzle starts discharge so that the developer hangs continuously along the slit-like discharge port in a belt-like manner until it reaches the edge on one side of the substrate, and the developer discharge nozzle The inner wall surface of the slit-shaped discharge port of those having hydrophilic.

  In the developing device according to the first aspect of the present invention, the developing solution discharge nozzle moves relative to the substrate held in a stationary state by the substrate holding means and develops on the substrate from the slit-like discharge port of the developing solution discharge nozzle. Liquid is discharged.

  In this case, the developing solution is simultaneously supplied to a region having a certain width. Further, since the inner wall surface of the slit-like discharge port of the developer discharge nozzle has hydrophilicity, the flowability of the developer on the inner wall surface of the slit-like discharge port is increased. Thereby, the uniformity of the discharge of the developer from the slit-like discharge port of the developer discharge nozzle is ensured. As a result, the uniformity of the line width of the development pattern is improved, the occurrence of development failure is prevented, and uniform development processing is performed.

  In the developing device according to the second invention, in the configuration of the developing device according to the first invention, the movement start position has a moving speed from the start of movement until the edge of the substrate reaches one edge of the substrate. It is set so as to secure a time for reaching a predetermined speed and for the developer at the slit-like discharge port to be strip-shaped.

  In the developing device according to a third aspect of the present invention, in the configuration of the developing device according to any one of the first to second aspects, the control means develops after the developer discharge nozzle passes through the substrate held by the substrate holding means. The discharge of the developer by the liquid discharge nozzle is stopped.

  A developing device according to a fourth invention is the developing device according to any one of the first to third inventions, wherein the developer discharge nozzle has a planar bottom surface provided with a slit-like discharge port, The moving means moves the developer discharge nozzle relative to the substrate so that the bottom surface of the developer discharge nozzle is kept parallel to the surface of the substrate held stationary by the substrate holding means. is there.

  In this case, a minute space sandwiched between planes parallel to each other is formed between the surface of the substrate and the bottom surface of the developer discharge nozzle, and the developer is supplied to the minute space from the slit-like discharge port of the developer discharge nozzle. The As a result, the developer is quickly filled into this minute space by capillary action.

  For this reason, the supply of the developer onto the substrate is made uniform by the developer filled in the minute space, and the phenomenon of running out of liquid and the phenomenon of liquid splash are sufficiently suppressed.

  As a result, the line width uniformity of the development pattern is further improved, the occurrence of development defects is sufficiently prevented, and a more uniform development process is performed.

  A developing device according to a fifth aspect of the present invention is the developing device according to any one of the first to fourth aspects, wherein the outer wall surface excluding the bottom surface of the developer discharge nozzle has water repellency.

  In this case, the phenomenon that the developer rises on the outer wall surface of the developer discharge nozzle is suppressed. As a result, the entrapment of minute bubbles due to the vibration of the liquid level on the outer wall surface of the developer discharge nozzle is prevented, and the occurrence of development defects due to the entrapment of minute bubbles is prevented. Further, since the developer does not adhere to the outer wall surface of the developer discharge nozzle, it is not necessary to clean the outer wall surface of the developer discharge nozzle when cleaning the developer discharge nozzle. Therefore, the cleaning mechanism for the developer discharge nozzle is simplified.

  A developing device according to a sixth aspect of the present invention is the developing device according to any one of the first to fifth aspects, wherein the surface above the bottom surface of the developer discharge nozzle has water repellency.

  In this case, the phenomenon that the developer rises on the outer wall surface of the developer discharge nozzle is suppressed. As a result, the entrapment of minute bubbles due to the vibration of the liquid level on the outer wall surface of the developer discharge nozzle is prevented, and the occurrence of development defects due to the entrapment of minute bubbles is prevented. Further, since the developer does not adhere to the outer wall surface of the developer discharge nozzle, it is not necessary to clean the outer wall surface of the developer discharge nozzle when cleaning the developer discharge nozzle. Therefore, the cleaning mechanism for the developer discharge nozzle is simplified.

  A developing device according to a seventh aspect of the present invention is the developing device according to any one of the first to sixth aspects, wherein the bottom surface of the developer discharge nozzle has hydrophilicity.

  In this case, the liquid retention is good at the bottom surface of the developer discharge nozzle, and a sufficient liquid pool is formed between the bottom surface of the developer discharge nozzle and the surface of the substrate. This makes it more difficult for the liquid to run out between the bottom surface of the developer discharge nozzle and the surface of the substrate.

  A developing device according to an eighth invention is the developing device according to any one of the first to seventh inventions, wherein the developer discharge nozzle has inclined surfaces on the front side and the rear side of the slit-like discharge port. The inclined surface of the developer discharge nozzle has water repellency.

  In this case, the phenomenon that the developer rises on the outer wall surface of the developer discharge nozzle is suppressed. As a result, the entrapment of minute bubbles due to the vibration of the liquid level on the outer wall surface of the developer discharge nozzle is prevented, and the occurrence of development defects due to the entrapment of minute bubbles is prevented. Further, since the developer does not adhere to the outer wall surface of the developer discharge nozzle, it is not necessary to clean the outer wall surface of the developer discharge nozzle when cleaning the developer discharge nozzle. Therefore, the cleaning mechanism for the developer discharge nozzle is simplified.

  1 is a plan view of a developing device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line XX of the main part of the developing device of FIG. 1, and FIG. 3 is YY of the main part of the developing device of FIG. It is line sectional drawing.

  As shown in FIGS. 2 and 3, the developing device includes a substrate holding unit 1 that sucks and holds the substrate 100 in a horizontal posture. The substrate holder 1 is fixed to the tip of the rotating shaft 3 of the motor 2 and is configured to be rotatable around a vertical axis. A circular inner cup 4 is provided around the substrate holding portion 1 so as to be movable up and down so as to surround the substrate 100. A square outer cup 5 is provided around the inner cup 4.

  As shown in FIG. 1, standby pots 6 and 7 are disposed on both sides of the outer cup 5, and a guide rail 8 is disposed on one side of the outer cup 5. Further, the nozzle arm 9 is provided so as to be movable in the scanning direction A and the opposite direction along the guide rail 8 by the arm driving unit 10. A pure water discharge nozzle 12 for discharging pure water is provided on the other side of the outer cup 5 so as to be rotatable in the direction of arrow R.

  A developer discharge nozzle 11 having a slit-like discharge port 15 at the lower end is attached to the nozzle arm 9 perpendicularly to the guide rail 8. Thereby, the developer discharge nozzle 11 can be linearly moved along the scanning direction A from the position of the standby pot 6 over the substrate 100 to the position of the standby pot 7.

  As shown in FIG. 2, a developer is supplied to the developer discharge nozzle 11 by a developer supply system 12. The control unit 13 controls the rotation operation of the motor 2, the scanning of the developer discharge nozzle 11 by the arm driving unit 10, and the discharge of the developer from the developer discharge nozzle 11.

  In this embodiment, the substrate holding unit 1 corresponds to a substrate holding unit, and the arm driving unit 10 corresponds to a moving unit.

  FIG. 4 is a cross-sectional view of the developer discharge nozzle 11. FIG. 5 is a bottom view of the developer discharge nozzle 11.

  The nozzle body 16 of the developer discharge nozzle 11 has a flat bottom surface 17. The nozzle body 16 is formed of a relatively hard hydrophilic material such as stainless steel, quartz glass, Pyrex (registered trademark) glass, ceramics (for example, alumina, SiC, αC). The nozzle body 16 is provided with a slit-like discharge port 15 that extends vertically downward and opens at the bottom surface 17.

  The outer wall surface 18 excluding the bottom surface 17 of the nozzle body 16 is coated with a resin-based water-repellent material layer 20 such as PVC (polyvinyl chloride), PPS (polyphenylene sulfide), PTFE (polytetrafluoroethylene) or the like.

  The hydrophilic material is exposed on the inner wall surface 21 of the slit-like discharge port 15 and the bottom surface 17 of the nozzle body 16.

  As shown in FIG. 5, the slit-like discharge port 15 is arranged perpendicular to the scanning direction A of the developer discharge nozzle 11. The slit width t of the slit-like discharge port 15 is 0.05 to 1.0 mm, and is 0.1 mm in this embodiment. Further, the discharge width L of the slit-like discharge port 15 is set to be equal to or larger than the diameter of the substrate 100 to be processed, and when processing the substrate 100 having a diameter of 8 inches, in this embodiment, 210 mm. Set to

  Further, the slit-like discharge port 15 is provided in front of the center of the bottom surface 17 in the scanning direction A of the developer discharge nozzle 11. The length a of the bottom surface 17 on the front side of the slit-like discharge port 15 (hereinafter referred to as the front side bottom surface 17a) is set to 0.5 to 2 mm, and is set to 1 mm in this embodiment. Further, the length b of the bottom 17 on the rear side of the slit-like discharge port 15 (hereinafter referred to as the rear bottom 17b) is set to 1 to 5 mm, and is set to 3 mm in this embodiment.

  The developer discharge nozzle 11 is scanned in the scanning direction A so that the bottom surface 17 is kept parallel to the surface of the substrate 100. The distance between the slit-like discharge port 15 and the surface of the substrate 100 is 0.2 to 5 mm, more preferably 0.5 to 2 mm, and 1 mm in this embodiment.

  Next, the operation of the developing device of FIG. 1 will be described with reference to FIGS. During the development process, the substrate 100 is held in a stationary state by the substrate holder 1.

  During standby, the developer discharge nozzle 11 is waiting at a position P0 in the standby pot 6. During the developing process, the developer discharge nozzle 11 moves up, moves in the scanning direction A, and moves down at the scanning start position P <b> 1 in the outer cup 5.

  Thereafter, the developer discharge nozzle 11 starts scanning at a predetermined scanning speed from the scanning start position P1. At this time, the developer is not yet discharged from the developer discharge nozzle 11. In this embodiment, the scanning speed is 10 to 500 mm / second.

  After the scanning of the developer discharge nozzle 11 is started and before the slit-like discharge port 15 of the developer discharge nozzle 11 reaches the substrate 100, the developer discharged from the developer discharge nozzle 11 at a predetermined flow rate at the discharge start position P2. Start dispensing. In this embodiment, the flow rate of the developer is 1.5 L / min.

  The developer discharge nozzle 11 moves linearly in the scanning direction A on the substrate 100 from the discharge start position P2 while discharging the developer (see FIG. 7). As a result, the developer is continuously supplied to the entire surface of the substrate 100. The supplied developer is held on the substrate 100 by surface tension.

  After the developer discharge nozzle 11 has passed over the substrate 100, the discharge of the developer by the developer discharge nozzle 11 is stopped at the discharge stop position P <b> 3 removed from the substrate 100. Then, the scanning of the developer discharge nozzle 11 is stopped when the developer discharge nozzle 11 reaches the scanning stop position P4 in the outer cup 5.

  Thereafter, the developer discharge nozzle 11 moves up to the position P5 of the other standby pot 7 after moving up at the scanning stop position P4 and then moves down into the standby pot 7.

  The state in which the developer is supplied onto the substrate 100 is maintained for a certain period of time, and the development proceeds. At this time, the substrate holding unit 1 may be rotationally driven by the motor 2 to rotate the substrate 100. Thereafter, the substrate 100 is rotated at a high speed while supplying pure water onto the substrate 100 by the pure water discharge nozzle 12, so that the developer on the substrate 100 is shaken off, the substrate 100 is dried, and the development process is completed.

  FIG. 8 is a front view showing a discharge state of the developer from the developer discharge nozzle 11. Immediately after the developer is discharged, the developer oozes out from the slit-like discharge port 15 in a drop shape as shown in FIG. When a certain period of time has elapsed since the discharge of the developer, as shown in FIG. 8B, the drop-like developer is connected and the developer is formed in a strip shape along the slit-like discharge port 15.

  The scanning start position P1 is such that the scanning speed reaches a predetermined speed from the start of scanning until the developer discharge nozzle 11 reaches the edge of the substrate 100, and as shown in FIG. The time is set so that the time required for the 15 developing solution to form a belt is secured. For example, the scanning start position P <b> 1 is set at a position away from the edge of the substrate 100 by about 10 to 100 mm in the direction opposite to the scanning direction A. In this embodiment, the scanning start position P1 is set at a position 50 mm away from the edge of the substrate 100.

  Further, the discharge start position P <b> 2 has a belt-like developer discharge state before the developer discharge nozzle 11 reaches the edge of the substrate 100 according to the scanning speed of the developer discharge nozzle 11 and the discharge flow rate of the developer. It is set so that time for becoming is secured.

  As the scanning speed increases, the time until the developer discharge nozzle 11 reaches the edge of the substrate 100 from the scanning start position P1 is shortened, so that the discharge start position P2 is brought closer to the scanning start position P1. For example, when the scanning speed is 100 mm / second, discharge of the developer starts 0.3 seconds after the scanning start time, and when the scanning speed is 30 mm / second, the developer liquid starts 1.3 seconds after the scanning start time. Starts to discharge.

  When the developer discharge flow rate is large, the developer discharge state becomes a belt shape in a short time, and the discharge start position P <b> 2 is brought close to the edge of the substrate 100. For example, when the developer discharge flow rate is 1.5 L / min and the scanning speed is 70 mm / second, 0.1 to 1.0 seconds (for example, 0) when the developer discharge nozzle 11 reaches the edge of the substrate 100. .2 seconds) before the developer discharge starts.

  In order to reduce the wasteful consumption amount of the developer, the discharge start position P2 is set to the substrate 100 within a range where the developer discharge state becomes a belt-like shape until the developer discharge nozzle 11 reaches the edge of the substrate 100. It is desirable to be close to the edge.

  FIG. 9 is a cross-sectional view showing scanning of the developer discharge nozzle 11 on the substrate 100.

  As described above, since the inner wall surface 21 of the slit-like discharge port 15 provided in the nozzle body 16 is formed of a hydrophilic material, the flowability of the developer on the inner wall surface 21 of the slit-like discharge port 15 is improved. Get higher. Thereby, the uniformity of the discharge of the developer is ensured over the entire area of the slit-like discharge port 15. As a result, the line width uniformity of the development pattern is improved and the occurrence of development failure is prevented.

  Further, as described above, the developer discharge nozzle 11 moves in the scanning direction A so that the bottom surface 17 is kept parallel to the surface of the substrate 100. In this case, a minute space sandwiched between planes parallel to each other is formed between the surface of the substrate 100 and the bottom surface 17 of the developer discharge nozzle 11, and the developer is supplied to the minute space from the slit-like discharge port 15. . The developer is quickly filled into this minute space by capillary action.

  Therefore, the supply of the developing solution onto the substrate 100 is made more uniform by the developing solution filled in this minute space, and the phenomenon of running out of liquid and the phenomenon of liquid splash are sufficiently suppressed. As a result, the line width uniformity of the development pattern is further improved, and the development failure is sufficiently prevented.

  In addition, since the nozzle body 16 is made of a relatively hard hydrophilic material, high processing accuracy can be obtained and it is resistant to changes over time. Therefore, good discharge uniformity can be stably obtained.

  FIGS. 10A to 10F are diagrams showing temporal changes in the state of the developer when the developer discharge nozzle 11 of this embodiment is moved in the scanning direction A, and FIGS. 11A to 11F. FIG. 10 is a diagram showing a temporal change in the state of the developer when the developer discharge nozzle 11a of the comparative example is moved in the scanning direction A. 10 and 11 are obtained by simulation by numerical calculation. In the developer discharge nozzle 11a of the comparative example, the slit-shaped discharge port 15 is provided in the scanning direction A on the rear side from the center of the bottom surface of the developer discharge nozzle 11a.

  As shown in FIGS. 10A to 10F, in the developer discharge nozzle 11 of this embodiment, a larger amount of developer is supplied to the rear side in the scanning direction A than to the front side of the slit-like discharge port 15, Good liquid accumulation is performed on the rear side of the slit-like discharge port 15.

  As shown in FIGS. 11A to 11F, in the developer discharge nozzle 11a of the comparative example, more developer is supplied to the front side in the scanning direction A than to the rear side of the slit-like discharge port 15, and the slit The amount of developer on the rear side of the discharge port 15 is insufficient. As a result, the liquid running out phenomenon is likely to occur.

  FIG. 12 is a diagram illustrating a fluid velocity vector when the developer discharge nozzle 11 of the present embodiment is moved in the scanning direction A, and FIG. 13 is a view when the developer discharge nozzle 11a of the comparative example is moved in the scanning direction A. It is a figure which shows a fluid velocity vector. 12 and 13 are obtained by simulation by numerical calculation.

  As shown in FIG. 12, in the developer discharge nozzle 11 of the present embodiment, the flow toward the rear of the slit-shaped discharge port 15 is generally strong. On the other hand, as shown in FIG. 13, in the developer discharge nozzle 11a of the comparative example, the forward flow becomes strong and the backward flow becomes weak due to the surface tension of the bottom surface 17 on the front side of the slit-like discharge port 15. Yes. Thereby, the turbulence of the flow is increased in the vicinity of the outlet of the slit-like discharge port 15.

  As described above, in the developer discharge nozzle 11 of the present embodiment, the length of the rear side bottom surface 17b is longer than the length of the front side bottom surface 17a. Is attracted more strongly by the space between. As a result, a larger amount of developer is supplied to the rear side than the front side of the slit-like discharge port 15, and the flow of the developer toward the rear side of the slit-like discharge port 15 becomes stronger. As a result, the generation of minute bubbles due to the advance of the developer is prevented, the disturbance of the developer flow in the vicinity of the outlet of the slit-like discharge port 15 is reduced, and the uniform developer is supplied onto the substrate 100. It becomes possible.

  When the developer rises on the outer wall surface 18 of the developer discharge nozzle 11, a phenomenon occurs in which the developer surface vibrates on the outer wall surface 18 due to interaction with gravity. The vibration of the liquid level of the developing solution induces the biting of minute bubbles at the portion where the developing solution contacts the surface of the substrate 100 and causes development defects.

  In the developer discharge nozzle 11 of the present embodiment, since the outer wall surface 18 of the nozzle body 16 is coated with the water repellent material layer 20, the phenomenon that the developer rises on the outer wall surface 18 of the developer discharge nozzle 11 is suppressed. Is done. Therefore, the minute bubble is prevented from biting due to the vibration of the developer surface at the outer wall surface 18 of the developer discharge nozzle 11, and the development defect due to the minute bubble biting is prevented. Further, since the developer does not adhere to the outer wall surface 18 of the developer discharge nozzle 11, only the bottom surface 17 of the developer discharge nozzle 11 needs to be cleaned when the developer discharge nozzle 11 is cleaned. Therefore, the structure of the water washing mechanism is simplified.

  Further, since the bottom surface 17 of the developer discharge nozzle 11 is formed of a hydrophilic material, the liquid retaining property at the bottom surface 17 of the developer discharge nozzle 11 is improved, and the bottom surface 17 of the developer discharge nozzle 11 and the surface of the substrate 100 are improved. A sufficient liquid pool is formed between the two. Thereby, even when the uniformity of the discharge of the developer from the slit-like discharge port 15 is not good, the liquid breakage does not occur between the bottom surface 17 of the developer discharge nozzle 11 and the surface of the substrate 100.

  Further, in the developing device of the present embodiment, since the discharge of the developer starts before the developer discharge nozzle 11 reaches the stationary substrate 100, the developer at the start of discharge gives an impact to the substrate 100. Is avoided. Thereby, the generation of bubbles in the developer is suppressed, and the occurrence of development defects is prevented.

  Further, when the developing solution discharge nozzle 11 moves, the developing solution near the slit-like discharge port 15 that comes into contact with air is discarded outside the substrate 100, and when the developing solution discharge nozzle 11 reaches the substrate 100, the developing solution discharge nozzle 11, a new developer is supplied onto the stationary substrate 100. This prevents development defects from being caused by the altered developer and prevents particles from the dried developer from adhering to the surface of the photosensitive film on the substrate 100.

  Further, a belt-like shape formed in the slit-like discharge port 15 is moved in a straight line in the horizontal direction on the substrate 100 where the developer discharge nozzle 11 is stationary in a state where the slit-like discharge port 15 and the upper surface of the substrate 100 are close to each other. Since the developer continuously contacts the surface of the substrate 100, the developer is uniformly supplied to the entire surface of the substrate 100 without applying an impact to the surface of the substrate 100.

  Further, since the supply of the developer is continued until the developer discharge nozzle 11 passes over the substrate 100, the adverse effect on the developer in the liquid pile due to the impact at the time of stopping the discharge is prevented. As a result, the occurrence of development defects is suppressed and the line width uniformity of the photosensitive film pattern after development is improved.

  Further, since the discharge of the developer is stopped after the developer discharge nozzle 11 passes over the substrate 100, it is possible to prevent an impact on the photosensitive film on the substrate 100 due to the dripping of the developer when the discharge is stopped. The Therefore, development defects and deterioration of the line width uniformity of the photosensitive film pattern are prevented.

  In this embodiment, the nozzle body 16 of the developer discharge nozzle 11 is formed of a hydrophilic material, and the water repellent material layer 20 is coated on the outer wall surface 18 of the nozzle body 16. The outer wall surface 18 may be subjected to water repellency treatment by other methods. Alternatively, the nozzle body 16 may be formed of another material, the hydrophilic treatment may be performed on the inner wall surface 21 of the slit-shaped discharge port 15 and the bottom surface 17 of the nozzle body portion 16, and the water repellent treatment may be performed on the outer wall surface 18. .

  FIG. 14 is a sectional view of a developer discharge nozzle in another embodiment of the present invention.

  14 includes a front-side outer wall surface 38, a front-side inclined surface 39, a rear-side outer wall surface 40, and a rear-side inclined surface 41 in the scanning direction A. The nozzle body 36 is made of a relatively hard hydrophilic material such as stainless steel, quartz glass, Pyrex (registered trademark) glass, ceramics (for example, alumina, SiC, αC). The nozzle body 36 is provided with a slit-like discharge port 35 that extends vertically downward and opens at the boundary between the front inclined surface 39 and the rear inclined surface 41.

  The outer wall surfaces 38 and 40 and the inclined surfaces 39 and 41 of the nozzle main body 36 are coated with a resin-based water-repellent material layer 32 such as PVC, PPS, or PTFE. A hydrophilic material is exposed on the inner wall surface 33 of the slit-like discharge port 35.

  The slit-like discharge port 35 is arranged perpendicular to the scanning direction A of the developer discharge nozzle 31. The slit width and discharge width of the slit-shaped discharge port 35 are the same as those of the slit-shaped discharge port 15 shown in FIG.

  Also in the developer discharge nozzle 31 of the present embodiment, the inner wall surface 33 of the slit-like discharge port 35 provided in the nozzle body 36 is formed of a hydrophilic material. The fluidity of the developer becomes higher. Thereby, the uniformity of the discharge of the developer is ensured over the entire area of the slit-like discharge port 35. As a result, the line width uniformity of the development pattern is improved and the occurrence of development failure is prevented.

  In addition, since the nozzle body 36 is made of a relatively hard hydrophilic material, high processing accuracy can be obtained and it is resistant to changes over time. Therefore, good discharge uniformity can be stably obtained.

  In this embodiment, the nozzle body 36 of the developer discharge nozzle 31 is formed of a hydrophilic material, and the outer wall surfaces 38 and 40 and the inclined surfaces 39 and 41 of the nozzle body 36 are coated with the water repellent material layer 32. However, the outer wall surfaces 38 and 40 and the inclined surfaces 39 and 41 of the nozzle body 36 may be subjected to water repellency treatment by other methods. Further, the nozzle body 36 is formed of another material, the hydrophilic treatment is performed on the inner wall surface 33 of the slit-like discharge port 35, and the water repellent treatment is performed on the outer wall surfaces 38, 40 and the inclined surfaces 39, 41 of the nozzle body 36. May be performed.

1 is a plan view of a developing device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the main part of the developing device in FIG. FIG. 2 is a cross-sectional view of the main part of the developing device in FIG. 1 taken along the line YY. It is sectional drawing of a developing solution discharge nozzle. It is a bottom view of a developing solution discharge nozzle. It is a figure for demonstrating operation | movement of the image development apparatus of FIG. It is a top view which shows the scanning of the developing solution discharge nozzle on a board | substrate. It is a front view which shows the discharge state of the developing solution from a developing solution discharge nozzle. It is sectional drawing which shows the scanning of the developing solution discharge nozzle on a board | substrate. It is a figure which shows the simulation result of the time change of the state of a developing solution when the developing solution discharge nozzle of an Example is moved to a scanning direction. It is a figure which shows the simulation result of the time change of the state of a developing solution when the developing solution discharge nozzle of a comparative example is moved to a scanning direction. It is a figure which shows the simulation result of the fluid velocity vector at the time of moving the developing solution discharge nozzle of an Example to a scanning direction. It is a figure which shows the simulation result of the fluid velocity vector at the time of moving the developing solution discharge nozzle of a comparative example to a scanning direction. It is sectional drawing of the developing solution discharge nozzle in the other Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate holding | maintenance part 4 Inner cup 5 Outer cup 8 Guide rail 9 Nozzle arm 10 Nozzle drive part 11, 31 Developer discharge nozzle 12 Developer supply system 13 Control part 15, 35 Slit-like discharge port 16 Nozzle body part 17 Bottom face 17a Front Side bottom surface 17b Rear side bottom surface 18, 38, 40 Outer wall surface 20 Water-repellent material layer 21, 33 Inner wall surface 39, 41 Inclined surface

Claims (8)

A substrate holding means for holding the substrate in a horizontal position;
A developer discharge nozzle having a slit-like discharge port for discharging the developer;
Moving means for moving the developer discharge nozzle relative to the substrate held in a stationary state by the substrate holding means;
Control means for controlling the developer discharge nozzle and the moving means,
The discharge width of the slit-like discharge port is set equal to or larger than the substrate width,
The control unit starts the movement of the developer discharge nozzle from the movement start position on one side outside the substrate held by the substrate holding unit, and then the developer discharge nozzle is held by the substrate holding unit. Start the discharge of the developer by the developer discharge nozzle so that the developer continuously hangs along the slit-like discharge port until reaching the one edge of the substrate,
The developing device according to claim 1, wherein an inner wall surface of the slit-like discharge port of the developer discharge nozzle has hydrophilicity. The movement start position is such that the movement speed reaches a predetermined speed from the start of movement of the developer discharge nozzle to the edge of the one side of the substrate, and the developer at the slit-like discharge port becomes a belt shape. 2. The developing device according to claim 1, wherein time is set so as to be secured. 3. The development according to claim 1, wherein the control unit stops the discharge of the developer by the developer discharge nozzle after the developer discharge nozzle passes through the substrate held by the substrate holding unit. apparatus. The developer discharge nozzle has a flat bottom surface provided with the slit-shaped discharge port,
The moving means moves the developer discharge nozzle relative to the substrate so that the bottom surface of the developer discharge nozzle is parallel to the surface of the substrate held in a stationary state by the substrate holding means. The developing device according to claim 1, wherein the developing device is moved in a moving manner. The developing device according to claim 1, wherein an outer wall surface excluding the bottom surface of the developer discharge nozzle has water repellency. The developing device according to claim 1, wherein a surface above the bottom surface of the developer discharge nozzle has water repellency. The developing device according to claim 1, wherein the bottom surface of the developer discharge nozzle has hydrophilicity. The developer discharge nozzle has inclined surfaces on the front side and the rear side of the slit-shaped discharge port,
The developing device according to claim 1, wherein the inclined surface of the developer discharge nozzle has water repellency.

Images