JP2008066600A - Conductive paste, laminate ceramic electronic component, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide conductive paste used to form an internal electrode of a laminate ceramic electronic component and capable of effectively preventing a sheet attack when a ceramic green sheet is thinned. <P>SOLUTION: The conductive paste to be used to form the internal electrode of the laminate ceramic electronic component includes conductive powder and an organic vehicle. An organic binder in the organic vehicle mainly contains one or more selected among ethyl cellulose resin, alkyd resin and acrylate resin. A solvent in the organic vehicle mainly contains propylene glycol diacetate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a conductive paste used for forming internal electrodes of a multilayer ceramic electronic component, a multilayer ceramic electronic component manufactured using the paste, and a method for manufacturing the electronic component.

  In recent years, electronic devices are becoming lighter, thinner, and smaller. Along with this, further miniaturization and higher capacity have been promoted in the multilayer ceramic electronic parts used in the electronic devices.

  The most effective method for reducing the size and increasing the capacity of a multilayer ceramic capacitor as an example of a multilayer ceramic electronic component is to make both the internal electrode and the dielectric layer as thin as possible (thinning), and to Is laminated as much as possible (multilayering).

  A multilayer ceramic capacitor is a ceramic green sheet mainly composed of a ceramic powder represented by barium titanate and a binder, and a conductive paste for forming internal electrodes is printed in a predetermined pattern and laminated, and then fired simultaneously. It is manufactured by integrally sintering and finally forming external electrodes.

  As the conductive paste for forming the internal electrode, a paste obtained by dispersing conductive powder in an organic vehicle in which an organic binder is dissolved in a solvent is used. As the organic binder in the organic vehicle, for example, ethyl cellulose or the like has been used, and as the solvent in the organic vehicle, terpineol or the like has been used.

  However, if a conductive paste using terpineol as a solvent is printed on a ceramic green sheet, it may cause problems such as blurring, and a thin electrode pattern with a predetermined thickness can be formed. There wasn't.

  In addition, when a conductive paste using terpineol as a solvent is used in combination with a ceramic green sheet using butyral resin as an organic binder, the solvent in the conductive paste causes the organic binder in the ceramic green sheet to swell or dissolve. The so-called “sheet attack” phenomenon occurs.

  Such a sheet attack phenomenon is not a practical problem as long as the ceramic green sheet is relatively thick. However, when the thickness of the ceramic green sheet is as thin as 5 μm or less, for example, if a sheet attack phenomenon occurs, the ceramic green sheet peels off when the ceramic green sheet is peeled off from a carrier sheet such as a PET film after printing the conductive paste. It becomes difficult. When the ceramic green sheet is difficult to peel off, wrinkles, holes, cracks, etc. occur in the ceramic green sheet due to this influence, and a normal laminate cannot be obtained in the lamination process. If a normal laminated body cannot be obtained, the final multilayer ceramic electronic component may have short-circuit failure, breakdown voltage failure (IR degradation), or delamination phenomenon (delamination) between the dielectric layer and the internal electrode layer. Occurred, leading to a decrease in yield.

  Therefore, in recent years, several measures for improving the seat attack phenomenon have been proposed. For example, Patent Documents 1 and 2 propose that a solvent having a relatively low compatibility with butyral is used as a solvent for a conductive paste for forming an internal electrode. Specifically, Patent Document 1 proposes a conductive paste using dihydroterpineol, and Patent Document 2 proposes a conductive paste using dihydroterpinyl acetate.

  However, even when these dihydroterpineols and dihydroterpinyl acetates are used as a solvent, not a few sheet attack phenomena occur, resulting in variations in the thickness of the ceramic green sheets. Due to this thickness variation, there has been a problem that short-circuit failure and withstand voltage failure (IR deterioration) are worsened, and delamination occurs. For this reason, the conventional conductive paste has a limit in further reducing the size and capacity of the multilayer ceramic capacitor. In addition, these dihydroterpineol and dihydroterpinyl acetate have low solubility in ethyl cellulose used as an organic binder, and therefore, pastes obtained using these solvents have problems such as variations in printing thickness. was there.

Japanese Patent Laid-Open No. 9-17687 Japanese Patent No. 2976268

  An object of the present invention is to provide a conductive paste that can be used to form an internal electrode of a multilayer ceramic electronic component and can effectively prevent sheet attack even when the thickness of the ceramic green sheet is reduced. It is to be. The present invention also provides a multilayer ceramic electronic component manufactured using such a conductive paste, having a low short-circuit defect rate, a high withstand voltage, and effectively preventing delamination (delamination). Another object of the present invention is to provide a method for manufacturing the electronic component.

  The present inventors use propylene glycol diacetate as a solvent to be included in the conductive paste, thereby allowing a resin (for example, ethyl cellulose resin, alkyd resin, acrylic resin) contained as a binder in the conductive paste. Even when the ceramic green sheet is thinned while being well dissolved, sheet attack is effectively prevented not only at room temperature but also at the solvent drying temperature (for example, 40 to 90 ° C.). As a result, the present invention has been completed.

That is, according to the present invention, a conductive paste used to form an internal electrode of a multilayer ceramic electronic component,
Including conductive powder and organic vehicle;
The organic binder in the organic vehicle is mainly composed of one or more selected from ethyl cellulose resin, alkyd resin and acrylic resin,
Solvent in the organic vehicle, a conductive paste, characterized in that a main component of propylene glycol diacetate _{(CH 3 COOCH 2 CHCH 3 COOCCH} 3) is provided.

  Preferably, the solvent in the organic vehicle is contained in an amount of 50 to 200 parts by weight with respect to 100 parts by weight of the conductive powder.

  Preferably, the conductive paste is used in combination with a ceramic green sheet having a thickness of 5 μm or less containing butyral resin.

  Preferably, the organic binder in the organic vehicle is contained in an amount of 1 to 10 parts by weight with respect to 100 parts by weight of the conductive powder.

  In the conductive paste of the present invention, the conductive powder may be any powder that can withstand the firing temperature and atmosphere when fired simultaneously with the ceramic green sheet. For example, when the multilayer ceramic electronic component is a multilayer ceramic capacitor, a simple substance such as Ag, Pd, or Ni, a mixture thereof, or an alloy powder can be used, and it is particularly preferable that Ni or Ni alloy is the main component. When the multilayer ceramic electronic component is a multilayer ceramic substrate, a single substance such as Ag, Pd, or Cu, a mixture thereof, or an alloy powder can be used.

  The conductive paste according to the present invention may contain additives such as a plasticizer and a dispersant as necessary.

According to the present invention, a green ceramic in which a plurality of ceramic green sheets having a thickness of 5 μm or less containing a butyral resin and electrode layers formed in a predetermined pattern using any one of the above conductive pastes are alternately stacked. Manufactured using laminates,
A multilayer ceramic electronic component having an internal electrode layer and a dielectric layer having a thickness of 3 μm or less is provided.

  Furthermore, according to the present invention, a green ceramic in which a plurality of ceramic green sheets having a thickness of 5 μm or less containing a butyral resin and electrode layers formed in a predetermined pattern using any one of the conductive pastes are alternately stacked. A method for manufacturing a multilayer ceramic electronic component for firing a multilayer body is provided.

  In the present invention, propylene glycol diacetate used as a solvent for the conductive paste does not dissolve or swell the butyral resin contained as an organic binder in the ceramic green sheet. For this reason, sheet attack can be effectively prevented by using the conductive paste using these solvents. For this reason, even when the thickness of the ceramic green sheet is reduced to, for example, 5 μm or less, the peelability of the ceramic green sheet is improved when the ceramic green sheet is peeled off from the carrier sheet such as a PET film after printing the conductive paste. In addition, the generation of wrinkles, holes, cracks, etc. in the ceramic green sheet can be effectively suppressed. That is, even if the ceramic green sheet is made thinner than before, the sheet attack phenomenon does not occur. As a result, even when a very thin ceramic green sheet having a thickness of 5 μm or less is applied, a normal laminate can be obtained. In the final multilayer ceramic electronic component, short circuit failure, withstand voltage failure (IR degradation), dielectric layer The possibility of causing delamination between the electrode layer and the internal electrode layer is reduced.

  Furthermore, propylene glycol diacetate has the property of not causing sheet attack not only at room temperature but also at the drying temperature of the solvent (for example, 40 to 90 ° C.). That is, according to the present invention, it is possible to prevent the occurrence of sheet attack when the solvent is dried. In particular, when a conventional solvent (for example, dihydroterpineol or dihydroterpinyl acetate) is used, even when sheet attack does not occur much at room temperature, for example, when the temperature is increased to 40 to 90 ° C. There is a problem that sheet attack occurs remarkably. On the other hand, according to the present invention, since no sheet attack occurs even at such a relatively high temperature, it is possible to prevent the occurrence of sheet attack in the solvent drying process. The reliability of the multilayer ceramic electronic component can be further increased. Furthermore, since the drying temperature of the solvent can be made relatively high, the production efficiency can be improved.

In addition to the above, propylene glycol diacetate sufficiently dissolves ethyl cellulose resin, alkyd resin, and acrylic resin that are generally used as an organic binder for conductive paste (good rheology). That is, the solubility with respect to these resin is high.
In general, the level of solubility can be determined by, for example, tan δ. Tan δ is an index for determining dynamic viscoelasticity, and the lower the tan δ value, the more elastic and less leveling, while the higher the tan δ value, the more inelastic and easier to level. It is considered that the larger tan δ, the better the dynamic viscoelasticity, that is, the better the leveling property and the higher the solubility. The propylene glycol diacetate used in the present invention has a property that tan δ is higher and superior compared to terpineol, dihydroterpineol, dihydroterpinel acetate, and terpinyl acetate. It exhibits sufficient solubility for the above-mentioned resin.

From the above, the conductive paste of the present invention is extremely useful for reducing the size and increasing the capacity of the final multilayer ceramic electronic component.
That is, according to the present invention, a conductive paste that is used to form an internal electrode of a multilayer ceramic electronic component and does not cause a sheet attack, and manufactured using this conductive paste, has a low short-circuit defect rate and high A multilayer ceramic electronic component having a withstand voltage and effectively preventing delamination, and a method for manufacturing the multilayer ceramic electronic part can be provided.

  The multilayer ceramic electronic component according to the present invention is not particularly limited, and examples thereof include a multilayer ceramic capacitor, a multilayer ceramic inductor, a multilayer ceramic LC component, and a multilayer ceramic substrate.

Hereinafter, the present invention will be described based on embodiments shown in the drawings.
FIG. 1 is a cross-sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention.
FIG. 2 (A) to FIG. 2 (D) are photomicrographs showing the compatibility of the solvent contained in the conductive pastes according to Examples and Comparative Examples of the present invention with respect to ceramic green sheets at room temperature,
FIGS. 3A to 3C are photographs showing the compatibility of the solvent contained in the conductive pastes according to Examples and Comparative Examples of the present invention with respect to the ceramic green sheet under the condition of a temperature of 50 ° C.

  In the present embodiment, a multilayer ceramic capacitor will be described as an example of a multilayer ceramic electronic component.

Multilayer Ceramic Capacitor As shown in FIG. 1, a multilayer ceramic capacitor 1 according to an embodiment of the present invention includes a capacitor body 10 having a configuration in which dielectric layers 2 and internal electrode layers 3 are alternately stacked. A pair of external electrodes 4, 4 are formed at both ends of the capacitor body 10 and are electrically connected to the internal electrode layers 3 arranged alternately in the body 10. The internal electrode layers 3 are laminated so that the side end faces are alternately exposed on the surfaces of the two opposite ends of the capacitor body 10. The pair of external electrodes 4, 4 are formed at both ends of the capacitor body 10 and are connected to the exposed end surfaces of the alternately arranged internal electrode layers 3 to constitute a capacitor circuit.

  The outer shape and dimensions of the capacitor body 10 are not particularly limited and can be appropriately set depending on the application. Usually, the outer shape is substantially a rectangular parallelepiped shape, and the dimensions are usually vertical (0.4 to 5.6 mm) × It can be about horizontal (0.2-5.0 mm) × height (0.2-1.9 mm).

  The dielectric layer 2 is formed by firing a ceramic green sheet, which will be described later, and the material thereof is not particularly limited. For example, the dielectric layer 2 is made of a dielectric material such as calcium titanate, strontium titanate and / or barium titanate. . In this embodiment, the thickness of the dielectric layer 2 is preferably 3 μm or less, more preferably 2 μm or less.

  The internal electrode layer 3 is formed by firing a conductive paste having a predetermined pattern which will be described later. The thickness of the internal electrode layer 3 is preferably reduced to 2 μm or less, more preferably 1 μm or less.

  As the material of the external electrode 4, copper, a copper alloy, nickel, a nickel alloy, or the like is usually used, but silver, a silver-palladium alloy, or the like can also be used. The thickness of the external electrode 4 is not particularly limited, but is usually about 10 to 50 μm.

Method for Manufacturing Multilayer Ceramic Capacitor Next, an example of a method for manufacturing the multilayer ceramic capacitor 1 according to this embodiment will be described.

Preparation of Dielectric Paste (1) First, a dielectric paste is prepared in order to manufacture a ceramic green sheet that will constitute the dielectric layer 2 shown in FIG. 1 after firing.
In this embodiment, the dielectric paste is composed of an organic solvent-based paste obtained by kneading ceramic powder (dielectric material) and an organic vehicle.

  The ceramic powder can be appropriately selected from various compounds to be complex oxides or oxides, such as carbonates, nitrates, hydroxides, organometallic compounds, and the like, and can be used as a mixture. The ceramic powder is usually used as a powder having an average particle size of 0.4 μm or less, preferably about 0.1 to 3.0 μm. In order to form a very thin ceramic green sheet, it is desirable to use a powder finer than the thickness of the ceramic green sheet.

  In this embodiment, polyvinyl butyral is used as the organic binder used in the organic vehicle. The degree of polymerization of the polyvinyl butyral is preferably 300 to 2400, more preferably 500 to 2000. The degree of butyralization of the resin is preferably 50 to 81.6%, more preferably 63 to 80%, and the amount of residual acetyl groups is preferably less than 6%, more preferably 3% or less. In the present embodiment, the organic binder may be partly acetalized with acetaldehyde.

  The organic solvent used in the organic vehicle is not particularly limited, and terpineol, butyl carbitol, acetone, toluene and the like are used.

  Content of each component in a dielectric paste is not specifically limited, For example, a dielectric paste can be prepared so that about 1 to about 50 weight% of solvent may be included.

  The dielectric paste may contain additives selected from various dispersants, plasticizers, dielectrics, subcomponent compounds, glass frit, insulators, and the like, if necessary. When these additives are added to the dielectric paste, the total content is desirably about 10% by weight or less.

  In this embodiment, since polyvinyl butyral is used for the organic binder in the organic vehicle, the plasticizer content in this case is preferably about 25 to about 100 parts by weight with respect to 100 parts by weight of the binder.

Formation of ceramic green sheet (2) Next, using this dielectric paste, it is preferably 0.5 to 30 μm, more preferably 0.5 to 10 μm, still more preferably on the carrier sheet by a doctor blade method or the like. A ceramic green sheet is formed with a thickness of about 0.5 to 5 μm. The ceramic green sheet becomes the dielectric layer 2 shown in FIG. 1 after firing.

  As the carrier sheet, for example, a PET film or the like is used, and a film coated with silicone or the like is preferable in order to improve peelability. Although the thickness of a carrier sheet is not specifically limited, Preferably it is 5-100 micrometers.

  The ceramic green sheet is dried after being formed on the carrier sheet. The drying temperature of the ceramic green sheet is preferably 50 to 100 ° C., and the drying time is preferably 1 to 20 minutes.

  The thickness of the ceramic green sheet after drying shrinks to a thickness of 5 to 25% compared with that before drying. In this embodiment, the thickness of the ceramic green sheet after drying is 5 μm or less, preferably 3 μm or less, and more preferably 1.5 μm or less. This is in order to meet the demand for thinner layers in recent years.

Preparation of Conductive Paste (3) Next, a conductive paste is prepared in order to manufacture an electrode layer (internal electrode pattern) having a predetermined pattern that will form the internal electrode layer 3 shown in FIG. 1 after firing.
The conductive paste used in the present embodiment contains a conductive powder and an organic vehicle.

  Although it does not specifically limit as electroconductive powder, It is preferable to comprise by at least 1 sort (s) chosen from Cu, Ni, and these alloys, More preferably, it comprises Ni or Ni alloy, and also these mixtures. .

  Ni or an Ni alloy is preferably an alloy of Ni and at least one element selected from Mn, Cr, Co, Al, Pt, Au, Ru, Rh, Re, Ir, and Os. Further, the Ni content in the alloy is preferably 95% by weight or more. In addition, in Ni or Ni alloy, various trace components, such as P, Fe, and Mg, may be contained about 0.1 wt% or less.

  Such a conductive powder is not particularly limited in shape, such as spherical or flake shaped, and may be a mixture of these shapes. As for the particle diameter of the conductive powder, in the case of a spherical shape, an average particle diameter of 0.5 μm or less, preferably about 0.01 to 0.4 μm is used. This is to realize the thinning more surely.

  The conductive powder is preferably contained in the conductive paste at 30 to 60% by weight, more preferably 40 to 50% by weight.

  The organic vehicle contains an organic binder and a solvent as main components.

  In this embodiment, the organic binder is mainly composed of ethyl cellulose resin, alkyd resin, or acrylic resin. These may be used in combination. The content of ethyl cellulose resin, alkyd resin and acrylic resin in the organic binder is preferably 95% by weight or more, more preferably 100% by weight.

  The organic binder is preferably contained in the conductive paste in an amount of 1 to 10 parts by weight with respect to 100 parts by weight of the conductive powder. If the amount of the binder is too small, the film strength after printing tends to decrease. If the amount is too large, the metal filling density of the electrode pattern before firing decreases, and the smoothness of the internal electrode formed after firing is maintained. I can't.

Solvent, as a main component propylene glycol diacetate _{(CH 3 COOCH 2 CHCH 3 COOCCH} 3). The content of propylene glycol diacetate in the solvent is preferably 95% by weight or more, more preferably 100% by weight, based on 100% by weight of the whole solvent. Examples of the solvent that can be used in combination with propylene glycol diacetate in a trace amount include terpineol and dihydroterpineol.

  The propylene glycol diacetate used as a solvent in this embodiment sufficiently dissolves ethyl cellulose resin, alkyd resin, and acrylic resin as an organic binder (the tan δ, which is an index for judging dynamic viscoelasticity, is large). Can do that.) That is, the solubility with respect to these resin is high, and the obtained electrically conductive paste can be made stable.

  The solvent is preferably contained in the conductive paste in an amount of 50 to 200 parts by weight, more preferably 80 to 100 parts by weight with respect to 100 parts by weight of the conductive powder. If the amount of the solvent is too small, the paste viscosity becomes too high, and if it is too much, the paste viscosity becomes too low.

  The total content of the organic binder and the solvent in the organic vehicle is preferably 95% by weight or more, and more preferably 100% by weight. There are plasticizers, leveling agents and the like that can be contained in an organic vehicle together with an organic binder and a solvent, although only in a very small amount.

  The conductive paste may contain the same ceramic powder as the ceramic powder contained in the dielectric paste as a co-material. The common material has an effect of suppressing the sintering of the conductive powder in the firing process. The ceramic powder (co-material) is preferably contained in the conductive paste in an amount of 5 to 30 parts by weight with respect to 100 parts by weight of the conductive powder. If the amount of the co-material is too small, the sintering suppressing effect of the conductive powder is lowered, the lineability (continuity) of the internal electrode is deteriorated, and the apparent dielectric constant is lowered. On the other hand, if the amount of the co-material is too large, the lineability of the internal electrode tends to deteriorate and the apparent dielectric constant tends to decrease.

  In order to improve adhesion, the conductive paste may contain a plasticizer. Examples of the plasticizer include phthalic acid esters such as benzylbutyl phthalate (BBP), adipic acid, phosphoric acid esters, glycols, and the like. In the present embodiment, preferably, dioctyl adipate (DOA), butyl butylene glycol phthalate (BPBG), didodecyl phthalate (DDP), dibutyl phthalate (DBP), benzyl butyl phthalate (BBP), dioctyl phthalate ( DOP), dibutyl sebacate and the like are used. Of these, dioctyl phthalate (DOP) is particularly preferable. The plasticizer is contained in an amount of preferably 25 to 150 parts by weight, more preferably 25 to 100 parts by weight with respect to 100 parts by weight of the organic binder in the organic vehicle. By adding the plasticizer, the adhesive force of the electrode layer formed using the paste is increased, and the adhesive force between the electrode layer and the ceramic green sheet is improved. In order to obtain such an effect, the amount of the plasticizer added is preferably 25 parts by weight or more. However, if the addition amount exceeds 150 parts by weight, it is not preferable because excess plasticizer oozes out from the electrode layer formed using the paste.

  The conductive paste can be obtained by kneading the above components with a ball mill or the like to form a slurry.

Formation of Electrode Layer (4) Next, using this conductive paste, an electrode layer (in a predetermined pattern) that becomes the internal electrode layer 3 shown in FIG. 1 is formed on the surface of the ceramic green sheet formed on the carrier sheet after firing. Internal electrode pattern) is formed.

  The thickness of the electrode layer is 2 μm or less, preferably 0.5 to 1.5 μm. If the thickness of the electrode layer is too thick, the number of stacked layers must be reduced, the acquired capacity is reduced, and it is difficult to increase the capacity. On the other hand, if the thickness is too thin, it is difficult to form uniformly, and electrode breakage is likely to occur.

  The thickness of the electrode layer is in the above range in the current technology, but it is more desirable that the thickness of the electrode layer is as thin as possible without causing electrode breaks.

The method for forming the electrode layer using the conductive paste is not particularly limited as long as the layer can be formed uniformly. In this embodiment, a screen printing method is used.
Specifically, first, a conductive paste is printed in a predetermined pattern on the surface of the ceramic green sheet produced as described above by screen printing to form an electrode paste film before drying. And in order to remove the solvent contained in this electrode paste film | membrane, it drys on the conditions of temperature 40-90 degreeC, and is set as the electrode layer (internal electrode pattern) before baking.

In this embodiment, since a conductive paste containing propylene glycol diacetate is used as a solvent, a sheet attack (that is, a sheet attack at room temperature) to a ceramic green sheet during electrode paste film formation by screen printing is performed. In addition to being able to prevent, it is also possible to effectively prevent sheet attack when the electrode paste film is dried (that is, sheet attack under high temperature conditions). Therefore, even when the thickness of the ceramic green sheet is 5 μm or less, preferably 3 μm or less, and more preferably 1.5 μm or less, a normal laminate can be obtained, and the final multilayer ceramic capacitor 1 has a short circuit resistance and resistance. There is less risk of voltage failure (IR degradation) and delamination between the dielectric layer 2 and the internal electrode layer 3 (delamination).
In addition, since the sheet attack under high temperature conditions can be prevented, the drying temperature of the solvent can be made relatively high, and the production efficiency can be improved.

Preparation of Green Chip, baking, etc. (4) Next, above that, by stacking a plurality of ceramic green sheets on which the electrode paste layer is formed on the surface of the predetermined pattern, to produce a green chip and subjected to binder removal step, The external electrodes 4 and 4 are formed by printing or transferring the external electrode paste onto the capacitor body 10 composed of a sintered body, which is formed through a firing process and an annealing process performed as necessary, and firing. Thus, the multilayer ceramic capacitor 1 is manufactured.

Other Embodiments The embodiment of the present invention has been described above. However, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. it can.

  For example, in the above-described embodiment, the multilayer ceramic capacitor is exemplified as the multilayer ceramic electronic component according to the present invention. However, the multilayer ceramic electronic component according to the present invention is not limited to the multilayer ceramic capacitor, and may be applied to a multilayer ceramic substrate or the like. Of course, it can be applied.

  Hereinafter, although this invention is demonstrated based on a more detailed Example, this invention is not limited to these Examples.

Example 1
First, a dielectric paste for forming a ceramic green sheet was produced.

Preparation of Dielectric Paste BaTiO ₃ -based ceramic powder, polyvinyl butyral (PVB) as an organic binder, and methanol as a solvent were prepared. Next, 10 parts by weight of an organic binder and 150 parts by weight of a solvent were weighed with respect to 100 parts by weight of the ceramic powder, kneaded with a ball mill, and slurried to obtain a dielectric paste.

Preparation of Ceramic Green Sheet The dielectric paste was applied to a predetermined thickness on a PET film by a doctor blade method and dried to form a ceramic green sheet having a dried thickness of 1.5 μm.

Compatibility test between solvent and ceramic green sheet (room temperature, dripping)
The ceramic green sheet produced above was peeled off from the PET film, and then stuck on the slide glass with a double-sided tape. Next, each solvent shown in Table 1 is dropped on the ceramic green sheet attached on the slide glass under room temperature (25 ° C.) conditions, and then the solvent is naturally dried at room temperature. The compatibility at room temperature was evaluated by observing the surface with a microscope. Each solvent was dropped by first dipping the tip of the wire into the solvent and then dropping the dipped solvent onto the sheet.
As the solvent, each of the solvents shown in Table 1 below was used, and micrographs of the surface of the ceramic green sheet after each solvent was dropped are shown in the respective drawings described in Table 1.

  From FIG. 2 (B) to FIG. 2 (D), on the ceramic green sheet, terpineol (FIG. 2 (B)), dihydroterpineol (FIG. 2 (C)), dihydroterpinyl acetate (FIG. 2 (D)). In the case of dripping, the ceramic green sheet swelled and wrinkles occurred over a wide area of the ceramic green sheet surface.

  On the other hand, from FIG. 2A, it can be confirmed that when propylene glycol diacetate is used as the solvent, the ceramic green sheet does not swell.

Compatibility test between solvent and ceramic green sheet (50 ℃, immersion)
The ceramic green sheet produced above was immersed in each solvent shown in Table 2 in a state where it was formed on the PET film (each solvent was put in a predetermined sample bottle in advance). Next, the soaked sheet was placed in a constant temperature bath at a temperature of 50 ° C. and left for 4 hours. Then, the sample bottle containing each sheet sample was taken out from the thermostat, and the state of each sheet sample after being left at 50 ° C. for 4 hours was observed.
As the solvents, the respective solvents shown in Table 2 below were used, and photographs of the ceramic green sheets after being immersed in the respective solvents are shown in the respective drawings described in Table 2.

  From FIG. 3 (B) and FIG. 3 (C), when the ceramic green sheet was immersed in terpineol (FIG. 3 (B)) and dihydroterpineol (FIG. 3 (C)) at 50 ° C., The ceramic green sheet swelled and peeled off from the PET film.

  On the other hand, from FIG. 3 (A), when propylene glycol diacetate is used, it can be confirmed that no swelling occurs even when the ceramic green sheet is immersed at 50 ° C.

  From the above results, propylene glycol diacetate has extremely low compatibility with the butyral resin as an organic binder used for the ceramic green sheet. In particular, not only room temperature conditions but also high temperature conditions (50 ° C. in this example). It can also be confirmed that the sheet attack can be effectively prevented.

Example 2
Preparation of organic vehicle Ethyl cellulose as an organic binder and the solvents shown in Table 3 were prepared.
Next, 10 parts by weight of an organic binder was dissolved with respect to 100 parts by weight of the solvent to produce an organic vehicle.

Evaluation of tan δ Tan δ (dynamic viscoelasticity) is a tan δ value obtained when a stress of 10 Pa is applied to the obtained organic vehicle under the condition of a frequency of 0.628 rad / s. , Manufactured by Eihiro Seiki Co., Ltd.). The results are shown in Table 3. The lower the tan δ value, the more elastic and less leveling, while the higher the tan δ value, the more inelastic and easy to level. Therefore, it is considered that the larger the tan δ value, the better the dynamic viscoelasticity, that is, the better the leveling property and the higher the solubility.

  As shown in Table 3, the sample using propylene glycol diacetate has a higher tan δ than any sample using terpineol, dihydroterpineol, dihydroterpinyl acetate and terpinyl acetate. I can confirm. That is, it can be confirmed that propylene glycol diacetate exhibits high solubility in ethyl cellulose.

Example 3
Production of Conductive Paste An organic vehicle for producing a conductive paste was prepared by the following method.

  That is, first, ethyl cellulose as an organic binder and each solvent shown in Table 4 were prepared. Next, 10 parts by weight of ethylcellulose was dissolved in 100 parts by weight of the solvent to prepare an organic vehicle.

  Next, Ni particles having an average particle diameter of 0.2 μm as a conductive powder were prepared, and 30 to 70 parts by weight of the organic vehicle prepared above was added to 100 parts by weight of the conductive powder. The mixture was kneaded to form a slurry to obtain a conductive paste.

Preparation of Test Sample A ceramic green sheet having a thickness of 1 μm was formed by applying the dielectric paste prepared in Example 1 to a predetermined thickness on a PET film by a doctor blade method and drying it.

  Next, on the obtained ceramic green sheet, among the conductive pastes produced above, a conductive paste using propylene glycol diacetate, which is an example of the present invention (sample number 1 in Table 4). Was used to form a ceramic green sheet (test sample) having an electrode pattern having a thickness of about 1.0 μm.

Evaluation of Test Sample Using the obtained test sample, “presence / absence of sheet attack” and “peelability of PET film from ceramic green sheet” were evaluated.

  “Presence / absence of sheet attack” was performed by visually observing the surface of the ceramic green sheet opposite to the electrode pattern side (the surface in contact with the PET film), and confirming the degree of dissolution of the ceramic green sheet by the degree of deformation and hue. . As a result, dissolution of the ceramic green sheet could not be observed.

  The “peelability of the PET film from the ceramic green sheet” was measured by measuring the peel strength when peeling the PET film from the test sample. The peel strength is measured by attaching a load cell to the end of the 9cm x 20cm ceramic green sheet with PET (the margin that creates the trigger for peeling) with adhesive tape and measuring the load (load) while moving it upward. It was. As a result, the peel strength was an appropriate value of 5.0 gf or less. Thereby, while maintaining the required holding force with respect to a ceramic green sheet, the efficiency of peeling work can be expected.

Production of Multilayer Ceramic Chip Capacitor Sample Next, using the dielectric paste produced in Example 1 and the conductive paste produced above, a multilayer ceramic chip capacitor 1 shown in FIG. 1 was produced as follows.

  First, a dielectric paste was applied to a PET film with a predetermined thickness by a doctor blade method and dried to form a ceramic green sheet having a thickness of 1 μm after drying. In this example, this ceramic green sheet was used as the first green sheet, and a plurality of these were prepared.

  Next, a conductive paste was formed in a predetermined pattern on the obtained first green sheet by a screen printing method to obtain a ceramic green sheet having an electrode pattern with a thickness of about 1 μm. In this example, this ceramic green sheet was used as the second green sheet, and a plurality of these were prepared.

Next, the first green sheets were laminated to a thickness of 150 μm to form a ceramic green sheet group. On this ceramic green sheet group, 250 second green sheets were laminated. Further, a ceramic green sheet group composed of a plurality of first green sheets similar to the above is laminated and formed thereon, and heated and pressurized under the conditions of a temperature of 70 ° C. and a pressure of 1.5 ton / cm ² to produce a green ceramic. A laminate was obtained.

  Next, after cutting the obtained laminated body into a predetermined size, binder removal treatment, firing and annealing were performed to obtain a sintered body.

  Next, after polishing the end face of the obtained sintered body by sand blasting, an In—Ga alloy was applied to form a test electrode to obtain a multilayer ceramic chip capacitor sample.

  The size of the capacitor sample is 1.6 mm long × 0.8 mm wide × 0.8 mm high. The thickness of the dielectric layer 2 sandwiched between the pair of internal electrode layers is about 1 μm, and the thickness of the internal electrode layer 3 is 1 μm. Met.

Evaluation of Capacitor Sample The capacitor sample obtained was evaluated for short-circuit failure characteristics, withstand voltage characteristics (IR characteristics), and the presence or absence of delamination.

  As for short-circuit failure characteristics, a tester applied 1.5 V and judged that a product of 1 MΩ or less was a failure, and a failure rate of less than 5% was considered good.

With respect to the withstand voltage characteristics (IR characteristics), a DC voltage 12 times the rated voltage (6.3 V) was applied for 3 seconds, and a capacitor sample having a resistance of less than 10 ⁴ Ω was determined to have a failure, and the average failure rate was 1. Less than 9% was considered good.

  About the presence or absence of delamination, the baking base was grind | polished and the lamination state was observed visually.

  The results are shown in Table 4.

  As shown in Table 4, a capacitor sample (sample number 1) produced using a conductive paste containing propylene glycol diacetate as a solvent was produced using a conductive paste containing terpineol or dihydroterpineol. Compared to the capacitor sample, it can be confirmed that any improvement in the short-circuit defect, failure rate, and delamination is dramatically improved. The above improvement in performance is also observed when compared with a capacitor sample made using a conductive paste containing dihydroterpinyl acetate. That is, about the Example sample of this invention, the reliability improvement was confirmed compared with the comparative example sample.

FIG. 1 is a cross-sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention. 2 (A) to 2 (D) are photomicrographs showing the compatibility of the solvent contained in the conductive pastes according to Examples and Comparative Examples of the present invention with respect to a ceramic green sheet at room temperature. FIGS. 3A to 3C are photographs showing the compatibility of the solvent contained in the conductive pastes according to Examples and Comparative Examples of the present invention with respect to the ceramic green sheet under the condition of a temperature of 50 ° C.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Multilayer ceramic capacitor 10 ... Capacitor body 2 ... Dielectric layer 3 ... Internal electrode layer 4 ... External electrode

Claims (7)

A conductive paste used to form internal electrodes of a multilayer ceramic electronic component,
Including conductive powder and organic vehicle;
The organic binder in the organic vehicle is mainly composed of one or more selected from ethyl cellulose resin, alkyd resin and acrylic resin,
A conductive paste characterized in that the solvent in the organic vehicle contains propylene glycol diacetate as a main component.   The conductive paste according to claim 1, wherein the solvent in the organic vehicle is contained in an amount of 50 to 200 parts by weight with respect to 100 parts by weight of the conductive powder.   The conductive paste according to claim 1, wherein the conductive paste is used in combination with a ceramic green sheet having a thickness of 5 μm or less containing a butyral resin.   4. The conductive paste according to claim 1, wherein the organic binder in the organic vehicle is contained in an amount of 1 to 10 parts by weight with respect to 100 parts by weight of the conductive powder.   The conductive paste according to claim 1, wherein the conductive powder contains Ni or a Ni alloy as a main component. A green ceramic laminate in which a plurality of ceramic green sheets containing butyral resin and having a thickness of 5 μm or less and electrode layers formed in a predetermined pattern using the conductive paste according to claim 1 are alternately stacked. Manufactured using the body,
A multilayer ceramic electronic component having an internal electrode layer and a dielectric layer having a thickness of 3 μm or less.   A green ceramic laminate in which a plurality of ceramic green sheets containing butyral resin and having a thickness of 5 μm or less and electrode layers formed in a predetermined pattern using the conductive paste according to claim 1 are alternately stacked. A method of manufacturing a multilayer ceramic electronic component for firing a body.

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