JP2008056374A - Chip conveyor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip conveyor certainly catching chips by eliminating a clearance between inner peripheries of windows formed into a plate and a wire sheet. <P>SOLUTION: The plate P is so formed that a flat section Pc of the plate P, an adhesive e as a means to fill the clearance between the inner peripheries of the windows W and the first wire sheet A, the first fine wire sheet A for catching chips, a second rough wire sheet B for preventing the deformation of the first wire sheet, and a support plate D are assembled sequentially from the top. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a chip conveying conveyor that collects cutting waste discharged from a machine tool such as a lathe, a milling machine, or a grinding machine.

  Cutting chips discharged from machine tools such as lathes, milling machines, and grinding machines include relatively large chips generated when machining parts corresponding to the machining allowance of the workpiece, and when machining the surface finish of the workpiece. There are two types of swarf that generate relatively small chips.

  The cutting waste discharged from the machine tool is collected at the recovery position of the chip conveyor where the endless carrier with the used cutting fluid is installed so that it can circulate in a predetermined direction. A plurality of transported plate plates are transported and discharged to a discharge position of a predetermined height apart by a predetermined distance, and a relatively small amount of swarf is attached to the plate plate by gravity in the course of transport together with the used cutting fluid. It is separated from relatively large chips by passing through the window, collected in the cutting fluid reservoir installed at the bottom of the chip conveyor, and installed in the cutting fluid reservoir, such as a drum filter, paper filter, etc. It is filtered with a filtration device. The cutting fluid from which the cutting waste has been removed is cooled by a cooler and supplied again to the cutting place of the machine tool.

  However, in the above-described conventional chip conveying conveyor, the cutting chips that can be conveyed and discharged by the plate plate are limited to relatively large chips, and the relatively small chips together with the used cutting fluid are chip conveying conveyors. After being collected in the cutting fluid reservoir installed at the lower part of the filter, it must be filtered by a filter device such as a drum filter or paper filter provided. Filtration devices such as drum-type filters and paper-type filters have a small filtration area, so the filtration capacity is small. As a result, it takes time to filter the used cutting fluid, and the processing capacity of the chip conveyor is limited. Had the problem.

For this reason, as shown in Patent Document 1, the present applicant provides the plate plate with a plurality of windows, a wire mesh for capturing cutting waste, and a support plate for preventing the wire mesh from falling off. A chip conveyor is provided in which a relatively small swarf is captured by a wire mesh and only a used cutting fluid is allowed to pass through a plate (Japanese Patent Application No. 2004-93846).
JP 2005-154143 A

  In the chip conveying conveyor described in Patent Document 1, the plate plate and the support plate are fixed by welding or bolting, and the wire mesh is fixed by being sandwiched between the plate plate and the support plate. Here, in general, the plate plate has a distortion on a processed surface because a plurality of windows are press-formed on a long plate having a length of about 500 mm. Further, since the wire mesh is formed by weaving metal wires such as stainless steel, the surface has irregularities. For this reason, when the wire mesh is sandwiched between the plate plate and the support plate, a gap corresponding to distortion and unevenness is generated between the inner periphery of a plurality of windows installed on the plate plate and the wire mesh. As a result, in the process of conveyance, cutting chips smaller than the gap enter the gap generated between the inner peripheral frames of the plurality of windows installed on the plate plate and the wire mesh, and pass through the plate plate. There is a problem that the capture of cutting waste is incomplete. In addition, the wire mesh is formed with a fine mesh for the purpose of capturing relatively small chips, so it is easily deformed, the gap is enlarged in the process of conveyance, and the cutting waste passes through the plate plate. It has the problem that it becomes easy to do.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a chip transport conveyor that eliminates gaps between the inner peripheries of a plurality of windows installed on a plate plate and the wire mesh and prevents cutting waste from entering the gaps.

  The chip conveying conveyor according to the present invention that achieves the above-described object is configured such that a plurality of plate plates for conveying a conveyed product are continuously arranged and spanned between a drive shaft and a driven shaft, and the conveyed product is placed on the plate plate. In the chip conveying conveyor that conveys, the plate plate is provided with a wire mesh for capturing cutting waste and a window for opening the wire mesh in a predetermined range, and the inner peripheral edge of the window and the wire mesh are bonded, welded, Or it is characterized by being formed without gaps by integral molding.

  According to the present invention, since the inner peripheral edge of the window and the wire mesh are bonded, welded, or integrally molded, the gap between the inner peripheral edge of the window and the wire mesh is filled, and the inner peripheral edge of the window and the wire mesh are Cutting scraps do not enter the gaps between them, and deformation of the wire mesh is prevented.

  Here, the term “adhesion” refers to bonding a plate with a window and a wire mesh with a solvent-resistant adhesive, metal brazing, or solder. Further, the welding is to join the plate with window and the wire mesh by melting a part of the object by means of ultrasonic waves, spot current or spot heating. Moreover, integral molding is insert-molding a metal net | network to a plate board with a metal mold | die.

  For example, when the plate plate is made of metal, a solvent-resistant epoxy adhesive is applied to the wire mesh bonding surface of a plurality of plate plates with windows by pattern printing, dispenser application, brush coating, etc., and then the wire mesh is placed. There is a method in which the metal plate is sandwiched between the plate plate and the supporting plate for preventing the drop-off so as to close and fix the gap. Alternatively, after sandwiching the wire mesh between the plate plate and the support plate, by applying an adhesive between the inner peripheral frame of the plurality of windows and the wire mesh, so as to close the gap There are methods such as close fixing.

  Also, for example, when the plate plate is made of thermoplastic plastic, a wire mesh is placed on the wire mesh bonding surface of a plurality of plate plates with windows and heated to melt a part of the plate plate and embed the wire mesh After that, there is a method of fixing the support plate. Alternatively, there is a method in which a metal mesh is arranged in a mold, a plate plate resin is cast, and the metal mesh and the plate plate are insert-molded. As a method for fixing the plate plate and the support plate, there are methods such as adhesion, welding, and bolt fastening.

  According to the present invention, the wire mesh is composed of a first wire mesh having a fine mesh for capturing cutting waste and a second wire mesh having a coarse mesh for preventing deformation of the first wire mesh. It is preferable that a support plate for preventing the metal mesh and the second metal mesh from falling off is provided.

  According to the present invention, the wire mesh includes a first wire mesh having a fine mesh for capturing cutting waste, a second wire mesh having a coarse mesh for preventing deformation of the first wire mesh, and the first wire mesh. And a support plate for preventing the second wire mesh from falling off, the first wire mesh with a fine mesh reliably captures any cutting waste, and the second wire mesh with a coarse mesh The deformation of the first wire mesh can be prevented by the second wire mesh, and the falling of the second wire mesh can be prevented by the support plate.

  That is, in order to capture as much amount of cutting waste as possible on the plate plate, the window of the plate plate is inevitably enlarged, and thus the first wire mesh is required to have higher strength. It is done. On the other hand, in order to capture as fine a chip as possible, the mesh of the first wire mesh is inevitably thin, so that the strength is insufficient and the mesh is easily deformed. Therefore, by arranging the second wire mesh having a coarse mesh for preventing the deformation of the first wire mesh between the first wire mesh and the support plate, even if it is a large amount of cutting waste or fine chips, The first wire mesh can be reliably captured, and the second wire mesh can prevent deformation of the first wire mesh.

  Here, the unit of the mesh size of the wire mesh is referred to as a mesh, and is represented by the number of meshes between 1 inch (25.4 mm). Moreover, the length of the line which comprises the metal mesh, and the space of a line is called an opening (opening). Usually, in order to reduce the opening, the wire diameter is reduced to make the mesh finer. In order to enlarge the opening, the wire diameter is increased to make the mesh coarse. Examples of the wire include stainless steel wire, iron wire, galvanized iron wire, copper wire, and the like, but considering corrosion resistance, stainless steel wire is preferable. There are plain weave, twill weave, plain tatami weave, twill tatami weave, and the like, but in order to reduce the thickness and form a square mesh, plain weave is generally used.

  Here, the fine mesh is a mesh that reduces the opening by thinning the wire diameter to make the mesh fine. The coarse mesh is a mesh that enlarges the opening by increasing the wire diameter and making the mesh coarse.

  The mesh of the first wire mesh is appropriately adjusted in the range of usually 100 to 600 mesh in order to allow cutting fluid to pass through while capturing cutting waste. The mesh of the second wire mesh is appropriately adjusted in the range of usually 5 to 50 meshes in order to prevent the deformation of the first wire mesh. However, the mesh of the wire mesh may exceed the above range depending on the material and shape of the cutting waste, the material of the cutting fluid, and the like.

  As described above, by adhering the inner peripheries of the plurality of windows provided in the plate plate and the first wire mesh, it is possible to eliminate the gap and prevent the cutting waste (chips) from passing through the plate plate. The first wire mesh with a mesh (small opening) captures cutting scraps securely, and the second wire mesh with a coarse mesh (large opening) prevents the deformation of the first wire mesh, This prevents the second wire mesh from falling off.

  According to the present invention, the inner peripheral edge of the window and the wire mesh are bonded, welded, or integrally molded, so that cutting waste does not enter the gap between the inner peripheral edge of the window and the wire mesh, and the wire mesh Deformation will be prevented, and for this reason, cutting scraps can be reliably captured by the wire mesh.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.

(First embodiment)
A chip conveying conveyor C according to an embodiment of the present invention is shown in FIGS. FIG. 1 is a perspective view showing a state in which a plurality of plate plates P of the chip conveying conveyor C are connected. 2 and 3 are exploded perspective views of an arbitrary plate plate P of the chip conveying conveyor C. FIG. FIG. 4 is a perspective view of an arbitrary plate plate P of the chip transport conveyor C. FIG. FIG. 5 is a cross-sectional view of the chip transport conveyor C taken along the line AA.

  As shown in FIG. 1, the chip transport conveyor C includes a plurality of plate plates P for transporting a transported object, a pair of left and right side plates S and S attached to the plate plate P, and the side plates S and S. A pair of left and right chains T, T attached to the plate plate is provided.

  Each plate plate P is a steel plate material, and a concave portion Pa formed in an arc shape having a substantially semicircular cross section is formed at one end portion in the connecting direction of the plate plate P, and the other end portion in the connecting direction. Is formed with a convex portion Pb bent vertically, and a flat portion Pc is formed between the concave portion Pa and the convex portion Pb. A window W is formed in the flat portion Pc. The size and number of the windows W are appropriately determined from the capture rate of cutting waste, the passing rate of cutting fluid, and the strength of the plate plate P.

  As shown in FIGS. 2 and 3, the plate plate P has an adhesive e as a means for filling the gaps between the flat portion Pc of the plate plate P, the inner peripheral edges of the plurality of windows W, and the first wire net A from above. , A first wire mesh A for fine mesh for capturing cutting waste, a second wire mesh B for coarse mesh for preventing deformation of the first wire mesh, and a support plate D are assembled in this order. The first wire mesh A applies a solvent-resistant epoxy adhesive e to the lower surface of the flat portion Pc of the plate plate P as means for eliminating the gap between the inner peripheral frame of the window W and the first wire mesh A. . Here, the adhesive e is screen-printed on the flat portion Pc so as to form an adhesive exit window w1 corresponding to the window W. Since the printing area of the adhesive e need only secure a printing area that can eliminate the gap between the inner edge of the window W and the first wire mesh A, the adhesive is printed on the peripheral area of the inner edge of the window W of the flat portion Pc. There is no problem even if the adhesive is not printed on the whole, but in order to increase the bonding strength between the first wire mesh A and the flat portion Pc, the first wire mesh A is formed while forming the adhesive exit window w1. Screen printing is performed so that the entirety is bonded to the flat portion Pc. Note that the method of applying the adhesive e is not limited to printing, and may be application using a dispenser or a brush. The adhesive e may be applied in advance to the flat portion Pc, or may be applied after the first wire net A is installed on the flat portion Pc.

  A second wire mesh B is installed on the lower surface of the first wire mesh A. A support plate D is installed on the lower surface of the second wire mesh B. The support plate D is formed with an exit window w2 corresponding to the window W. The exit window w <b> 2 is the same size as the window W or larger than the window W in order to prevent the metal meshes A and B from falling off while ensuring the passage of the cutting fluid. The support plate D is a steel plate material, and the support plate D and the plate plate P are fixed by welding a part of the outer periphery. 4 is a perspective view of the plate plate P shown in FIG. FIG. 4A is a perspective view of the plate plate P as viewed from the upper surface side. FIG. 4B is a perspective view of the plate plate P viewed from the bottom side. Here, both the side surfaces of the support plate D in the longitudinal direction of the outer periphery and the plate plate P are welded and fixed at five locations on each side. In addition, as a fixing method of the support plate D and the plate plate P, any method such as adhesion, welding, and bolt fastening may be used. FIG. 2 shows a case where the exit window w2 has the same size as the window W, and FIG. 3 shows a case where the exit window w2 is larger than the window W. The chip conveying conveyor P can be reduced in weight by increasing the exit window w2.

  The first wire mesh A is a fine mesh, and the second wire mesh B is a coarse mesh. Even when the arrangement order of the wire mesh is reversed, the gap between the inner frame of the window W and the first wire mesh A is filled with an adhesive, so that the effect of capturing cutting waste and reinforcing the wire mesh can be obtained. Compared with the case where A has a fine mesh, it is advantageous in that it is easier to remove the captured cutting waste. If the mesh of the first wire mesh A is rough, the cutting chips supplemented in the gap formed between the first wire mesh A and the second wire mesh B are likely to be caught, but if the mesh of the first wire mesh A is fine, the first Since there is no gap between the wire mesh A and the second wire mesh B, the supplemented cutting waste is not caught.

FIG. 5 is a cross-sectional view of the chip transport conveyor P taken along the line AA. 5A, the first wire net A is attached to the lower surface of the flat portion Pc of the plate plate P, the second wire net B is then attached, and the support plate D is then attached. A gap between the inner peripheral frame of the window W of the flat portion Pc and the first wire net A is filled with an adhesive e (not shown). The support plate D and the plate plate P are fixed by welding a part of the outer periphery. The plate plate P and the side plate S are fixed by bolts b1 and nuts n1, and the chain T is attached to the plate plate P via the side plate S.
In FIG. 5B, the first metal net A, the second metal net B, and the support plate D are lengthened in accordance with the length of the plate plate P, so that the plate plate P, the first metal net A, the second The wire mesh B, the support plate D, and the chain T are simultaneously fixed by the bolt b1 and the nut n1, and welding of the support plate D and the plate plate P can be omitted. In FIG. 5C, the first wire net A is attached to the upper surface of the flat portion Pc of the plate plate P. 5B, the plate plate P, the first wire net A, the second wire net B, and the support plate D are assembled in this order from the top. 5C, the support plate D, the first wire net A, the second wire net B, and the plate plate P are assembled in this order from the top.

(Second embodiment)
FIG. 6 is a cross-sectional view taken along the line AA of the chip transport conveyor C2 according to another embodiment of the present invention.
In FIG. 6A, the wire mesh A is placed on the wire mesh bonding surface of the flat portion Pc of the plastic plate plate P2 and heated to melt a part of the plate plate P2 to embed the wire mesh A. FIG. 6 (b) shows that the first wire mesh A and the second wire mesh B that are matched to the length of the plate plate P2 are placed and heated, so that a part of the plate plate P2 is melted to be heated. A and the second wire mesh B are buried. The plate plate P2, the first wire mesh A, the second wire mesh B, and the chain T are simultaneously fixed by the bolt b1 and the nut n1, and the first wire mesh A and the second wire mesh B are more securely fixed. It will be certain.

  As described above, the present invention is not limited to the embodiment described above. For example, the metal meshes A and B can be integrally formed by insert molding at the time of molding the plastic plate plate P2.

  Thus, it goes without saying that the present invention can be modified as appropriate without departing from the spirit of the present invention.

It is a perspective view which shows the state which connected the several plate board of the chip conveyance conveyor of one embodiment of this invention. It is a disassembled perspective view of the plate of the chip conveyance conveyor of the said embodiment. It is a disassembled perspective view of the plate of the chip conveyance conveyor of the said embodiment. It is a perspective view of the plate of the chip conveyance conveyor of the said embodiment. It is AA sectional drawing of the chip conveyance conveyor of the said embodiment. It is AA sectional drawing of the chip conveyance conveyor of other embodiment of this invention.

Explanation of symbols

C chip conveyor,
P, P2 plate plate,
e Adhesive,
f welding,
A first wire mesh,
B Second wire mesh,
D support plate,
W, w1, w2 windows,
Pa concave portion, Pb convex portion, Pc flat portion,

Claims (2)

In a chip transport conveyor in which a plurality of plate plates for transporting a transported object are continuously arranged and spanned between a drive shaft and a driven shaft to transport the transported material on the plate plate,
The plate plate is provided with a wire mesh for capturing cutting waste, and a window for opening the wire mesh in a predetermined range,
The chip conveyor according to claim 1, wherein the inner peripheral edge of the window and the wire mesh are formed without any gaps by adhesion, welding, or integral molding. The wire mesh is composed of a first wire mesh having a fine mesh for capturing cutting scraps and a second wire mesh having a coarse mesh for preventing deformation of the first wire mesh, and the first wire mesh and the second wire mesh. 3. A chip conveying conveyor according to claim 2, further comprising a support plate for preventing the metal mesh from falling off.

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