JP2008070266A - Probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vertical type probe card capable of maintaining the effective length of a probe tip. <P>SOLUTION: The probe card is provided with a main substrate 10 in which an electrically conductive pattern is formed; a probe support part 14 connected to the main substrate 10 and having a plurality of through holes; a probe 12 that is connected to the electrically conductive pattern, inserted in the through holes, and passed through the probe support part 14; and a probe-adjusting mechanism 20 capable of inserting the part of the probe 12 in between its connection to the electrically conductive pattern and its insertion in the through holes in the probe support part 14. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a probe card.

Probe cards used when measuring various electrical characteristics of a semiconductor integrated circuit such as an LSI chip are roughly classified into two types, a horizontal type called a cantilever type and a vertical type called a vertical type. This cantilever type probe card has many excellent performances. However, due to the recent miniaturization, high speed, high integration, and multiplexing of measuring equipment, the cantilever type probe card cannot be applied. Yes.

Among them, the vertical probe card includes a main substrate that is a multi-layered substrate of several tens of layers on which a conductive pattern is formed, a probe that has a bent portion that is bent into a substantially U-shape at the middle part thereof, and the main probe card. A probe support portion is provided below the substrate and includes an upper guide plate and a lower guide plate with the bent portion interposed therebetween.

The connecting portion at the rear end of the probe is soldered to the conductive pattern on the surface of the main substrate through a through hole formed in the main substrate. The upper guide plate and the lower guide plate are each provided with a through hole through which the probe passes. The position of the tip of the probe is designed corresponding to the electrode pad of the LSI chip.

In the vertical probe card configured as described above, in measuring the electrical characteristics of a semiconductor integrated circuit, the probe tip deteriorates each time a plurality of measurements are performed, and the probe tip needs to be maintained each time. This maintenance is performed by shaving the probe tip. For this reason, the tip of the probe is gradually scraped, and the probe card must be replaced with several maintenance operations. Further, even when the probe tip is damaged, it is necessary to cut the probe tip, which causes the same problem as described above.

As this type of related technology, an example of a vertical probe card is disclosed (for example, see Patent Document 1).
Japanese Patent No. 3486841

It is an object of the present invention to provide a probe card that can maintain the effective length of the probe tip in a vertical probe card.

A probe card according to an aspect of the present invention includes a main board on which a conductive pattern is formed, a probe support portion connected to the main board and having a plurality of through holes, connected to the conductive pattern, and inserted into the through holes. A probe that penetrates through the probe support, and a probe adjustment mechanism that can insert the probe from being connected to the conductive pattern to being inserted into the through-hole into the probe support. It is characterized by.

The probe card according to another aspect of the present invention includes a main board on which a conductive pattern is formed, a probe support portion connected to the main board and having a plurality of through holes, connected to the conductive pattern, and A probe that hangs down from the substrate and penetrates the probe support from the through hole, and the probe support has an intermediate guide plate that curves the probe, and by adjusting the intermediate guide plate, It is characterized in that the tip of the probe can be pulled out.

According to the present invention, the effective length of the probe tip can be maintained in the vertical probe card.

  Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic cross-sectional view of a vertical probe card according to Embodiment 1 of the present invention. FIG.
1 is a schematic cross-sectional view of a vertical probe card according to Embodiment 1 of the present invention.

As shown in FIG. 1, the vertical probe card according to the first embodiment of the present invention includes a main substrate 10 that is a multi-layered substrate of several tens layers on which a conductive pattern is formed, and is bent into a substantially U shape at the middle part. A plurality of probes 12 that have a bent portion and are vertically suspended from the main substrate 10, and a probe support portion 14 that is provided on the back surface side of the main substrate 10 and supports the probe 12.

The main substrate 10 is a substrate having a conductive pattern formed on the surface. A hole for attaching the probe support portion 14 is provided in the central portion of the main substrate 10. And this main board 1
0 and the probe support part 14 are screwed.

Here, it is not always necessary to provide a hole in the central portion of the main substrate 10. For example, a through hole corresponding to the position of the electrode pad of the LSI chip may be provided in the central portion of the main substrate 10.

The probe support portion 14 is provided in parallel to the main substrate 10, supports the probe 12 by penetrating the through holes formed in each of them, and sandwiches the bent portion of the probe 12 with the upper guide plate 16 and the lower guide plate 16. A side guide plate 18 is provided. The through hole corresponds to the arrangement of the electrode pads of the LSI chip. A connecting portion at the rear end of the probe 12 is electrically connected to a conductive pattern on the surface of the main substrate 10 through a through hole formed in the main substrate 10.

Furthermore, the probe support portion 14 includes a probe adjustment mechanism 20 that can further insert a part of the probe 12 from being connected to the conductive pattern to being inserted into the through hole into the probe support portion 14. For example, the probe adjusting mechanism 20 has a through hole through which the plurality of probes 12 are passed, and a first guide plate 22 and a second guide plate 24 that support the probes 12.
Is provided. The first guide plate 22 fixes the probe 12. The first guide plate 22 and the second guide plate 24 are in contact with the electrode pads of the LSI chip from the main substrate 10 side.
2. It is possible to adjust the height up and down in the direction of the tip. As a means for adjusting the height of the first guide plate 22 and the second guide plate 24, for example, a screw hole is provided so as to penetrate the upper guide plate 16, and the screw hole is connected to the first guide plate 22. This can be achieved by providing the adjusting screw 26. That is, when it is desired to pull out the tip of the probe 12 toward the LSI chip, the tip of the probe 12 can be pulled out toward the LSI chip by lowering the adjustment screw 26.

Therefore, as shown in FIG. 2, the positions of the first guide plate 22 and the second guide plate 24 are moved from the main substrate 10 side toward the distal end of the probe 12, and after being connected to the conductive pattern, the through hole A part of the probe 12 until it is inserted into the probe support portion 14 can be drawn into the probe support portion 14. Then, it is possible to adjust the length of the tip of the probe 12 that contacts the electrode pad of the LSI chip.

Here, the means for pulling the probe 12 into the probe support portion 14 is not limited to the above-described means. For example, the pillar portion 2 that connects the first guide plate 22 and the second guide plate 24.
By providing a mechanism for adjusting the length of 8, the first guide plate 22 may be pushed down. In other words, by forming a stacked structure in which a plurality of pillar portions 28 are stacked in the height direction, by removing a part of the plurality of pillar portions 28, the length of the pillar portions 28 is shortened and the first guide plate 22 is pushed down. The probe 12 may be pulled into the probe support portion 14. Further, this mechanism may be applied to the upper guide plate 16 and the lower guide plate 18 as they are. That is, the pillar portion 32 connecting the upper guide plate 16 and the lower guide plate 18 is formed in a stacked structure in which a plurality of pillar portions 32 are stacked in the height direction, and a part of the plurality of pillar portions 32 is removed, thereby The length is shortened, the upper guide plate 16 is pushed down, and the probe 12 is moved to the probe support portion 1.
4 may be drawn. In that case, the first guide plate 22 and the second guide plate 24 are not necessary.

The probe 12 is connected to the conductive pattern on the surface of the main substrate 10 at the rear end of the probe 12, pulled out from the main substrate 10 on which the conductive pattern is formed, penetrates through the probe support 14, and the LSI chip from below the probe support 14. The tip of the probe 12 protrudes to contact the electrode pad. Further, the probe 12 is a contact portion with a sharpened tip, and a rear end is also a sharpened connection portion. In addition, the probe 12 has a bent portion 30 that is curved.
The bent portion 30 can elastically secure a predetermined contact pressure between the LSI chip and the electrode pad. Further, the bent portion 30 is provided between the first guide plate 22 and the second guide plate 24.

Here, the bent portion 30 is not necessarily provided between the first guide plate 22 and the second guide plate 24. For example, it may be provided between the second guide plate 22 and the lower guide plate 48.

The probe card according to the first embodiment of the present invention configured as described above is configured as follows.
The electrical characteristics of the SI chip can be measured.

A semiconductor wafer on which a plurality of LSI chips are formed is vacuum-sucked on the upper surface of the table. The probe card is lowered toward the table, and the tips of all the probes 12 are brought into contact with the electrode pads of the LSI chip. Further, even after the tip of the probe 12 comes into contact with the electrode pad, the probe card is lowered to ensure a predetermined contact pressure.

As described above, the electrical characteristics of the LSI chip can be measured while the probe 12 is in contact with the electrode pad, and the electrical characteristics are measured sequentially for each LSI chip.

Next, the use of the probe card according to the first embodiment of the present invention will be described. For example, the probe 12 of the probe card may be damaged or worn at the tip of the probe 12 due to repeated contact with the electrode pads of the LSI chip. At that time, probe 1
The tip of the probe 12 is maintained by polishing or the like. However, by repeating the maintenance of the tip of the probe 12, the length of the tip of the probe 12 protruding from the lower guide plate 18 is shortened, and the effective length of the tip of the probe 12 for connecting to the electrode pad of the LSI chip is reduced. It becomes impossible to maintain. Therefore, in the probe card of this embodiment, a part of the probe 12 from when the shortened length of the tip of the probe 12 is connected to the conductive pattern by the probe adjusting mechanism 20 until it is inserted into the through hole is used as the probe support portion. 14 can be withdrawn. Therefore, the length of the tip of the probe 12 protruding from the lower guide plate 18 can be increased, and the probe 1 can be used for maintenance of the tip of the probe 12 or the like.
2 Even if the tip is shortened, the effective length of the tip of the probe 12 brought into contact with the electrode pad of the LSI chip can be maintained.

As described above, the probe card according to the first embodiment of the present invention is a probe card that is connected to the conductive pattern and inserted into the through hole by providing the probe adjustment mechanism in the configuration of the conventional probe card. Can be pulled into the probe support. Therefore, the length of the probe tip shortened due to breakage, wear, etc. can be increased, and the effective length of the probe tip that is brought into contact with the electrode pad of the LSI chip can be increased. And the use frequency of a probe card can be extended significantly.

FIG. 3 is a schematic cross-sectional view of a vertical probe card according to the second embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of the main part of the vertical probe card according to the second embodiment of the present invention.

As shown in FIG. 3, the vertical probe card according to the second embodiment of the present invention includes a main substrate 10 that is a multi-layered substrate of several tens of layers on which a conductive pattern is formed, and a plurality of members vertically hanging from the main substrate 10. The probe 12 is provided on the back side of the main substrate 10 and supports the probe 12.

The main substrate 10 is a substrate having a conductive pattern formed at the center of the surface. In this embodiment, the probe 12 is directly attached to the central conductive pattern of the main substrate 10, and the probe 12 penetrates the main substrate 10 from the conductive pattern and is suspended from the probe support portion 14 below the main substrate 10. ing.

The probe support portion 14 is provided in parallel to the main substrate 10 and is screwed to and connected to the main substrate 10. The probe support portion 14 supports the probe 12 suspended from the main substrate 10 and has an upper guide plate 16 and a lower guide plate 1 having a through hole through which the probe 12 passes.
8 is provided. The through hole corresponds to the arrangement of the electrode pads of the LSI chip.

Further, the probe support portion 14 is formed with an upper guide plate 16, a lower guide plate 18, and a bent portion 30 that are bent in a substantially U shape in the middle portion of the probe 12 suspended from the main substrate 10. Between them, an intermediate guide plate 52 is provided. The intermediate guide plate 52 is provided with a through hole corresponding to the arrangement of the electrode pads. The through holes of the upper guide plate 16 and the lower guide plate 18 are LS
Corresponding to the electrode pads of the I chip, they are provided on the same straight line. The intermediate guide plate 52 is disposed in parallel with the upper guide plate 16 and the lower guide plate 18, and can be translated along the parallel planes. Therefore, the through hole of the intermediate guide plate 52 through which the probe has passed can be shifted so as not to be collinear with the through holes of the upper guide plate 16 and the lower guide plate 18. A bent portion 30 that is bent into a substantially square shape can be formed.

Therefore, as shown in FIG. 4B, the intermediate guide plate 52 is moved in parallel to bend the bent portion 3.
By loosening the 0 curve, it is possible to adjust the length of the tip of the probe 12 brought into contact with the electrode pad of the LSI chip.

The probe 12 is connected at its rear end to the conductive pattern on the surface of the main substrate 10, passes through the main substrate 10 from the main substrate 10 on which the conductive pattern is formed, passes through the probe support portion 14, and the probe support portion 14. The tip of the probe 12 protrudes from the lower part to contact the electrode pad of the LSI chip. Further, the probe 12 is a contact portion with a sharpened tip, and a rear end is also a sharpened connection portion. In addition, the probe 12 is formed with a bent portion 30 that is bent by the intermediate guide plate 52, and a predetermined contact pressure can be elastically secured between the LSI chip and the electrode pad.

The measurement of the electrical characteristics of the LSI chip using the probe card according to the second embodiment of the present invention configured as described above is the same as that in the first embodiment, and thus the description thereof is omitted.

Next, the use of the probe card according to the second embodiment of the present invention will be described. For example, the probe 12 of the probe card cannot maintain the effective length of the tip of the probe 12 protruding from the lower guide plate 18 due to damage or wear of the tip of the probe 12 as in the first embodiment. Therefore, in the probe card of the present embodiment, as shown in FIG. 4A, the through holes of the intermediate guide plate 52 are formed so as not to be collinear with the through holes of the upper guide plate 16 and the lower guide plate 18. The bent portion 30 is formed by shifting, but as shown in FIG. 4B, the curved portion 30 can be loosened by moving the intermediate guide plate 52 in the direction of the arrow. The length of the tip of the probe 12 protruding from the lower guide plate 18 can be increased. Therefore, even if the tip of the probe 12 becomes shorter due to maintenance of the tip of the probe 12, etc.
The effective length of the tip of the probe 12 brought into contact with the electrode pad of the LSI chip can be maintained.

As described above, the probe card according to the second embodiment of the present invention is provided with the intermediate guide plate for forming the bent portion in the configuration of the conventional probe card, and is damaged by adjusting the curve of the bent portion. The length of the probe tip shortened due to wear or the like can be increased. Therefore, the effective length of the probe tip that is brought into contact with the electrode pad of the LSI chip can be extended, and the number of times the probe card is used can be greatly increased.

Here, by making the lower guide plate 18 and the intermediate guide plate 52 movable in the height direction,
If the distance between the upper guide plate 16 and the lower guide plate 18 and the lower guide plate 18 and the intermediate guide plate 52 can be adjusted, the distance between the upper guide plate 16 and the lower guide plate 18 can be reduced. It is also possible to increase the length of the tip of the probe 12 to be brought into contact with the electrode pad of the chip. At this time, the position of the bent portion 30 of the probe 12 can also be adjusted by adjusting the position of the intermediate guide plate 52.

  FIG. 5 shows a schematic cross-sectional view of a vertical probe card according to Embodiment 3 of the present invention.

The difference of the third embodiment of the present invention from the above embodiments is that, as shown in FIG. 5, an intermediate guide plate which is the configuration of the vertical probe card of the second embodiment is added to the configuration of the vertical probe card of the first embodiment. 52 is provided. In addition, about the structure same as the other Example 1 and Example 2, the same code | symbol is attached | subjected and description is abbreviate | omitted.

That is, as shown in FIG. 5, the first guide plate 22 and the second guide plate 24 are formed between the first guide plate 22 and the second guide plate 24 in order to form a bent portion 30 that is bent in a substantially U shape in the middle part of the probe 12. An intermediate guide plate 52 is provided. Therefore, as in the first embodiment, a part of the probe 12 from being connected to the conductive pattern to being inserted into the through hole can be drawn into the probe support portion 14,
Further, similarly to the second embodiment, the bent portion 30 can be loosened by the intermediate guide plate 52, and the length of the tip of the probe 12 protruding from the lower guide plate 18 can be increased.

Here, the intermediate guide plate 52 is not necessarily provided between the first guide plate 22 and the second guide plate 24. For example, the intermediate guide plate 52 may be provided between the second guide plate 22 and the lower guide plate 48.

The measurement of the electrical characteristics of the LSI chip using the probe card according to the third embodiment of the present invention configured as described above is the same as that in each of the above embodiments, and thus the description thereof is omitted.

Further, since the method for extending the effective length of the probe tip to be brought into contact with the electrode pad of the LSI chip of the probe card according to the third embodiment of the present invention is the same as that in each of the above embodiments, the description thereof is omitted.

As described above, the probe card according to the third embodiment of the present invention is inserted into the through-hole after being connected to the conductive pattern by providing the probe adjustment mechanism in the configuration of the conventional probe card as in the above-described embodiments. A part of the probe until it is done can be pulled into the probe support part. Furthermore, an intermediate guide plate for forming a bent portion is provided in the configuration of the conventional probe card, and the length of the probe tip shortened due to breakage, wear, etc. is increased by adjusting the bending of the bent portion. be able to. Therefore, the effective length of the probe tip that is brought into contact with the electrode pad of the LSI chip can be extended, and the number of times the probe card is used can be greatly increased.

Note that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

1 is a schematic cross-sectional view of a vertical probe card according to Embodiment 1 of the present invention. 1 is a schematic cross-sectional view of a vertical probe card according to Embodiment 1 of the present invention. FIG. 6 is a schematic cross-sectional view of a vertical probe card according to Embodiment 2 of the present invention. FIG. 5 is a schematic cross-sectional view of a main part of a vertical probe card according to Embodiment 2 of the present invention. FIG. 6 is a schematic cross-sectional view of a vertical probe card according to Embodiment 3 of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Main board 12 Probe 14 Probe support part 16 Upper guide plate 18 Lower guide plate 20 Probe adjustment mechanism 22 1st guide plate 24 2nd guide plate 26 Adjustment screw 28, 32 Pillar part 30 Bending part 52 Intermediate guide plate

Claims (5)

A main substrate on which a conductive pattern is formed;
A probe support connected to the main substrate and having a plurality of through holes;
A probe connected to the conductive pattern, inserted into the through hole, and penetrating the probe support;
A probe adjustment mechanism capable of inserting the probe from being connected to the conductive pattern to being inserted into the through hole into the probe support;
A probe card comprising: 2. The probe card according to claim 1, wherein the probe support portion has an intermediate guide plate that curves the probe, and the tip of the probe can be pulled out by adjusting the intermediate guide plate. A main substrate on which a conductive pattern is formed;
A probe support connected to the main substrate and having a plurality of through holes;
A probe connected to the conductive pattern, suspended from the main substrate, and penetrating the probe support from the through hole;
The probe support part has an intermediate guide plate for bending the probe, and the tip of the probe can be pulled out by adjusting the intermediate guide plate. The said probe adjustment mechanism is provided with the 1st guide plate which fixed the said probe, and can adjust the distance of the said 1st guide plate and the said main board | substrate.
The probe card described. The intermediate guide plate can be shifted to a position where the through hole of the intermediate guide plate and the through hole of the probe support portion are not on the same straight line, and the tip of the probe is pulled out by loosening the curve of the probe. The probe card according to claim 2 or 3, wherein

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