JP2008084960A5 - - Google Patents
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- Publication number
- JP2008084960A5 JP2008084960A5 JP2006260980A JP2006260980A JP2008084960A5 JP 2008084960 A5 JP2008084960 A5 JP 2008084960A5 JP 2006260980 A JP2006260980 A JP 2006260980A JP 2006260980 A JP2006260980 A JP 2006260980A JP 2008084960 A5 JP2008084960 A5 JP 2008084960A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- substrate holder
- holder
- reaction furnace
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims 32
- 238000000034 method Methods 0.000 claims 1
Claims (2)
前記基板保持具から基板を取り出す際に、前記基板保持具の上側の治具に載置されている前記基板から下側の治具に向かって載置されている前記基板を取り出す基板移載機を有することを特徴とする基板処理装置。 After transferring a plurality of substrates to a substrate holder provided with a jig for placing the substrate substantially horizontally, the substrate holder is carried into a reaction furnace and sealed, and the inside of the reaction furnace is maintained at a predetermined temperature and pressure. In the substrate processing apparatus, the substrate is processed by maintaining and supplying a predetermined gas, and after the processing, the substrate holder is unloaded from the reaction furnace, and the substrate is taken out from the substrate holder.
A substrate transfer machine that, when taking out a substrate from the substrate holder, takes out the substrate placed toward the lower jig from the substrate placed on the upper jig of the substrate holder. the substrate processing apparatus characterized by having a.
前記基板保持具に前記基板を移載する際に、前記基板保持具の下側の治具に載置されている前記基板から上側の治具に向かって載置されている前記基板を移載する基板移載機を有することを特徴とする基板処理装置。When transferring the substrate to the substrate holder, the substrate placed on the upper jig from the substrate placed on the lower jig of the substrate holder is transferred. A substrate processing apparatus, comprising: a substrate transfer machine that performs the above process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006260980A JP5010884B2 (en) | 2006-09-26 | 2006-09-26 | Substrate processing apparatus, substrate transport method, and semiconductor integrated circuit device manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006260980A JP5010884B2 (en) | 2006-09-26 | 2006-09-26 | Substrate processing apparatus, substrate transport method, and semiconductor integrated circuit device manufacturing method |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011048929A Division JP2011176320A (en) | 2011-03-07 | 2011-03-07 | Substrate processing apparatus |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008084960A JP2008084960A (en) | 2008-04-10 |
JP2008084960A5 true JP2008084960A5 (en) | 2009-11-05 |
JP5010884B2 JP5010884B2 (en) | 2012-08-29 |
Family
ID=39355527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006260980A Active JP5010884B2 (en) | 2006-09-26 | 2006-09-26 | Substrate processing apparatus, substrate transport method, and semiconductor integrated circuit device manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5010884B2 (en) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3115164B2 (en) * | 1993-07-29 | 2000-12-04 | 東京エレクトロン株式会社 | Heat treatment equipment |
JP2001257167A (en) * | 2000-03-13 | 2001-09-21 | Hitachi Kokusai Electric Inc | Semiconductor manufacturing device |
JP2002305231A (en) * | 2000-12-27 | 2002-10-18 | Semiconductor Energy Lab Co Ltd | Longitudinal batch processor, mobile machine and conveying method for wafer |
JP4923361B2 (en) * | 2001-09-04 | 2012-04-25 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
JP2004335684A (en) * | 2003-05-07 | 2004-11-25 | Hitachi Kokusai Electric Inc | Heat treatment apparatus |
JP4285759B2 (en) * | 2003-07-28 | 2009-06-24 | 株式会社日立国際電気 | Substrate processing apparatus and substrate processing method |
JP2005328008A (en) * | 2004-05-17 | 2005-11-24 | Shin Etsu Handotai Co Ltd | Vertical boat for heat-treating semiconductor wafer, and heat treatment method |
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2006
- 2006-09-26 JP JP2006260980A patent/JP5010884B2/en active Active
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