JP2008062489A - Splitting method for brittle material, and splitting apparatus for brittle material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser splitting apparatus and a method for reducing a large amount of time and materials consumed for finding the optimal conditions different by materials to enable stable splitting operation. <P>SOLUTION: The temperatures of a laser beam irradiation point and a vicinity of the distal end of a crack are measured by a non-contact type thermometer, and whether the temperatures are in a temperature zone in which splitting is possible or not. Then, by controlling a laser output, a material feeding speed, a cooling amount and a laser beam diameter, optimal conditions for the splitting of a brittle material are automatically set. A cooling material is jetted from a nozzle in an enclosed space (constant temperature bath) which keeps the temperature uniform, and the stream of the cooling material is guided by the stream of a gas, and the vicinity of the distal end is cooled, but the front area in the laser beam scanning direction is not cooled, and thus, the maintenance of the temperature zone to make the splitting possible is facilitated. The dispersion of heat is prevented from occurring by making the brittle material come into contact on a point or a line, and the splitting is accelerated without restraining the material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cleaving method and a cleaving apparatus for a brittle material using a laser.

The cleaving of the brittle material using the thermal stress by the laser beam has the following advantages over the conventional blade dicing.
・ High-speed machining is possible (feed speed of 100mm / s or more is possible)
・ High precision machining is possible (no cutting allowance)
・ Small cross-section damage (less micro-cracking and thermal change)
・ Clean processing is possible (no waste, no post-cleaning required)
Japanese Patent No. 1651809, Japanese Patent No. 1942282, Japanese Patent No. 2700136, Japanese Patent No. 3210934, Japanese Patent No. 3751211, Japanese Patent No. 3751122, Japanese Patent Application No. 9-168479

In order to stably break the brittle material along the planned breaking line, the temperature of the heated part immediately after the laser beam scanning for applying heat and the temperature near the tip of the crack after the laser beam scanning are divided. Failure to secure a temperature difference to enable it will result in failure to break, deviate or not proceed.
Therefore, it is necessary to maintain the cleaved portion in a temperature region where cleaving is possible.
For this purpose, it is necessary to change the laser output, the material feed rate, the cooling amount, and the laser beam diameter depending on the material, size, thickness, and the like of the brittle material.
In order to find the optimum combination from the above conditions, there is a drawback that a great deal of experience and time, and a lot of experimental materials and electric energy are consumed.

Although there is a natural cooling method of the tip of the crack by raising the temperature of the heated part by scanning a large-capacity laser beam along the planned cutting line of the brittle material, degradation of the cracking accuracy and damage of the brittle material may occur. There was a drawback that would increase.
Further, when the heating temperature was raised, there were also problems such as innumerable cracks remaining, such as fragments remaining on the surface of the brittle material.

  Further, when the laser beam is scanned along the planned fracture line of the brittle material or when the fracture is performed by moving the brittle material, the laser beam is cleaved by scanning the laser beam, and the laser beam follows the shape of the laser beam. It became out of control and sometimes went out of control.

  On the other hand, after scanning the laser beam to apply heat, it is cooler than natural cooling in order to maintain the temperature range that can be cleaved while ensuring the temperature difference for cleaving near the tip of the crack in the brittle material. Forced cooling that injects the material is easier, but by injecting the coolant, there is a drawback that it becomes difficult to maintain the temperature region that can be cleaved because the front of the laser beam scanning direction is cooled. .

In addition, if a holding part is provided on the back side to support the brittle material, the contact area between the brittle material and the holding part will increase, and heat will be transferred from the contact surface between the brittle material and the holding part, allowing cleaving. It was difficult to maintain a constant temperature region for
On the other hand, when the structure of the holding part constrains the material, there is also a drawback that the cleaving is hindered and the accuracy is deteriorated by hindering the cleaving direction.

In order to solve the problem, in the present invention, a brittle material cleaving method comprising a heating step of irradiating a brittle material with a laser beam along a planned cutting line and a cleaving step of cooling a heated portion heated in the heating step. In the first measurement step of measuring the temperature of the part heated in the heating step, the second measurement step of measuring the cooling part temperature in the vicinity of the cleaving planned location of the cleaving step, the heating step and the cleaving step, Among the third measurement steps for measuring the temperature of the processing space for performing each temperature measurement value obtained from at least two of the measurement steps, each temperature calculation value predetermined according to the type of the brittle material The brittle material cleaving method is characterized by comparing whether or not the brittle material is cleaved in comparison with the above, and in the heating step, the brittle material feed speed, laser beam output, laser beam feed, The brittle material cleaving method is characterized in that at least one of the cutting speed and the laser beam diameter is controlled in combination, and in the cleaving step, the cooling amount of the cooling nozzle is controlled.
Further, in the cleaving step, the laser beam is adjusted so that each temperature measurement value obtained from the two or more measurement steps matches each calculation predicted temperature calculated in advance according to the type of the brittle material. A brittle material cleaving method characterized in that automatic condition setting is performed by combining at least one of output, brittle material feed rate, laser beam feed rate, and laser beam diameter.
Further, the present invention is also a brittle material cleaving method characterized in that the temperature of the working space for performing the heating step and the cleaving step is kept constant.
Further, in the present invention, a heating mechanism that irradiates the brittle material with a laser beam along the planned cutting line, a cleaving mechanism that cools the heating portion of the brittle material heated by the heating mechanism, and the heating mechanism that is heated. First measuring means for measuring the temperature of the part, second measuring means for measuring the temperature of the cooling part at the tip of the crack of the brittle material that has been cooled and cleaved by the heating mechanism, and heating and cleaving as described above. Of the third measuring means for measuring the temperature of the working space to be performed, each temperature measurement value obtained from at least two of the measuring means is compared with a calculated value calculated in advance according to the type of the brittle material. A brittle material cleaving apparatus comprising a calculation / comparison determination mechanism, wherein the cleaving mechanism is provided with a cooling guide and holding means for contacting the back surface of the brittle material with dots or lines.

The structure according to claim 1 makes it possible to make a comparative determination as to whether or not the brittle material is to be stably cleaved along the planned cleaving line, and the method for cleaving the brittle material according to claim 2. As a result, it was possible to increase the cleaving speed along the planned cleaving line of the brittle material cleaving the crack, and to proceed the cleaving with high accuracy.
Further, by providing the brittle material cleaving device according to claim 6 with the cooling guide according to claim 7, by accurately controlling the cooling without abnormally increasing the output of the laser transmitter, The laser beam was always more severely scanned than the laser beam scan, and the laser beam could be prevented from following up, and it was no longer possible to control it, causing problems such as the runaway, broken or misaligned.
Furthermore, by providing the cleaving mechanism according to claim 8 with a holding means for contacting the back surface of the brittle material with a dot or a line, heat conduction to the holding portion is reduced, and a constant temperature region capable of cleaving can be maintained. Thus, high-precision cleaving can be performed without disturbing the cleaving direction.
As in the past, a great deal of experience and time and a lot of experimental materials are no longer required.
In addition, the accuracy of cleaving was improved and the damage to brittle materials was reduced. Further, when the heating temperature is increased, the surface of the brittle material is not melted, and the problem that the surface of the brittle material melts and the scattered pieces remain and the innumerable cracks are generated as in the prior art.

  FIG. 2 is a chart showing a simple flow of the operation of the laser cleaving apparatus according to the present invention.

  FIG. 3 shows a temperature relationship by laser beam irradiation to a planned cutting line of a brittle material with the cutting apparatus according to the present invention.

  The laser cleaving apparatus according to the present invention includes a heating means for irradiating a cleaved brittle material with a laser beam to form a heating (irradiation point), and a cooling unit (cooling) on the surface of the brittle material by injecting a coolant. A temperature detection means for measuring the temperature in the vicinity of the tip of the crack of the brittle material and the temperature of the heated portion by scanning a laser beam, and a temperature detection for measuring the temperature of the processing space of the brittle material. Means and a means for moving the crack tip so as to advance along the planned cutting line, and the measured values obtained from two or more measuring means are calculated according to the type of the arithmetic processing means and the brittle material Control means for determining whether to compare or not by data was provided, and at least one of the cooling and moving means and the output of the laser beam was controlled so that the tip of the crack progressed along the planned cutting line.

According to the above laser cleaving apparatus, the laser beam irradiation point became high temperature by irradiating the brittle material with the laser beam, while the cooling point became low temperature by spraying the coolant.
By moving the laser beam irradiation point and the cooling point along the planned cutting line, a temperature gradient was formed between the laser beam irradiation point and the cooling point, and the crack of the brittle material progressed due to the stress caused by the temperature gradient. .
By detecting the laser beam irradiation point and the cooling point at the tip of the crack by temperature measurement and controlling at least one of the cooling means and the moving means along the planned cutting line, the crack can be advanced along the planned cutting line. I was able to.

In the above laser cleaving apparatus, the control means controls the moving speed of the laser beam irradiation point.
When the measured temperature at the laser beam irradiation point was lower than the data obtained by the calculation processing means to predict, the moving speed was controlled to decrease.

  Lowering the moving speed of the laser beam irradiation point raises the temperature of the laser beam irradiation point and shortens the distance between the laser beam irradiation point and the tip of the crack, improving the direction of cleaving. The crack could be advanced along the line.

When the measured temperature at the laser beam irradiation point was higher than the data obtained by the calculation processing means to predict, the moving speed was controlled to increase.
By increasing the moving speed of the laser beam irradiation point, the temperature of the laser beam irradiation point decreases, and the distance between the laser beam irradiation point and the tip of the crack increases, so the cleaving speed increases and the cleaving speed increases. I was able to increase.

In the laser cleaving apparatus described above, the brittle material can be held by a structure using a point or line holding material, so that heat conduction to the holding portion can be reduced.
By making the holding part into a shape that does not restrain the brittle material, it was possible to advance the crack along the planned cutting line.
When the measurement temperature for measuring the temperature of the processing space of the brittle material rises in temperature of the brittle material, the predicted processing temperature value changes, and the temperature for measuring the temperature of the processing space is used as a correction value. The processing accuracy of the cleaving along the planned cutting line of the brittle material could be improved.

  In the above laser cleaving apparatus, if the temperature measured at the laser beam irradiation point is lower than the data obtained by the arithmetic processing means by the cooling means that forms the cooling part on the surface of the brittle material of the control means, By increasing the injection of coolant, the temperature gradient is increased between the laser beam irradiation point and the cooling point, and the distance between the laser beam irradiation point and the crack tip is shortened, so the directionality of cleaving is good As a result, the crack was able to advance along the planned cutting line.

  If the measurement temperature at the laser beam irradiation point is higher than the data obtained by the calculation processing means that predicts the measurement temperature of the laser beam irradiation point in the cooling means that forms the cooling part on the surface of the brittle material, the injection of the coolant is reduced and the laser is reduced. By reducing the temperature gradient between the beam irradiation point and the cooling point, the distance between the irradiation point of the laser beam and the tip of the crack becomes longer, so the cleaving speed increases and the crack progresses along the planned cutting line. I was able to.

  The cooling means includes a cooling guide for accurately carrying out the cooling point on the surface of the brittle material, thereby increasing the temperature gradient by a mechanism that does not cool the irradiation point of the laser beam.

  When a sufficient effect was not obtained in the control means, the output of the laser transmitter was increased if the measured temperature at the laser beam irradiation point was lower than the data obtained by the arithmetic processing means to predict.

  In the above laser cleaving apparatus, the temperature obtained by calculating the temperature gradient by measuring the temperature measured at the laser beam irradiation point on the brittle material and the temperature measured at the cooling point of the brittle material by injecting the coolant into the brittle material; By carrying out the comparison control, the cutting was always advanced from the scanning of the laser beam, and the shape of the laser beam could be prevented.

  The above laser cleaving apparatus includes storage means for storing the speed of the moving means and the control amount of the cooling means obtained during the laser cleaving process, and stored in the storage means in the past in the next laser cleaving process. Based on the control amount, at least one of the movement, the cooling and the laser beam was controlled.

Each time the laser cleaving process is performed, the speed of the moving means, the control amount of the cooling means, and the state of the laser beam are accumulated in the storage means, and the next laser cleaving process is based on the control amount accumulated in the storage means. Since it can be controlled, the cutting accuracy can be improved.
By repeating the accumulation of the above-described control in the storage means, an appropriate control amount is accumulated, so that the speed of the means for moving the crack tip to move along the planned cutting line and the control of the cooling means can be controlled. It has become possible.

  The laser cleaving method of the present invention includes a laser transmitter that irradiates a laser beam to form a laser irradiation point on the surface of the brittle material, and a cleaving that injects a coolant to form a cooling point on the surface of the brittle material. A temperature detection step of measuring the temperature of the cracked portion of the brittle material and a heated portion by scanning with a laser beam; a temperature detection step of measuring the temperature of the processing space of the brittle material; A control means comprising a step of moving so as to proceed along the line, and comparing the determination of the measurement values obtained from two or more measurement means with data corresponding to the type of the brittle material And controlling at least one of the cooling and moving means and the output of the laser transmitter so that the tip of the crack advances along the planned cutting line.

According to the above laser cleaving method, the laser beam irradiation point becomes high temperature by irradiating the brittle material with the laser beam, while the cooling point becomes low temperature by spraying the coolant.
By moving the laser beam irradiation point and the cooling point along the planned cutting line, a temperature gradient is formed between the laser beam irradiation point and the cooling point, and the crack of the brittle material proceeds due to the stress caused by the temperature gradient.
By detecting the tip of the crack by temperature measurement and controlling at least one of the cooling means and the moving means along the planned cutting line, the crack could be advanced along the planned cutting line.

In the laser cleaving method, the control step controls the moving speed of the laser beam irradiation point.
When the measured temperature at the laser beam irradiation point was lower than the data obtained by the calculation processing means to predict, the moving speed was controlled to decrease.

  Therefore, by lowering the moving speed of the laser beam irradiation point, the temperature of the laser beam irradiation point increases, and the distance between the laser beam irradiation point and the crack tip is shortened, so that the directionality of cleavage is improved. The crack was able to advance along the planned cutting line.

  When the measured temperature at the laser beam irradiation point was higher than the data obtained by the calculation processing means to predict, the moving speed was controlled to increase. By increasing the moving speed of the laser beam irradiation point, the temperature of the laser beam irradiation point decreases, and the distance between the laser beam irradiation point and the tip of the crack increases, so the cleaving speed increases and the cleaving speed increases. Could be increased.

In the laser cleaving method, heat conduction to the holding portion can be reduced by holding the brittle material as a point or line holding material. By making the holding part into a shape that does not restrain the brittle material, it was possible to advance the crack along the planned cutting line. As the measurement temperature for measuring the temperature of the processing space of the brittle material rises, the predicted processing temperature value changes.
By using the temperature for measuring the temperature of the processing space as a correction value, it was possible to improve the processing accuracy of the cleaving along the planned cutting line of the brittle material.

  In the laser cleaving method described above, if the measurement temperature of the laser beam irradiation point is lower than the data obtained by the arithmetic processing means predicted by the cooling means that forms the cooling part on the surface of the brittle material of the control means, By injecting coolant and increasing the temperature gradient between the laser beam irradiation point and the cooling point, the distance between the laser beam irradiation point and the tip of the crack is shortened, so that the direction of cleaving is improved and cleaving The crack could be advanced along the planned line.

  If the measured temperature at the laser beam irradiation point is higher than the data obtained by the calculation processing means that predicts the measurement temperature of the laser beam irradiation point in the cooling process for forming the cooling part on the surface of the brittle material, the injection of the coolant is reduced and the laser beam is reduced. By reducing the temperature gradient between the irradiation point and the cooling point, the distance between the irradiation point of the laser beam and the tip of the crack becomes longer, so the cleaving speed becomes faster and the crack progresses along the planned cutting line. I was able to.

  In the cooling method, a temperature gradient can be increased by a mechanism that does not cool the irradiation point of the laser beam by providing a guide for accurately performing the cooling point on the surface of the brittle material.

When the control means is not effective, control is performed to increase the output of the laser transmitter when the measured temperature at the laser beam irradiation point is lower than the data obtained by the predictive processing means.
The measured value for measuring the temperature of the heated part by scanning the laser beam was compared with the data obtained by the arithmetic processing means, thereby preventing high temperature.

  In the above laser cleaving method, data obtained by calculating the temperature gradient by measuring the measurement temperature of the laser beam irradiation point and the coolant at the measurement temperature of the cooling point of the brittle material by injecting the brittle material to the brittle material By controlling the comparison with, the cutting always progressed more than the scanning of the laser beam, and the shape of the laser beam could be prevented.

  The laser cleaving method includes a storage unit that stores the speed of the moving unit and the control amount of the cooling unit obtained during the laser cleaving process, and is stored in the storage unit in the past in the next laser cleaving process. Based on the control amount, at least one of the movement, the cooling and the laser beam was controlled.

FIG. 1 is a basic configuration diagram showing the best mode of the cleaving apparatus of the present invention. In FIG. 1, the laser beam irradiation point moved along the planned cutting line by irradiating the brittle material 10 in the X direction along the planned cutting line by irradiating a laser beam from the laser oscillator 1 serving as a heating source.
In addition, a cooling point is formed by injecting the coolant cooled by the cooling unit 30 from the cooling nozzle 31 from behind the laser beam (attached to the position where the temperature near the tip of the crack is cooled) along the planned cutting line. did.
The cooling point is preferably located slightly behind the breaking progress point (crack tip), but the position may be changed depending on the type of brittle material.
For example, the coolant may be cooled by pressurizing pure water with nitrogen or by compressing ordinary water or a mixture of alcohol and water with air. A capillary equipped with a piezoelectric element may be used.
The coolant sprayed from the cooling nozzle 31 was blocked by a cooling guide 32 (air curtain nozzle) so as not to enter the laser beam irradiation point.
In this cooling guide 32 (air curtain nozzle), the effect of cooling (reducing damage) other than the cleaved portion of the brittle material could be used in combination.
The XYZ-rotation stage 20 that moves the brittle material 10 can be controlled from the outside suitable for cleaving movement. A linear direct drive motor or servo motor is used for the XYZ of the linear motor, but the specifications are suitable for cleaving movement. Can be controlled from the outside.
In this stage 20, heat conduction for holding the brittle material 10 can be reduced, and by making the brittle material unconstrained, deviation (error) can be reduced without shifting along the planned cutting line. I was able to.
While the laser beam irradiation point was heated to a high temperature, the cooling point was cooled, so a temperature gradient was formed between the two points, and the cleaving proceeded.
Non-contact spot thermometer 41 that measures the temperature of the heated portion immediately after beam scanning, non-contact spot thermometer 42 that measures the temperature of the tip of the crack, and non-contact that measures the temperature of the processing space where the material holding portion is located Since the laser beam power, movement, and cooling amount were controlled so that the temperature gradient between the two points was adjusted to the optimum value for cleaving by measuring the temperature with the spot type thermometer 43, the type of brittle material was transferred to the control computer. By comparing the values calculated according to the cleaving conditions (laser power, moving speed, cooling amount) registered in advance, an easy control amount can be obtained.

An example of the operation according to the present invention will be described below with reference to FIGS. In this embodiment, the brittle material 10 is moved to the cleaving start position (end face of the brittle material) and then heated by irradiation with the laser beam emitted from the laser oscillator 1, and the temperature of the heated portion immediately after the beam scanning is measured without contact. While measurement was performed with a spot thermometer 41, the temperature was stopped until the temperature at which a crack (initial crack) was generated due to thermal stress, but depending on the type of brittle material, movement at a low speed may be used. The temperature at which the crack starts to progress is registered in advance in the control computer 50 (representative value corresponding to the type of brittle material).
By comparing this registered temperature value with the measured temperature, the brittle material 10 was moved (started). When the movement start condition is satisfied, the movement at a low speed is started to the XYZ-rotation stage 20 that moves the brittle material 10 along the planned cutting line.
As the laser beam irradiation point on the brittle material 10 moves, the temperature of the heated portion also moves, so the value measured by the non-contact spot thermometer 41 that measures the temperature decreases.
The measured value when the measurement position of the non-contact type spot thermometer 42 for measuring the temperature at the tip of the crack reaches the heated portion after scanning the irradiation beam is taken into the control computer, and the temperature measurement of the thermometer 41 at the laser beam irradiation point is performed. If the temperature gradient was calculated from the measured value and the temperature measured value of the thermometer 42, the cooling amount of cooling was found.
The cooling amount of the coolant sprayed from the cooling nozzle 31 may be controlled in advance by being registered in advance in the control computer (representative value corresponding to the type of brittle material).
Control was performed to switch the movement of the XYZ-rotating stage 20 that moves the brittle material 10 to high speed when the temperature gradient increases. Speed control may be performed at any time.
As the moving speed of the laser beam irradiation point to the brittle material 10 increases, the measurement temperature of the non-contact type spot thermometer 42 that measures the temperature at the tip of the crack decreases, so the amount of cooling may be controlled slightly. . When reaching the end face (termination) of the brittle material by such control, the temperature measurement value of the thermometer 41 at the laser beam irradiation point suddenly decreases, and the non-contact type spot thermometer for measuring the temperature at the tip of the crack Since the measurement temperature of 42 does not change, it can be judged as an end face, so that the cutting is completed along the planned cutting line. However, the brittle material 10 is moved by the distance between the laser beam irradiation point and the cooling point.

If the temperature gradient that can be cleaved is low in the constant temperature range, 20: XYZ-feeding the rotating stage and scanning the laser beam to raise the temperature of the heated part and slowing the stage feed and increasing the laser beam output I chose.
The laser beam diameter may be changed so that the temperature can be increased by increasing the time. When the temperature gradient that can be cleaved is not in a certain temperature range and is high, 20: XYZ-rotation stage 20 feed is accelerated to scan the laser beam to lower the temperature of the heated portion, and to reduce the laser beam output.
When the cleaving temperature gradient reaches a certain temperature range, cleaving control is performed even if the cooling speed of the cooling nozzle 31 is changed by measuring the non-contact type spot thermometers 41, 42, 43 with the moving speed of the brittle material constant. The laser output of the laser transmitter 1 may be changed.
The laser beam diameter, the cooling amount of the cooling nozzle 31 and at least one of the XYZ-rotation stages 20 may be combined and controlled, and the optimum condition for maintaining a constant temperature region during laser scanning is calculated by a system control computer. Also good.
The optimum temperature condition range is about 140 ° C. to 70 ° C. for a mirror-finished silicon wafer having a thickness of 500 μm, but the cutting temperature condition varies depending on the type of brittle material.
The moving speed of the XYZ-rotating stage 20 was set to 100 mm / s or more for a mirror-finished silicon wafer having a thickness of 500 μm.

Configuration example

The laser oscillator 1 uses a YAG laser having an optimum wavelength for a silicon wafer, but a CO 2 laser, an excimer laser, a He—Cd laser, or the like may be used depending on the type of brittle material.
The laser beam spot diameter may be a diameter that can generate a cleaving temperature.
The brittle material 10 is a mirror-finished silicon wafer having a thickness of 500 μm, but may be a brittle material wafer suitable for the laser wavelength.
The XYZ-rotation stage 20 can be controlled from the outside by a direct drive motor that rotates the XYZ of the linear motor, but a servo motor may be used.
Any specification suitable for cleaving movement may be used.
This stage was equipped with a holding part for bringing the brittle material into contact with a point or line for preventing heat dispersion.
An arc shape, a sword mountain shape, or a mountain shape with few contact surfaces is desirable.
The cooling unit 30 includes a mechanism that primarily stores coolant, a mechanism that primarily stores gas, and electric microvalves attached to the respective nozzles 31 and 32.
The cooling nozzle 31 is attached at a position for cooling the temperature near the tip of the crack, and pure water is used as the coolant, but general water or a mixture of alcohol and water may be used.
The laser spot diameter is sized so that it can be cooled, and the beam heating section is oriented so as not to be cooled.
The curtain nozzle 32 is a curtain that does not enter the laser heating unit using nitrogen, but the center of the structure integrally with the cooling nozzle 31 may be a coolant and the surrounding may be a pressurized gas system.
This part can be used in combination with an effect of cooling (reducing damage) other than the cleaved portion of the brittle material.
The non-contact type spot thermometer 41 has a non-contact thermopile type spot diameter of 1 mm.
The non-contact type spot thermometer 42 has a non-contact thermopile type spot diameter of 2 mm, as long as the tip of the crack can be reliably measured.
The non-contact type spot thermometer 43 has a non-contact thermopile type diameter of 50 mm, but may have an equivalent function.
These thermometers have a fast temperature response that does not sense the laser beam and need only have an output to send measurement data to the system control computer.
The non-contact type spot thermometer 41 has a thermopile type response speed of 100 ms, but may be a radiation thermometer type or non-contact photoelectric element as long as the specifications of the speed and the spot diameter are satisfied.
If the response speed (μs) of the thermometer is taken into the system control computer (μs), the speed can be changed by 1000 or more.
The control of the present invention takes in a plurality of temperature measurements at a high speed and takes in a system control computer 50 having a memory (hard disk) that has an IO board and stores the database in order to determine the optimum condition for cleavage. The obtained temperature data is calculated by software that obtains predicted calculation data by comparing with past cleaved measurement data relating to different temperatures for each type of brittle material. The calculation is an approximate curve method, but may be a complementary equation.
Predictive calculation data was judged to be cleaved at high speed.
Since it has a high-speed control function, either the speed of the XYZ-rotating stage 20 or the cooling amount of the cooling nozzle 31 may be controlled or both may be controlled.
The data format is a table in which the laser output value is plotted on the vertical axis and the cutting temperature condition is plotted on the vertical axis, and the moving speed of the XYZ-rotating stage 20 is plotted on the horizontal axis. The horizontal axis may be the laser beam moving speed.

Glass processing: automotive glass, mirror, architectural window glass, FDP glass, portable display Ceramic processing: vehicle ceramic substrate, tool, semiconductor substrate Solar cell processing: amorphous glass substrate, single crystal semiconductor substrate, polycrystalline semiconductor substrate Semiconductor manufacturing plant: Si wafer, SiC wafer, gallium arsenide wafer, gallium phosphide wafer, indium phosphide wafer, sapphire

It is the schematic of the laser cleaving apparatus in this invention. It is an operation | movement flowchart of the laser cleaving apparatus in this invention. In the present invention, the material cutting schedule line, the explanation of the heating part, the cooling part and the temperature distribution diagram.

Explanation of symbols

1: Laser oscillator
10: Brittle material 20: XYZ-rotation stage 21: Holding part 30: Cooling unit
31: Cooling nozzle 32: Curtain nozzle 41: Non-contact spot thermometer 1 of heating part
42: Non-contact spot thermometer 2 in the cooling section
43: Non-contact spot thermometer 3 for ambient temperature
50: System control computer
60: Stage drive driver

Claims (8)

  A brittle material cleaving method comprising: a heating step of irradiating a brittle material with a laser beam along a planned cutting line; and a cleaving step of cooling a heated portion heated in the heating step. A first measurement step for measuring the temperature, a second measurement step for measuring the temperature of the cooling part in the vicinity of the planned cutting position of the cleaving step, and a third for measuring the temperature of the working space for performing the heating step and the cleaving step. Of the measurement steps, each temperature measurement value obtained from at least two of the measurement steps is compared with each temperature calculation value predetermined according to the type of the brittle material, and whether the brittle material cleaves. A method for cleaving a brittle material, characterized in that a comparison is made.   2. The brittle material cleaving method according to claim 1, wherein in the heating step, the brittle material is controlled by combining at least one of a brittle material feed rate, laser beam output, laser beam feed rate, and laser beam diameter.   The brittle material cleaving method according to claim 1, wherein the cooling amount of the cooling nozzle is controlled in the cleaving step.   In the cleaving step, the laser beam output and the brittle material so that each temperature measurement value obtained from the two or more measurement steps coincides with each calculated predicted temperature calculated in advance according to the type of the brittle material. The brittle material cleaving method according to claim 3, wherein automatic condition setting is performed by combining at least one of a feed rate, a laser beam feed rate, and a laser beam diameter.   The method for cleaving a brittle material according to claim 1, wherein the temperature of a working space for performing the heating step and the cleaving step is kept constant.   A heating mechanism for irradiating a brittle material with a laser beam along a planned cutting line, a cleaving mechanism for cooling a heated part heated by the heating mechanism, and a first measuring means for measuring the temperature of the part heated by the heating mechanism And at least two or more of second measuring means for measuring the temperature of the cooling part near the planned cutting position of the cleaving mechanism, and third measuring means for measuring the temperature of the processing space where the heating mechanism and the previous cleaving mechanism are located. A brittle material comprising: a calculation / comparison determination mechanism that compares each temperature measurement value obtained from the measurement means with a predetermined calculation value according to the type of the brittle material. Cleaving device.   The brittle material cleaving apparatus according to claim 6, wherein a cooling guide is provided in the cleaving mechanism.   The brittle material cleaving apparatus according to claim 6 or 7, wherein the cleaving mechanism is provided with holding means for contacting the back surface of the brittle material with dots or lines.

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