WO2008102603A1 - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
WO2008102603A1
WO2008102603A1 PCT/JP2008/051153 JP2008051153W WO2008102603A1 WO 2008102603 A1 WO2008102603 A1 WO 2008102603A1 JP 2008051153 W JP2008051153 W JP 2008051153W WO 2008102603 A1 WO2008102603 A1 WO 2008102603A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
substrate processing
transfer unit
processing apparatus
receives
Prior art date
Application number
PCT/JP2008/051153
Other languages
French (fr)
Japanese (ja)
Inventor
Yuji Kamikawa
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2008102603A1 publication Critical patent/WO2008102603A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A substrate processing apparatus is provided with a substrate processing container (30) having a chamber inside for storing a substrate (W) to be processed; a first transfer unit (40) which receives and transfers the substrate (W) to the substrate processing container (30); and a second transfer unit which receives and transfers the substrate (W) to the first transfer unit (40) and receives the substrate (W) from the first transfer unit (40). The first transfer unit (40) is of noncontact type and holds the substrate (W) from above without being in contact with the upper surface of the substrate (W). The second transfer unit is of contact type and holds the substrate (W) by being in contact with the substrate (W).
PCT/JP2008/051153 2007-02-23 2008-01-28 Substrate processing apparatus and substrate processing method WO2008102603A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007043918A JP2010114101A (en) 2007-02-23 2007-02-23 Substrate processing apparatus and method
JP2007-043918 2007-02-23

Publications (1)

Publication Number Publication Date
WO2008102603A1 true WO2008102603A1 (en) 2008-08-28

Family

ID=39709882

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051153 WO2008102603A1 (en) 2007-02-23 2008-01-28 Substrate processing apparatus and substrate processing method

Country Status (2)

Country Link
JP (1) JP2010114101A (en)
WO (1) WO2008102603A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9330898B2 (en) 2010-08-23 2016-05-03 Tokyo Electron Limited Separation system, separation method, program and computer storage medium
EP3655352A4 (en) * 2017-07-21 2021-04-21 Electro Scientific Industries, Inc. Non-contact handler and method of handling workpieces using the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012238762A (en) * 2011-05-12 2012-12-06 Tokyo Electron Ltd Substrate transfer device, coater/developer apparatus equipped with the same and substrate transfer method
JP2013004845A (en) * 2011-06-20 2013-01-07 Tokyo Electron Ltd Separation system, separation method, program and computer storage medium
JP6161061B2 (en) * 2013-04-04 2017-07-12 サムコ株式会社 Work transfer device
KR101987822B1 (en) * 2017-07-05 2019-06-12 (주)소닉스 In-line inspection system for inspecting object related to display module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071702A (en) * 2002-08-02 2004-03-04 Toshiba Ceramics Co Ltd Semiconductor wafer cleaning device
JP2005011917A (en) * 2003-06-18 2005-01-13 Disco Abrasive Syst Ltd Processing equipment of semiconductor wafer
JP2005340522A (en) * 2004-05-27 2005-12-08 Shin Etsu Handotai Co Ltd Bernoulli chuck

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071702A (en) * 2002-08-02 2004-03-04 Toshiba Ceramics Co Ltd Semiconductor wafer cleaning device
JP2005011917A (en) * 2003-06-18 2005-01-13 Disco Abrasive Syst Ltd Processing equipment of semiconductor wafer
JP2005340522A (en) * 2004-05-27 2005-12-08 Shin Etsu Handotai Co Ltd Bernoulli chuck

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9330898B2 (en) 2010-08-23 2016-05-03 Tokyo Electron Limited Separation system, separation method, program and computer storage medium
EP3655352A4 (en) * 2017-07-21 2021-04-21 Electro Scientific Industries, Inc. Non-contact handler and method of handling workpieces using the same
US11254014B2 (en) 2017-07-21 2022-02-22 Electro Scientific Industries, Inc. Non-contact handler and method of handling workpieces using the same

Also Published As

Publication number Publication date
JP2010114101A (en) 2010-05-20

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