JP2008096384A - Probe assembly for current carrying test - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe assembly for preventing an arm from being excessively warped and deformed when it is removed from an electrode even if the electrode is melted and attached to probes. <P>SOLUTION: The probe assembly is provided with: a probe substrate; an attachment section supported by the probe substrate; the arm spaced from the probe substrate and extended from an attachment section along the probe substrate; a plurality of the probes disposed in the arm, and respectively having needles separated and protruded from the probe substrate; and a means supported by the probe substrate, and regulating a warpage and a deformation generated in the arm when an action force is applied to the needles of the probes in the direction for separating them from the probe substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an energization test probe assembly suitable for use in an energization test of a flat object such as a semiconductor integrated circuit or a display substrate.

  Some semiconductor chip electrodes use bump electrodes. According to this bump electrode, the semiconductor chip can be mounted on the circuit board by directly joining the electrode of the circuit board to which the semiconductor chip is attached and the bump electrode of the semiconductor chip. In general, such semiconductor chips are collectively formed as a semiconductor integrated circuit on a semiconductor wafer and subjected to an electrical inspection before the semiconductor wafer is separated into the respective chips.

  In this type of electrical inspection, each chip region, which is an object to be inspected, is connected to the tester body through a probe assembly provided with a large number of probes that come into contact with each electrode of each chip region on the semiconductor wafer.

  Each probe of the probe assembly described above has an arm portion provided with a needle tip portion. One end of the arm portion is fixed to the circuit of the probe substrate of the probe assembly, and the arm portion extends laterally along the surface of the probe substrate at a distance from the surface. The needle tip portion protrudes in a direction away from the surface of the probe substrate at the tip of the arm portion, and the protruding end becomes a needle tip (see Patent Document 1).

  The probe assembly is moved relatively toward the semiconductor wafer so that the probe tips of the probes come into contact with the corresponding bump electrodes of the device under test, whereby the probe tips of the probes are pressed against the corresponding electrodes. Is done. At this time, an overdrive force is applied to each probe so that slight bending deformation occurs in the arm portion. Due to this overdrive force, each probe and the corresponding bump electrode are reliably in electrical contact.

  However, when a current for testing is passed while the probe is in contact with the bump electrode, the bump electrode may be welded to the probe tip due to this energization. In the case where the bump electrode is a gold bump, the probe is easily welded to the probe tip.

  When the bump electrode is welded to the probe and the probe assembly is moved relatively away from the object to be inspected after the current test, the probe tip to which the bump electrode is welded is the bump electrode. Therefore, the probe tip of the probe receives an acting force in a direction away from the probe substrate of the probe assembly. Therefore, the arm portion of the probe to which the bump electrode is welded is warped and deformed in the direction opposite to that when receiving the overdrive force. Excessive warping deformation of the arm portion due to this welding can cause damage to the probe.

JP 2002-311049 A

  Accordingly, an object of the present invention is to provide a probe assembly that does not cause excessive warping and deformation in the arm portion of the probe when the electrode is welded to the probe when the electrode is separated from the electrode.

  A probe assembly according to the present invention includes a probe substrate, an arm portion that is supported by the probe substrate and extends substantially along the probe substrate, and a needle that is provided on the arm portion and protrudes away from the probe substrate. A plurality of probes each having a tip portion and a probe substrate are supported by the probe substrate, and the warp deformation generated in the arm portion when the needle tip portion of the probe receives an acting force in a direction away from the probe substrate is regulated. Means.

  In the probe assembly according to the present invention, the tip of the probe tip, that is, the tip of the probe is pressed against the corresponding electrode of the device under test by the overdrive force. When the electrode is energized through the probe in the pressed state, even if the electrode is welded to the needle tip, the arm portion of the probe is provided with means for warping and restricting deformation. When the probe assembly and the object to be inspected move relative to each other in a direction away from each other, excessive warping deformation that causes damage to the arm portion is prevented by the restricting means. Therefore, the arm portion is reliably prevented from being damaged due to excessive warping.

  The arm portion of the probe can be supported on the probe substrate via an attachment portion extending from the end of the arm portion toward the probe substrate.

  When at least some of the plurality of probes are arranged in alignment with each other, the restricting means can be provided in common to the plurality of aligned probes.

  The restricting means allows deformation of the arm portion with displacement of the needle tip portion toward the probe substrate, but of the arm portion with displacement of the needle tip portion exceeding a predetermined distance from the probe substrate. It can be formed of a hook member that restricts deformation.

  The hook member can be provided on the probe substrate so as to be engageable with the arm portion between the attachment portion and the needle tip portion.

  Further, instead of the hook member described above, a pair of side wall portions projecting along the both sides of the arm portion from the probe substrate on both sides of the arm portion, and the arm portion formed integrally with the both side wall portions. A hook member having a bottom wall portion spaced from the surface opposite to the probe substrate can be used.

  Further, instead of enabling the hook member to be engaged with the arm portion between the attachment portion and the needle tip portion, the arm portion is more than the needle tip portion viewed in the longitudinal direction. Also, the hook portion can be engaged on the tip side.

  When the hook portion is engaged with the arm portion of the probe on the tip side, an engaging surface for receiving the hook member is formed on the opposite side of the tip portion of the arm portion to the side facing the probe substrate, and the hook The member includes a vertical portion extending in a direction away from the probe substrate at a position of the probe substrate that is disengaged from the tip portion of the arm portion, and the engagement surface spaced from the vertical portion to the engagement surface. A hook member having a bottom extending along the surface can be used.

  The probe substrate is formed of an electric insulating layer, a pattern wiring layer embedded in the electric insulating layer, connected to the probe, and the same metal material as the pattern wiring layer, and the pattern wiring is formed in the electric insulating layer. A probe substrate comprising a support layer electrically insulated from the layers can be used. In this case, the hook member can be coupled to the support layer.

  The probe and the hook according to the present invention can be formed by sequentially depositing a metal material in a recess that is formed by a photoresist formed by using a photolithography technique.

  According to the present invention, as described above, even if the probe needle tip is pressed against the electrode by the overdrive force, the probe is energized, and even if the electrode is welded to the probe tip by this energization, the probe When the assembly and the object to be inspected move relative to each other in a direction away from each other, the arm is prevented from being excessively warped and deformed to the extent that the arm portion is damaged. The tip of the probe can be reliably separated from the electrode welded thereto and removed without causing damage to the portion.

  1 and 2, a probe assembly 10 according to the present invention includes a rigid wiring board 12 and a block that is elastically supported by the rigid wiring board via a spring member 14 (see FIG. 2). 16 and a probe sheet 20 integrally formed with a probe substrate 18 provided with a plurality of well-known conductive paths electrically connected to a plurality of wiring paths (not shown) in the rigid wiring board 12. Prepare. In this embodiment, the probe substrate 18 is formed at the center of the flexible probe sheet 20.

  As is well known in the art, a wiring path connected to the electric circuit of the tester body is formed in the rigid wiring board 12, and the rigid wiring board 12 has a circular opening 12a at the center thereof. As shown in FIG. 2, a circular support plate 24 made of a metal such as stainless steel is disposed on the upper surface of the rigid wiring board 12 so as to cover the circular opening 12a. It is fixed to the rigid wiring board 12 via the bolts 22. The support plate 24 supports the rigid wiring board 12 and reinforces the rigid wiring board.

  The spring member 14 is made of a flat spring material, and the opening is formed in the circular opening 12a of the rigid wiring board 12 through an annular mounting plate 26 and an annular pressing plate 28 that sandwich the annular outer edge portion from both sides. Held across. In order to hold the spring member 14, the mounting plate 26 is coupled to the lower surface of the support plate 24 with bolts 30, and the holding plate 28 penetrates the holding plate and the annular outer edge of the spring member 14. It is connected to the mounting plate 26 by a bolt 32 that is screwed onto the mounting plate 26.

  In the example shown in FIG. 2, the parallel adjustment screw member 34 for adjusting the holding posture of the spring member 14 in a state where the bolt 30 is loosened so that the tip of the parallel adjustment screw member 34 can come into contact with the top surface of the mounting plate 26. Threaded onto.

  The block 16 described above is fixed to the main body 14b (see FIG. 1) of the spring member 14 held in the circular opening 12a of the rigid wiring board 12. The block 16 includes a stem portion 16a having a rectangular cross section, and a support portion 16b having a regular octagonal cross section continuous to the lower end of the stem portion.

  As shown in FIG. 2, the block 16 is coupled to the spring member 14 at the top surface of the stem portion 16a with the flat lower surface 16c of the support portion 16b facing downward. For this connection, a fixing plate 36 that clamps the main body portion 14b together with the stem portion 16a is fixed to the stem portion 16a by a screw member 38 that is screwed into the stem portion 16a.

  In the example shown in FIG. 1, the probe substrate 18 at the center of the probe sheet 20 is an octagonal portion formed corresponding to the lower surface 16 c of the block 16. A contact region 42 in which a large number of probes 40 (see FIG. 2) are collectively provided is formed in the central portion of the probe substrate 18 corresponding to the lower surface 16c of the block 16. Each probe 40 is connected to a corresponding conductive path in the probe substrate 18 and is formed so as to protrude from the lower surface of the contact region 42, that is, the surface opposite to the surface facing the lower surface 16 c of the block 16. .

  As shown in FIG. 2, the probe sheet 20 is fixed to the lower surface via an adhesive so that the contact region 42 of the probe substrate 18 is supported by the lower surface 16 c of the block 16. Further, the probe sheet 20 is coupled to the rigid wiring board 12 at the outer edge so that the part extending outward from the probe board 18 which is the octagonal part has a slight slack.

  An elastic rubber ring 44 is disposed along the outer edge portion of the probe sheet 20 for coupling the outer edge portions of the probe sheet 20, and a ring metal fitting 46 that covers the elastic rubber ring 44 is disposed. The outer edge portion of the probe sheet 20 is coupled to the rigid wiring substrate 12 by tightening the screw member 48 that passes through the outer edge portion of the probe sheet 20 and both the members 44 and 46 and is screwed to the rigid wiring substrate 12. By coupling the outer edge of the probe sheet 20 to the rigid wiring board 12, the conductive path of the probe sheet 20 is electrically connected to the corresponding wiring path of the rigid wiring board 12 as in the conventional case. Accordingly, each probe 40 is connected to the tester body through the conductive path of the probe sheet 20.

  An alignment pin 50 is disposed through the probe sheet 20 as necessary. At the lower end of the alignment pin 50, an alignment mark 50a (FIG. 2) that can be photographed from a camera (not shown) supported on a table (not shown) that holds a semiconductor wafer 56 (see FIGS. 4 and 5) that is an object to be inspected. Reference) is provided.

  FIG. 3 is a perspective view showing an arrangement of a large number of probes 40 provided on the probe substrate 18 as seen through the probe substrate 18 from above obliquely. In the example shown in FIG. 3, a large number of probes 40 are arranged with their needle tips 40a aligned in two rows. FIG. 4 is a front view of one probe row shown in FIG.

  Each probe 40 is made of a conductive material. As shown in FIG. 4, the probe 40 is connected to the above-described conductive path corresponding to each probe 40 in the probe board 18 and extends downward from the lower surface 18a of the probe board 18; And an arm portion 40c coupled to the probe substrate 18 and a needle tip portion 40d provided at the tip of the arm portion. The arm portion 40c extends laterally from the lower end of the attachment portion 40b along the lower surface 18a of the probe substrate 18, and the needle tip portion 40d is provided at the tip thereof. Further, the needle tip 40a protrudes from the surface opposite to the surface facing the lower surface 18a of the probe substrate 18 of the needle tip portion 40d.

  The arm portion 40c has, for example, a rectangular cross section, and is spaced from the mounting surface 18a when no load is applied. The arm portion 40c is formed with an upper protrusion 40e that forms a recess 52 that crosses the arm portion 40c and opens downward between the attachment portion 40b and the needle tip portion 40d. As shown in FIG. 3, the upper protrusions 40e in each row of the probes 40 are arranged in a straight line.

  In the example shown in FIG. 3, a common deformation regulating means 54 is formed for each probe row. That is, the hook member 54 constituting each deformation restricting means includes a bottom wall portion 54a disposed across the corresponding recess 52 for each probe row, and a bottom spaced from the probes on both sides of each probe 40. And a side wall part 54b rising from the wall part 54a. The top portion of the bottom wall portion 54a is supported by the probe substrate 18.

  When no load is applied when the probe tip 40a of the probe 40 does not contact the bump electrode 56a of the semiconductor wafer (chip region) 56 or when the probe tip 40a is pressed against the bump electrode 56a by an overdrive force, the bottom wall portion 54a The lower surface substantially coincides with the height position of the lower surface of the region excluding the upper protruding portion 40e of the arm portion 40c. At this time, the upper surface 40 of the bottom wall portion 54 a is spaced from the opposing surface of the recess 52. Therefore, at least when the probe tip 40a of the probe 40 is pressed against the bump electrode 56a, the probe 40 and the deformation restricting means 54 are brought into a non-contact state. Therefore, the bottom wall portion 54a and the side wall portion 54b can be formed of a conductive material similar to the conductive material forming the probe 40.

  During the energization test, the probe assembly 10 is relatively moved with respect to the semiconductor wafer 56 so that the probe assembly 10 and the semiconductor wafer 56 that is the object to be inspected are close to each other. With the relative movement of the probe assembly 10, the probe tip 40a of the probe 40 on the probe substrate 18 is pressed against the bump electrode 56a with an overdrive force as shown in FIG. However, at the time of this energization test, as described above, since the probe 40 and the deformation restricting means 54 formed of the hook member are in a non-contact state, the deformation restricting means 54 does not interfere with the test. .

  After the end of the energization test, the probe assembly 10 is moved away from the semiconductor wafer 56. When the bump electrode 56a is welded to the probe tip 40a of the probe 40 by the previous energization test, as shown in FIG. 5, the probe tip 10a of the probe 40 is pulled to the bump electrode 56a as the probe assembly 10 moves. For this reason, the needle tip portion 40 d receives an acting force in a direction away from the probe substrate 18. Therefore, warp deformation in the direction opposite to the deformation when the overdrive force is applied to the arm portion 40c of the probe 40 that has been welded occurs.

  However, in the probe assembly 10 according to the present invention, when the bottom wall portion 54a of the deformation restricting means 54 comes into contact with the opposing surface of the upper protrusion 40e of the probe 40, the warping deformation of the arm portion 40c is restricted. Part of the acting force is received by the deformation restricting means 54 functioning as a hook member.

  In the conventional probe assembly in which the deformation restricting means, that is, the hook member 54 is not provided, a large stress concentration is generated at a location indicated by the symbol X between the mounting portion 40b and the arm portion 40c, for example, due to large warping deformation. Therefore, there is a possibility that damage such as breakage may occur in the stress concentration portion. However, in the probe assembly 10 according to the present invention, such stress concentration is prevented by the support action by the deformation restriction means 54 and the action of restricting the warp deformation of the arm portion 40c. It is possible to reliably prevent the arm portion 40c from being damaged.

  FIG. 3 shows an example in which the deformation restricting means 54 is formed in common for each probe row. Instead, a hook member having a pair of bottom wall portions 54a and side wall portions 54b is arranged for each probe 40. Can do. However, it is desirable to provide a common deformation regulating means 54 for each probe row as shown in FIG. 3 in terms of reducing the space for the side wall portion 54b and simplifying the manufacturing process of the deformation regulating means 54.

  Instead of forming the upper protrusion 40e on the arm 40c of the probe 40, as shown in FIGS. 6 to 8, the needle tip 40d provided with the needle tip 40a is spaced from the tip of the arm 40c. The deformation regulating means 58 can be provided in association with the tip of the arm portion 40c.

  In the example shown in FIG. 6 to FIG. 8 in which the deformation restricting means 58 is provided, the plurality of probes 40 constituting the probe row have their needle tips 40a alternately arranged in the arrangement order with a predetermined deviation in the longitudinal direction of each arm portion 40c. Has been placed. Alternatively, in each arm portion 40c, instead of the above-described upper protruding portion 40e, deformation restricting means 58 is provided on the tip side of the arm portion 40c on the tip side and opposite to the surface facing the lower surface 18a of the probe substrate 18. An engagement surface 40f is formed.

  The hook member constituting the deformation restricting means 58 has an opposing surface portion corresponding to the engaging surface 40f, and has a bottom portion 58a that is arranged in a direction crossing each arm portion 40c along the probe row, and each arm portion 40c. And a vertical portion 58b rising from the bottom portion 58a with a space from the tip. The top of the vertical portion 58b is supported by the probe substrate 18 in the same manner as the side wall portion 54b of the deformation restricting means 54, whereby the vertical portion 58b protrudes downward from the lower surface 18a of the probe substrate 18, and its lower end is integrated with the vertical portion 58b. Combined.

  Therefore, as shown in FIG. 7, when the probe tip 40a of each probe 40 is in contact with the corresponding bump electrode 56a of the semiconductor wafer 56, the bottom 58a and the vertical portion of the hook member 58 constituting the deformation restricting means. 58b is spaced from the probe 40. Therefore, the hook member 58 does not interfere with the energization test.

  Further, when the probe assembly 10 is moved away from the semiconductor wafer 56 after completion of the energization test, if the bump electrode 56a is welded to the probe tip 40a of the probe 40 by the energization test, the probe assembly 10 As shown in FIG. 8, the probe tip 40a of the probe 40 is pulled by the bump electrode 56a. Therefore, the needle tip portion 40d receives an acting force in a direction away from the probe substrate 18, and the arm portion 40c is warped and deformed as described above.

  However, when the bottom 58a of the deformation restricting means 58 comes into contact with the engaging surface 40f of the arm 40c, the warping deformation of the arm 40c is restricted as described with reference to FIG. A part of the acting force is received by the functioning deformation regulating means 58. Therefore, stress concentration on the arm portion 40c due to excessive warping deformation as described above is prevented, and damage to the arm portion 40c at the stress concentration portion is reliably prevented.

  Although each hook member can be formed for each corresponding probe 40 as the deformation restricting means 58, it is desirable to form a common deformation restricting means 58 for each probe row as in the deformation restricting means 54.

  Furthermore, as shown in FIGS. 9 to 11, both deformation restricting means 54 and 58 can be combined. Because of this combination, as clearly shown in FIG. 10, the arm 40 c of each probe 40 has an upper protrusion 40 e for the deformation restricting means 54 and an engaging surface 40 f for the deformation restricting means 58. Each is formed.

  The side wall portion 54b of the hook member 54 as the first deformation restricting means is supported by the probe substrate 18, and the vertical portion 58b of the hook member 58 as the second deformation restricting means is similarly supported by the probe substrate 18. As shown in FIG. 10, when the probe tips 40 a of the probes 40 are in contact with the corresponding bump electrodes 56 a of the semiconductor wafer 56, the hook members 54 and 58 constituting the deformation restricting means are spaced from the probe 40. Put. Therefore, both hook members 54 and 58 do not interfere with the energization test.

  Further, when the probe assembly 10 is moved away from the semiconductor wafer 56 after completion of the energization test, if the bump electrode 56a is welded to the probe tip 40a of the probe 40 by the energization test, the probe assembly 10 As shown in FIG. 11, the probe tip 40a of the probe 40 is pulled by the bump electrode 56a. Therefore, the needle tip portion 40d receives an acting force in a direction away from the probe substrate 18, and the arm portion 40c is warped and deformed as described above.

  At this time, as shown in FIG. 11, the bottom wall portion 54a of the first hook member 54 abuts against the facing surface of the upper projection 40e of the arm portion 40c, and the bottom portion 58a of the second hook member 58 faces. It abuts on the engagement surface 40f of the arm portion 40c. Therefore, since the rebound force acting on the arm portion 40c is shared by the hook members 54 and 58, the stronger acting force acting on the arm portion 40c can be reliably received. Therefore, the combination of both deformation restricting means 54 and 58 is effective for stronger fixation of the bump electrode 56a to the probe tip 40a of the probe 40, so that the probe 40 is not damaged without damaging the probe 40. It is possible to remove the bump electrode 56a that has been welded to the solder plate reliably.

  Next, a method for manufacturing the deformation restricting means according to the present invention will be described. 12 and 13 show an example of a manufacturing method of the deformation restricting means (hook member) 54 shown in FIGS. 3 to 5 in relation to the manufacturing method of the probe 40 and the probe substrate 18.

  In the method of manufacturing an assembly including the hook member 54 according to the present invention, as shown in FIG. 12A, a metal plate such as a stainless steel plate is used as the base 100, and an indenter dent is formed on the surface thereof. Thus, a recess 102 for the needle tip of the probe 40 is formed. Although a single recess 102 is shown in the drawing, a plurality of recesses 102 corresponding to the number of probes 40 formed in the above-described contactor region 42 are provided with a predetermined needle tip interval. It is formed. Hereinafter, for simplification of description, description will be made along an example of a single probe representing a plurality of probes 40.

  After the formation of the recess 102, a pattern mask 104 for a sacrificial layer to be removed later is formed in a predetermined region in the vicinity of the recess 102 except for the recess 102 by selective exposure and development of a photoresist using a photolithography technique. (FIG. 12B).

  A metal material such as copper is deposited by electroplating in the recess in the pattern mask 104, and a sacrificial layer 106 is formed from this metal material (FIG. 12C). After the formation of the sacrificial layer 106, the pattern mask 104 is removed (FIG. 12D).

  After the removal of the sacrificial layer 106, a pattern mask 108 is formed to cover other regions except the predetermined portion of the sacrificial layer 106 and the recess 102 (FIG. 12E). The region 110 exposed from the pattern mask 108 of the sacrificial layer 106 corresponds to the bottom wall portion 54 a of the deformation regulating means 54.

  In the region 110 exposed from the pattern mask 108 of the sacrificial layer 106, for example, the same metal material 112 as the metal material forming the probe 40 is deposited to a predetermined thickness by, for example, electroplating (FIG. 12F). As this metal material, it is desirable to use a metal material rich in toughness such as nickel or nickel copper alloy.

  When the bottom wall portion 54a is formed by the deposition of the metal material 112, the pattern mask 108 is removed (FIG. 12G). Next, a new pattern mask 114 for the sacrificial layer covering the bottom wall portion 54a is formed of photoresist (FIG. 12H), and the same material 116 as the sacrificial layer 106 is patterned by, for example, electroplating. It is deposited on the bottom wall portion 54a exposed from the mask 114 (FIG. 12 (i)). Thereafter, as shown in FIG. 12H, the new sacrificial layer 116 is polished together with the protruding surface of the pattern mask 114 so as to have a predetermined thickness (FIG. 12J).

  After polishing, the pattern mask 114 is removed (FIG. 12 (k)), and a new pattern mask 118 that selectively exposes a predetermined region including the recess 102 is formed with a photoresist (FIG. 12 (l)). The pattern mask 118 has a planar shape that exposes the recesses 120 corresponding to the arm portion 40c and the needle tip portion 40d excluding the mounting portion 40b of the probe 40, and in the recess 120 that is the exposed region, Forty metal materials 122 are deposited to a predetermined thickness by, for example, electroplating (FIG. 13 (m)).

  After the deposition of the metal material 122, the pattern mask 118 is removed, whereby the region including the recess 102 on the base 100, the sacrificial layer 116, and the sacrificial layer 106, as shown in FIG. Are each formed integrally with a needle tip portion 40d including a needle tip 40a, an upper projection 40e, and an arm portion 40c.

  The arm 40c, the needle tip 40d, and the upper protrusion 40e are once covered with a pattern mask 124 made of a photoresist (FIG. 13 (o)). The pattern mask 124 exposes the rear edge of the sacrificial layer 106. In a region excluding the pattern mask 124, a new sacrificial layer 126 made of a metal material such as copper is deposited (FIG. 13 (p)).

  After the sacrificial layer 126 is deposited, the pattern mask 124 is removed, and the metal material 122, that is, the portion excluding the mounting portion 40b of the probe 40 is exposed again (FIG. 13 (q)).

  A sacrificial layer 128 made of a dry film is formed on the sacrificial layer 126 and the metal material 122 exposed from the sacrificial layer, and a polyimide layer 130 constituting one surface of the probe substrate 18 is further formed on the sacrificial layer 128. Deposited to a thickness (FIG. 13 (r)).

  As shown in FIG. 13S, the polyimide layer 130 and the sacrificial layer 128 are formed with etching holes 132 and 134 penetrating therethrough. One etching hole 132 is formed in a pair on both sides of the upper protrusion 40e of the arm portion 40c, and each etching hole 132 opens to the upper surface of the bottom wall portion 54a. The other etching hole 134 opens to the upper surface of the arm portion 40c.

  The pair of etching holes 132 is a hole for the side wall portion 54b of the deformation restricting means 54, and the other etching hole 134 is a hole for the attachment portion 40b. Therefore, the above-described metal material for the probe 40 is deposited in the holes 132 and 134, whereby a pair of side wall portions 54b are formed integrally with the bottom wall portion 54a, while the arm portions are formed. A mounting portion 40b is integrally formed with 40c (FIG. 13 (t)).

  After the formation of the side wall portion 54b and the attachment portion 40b, as shown in FIG. 13 (u), a conductive material 136 (136a, 136b) for pattern wiring is deposited on the polyimide layer 130. Of this conductive material layer, the conductive material layer portion 136a is formed so as to cover the mounting portion 40b, and constitutes the conductive path of the probe substrate 18 formed integrally with the mounting portion. Further, the conductive material layer portion 136b that is electrically cut off from the conductive material layer portion 136a is formed integrally with the side wall portion so as to cover the top of the side wall portion 54b, and constitutes an anchor portion of the side wall portion 54b. Therefore, the conductive material layer portion 136 b functions as a support layer for the hook member 54.

  Further, as shown in FIG. 13 (u), the ceramic plate 140 is embedded through the adhesive layers 138a and 138b so as to cover the conductive material layer portions 136a and 136b and the polyimide layer 130. The ceramic plate 140 has a planar shape substantially corresponding to the contact region 42 of the probe substrate 18 and increases the rigidity of the contact region 42. Furthermore, a polyimide layer 142 constituting the other surface of the probe substrate 18 is laminated on the polyimide layer 130 so as to cover the conductive material layer portions 136a and 136b and the ceramic plate 140 on the polyimide layer. Both polyimide layers 130 and 142 constitute an electrically insulating layer of the probe substrate 18.

  A sacrificial layer 144 made of dry fill is formed on the polyimide layer 142. Through the sacrificial layer 144, the polyimide layer 142, and the adhesive layer 138a, an etching hole 146 is formed to open on the conductive path 136a formed by the conductive material layer portion. In the etching hole 146, a conductive material for the connection terminal 148 which is a lead stem of the conductive path 136a is deposited. The top of the connection terminal 148 becomes an electrical connection terminal of the probe board 18, and the electrical connection terminal is connected to the conductive path of the probe sheet 20.

  After the connection terminal 148 is formed, each sacrificial layer 106, 116, 126, 128 and 144 is removed and the probe assembly is removed from the base 100. Thereby, the assembly of the probe substrate 18, the probe 40, and the deformation restricting means 54 is completed. This assembly can be assembled to the probe sheet 20 as part of the probe assembly 10 shown in FIGS.

  Finally, a method for manufacturing the hook member 58 according to the present invention will be described with reference to FIGS. As shown in FIG. 14A, a recess 102 for the needle tip of the probe 40 is formed on the surface of the base 100. Thereafter, a pattern mask 150 for forming a recess for the bottom portion 58a of the hook member 58 is formed with a photoresist in the vicinity of the recess 102 at a position separated from the recess (FIG. 14B).

  As shown in FIG. 14 (c), a metal material for the hook member 58, that is, a metal material for the probe 40, for example, is deposited in the recess of the pattern mask 150, and is positioned in the vicinity of the recess 102. When the bottom portion 58a of the hook member 58 is formed, the pattern mask 150 is removed (FIG. 14D).

  Next, a new pattern mask 152 for partially covering the bottom 58a with a sacrificial layer made of a metal such as copper is formed (FIG. 14E). A metal material 154 for a sacrificial layer is deposited on an area exposed from the pattern mask 152 (FIG. 14F), and the metal material layer 154 is ground together with the surface of the pattern mask and set to an appropriate thickness. (FIG. 14 (g)).

  After removal of the pattern mask 152 (h), a new pattern mask 156 for forming the sacrificial layer 160 for the arm portion 40c is formed (FIG. 14 (i)). In the recess 158 exposed from the pattern mask 156, a sacrificial layer 160 made of, for example, copper is deposited by the same electroplating method as described above (FIG. 14J). Thereafter, the pattern mask 156 is removed (FIG. 14 (k)), and a bottom 58a on the base 100, a sacrificial layer 154 that partially covers the bottom, and a pattern mask 162 that covers a predetermined portion of the sacrificial layer 160 are formed. (FIG. 14 (l)). The region exposed from the pattern mask 162 on the sacrificial layer 154 and the sacrificial layer 160 corresponds to the arm portion 40c, and the exposed region including the recess 102 between the sacrificial layers 154 and 160 is the needle tip portion including the needle tip 40a. This corresponds to the region 40d.

  Therefore, the metal material 112 for the probe 40 is deposited on the region exposed from the pattern mask 162 (FIG. 15 (m)), and then the pattern mask 162 is removed (FIG. 15 (n)). By removing the pattern mask 162, the needle tip portion 40d having the needle tip 40a and the arm portion 40c formed integrally therewith are exposed on the base 100 as a whole. At this time, the distal end portion of the arm portion 40c is placed on the bottom portion 58a via the sacrificial layer 154.

  The integrally formed arm portion 40c and needle tip portion 40d are once covered with a pattern mask 164 made of photoresist (FIG. 15 (o)). The pattern mask 164 exposes the rear edge of the sacrificial layer 160. In a region excluding the pattern mask 164, a new sacrificial layer 166 made of a metal material such as copper is deposited (FIG. 15 (p)).

  After the sacrificial layer 166 is deposited, the pattern mask 164 is removed, and the portion excluding the mounting portion 40b of the probe 40 is exposed again (FIG. 15 (q)).

  A sacrificial layer 128 made of a dry film is formed on the sacrificial layer 166 and an area exposed from the sacrificial layer, and a polyimide layer 130 constituting one surface of the probe substrate 18 is further formed on the sacrificial layer 128. Deposited to a thickness (FIG. 15 (r)).

  As shown in FIG. 15S, the polyimide layer 130 and the sacrificial layer 128 are formed with etching holes 132 and 134 penetrating therethrough. One etching hole 132 extends downward at a distance from the arm portion in front of the tip portion of the arm portion 40c, and opens to the upper surface of the bottom portion 58a. The other etching hole 134 opens to the upper surface of the arm portion 40c.

  The etching hole 132 is a hole for the vertical portion 58b of the deformation restricting means 58, and the other etching hole 134 is a hole for the mounting portion 40b. Accordingly, the above-described metal material for the probe 40 is deposited in the holes 132 and 134, whereby the vertical portion 58b is formed integrally with the bottom portion 58a, while the arm portion 40c has the vertical portion 58b. A mounting portion 40b is formed integrally therewith (FIG. 15 (t)).

  After the formation of the vertical portion 58b and the attachment portion 40b, as shown in FIG. 15 (u), a conductive material 136 (136a, 136b) for pattern wiring is deposited on the polyimide layer 130. Of this conductive material layer, the conductive material layer portion 136a is formed so as to cover the mounting portion 40b, and constitutes the conductive path of the probe substrate 18 formed integrally with the mounting portion. In addition, the conductive material layer portion 136b that is electrically cut off from the conductive material layer portion 136a is formed integrally with the vertical portion so as to cover the top of the vertical portion 58b, and constitutes an anchor portion of the vertical portion 58b. Therefore, as described above, the conductive material layer portion 136 b functions as a support layer for the hook member 58.

  Further, as shown in FIG. 15 (u), the ceramic plate 140 for increasing the rigidity of the contact region 42 covers the adhesive layers 138a and 138b so as to cover the conductive material layer portions 136a and 136b and the polyimide layer 130. Buried. Further, a polyimide layer 142 constituting the other surface of the probe substrate 18 is laminated so as to cover the conductive material layer portions 136a and 136b and the ceramic plate 140.

  After a sacrificial layer 144 made of dry fill is formed on the polyimide layer 142, the sacrificial layer 144, the polyimide layer 142, and the adhesive layer 138a are passed through the connection terminal 148 which is a lead stem of the conductive path 136a. Conductive material for is deposited. The connection terminal 148 is connected to the corresponding wiring path of the rigid wiring board 12 described above.

  After the connection terminals 148 are formed, the sacrificial layers 154, 160, 166, 128, and 144 are removed, and the probe assembly is removed from the base 100. Thereby, the assembly of the probe substrate 18, the probe 40, and the deformation restricting means 58 is completed. This assembly can be assembled to the probe sheet 20 as part of the probe assembly 10 shown in FIGS.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention. The above-described manufacturing method is only an example, and various deformation regulating means can be formed by various methods.

It is a bottom view which shows an example of the probe assembly which concerns on this invention. It is drawing which expands and shows the cross section obtained along line II-II shown in FIG. It is a perspective view which expands and shows a part of specific example of the probe assembly shown in FIG. FIG. 4 is a front view of the probe assembly showing a state in which the probe of the probe assembly shown in FIG. 3 is pressed against a corresponding electrode with an overdrive force. FIG. 5 is a view similar to FIG. 4 showing a state immediately before the probe of the probe assembly shown in FIG. 3 is separated from the corresponding electrode. It is drawing similar to FIG. 3 which shows the other specific example of this invention. FIG. 7 is a view similar to FIG. 4 of the probe assembly shown in FIG. 6. FIG. 7 is a view similar to FIG. 5 of the probe assembly shown in FIG. 6. It is drawing similar to FIG. 3 which shows the other specific example of this invention. FIG. 10 is a view similar to FIG. 4 of the probe assembly shown in FIG. 9. FIG. 10 is a view similar to FIG. 5 of the probe assembly shown in FIG. 9. It is process explanatory drawing (the 1) which shows the manufacturing method of the deformation | transformation control means of the probe assembly shown in FIG. It is process explanatory drawing (the 2) which shows the manufacturing method of the deformation | transformation control means of the probe assembly shown in FIG. FIG. 7 is a process explanatory view (No. 1) showing a manufacturing method of the deformation regulating means of the probe assembly shown in FIG. 6; FIG. 8 is a process explanatory view (No. 2) showing the method for manufacturing the deformation regulating means for the probe assembly shown in FIG. 6.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Probe assembly 18 Probe board 40 Probe 40a Probe needle point 40b Probe attachment part 40c Probe arm part 40d Probe needle part 40e Arm part upper projection part 40f Arm part engagement surface 54, 58 Deformation restriction means (Hook member)
54a Bottom wall portion of hook member 54b Side wall portion of hook member 58a Bottom portion of hook member 58b Vertical portion of hook member 130, 142 Electrical insulation layer of probe board 136b Support layer

Claims (10)

  A probe substrate, an arm portion having an end portion supported by the probe substrate, extending substantially along the probe substrate, and a needle tip portion protruding from the probe substrate in a direction away from the probe substrate A plurality of probes each of which is supported by the probe substrate, and means for restricting the warping deformation generated in the arm portion when the probe tip portion of the probe receives an acting force in a direction away from the probe substrate. A probe assembly.   The probe assembly according to claim 1, wherein the arm portion is supported by the probe substrate via an attachment portion extending from the end portion toward the probe substrate.   2. The probe assembly according to claim 1, wherein at least some of the plurality of probes are arranged in alignment with each other, and the restriction means is provided in common with the plurality of aligned probes.   The restricting means allows deformation of the arm portion with displacement of the needle tip portion toward the probe substrate, but of the arm portion with displacement of the needle tip portion exceeding a predetermined distance from the probe substrate. The probe assembly according to claim 1, comprising a hook member that restricts deformation.   The probe assembly according to claim 4, wherein the hook member is provided on the probe substrate so as to be engageable with the arm portion between the attachment portion and the needle tip portion.   The hook member includes a pair of side wall portions projecting from the probe substrate along both sides of the arm portion on both sides of the arm portion, and the arm portion formed integrally with the both side wall portions on the opposite side to the probe substrate. The probe assembly according to claim 4, further comprising a bottom wall spaced from the surface of the probe assembly.   5. The probe assembly according to claim 4, wherein the hook member is provided on the probe substrate so as to be engageable with the arm portion on a distal end side with respect to the needle tip portion when viewed in the longitudinal direction of the arm portion.   An engagement surface that receives the hook member is formed on the side of the tip of the arm that is opposite to the side facing the probe substrate, and the hook member is disengaged from the tip of the arm. 5. The apparatus according to claim 4, comprising: a vertical portion extending in a direction away from the probe substrate at a position of the probe substrate; and a bottom portion extending along the engagement surface at a distance from the vertical portion to the engagement surface. Probe assembly.   The probe substrate is formed of an electric insulating layer, a pattern wiring layer embedded in the electric insulating layer, to which the probe is connected, and the same metal material as the pattern wiring layer, and the pattern wiring layer is formed in the electric insulating layer. The probe assembly according to claim 4, further comprising a support layer electrically insulated from the hook member, wherein the hook member is coupled to the support layer.   5. The probe assembly according to claim 4, wherein the probe and the hook member are formed by sequentially depositing a metal material in a recess resembling a photoresist formed by using a photolithography technique.

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