JP2008084960A5 - - Google Patents

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JP2008084960A5
JP2008084960A5 JP2006260980A JP2006260980A JP2008084960A5 JP 2008084960 A5 JP2008084960 A5 JP 2008084960A5 JP 2006260980 A JP2006260980 A JP 2006260980A JP 2006260980 A JP2006260980 A JP 2006260980A JP 2008084960 A5 JP2008084960 A5 JP 2008084960A5
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Prior art keywords
substrate
substrate holder
holder
reaction furnace
jig
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JP2006260980A
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Japanese (ja)
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JP2008084960A (en
JP5010884B2 (en
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Publication of JP2008084960A5 publication Critical patent/JP2008084960A5/ja
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複数枚の基板を略水平に載置する治具を備えた基板保持具に移載した後に、この基板保持具を反応炉に搬入して密閉し、この反応炉内を所定の温度及び圧力に維持して所定のガスを供給することにより前記基板に処理を施し、この処理後に、前記基板保持具を前記反応炉から搬出し、この基板保持具から前記基板を取り出す基板処理装置において、
前記基板保持具から基板を取り出す際に、前記基板保持具の上側の治具に載置されている前記基板から下側の治具に向かって載置されている前記基板を取り出す基板移載機を有することを特徴とする基板処理装置。
After transferring a plurality of substrates to a substrate holder provided with a jig for placing the substrate substantially horizontally, the substrate holder is carried into a reaction furnace and sealed, and the inside of the reaction furnace is maintained at a predetermined temperature and pressure. In the substrate processing apparatus, the substrate is processed by maintaining and supplying a predetermined gas, and after the processing, the substrate holder is unloaded from the reaction furnace, and the substrate is taken out from the substrate holder.
A substrate transfer machine that, when taking out a substrate from the substrate holder, takes out the substrate placed toward the lower jig from the substrate placed on the upper jig of the substrate holder. the substrate processing apparatus characterized by having a.
複数枚の基板を略水平に載置する治具を備えた基板保持具に移載した後に、この基板保持具を反応炉に搬入して密閉し、この反応炉内を所定の温度及び圧力に維持して所定のガスを供給することにより前記基板に処理を施し、この処理後に、前記基板保持具を前記反応炉から搬出し、この基板保持具から前記基板を取り出す基板処理装置において、After transferring a plurality of substrates to a substrate holder equipped with a jig for placing the substrate substantially horizontally, the substrate holder is carried into a reaction furnace and sealed, and the inside of the reaction furnace is maintained at a predetermined temperature and pressure. In the substrate processing apparatus, the substrate is processed by maintaining and supplying a predetermined gas, and after the processing, the substrate holder is unloaded from the reaction furnace, and the substrate is taken out from the substrate holder.
前記基板保持具に前記基板を移載する際に、前記基板保持具の下側の治具に載置されている前記基板から上側の治具に向かって載置されている前記基板を移載する基板移載機を有することを特徴とする基板処理装置。When transferring the substrate to the substrate holder, the substrate placed on the upper jig from the substrate placed on the lower jig of the substrate holder is transferred. A substrate processing apparatus, comprising: a substrate transfer machine that performs the above process.

JP2006260980A 2006-09-26 2006-09-26 Substrate processing apparatus, substrate transport method, and semiconductor integrated circuit device manufacturing method Active JP5010884B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006260980A JP5010884B2 (en) 2006-09-26 2006-09-26 Substrate processing apparatus, substrate transport method, and semiconductor integrated circuit device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006260980A JP5010884B2 (en) 2006-09-26 2006-09-26 Substrate processing apparatus, substrate transport method, and semiconductor integrated circuit device manufacturing method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011048929A Division JP2011176320A (en) 2011-03-07 2011-03-07 Substrate processing apparatus

Publications (3)

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JP2008084960A JP2008084960A (en) 2008-04-10
JP2008084960A5 true JP2008084960A5 (en) 2009-11-05
JP5010884B2 JP5010884B2 (en) 2012-08-29

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JP2006260980A Active JP5010884B2 (en) 2006-09-26 2006-09-26 Substrate processing apparatus, substrate transport method, and semiconductor integrated circuit device manufacturing method

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Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3115164B2 (en) * 1993-07-29 2000-12-04 東京エレクトロン株式会社 Heat treatment equipment
JP2001257167A (en) * 2000-03-13 2001-09-21 Hitachi Kokusai Electric Inc Semiconductor manufacturing device
JP2002305231A (en) * 2000-12-27 2002-10-18 Semiconductor Energy Lab Co Ltd Longitudinal batch processor, mobile machine and conveying method for wafer
JP4923361B2 (en) * 2001-09-04 2012-04-25 東京エレクトロン株式会社 Heat treatment apparatus and heat treatment method
JP2004335684A (en) * 2003-05-07 2004-11-25 Hitachi Kokusai Electric Inc Heat treatment apparatus
JP4285759B2 (en) * 2003-07-28 2009-06-24 株式会社日立国際電気 Substrate processing apparatus and substrate processing method
JP2005328008A (en) * 2004-05-17 2005-11-24 Shin Etsu Handotai Co Ltd Vertical boat for heat-treating semiconductor wafer, and heat treatment method

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