JP2008056737A - Method for producing polymer powder, polymer powder and resist composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing a polymer giving a polymer containing little impurities such as metallic component and a polymer of former lot, etc., polymer powder having low impurity content and a resist composition. <P>SOLUTION: The method for producing polymer powder comprises a step to produce the wet powder of a polymer by filtering a dispersion liquid containing a polymer dispersed in a dispersion medium with a filter 42 and a step to dry the obtained wet powder of polymer in the state deposited on the filter 42. The invention further provides polymer powder obtained by the production method and a resist composition obtained from the polymer powder produced by the production method. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for producing a polymer powder, a polymer powder, and a resist composition.

  In recent years, resist patterns formed in the manufacturing process of semiconductor elements, liquid crystal elements, and the like have been rapidly miniaturized due to advances in lithography technology. As a resist composition used for forming a resist pattern, a chemically amplified resist containing a photoacid generator that generates an acid upon irradiation with radiation and a resin whose alkali solubility is changed by the action of the generated acid is known. It has been.

  As a resin for a chemically amplified resist composition used in the formation of a resist pattern using an ArF excimer laser (wavelength 193 nm), an acrylic polymer that is transparent to light with a wavelength of 193 nm has attracted attention. As the polymer, for example, a polymer of a (meth) acrylic acid ester having an alicyclic skeleton and a (meth) acrylic acid ester having a lactone skeleton is known (see, for example, Patent Documents 1 and 2). .)

The polymer is produced through the following steps (see Examples in Patent Documents 1 and 2).
(I) A step of polymerizing a monomer component containing a (meth) acrylic acid ester having an alicyclic skeleton, a (meth) acrylic acid ester having a lactone skeleton, and the like by a solution polymerization method.
(Ii) A step of pouring the polymer solution obtained by the solution polymerization method into a poor solvent to precipitate the polymer to obtain a polymer dispersion.
(Iii) A step of producing a polymer powder by filtering the polymer dispersion using a filter.
(Iv) A step of dissolving the produced polymer wet powder in a good solvent to obtain a polymer solution, pouring the polymer solution into a poor solvent and precipitating the polymer to obtain a polymer dispersion.
(V) A step of producing a polymer powder by filtering the polymer dispersion using a filter.
(Vi) A step of drying the produced polymer powder after repeating steps (iv) to (v) as necessary.

However, in the polymer powder produced in this way, metal components adhering to the container used in the drying step may be mixed as impurities. If the resist polymer contains a large amount of metal components, the conductivity of the insulating film increases, and junction leaks, deterioration of the characteristics of the insulating film, and electrical characteristics of semiconductor elements, liquid crystal elements, and the like are significantly reduced. Therefore, a polymer having a low metal content is desired.
Furthermore, when a plurality of polymers having different constituent unit compositions are produced continuously using the same production equipment, the polymer of the previous lot adhering to the container used in the drying step is mixed as impurities, May cause problems.
Resist pattern obtained by developing the resist film, because the resist film made of the resist composition containing the obtained polymer cannot exhibit the performance as designed (solubility in developer, sensitivity, resolution, etc.). The accuracy, yield, etc. of the circuit formed by using this decrease.
When developing a resist film, a development defect called a defect occurs, the defect causes a loss of a resist pattern, and a circuit formed using the resist pattern is disconnected or has a defect.
JP 10-319595 A JP-A-10-274852

  The present invention provides a method for producing a polymer powder capable of obtaining a metal powder, a polymer powder with less impurities such as a polymer of a previous lot, a polymer powder with less impurities, and a resist composition.

The method for producing a polymer powder of the present invention includes a step of producing a polymer wet powder by filtering a dispersion liquid in which a polymer is dispersed in a dispersion medium using a filter, and the obtained polymer dry powder on the filter. And a step of drying while placed.
Here, it is preferable that the following conditions are satisfied before the filter is used for filtration.
The difference (X−Y) between the electrical conductivity (X) of water after filter immersion and the electrical conductivity (Y) of water before filter immersion is 1.8 μS / cm or less. However, as the water before immersing the filter, pure water having an electric conductivity of 0.5 μS / cm or less is used, and the electric conductivity (X) of the water after immersing the filter is 20 L per 1 m ^{2 of} the filter area. The filter is immersed in water, and the electric conductivity of water measured in a state where the filter is immersed 15 minutes after the start of immersion is taken.

The polymer powder of the present invention is obtained by the method for producing a polymer powder of the present invention.
The resist composition of the present invention is obtained from a polymer powder obtained by the method for producing a polymer powder of the present invention.

According to the method for producing a polymer powder of the present invention, a polymer powder with few impurities such as a metal component and a polymer of the previous lot can be obtained.
The polymer powder of the present invention contains few impurities.
The resist composition of the present invention contains few impurities.

Hereinafter, the present invention will be described in detail.
Moreover, the monomer represented by Formula (1-1) is described as a monomer (1-1). The same applies to monomers represented by other formulas. Moreover, (meth) acrylic acid means methacrylic acid or acrylic acid, and (meth) acrylic acid ester means methacrylic acid ester or acrylic acid ester.

<Method for producing polymer>
The method for producing a polymer powder of the present invention includes a step of producing a polymer powder by filtering a dispersion liquid in which a polymer is dispersed in a dispersion medium using a filter, and the obtained polymer powder on a filter. And a step of drying while placed on the substrate.

Examples of polymers include acrylic polymers, styrene polymers (polystyrene, acrylonitrile-butadiene-styrene copolymers, etc.), vinyl chloride polymers, polyester polymers, cycloolefin polymers, vinyl ether polymers. And fluorine-based polymers.
Examples of the polymer include a resist polymer, an antireflection polymer, a coating polymer, a toner polymer, a molding polymer, and the like depending on applications.
The method for producing a polymer powder of the present invention is suitable for producing a resist polymer that is required to suppress contamination (contamination) of impurities as much as possible.

An example of the dispersion medium is a poor solvent. The poor solvent is a solvent having a small ability to dissolve the polymer, and the poor solvent varies depending on the composition of the polymer.
For example, “Polymer Handbook”, 4th edition, pages VII-497 to VII-545 describe nonsolvents corresponding to various polymers (Polymers).
When the polymer is an acrylic polymer for resist, the solubility parameter (hereinafter also simply referred to as “SP value”) has a value of 7.0 (cal / cm ³ ) ^{1/2 to} 9.0. (Cal / cm ³ ) ^1/2 [14.3 MPa ^{1/2 to} 18.5 MPa ^1/2 ], or 11.5 (cal / cm ³ ) ^{1/2 to} 23.4 (cal / cm ³ ) ^{1 / 2 A} solvent having a range of [23.5 MPa ^{1/2 to} 47.9 MPa ^1/2 ] is preferable as the poor solvent.
The SP value of the solvent can be determined, for example, by the method described in “Polymer Handbook”, 4th edition, pages VII-675 to VII-711. Specifically, Table 1 (VII- 683), Tables 7 to 8 (VII-688 to VII-711).
The SP value when the poor solvent is a mixed solvent of a plurality of solvents can be determined by a known method. For example, the SP value of the mixed solvent can be obtained as the sum of products of the SP value of each solvent and the volume fraction, assuming that additivity is established.
Examples of the poor solvent for the resist acrylic polymer include methanol, isopropanol, methyl-t-butyl ether, water, n-hexane, and n-heptane. A poor solvent may be used individually by 1 type, and may use 2 or more types together.

Examples of the dispersion liquid in which the polymer is dispersed in the dispersion medium include the following dispersion liquids.
(Α) A polymer dispersion obtained by pouring a polymer solution obtained by a solution polymerization method into a poor solvent to precipitate the polymer.
(Β) A polymer slurry obtained by coagulating a polymer in a latex obtained by an emulsion polymerization method.
(Γ) A suspension of a polymer obtained by suspension polymerization.
(Δ) A dispersion obtained by pulverizing a polymer obtained by bulk polymerization and dispersing in a dispersion medium.
(Ε) A dispersion in which the polymer recovered from (α) to (δ) is dispersed again in a dispersion medium.

Examples of the filter include a filter cloth, a filter paper, a glass filter, a membrane filter, a cartridge filter, a felt, and the like that can be directly put in a dryer. Industrially, a filter cloth is preferable. The filter cloth is a cloth woven from long fibers. Examples of the long fiber material include synthetic resin (polyester, nylon, polypropylene, polytetrafluoroethylene, etc.), wool, cotton, ceramic, glass, cellulose, carbon, asbestos, metal (stainless steel, etc.), and the like. .
The filter may be one obtained by washing the filter used in the previous lot, or a new filter that has never been used for filtration.

Moreover, it is preferable to use a filter that satisfies the following conditions before being used for filtration.
The difference (X−Y) between the electrical conductivity (X) of water after filter immersion and the electrical conductivity (Y) of water before filter immersion is 1.8 μS / cm or less. The difference (X−Y) is preferably 1.5 or less, more preferably 1.2 or less, and even more preferably 1.0 or less.
However, pure water having an electric conductivity of 0.5 μS / cm or less is used as water before the filter is immersed. If water other than pure water is used as the water before immersing the filter, impurities such as metals, metalloids, ions, and organic substances in the water cannot be used to accurately determine the end point of cleaning of the filter, and defects in the resist pattern may occur. Cause. The electrical conductivity (X) of the water after immersion in the filter was determined by immersing the filter in 20 L of pure water per 1 m ² area of the filter and measuring the electrical conductivity of the water 15 minutes after the start of immersion. Degree. Moreover, the electrical conductivity of water is set to 2% / ° C. using a Castany ACT conductivity meter ES-14 (trade name) manufactured by Horiba, Ltd., and the water temperature is between 5 ° C. and 40 ° C. Measure with The area of the filter is the surface area on the side where the dispersion is supplied (that is, the side on which the polymer is deposited).

If the difference (X−Y) is 1.8 μS / cm or less, it is possible to prevent impurities such as metal components and polymers in the previous lot from entering the polymer from the filter.
That is, there is a correlation between the amount of impurities such as the metal component adhering to the filter and the polymer of the previous lot and the electric conductivity of water after the filter is immersed in water, and the difference (X If -Y) is 1.2 μS / cm or less, there is almost no contamination of impurities from the filter into the polymer.

As the dryer used in the present invention, an indirect heating type box type drying apparatus (vacuum), an indirect heating type box type drying apparatus (freezing vacuum), an indirect heating type stirring drying apparatus (dish type, round shape, groove type) , Indirect heating method rotary drying device, indirect heating method drum type drying device, direct heating method box type drying device (parallel, aeration, fluidized bed), direct heating method tunnel type drying device, direct heating method band type drying device (parallel, Aeration), direct heating method sheet drying device, direct superheating method multi-stage disc drying device, direct superheating method vertical turbo drying device, direct superheating method vertical aeration drying device, direct superheating method rotary drying device (direct, aeration), direct Heating method vibration drying device, direct heating method fluidized drying device, direct heating method airflow drying device, direct heating method spray drying device, direct heating method foam layer drying device, infrared drying device, high frequency drying device, ultrasonic drying Device, and the like. As the dryer, an indirect heating type box-type dryer is preferable from the viewpoint of excellent sensitivity and resolution when used as a resist composition.
Drying the polymer wet powder on the filter means that after the dispersion liquid described above is filtered using a filter, the polymer wet powder deposited on the filter is moved into the dryer together with the filter. It is to dry the wet powder as it is deposited on the filter. When the polymer wet powder is dried on the filter, the polymer wet powder may be wrapped with a filter, and the periphery of the filter may be put together in one place and tied with a string or the like.
The drying temperature is preferably 20 to 100 ° C.
The drying time is preferably 2 to 200 hours.

<Method for producing resist polymer>
Hereinafter, a method for producing a resist polymer will be specifically described.
For example, the resist polymer is manufactured through the following steps.
(A) A step of polymerizing the monomer component.
(B) A step of obtaining a polymer dispersion.
(C) A step of producing a polymer powder by filtering the polymer dispersion using a filter.
(D) A step of dispersing the obtained polymer wet powder in a poor solvent to obtain a polymer dispersion.
(E) A step of producing a polymer powder by filtering the polymer dispersion using a filter.
(F) A step of drying the obtained polymer powder to obtain a powder product.

(A) Process:
Examples of the polymerization method include known polymerization methods such as a solution polymerization method, an emulsion polymerization method, a suspension polymerization method, and a bulk polymerization method. In order not to reduce the light transmittance, a monomer remaining after the completion of the polymerization reaction is used. The solution polymerization method is preferable because it needs to be removed and the molecular weight of the polymer needs to be relatively low. Among the solution polymerization methods, the monomer component was heated to a predetermined polymerization temperature from the standpoint of easily obtaining a reproducible polymer with small variations in average molecular weight and molecular weight distribution due to differences in production lots. A polymerization method called a dropping polymerization method in which the polymerization vessel is dropped into a polymerization vessel is preferable.

The monomer component may be dropped only with the monomer component, or the monomer component may be dropped after being dissolved in an organic solvent (hereinafter also referred to as “dropping solvent”).
An organic solvent (hereinafter also referred to as “charged solvent”) may be charged into the polymerization vessel in advance, or the charged solvent may not be charged into the polymerization vessel in advance. In this case, the monomer component or the polymerization initiator is dropped into the polymerization vessel in the absence of the charged solvent.
The polymerization initiator may be dissolved in the monomer component or may be dissolved in the dropping solvent.
The monomer component and the polymerization initiator may be mixed in the same storage tank and then dropped into the polymerization container; they may be dropped into the polymerization container from independent storage tanks; They may be mixed immediately before being supplied to and dropped into the polymerization vessel.
One of the monomer component and the polymerization initiator may be dropped first, and then the other may be dropped with a delay, or both may be dropped at the same timing.
The dropping rate may be constant until the end of dropping, or may be changed in multiple stages according to the consumption rate of the monomer or the polymerization initiator.
The dripping may be performed continuously or intermittently.

Polymerization of the monomer component by the drop polymerization method is performed, for example, as follows.
A raw material (a monomer component, a polymerization initiator, a solvent, etc.) is injected into a mixing tank 10 having a stirrer 12 and a jacket shown in FIG. 1 and stirred with the stirrer 12 to prepare a monomer solution.
A solvent is poured into a polymerization tank 20 having a stirrer 22, a jacket and a condenser 24, and kept at a constant temperature. The monomer solution in the blending tank 10 is supplied to the polymerization tank 20 and dropped into a solvent maintained at a constant temperature to polymerize the monomer components to obtain a polymer solution.

  As the monomer component, those containing a monomer (1) having a lactone skeleton and a monomer (2) having an acid-eliminable group are preferred, and further a monomer (3) having a hydrophilic group The thing containing is preferable. The monomer component may contain the monomer (4) having a nonpolar alicyclic skeleton, or may contain another monomer (5).

The monomer (1) having a lactone skeleton is a component that improves the adhesion of the resist film to the substrate. Moreover, if the monomer (1) having a lactone skeleton has an acid-eliminable group, the adhesion and sensitivity of the resist film are improved. If the monomer (1) having a lactone skeleton has a hydrophilic group, the adhesion of the resist film and the rectangularity of the resist pattern are improved.
The monomer (1) having a lactone skeleton is a monomer having a cyclic saturated hydrocarbon group containing a carbonyloxy group (—C (O) O—) in the ring.

  The amount of the monomer (1) having a lactone skeleton is preferably 30 mol% or more, more preferably 35 mol% or more in the monomer component (100 mol%) from the viewpoint of adhesion of the resist film to the substrate. preferable. The amount of the monomer (1) having a lactone skeleton is preferably 60 mol% or less, more preferably 55 mol% or less, from the viewpoint of the sensitivity and resolution of the resist film. As the monomer (1) having a lactone skeleton, one type may be used alone, or two or more types may be used in combination.

Examples of the monomer (1) having a lactone skeleton include known monomers used in the production of resist polymers, and resists using ArF excimer laser (wavelength 193 nm) or KrF excimer laser (wavelength 248 nm). In view of obtaining a polymer suitable for pattern formation, a (meth) acrylic acid ester having a lactone skeleton is preferred.
As the monomer having a lactone skeleton, monomers (1-1) to (1-29) are preferable. However, R represents a hydrogen atom or a methyl group.

  The monomer (2) having an acid leaving group (excluding a monomer having a lactone skeleton) is a component that improves the sensitivity of the resist film. Further, if the monomer (2) having an acid leaving group has a hydrophilic group, the sensitivity of the resist film is further improved.

The acid leaving group is a group having a bond that is cleaved by an acid generated from the photoacid generator, and part or all of the acid leaving group is released from the main chain of the polymer by cleavage of the bond. It is a group. As an acid leaving group, the ester group which the following groups couple | bonded with the oxygen atom of the carbonyloxy group (-C (O) O-) is mentioned, for example.
A branched tertiary alkyl group, an alkyl-substituted hydrocarbon group represented by the following formula (wherein R ¹¹ represents a linear or branched alkyl group having 1 to 6 carbon atoms, and R ¹² represents a carbon to which it is bonded. Represents a group that forms a hydrocarbon group with an atom.), An alkoxyalkyl group, a group represented by —R ¹³ —O—R ¹⁴ —R ¹⁵ (wherein R ¹³ is a straight chain having 1 to 6 carbon atoms) A linear or branched alkylene group, R ¹⁴ represents a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms, and R ¹⁵ represents a hydrocarbon group.), A tetrahydropyranyl group , Tetrahydrofuranyl group and the like.

Examples of the branched tertiary alkyl group include a t-butyl group and a t-pentyl group.
Examples of the alkoxyalkyl group include a methoxymethyl group, 1-methoxyethyl group, ethoxymethyl group, 1-ethoxyethyl group, isopropoxymethyl group, 1-isopropoxyethyl group, cyclohexoxymethyl group, 1-cyclohexoxyethyl group, Examples include a cyclopentoxymethyl group and a 1-cyclopentoxyethyl group.

The hydrocarbon group is preferably a saturated alicyclic hydrocarbon group from the viewpoint of high light transmittance when a resist polymer is used. Examples of the saturated alicyclic hydrocarbon group include a monocyclic alicyclic hydrocarbon group and a polycyclic alicyclic hydrocarbon group.
Monocyclic alicyclic hydrocarbon groups include, for example, cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, etc. From the viewpoint of superiority, a cyclopentyl group and a cyclohexyl group are preferable.
Examples of the polycyclic alicyclic hydrocarbon group include a bridged cyclic hydrocarbon group, a spiraline hydrocarbon group, and a ring assembly type hydrocarbon group. Specific examples include bicyclo [2.2.1] heptyl group, tetracyclo [4.4.0.1 ^2,5 ] dodecyl group, 1-adamantyl group, 2-adamantyl group and the like.

  The amount of the monomer (2) having an acid leaving group is preferably 20 mol% or more, more preferably 25 mol% or more in the monomer component (100 mol%) from the viewpoint of the sensitivity and resolution of the resist film. More preferred. The amount of the monomer (2) having an acid leaving group is preferably 60 mol% or less, and more preferably 55 mol% or less, from the viewpoint of adhesion of the resist film to the substrate. As the monomer (2) having an acid leaving group, one type may be used alone, or two or more types may be used in combination.

Examples of the monomer (2) having an acid-eliminable group include known monomers used in the production of resist polymers. ArF excimer laser (wavelength 193 nm) or KrF excimer laser (wavelength 248 nm) is used. A (meth) acrylic acid ester having an acid leaving group is preferred from the viewpoint of obtaining a polymer suitable for forming the used resist pattern.
As the (meth) acrylic acid ester having an acid leaving group, monomers (2-1) to (2-28) are preferable. However, R and R ′ represent a hydrogen atom or a methyl group.

The monomer (3) having a hydrophilic group (excluding a monomer having a lactone skeleton and a monomer having an acid leaving group) is a component that improves the rectangularity of the resist pattern.
The hydrophilic group is at least one selected from the group consisting of —C (CF ₃ ) ₂ —OH, a hydroxy group, a cyano group, a methoxy group, a carboxy group, and an amino group.

  The amount of the monomer (3) having a hydrophilic group is preferably 5 mol% or more and more preferably 10 mol% or more in the monomer component (100 mol%) from the viewpoint of the rectangularity of the resist pattern. The amount of the monomer (3) having a hydrophilic group is preferably 30 mol% or less, and more preferably 25 mol% or less, from the viewpoints of adhesion of the resist film to the substrate and sensitivity. As the monomer (3) having a hydrophilic group, one type may be used alone, or two or more types may be used in combination.

Examples of the monomer (3) having a hydrophilic group include known monomers used for the production of resist polymers, and an ArF excimer laser (wavelength 193 nm) or a KrF excimer laser (wavelength 248 nm) was used. In view of obtaining a polymer suitable for forming a resist pattern, a (meth) acrylic acid ester having a hydrophilic group is preferred.
As the (meth) acrylic acid ester having a hydrophilic group, monomers (3-1) to (3-15) are preferable. However, R represents a hydrogen atom or a methyl group.

The monomer (4) having a nonpolar alicyclic skeleton (except for a monomer having a lactone skeleton, a monomer having an acid-eliminable group, and a monomer having a hydrophilic group), It is a component that improves the dry etching resistance of the resist pattern.
The amount of the monomer (4) having a nonpolar alicyclic skeleton is not particularly limited, but is preferably 20 mol% or less in the monomer component (100 mol%). As the monomer (4) having a nonpolar alicyclic skeleton, one type may be used alone, or two or more types may be used in combination.

Examples of the monomer (4) having a nonpolar alicyclic skeleton include known monomers used in the production of resist polymers, such as ArF excimer laser (wavelength 193 nm) or KrF excimer laser (wavelength 248 nm). (Meth) acrylic acid ester having a nonpolar alicyclic skeleton is preferable from the viewpoint of obtaining a polymer suitable for forming a resist pattern using.
Examples of the (meth) acrylic acid ester having a nonpolar alicyclic skeleton include cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, norbornyl (meth) acrylate, adamantyl (meth) acrylate, (meth) Examples include tricyclodecanyl acrylate and dicyclopentadienyl (meth) acrylate. The (meth) acrylic acid ester having a nonpolar alicyclic skeleton may have a linear or branched alkyl group having 1 to 6 carbon atoms on the alicyclic skeleton.
As the (meth) acrylic acid ester having a nonpolar alicyclic skeleton, monomers (4-1) to (4-5) are preferable. However, R represents a hydrogen atom or a methyl group.

Examples of other monomer (5) include methyl (meth) acrylate, ethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-propyl (meth) acrylate, and (meth) acrylic acid. Isopropyl, n-butyl (meth) acrylate, isobutyl (meth) acrylate, methoxymethyl (meth) acrylate, n-propoxyethyl (meth) acrylate, iso-propoxyethyl (meth) acrylate, (meth) acryl N-butoxyethyl acid, iso-butoxyethyl (meth) acrylate, tert-butoxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, (meth) acrylic 2-hydroxy-n-propyl acid, 4-hydroxy-n-butyl (meth) acrylate, 2-methacrylic acid (meth) acrylate, 1-ethoxyethyl (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoro- (meth) acrylic acid n-propyl, 2,2,3,3,3-pentafluoro-n-propyl (meth) acrylate, methyl α- (tri) fluoromethyl acrylate, ethyl α- (tri) fluoromethyl acrylate, α- 2-ethylhexyl (tri) fluoromethyl acrylate, n-propyl α- (tri) fluoromethyl acrylate, iso-propyl α- (tri) fluoromethyl acrylate, n-butyl α- (tri) fluoromethyl acrylate, iso-butyl α- (tri) fluoromethyl acrylate, tert-butyl α- (tri) fluoromethyl acrylate, α- (tri) Methoxymethyl fluoromethyl acrylate, ethoxyethyl α- (tri) fluoromethyl acrylate, n-propoxyethyl α- (tri) fluoromethyl acrylate, iso-propoxyethyl α- (tri) fluoromethyl acrylate, α- It has a linear or branched structure such as n-butoxyethyl (tri) fluoromethyl acrylate, iso-butoxyethyl α- (tri) fluoromethyl acrylate, tert-butoxyethyl α- (tri) fluoromethyl acrylate (meta ) Acrylic acid ester;
2-methyl-2,4-butanediol di (meth) acrylate, 2,5-dimethyl-2,5-hexanediol di (meth) acrylate, 1,4-butanediol di (1- (meth) acryloyloxy) Ethyl ether, 1,4-butanediol di (1- (meth) acryloyloxy) methyl ether, (meth) acryloyloxyethylene glycol dimer (1- (meth) acryloyloxy) ethyl ether, (meth) acryloyloxyethylene glycol dimer A polyfunctional (meth) acrylic acid ester having an acid-decomposable group such as (1- (meth) acryloyloxy) methyl ether;
Styrene, α-methylstyrene, vinyltoluene, p-hydroxystyrene, p-tert-butoxycarbonylhydroxystyrene, 3,5-di-tert-butyl-4-hydroxystyrene, 3,5-dimethyl-4-hydroxystyrene, aromatic alkenyl compounds such as p-tert-perfluorobutylstyrene and p- (2-hydroxy-iso-propyl) styrene;
Unsaturated carboxylic acids and carboxylic anhydrides such as (meth) acrylic acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride;
Ethylene, propylene, norbornene, tetrafluoroethylene, acrylamide, N-methylacrylamide, N, N-dimethylacrylamide, vinyl chloride, vinyl fluoride, vinylidene fluoride, vinylpyrrolidone;
And monomers (5-1) to (5-15). However, R represents a hydrogen atom or a methyl group.

  The amount of the other monomer (5) is not particularly limited, but is preferably 20 mol% or less in the monomer component (100 mol%). Another monomer (5) may be used individually by 1 type, and may be used in combination of 2 or more type.

As the polymerization initiator, those that generate radicals efficiently by heat are preferable. Examples of such a polymerization initiator include 2,2′-azobisisobutyronitrile, dimethyl-2,2′-azobisisobutyrate, 2,2′-azobis [2- (2-imidazoline- Azo compounds such as 2-yl) propane]; organic peroxides such as 2,5-dimethyl-2,5-bis (tert-butylperoxy) hexane and di (4-tert-butylcyclohexyl) peroxydicarbonate Etc.
In the case where the polymer obtained by the production method of the present invention is used for an ArF excimer laser (wavelength: 193 nm) lithography application, a polymerization initiator is used because the light transmittance (transmittance with respect to light having a wavelength of 193 nm) is not reduced as much as possible. As for, what does not have an aromatic ring in molecular structure is preferable. In consideration of safety during polymerization, the polymerization initiator preferably has a 10-hour half-life temperature of 60 ° C. or higher.
The amount of the polymerization initiator is not particularly limited, but is preferably 0.3 mol parts or more, more preferably 1 mol parts or more with respect to 100 mol parts of the monomer component, from the viewpoint of increasing the yield of the polymer. Moreover, 30 mol parts or less are preferable with respect to 100 mol parts of monomer components from the point which narrows the molecular weight distribution of a polymer.

As the solvent, a solvent capable of dissolving any of the monomer component, the polymerization initiator, the obtained polymer, and the chain transfer agent when the chain transfer agent described later is used in combination is preferable. Examples of the solvent include ethers (chain ethers such as diethyl ether and propylene glycol monomethyl ether, cyclic ethers such as tetrahydrofuran and 1,4-dioxane, etc.), esters (methyl acetate, ethyl acetate, butyl acetate, ethyl lactate). , Butyl lactate, propylene glycol monomethyl ether acetate, γ-butyrolactone, etc.), ketone (acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.), amide (N, N-dimethylacetamide, N, N-dimethylformamide, etc.), sulfoxide. (Dimethyl sulfoxide, etc.), hydrocarbons (aromatic hydrocarbons such as benzene, toluene, xylene, aliphatic hydrocarbons such as hexane, alicyclic hydrocarbons such as cyclohexane, etc.), mixed solvents thereof and the like. . A solvent may be used individually by 1 type and may use 2 or more types together.
The amount of the solvent is the total amount of the dropping solvent and the charged solvent, and is preferably 30 to 700 parts by mass with respect to the monomer component (100 parts by mass).
When two or more solvents are used in the dropping polymerization method, the mixing ratio of the solvent in the dropping solvent and the charged solvent can be set at an arbitrary ratio.
Although the monomer density | concentration of the monomer solution in the mixing tank 20 is not specifically limited, 5-50 mass% is preferable.
The amount of the charged solvent is not particularly limited and may be determined as appropriate. Usually, it is 30-700 mass parts with respect to 100 mass parts of whole quantity of a monomer component.

In the step (a), a chain transfer agent may be used as long as the storage stability of the resist composition is not hindered. By using a chain transfer agent, a polymer having a low molecular weight and a small molecular weight distribution can be produced. Examples of the chain transfer agent include 1-butanethiol, 2-butanethiol, 1-octanethiol, 1-decanethiol, 1-tetradecanethiol, cyclohexanethiol, 2-methyl-1-propanethiol, 2-mercaptoethanol, Examples include mercaptoacetic acid and 1-thioglycerol. As the chain transfer agent, those having no aromatic ring are preferable from the viewpoint of reducing the light transmittance (transmittance with respect to light having a wavelength of 193 nm) as much as possible.
The amount of the chain transfer agent is preferably 1 to 20 mole parts relative to the monomer component (100 mole parts).

The polymerization temperature in the step (a) is preferably 50 ° C. or higher, and preferably 150 ° C. or lower.
The polymerization time is preferably 1 hour or longer, and preferably 24 hours or shorter.

(B) Process:
The method for obtaining a polymer dispersion varies depending on the polymerization method in step (a).
In the case of the solution polymerization method (drop polymerization method), the dispersion liquid (α) is obtained by pouring the obtained polymer solution into a poor solvent to precipitate the polymer.
In the case of the emulsion polymerization method, the polymer slurry (β) is obtained by coagulating the polymer in the obtained latex by aciding out or salting out.
In the case of the suspension polymerization method, the obtained polymer suspension becomes the suspension (γ) as it is.
In the case of bulk polymerization, the obtained polymer is pulverized and then dispersed in a dispersion medium to obtain the dispersion liquid (δ).

In the case where the polymer solution obtained by the solution polymerization method (drop polymerization method) is poured into a poor solvent to precipitate the polymer, for example, it is performed as follows.
The polymer solution in the polymerization tank 20 shown in FIG. 1 is diluted with a good solvent to an appropriate solution viscosity as necessary.
A poor solvent is injected into a purifier 30 having a stirrer 32 and a jacket. The polymer solution in the polymerization tank 20 is supplied to the purification tank 30 and added dropwise to the poor solvent while stirring with the stirrer 32 to precipitate the polymer to obtain a polymer dispersion.

Examples of the good solvent include the solvents used in step (a).
Examples of the poor solvent include a poor solvent for the resist polymer.
The amount of the poor solvent is preferably 300 to 3000 parts by mass with respect to 100 parts by mass of the polymer solution.

(C) Process:
The polymer dispersion in the purification tank 30 shown in FIG. 1 is supplied to a vacuum filter 40 having a filter 42, and the polymer dispersion is filtered using the filter 42 to recover the polymer powder. To do.
As the filter 42, it is preferable to use a filter having the difference (XY) before being used for filtration of 1.8 μS / cm or less.
Instead of vacuum filtration, a pressure filter, gravity filtration, squeeze filter, centrifuge, or the like may be used. Moreover, you may use 2 or more types together.

(D) Process:
A poor solvent is injected into the purification tank 30 shown in FIG. (C) The polymer wet powder collected by the vacuum filter 40 in the step is put into the purification tank 30 and stirred by the stirrer 32 and dispersed in a poor solvent to obtain a polymer dispersion.
As a poor solvent, the poor solvent used at the (b) process is mentioned.
The amount of the poor solvent is preferably 300 to 3000 parts by mass with respect to 100 parts by mass of the polymer wet powder.

(E) Process:
In the same manner as in the step (c), the polymer dispersion is filtered using the filter 42 to produce a polymer wet powder.
As the filter 42, the filter used in the step (c) may be used as it is. Instead of the filter used in the step (c), a filter having the difference (XY) of 1.8 μS / cm or less is newly added. It may be prepared and used.

(F) Process:
(E) The polymer powder produced in the step is moved to the dryer 50 together with the filter 42. Next, the polymer wet powder is dried in the dryer 50 while being placed on the filter to obtain a polymer powder as a final product. When the polymer powder is dried on the filter, the polymer powder may be wrapped with the filter 42, and the periphery of the filter 42 may be gathered at one place and tied with a string or the like.
As the dryer 50, a vacuum dryer, an indirect heating method box type drying device (vacuum), an indirect heating method box type drying device (freezing vacuum), an indirect heating method stirring drying device (dish shape, round shape, groove shape), Indirect heating type rotary dryer, indirect superheated drum type dryer, direct superheated box type dryer (parallel, aerated, fluidized bed), direct heating type tunnel type dryer, direct heating type band type dryer (parallel, aerated) ), Direct heating method sheet drying device, direct heating method multi-stage disc drying device, direct heating method vertical turbo drying device, direct heating method vertical aeration drying device, direct heating method rotary drying device (direct, aeration), direct heating Vibration drying device, direct heating method fluidized drying device, direct heating method airflow drying device, direct heating method spray drying device, direct heating method foam layer drying device, infrared drying device, high frequency drying device, ultrasonic drying置等 and the like. As the dryer, an indirect heating type box-type dryer is preferable from the viewpoint of excellent sensitivity and resolution when used as a resist composition.
The drying temperature is preferably 20 to 100 ° C.
The drying time is preferably 2 to 200 hours.

<Polymer, resist composition>
The metal and metalloid contents contained in the polymer powder obtained by the production method of the present invention are Na, K, Mg, Al, Ca, Cr, Mn, Fe, Ni, Cu, Zn, Sn, Pb, Co, About Li, 300 ppb or less is preferable in a polymer powder, 100 ppb or less is more preferable, 50 ppb or less is further more preferable, and 20 ppb or less is especially preferable. Further, Si is preferably 500 ppb or less, more preferably 300 ppb or less, further preferably 100 ppb or less, and particularly preferably 50 ppb or less in the polymer powder.
Here, “metal” and “metalloid” in the present invention mean commonly used “metal” and “metalloid” (Iwanami “Science and Chemistry Dictionary” third edition supplement, Iwanami Shoten Co., Ltd.). To do.

The metal and metalloid content contained in the polymer is represented by a mass / mass ratio with respect to the mass of the solid content contained in the polymer powder or polymer solution.
Measurement of metal and metalloid content is performed as follows.
An organic solvent that is infinitely miscible with water is purified by non-boiling distillation, and a solid polymer is dissolved in this to form a polymer solution. Then, the polymer solution is directly introduced into an inductively coupled plasma mass spectrometer (ICP-MS) apparatus. Measure the content.

The organic solvent that is infinitely miscible with water is not particularly limited, but those having a relatively high boiling point are preferable. Also preferred are those sold as electronic industry grades that guarantee a certain level of low metal and low metalloid levels. Examples thereof include N-methylpyrrolidone, γ-butyrolactone, N, N-dimethylacetamide and the like. Among these, N-methylpyrrolidone is particularly preferable from the viewpoints of polymer solubility, stability of metal and metalloid standards, chemical stability during non-boiling distillation, and the like.
Non-boiling distillation means that the organic solvent that is the subject of distillation is evaporated at a temperature below the boiling point without being boiled, cooled and agglomerated, and distilled. It becomes possible to obtain an ultra-high purity organic solvent purified to have a metal element concentration of 20 ppt or less.

  Although it does not restrict | limit especially as an inductively coupled plasma mass spectrometry (ICP-MS) apparatus, For example, the apparatus provided with detection means, such as a double focusing type | mold high resolution mass spectrometer and a quadrupole mass spectrometer, is mentioned. Among them, a quadrupole mass spectrometer is preferable, and a collision / reaction cell method has been developed for the apparatus, which is very effective in eliminating polyatomic ion interference.

  There are a calibration curve method and a standard addition method as a method for quantifying metals with an ICP-MS apparatus. In the case of ultra-trace metal analysis, it is preferable not to add an internal standard because adding an internal standard may cause contamination. Further, when the sample is a solid polymer, it is dissolved in a solvent and used as a polymer solution. However, since the sample has viscosity, the amount of sample sucked up and how the mist is blown by the nepriser is different from that of the solvent alone. For these reasons, the standard addition method is preferable as a method for quantifying the metal, and it is preferable to quantitate both the sample solution and the solvent to correct the metal content in the solvent.

  As polyatomic ion interference when organic substances are directly introduced into an ICP-MS apparatus, polyatomic ion interference that is a compound with argon (Ar), which is a plasma gas, and in addition to these, compounds of hydrogen, carbon, and nitrogen There is polyatomic ion interference that is In ultra-trace metal analysis, it is particularly important to detect these target metal ions with high sensitivity by selecting appropriate ICP-MS measurement conditions to eliminate these polyatomic ion interferences. The quantification in ultra-trace metal analysis depends on how low the analytical value can be obtained by using an excellent analytical technique (mass number to be detected, tuning selection, etc.).

The technique for mitigating polyatomic ion interference is not particularly limited as long as it can reduce polyatomic ion interference and efficiently detect necessary metal ions, and includes the following three processes, for example.
(1) CID (Collision induced dissociation): polyatomic ions are decomposed by collision energy with cell gas.
(2) ED (energy discrimination): Uses the difference in collision cross section of the measurement element and interfering polyatomic ions with respect to cell gas.
(3) Reaction: Utilizing the difference in reaction rate of the measurement element and interfering polyatomic ions with respect to cell gas.
As cell gas, it is preferable to use an inert gas such as helium (He) in the case of (1) and (2), and to use a highly reactive gas such as hydrogen (H ₂ ) in the case of (3). It is.
Note that the likelihood of CID, ED, and reaction depends on the reaction enthalpy of each element, the reaction rate constant, the ionization potential, the mass and radius of ions and gas molecules, and the kinetic energy of the ions.

In the case of a resist polymer, the mass average molecular weight of the polymer powder obtained by the production method of the present invention is preferably 1000 or more, and more preferably 1000000 or less. When the resist polymer is used in a positive resist composition, the mass average molecular weight of the resist polymer is preferably 1000 or more, more preferably 2000 or more, from the viewpoint of etching resistance and resist pattern shape. It is especially preferable that it is 5000 or more. In the case where the resist polymer is used as a positive resist composition, the mass average molecular weight of the resist polymer is preferably 100,000 or less, more preferably 50,000 or less, from the viewpoint of solubility in a solvent and resolution. Is more preferable, and it is especially preferable that it is 20000 or less.
The molecular weight distribution (Mw / Mn) of the polymer powder obtained by the production method of the present invention is not particularly limited, but in the case of using as a resist polymer, 2. 5 or less is preferable, 2.3 or less is more preferable, and 2.0 or less is particularly preferable.

  The resist polymer is suitably used as a raw material for the resist composition. The resist composition is obtained by dissolving a resist polymer in a solvent. The chemically amplified resist composition is obtained by dissolving a resist polymer and a photoacid generator in a solvent. The resist polymer may be used alone or in combination of two or more. The resist composition may contain a polymer other than the resist polymer obtained by the production method of the present invention.

The solvent for the resist composition is arbitrarily selected according to use conditions and the like.
Examples of the solvent include linear or branched ketones such as methyl ethyl ketone, methyl isobutyl ketone, 2-pentanone and 2-hexanone; cyclic ketones such as cyclopentanone and cyclohexanone; propylene glycol monomethyl ether acetate, propylene glycol monoethyl Propylene glycol monoalkyl ether acetates such as ether acetate; Ethylene glycol monoalkyl ether acetates such as ethylene glycol monomethyl ether acetate and ethylene glycol monoethyl ether acetate; Propylene glycol monoalkyl such as propylene glycol monomethyl ether and propylene glycol monoethyl ether Ethers; ethylene glycol monomethyl ether, ethylene glycol Ethylene glycol monoalkyl ethers such as monoethyl ether; diethylene glycol alkyl ethers such as diethylene glycol dimethyl ether and diethylene glycol monomethyl ether; esters such as ethyl acetate and ethyl lactate; n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, cyclohexanol , Alcohols such as 1-octanol; 1,4-dioxane, ethylene carbonate, γ-butyrolactone; pentane, 2-methylbutane, n-hexane, 2-methylpentane, 2,2-dibutylbutane, 2,3-dibutylbutane , N-heptane, n-octane, isooctane, 2,2,3-trimethylpentane, n-nonane, 2,2,5-trimethylhexane, n-decane, n-dodecane, etc. 11 aliphatic hydrocarbon solvents. A solvent may be used individually by 1 type and may use 2 or more types together.
As the solvent, propylene glycol monomethyl ether acetate, ethyl lactate, cyclohexanone, and γ-butyrolactone are preferable because they are highly safe and widely used.

  The concentration (solid content concentration) of the polymer in the resist composition (solution) is not particularly limited, but is preferably 50% by mass or less in the resist composition (100% by mass) from the viewpoint of the viscosity of the resist composition. The mass% or less is more preferable, and 30 mass% or less is more preferable. The concentration of the polymer in the resist composition is preferably 2% by mass or more, more preferably 5% by mass or more, and further preferably 8% by mass or more from the viewpoint of the resist film thickness.

When the resist polymer is used for a chemically amplified resist composition, it is necessary to use a photoacid generator.
The photoacid generator can be arbitrarily selected from those that can be used as the acid generator of the chemically amplified resist composition. A photo-acid generator may be used individually by 1 type, and may use 2 or more types together.

  Examples of the photoacid generator include onium salt compounds, sulfonimide compounds, sulfone compounds, sulfonic acid ester compounds, quinone diazide compounds, diazomethane compounds, and the like. Of these, the photoacid generator is preferably an onium salt compound such as a sulfulonium salt, iodonium salt, phosphonium salt, diazonium salt, pyridinium salt, specifically, triphenylsulfonium triflate, triphenylsulfonium hexafluoro. Antimonate, triphenylsulfonium naphthalenesulfonate, (hydroxyphenyl) benzylmethylsulfonium toluenesulfonate, diphenyliodonium triflate, diphenyliodonium pyrenesulfonate, diphenyliodonium dodecylbenzenesulfonate, diphenyliodonium hexafluoroantimonate, p-methylphenyldiphenylsulfonium nonafluoro Butanesulfonate, tri (tert-butylphenyl) sulfonium Trifluoromethanesulfonate and the like.

  The amount of the photoacid generator is appropriately determined depending on the type of the photoacid generator selected, and is usually 0.1 parts by mass or more and 0.5 parts by mass or more with respect to 100 parts by mass of the resist polymer. More preferred. By setting the amount of the photoacid generator within this range, a chemical reaction due to the catalytic action of the acid generated by exposure can be sufficiently caused. Moreover, the quantity of a photo-acid generator is 20 mass parts or less normally with respect to 100 mass parts of resist polymers, and 10 mass parts or less are more preferable. By setting the amount of the photoacid generator within this range, the stability of the resist composition is improved, and the occurrence of uneven coating during application of the composition, scum during development, etc. is sufficiently reduced.

  Furthermore, a nitrogen-containing compound can also be mix | blended with a chemically amplified resist composition. By containing a nitrogen-containing compound, the resist pattern shape, the stability over time, and the like are further improved. In other words, the cross-sectional shape of the resist pattern is closer to a rectangle, and the resist film is exposed, post-exposure baked (PEB), and left for several hours before the next development process. Yes, the occurrence of deterioration of the cross-sectional shape of the resist pattern is further suppressed when left as such (timed).

Any known compounds can be used as the nitrogen-containing compound, and among these, amines are preferable, and secondary lower aliphatic amines and tertiary lower aliphatic amines are more preferable. The lower aliphatic amine means an alkyl or alkyl alcohol amine having 5 or less carbon atoms.
Examples of the secondary lower aliphatic amine and tertiary lower aliphatic amine include trimethylamine, diethylamine, triethylamine, di-n-propylamine, tri-n-propylamine, tripentylamine, diethanolamine, triethanolamine and the like. Is mentioned. Among these, as the nitrogen-containing compound, a tertiary alkanolamine such as triethanolamine is more preferable.
A nitrogen-containing compound may be used individually by 1 type, and may use 2 or more types together.

  The amount of the nitrogen-containing compound is appropriately determined depending on the type of the selected nitrogen-containing compound, and is usually preferably 0.01 parts by mass or more with respect to 100 parts by mass of the resist polymer. By making the amount of the nitrogen-containing compound within this range, the resist pattern shape can be made more rectangular. The amount of the nitrogen-containing compound is usually preferably 2 parts by mass or less with respect to 100 parts by mass of the resist polymer. By setting the amount of the nitrogen-containing compound within this range, deterioration in sensitivity can be reduced.

The chemically amplified resist composition may also contain an organic carboxylic acid, a phosphorus oxo acid, or a derivative thereof. By containing these compounds, it is possible to prevent sensitivity deterioration due to the compounding of the nitrogen-containing compound, and further improve the resist pattern shape, the stability with time of standing, and the like.
As the organic carboxylic acid, for example, malonic acid, citric acid, malic acid, succinic acid, benzoic acid, salicylic acid and the like are preferable.
Phosphorus oxoacids or derivatives thereof include, for example, phosphoric acid, phosphoric acid di-n-butyl ester, phosphoric acid diphenyl ester and other phosphoric acid and derivatives thereof; phosphonic acid, phosphonic acid dimethyl ester Phosphonic acids such as phosphonic acid di-n-butyl ester, phenylphosphonic acid, phosphonic acid diphenyl ester, phosphonic acid dibenzyl ester and the like; derivatives such as phosphinic acid, phenylphosphinic acid and the like Examples include derivatives such as esters. Of these, phosphonic acid is preferred.
These compounds (organic carboxylic acid, phosphorus oxo acid, or derivatives thereof) may be used alone or in combination of two or more.

  The amount of these compounds (organic carboxylic acid, phosphorus oxo acid, or derivative thereof) is appropriately determined depending on the type of the selected compound and the like, and is usually 0.01 mass per 100 mass parts of the resist polymer. Part or more is preferred. By setting the amount of these compounds within this range, the resist pattern shape can be made more rectangular. The amount of these compounds (organic carboxylic acid, phosphorus oxo acid, or derivative thereof) is usually preferably 5 parts by mass or less with respect to 100 parts by mass of the resist polymer. By reducing the amount of these compounds within this range, the film loss of the resist pattern can be reduced.

Both the nitrogen-containing compound and one or more selected from the group consisting of organic carboxylic acids, phosphorus oxo acids and derivatives thereof may be contained in the chemically amplified resist composition, or only one of them may be contained. May be.
Further, the resist composition may contain various additives such as surfactants, quenchers other than the nitrogen-containing compounds, sensitizers, antihalation agents, storage stabilizers, antifoaming agents, etc., as necessary. Also good. Any of these additives can be used as long as it is known in the art. Moreover, the addition amount of these additives is not specifically limited, What is necessary is just to determine suitably.

  The resist composition of the present invention may be used as a resist composition for metal etching, photofabrication, plate making, hologram, color filter, retardation film and the like.

A resist pattern can be formed using the resist composition of the present invention. An example of a method for forming a resist pattern using the resist composition will be described.
First, a resist composition is applied to the surface of a substrate to be processed such as a silicon wafer on which a pattern is formed by spin coating or the like. And the to-be-processed board | substrate with which this resist composition was apply | coated is dried by baking process (prebaking) etc., and a resist film is formed on a board | substrate.

Next, the resist film thus obtained is irradiated with light having a wavelength of 250 nm or less through a photomask (exposure). The light used for exposure is preferably a KrF excimer laser, an ArF excimer laser, or an F ₂ excimer laser, and particularly preferably an ArF excimer laser. Moreover, you may expose with an electron beam.

  After exposure, heat treatment is appropriately performed (post-exposure baking, PEB), the substrate is immersed in an alkaline developer, and the exposed portion is dissolved in the developer and removed (development). Any known alkaline developer may be used. Then, after development, the substrate is appropriately rinsed with pure water or the like. In this way, a resist pattern is formed on the substrate to be processed.

  In general, a substrate to be processed on which a resist pattern is formed is appropriately heat-treated (post-baked) to reinforce the resist pattern, and a portion without the resist pattern is selectively etched. After etching, the resist pattern is usually removed using a release agent.

  In the polymer production method of the present invention described above, the polymer wet powder is placed directly on the filter while being put on the filter, so that the polymer wet without using a container with impurities attached. Since the powder can be dried, a polymer with few impurities can be produced.

  In addition, in the polymer powder for uses other than the resist polymer, it is preferable that the metal content is low. Therefore, the production method of the present invention is suitable for producing polymer powder for uses other than the resist polymer. is there.

  Further, as a filter, the difference (X−Y) between the electrical conductivity (X) of water after immersion in the filter and the electrical conductivity (Y) of water before immersion in the filter is 1.8 μS / cm before being used for filtration. When the following filter is used, contamination of impurities from the filter can be suppressed.

Moreover, since the polymer powder of the present invention is a polymer powder obtained by the production method of the present invention, the amount of impurities contained is small.
Moreover, since the resist composition of this invention is obtained by melt | dissolving the polymer powder obtained by the manufacturing method of this invention, there are few impurities contained.

  Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited thereto.

[Example 1]
(Manufacture of resist polymer)
(A) Process:
In a mixing tank having a stirrer and a jacket, monomer (1-1) (where R is a methyl group) 23.1 parts by mass, monomer (2-10) (where R is a methyl group) 26 0.7 parts by mass, monomer (3-4) (wherein R is a methyl group) 16.1 parts by mass, ethyl lactate 98.7 parts by mass, and dimethyl-2,2′-azo as a polymerization initiator 1.96 parts by mass of bisisobutyrate (manufactured by Wako Pure Chemical Industries, Ltd., V601) was injected and stirred to prepare a monomer solution.

  Under a nitrogen atmosphere, 54.9 parts by mass of ethyl lactate was poured into a polymerization tank having a nitrogen inlet, a stirrer, a jacket and a condenser, and the temperature was maintained at 80 ° C. while stirring. The monomer solution in the preparation tank was supplied to the polymerization tank and dropped into ethyl lactate maintained at 80 ° C. at a constant rate over 6 hours. Thereafter, the solution was kept at 80 ° C. for 1 hour to obtain a polymer solution.

(B) Process:
Into a purification tank having a stirrer and a jacket, 1078 parts by mass of methanol and 340 parts by mass of water were injected. 220 parts by mass of the polymer solution in the polymerization tank was supplied to the purification tank and dropped into the mixed solution of methanol and water while stirring to precipitate the polymer, thereby obtaining a polymer dispersion.

(C) Process:
Pure water was prepared. The electric conductivity of the pure water was measured at 18.2 ° C. using an electric conductivity meter (manufactured by Horiba, Ltd., Castany ACT conductivity meter ES-14) and found to be 0.39 μS / cm. .
Production of previous lot (monomer (1-1) 35.1 mass% (40 mol%), monomer (2-10) 40.5 mass% (40 mol%), monomer (3-4 ) The polyester filter (made by Toray Industries, Inc., Miracle filter cloth) used in 24.4% by mass (20 mol%) (manufacture of a polymer comprising all R groups) may be pure water. Washed and rinsed with pure water. The washed filter is immersed in 20 L of pure water (electrical conductivity: 0.39 μS / cm) per 1 m ^{2 of} filter area, and the electric conductivity of water (X) in the state where the filter is immersed 15 minutes after the start of immersion. Was measured at 16.2 ° C. using an electric conductivity meter (manufactured by Horiba, Ltd., Castany ACT conductivity meter ES-14), it was 0.86 μS / cm. Therefore, the difference (X−Y) between the electrical conductivity (X) of the water after immersion in the filter and the electrical conductivity (Y) of the water before immersion in the filter was 0.47 μS / cm.
The polymer dispersion in the purification tank is supplied to a vacuum filter having a filter with the difference (XY) of 0.47 μS / cm, and the polymer dispersion is filtered using the filter. A polymer wet powder was produced.

(D) Process:
Into the purification tank, 1445 parts by mass of methanol and 255 parts by mass of water were injected. 140 parts by mass of polymer wet powder produced by a vacuum filter was put into a purification tank, stirred with a stirrer and dispersed in a mixed solution of methanol and water, and a polymer dispersion was obtained.

(E) Process:
The polymer dispersion in the purification tank was supplied to a vacuum filter having a filter, and the polymer dispersion was filtered using the filter to produce a polymer powder. As the filter, the filter used in the step (c) was used as it was without washing.

(F) Process:
Wrap the produced polymer powder in the filter used in step (e), put the filter's peripheral edge together in a single place and tie it with a string, and dry the filter together with the dryer (made by Shimizu Rika Seisakusho, explosion-proof vacuum drying) Machine VOW4-6B). Next, the inside of the dryer was depressurized with the polymer wet powder wrapped in a filter, and dried under conditions of a drying temperature of 60 ° C. and a drying time of 36 hours to obtain a polymer powder as a final product.

(Weight average molecular weight, molecular weight distribution of polymer)
20 mg of the polymer powder obtained in Example 1 was dissolved in 5 mL of tetrahydrofuran (THF) and filtered through a membrane filter having a pore size of 0.5 μm to prepare a sample solution. This sample solution was introduced into a gel permeation chromatography (GPC) manufactured by Tosoh Corporation, and the mass average molecular weight (Mw) and the number average molecular weight (Mn) were measured. Moreover, molecular weight distribution (Mw / Mn) was calculated | required from the mass average molecular weight (Mw) and the number average molecular weight (Mn). The results are shown in Table 1.
As a separation column, Showa Denko KK-made Shodex GPC K-805L (trade name) in series was used, and the solvent was THF (flow rate 1.0 mL / min). Used a differential refractometer. The measurement conditions were a measurement temperature of 40 ° C. and an injection volume of 0.1 mL. Standard polystyrenes F-80 (Mw = 706000), F-20 (Mw = 19000), F-4 (Mw = 37900), F-1 (Mw = 10200), A-2500 (Mw = 2630) as standard polymers ), A-500 (mixture of Mw = 682, 578, 474, 370, 260).

(Measurement of metal and metalloid content of polymer)
First, a crude electronic-grade N-methylpyrodon (hereinafter referred to as “NMP”) was introduced into a non-boiling batch-type transparent quartz acid distillation apparatus (manufactured by Fujiwara Seisakusho, SHF-special type) and distilled. The heater output was adjusted so that the speed was about 1 drop / 10 seconds to obtain non-boiling distilled NMP. The non-boiling distilled NMP was sufficiently low with metal and metalloid levels of 10 ppt or less for all elements.
Subsequently, the obtained polymer was dissolved in non-boiling distilled NMP to prepare a 5% by mass polymer solution. Using an Agilent 7500CS ICP-MS manufactured by Glass Expansion equipped with Microexp AR80-1-FM04 as a nebulizer, the metal and metalloid in the polymer solution were measured. The metalloid was quantified.
In addition, before the measurement, the non-boiling distilled NMP (blank) and the tuning liquid in which the metal concentration of the non-boiling distilled NMP is adjusted to 1 ppb so that the difference in the count number of metal ions is several tens of times, In addition, the blank was tuned so that all metals would be 1 digit or less with an integration time of 0.1 seconds.
All measurements were performed by the standard addition method. As a metal standard, XSTC-622 made by SPEX was used, and XSTC-622 was diluted with non-boiling distilled NMP and used for addition so that the concentration of each element was 100 ppb. The calibration curve was created by a linear regression line passing through the blank value at four points of blank, 200 ppt, 500 ppt, and 1000 ppt. Furthermore, in the measurement of non-boiling distilled NMP, XSTC-622 was diluted with non-boiling distilled NMP and used for addition so that the concentration of each element was 10 ppb. A calibration curve was prepared by a linear regression line passing through the blank value at four points of blank, 20 ppt, 50 ppt, and 100 ppt.
In addition, operations such as non-boiling distillation, sample preparation, standard preparation, and ICP-MS measurement were all performed in a class 1000 clean room.
The measurement results of metal and metalloid contents are shown in Table 1.

(Preparation of resist composition)
After mixing 100 parts by mass of the polymer powder obtained in Example 1, 400 parts by mass of propylene glycol monomethyl ether acetate, and 2 parts by mass of triphenylsulfonium triflate as a photoacid generator, a uniform solution was obtained. The resist composition was prepared by filtering through a membrane filter having a pore diameter of 0.1 μm.

(Formation of resist pattern)
The resist composition was spin-coated on a silicon wafer and prebaked at 120 ° C. for 60 seconds using a hot plate to form a resist film having a thickness of 0.4 μm. Next, after exposure using an ArF excimer laser exposure machine (wavelength: 193 nm), post-exposure baking was performed using a hot plate at 120 ° C. for 60 seconds. Subsequently, it developed at room temperature using the 2.38 mass% tetramethylammonium hydroxide aqueous solution, wash | cleaned with the pure water, and dried, and the resist pattern was formed.

(sensitivity)
The exposure amount (mJ / cm ² ) for forming a line-and-space (L / S = 1/1) with a line width of 1/1 was measured and used as sensitivity. The results are shown in Table 1.

(resolution)
The minimum dimension (μm) of the resist pattern resolved when exposed at the exposure amount was defined as the resolution. The results are shown in Table 1.

(Resist pattern)
The resist pattern was observed with a JSM-6340F field emission scanning electron microscope manufactured by JEOL, and the case where no defect occurred was evaluated as good, and the case where the defect occurred was evaluated as defective. The results are shown in Table 1.

[Examples 2 and 3]
A polymer powder was produced in the same manner as in Example 1 except that a filter having the difference (XY) shown in Table 1 was used as a filter, and a resist composition was prepared and evaluated. The evaluation results are shown in Table 1.

[Examples 4 and 5]
(A) The monomer component used in the step is monomer (1-12) (where R is a hydrogen atom), 33.7 parts by mass, monomer (2-2) (where R is a methyl group) 37.7 parts by mass and monomer (3-7) (where R is a methyl group) 19.7 parts by mass; dripping solvent changed to 136.7 parts by mass of propylene glycol monomethyl ether acetate Change the charged solvent to a mixed solvent of 33.41 parts by mass of propylene glycol monomethyl ether acetate and 42.5 parts by mass of γ-butyrolactone; dimethyl-2,2′-azobisisobutyrate (sum of polymerization initiator) The amount of V601 (trade name) manufactured by Kojun Pharmaceutical Co., Ltd. was changed to 3.50 parts by mass; the poor solvent used in step (b) was changed to 1824 parts by mass of methanol; and the filter used in step (c) Before (Monomer (1-12) (where R is a hydrogen atom) 37.0% by mass (40 mol%), monomer (2-2) (where R is a methyl group) 41 4% by mass (40 mol%), monomer (3-7) (where R is a methyl group) 21.6% by mass (production of a polymer comprising 20 mol%)) And the difference (X−Y) was changed to a filter having a numerical value shown in Table 1; the polymer was obtained in the same manner as in Example 1 except that the poor solvent used in the step (d) was changed to 1824 parts by mass of methanol. The resist composition was manufactured and evaluated. The evaluation results are shown in Table 1.

[Examples 6 and 7]
The monomer component used in the step (a) is monomer (1-1) (where R is a methyl group) 28.6 parts by mass, monomer (2-8) (where R is a methyl group) 30.6 parts by weight, and monomer (3-4) (where R is a methyl group) 19.8 parts by weight; the amount of ethyl lactate as the dropping solvent is 118.4 parts by weight The amount of ethyl lactate as a charging solvent was changed to 65.8 parts by mass; dimethyl-2,2′-azobisisobutyrate as a polymerization initiator (manufactured by Wako Pure Chemical Industries, Ltd., V601 ( (Name of product)) is changed to 2.32 parts by mass; the poor solvent used in step (b) is changed to 1190 parts by mass of methanol and 500 parts of water; Monomer (1-1) (where R is a methyl group) 36.2% by mass (40 mol%), monomer ( 2-8) (where R is a methyl group) 38.7% by mass (40 mol%), monomer (3-4) (where R is a methyl group) 25.1% by mass (20 mol%) And the difference (X−Y) is changed to a filter having a numerical value shown in Table 1; and the poor solvent used in the step (d) is 1269 parts by mass of methanol and water. Except having changed into 400 mass parts, the polymer was manufactured like Example 1 and the resist composition was prepared and evaluated. The evaluation results are shown in Table 1.

[Comparative Example 1]
A polymer powder was produced in the same manner as in Example 1 except that the polymer wet powder was transferred from the filter to a container and dried, and a resist composition was prepared and evaluated. The evaluation results are shown in Table 1.

[Comparative Example 2]
A polymer powder was produced in the same manner as in Example 1 except that the filter having the numerical value shown in Table 1 as the difference (XY) was used as the filter, and the polymer powder was transferred from the filter to the container and dried. Then, a resist composition was prepared and evaluated. The evaluation results are shown in Table 1.

[Comparative Example 3]
A polymer powder was produced in the same manner as in Example 4 except that the filter with the difference (XY) shown in Table 1 was used as the filter, and the polymer powder was transferred from the filter to the container and dried. Then, a resist composition was prepared and evaluated. The evaluation results are shown in Table 1.

[Comparative Example 4]
A polymer powder was produced in the same manner as in Example 6 except that the filter having the numerical value shown in Table 1 as the difference (XY) was used as the filter, and the polymer powder was transferred from the filter to the container and dried. Then, a resist composition was prepared and evaluated. The evaluation results are shown in Table 1.

As is clear from Table 1, the polymer powders of Examples 1 to 3 contained almost no metal component impurities. Moreover, in the resist composition, it was confirmed that the performance (sensitivity and resolution) of the resist film was small and the performance as designed was exhibited. Furthermore, the resist pattern was also good. Similar results were obtained for the polymer powders and resist compositions of Examples 4-7.
On the other hand, many metal components were contained in the polymer powder of Comparative Example 1. Moreover, the resist composition was not able to exhibit the performance as designed because the performance of the resist film was significantly different from those of Examples 1 to 3. This is because in the polymer drying step, the polymer powder is transferred to the container and dried, so that impurities adhering to the container are mixed into the polymer. The polymer powder of Comparative Example 2 also contained many metal components, and the resist composition did not exhibit the performance as designed because the performance of the resist film deviated significantly from Examples 1 to 3. The polymer powder of Comparative Example 3 also contained many metal components, and the resist composition did not exhibit the performance as designed because the performance of the resist film was significantly different from Examples 4 and 5. Further, the polymer powder of Comparative Example 4 also contained many metal components, and the resist composition did not exhibit the performance as designed because the performance of the resist film deviated significantly from Examples 6 and 7. .

  According to the method for producing a polymer powder of the present invention, it is possible to produce a polymer powder and a resist composition that have few impurities such as metal components and that can perform as designed in the intended use, and are composed of the resist composition. A reduction in accuracy, yield, and the like of circuits formed using the resist pattern can be suppressed.

It is a block diagram which shows an example of the manufacturing equipment of a polymer.

Explanation of symbols

42 Filter

Claims (4)

  A polymer having a step of producing a polymer wet powder by filtering a dispersion liquid in which a polymer is dispersed in a dispersion medium, and a step of drying the obtained polymer wet powder on the filter Powder manufacturing method. The method for producing a polymer powder according to claim 1, wherein the filter satisfies the following conditions before being used for filtration.
The difference (X−Y) between the electrical conductivity (X) of water after filter immersion and the electrical conductivity (Y) of water before filter immersion is 1.8 μS / cm or less. However, as the water before immersing the filter, pure water having an electric conductivity of 0.5 μS / cm or less is used, and the electric conductivity (X) of the water after immersing the filter is 20 L per 1 m ^{2 of} the filter area. The filter is immersed in water, and the electric conductivity of water measured in a state where the filter is immersed 15 minutes after the start of immersion is taken.   A polymer powder obtained by the method for producing a polymer powder according to claim 1. The resist composition obtained from the polymer powder obtained by the manufacturing method of the polymer powder of Claim 1 or 2.

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