JP2008091622A - Heat receiving member mounting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat receiving member mounting structure which can be thermally connected to a semiconductor element with a small thermal resistance even if a thin heat receiving plate is used, making it possible to thin a heat sink. <P>SOLUTION: A heat receiving member mounting structure 1 includes a substrate 2 and a substrate 5 mounted on the substrate 2, a semiconductor element 6 mounted on the substrate 5 protruding from the substrate 5, a heat receiving plate 3, of which one side is thermally connected to the protruding side of the semiconductor element 6, of which another side is thermally connected to a heat pipe 10, being equipped with a reinforcement structure 4 in the periphery of the protruding side, and a fixing member 7 which fixes the substrate 2 and the heat receiving plate 3 while the protruding side and the heat receiving plate 3 are thermally connected by an elastic force. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat receiving member mounting structure for fixing a heat receiving plate thermally connected to a semiconductor element mounted on a substrate to the substrate, and more particularly to a thin heat receiving member mounting structure by thinning the heat receiving plate.

  The heat generation amount and the heat generation density of the projecting surfaces of the CPU and elements mounted on the substrate are increased, and there is a demand for a high performance heat sink that efficiently dissipates them. In personal computers as well, CPUs, graphic chips (GPU or VGA), chipsets and other elements that require active heat dissipation have increased. On the other hand, a reduction in thickness has been demanded.

FIG. 12 is a schematic diagram for explaining a conventional heat sink. As shown in FIG. 12A, the heat receiving plate 101 is thermally connected to the semiconductor element mounted on the substrate, and is fixed to the substrate by the fixing member 105. One end of the heat pipe is thermally connected to the upper surface of the heat receiving plate. The other end of the heat pipe is thermally connected to the radiating fin portion 103 and moves the heat of the semiconductor element to the radiating fin portion. A fan 104 is provided in the vicinity of the heat radiating fin portion, and the heat moved to the heat radiating fin portion is released, for example, outside the housing. FIG. 12B is a cross-sectional view of the portion viewed from the direction of arrow A shown in FIG. As shown in FIG. 12B, the heat receiving plate 110 is pressed against the protruding surface (that is, the upper surface) of the semiconductor element 107 mounted on the substrate, and is fixed to the substrate 106 by a fixing member including a screw 108 and a spring 109. Has been.
JP 2000-286130 A

  As described above, the heat sink is strongly required to be thin, and the heat receiving plate needs to be thin. As shown in FIG. 12 (c), when the heat receiving plate is thinned, the rigidity of the heat receiving plate is lowered, and as shown by an arrow C, deflection occurs in the central portion of the heat receiving plate. The spring is not compressed at the end of the heat receiving plate through which the screw of the fixing member is inserted, and the load is reduced. Therefore, the thermal connection between the protruding surface of the semiconductor element and the heat receiving plate is deteriorated, and the thermal resistance is increased.

  Accordingly, an object of the present invention is to provide a heat receiving member mounting structure that can be thermally connected to a semiconductor element with a small thermal resistance even if a thin heat receiving plate is used, and the heat sink can be thinned. .

  The inventor conducted extensive research to solve the conventional problems. As a result, even if a thin heat receiving plate is used, the rigidity of the heat receiving plate can be reinforced by providing a reinforcing structure portion around the element contact surface that is thermally connected to the protruding surface of the semiconductor element, It has been found that when the heat receiving plate and the substrate are fixed by the fixing member, no gap is formed between the heat receiving plate and the protruding surface of the semiconductor element, and the heat connection can be performed with a small thermal resistance.

  Furthermore, it has been found that the above-described reinforcing structure can be easily formed by folding and overlapping the end portions of the heat receiving plate, and the heat sink can be made thinner. In addition, by fixing the body portion of the leaf spring to the heat receiving plate and providing the extending portions radially, the extending portion can be fixed to the substrate by the fixing member using the leaf spring itself as a reinforcing material, and the heat receiving plate by the fixing member. When fixing the substrate, it has been found that there is no gap between the heat receiving plate and the protruding surface of the semiconductor element.

  According to a first aspect of the heat receiving member mounting structure of the present invention, a substrate, a semiconductor element mounted on the substrate and projecting from the substrate, and a projecting surface of the semiconductor element projecting from the substrate are thermally applied. One surface is connected, the other surface is thermally connected to a heat pipe, a heat receiving plate provided with a reinforcing structure around the protruding surface, the substrate and the heat receiving plate, and the protruding surface It is a heat receiving member attachment structure provided with the fixing member fixed in the state in which the heat receiving plate was thermally connected by the elastic force.

  A second aspect of the heat receiving member mounting structure according to the present invention is the heat receiving member mounting structure in which the reinforcing structure portion is formed by bending and overlapping the peripheral portion of the heat receiving plate.

  A third aspect of the heat receiving member mounting structure according to the present invention is a heat receiving member mounting structure in which a peripheral portion of the heat receiving plate is bent toward the semiconductor element.

  A fourth aspect of the heat receiving member mounting structure according to the present invention is a heat receiving member mounting structure in which the heat receiving plate is pressed to form a recess corresponding to the projecting surface and is bent toward the recess.

  According to a fifth aspect of the heat receiving member mounting structure of the present invention, the reinforcing structure portion of the heat receiving plate is formed by overlapping the heat receiving plate by folding a peripheral portion of a polygonal plate toward the semiconductor element. The heat receiving member mounting structure.

  According to a sixth aspect of the heat receiving member mounting structure of the present invention, the heat receiving plate includes a rectangular element contact portion corresponding to the protruding surface, and extending portions extending radially from each corner of the element contact portion. The reinforcing structure portion is a heat receiving member mounting structure formed by bending and overlapping the extending portion.

  A seventh aspect of the heat receiving member mounting structure according to the present invention is a heat receiving member mounting structure in which the reinforcing structure is formed of another material different from the heat receiving plate and is attached to the heat receiving plate. is there.

  According to an eighth aspect of the heat receiving member mounting structure of the present invention, a groove portion is formed by cutting or forging at a position corresponding to the projecting surface of the heat receiving plate, and a peripheral portion of the groove portion forms the reinforcing structure portion. It is a member attachment structure.

  A ninth aspect of the heat receiving member mounting structure according to the present invention is the heat receiving member mounting structure in which the fixing member includes a screw and a spring, and the heat receiving plate is screwed to the substrate via the spring.

  According to a tenth aspect of the heat receiving member mounting structure of the present invention, the spring is composed of a plurality of plate springs each having a fixing portion and an extending portion, and each of the fixing portions is fixed to the heat receiving plate, and the extension It is the heat receiving member attachment structure screwed through each of the parts.

  In an eleventh aspect of the heat receiving member mounting structure according to the present invention, the spring is composed of a single member connecting the fixing portions of a plurality of leaf springs each having a fixing portion and an extending portion, and the fixing portions are respectively provided. It is a heat receiving member mounting structure fixed to the heat receiving plate and screwed through the extending portion.

  A twelfth aspect of the heat receiving member mounting structure according to the present invention is a heat receiving member mounting structure further including a reinforcing member on a side on which the leaf spring is mounted.

  A thirteenth aspect of the heat receiving member mounting structure according to the present invention is a heat receiving member mounting structure in which the heat pipe is composed of a plurality of heat pipes and another reinforcing member is provided between the heat pipes.

  According to the heat receiving member mounting structure of the present invention, since the reinforcing structure portion of the separate member is provided in the peripheral portion of the thin heat receiving plate, when the heat receiving plate and the substrate are fixed by the fixing member made of screws and springs, Protruding surfaces can be connected with a small thermal resistance. As a result, the heat receiving member can be thinned and the heat sink can be thinned.

The heat receiving member mounting structure of the present invention will be described with reference to the drawings.
One aspect of the heat receiving member mounting structure according to the present invention includes a substrate, a semiconductor element mounted on the substrate and protruding from the substrate, and a thermal surface on the protruding surface of the semiconductor element protruding from the substrate. And the other surface is thermally connected to a heat pipe, a heat receiving plate having a reinforcing structure around the protruding surface, the substrate and the heat receiving plate, and the protruding surface and the heat receiving plate. A heat receiving member mounting structure including a fixing member that fixes a plate in a state where the plate is thermally connected by an elastic force.

FIG. 1 is a schematic cross-sectional view illustrating a heat receiving member mounting structure according to the present invention.
As shown in FIG. 1, the heat receiving member mounting structure 1 of the present invention includes a substrate (motherboard) 2, a semiconductor element 6 having a protruding surface (that is, an upper surface) mounted on a small substrate 5, and a reinforcement. A heat receiving plate 3 including the structure portion 4, a substrate (motherboard) 2, and a fixing member 7 that fixes the heat receiving plate 3 are provided. That is, the protruding surface of the semiconductor element 6 mounted on the substrate (motherboard) 2 is thermally connected to one surface of the heat receiving plate. In order to reduce the thermal resistance, the protruding surface is formed flat.

  A reinforcement structure 4 formed of a member different from the heat receiving plate is attached to the periphery of the element contact portion 11 where the protruding surface of the heat receiving plate 3 is thermally connected. One end of the heat pipe 10 is thermally connected to the surface opposite to the surface of the heat receiving plate to which the semiconductor element is thermally connected.

  In the embodiment shown in FIG. 1, the ends of the two heat pipes are thermally connected to the heat receiving plate. A heat radiating fin is thermally connected to the other end of the heat pipe (not shown), and the heat transferred to the heat radiating fin by the heat pipe is radiated by a fan provided near the heat radiating fin. At least the end of the heat pipe may be flattened to widen the contact surface with the heat receiving plate.

For example, holes are provided at four corners of the heat receiving plate, and a fixing member is inserted through the hole so that the heat receiving plate is fixed to the substrate. The fixing member 7 includes a screw 8 and a spring 9, for example.
The gap between the lower surface of the reinforcing structure portion 4 provided in the lower peripheral portion of the heat receiving plate 3 and the small substrate 5 is conventional when the heat receiving plate and the substrate (motherboard) are fixed by the fixing member described above. As described in the art, the heat receiving plate is set to be curved so that there is no gap between the element contact portion of the heat receiving plate and the protruding surface. For example, the gap between the lower surface of the reinforcing structure 4 and the upper surface of the small substrate 5 may be substantially the same as the thickness of the reinforcing structure. In this case, since the small substrate supports the reinforcing member, the element contact portion of the heat receiving plate and the protruding surface are in close contact with each other, and the thermal resistance is reduced.

As described above, in the heat receiving member mounting structure according to this aspect, the reinforcing structure portion of the separate member is provided in the peripheral portion of the thin heat receiving plate. Therefore, when the heat receiving plate and the substrate are fixed by the fixing member including the screw and the spring. In addition, the heat receiving plate and the protruding surface can be connected with a small thermal resistance.
In the embodiment shown in FIG. 1, as described above, the small substrate 5 is disposed on the substrate (motherboard) 2, the semiconductor element protrudes from the small substrate, and the upper surface forms a protruding surface. It may be a case where a semiconductor element is directly mounted on a substrate (that is, a mother board). Further, a socket may be disposed on a substrate (motherboard), a small substrate may be disposed on the socket, and a semiconductor element may be formed to protrude on the small substrate.

  FIG. 2A is a schematic cross-sectional view illustrating a heat receiving member mounting structure according to another embodiment of the present invention. FIG.2 (b) is the top view and sectional drawing of a heat receiving plate provided with the reinforcement structure part. In this aspect, as shown in FIG. 2 (b), the peripheral portion of the heat receiving plate is folded and overlapped to form the reinforcing structure portion.

  That is, as shown in the left and right views of FIG. 2B, the portion 3-1 formed by folding both side ends of the heat receiving plate 3 toward the semiconductor element side functions as a reinforcing structure portion. A portion located between the two portions 3-1 that are folded and overlapped forms an element contact surface that is thermally connected to the protruding surface of the semiconductor element. A hole 12 for a fixing member is formed at the end of the folded and overlapped portion.

  The heat receiving plate 3 is fixed to the substrate using the heat receiving plate 3 having the reinforcing structure described with reference to FIG. That is, as shown in FIG. 2 (a), the heat receiving member mounting structure 1 according to this aspect includes a substrate 2, a semiconductor element 6 provided with a projecting surface mounted on a small substrate 5, and a peripheral portion bent. And a heat receiving plate 3 that forms a reinforcing structure 3-1 by overlapping and a fixing member 7 that fixes the substrate and the heat receiving plate. As described above, the protruding surface of the semiconductor element 6 mounted on the substrate 2 is thermally connected to the element contact surface of the heat receiving plate positioned between the two portions 3-1 that are folded and overlapped.

  Since the heat receiving plate 3 includes the reinforcing structure portion 3-1 formed by bending and overlapping the side surface portion of itself, the rigidity of the thin heat receiving plate is enhanced. Therefore, when the heat receiving plate is fixed to the substrate through the spring by inserting the screw as the fixing member through the spring, the protruding surface and the heat receiving plate are thermally heated with a small thermal resistance without causing the heat receiving plate to bend. Connected. On the other hand, since the heat receiving plate is thin, the thin element contact portion is thermally connected to the protruding surface of the semiconductor element, and the heat receiving member mounting structure can be thinned.

  FIG. 3 is a diagram illustrating another embodiment of the heat receiving plate. Fig.3 (a) is the top view and side view of a heat receiving plate which formed the recessed part by press work. FIG. 3B is a plan view and a side view of the heat receiving plate in which the side portions of the heat receiving plate shown in FIG.

  As shown to Fig.3 (a), a recessed part is formed in the center part 3-2 of the heat receiving plate 3 by press work. That is, flat surfaces 3-3 are formed on both sides of the concave portion of the central portion 3-2. The back surface of the concave portion in the central portion forms an element contact surface that is thermally connected to the protruding surface of the semiconductor element. As shown in FIG. 3B, both side portions 3-3 of the heat receiving plate in which the concave portion is formed in the central portion 3-2 in this way are folded and overlapped to the concave portion side. When folded in this way, the upper surface of the concave portion at the center portion and the upper surfaces of the side portions 3-3 that are folded and overlapped form substantially the same surface.

  As shown in the right cross-sectional view of FIG. 3B, the formed heat receiving plate is thicker at both sides, and the element contact surface that is thermally connected to the protruding surface of the semiconductor element at the center is thinner. . Although not shown, a hole through which the fixing member is inserted is formed. In FIG. 3, the bending direction is described as the concave portion side of the central portion, but the bending direction is not limited to this, and the folding direction may be folded to the opposite side and overlapped.

FIG. 4 is a diagram illustrating another embodiment of the heat receiving plate. FIG. 4A is a plan view of an octagonal heat receiving plate. FIG. 4B is a plan view of the heat receiving plate in which the side portions of the heat receiving plate shown in FIG.
As shown in FIG. 4A, an octagonal heat receiving plate is prepared so that a heat receiving plate having a predetermined shape can be formed. A dotted line portion shown in FIG. 4A is a fold line.

  The peripheral portion 3-4 is bent and overlapped at the dotted line portion shown in FIG. 4A to form a heat receiving plate having a predetermined shape (in this embodiment, a rectangle). As shown in FIG. 4B, the heat receiving plate 3 formed by being folded and overlapped as described above has a thin central portion 3-6 and becomes an element contact surface. The peripheral portion 3-5 is folded and overlapped to be approximately twice as thick as the central portion. Also in this aspect, a hole through which the fixing member is inserted is formed at the corner.

  FIG. 5 is a diagram illustrating another embodiment of the heat receiving plate. Fig.5 (a) is the top view and side view of a heat-receiving plate thicker than another aspect. FIG. 5B is a plan view and a side view of the heat receiving plate in which a groove portion is formed by cutting or forging the central portion of the heat receiving plate shown in FIG.

  A slightly thick heat receiving plate is prepared as shown in FIG. As shown in FIG. 5B, the central portion 3-2 of the heat receiving plate 3 thus prepared is cut to form a thin element contact surface. That is, in this embodiment, the central portion 3-2 of the thick plate-shaped heat receiving plate is cut and thinned, and the both side portions 3-3 are left as they are as thick portions. As a result, while maintaining the rigidity of the heat receiving plate, the thickness of the element contact surface 11 that is thermally connected to the protruding surface of the semiconductor element can be reduced, so that the heat receiving member mounting structure can be made thinner. Also in this aspect, a hole through which the fixing member is inserted is formed at the corner.

  FIG. 6 is a diagram illustrating another embodiment of the heat receiving plate. FIG. 6A is a plan view of the heat receiving plate. FIG. 6B is a plan view of the heat receiving plate formed by folding and overlapping the radially extending portions of the heat receiving plate shown in FIG. As shown in FIG. 6A, a thin plate-shaped heat receiving plate 3 having a rectangular portion and extending portions 13 extending radially from the corners of the rectangle is prepared. Four extending portions 13 are folded and overlapped along the dotted line shown in FIG. 6A to form a heat receiving plate with increased rigidity along the extending portion, as shown in FIG. 6B. In this aspect, a hole 12 through which the fixing member is inserted is formed at the end of the extended portion that is folded and overlapped. In the heat receiving plate of this aspect, the rigidity of the line connecting the hole 12 and the element contact surface is increased.

  FIG. 7 is a schematic cross-sectional view illustrating a heat receiving member mounting structure according to another aspect of the present invention. In this aspect, the reinforcing structure portion 3-1 is formed by bending and overlapping the peripheral portion of the heat receiving plate. Note that, as described with reference to FIG. 1, a reinforcing structure portion as a separate member may be provided around the thin heat receiving plate.

  As shown in FIG. 7, a portion 3-1 formed by folding both side end portions of the heat receiving plate 3 toward the semiconductor element side and functioning as a reinforcing structure portion. A portion located between the two portions 3-1 that are folded and overlapped forms an element contact surface that is thermally connected to the protruding surface of the semiconductor element. A hole for a fixing member is formed at the end of the folded and overlapped portion.

In this embodiment, a screw 8 and an elastic resin material 9 are used as the fixing member 7. The elastic resin material functions as a spring. That is, a washer formed of an elastic resin material such as rubber is used. For example, there is a silicone washer having a thickness of 1 mm. If a silicone washer is used, the diameter can be reduced. Further, a disc spring may be used instead of the elastic resin washer. The material of the disc spring may be metal or resin.
Other portions of the heat receiving member mounting structure are substantially the same as those described with reference to FIG. 1 or FIG.

  FIG. 8 is a view for explaining a heat receiving plate to which a leaf spring is attached. 8A is a plan view and FIG. 8B is a cross-sectional view. As shown in FIG. 8, the heat receiving plate 3 is formed with a reinforcing structure portion 3-1 by folding both side portions as described with reference to FIG. An element contact surface 11 to be thermally connected is formed. Leaf springs composed of a fixing portion 14-1 and an extending portion 14-2 are attached to both sides of the heat receiving plate formed in this way, for example, by rivets 15. That is, leaf springs are attached to the heat receiving plate portions (that is, both side portions) that retain rigidity. In a state where the thin element contact surface 11 of the heat receiving plate 3 is thermally connected to the protruding surface of the semiconductor element, the fixing member is inserted into the hole 12 provided in the extending portion 14-2, and the heat receiving plate is attached to the substrate. Fixed.

  FIG. 9 is a view for explaining a heat receiving plate to which a leaf spring is attached. FIG. 9A is a plan view, and FIG. 9B is a cross-sectional view. As shown in FIG. 9 (a), in this aspect, two leaf springs comprising a 14-1 fixing portion and an extending portion 14-2 are connected and integrated by a connecting portion 14-3. The fixed portions 14-1 of the leaf springs connected and integrated in this way are attached to the heat receiving plate 3 by rivets 15, for example. Although the heat receiving plate has a thin plate shape, its rigidity is reinforced by a connected and integrated leaf spring.

  It should be noted that the two leaf springs are not connected and integrated by the connecting portion, but separate leaf springs are attached to both sides of the heat receiving plate as shown in FIG. 8, and further, as shown in FIG. The rigidity of the heat receiving plate may be reinforced by bending the fixing portion of the spring and sandwiching and fixing the thin heat receiving plate with a rivet as indicated by reference numeral 16.

  FIG. 10 is a view for explaining another heat receiving plate to which a leaf spring is attached. In the embodiment shown in FIG. 10, the reinforcing material is also attached to the surface of the heat receiving plate on the side where the heat pipe is thermally connected. As described with reference to FIG. 8, the heat receiving plate 3 is formed with a reinforcing structure portion 3-1 by bending both sides thereof, and the element contact where the thin central portion is thermally connected to the protruding surface of the semiconductor element. Surface 11 is formed. A leaf spring composed of a fixing portion 14-1 and an extending portion 14-2 is attached to both side portions of the heat receiving plate 3 formed in this way via another reinforcing member 17 by, for example, rivets 15. Since the leaf spring is thinner than a normal spring or the like, the heat receiving member mounting structure can be thinned even if another reinforcing material described above is used. As shown in FIG. 10A, a heat pipe is thermally connected between two leaf springs.

  FIG. 11 is a diagram for explaining another heat receiving plate to which a leaf spring is attached. In the embodiment shown in FIG. 11, as described with reference to FIG. 10, the reinforcing material is also attached to the surface of the heat receiving plate where the heat pipe is thermally connected. That is, the heat receiving plate 3 forms a reinforcing structure portion 3-1 by bending both sides thereof, and a thin central portion forms an element contact surface 11 that is thermally connected to the protruding surface of the semiconductor element. A leaf spring composed of a fixing portion 14-1 and an extending portion 14-2 is attached to both side portions of the heat receiving plate 3 formed in this way via another reinforcing member 17 by, for example, rivets 15. In this aspect, a reinforcing material is further attached between the heat pipes, and the rigidity of the heat receiving plate is further reinforced. That is, as shown in FIG. 11 (c), the reinforcing material 18 is provided between the two heat pipes 10.

A conical spring may be used as the spring. The conical spring can be thinned until it is entirely located on the same plane.
The reinforcing material may be made of a material different from that of the heat receiving plate, if necessary. For example, a steel material obtained by nickel-plating a copper heat receiving plate can be used as a reinforcing material.

  As described above, according to the heat receiving member mounting structure of the present invention, the reinforcing structure portion of the separate member is provided in the peripheral portion of the thin heat receiving plate, so when the heat receiving plate and the substrate are fixed by the fixing member, The protruding surfaces can be connected with a small thermal resistance, and the heat receiving member and the heat sink can be thinned.

FIG. 1 is a schematic cross-sectional view illustrating a heat receiving member mounting structure according to the present invention. FIG. 2A is a schematic cross-sectional view illustrating a heat receiving member mounting structure according to another embodiment of the present invention. FIG.2 (b) is the top view and sectional drawing of a heat receiving plate provided with the reinforcement structure part. FIG. 3 is a diagram illustrating another embodiment of the heat receiving plate. Fig.3 (a) is the top view and side view of a heat receiving plate which formed the recessed part by press work. FIG. 3B is a plan view and a side view of the heat receiving plate in which the side portions of the heat receiving plate shown in FIG. FIG. 4 is a diagram illustrating another embodiment of the heat receiving plate. FIG. 4A is a plan view of an octagonal heat receiving plate. FIG. 4B is a plan view of the heat receiving plate in which the side portions of the heat receiving plate shown in FIG. FIG. 5 is a diagram illustrating another embodiment of the heat receiving plate. Fig.5 (a) is the top view and side view of a heat-receiving plate thicker than another aspect. FIG. 5B is a plan view and a side view of the heat receiving plate in which a groove portion is formed by cutting or forging the central portion of the heat receiving plate shown in FIG. FIG. 6 is a diagram illustrating another embodiment of the heat receiving plate. FIG. 6A is a plan view of the heat receiving plate. FIG. 6B is a plan view of the heat receiving plate formed by folding and overlapping the radially extending portions of the heat receiving plate shown in FIG. FIG. 7 is a schematic cross-sectional view illustrating a heat receiving member mounting structure according to another aspect of the present invention. FIG. 8 is a view for explaining a heat receiving plate to which a leaf spring is attached. 8A is a plan view and FIG. 8B is a cross-sectional view. FIG. 9 is a view for explaining a heat receiving plate to which a leaf spring is attached. FIG. 9A is a plan view, and FIG. 9B is a cross-sectional view. FIG. 10 is a view for explaining another heat receiving plate to which a leaf spring is attached. FIG. 11 is a diagram for explaining another heat receiving plate to which a leaf spring is attached. FIG. 12 is a schematic diagram for explaining a conventional heat sink.

Explanation of symbols

1 Heat receiving member mounting structure 2 Board (motherboard)
3 Heat receiving plate 4 Reinforcement structure 5 Small substrate 6 Semiconductor element 7 Fixing member 8 Screw 9 Spring 10 Heat pipe 11 Element contact surface 12 Hole 13 Extension part 14 Leaf spring 15 Rivet 16 Reinforcement 17 Reinforcement 18 Reinforcement

Claims (13)

A substrate,
A semiconductor element mounted on the substrate and protruding from the substrate;
One surface is thermally connected to the projecting surface of the semiconductor element projecting from the substrate, the other surface is thermally connected to a heat pipe, and a heat receiving unit is provided with a reinforcing structure around the projecting surface. Plates,
A heat receiving member mounting structure comprising: a fixing member that fixes the substrate and the heat receiving plate in a state where the protruding surface and the heat receiving plate are thermally connected by an elastic force.   2. The heat receiving member mounting structure according to claim 1, wherein the reinforcing structure portion is formed by bending and overlapping a peripheral portion of the heat receiving plate.   The heat receiving member mounting structure according to claim 2, wherein a peripheral portion of the heat receiving plate is bent toward the semiconductor element.   The heat receiving member mounting structure according to claim 2, wherein the heat receiving plate is pressed to form a recess corresponding to the protruding surface, and the heat receiving plate is bent toward the recess.   2. The heat receiving member mounting structure according to claim 1, wherein the reinforcing structure portion of the heat receiving plate is formed by overlapping the heat receiving plate by bending a peripheral portion of a polygonal plate toward the semiconductor element.   The heat receiving plate includes a rectangular element contact portion corresponding to the projecting surface and extending portions extending radially from each corner of the element contact portion, and the reinforcing structure portion folds and extends the extending portion. The heat receiving member attachment structure according to claim 1, wherein the heat receiving member attachment structure is formed.   The heat receiving member mounting structure according to claim 1, wherein the reinforcing structure portion is formed of another material different from the heat receiving plate and is attached to the heat receiving plate.   The heat receiving member mounting structure according to claim 1, wherein a groove portion is formed by cutting or forging at a position corresponding to the protruding surface of the heat receiving plate, and a peripheral portion of the groove portion forms the reinforcing structure portion.   The heat receiving member mounting structure according to any one of claims 1 to 8, wherein the fixing member includes a screw and a spring, and the heat receiving plate is screwed to the substrate via the spring.   The spring includes a plurality of leaf springs each having a fixing portion and an extending portion, and each of the fixing portions is fixed to the heat receiving plate and is screwed through each of the extending portions. The heat receiving member mounting structure according to the description.   The spring is composed of a single member that connects the fixing portions of a plurality of leaf springs each having a fixing portion and an extending portion, and the fixing portions are respectively fixed to the heat receiving plate and screwed through the extending portion. The heat-receiving member attachment structure according to claim 9.   The heat receiving member mounting structure according to claim 10 or 11, further comprising a reinforcing member on a side on which the leaf spring is mounted.   The heat receiving member mounting structure according to any one of claims 1 to 12, wherein the heat pipe includes a plurality of heat pipes, and another reinforcing member is provided between the heat pipes.

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