JP2008053847A - Non-reciprocal circuit element and communication device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-reciprocal circuit element that has a structure capable of arranging various kinds of functional components and can be manufactured with stable characteristics and a high yield, facilitates soldering work, and reduces size, thickness, and costs effectively, and to provide a communication device using the non-reciprocal circuit element. <P>SOLUTION: The non-reciprocal circuit element includes a support substrate 1 and the functional component 2. The support substrate 1 comprises a flat magnetic body. The functional component 2 is mounted onto one surface of the support substrate 1. The functional component 2 includes a magnetic rotor 21, a permanent magnet 23, and circuit components 221-224. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to non-reciprocal circuit elements such as isolators and circulators, and communication devices using the same.

  Non-reciprocal circuit elements such as isolators and circulators are used in mobile wireless devices such as mobile phones. Conventionally, this type of nonreciprocal circuit device has a necessary functional component incorporated in a magnetic metal container functioning as a yoke, as disclosed in Patent Document 1. The main functional parts are magnetic parts such as a magnetic rotor and a permanent magnet composed of a soft magnetic substrate and a central conductor, circuit parts such as a matching capacitor, and a termination resistor.

  A central conductor is assembled to the soft magnetic substrate, and a DC magnetic field is applied from a permanent magnet. The center conductor includes a plurality of center conductors arranged on one surface side of the soft magnetic substrate, and one end of the center conductor is soldered to the electrode of the circuit component. The circuit component usually has a ground electrode on the side opposite to the electrode to which one end of the center conductor is soldered, and this ground electrode is fixed to the bottom surface of the magnetic metal container by soldering.

  Further, each of the central conductors is branched from a ground electrode disposed on the other surface side of the soft magnetic substrate, and the ground electrode is fixed to the bottom surface of the magnetic metal container by soldering.

  As described above, the magnetic metal container must satisfy not only the function as a yoke but also the function as a conductor for soldering the ground electrode of the central conductor and the ground electrode of the circuit component. Therefore, conventionally, a magnetic metal container has a complicated structure in which a conductive magnetic substrate is molded in an insulating resin.

However, the complexity of the structure of the magnetic metal container increases the cost and becomes an obstacle to miniaturization and thinning. In addition, since the ground electrode of the circuit component and the ground electrode of the central conductor must be soldered on the bottom of the magnetic metal container having a depth, it is difficult to perform the soldering operation and the functional component is being inserted. Therefore, it is easy to produce position shift. For this reason, there has been a problem that misalignment, soldering failure, and the like that cannot be confirmed from the outside occur, leading to variation in characteristics and a decrease in yield.
JP 2002-141709 A

  An object of the present invention is to provide a non-reciprocal circuit element having a structure capable of manufacturing a stable characteristic with a high yield, and a communication device using the same.

  Another object of the present invention is to provide a non-reciprocal circuit device effective for miniaturization, thickness reduction, and cost reduction, and a communication device using the same.

  In order to solve the above-described problem, the nonreciprocal circuit device according to the present invention includes a support substrate and a functional component. The support substrate is made of a flat magnetic material, and the functional component is mounted on one surface of the support substrate.

  As described above, in the nonreciprocal circuit device according to the present invention, the support substrate has a flat plate shape, and the functional components are mounted on one surface of the support substrate. Unlike the case of using, the structure is simplified and the cost is reduced.

  Since the functional component is mounted on one surface of the support substrate, the functional component can be positioned with high accuracy. Even if a positional deviation occurs at the time of mounting, it can be confirmed and corrected, so that a product with stable characteristics can be manufactured with a high yield.

  Furthermore, since the support substrate on which the functional components are mounted is flat, it is smaller and thinner than conventional magnetic metal containers. Moreover, since the support substrate is a magnetic plate, it can satisfy the function as a yoke.

  The support substrate is preferably covered with at least one surface by an insulating film, and a ground electrode having no insulating film is provided within the surface of the insulating film. According to this structure, the ground electrode of the circuit component, the ground electrode of the center conductor, and the like can be directly soldered on one surface of the support substrate through the ground electrode of the support substrate. Parts other than the ground electrode are covered with an insulating film. By carrying out like this, it can avoid that an active part arises unnecessarily in a support substrate.

  In the nonreciprocal circuit device according to the present invention, the functional component may have a general configuration. That is, the functional component can include a magnetic rotor, a permanent magnet, and a circuit component. The magnetic rotor has a central conductor disposed on a soft magnetic substrate, and the permanent magnet applies a DC magnetic field to the magnetic rotor. The circuit component includes a capacitor, which is connected to the central conductor of the magnetic rotor.

  The nonreciprocal circuit device according to the present invention also includes a cover member as in the conventional case. The cover member is made of a magnetic material, and constitutes a yoke against the magnetic field generated by the permanent magnet together with the support substrate.

  Furthermore, the present invention also discloses a communication device including the above-described non-reciprocal circuit element, such as a mobile wireless device such as a mobile phone.

According to the present invention described above, the following effects can be obtained.
(A) It is possible to provide a nonreciprocal circuit element that facilitates the arrangement of various functional components and soldering work, and a communication device using the nonreciprocal circuit element.
(B) It is possible to provide an irreversible circuit element effective for miniaturization, thinning, and cost reduction, and a communication device using the same.

  Other features of the present invention and the operational effects thereof will be described in more detail by embodiments with reference to the accompanying drawings.

  1 is an exploded perspective view showing an embodiment of a non-reciprocal circuit device according to the present invention, FIG. 2 is a perspective view showing an internal structure arrangement, and FIG. 3 is a perspective view showing a completed state. 2 and 3 are different from FIG. 1 in the viewing direction by 180 degrees. The illustrated nonreciprocal circuit device illustrates two possible types, that is, an isolator of an isolator or a circulator, and includes a support substrate 1 and a functional component 2.

  The support substrate 1 is made of a flat magnetic material. Specifically, it is a magnetic metal plate, a ferrite magnetic plate, or a composite magnetic plate in which magnetic powder and synthetic resin are mixed. When the support substrate 1 is made of a magnetic material having conductivity, such as a magnetic metal plate, the entire surface is covered with a thin insulating film, in particular, an electrodeposition film, and a ground electrode without an insulating film is provided where necessary. Is used as a ground electrode. When the support substrate 1 has an insulating property, a conductor film serving as a ground electrode is formed at a predetermined position on the support substrate 1. The embodiment shows a case where the former structure is adopted. That is, a magnetic metal plate mainly composed of Fe or the like is used as the support substrate 1, and an insulating film is thinly deposited on the entire surface by electrodeposition, and ground electrodes 110 to 116 having no insulating film are formed at required positions. The structure is formed. In the ground electrodes 110 to 116, the surface of the magnetic metal plate constituting the support substrate 1 is exposed.

  Electrodeposition involves immersing an object (conductor) in a tank containing a conductive water-soluble paint, using this object as a cathode, and using the electrode immersed in the water-soluble paint as an anode as a direct current. This is carried out by applying a paint to the surface of the object to be coated by energization. Thereafter, the coating film is cured. As the water-soluble paint, for example, an aqueous solution of polyimide is known. According to this electrodeposition, it is possible to form an insulating coating film with a uniform film thickness on the entire surface of the object to be coated, there is almost no loss of paint, automation and labor saving can be easily realized, rust prevention It is possible to form a coating film with excellent electrical insulation, and because the throwing power is excellent, there is no unpainted film, no sagging of the coating film, no melt-off, etc., and a high-quality film can be formed. Benefits are gained. These advantages are the advantages of electrodeposition coating in comparison with other coating techniques such as electrostatic coating, spray coating or powder coating, for example.

  Further, input / output terminals 117 and 118 are provided on the support substrate 1. The input / output terminals 117 and 118 shown in the embodiment have a structure in which metal balls are embedded in recesses provided on opposite sides of the support substrate 1. As the metal balls, those having high spreadability and low electric resistance, for example, Cu balls are suitable. In addition, solder balls, Au balls, and the like can be used. When these metal balls are embedded, the surface of the concave portion of the support substrate 1 is covered with an insulating film, so that the input / output terminals 117 and 118 formed of the metal balls are magnetic plates constituting the support substrate 1. Is electrically insulated.

  Next, the functional component 2 includes a magnetic rotor 21, a permanent magnet 23, and circuit components 221 to 224. Such a combination of functional components is well known for this type of non-reciprocal circuit device. In the magnetic rotor 21, first to third central conductors 211 to 213 are arranged on a soft magnetic base 210. The soft magnetic base 210 is preferably a soft magnetic material such as yttrium / iron / garnet (YIG). As an example, the soft magnetic substrate 210 is formed in a flat plate shape with a side of several mm and a thickness of about 0.2 to 0.5 mm.

  The first to third center conductors 211 to 213 are made of a conductor plate obtained by punching a copper foil having a thickness of about 10 to 50 μm, for example, and intersect each other at a predetermined angle on one surface of the soft magnetic substrate 210. So that they are combined at an appropriate angle. Both ends of the first to third central conductors 211 to 213 serve as terminal portions 201 to 206 connected to the circuit components 221 to 224. The first to third central conductors 211 to 213 are electrically insulated from each other at the intersection. The electrical insulation can be realized by interposing an insulating film formed by applying an insulating paint, an insulating film or the like in the overlapping portion. In the embodiment, the first to third center conductors 211 to 213 are plate-like pieces that are independent from each other. However, the first to third center conductors 211 to 213 are branched from a common ground electrode disposed on the other surface side of the soft magnetic substrate 210. Alternatively, it may be configured as an integrated body that is raised along the side surface of the soft magnetic substrate 210 and bent so as to overlap on one surface of the soft magnetic substrate 210.

  The permanent magnet 23 applies a DC magnetic field to the magnetic rotor 21. The permanent magnet 23 is formed in a square shape slightly larger than the soft magnetic base 210 using a ferrite magnet or the like, and faces the first to third central conductors 211 to 213 so as to face the soft magnetic base 210. It is arranged on one side.

  The circuit components include capacitors 211 to 223 and a resistor 224, which are mounted on the support substrate 1 and soldered. Specifically, the capacitor 221 has two terminal electrodes 241 and 242 on one surface and terminal electrodes 243a and 243b that are independent of each other on the opposite surface. The terminal portion 201 of the first central conductor 211 is connected to the terminal electrode 241 by soldering, and the terminal portion 204 of the second central conductor 212 is connected to the terminal electrode 242 by soldering. The terminal electrode 243a is soldered to the ground electrode 111 of the support substrate 1, and the terminal electrode 234b is soldered to the input / output terminal 117.

  The capacitor 222 has a terminal electrode 244 on one surface and a terminal electrode 245 on the other surface on the opposite side. The terminal portion 206 of the third central conductor 213 is soldered to the terminal electrode 244, and the terminal electrode 245 on the opposite side is soldered to the ground electrode 112 of the support substrate 1.

  The capacitor 223 has two terminal electrodes 246 and 247 on one surface, and terminal electrodes 248a and 248b that are independent from each other on the opposite surface. The terminal portion 203 of the second center conductor 212 is connected to the terminal electrode 246 by soldering, and the terminal portion 202 of the first center conductor 211 is connected to the terminal electrode 247 by soldering. The terminal electrode 248 a is soldered to the ground electrode 114 of the support substrate 1, and the terminal electrode 248 b is soldered to the input / output terminal 118.

  FIG. 4 is a partially enlarged sectional view showing an example of the capacitors 221 and 223. FIG. 4 directly shows the structure and mounting structure of the capacitor 221, and for the capacitor 223, the corresponding portion is shown in parentheses. However, FIG. 4 is only an example of the capacitors 221, 223, and is not limited to this.

  Referring to FIG. 4, the capacitor 221 has a plurality of internal electrodes 41, 42 that are paired inside the ceramic base, and the opposite ends of the internal electrodes 41, 42 are connected to the through-hole conductor 43, 44. The through-hole conductor 43 has one end connected to the terminal electrode 241 and the other end connected to the terminal electrode 243a. The terminal electrode 243 a is connected to the conductive substrate 10 of the support substrate 1 by soldering 51. Further, the terminal electrode 243 b is connected to the input / output terminal 117 by soldering 52.

  The resistor 224 has terminal electrodes 249 and 250 at opposite ends, and is disposed on the side of the capacitor 222. The terminal portion 206 of the third central conductor 213 is soldered to the terminal electrode 249, and the terminal electrode 250 is soldered to the ground electrode 113 of the support substrate 1. The terminal portion 205 of the third center conductor 213 is soldered to a metal block 119 fixed on one surface of the support substrate 1 by means such as adhesion. The metal block 119 is soldered to the ground electrode 110.

  Furthermore, the nonreciprocal circuit device according to the present invention also includes the cover member 3 as in the conventional case. The cover member 3 is made of a magnetic material mainly composed of Fe or the like, and constitutes a yoke for a magnetic field generated by the permanent magnet 23 together with the support substrate 1. The illustrated cover member 3 has side plates 32 and 33 that are continuously bent from the top surface 31 on opposite sides. The edge of the side plate 33 is coupled to the support base 1 through ground electrodes 115 and 116 provided on the side of the support substrate 1.

  FIG. 5 is a circuit diagram of the isolator shown in FIGS. For reference numerals not shown in FIG. 5, refer to FIGS. In FIG. 5, the end 204 of the second center conductor 212 is connected to the input / output terminal 117, and a capacitance C11 is generated between the end 204 and the ground. The capacitance C11 is acquired by the internal electrodes 41 and 42 between the terminal electrodes (242 and 243b) and the terminal electrodes (242 and 243a) of the capacitor 221, and is grounded to the conductive base 10 of the support substrate 1 by the terminal electrode 243a. Is done.

  Next, the end portion 202 of the first center conductor 211 is connected to the input / output terminal 118, and a capacitance C31 is generated between the end portion 202 and the ground. The capacitance C31 is acquired by the internal electrodes 41 and 42 between the terminal electrodes (247 and 248b) of the capacitor 223 and the terminal electrodes (247 and 248a), and is connected to the conductive base 10 of the support substrate 1 by the terminal electrode 248a. Grounded.

  Further, the end 206 of the third central conductor 213 is connected to the terminal electrode 244 of the capacitor 222 and the terminal electrode 249 of the resistor 224. A capacitance C21 is generated between the end 206 of the third central conductor 213 and the ground. Capacitance C <b> 21 is acquired by the terminal electrode 244 of the capacitor 222 and its counter electrode, and taken out by the terminal electrode 245. In addition, a resistor R by a resistor 224 is connected in parallel to the capacitance C21. Further, the end 205 of the third central conductor 213 is connected to the metal block 1 19.

  As described above, in the non-reciprocal circuit device according to the present invention, the support substrate 1 has a flat plate shape, and the functional component 2 is mounted on one surface of the support substrate 1, so that a so-called planar mounting structure is obtained. Unlike the case of using a magnetic metal container, the structure is simplified and the cost is reduced.

  In addition, since the functional component 2 is mounted on one surface of the support substrate 1, positioning of the functional component 2 on the one surface of the support substrate 1 can be performed with high accuracy. Even if the functional component 2 is misaligned during mounting, it can be confirmed and corrected. Therefore, a product with stable characteristics can be manufactured with a high yield.

  Further, since the support substrate 1 on which the functional component 2 is mounted has a flat plate shape, it is smaller and thinner than a conventional magnetic metal container. Further, since the support substrate 1 is a magnetic plate, it can satisfy the function as a yoke.

  Furthermore, according to the structure in which at least one surface of the support substrate 1 is covered with the insulating film 11 and the ground electrodes 110 to 116 without the insulating film are provided in the surface of the insulating film, the ground electrodes 110 to 116 are passed through. The terminal electrodes of the circuit components 221 to 224, the ground electrode of the central conductor, and the like can be directly soldered on one surface of the support substrate 1. Parts other than the ground electrodes 110 to 116 are covered with the insulating film 11. By carrying out like this, it can avoid that an active part arises in the support substrate 1 unnecessarily.

  The nonreciprocal circuit device according to the present invention is used as a component of a communication device. FIG. 6 shows a communication apparatus using the nonreciprocal circuit device according to the present invention, and shows the configuration of a mobile wireless device such as a mobile phone. The illustrated communication device includes an antenna 61, a transmission circuit 65, a reception circuit 64, and a nonreciprocal circuit element 63. Reference numeral 62 is a duplexer. The transmission circuit 65 and the reception circuit 64 perform transmission / reception using the antenna 61 in common.

  The nonreciprocal circuit element 63 relates to the present invention, and is incorporated in a circuit from the duplexer 62 to the transmission circuit 65. The nonreciprocal circuit element 63 may be incorporated in a circuit that reaches the receiving circuit 64. Since the functions of the transmission circuit 65, the reception circuit 64, the nonreciprocal circuit element 63, and the duplexer 62 are well known, no particular description is required.

  However, since the non-reciprocal circuit element 63 is a non-reciprocal circuit element according to the present invention, it is obvious that the above-described operational effects can be obtained even on a communication device.

  Although the contents of the present invention have been specifically described with reference to the preferred embodiments, various modifications can be made by those skilled in the art based on the basic technical idea and teachings of the present invention. It is self-explanatory.

It is a disassembled perspective view which shows one Embodiment of the nonreciprocal circuit device based on this invention. FIG. 2 is a perspective view showing an internal structure arrangement of the non-reciprocal circuit device shown in FIG. 1, in which the viewing direction is 180 degrees different from FIG. 1. FIG. 3 is a perspective view showing a completed state of the non-reciprocal circuit device shown in FIGS. 1 and 2. It is an expanded sectional view of the capacitor | condenser part which comprises the nonreciprocal circuit device shown in FIGS. FIG. 5 is a circuit diagram of the nonreciprocal circuit device illustrated in FIGS. 1 to 4. It is a block diagram of the communication apparatus using the nonreciprocal circuit device based on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Support substrate 2 Functional component 21 Magnetic rotor 210 Soft-magnetic base | substrate 211-213 Center conductor

Claims (4)

A non-reciprocal circuit device including a support substrate and a functional component,
The support substrate is made of a flat plate-like magnetic body,
The functional component is mounted on one surface of the support substrate,
Non-reciprocal circuit element. The nonreciprocal circuit device according to claim 1, wherein the functional component includes a magnetic rotor, a permanent magnet, and a circuit component.
The magnetic rotor has a central conductor disposed on a soft magnetic substrate,
The permanent magnet applies a DC magnetic field to the magnetic rotor,
The circuit component includes a capacitor, and the capacitor is connected to the central conductor of the magnetic rotor.   3. The nonreciprocal circuit device according to claim 2, further comprising a cover member, wherein the cover member is made of a magnetic material and forms a yoke against the magnetic field generated by the permanent magnet together with the support substrate. element. A communication device including an antenna, a transmission circuit, a reception circuit, and a nonreciprocal circuit element,
The nonreciprocal circuit element is described in any one of claims 1 to 3, and is combined with at least one of the transmission circuit or the reception circuit.
Communication device.

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