JP2008085135A - Mounting structure body, electrooptical device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting structure body capable of restricting the enlargement of a resin member toward a circumference and securing electric reliability even in high-density mounting of an electronic component, and to provide an electrooptical device using the mounting structure body, and an electronic apparatus using the electrooptical device. <P>SOLUTION: A flexible substrate 3 includes through-holes 32 as flow passages for the resin member 31, which are arranged at the outer side of the mounting region C of an IC26 for a power source and attains communication from a mounting side surface 23a to the opposite side surface 23b. The through-holes 32 respectively include storage parts 33 for the resin member 31, which are arranged at the opposite side of the mounting side surface 23a and have a diameter larger than that of a mounting side inner diameter D. Consequently, the resin member 31 flowing out from the mounting region C is guided to the opposite side with the use of the through-holes 32 for storage. A liquid crystal device 1 is constituted to sufficiently store the resin member 31 and prevent it from flowing into the external side of the mounting region C so that the electronic component, etc., can be mounted with high-density. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a mounting structure used for a personal computer or a mobile phone, an electro-optical device using the mounting structure, and an electronic apparatus using the electro-optical device.

  Conventionally, there is an electro-optical device such as a liquid crystal device as a display device of an electronic device such as a personal computer or a cellular phone, and a semiconductor IC chip is mounted on the liquid crystal device or the like by, for example, a flip chip mounting method.

  However, for example, when a semiconductor IC chip is bonded and fixed to a printed circuit board or the like using an adhesive resin, the adhesive resin is spread and adheres to an adjacent wiring pattern or the like. There was a problem that it would occur.

In view of this, it has been proposed that a printed wiring board for mounting a semiconductor chip has a groove formed in a portion for mounting the semiconductor chip into which a resin for mounting the semiconductor chip is poured ( For example, see Patent Document 1.)
JP 2000-183237 (paragraph [0008], FIG. 1).

  However, although the resin flowing out to the outside of the semiconductor chip can be regulated to some extent by the above-described method, the step of forming the groove is required, and the manufacturing cost cannot be reduced. There was a problem that there was a limit to the amount that could be accommodated, and if it leaked more than that, it could no longer be regulated. Further, the through hole is also prevented from flowing out to the back surface of the printed wiring board, and its own resin capacity is limited.

  The present invention has been made in view of the above-described problems. A mounting structure that restricts the spread of a resin member to the surroundings and can ensure electrical reliability even in high-density mounting of electronic components, and the mounting structure. It is an object to provide an electro-optical device used and an electronic apparatus using the electro-optical device.

  In order to achieve the above object, a mounting structure according to a main aspect of the present invention is a mounting structure in which a first bonded member and a second bonded member are connected via a resin member. The first adherend member has a flow path of the resin member that communicates from the connection side surface to the opposite side surface outside the region to which the second adherend member is connected. It has the accommodating part of the said resin member larger in diameter than the said connection side internal diameter on the opposite side, It is characterized by the above-mentioned.

  Here, the “first adherend member” is, for example, a glass substrate or a circuit board of a liquid crystal panel, and the “second adherend member” is, for example, an electronic component such as a semiconductor device. is there.

  In the present invention, the first adherend member has a flow path of the resin member that communicates from the connection side surface to the opposite side surface outside the region to which the second adherend member is connected. The housing portion for the resin member having a diameter larger than the inner diameter of the connection side is provided on the side opposite to the side surface. Therefore, the resin member that has flowed out of the connection region can be guided to the opposite side by the flow path, and the resin member can be sufficiently accommodated on the opposite side, so that the resin member flows out of the connection region. It is possible to regulate and mount electronic parts and the like with higher density.

  According to an aspect of the present invention, a plurality of the flow paths are formed around the second bonded member. Accordingly, the resin member can be prevented from spreading around the entire periphery of the second adherend member, and other electronic components can be mounted at a higher density around the second adherend member. Further, more resin members can be accommodated in the opposite accommodation portion by the plurality of flow paths, and the spread of the resin member on the connection side surface can be reliably regulated.

  According to an aspect of the present invention, the flow path is a through hole, and is formed obliquely so as to be separated from the second bonded member from the connection side surface toward the opposite side surface. And As a result, since the flow path is formed in the direction of the flow of the resin member that tries to spread from the connection region to the outside, it is easy to flow into the flow path, and the resin member on the connection side surface is more quickly guided to the opposite side. Even if the amount of flow out of the connection side surface temporarily increases, it is possible to cope with it. In addition, since the through holes are formed obliquely, the opening area on the flow-in side can be increased, the flow of the resin member can be increased correspondingly, and other electronic components on the connection side surface can be mounted at high density. .

  According to an embodiment of the present invention, the first adherend is formed on the outside of the connection region so that the first adherend becomes deeper and the lateral width becomes narrower as the distance from the second adherend is increased. 1 channel, and the channel is formed at the bottom of the first groove that is farthest from the second bonded member side. Thereby, more resin members that flow on the connection side surface can be collected in the flow path and accommodated in the accommodation portion on the opposite side, and the spread of the resin member outside the connection region can be more restricted.

  According to an aspect of the present invention, the accommodating portion is formed so that an inner diameter of the flow path increases toward the opposite side surface. Thereby, many resin members can be accommodated in the said accommodating part, and the expansion of the said resin member in a connection side surface can be controlled.

  According to an aspect of the present invention, the accommodating portion is formed by a second groove that connects a plurality of openings exposed on the opposite side surface by the flow path. As a result, the resin member can be prevented from spreading outside the second groove on the opposite side surface, and high-density mounting of other electronic components and the like can be performed not only on the connection side surface but also on the opposite side surface.

  According to an aspect of the present invention, the accommodating portion is a recess formed on the opposite side surface so as to include a plurality of openings exposed on the opposite side surface by the flow path. Accordingly, a larger amount of the resin member can be accommodated on the opposite side, the spread of the resin member on the connection side surface can be further reduced, and further high-density mounting is possible.

  According to an aspect of the present invention, the first bonded member has a laminated structure, and the concave portion is an opening provided in an outermost layer that is at least the opposite side surface of the laminated structure. It is characterized by being. Thereby, manufacture of the said accommodating part can be made easy and manufacturing cost can be reduced.

  An electro-optical device according to another aspect of the present invention includes an electro-optical panel, a flexible circuit board connected to the electro-optical panel, and an electronic component mounted on the flexible circuit board via a resin member The flexible circuit board includes a flow path of the resin member that communicates from the mounting side surface to the opposite side surface outside the region where the electronic component is mounted. The path has a housing part for the resin member having a diameter larger than the inner diameter on the mounting side on the opposite side.

  In the present invention, a flexible circuit board connected to an electro-optical panel has a flow path of a resin member that communicates from the mounting side surface to the opposite side surface outside the area where the electronic component is mounted. The housing part for the resin member having a diameter larger than the inner diameter on the mounting side is provided on the opposite side of the mounting side surface. Therefore, the resin member that has flowed out of the mounting area can be guided to the opposite side by the flow path, and the resin member can be sufficiently accommodated on the opposite side, so that the resin member flows out of the mounting area. It is possible to provide an electro-optical device that is regulated and capable of mounting electronic components or the like with higher density.

  According to an aspect of the present invention, a plurality of the flow paths are formed around the electronic component. Accordingly, the resin member can be prevented from spreading around the entire periphery of the electronic component, and other electronic components can be mounted at a higher density around the electronic component. In addition, more resin members can be accommodated in the opposite accommodation portion through the plurality of flow paths, and the spread of the resin member on the mounting side surface can be reliably regulated.

  According to an aspect of the present invention, the flow path is a through hole, and is formed obliquely so as to be separated from the electronic component from the mounting side surface toward the opposite side surface. As a result, the flow path is formed in the direction of the flow of the resin member that tends to spread from the mounting area to the outside, so that it is easy to flow into the flow path, and the resin member on the mounting side surface is more quickly guided to the opposite side. Even if the amount of flow out of the mounting side temporarily increases, it can cope with it. In addition, since the through-holes are formed diagonally, the opening area on the flow-in side can be increased, and the flow of resin material can be increased correspondingly, and other electronic components on the mounting side can be mounted at high density. it can.

  According to an aspect of the present invention, the accommodating portion is formed so that an inner diameter of the flow path increases toward the opposite side surface. Thereby, many resin members can be accommodated in the said accommodating part, and the breadth of the said resin member in a mounting side surface can be controlled.

  According to an aspect of the present invention, the accommodating portion is formed by a groove that connects a plurality of openings exposed on the opposite side surface by the flow path. Accordingly, the resin member can be prevented from spreading outside the groove on the opposite side surface, and high-density mounting of other electronic components and the like can be performed not only on the mounting side surface but also on the opposite side surface.

  According to an aspect of the present invention, the accommodating portion is a recess formed on the opposite side surface so as to include a plurality of openings exposed on the opposite side surface by the flow path. As a result, more resin members can be accommodated in the recesses, the spread of the resin members on the mounting side surface can be further reduced, and further high-density mounting is possible.

  An electronic apparatus according to another aspect of the invention includes the above-described electro-optical device.

  Since the present invention includes an electro-optical device that regulates the spread of the resin member to the surroundings and can ensure electrical reliability even in high-density mounting of electronic components, the electronic device has high functionality, downsizing, and thinning. It is possible to improve the electrical reliability while attempting.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description of the embodiments, a TFT (Thin Film Transistor) active matrix type liquid crystal device and an electronic apparatus using the liquid crystal device will be described as examples of the mounting structure and the electro-optical device. It is not limited. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure and the scale and number of each structure are different.

  (First embodiment)

  1 is a schematic perspective view of a liquid crystal device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1 (a driver IC and a power supply IC are not cut), and FIG. FIG. 1 is a partial bottom view of a flexible substrate, and FIG. 4 is a sectional view taken along line B-B in FIG. 1 (the power supply IC is not cut).

  (Configuration of liquid crystal device)

  For example, as shown in FIG. 1, the liquid crystal device 1 includes a liquid crystal panel 2 as an electro-optical panel, a flexible substrate 3 as a flexible circuit board connected to the liquid crystal panel 2, and the like. Here, in addition to the flexible substrate 3, an illumination device such as a backlight and other incidental mechanisms are attached to the liquid crystal device 1 as necessary (not shown).

  As shown in FIGS. 1 and 2, the liquid crystal panel 2 is a TN (Twisted Nematic) type sealed in a gap between the first substrate 5 and the second substrate 6 and the two substrates bonded together via a sealing material 4. The liquid crystal 7 is included.

  The first and second substrates 5 and 6 have a first base material 5a and a second base material 6a made of a light-transmitting plate member such as glass, for example, as shown in FIG. Polarizing plates 8 and 9 for polarizing incident light are attached to the outside of the second base materials 5a and 6a, respectively.

  In addition, the first substrate 5a has a plurality of source wirings 10 formed in parallel in the Y-axis direction as shown in FIGS. 1 and 2, for example, on the inner side (liquid crystal side), and a plurality of gate wirings in the X-axis direction. 11 are formed in parallel, and an alignment film 12 is formed on the liquid crystal side of the source wiring 10 and the gate wiring 11. The source wiring 10 and the gate wiring 11 are made of nickel or the like, for example, and are electrically connected to a TFT (not shown). The TFT is electrically connected to the pixel electrode 13 made of ITO (indium tin oxide) or the like.

  That is, one end of the source wiring 10 is electrically connected to a source electrode (not shown) of the TFT, and the other end is electrically connected to an output connection terminal 14 described later. Further, one end of the gate wiring 11 is electrically connected to a gate electrode (not shown) of the TFT, and the other end is electrically connected to an output connection terminal 14 to be described later.

  As a result, the source wiring 10 and the gate wiring 11 apply a data signal from the source electrode (not shown) to the pixel electrode 13 when a voltage is applied to the gate electrode, and the pixel electrode 13 is sandwiched between the common electrode described later. A voltage is applied to the liquid crystal 7.

  Further, the first base material 5a has, for example, a projecting portion 15 projecting from the outer peripheral edge of the second base material 6a as shown in FIGS. 1 and 2, and the projecting portion 15 includes a driver for driving a liquid crystal. IC16 is mounted. The source wiring 10 and the gate wiring 11 extend from the region surrounded by the seal material 4 to the overhanging portion 15 and are electrically connected to the output connection terminals 14 provided in parallel in the mounting region of the driver IC 16. Has been.

  Further, the overhanging portion 15 has an input wiring 17 for supplying current from the flexible substrate 3 or the like to the driver IC or the like as shown in FIG. 2, for example, and the input wiring 17 has one end of the flexible substrate 3 described later. It is formed as an external connection terminal 18 electrically connected to the wiring pattern, and the other end is electrically connected to an input connection terminal 19 arranged in parallel in the mounting area of the driver IC 16.

  The driver IC 16 has, for example, a plurality of bumps 20 arranged in parallel on the mounting surface to be mounted on the overhanging portion 15 as shown in FIG. 2, and the output connection terminal 14 and the input via the ACF (Anisotropic Conductive Film) (not shown), for example. The electrical connection terminal 19 is electrically connected. The bump 20 is formed in a substantially rectangular parallelepiped, for example, from nickel (Ni), copper (Cu), gold (Au), or the like.

  On the other hand, as shown in FIG. 2, for example, the second substrate 6a has a common electrode 21 formed on the inner side (liquid crystal side), and the common electrode 21 has an alignment film 22 formed on the liquid crystal side.

  Although not shown, a base layer, a reflective layer, a colored layer, a light shielding layer, and the like are formed on the liquid crystal side of the first and second substrates 5a and 6a as necessary.

  Next, the flexible substrate 3 is electrically connected to the wiring patterns 24 and 25 formed of copper (Cu) or the like on the base substrate 23 and the wiring patterns 24 and 25, for example, as shown in FIGS. A power IC 26 as an electronic component is formed and mounted.

  Here, the base substrate 23 is a flexible film-like member, and is formed by laminating a plurality of thin films, for example. Further, for example, as shown in FIGS. 1 and 2, the wiring pattern 24 has one end electrically connected to a connection terminal 27 electrically connected to the external connection terminal 18 of the overhang portion, and the other end is connected. It is formed as an output connection terminal 28 arranged in parallel in the mounting area C (C in FIGS. 3 and 4) of the power supply IC 26. The connection terminal 27 is provided on the side surface 23b opposite to the mounting side surface 23a on which the power supply IC 26 is mounted, and is electrically connected to the wiring pattern 24 on the mounting side surface through a through hole (not shown).

  As shown in FIGS. 1 and 2, for example, one end of the wiring pattern 25 is formed as an input connection terminal 29 arranged in parallel with the mounting region C of the power supply IC 26, and the other end is used for a connector (not shown), for example. It is formed as a connection terminal.

  The power supply IC 26 supplies, for example, a predetermined current to the driver IC 16, and has a plurality of parallel solder balls 30 electrically connected to the output connection terminal 28 and the input connection terminal 29 on the mounting side surface. The solder ball 30 is formed in a substantially spherical shape, for example. Further, the power supply IC 26 is mounted on the base substrate 23 by the resin member 31 so that the solder ball 30 is electrically connected to the output connection terminal 28 and the input connection terminal 29.

  On the other hand, as shown in FIGS. 3 and 4, for example, the base substrate 23 is formed with a through hole 32 that penetrates from the mounting side surface 23 a to the opposite side surface 23 b as a plurality of flow paths so as to surround the power supply IC 26. . The through-hole 32 has a housing portion 33 formed of a space formed so that the inner diameter D (D in FIG. 3) of the through-hole 32 increases toward the opposite side surface 23b on the side opposite to the mounting side surface 23a. After the power supply IC 26 is mounted, the resin member 31 flowing from the mounting side surface is accommodated and held in the accommodating portion. Here, the inner diameter of the through hole 32 is, for example, about 0.1 mm.

  The number of the through holes 32 is adjusted according to the amount of outflow from the mounting region C of the resin member 31, or at the same time, the internal space of the housing portion 33 is increased or decreased so that the resin member on the mounting side surface The spread area E (E in FIG. 4) can be adjusted to an optimum state, and other electronic components 34 can be arranged closer to each other as shown in FIG. 4, for example.

  (Manufacturing method of liquid crystal device)

  Next, a method for manufacturing the liquid crystal device 1 configured as described above will be described focusing on mounting of a power supply IC.

  FIG. 5 is an explanatory diagram for explaining a mounting process of the power supply IC.

  For example, a TFT, a source wiring 10, a gate wiring 11, a pixel electrode 13 and the like are formed on the liquid crystal side of the first base material 5a, an alignment film 12 is formed on the liquid crystal side, and a rubbing process is performed. Manufacturing. Further, if necessary, a base layer, a reflective film, a colored layer, etc. are formed on the liquid crystal side of the second substrate 6a, a common electrode 21 is formed on the liquid crystal side, and an alignment film 22 is further formed on the rubbing surface. Processing is performed to manufacture the second substrate 6.

  Then, the gap material 35 is sprayed on the second substrate by dry spraying or the like, and the first substrate 5 and the second substrate 6 are bonded together via the seal material 4. Thereafter, the liquid crystal 7 is injected into the sealing material 4 from an injection port (not shown), and the injection port of the sealing material 4 is sealed with a sealing material such as an ultraviolet curable resin to enclose the liquid crystal 7.

  Further, the driver IC 16 is pressed against the output connection terminal 14 and the input connection terminal 19 with a predetermined pressure through an ACF, for example, with a pressure head (not shown), heated to about 300 ° C., and then bonded to the first substrate 5. Then, the liquid crystal panel 2 is completed by sticking the polarizing plates 8 and 9 to the outer surfaces of the first and second substrates 5 and 6.

  Next, for example, the base substrate 23 is formed by laminating a plurality of film-like thin films, and the wiring patterns 24 and 25 are formed thereon together with the output connection terminals 28, the input connection terminals 29, and the like.

  Then, for example, as shown in FIG. 5A, the solder ball 30 formed with the power supply IC 26 on the mounting surface is aligned with the output connection terminal 28 or the input connection terminal 29 on the base substrate 23 and mounted. To do.

  Thereafter, as shown in FIG. 5B, for example, a resin member (underfill agent) 31, for example, a one-component thermosetting epoxy resin is injected from one of the gaps between the power supply IC 26 and the base substrate 23, and the capillary tube Due to the phenomenon, the entire gap between the package of the power supply IC 26 and the base substrate 23 is infiltrated. At this time, as shown in FIG. 5B, a part of the resin member 31 flows out from the mounting region C. However, as shown in FIG. 4, there are a plurality of through holes 32 as flow paths of the resin member 31 in the mounting region. Since it is formed so as to surround the periphery, the resin member 31 flows into the through hole 32 from the mounting side surface 23a.

  As a result, even when the resin member 31 completely penetrates into the gap between the power supply IC 26 and the base substrate 23, for example, as shown in FIGS. It remains in the spreading region E having the through hole 32 as a substantially outer periphery. That is, all of the excess resin member 31 flows into the through-hole 32 and is held in the trumpet-shaped accommodation portion 33 provided on the opposite side, and can be prevented from spreading beyond the spreading region E.

  Further, when the thermosetting is finally completed, the resin member 31 remains in the widened area E having a plurality of through holes 32 as a substantially outer periphery as shown in FIGS. It will be accommodated to the extent that it is almost full. Of course, the resin member does not need to be fully accommodated in the through hole 32. In short, it is only necessary that the resin member be accommodated in the widened area E having the plurality of through holes 32 as a substantially outer periphery on the mounting side surface 23a.

  Then, the connection terminal 27 of the wiring pattern 24 of the flexible substrate 3 is electrically connected to the external connection terminal 18 of the liquid crystal panel 2 through, for example, an ACF.

  Finally, a lighting device such as a backlight is attached as necessary, and the liquid crystal device 1 is completed.

  Above, description of the manufacturing method of the liquid crystal device 1 is complete | finished.

  As described above, according to the present embodiment, the flexible substrate 3 has the through hole 32 as the flow path of the resin member 31 communicating from the mounting side surface 23a to the opposite side surface 23b outside the mounting region C of the power supply IC 26. The through-hole 32 has an accommodating portion 33 for the resin member 31 having a diameter larger than the mounting-side inner diameter D on the opposite side of the mounting side surface 23a. Therefore, the resin member 31 that has flowed out of the mounting region C can be guided to the opposite side by the through hole 32, and the resin member 31 can be sufficiently accommodated on the opposite side, and the resin member 31 outside the mounting region C can be accommodated. It is possible to provide the liquid crystal device 1 that regulates the outflow of the resin member 31 and can mount electronic components or the like with higher density.

  Further, since a plurality of the through holes 32 are formed around the electronic component, for example, the power supply IC 26, the resin member 31 can be prevented from spreading around the power supply IC 26. Other electronic components can be mounted at higher density around. In addition, more resin members 31 can be accommodated in the accommodation portion 33 on the opposite side by the plurality of through holes 32, and the spread of the resin member 31 on the mounting side surface 23a can be reliably controlled.

  Further, since the accommodating portion 33 is formed so that the inner diameter D of the through hole 32 increases toward the opposite side surface 23b, more resin members 31 can be accommodated in the accommodating portion, and the resin on the mounting side surface 23a can be accommodated. The spread of the member 31 can be prevented and the electrical reliability of the liquid crystal device 1 can be improved.

  Further, the shape in which the inner diameter is formed larger toward the side opposite to the mounting side surface 23a of the through-hole 32 easily flows when the resin member 31 flows to the opposite side, but the resin member 31 that has flowed into one end enters the mounting side surface 23a. If you try to return, you will work in the direction of obstructing the flow. Thereby, the spread of the resin member 31 on the mounting side surface can be reduced more reliably.

  (Modification 1)

  Next, a first modification of the liquid crystal device according to the present invention will be described. In this modification, since the shape of the accommodating part provided in the flexible substrate is different from that of the first embodiment, this point will be mainly described. In the following description, the same components as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and the description thereof is omitted or simplified. Further, since the manufacturing method of the liquid crystal device is substantially the same as that of the first embodiment, the description thereof is omitted.

  6 is a schematic cross-sectional view of the vicinity of the mounting of the power supply IC of the liquid crystal device according to Modification 1 of the present invention, and FIG. 7 is a bottom view of the flexible substrate in the vicinity of the power supply IC.

  For example, each through-hole 32 has a groove 142 having a substantially rectangular cross section formed so as to connect the opening 141 exposed on the opposite side surface 23b as shown in FIGS.

  For example, as shown in FIG. 6, the groove 142 has a diameter larger than the mounting side inner diameter D of the through-hole 32 as a flow path, and the lateral width F of the cross-sectional space (F in FIG. 6 is the X-axis direction) is F> D. Further, the depth G (G in FIG. 6) from the opposite side surface 23 b of the cross-sectional space is formed such that the resin member 31 does not overflow from the groove 142 due to the inflow amount of the resin member 31.

  Further, as shown in FIG. 7, the groove 142 is formed in a substantially frame shape so as to connect the openings 141 on the opposite side surface 23b, and between the inside of the through hole 32 and the outer inner wall 142a and the inner inner wall 142b of the groove 142. The resin member 31 is accommodated and held.

  As described above, according to the present modification, the accommodating portion is formed by the groove 142 that connects the plurality of openings 141 exposed on the opposite side surface 32b by the through-hole 32 as the flow path. Accordingly, it is possible to prevent the resin member 31 from spreading outside the groove 142 (specifically, outside the outer inner wall 142a of the groove 142) on the opposite side surface 23b, and not only on the mounting side surface 23a but also on the opposite side surface 23b. High-density mounting of electronic components and the like is possible.

  (Modification 2)

  Next, a second modification of the liquid crystal device according to the present invention will be described. In this modification, since the accommodating part provided in the flexible substrate is a recessed part from 1st Embodiment and the modification 1, it demonstrates centering on the point.

  FIG. 8 is a schematic cross-sectional view of the vicinity of the mounting of the power supply IC of the liquid crystal device according to Modification 2 of the present invention, and FIG. 9 is a bottom view of the flexible substrate near the power supply IC.

  For example, the flexible substrate 3 has a laminated structure in which a plurality of thin films are laminated, and a recess 251 is formed as an accommodating portion in the outermost layer 223a that is the opposite side surface 23b of the laminated structure.

  For example, as shown in FIGS. 8 and 9, the recess 251 is formed by a substantially rectangular opening 223b that penetrates only the outermost layer 223a so as to include all the openings 141 exposed on the opposite side surface 23b.

  Further, for example, as shown in FIG. 8, the recess 251 has a diameter larger than the mounting side inner diameter D of the through hole 32 as a flow path, and the lateral width H (H in FIG. 8 is the X axis direction) of the cross-sectional space H> D. Further, the depth I (I in FIG. 8) from the opposite side surface 23 b of the cross-sectional space is formed such that the resin member 31 does not overflow from the recess 251 due to the outflow amount of the resin member 31.

  Thereby, the resin member 31 is accommodated and held in the space surrounded by the through hole 32 and the inner wall 251a of the recess 251.

  The manufacturing method of the recess 251 of the flexible substrate 3 will be briefly described with respect to the manufacturing method of the liquid crystal device 1 configured as described above.

  FIG. 10 is an explanatory diagram for explaining a manufacturing process of the concave portion of the flexible substrate.

  For example, among the plurality of film-shaped thin films constituting the base substrate 23, a plurality of through holes 32 are formed in the outermost layer 223 a constituting the opposite side surface 23 b as shown in FIG. An opening 223b is formed in advance so as to be included in the interior.

  Then, the remaining thin film is laminated on the outermost layer 223a to form a laminated structure and to form a recess 251. Thereafter, a through hole 32 is formed at a predetermined position in the recess 251, that is, around the power supply IC 26 to be mounted.

  As a result, a recess 251 is formed in the outermost layer 223a of the laminated structure as a housing part from which the thin film is completely removed in a substantially rectangular shape.

  As described above, according to the present modification, the recess 251 is formed so as to include a plurality of openings 141 exposed on the opposite side surface 32b of the through hole 32 as a flow path. Therefore, a large amount of the resin member 31 that has flowed into the recess 251 from the through-hole 32 can be accommodated and held on the opposite side surface 23b, and even if the resin member 31 flows out more than expected, it is possible to cope with it. That is, high-density mounting of electronic components and the like is possible while ensuring electrical reliability.

  The base substrate 23 has a laminated structure, and the recess 251 is an opening 223b provided in the outermost layer 223a which is the opposite side surface 23b of the laminated structure. Therefore, by providing the opening 223b in advance in the outermost layer 223a of the base substrate 23, it becomes very easy to manufacture the recess 251 that is the housing portion, and the manufacturing cost can be reduced.

  Furthermore, the inner wall 251a of the recess 251 can prevent the resin member 31 to be accommodated from flowing out of the inner wall 251a. The resin member 31 can be prevented from spreading on the opposite side surface 23b, and high-density mounting of electronic components can be prevented. Is possible.

  (Second Embodiment)

  Next, a second embodiment of the liquid crystal device according to the present invention will be described. In the present embodiment, since the through hole is different from the first embodiment and the modification, the description will be focused on that point. Note that the manufacturing method of the liquid crystal device is substantially the same as that of the first embodiment, and thus the description thereof is omitted.

  FIG. 11 is a schematic cross-sectional view of the vicinity of the power supply IC mounted in the liquid crystal device according to the second embodiment of the present invention.

  As shown in FIG. 11, the base substrate 23 is formed with through holes 332 penetrating from the mounting side surface 23 a to the opposite side surface 23 b as a plurality of flow paths so as to surround the power supply IC 26.

  Each through hole 332 is formed obliquely so as to be away from the power supply IC 26 from the mounting side surface 23a toward the opposite side surface 23b. Specifically, as shown in FIG. 11, the through-hole 332 is formed so that the penetration direction has an obtuse internal angle θ1 (θ1 in FIG. 11) with respect to the mounting side surface 23a.

  Further, the through hole 332 has a housing portion 333 formed of a space formed so that the inner diameter D (D in FIG. 11) of the through hole 332 increases toward the opposite side surface 23b on the side opposite to the mounting side surface 23a. After the power supply IC 26 is mounted (after the resin member 31 is applied), the resin member 31 flowing from the mounting side surface is accommodated and held in the accommodating portion.

  Further, the opening 332a on the mounting side surface 23a of the through hole 332 is formed in an elliptical shape including a circular cross section of the through hole 332 because the through direction of the through hole 332 is formed obliquely with respect to the mounting side surface 23a. Becomes larger than the circular cross section of the through-hole 332.

  Thus, according to the present embodiment, the through-hole 332 is formed obliquely so as to be away from the power supply IC 26 from the mounting side surface 23a toward the opposite side surface 23b. Therefore, since the through hole 332 as the flow path is formed in the direction of the flow of the resin member 31 that is going to spread outside from the mounting region C, the resin on the side surface of the mounting is easily flowed into the through hole 332 more quickly. The member 31 can be guided to the opposite side. Moreover, even if the amount of flow out of the mounting side surface 23a temporarily increases, it is possible to cope sufficiently. Furthermore, since the through-hole 332 is formed obliquely, the opening area on the flow-in side can be increased, and the flow of the resin member 31 can be increased accordingly. Thereby, the spread of the resin member 31 can be further reduced, and high-density mounting of other electronic components on the mounting side surface 23a becomes possible.

  (Modification 3)

  Next, a third modification of the liquid crystal device according to the present invention will be described. In the present modification, the shape of the through hole on the mounting side surface is different from those of the first and second embodiments and Modifications 1 and 2, and this point will be mainly described. Note that the manufacturing method of the liquid crystal device is substantially the same as that of the first embodiment, and thus the description thereof is omitted.

  FIG. 12 is a schematic cross-sectional view of the vicinity of the mounting of the power supply IC of the liquid crystal device according to Modification 3 of the present invention, and FIG.

  As shown in FIG. 12, the base substrate 23 is formed with through holes 32 penetrating from the mounting side surface 23a to the opposite side surface 23b as a plurality of flow paths so as to surround the power supply IC 26.

  Further, the base substrate 23 has a groove 461 as a first groove formed so that the depth from the mounting side surface becomes deeper as the distance from the power supply IC 26 increases, and the lateral width thereof becomes narrower. Openings 461b of the through holes 32 are formed on the bottom surface 461a as the bottom most distant from the power supply IC 26, respectively.

  For example, as shown in FIG. 13, the groove 461 is formed in a semicircular shape when seen in a plan view, and the depth from the mounting side surface 23a increases from zero to the depth K (the center of the opening 461b) as the distance from the power supply IC 26 increases. Depth). Further, the lateral width of the groove 461 decreases from the maximum L1 (diameter of a semicircle) to the lateral width L2 (lateral width at the center of the opening 461b) as the distance from the power supply IC 26 increases (L1> L2).

  In addition, the opening 461b at the bottom surface 461a of the through hole 32 has an elliptical shape including a circular cross section of the through hole 32 because the bottom surface 461a is formed obliquely with respect to the through direction of the through hole 32. The through hole 32 is larger than the circular cross section. Thereby, the resin member 31 is easy to flow into the through hole 32.

  As described above, according to this modification, the flexible substrate 3 as the first adherend becomes deeper as the distance from the power supply IC 26 as the second adherend increases outside the mounting region C as the connection region. The groove 461 is formed so that the lateral width is narrow, and the through hole 32 is formed on the bottom surface 461a of the groove 461 farthest from the power supply IC 26. Therefore, more resin members 31 flowing on the connection side surface can be collected in the through holes 32 and accommodated in the accommodation portion 33 on the opposite side, and the spread of the resin member 31 outside the mounting area can be more restricted.

  (Third embodiment: electronic device)

  Next, an electronic apparatus according to the third embodiment of the present invention including the above-described liquid crystal device 1 will be described.

  FIG. 14 is a schematic external view of a mobile phone according to the third embodiment of the present invention, and FIG. 15 is a schematic external view of a personal computer.

  For example, the mobile phone 500 includes, for example, the liquid crystal device 1 in an outer frame having a receiving mouth 572 and a sending mouth 573 in addition to a plurality of operation buttons 571 as shown in FIG.

  As shown in FIG. 15, the personal computer 600 includes a main body 682 having a keyboard 681 and a liquid crystal display unit 683. The liquid crystal display unit 683 includes, for example, the liquid crystal device 1 on an outer frame. Yes.

  In addition to the liquid crystal device 1, these electronic devices include various circuits such as a display information output source and a display information processing circuit, and a display signal generation unit including a power supply circuit that supplies power to these circuits, although not shown. Consists of.

  Further, for example, in the case of the personal computer 600, the liquid crystal device 1 is supplied with a display signal generated by the display signal generation unit based on information input from the keyboard 681, so that a display image is supplied to the liquid crystal device 1. Is displayed.

  According to this embodiment, since the liquid crystal device 1 that regulates the spread of the resin member to the surroundings and can ensure electrical reliability even in high-density mounting of electronic components, the electronic device has high functionality, downsizing, and It is possible to improve electrical reliability while reducing the thickness.

  In particular, portable electronic devices as described above are required to have higher electrical reliability as well as thinner and smaller devices, and the significance of the present invention that can provide such electrical reliability at low cost. Is big.

  In addition, examples of the electronic device include a touch panel equipped with a liquid crystal device, a projector, a liquid crystal television, a viewfinder type, a monitor direct view type video tape recorder, a car navigation, a pager, an electronic notebook, a calculator, and the like. And it cannot be overemphasized that the liquid crystal device 1 mentioned above is applicable as a display part of these various electronic devices, for example.

  The present invention is not limited to any of the above-described embodiments and modifications, and can be implemented with appropriate modifications within the scope of the technical idea of the present invention. Moreover, in the range which does not deviate from the summary of this invention, each embodiment mentioned above and a modification can be combined.

  For example, in the above-described embodiments, the thin film transistor element active matrix type liquid crystal device has been described as an example of the liquid crystal device. However, the present invention is not limited to this. For example, the thin film diode element active matrix type or passive matrix type liquid crystal device may be used. Also good. As a result, a wide variety of liquid crystal devices can be reduced in thickness and size at a low cost, and higher electrical reliability can be achieved.

  Further, in the above description, the power supply IC 26 mounted on a flexible substrate has been described as an example of the second adherend member or electronic component. However, the present invention is not limited to this. For example, the power supply IC 26 is mounted on the glass substrate of the liquid crystal panel 2. The liquid crystal driving driver IC 16 may also be formed with a flow path around it and a resin member housing portion formed on the back side of the substrate. As a result, a wider variety of liquid crystal devices can be mounted at a high density, and can be reduced in thickness and size at a low cost, and higher electrical reliability can be achieved.

  In the above description, the housing portion for the resin member 31 is formed on the side opposite to the mounting side surface. However, the present invention is not limited to this. For example, a space may be provided inside the substrate to serve as the housing portion. As a result, a wider variety of liquid crystal devices can be mounted at a high density, and can be reduced in thickness and size at a low cost, and higher electrical reliability can be achieved.

1 is a schematic perspective view of a liquid crystal device according to a first embodiment. It is the sectional view on the AA line of FIG. 1 (driver IC etc. are not cut | disconnected). FIG. 2 is a cross-sectional view taken along the line BB in FIG. 1 (the power supply IC is not cut). It is a partial bottom view of the flexible substrate concerning a 1st embodiment. It is explanatory drawing of the mounting process of power supply IC which concerns on 1st Embodiment. 10 is a schematic cross-sectional view of the vicinity of mounting of a power supply IC of a liquid crystal device according to Modification 1. FIG. 10 is a bottom view of a flexible substrate in the vicinity of a power supply IC according to Modification 1. FIG. 12 is a schematic cross-sectional view of the vicinity of mounting of a power supply IC of a liquid crystal device according to Modification 2. FIG. 10 is a bottom view of a flexible substrate in the vicinity of a power supply IC according to Modification 2. FIG. 10 is an explanatory diagram of a manufacturing process of a concave portion of a flexible substrate according to Modification 2. FIG. It is a schematic sectional drawing of power supply IC vicinity of the liquid crystal device which concerns on 2nd Embodiment. 12 is a schematic cross-sectional view of the vicinity of mounting of a power supply IC of a liquid crystal device according to Modification 3. FIG. It is a schematic enlarged view of the mounting side surface of the through-hole which concerns on the modification 3. It is the external appearance schematic of the mobile telephone which concerns on 3rd Embodiment. FIG. 10 is a schematic external view of a personal computer according to a third embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Liquid crystal device, 2 Liquid crystal panel, 3 Flexible board, 4 Sealing material, 5 1st board | substrate, 6 2nd board | substrate, 7 Liquid crystal, 8, 9 Polarizing plate, 10 Source wiring, 11 Gate wiring, 12, 22 Orientation film , 13 pixel electrode, 14, 28 output connection terminal, 15 overhang, 16 driver IC, 17 input wiring, 18 external connection terminal, 19, 29 input connection terminal, 20 bump, 21 common electrode, 23 base base Material, 24, 25 Wiring pattern, 26 Power supply IC, 27 Connection terminal, 30 Solder ball, 31 Resin member, 32,332 Through hole, 33,333 Housing part, 34 Electronic component, 35 Gap material, 141, 332a, 461b Opening, 142,461 groove, 223a outermost layer, 223b opening, 25 DESCRIPTION OF SYMBOLS 1 Recessed part, 251a Inner wall, 461a Bottom face, 500 Mobile phone, 571 Operation button, 572 Earpiece, 573 Mouthpiece, 600 Personal computer, 681 Keyboard, 682 Main part, 683 Liquid crystal display unit, C mounting area, E Spreading area

Claims (15)

In the mounting structure in which the first adherend member and the second adherend member are connected via the resin member,
The first bonded member has a flow path of the resin member that communicates from the connection side surface to the opposite side surface outside the region to which the second bonded member is connected,
The mounting structure according to claim 1, wherein the flow path includes a housing portion for the resin member having a diameter larger than the connection-side inner diameter on the opposite side.   The mounting structure according to claim 1, wherein a plurality of the flow paths are formed around the second bonded member.   The said flow path is a through-hole, and is formed diagonally so that it may leave | separate from the said 2nd to-be-adhered member toward the said opposite side surface from the said connection side surface. The mounting structure described. The first adherend member has a first groove formed outside the connection region so as to become deeper as the distance from the second adherend member side increases and the lateral width becomes narrower.
The said flow path is formed in the bottom most distant from the said 2nd to-be-adhered member side of the said 1st groove | channel, The Claim 1 characterized by the above-mentioned. Mounting structure.   The mounting structure according to any one of claims 1 to 4, wherein the housing portion is formed so that an inner diameter of the flow path increases toward the opposite side surface. .   5. The mounting according to claim 1, wherein the housing portion is formed by a second groove that connects a plurality of openings exposed on the opposite side surface by the flow path. Structure.   The said accommodating part is a recessed part formed in the said opposite side surface so that multiple opening exposed to the said opposite side surface by the said flow path may be included, The Claim 1 characterized by the above-mentioned. The mounting structure described. The first bonded member has a laminated structure,
The mounting structure according to claim 7, wherein the recess is an opening provided in an outermost layer that is at least the opposite side surface of the stacked structure. An electro-optical device comprising: an electro-optical panel; a flexible circuit board connected to the electro-optical panel; and an electronic component mounted on the flexible circuit board via a resin member,
The flexible circuit board has a flow path of the resin member that communicates from the mounting side surface to the opposite side surface outside the region where the electronic component is mounted,
2. The electro-optical device according to claim 1, wherein the flow path includes a housing portion for the resin member having a diameter larger than the mounting-side inner diameter on the opposite side.   The electro-optical device according to claim 9, wherein a plurality of the flow paths are formed around the electronic component.   11. The electro-optic according to claim 9, wherein the flow path is a through hole, and is formed obliquely so as to be separated from the electronic component from the mounting side surface toward the opposite side surface. apparatus.   The electro-optical device according to claim 9, wherein the accommodating portion is formed so that an inner diameter of the flow path increases toward the opposite side surface. .   12. The electro-optical device according to claim 9, wherein the housing portion is formed by a groove that connects openings exposed on the opposite side surface by the flow path. .   The said accommodating part is a recessed part formed in the said opposite side surface so that multiple openings may be exposed to the said opposite side surface by the said flow path, The any one of Claims 9-11 characterized by the above-mentioned. The electro-optical device according to 1.   An electronic apparatus comprising the electro-optical device according to any one of claims 9 to 14.

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