JP2008073723A - Manufacturing method of cylindrical member and transferred body using the same, and bump defect correcting apparatus for cylindrical member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of advantageously manufacturing a cylindrical precision member having no bump defect, and a method of manufacturing a transferred body to which the shape of such roll surface is transferred. <P>SOLUTION: As regards the projecting bump defects formed by a surface treatment such as plating on the surface of a cylindrical member, the method of manufacturing the cylindrical precision member includes: detecting the places of the bump defects by a defect detecting means; irradiating the roll face of the cylindrical member with a machining laser beam from a tangential direction by a machining laser beam irradiation means; and removing the bump defects. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a method of manufacturing a cylindrical member having a precise roll surface and a method of manufacturing a transfer product that is a copy of the shape of such a roll surface.

A cylindrical member having a precision roll surface is used for applications in which the precise roll surface is pressed against an object to continuously copy the shape of the roll surface onto the object. Examples of such a cylindrical member include a printing plate cylinder and an embossing roll.
For example, as an antireflection film manufacturing method, a resin film is mixed with fine particles such as a filler, and an embossing roll for forming an antireflection film (hereinafter simply referred to as an embossing roll) is pressed against the surface of a smooth resin film. A method of forming irregularities on the surface of the smooth resin film is known.
The structure of the embossing roll used in the method for forming an antireflection film by forming irregularities on the surface of the smooth resin film is as follows. The surface of the metallic roll core material is subjected to various plating such as copper plating and nickel plating, A ground layer, a release layer, and a processed layer are laminated, and unevenness is formed on the surface of the processed layer by sandblasting or the like on the surface of the processed layer. Further, the processed layer has a structure in which chromium plating is applied as a protective layer.
Here, in the plating step when producing the embossing roll, there is a problem that a large number of point-like protrusion-like defect (hereinafter, simply referred to as the knob defect) occurs on the surface of the plating layer.

Conventionally, as a method for correcting a defect generated on a metal surface, a technique for correcting the metal member by overlaying without deforming the metal member (see Patent Document 1), or by overlaying by welding and finishing the welding material is performed. A technique is known (see Patent Document 2).
JP 2000-61960 A JP 2002-219567 A

However, the conventional method is a method that can be corrected in the case of a defect in which the metal surface is depressed, so that when a point-like bump defect occurs in the plating process when producing the embossing roll, this defect is completely eliminated. It was difficult to correct.
Then, the objective of this invention is providing the manufacturing method of the embossing roll for anti-reflective film shaping | molding which does not have a knob defect.

In order to achieve the above-mentioned object, in the appearance inspection in the middle of the embossing roll manufacturing or in the final manufacturing process, the defect of the bump is examined by using a microscope mechanism that observes the embossing roll from the two directions of the vertical direction and the tangential direction. A method for producing a defect-free embossing roll by irradiating a processing laser beam by a processing laser beam irradiating means from a tangential direction to the roll surface of the embossing roll on the discovered bump defect to remove the bump defect It is.
ADVANTAGE OF THE INVENTION According to this invention, the method of manufacturing an antireflection film etc. continuously continuously without a defect can be provided.

A first invention according to claim 1 is a method of repairing a defect of a cylindrical member, wherein the roll surface is inspected for a protrusion-like defect, and the aneurysm is measured from a tangential direction of the roll surface. It is a manufacturing method of a cylindrical member characterized by including a bump defect removing step of removing a bump defect by irradiating the defect with a processing laser beam. According to this, the laser beam for processing is irradiated from the tangential direction of the roll surface to the bump defect on the surface of the roll surface, so that the irradiation energy of the processing laser beam is dissipated backward even if the bump defect is removed. As a result, the effect that the bump defects can be removed without damaging the roll surface is achieved.
A second invention according to claim 2 is a method of manufacturing a cylindrical member having a roll surface on which an emboss pattern is formed, a pattern forming step for forming an emboss pattern on the roll surface, and a tangent to the roll surface A method of manufacturing a cylindrical member, comprising: a grooving defect removing step of irradiating the grooving defect with a processing laser beam from a direction to remove the grooving defect.
According to this, similarly to the roll surface on which the embossed pattern is formed, the laser beam for processing is irradiated to the bump defect from the tangential direction of the roll surface. Since the irradiation energy of the beam is dissipated backward, there is an effect that the aforementioned defect can be removed without damaging the roll surface.
A third aspect of the invention according to claim 3 includes a metal layer forming step of forming a metal layer on the surface of the roll surface between the pattern forming step and the inspection step. It is a manufacturing method of a shaped member.
According to a fourth aspect of the present invention, in the cylindrical shape according to the second aspect, the processing laser beam used in the ankle defect removing step is an ultrashort pulse laser having a pulse width of 1 picosecond or less. It is a manufacturing method of a member. According to this, since the removal of the bump defect can be performed without heating, there is an effect that the bump defect can be removed with high accuracy.
According to a fifth aspect of the present invention, in the inspection step, whether the inspection target part on the roll surface is observed from a normal direction and a tangential direction of the roll surface, and is consistent with a predetermined defect defect standard? The method for manufacturing a cylindrical member according to any one of claims 1 to 4, wherein the method is a step of determining the above. According to this, since the said grooving defect can be confirmed correctly, the oversight of the said grooving defect can be prevented, and a defect-free cylindrical member can be produced.
According to a sixth aspect of the present invention, in the step of removing the defect defect, the processing laser beam is irradiated from the tangential direction of the roll surface with respect to the defect defect in the axial direction of the cylindrical member. The method for producing a cylindrical member according to any one of claims 1 to 5, wherein the method is a step of removing the aneurysm defect. According to this, since it is possible to uniformly irradiate the grooving defect with the processing laser beam, the grooving defect can be removed with high accuracy.
A seventh aspect of the invention according to claim 7 is a transfer product in which the shape of the roll surface provided in the cylindrical member manufactured by the method according to any one of claims 1 to 6 is transferred.
An eighth invention according to claim 8 is an apparatus for correcting an anomaly of a cylindrical member having a roll surface, and the apparatus for correcting an aneurysm at least places an inspection target part on the roll surface. First observation means observable from a line direction, second observation means capable of observing the inspection target part from a tangential direction of the roll surface, and inspection target parts specified by the first observation means and the second observation means An aneurysm defect detection mechanism for comparing the protrusion of the anomaly with a criterion to be determined as an aneurysm defect, a positioning means for detecting the position of the aneurysm defect detected by the aneurysm defect detection mechanism, and the aneurysm defect An aneurysm defect correcting device comprising: an excision defect removing mechanism comprising: a processing laser irradiating means capable of irradiating the aneurysm defect with a processing laser for removing the defect from a tangential direction of the roll surface A.
According to a ninth aspect of the present invention, the positioning means is a visible laser, the visible laser and the processing laser beam can be incident on the same axis, and the means for making the lasers have the same focal point is further provided. 9. A device for correcting a flaw defect according to claim 8, further comprising: Thereby, since the irradiation position of the processing laser beam can be confirmed with the visible laser, the effect of removing the defect defect with high accuracy is achieved.
According to a tenth aspect of the present invention, there is provided an optical attenuator in which the positioning laser irradiation means can change the output of the processing laser beam emitted from the means, two or more high-output light sources having different oscillation wavelengths, and The apparatus according to claim 9, further comprising: the processing laser beam swingable in an axial direction of the cylindrical member. Thereby, even if the material of the cylindrical member is selected widely, there is an effect that the aneurysm defect can be removed with high accuracy.

  As will be apparent from the above description, the following effects can be obtained with the cylindrical member manufacturing method and the bump defect correcting device of the present invention.

First, as shown in FIG. 5, the processing laser beam is incident on the embossing roll surface horizontally from the tangential direction of the embossing roll 7, which is a cylindrical member. Is focused on the top of the circumference of the embossing roll 7, the energy of the processing laser beam 25 acts only on the aneurysm defect 1 to remove the aneurysm defect 1, and even if the aneurysm defect 1 is removed, Irradiation energy of the processing laser beam 25 is dissipated backward, and the protective layer 19 on the surface of the embossing roll 7 is not damaged, so that the uniform and stable removal of the defect 1 can be performed.
By this method, it is possible to prevent the occurrence of pattern defects in the transferred product obtained by transferring the shape of the roll surface of the manufactured cylindrical member.

  Second, as a means for detecting and measuring the bump defect 1, it is arranged so that the bump defect 1 can be observed by a microscope system equipped with a CCD camera from two directions of the embossing roll 7 in the radial direction and the tangential direction. Height and area information can be acquired simultaneously. Further, the illumination defect provided in each microscope and the positioning laser can clearly capture the aneurysm defect 1, and a predetermined criterion for the aneurysm defect 1 is removed, for example, the aneurysm defect 1 having a height of 1 μm or more is removed. By determining the nodule defect 1 to be removed, for example, by setting the above-mentioned criteria, the processing time for determining whether or not the nodule defect 1 should be removed can be shortened, and the removal observation of the nodule defect 1 by laser is also performed. Therefore, there is no problem that the removal of the aneurysm defect 1 is incomplete and the aneurysm defect 1 is partially left behind.

  Thirdly, by making it possible to equip various combinations of laser light sources, it is possible to remove the bump defect 1 of the embossing roll 7 constituted by the embossing roll 7 in a wide material range.

Although the present invention is a cylindrical member and can be applied as long as a raised defect occurs on the roll surface, here, an embossing roll for transferring a concavo-convex pattern to a transfer product such as an antiglare film will be described. To do.
The manufacturing process of the embossing roll 7 will be sequentially described with reference to FIGS.
First, for example, electrolytic nickel plating is performed on a roll core 9 having a diameter of 300 mm and a length of 500 mm, which is made of iron or aluminum, as shown in FIG. 6A to form an adhesion layer 11 having a plating thickness of several tens of μm (see FIG. 6). 6 (b)), and a base layer 13 having a plating thickness of 50 to 200 μm is formed thereon by, for example, electrodeposition copper plating, electrodeposition nickel plating or the like (FIG. 6C).
Next, the surface of the underlayer 13 is polished with a grindstone, and further a release layer 15 is formed by a release treatment (FIG. 6 (d)). Further, for example, electrodeposited nickel plating, electroless nickel plating, electrodeposited zinc plating is formed thereon. Then, a processed layer 17 having a plating thickness of 50 to 200 μm is formed by using any one of electrodeposited copper plating and the like (FIG. 7E).
By this method, when the processed layer 17 is damaged due to the operation of the embossing roll 7 or needs to be regenerated due to other problems, the release layer 15 and the processed layer 17 are mechanically separated, The underlayer 13 is prepared by polishing, a release layer 15 is formed again, and a processed layer 17 is formed thereon by plating.

Next, the embossing formation method of the embossing roll 7 is demonstrated.
As a method for forming irregularities on the processed layer 17, a method using a blasting technique using ceramic beads or a photolithography technique can be used. As the photolithography technology, laser plate making technology can be applied. After forming unevenness on the surface, the uneven surface is smoothed using an etching solution of sulfuric acid, hydrochloric acid, nitric acid, sulfuric acid-hydrogen peroxide, ammonium persulfate solution, copper chloride solution, or iron chloride solution. Further, as shown in FIG. 7 (f), in order to protect the uneven surface of the processed layer 17, a protective layer 19 having a plating thickness of 10 μm is formed by electrodeposition chromium plating.

  The method of removing the bump defect 1 on the surface of the embossing roll 7 proposed in the present invention is a method of removing the bump defect 1 discovered during the final inspection of the embossing roll 7 by irradiating the processing laser beam 25. It is.

  An ablation action is used for the processing laser beam used for the removal of the protrusion-like bump defect 1 described above. Here, laser ablation is a phenomenon in which when a solid is irradiated with a laser beam, the elements that make up the solid material are released in an explosive form in various forms, and the laser beam irradiated part of the solid surface is removed, another expression In other words, this is an explosive peeling phenomenon of a solid surface accompanied by plasma emission and shock wave generated when a laser beam is irradiated on the solid surface. Depending on the energy and pulse width and wavelength of the laser beam used, there are those with sublimation, those with evaporation, those with melting, those with fracture by shock waves, etc. Ablation processing of sublimation and crushing without melting without expansion of the processing area is suitable.

The processing laser device used for ablation processing is an ultrashort pulse laser device with an oscillation pulse width of 1 picosecond or less. A specific material is irradiated with an ultrashort pulse laser, and the material is processed by ultrashort pulse laser ablation. Remove.
The feature of this laser device is that non-thermal processing is possible because it is a phenomenon that is shorter than multiphoton absorption and thermal relaxation time, and the processing resolution is below the diffraction limit of light due to nonlinear response, High precision machining is possible.

  If fine irregularities on the surface of the embossing roll 7 thus produced can be appropriately applied to the film, the haze can be lowered and the visibility of the display panel can be improved.

  In the method for repairing the bump defect 1 on the surface of the embossing roll according to the present invention, in addition to the function of removing the bump defect 1 with a laser, it has a function of detecting and identifying the bump defect 1 prior to the function. Is integrated with high accuracy with a micrometer digit, and forms an aneurysm 1 inspection and correction mechanism.

  In order to realize the function of removing the defect 1, the processing laser beam 25 emitted from the processing laser device 21 is spread by the objective lens 29 as shown in FIG. The beam spot 33, that is, the processing point P is formed at the laser irradiation position, that is, the laser processing position, by the condensing lens 31 arranged in advance.

  In the above-described method in which the processing laser beam is incident perpendicularly to the surface of the embossing roll 7 of Patent Document 1, light is condensed by an objective lens having a magnification of 10 to 50 times, and the working distance is in the range of 20 mm to 5 mm. Even in the method of entering from the tangential direction with respect to the circumference of the embossing roll 7 of the present invention, the numerical aperture of the lens is increased as much as possible in order to minimize the range in which the lumbar defect 1 is removed by the processing laser beam. Desirably, the condenser lens 31 has an effective diameter of 50 mm or more, and the working distance needs to be 70 mm or more in order to arrange the optical system in consideration of the diameter of a general embossing roll 7 of 300 mm. The distance (working distance) between the objective lens 29 and the processing point P of the embossing roll 7 from which the aneurysm defect 1 is removed was set to 100 mm. These design conditions are not limited to these numbers as long as the required spot diameter and focal depth can be obtained.

  In the configuration shown in FIG. 1, a visible light positioning laser device 23 having a different wavelength is provided together with the processing laser device 21. The laser beams emitted from the two laser devices are combined by the half mirror 27a so as to be incident on the same axis. In this case, it is particularly desirable that the objective lens 29 and the final condenser lens 31 are achromatic lenses. The positioning laser emitted from the positioning laser device 23 is incorporated for specifying and confirming the irradiation position of the processing laser beam, but it can also be used for the purpose of detecting and visualizing the defect 1.

  Here, for the same purpose, a low output is set by installing a light attenuator with a polarizing element, ND filter, etc. at the output end of the laser so that the laser output can be switched between a low output and a high output. By irradiating the surface of the embossing roll 7 from the tangential direction, the laser beam can be used for searching for the bump defect 1, and the irradiation position of the processing laser beam can be confirmed.

  In addition, it is also effective to prepare two or more high-power lasers with different wavelengths having a laser output switching function as described above, which can be applied to an embossing roll 7 of a wide range of materials. All of the following lasers are within the scope of the present invention.

  For the detection and identification of the defect 1 and the observation of the processing height and shape, the microscope system 35a (first observation means) for observing from the tangential direction with respect to the circumference of the embossing roll 7 surface and the embossing roll 7 surface, respectively. A microscope system including two sets of CDD cameras that form an angle of 90 degrees with each other is prepared for a microscope system 35b (second observation means) for observation from a vertical direction.

  Here, the field of view of the microscope system 35a observed from the tangential direction is coincident with the processing laser beam of the processing laser device 21 and the optical axis of the visible laser of the positioning laser device 23, and the region where the defect 1 exists is condensed. The light is branched and observed by the half mirror 27b via the lens 31 and the objective lens 29. The branching location is between the laser light source and the objective lens 29, but this may be branched between the condenser lens 31 and the objective lens 29.

  The observation illumination from the tangential direction is arranged at an angle by a light guide 39 guided from the illuminating device 37, and a reflecting mirror 41 is arranged on the rear side of the optical axis to obtain a field of view with good brightness. (See FIG. 2). The reflecting mirror 41 does not need to have a reflected light amount close to 100%, and may be white paper or a plastic sheet, and more preferably has a scattering effect on the surface.

The microscope system 35b for observing from the direction perpendicular to the surface of the embossing roll 7 is used for calculating the projected area of the aneurysm defect 1 at the time of inspection. Further, when irradiating with visible laser, it is used for positioning in the in-plane direction of the processing laser beam.
The beam spot 33 can be moved in the axial direction of the embossing roll 7 by moving the position of the condenser lens 31 in the direction perpendicular to the optical axis.
That is, in the irradiation of the processing laser beam, the beam spot 33 of the processing laser beam moves left and right (oscillates) by reciprocating the condenser lens 31 in the axial direction of the embossing roll in accordance with the size of the lump defect 1. ) The aneurysm defect 1 can be removed.

  The observation illumination in the vertical direction is coaxially incident on the inside of the microscope system 35b because the working distance of an objective lens (not shown) incorporated in the microscope system 35b can be shortened and a sufficient amount of reflected light can be obtained.

FIG. 3 and FIG. 4 show an outline of the aneurysm defect 1 captured in the field of view of each microscope system.
FIG. 3 is a schematic view of the upper end portion of the circumference of the embossing roll 7 observed from the tangential direction with respect to the surface of the embossing roll 7. As a result, when the defect 1 is present, it is displayed as a bright spot on the embossing roll end face 5 of the observation screen 3.

  FIG. 4 is a schematic diagram on the circumference of the embossing roll 7 observed from a direction perpendicular to the surface of the embossing roll 7. The bump defect 1 is projected in black with a hemispherical shape or a projection-like structure in which hemispheres are joined together.

  It is desirable that fine adjustment of the processing laser beam in the radial direction of the embossing roll 7 is also performed. In this case, the size of the laser beam spot 33 of the visible laser 23 for positioning captured in the images of both the microscope system 35 a observed from the tangential direction and the microscope system 35 b observed from the direction perpendicular to the surface of the embossing roll 7. Thus, the irradiation position of the processing laser beam is adjusted.

  The processing laser device 21, the positioning laser device 23, the microscope system 35 a that observes from the tangential direction with respect to the surface of the embossing roll 7, and the microscope system 35 b that observes from the direction perpendicular to the surface of the embossing roll 7, They are electrically connected and their operations are controlled. Further, a roller control mechanism 45 that detects the position by rotating and moving the embossing roll 7 in the axial direction is provided to communicate commands and status information with the inspection / correction control device 43.

  Next, the operation from detection to removal of the bump defect 1 will be described step by step.

  First, when the embossing roll 7 used for the inspection and correction of the bump defect 1 is suspended on a roll inspection table with a roll rotation mechanism using an electric motor (not shown), the position of the embossing roll 7 is set by the roller control mechanism 45. Is done. The observation position of the defect defect 1 inspection and correction mechanism is set at one end of the embossing roll 7 in the axial direction, and the initial value together with the rotation angle is sent from the roller control mechanism 45 to the inspection and correction control device 43. 43 is recorded in a storage device (not shown).

  Next, the roller control mechanism 45 rotates the embossing roll 7 by an inspection start command from the inspection correction control device 43. When the embossing roll 7 starts to rotate, the inspection correction control device 43 sequentially receives from both the microscope system 35a observing from the tangential direction with respect to the surface of the embossing roll 7 and the microscope system 35b observing from the direction perpendicular to the surface of the embossing roll 7. When the acquired image is processed and an abnormality is found, the height of the bright spot and the size of the dark part are compared with preset determination values. The acquired image and its processing result, the brightness of the bright spot, and the size of the dark part are stored in the storage unit as inspection result data. When the embossing roll 7 finishes one rotation, the embossing roll 7 is moved in the axial direction by a predetermined amount, and the next line is inspected.

  This operation is sequentially repeated to complete the detection and identification of the aneurysm defect 1. When the number of defects is “0”, the embossing roll 7 is sent to the next process.

  The embossing roll 7 in which at least one knob defect 1 is specified is positioned based on the inspection result data, and the removal operation by the laser is performed. After positioning to the aneurysm defect 1 by the laser of the positioning laser device 23 within an allowable error range, a switch (not shown) provided in the processing laser device 21 is operated, and the processing laser beam of the processing laser device 21 is made to the aneurysm defect. 1 is irradiated. Then, while the condenser lens 31 is swung by a fine movement mechanism (not shown) within a size range measured by the microscope system 35b observed from a direction perpendicular to the surface of the embossing roll 7, the surface of the embossing roll 7 is moved with respect to the surface of the embossing roll 7. Then, the height of the aneurysm defect 1 is sequentially monitored from the image observed by the microscope system 35a observed from the tangential direction, and the oscillation of the condensing lens 31 is stopped when the height falls below the specified value, and the processing laser The switch (not shown) of the device 21 is closed.

  After this operation is performed on all the lumped defects 1 found on one embossing roll 7, the surface of the embossing roll 7 is cleaned, and all the groin defect 1 inspection and repairing steps are completed.

  As described above, the procedure in which the inspection process and the repairing process are separated has been described. However, the repairing operation may be sequentially performed at the time when one bump defect 1 is detected, and is not restricted by the procedure described above. Further, although the embossing roll 7 is moved in the axial direction, the inspection correction mechanism portion may be moved. By carrying out like this, the movement of the embossing roll 7 in the front and back processes can be avoided.

An embodiment of the method for repairing the bump defect 1 on the surface of the embossing roll 7 related to the present invention will be described below.

(Example 1)
FIG. 5 is a schematic view showing a layer structure for forming the embossing roll 7 and a method for removing the bump defect 1.

  After grinding the iron roll core material 9 having a shaft, the electrodeposited nickel was plated to form an adhesion layer 11 and then the electrodeposited copper was plated to form an underlayer 13 of about 200 μm. This surface was leveled by vertical polishing, and silver displacement plating was performed to form a release layer 15. Furthermore, electrodeposited copper plating was performed, and the processed layer 17 was formed by polishing so as to have a surface roughness Ra of 0.001 to 0.005 μm by vertical polishing. The processed layer 17 as the polished surface is blasted with silicon carbide having a particle size of about 50 to 150 μm for about 4 hours to form fine irregularities, and then etched with an iron chloride solution to reduce the irregularities on the surface. did.

  After the processed layer 17 which is the polished surface is dried with an air gun so that no water droplets remain, an inspection of the defect defect is performed by detecting the defect defect 1 on the surface of the processed layer 17. Short pulse laser device (FLS-5000 manufactured by Hoya Candeo Optronics Co., Ltd .; oscillation wavelength 775 nm, peak power 800 mW, maximum pulse energy 800 μJ / pulse, minimum pulse width 150 femtoseconds, pulse repetition frequency 1 kHz, diameter of linearly polarized beam spot 10 μm) is used to irradiate a laser beam (beam diameter of about 50 μm, distance between the processing part and the lens of about 100 mm, laser output value of 100 mW, pulse width of 200 fs) from the tangential direction of the embossing roll 7 to form the protrusion-like defect 1 Removed.

  Subsequently, a protective layer 19 was formed on the surface of the processed layer 17 by plating with a plating thickness of 10 μm by electrodeposition chromium plating.

Further, the surface of the protective layer 17 by chrome plating was inspected and removed by irradiating the laser beam for processing to the bump defect 1 which was not detected before chrome plating. Using the embossed roll thus obtained, the roll surface was transferred to an ultraviolet curable resin laminated on a polyester film, and a film was produced. Thus, a defect-free film sheet could be produced.

The present invention relates to the surface of an embossing roll for forming an antireflection film for producing an antireflection film for preventing the reflection of external light onto the surface of the display surface of an image display device such as a liquid crystal display device used in a liquid crystal television or a personal computer. It can also be used for defect removal and repair methods.

It is the schematic which shows the structure of the bump defect repairing method of the embossing roll surface which is an Example of this invention. It is the schematic which shows the structure of the illumination system observed from a tangential direction with respect to the embossing roll circumference of the embossing roll surface repair method of the embossing roll surface which is an Example of this invention. It is the schematic of the upper end part on the circumference of the embossing roll observed from the tangential direction with respect to the embossing roll circumference of the embossing roll circumference repairing method of the embossing roll surface which is an example of the present invention. It is the schematic on the circumference of the embossing roll observed from the perpendicular | vertical direction to the embossing roll surface in connection with this invention. It is the schematic which shows the structure of the embossing roll in connection with this invention, and the removal method of an ankle defect. The figure which shows the formation process of the embossing roll regarding this invention Embossing roll forming process of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ...... Defect 3 ... Observation screen 5 ... Embossing roll end face 7 ... Embossing roll 9 ... Roll core material 11 ... Adhesion layer 13 ... Bottom Layer 15 ... Peeling layer 17 ... Processing layer 19 ... Protective layer 21 ... Processing laser device 23 ... Positioning laser device 25 ... Processing laser beam 27a, 27b ... half mirror 29 ... objective lens 31 ... condensing lens 33 ... beam spots 35a, 35b ... microscope system 37 ... illumination device 39 ... Light guide 41 ... Reflector 43 ... Inspection / correction control device 45 ... Roller control mechanism

Claims (10)

A method of manufacturing a cylindrical member,
An inspection step for inspecting the roll surface for protrusion-like nodule defects;
A nodule defect removing step of removing the nodule defect by irradiating a laser beam for processing the nodule defect from the tangential direction of the roll surface,
The manufacturing method of the cylindrical member characterized by comprising. A method of manufacturing a cylindrical member having a roll surface on which an emboss pattern is formed,
A pattern forming step of forming an embossed pattern on the roll surface;
An inspection step for inspecting the roll surface for protrusion-like nodule defects;
A nodule defect removing step of removing the nodule defect by irradiating a laser beam for processing the nodule defect from the tangential direction of the roll surface,
The manufacturing method of the cylindrical member characterized by comprising.   The method for producing a cylindrical member according to claim 2, further comprising a metal layer forming step of forming a metal layer on the surface of the roll surface between the pattern forming step and the inspection step.   3. The method for manufacturing a cylindrical member according to claim 2, wherein the processing laser beam used in the step of removing the defect is an ultrashort pulse laser having a pulse width of 1 picosecond or less.   The inspection step is a step of observing an inspection target site on the roll surface from a normal direction and a tangential direction of the roll surface, and determining whether or not it matches a preset criterion for an aneurysm defect. The manufacturing method of the cylindrical member in any one of Claim 1 to 4. The aneurysm defect removing step includes:
2. The step of removing the bump defect by irradiating a machining laser beam while swinging the bump defect in the axial direction of the cylindrical member from a tangential direction of the roll surface. The method for producing a cylindrical member according to any one of claims 5 to 6.   A transfer product, wherein the shape of the roll surface of the cylindrical member produced by the method according to claim 1 is transferred. A device for correcting an anomaly of a cylindrical member having a roll surface,
The aneurysm repair device is at least
A first observation means capable of observing the inspection target site on the roll surface from a normal direction of the roll surface; a second observation means capable of observing the inspection target site from a tangential direction of the roll surface;
An aneurysm defect determination means for comparing the protrusions of the inspection target site specified by the first observation means and the second observation means with a reference to be determined as an aneurysm defect;
An aneurysm defect detection mechanism comprising:
Positioning means for detecting the position of the aneurysm defect detected by the aneurysm defect detection mechanism;
A processing laser beam irradiating means capable of irradiating the grooving defect from the tangential direction of the roll surface with the processing laser for removing the grooving defect;
An aneurysm defect correcting device comprising: an aneurysm defect removing mechanism.   The said positioning means is a visible laser, The said visible laser and the said laser beam for a process can inject coaxially, and are further provided with the means which makes the focus of both lasers the same. An aneurysm repair device. The visible laser used for the positioning further includes an optical attenuator capable of changing the output of the processing laser beam emitted from the means within the visible region, and two or more high-output light sources having different oscillation wavelengths,
The aneurysm defect correcting device according to claim 9, wherein the processing laser beam is swingable in an axial direction of the cylindrical member.