JP2008069237A - Electroconductive adhesive - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electroconductive adhesive without requiring a treatment for electrodes and a circuit board after applying an electroconductive adhesive, and suppressing the elevation of resistance under a high temperature and high humidity or under a heat cycle. <P>SOLUTION: This electroconductive adhesive is characterized by containing an adhesive material having an epoxy resin and electroconductive particles, and further containing benzotriazole and/or its derivative, a carboxylic acid compound and an amine compound. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a conductive adhesive suitably used, for example, for bonding an electronic component having a tin-plated electrode to a conductor circuit.

  In general, an electrode of an electronic component is tin-plated for the purpose of preventing corrosion. In addition, many conductive adhesives contain silver powder, copper powder, silver-coated copper powder, and the like as conductive particles. Therefore, when electronic components are bonded to circuit boards using conductive adhesives, galvanic corrosion and Kirkendall void phenomena occur, resulting in a significant increase in connection resistance and high adhesive strength in high-temperature and high-humidity environments and environments where cooling and heating are repeated There was a problem of lowering.

In order to solve such a problem, for example, Patent Document 1 discloses a method of forming a metal oxide layer on the electrode metal surface. Patent Document 2 discloses a method of applying ultrasonic waves through a circuit board after applying a conductive adhesive to an electrode. Further, Patent Document 3 discloses a conductive adhesive containing an epoxy resin having a naphthalene skeleton, an acid anhydride and a phenol resin as curing agents, imidazole as a curing accelerator, and a conductive filler. .
JP 2002-94223 A JP 2003-188505 A JP 2006-124607 A

  However, in the methods described in Patent Documents 1 and 2, it is necessary to perform various treatments on the circuit board after application of the electrode and the conductive adhesive. Moreover, although the conductive adhesive described in Patent Document 3 can suppress an increase in connection resistance under high temperature and high humidity, it is difficult to suppress an increase in resistance under a heat cycle.

  The present invention has been made in view of the above circumstances, and does not require treatment of the circuit board after application of an electrode or a conductive adhesive, and can suppress an increase in resistance under high temperature and high humidity or heat cycle. An object is to provide a conductive adhesive.

As a result of intensive studies, the present inventors have focused on the fact that the resistance increases as the conductive particles contained in the conductive adhesive and the tin-plated electrode are easily rusted under high temperature and high humidity and heat cycles. Then, it discovered that an increase in resistance was suppressed under a heat cycle by containing a benzotriazole, a carboxylic acid compound, and an amine compound in a conductive adhesive, and completed the present invention.
That is, the conductive adhesive of the present invention includes an adhesive material having an epoxy resin and conductive particles, and further contains benzotriazole and / or a derivative thereof, a carboxylic acid compound, and an amine compound. Features.
Here, it is preferable that a phenol resin is included.
The phenol resin is preferably in a liquid state at room temperature.
Furthermore, the epoxy resin is preferably naphthalene-based.
Moreover, it is preferable that the total content of the benzotriazole and / or its derivative, a carboxylic acid compound, and an amine compound is 0.1 to 3.0 parts by mass with respect to 100 parts by mass of the adhesive material.
Furthermore, it is preferable for joining electronic components having tin-plated electrodes on a conductor circuit.

  According to the present invention, it is possible to provide a conductive adhesive that can suppress an increase in resistance under high temperature and high humidity or under a heat cycle without requiring any treatment on the circuit board after applying the electrode or the conductive adhesive. .

Hereinafter, the present invention will be described in detail.
The conductive adhesive of the present invention contains an adhesive material having an epoxy resin and conductive particles, benzotriazole and / or a derivative thereof, a carboxylic acid compound, and an amine compound.

The epoxy resin is contained in the conductive adhesive as a binder, and includes naphthalene-based, phenol novolac-based, cresol novolak-based, dicyclopentadiene-based, and bisphenol A-type, among which naphthalene-based is preferable. These epoxy resins may be used alone or in combination of two or more.
As for content of an epoxy resin, 3-30 mass% is preferable in 100 mass% of adhesive materials, and 5-20 mass% is more preferable. When the lower limit value of the content of the epoxy resin is smaller than the above value, the adhesive strength becomes weak and it becomes difficult to function as an adhesive. On the other hand, when the upper limit value of the content is larger than the above value, the connection of the conductive particles is deteriorated, and it becomes difficult to obtain conductivity.

  As the conductive particles, silver particles, copper particles, silver-plated copper particles, tin-plated copper particles, nickel particles and the like can be used. The shape may be a substantially spherical shape or a flake shape, but a flake shape is preferred. 60-90 mass% is preferable in 100 mass% of adhesive materials, and, as for content of electroconductive particle, 70-85 mass% is more preferable. When the lower limit value of the content of the conductive particles is smaller than the above value, the connection of the conductive particles is deteriorated, and it is difficult to obtain conductivity. On the other hand, when the upper limit of the content is larger than the above value, the adhesive strength is weakened and the cost is increased more than necessary.

Benzotriazole and / or its derivatives include conductive particles contained in the conductive adhesive and tin-plated electrodes (hereinafter sometimes referred to as “tin electrodes”) even under high temperature and high humidity and heat cycles. Contained to prevent rusting.
Examples of the benzotriazole derivative include tolyltriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] benzotriazole, carboxybenzotriazole, and hydroxybenzotriazole, among which tolyltriazole is preferable. These benzotriazole derivatives may be used alone or in combination of two or more.
The content of benzotriazole and / or a derivative thereof is preferably 0.04 to 1.0 part by mass and more preferably 0.05 to 0.8 part by mass with respect to 100 parts by mass of the adhesive material. When the lower limit value of the content of benzotriazole and / or its derivative is smaller than the above value, the resistance under a heat cycle increases. On the other hand, when the upper limit of the content is larger than the above value, the viscosity of the conductive adhesive becomes high, so that dispersion in the adhesive becomes difficult and storage stability is lowered.

  However, since benzotriazole and / or its derivatives react with the above-described epoxy resin, the conductive adhesive is thickened and storage stability is lowered. Moreover, since it reacts with an epoxy resin also when heat-curing a conductive adhesive, the ratio of the benzotriazole in a conductive adhesive reduces, and sufficient rust prevention effect is no longer acquired.

Therefore, when the carboxylic acid compound is contained in the conductive adhesive, the reaction between benzotriazole and / or its derivative and the epoxy resin as described above can be suppressed, so that a decrease in storage stability can be prevented.
Examples of the carboxylic acid compound include octanoic acid, acetic acid, propionic acid, butyric acid, valeric acid, hexanoic acid, lauric acid, adipic acid, benzoic acid, maleic acid, and the like. Among them, octanoic acid is preferable. These carboxylic acid compounds may be used alone or in combination of two or more.
0.03-1.0 mass part is preferable with respect to 100 mass parts of adhesive materials, and, as for content of a carboxylic acid compound, 0.04-0.8 mass part is more preferable. When the lower limit of the content of the carboxylic acid compound is smaller than the above value, it becomes difficult to suppress the reaction between benzotriazole and / or its derivative and the epoxy resin, and the storage stability of the conductive adhesive is lowered. On the other hand, when the upper limit value of the content is larger than the above value, the initial resistance value of the conductive adhesive is increased and the adhesive strength is deteriorated.

  However, since the carboxylic acid compound is acidic, the conductive particles and tin electrode contained in the conductive adhesive are likely to rust when subjected to high temperature and high humidity or heat cycles, resulting in increased resistance.

Therefore, since the conductive adhesive can be adjusted to be neutral by further containing an amine compound, it is possible to prevent rust under high temperature and high humidity and heat cycle as described above, and suppress an increase in resistance.
Examples of the amine compound include triethanolamine, catecholamine, ethylamine, methylethylamine, and trimethylamine, and triethanolamine is preferable. These amine compounds may be used alone or in combination of two or more.
0.03-1.0 mass part is preferable with respect to 100 mass parts of adhesive materials, and, as for content of an amine compound, 0.04-0.8 mass part is more preferable. If the lower limit value of the amine compound content is smaller than the above value, the conductive adhesive cannot be neutrally prepared, and it is difficult to suppress the generation of rust and the increase in resistance. On the other hand, when the upper limit of content becomes larger than the said value, an amine compound and an epoxy resin will react and the storage stability of a conductive adhesive will fall.

  In addition, 0.1-3.0 mass parts is preferable with respect to 100 mass parts of adhesive materials, and, as for the total content of these benzotriazole and / or its derivative (s), a carboxylic acid compound, and an amine compound, 0.5- 2.0 parts by mass is more preferable. When the lower limit of the total content is smaller than the above value, the conductive particles and tin electrode contained in the conductive adhesive are easily rusted under a heat cycle, and as a result, the resistance is increased. On the other hand, when the upper limit value of the content is larger than the above value, the initial resistance value of the conductive adhesive is increased and the adhesive strength is deteriorated.

The conductive adhesive of the present invention may contain a phenol resin. Examples of the phenol resin include a phenol novolak resin, a cresol novolak resin, a dicyclopentadiene phenol resin, a terpene phenol resin, a triphenolmethane resin, a phenol aralkyl resin, and the like, and a phenol novolac resin is particularly preferable. These phenol resins may be used alone or in combination of two or more.
3-15 mass% is preferable in 100 mass% of adhesive materials, and, as for content of a phenol resin, 5-10 mass% is more preferable. If the lower limit of the phenol resin content is smaller than the above value, the strength of the conductive adhesive cannot be sufficiently increased. On the other hand, when the upper limit value of the content is larger than the above value, the resistance under high temperature and high humidity or heat cycle increases.

Furthermore, the phenol resin is preferably liquid at room temperature. As a result, a normal adhesive often contains a solvent, but in the present invention, the conductive adhesive can be a solventless adhesive without using a solvent described later.
In addition, 15N or more is preferable and, as for the adhesive strength at the time of setting it as an electrically conductive adhesive, the more preferable adhesive strength is 40N or more.

  The conductive adhesive of the present invention may appropriately contain optional components such as a reactive diluent and a curing agent as long as the effects of the present invention are not impaired. Further, water may be contained in order to dissolve the above-described benzotriazole and / or its derivative. Further, a solvent may be included.

Examples of reactive diluents include ethylene glycol diglycidyl ether, 2-ethylhexyl glycidyl ether, glycidyl methacrylate, cyclohexane dimethanol diglycidyl ether, trimethylolpropane triglycidyl ether, neopentyl glycol diglycidyl ether, phenyl glycidyl ether, polyethylene glycol diester. Examples thereof include glycidyl ether and polypropylene glycol diglycidyl ether. These reactive diluents may be used alone or in combination of two or more.
1-15 mass% is preferable in 100 mass% of adhesive materials, and, as for content of a reactive diluent, 2-10 mass% is more preferable.
Any curing agent may be used as long as it can cure the epoxy resin, and examples thereof include amine-based epoxy curing agents, acid anhydride-based epoxy curing agents, and imidazole-based epoxy curing agents.
As for content of a hardening | curing agent, 0.1-3.0 mass% is preferable in 100 mass% of adhesive materials, and 0.5-2.0 mass% is more preferable.

  The solvent is not particularly limited as long as it is used for an adhesive, and a known solvent may be used. However, in the present invention, as described above, it is preferable to include a reactive diluent or a phenol resin that is liquid at room temperature in the conductive adhesive, and in this case, solvent-free adhesion is possible without using a solvent. It can be used as an agent.

The conductive adhesive of the present invention comprises the above-described adhesive material having an epoxy resin and conductive particles, benzotriazole and / or a derivative thereof, a carboxylic acid compound, and an amine compound using a planetary mixer, a roll mill, or the like. It is obtained by mixing.
70-300 degreeC is preferable and, as for the glass transition temperature (Tg) after heat-curing the conductive adhesive obtained in this way, 85-250 degreeC is more preferable.

In addition, the conductive adhesive contains benzotriazole and / or a derivative thereof, a carboxylic acid compound, and an amine compound as described above, so that processing to the circuit board after applying the electrode or the conductive adhesive is performed. Even if not performed, the phenomenon of galvanic corrosion and Kirkendall void can be prevented, and the increase in resistance under high temperature and high humidity or heat cycle can be suppressed.
Such a conductive adhesive can be used for various applications, and is particularly suitable for bonding an electronic component having a tin-plated electrode to a conductor circuit.

  EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these.

<Example 1>
(Manufacture of conductive adhesive)
In the compounding amounts shown in Table 1, naphthalene type epoxy resin (manufactured by Dainippon Ink and Chemicals, "Epicron HP-4700") as epoxy resin, and flake silver ("SF-86" made by Fellow) as conductive particles, Phenol novolak resin (Maywa Kasei, “MEH8005”) as phenolic resin, ethylene glycol diglycidyl ether (manufactured by Nagase Chemtech, “Denacol EX-810”) as reactive diluent, and imidazole-based epoxy curing as curing agent Agent (Shikoku Kasei Kogyo Co., Ltd., “Curazole 2P4MHZ”), benzotriazole, octanoic acid as a carboxylic acid compound, triethanolamine as an amine compound, and water were mixed by a roll mill to produce a conductive adhesive. .

  Next, using the obtained conductive adhesive, 50 chip resistors (KOA, “RK73Z”) having electrodes plated with tin on a copper circuit board (made by Nikkan Kogyo) were placed in series, A glass epoxy substrate was prepared by heating and curing at 200 ° C. for 10 minutes and bonding.

(Evaluation)
The storage stability and adhesive strength of the conductive adhesive were evaluated.
For storage stability, the conductive adhesive was allowed to stand at −25 ° C. for 3 months, and the viscosity at 23 ° C. was measured with a BM type rotational viscometer. In addition, as a criterion, the viscosity within 20% of the increase from the initial viscosity was regarded as good and indicated by ◯ and X.
The adhesive strength was measured by using a bond tester (manufactured by Nishishin Shoji, “SS-30WD”) at the chip resistance junction of the obtained glass epoxy substrate.
The results are shown in Table 1.

(Measurement of resistance value)
The initial resistance of the electrode was measured using a digital multimeter (manufactured by Advantest).
In the heat resistance test, the resistance of the electrode after being allowed to stand for 500 hours in an environment of 150 ° C. was measured.
In the test of high temperature and high humidity, the resistance of the electrode after being left for 500 hours in an environment of 85 ° C. and 85% RH was measured.
In the heat cycle test, an operation of leaving at -65 ° C. for 30 minutes, then leaving at room temperature for 5 minutes, then leaving at 125 ° C. for 30 minutes, and then leaving at room temperature for 5 minutes is one cycle. The electrode resistance after 500 cycles of this was measured.
Table 1 shows the resistance values. As a determination criterion, a resistance value within 10 times the initial resistance value is considered good.

<Examples 2 to 4>
Except having changed the compounding quantity of each component into the quantity shown in Table 1, the conductive adhesive was manufactured similarly to Example 1 and the glass epoxy board | substrate was produced.
Various evaluations and resistance values were measured. The results are shown in Table 1.

<Comparative Examples 1-4>
Except having changed the compounding quantity of each component into the quantity shown in Table 1, the conductive adhesive was manufactured similarly to Example 1 and the glass epoxy board | substrate was produced. However, the tin-plated copper powder (manufactured by Nikko Materials) used in Comparative Example 4 has a mass ratio of tin and copper of 20:80 and a particle size of 10 μm.
Various evaluations and resistance values were measured. The results are shown in Table 1.

As apparent from Table 1, the conductive adhesives of Examples 1 to 3 had good storage stability and adhesive strength. Further, even under the heat resistance, high temperature and high humidity, and heat cycle environments, there was almost no increase in resistance compared to the initial resistance. In addition, the conductive adhesive of Example 4 also had good storage stability, and there was almost no increase in resistance compared to the initial resistance even in each environment of heat resistance, high temperature and high humidity, and heat cycle. However, since no phenol resin was contained, the adhesive strength was low compared to other examples.
On the other hand, since the conductive adhesive of Comparative Example 1 did not contain benzotriazole, carboxylic acid compound, and amine compound, the resistance was remarkably increased in each environment of high temperature and high humidity and heat cycle.
Since the conductive adhesive of Comparative Example 2 does not contain a carboxylic acid compound and an amine compound, benzotriazole reacts with the epoxy resin, so that the storage stability is poor, and the resistance increases remarkably under high temperature and high humidity and heat cycle. did.
Since the conductive adhesive of Comparative Example 3 contains benzotriazole and a carboxylic acid compound, the benzotriazole and the epoxy resin did not react and storage stability was good, but the amine compound was not contained. The particles were easily rusted, and the resistance increased remarkably in each environment of high temperature and high humidity and heat cycle.
Although the conductive adhesive of Comparative Example 4 is effective in each environment of heat resistance and high temperature and high humidity, it does not contain benzotriazole, a carboxylic acid compound, and an amine compound. It rose significantly.
As described above, the conductive adhesive of the present invention realizes a characteristic of maintaining a stable resistance value and adhesive strength in an environmental test of heat resistance, high temperature and high humidity, and heat cycle for an electronic component having a tin-plated electrode. it can.

Claims (6)

Including an adhesive material having an epoxy resin and conductive particles;
Furthermore, a conductive adhesive comprising benzotriazole and / or a derivative thereof, a carboxylic acid compound, and an amine compound.   The conductive adhesive according to claim 1, comprising a phenol resin.   The conductive adhesive according to claim 2, wherein the phenol resin is liquid at room temperature.   The conductive adhesive according to claim 1, wherein the epoxy resin is naphthalene-based.   The total content of the benzotriazole and / or its derivative, a carboxylic acid compound, and an amine compound is 0.1 to 3.0 parts by mass with respect to 100 parts by mass of the adhesive material. The conductive adhesive in any one of 1-4. The conductive adhesive according to any one of claims 1 to 5, wherein the conductive adhesive is used for joining an electronic component having a tin-plated electrode to a conductor circuit.