JP2008053472A - Structure and method for three-dimensional sealing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a three-dimensional sealing structure which can be easily disassembled even after sealing and can be suppressed with a decline in sealing property, and to provide a three-dimensional sealing method. <P>SOLUTION: Portions to be sealed in the three-dimensional sealing structure are formed at facing portions of a cover 10, case 20, and connector 30 via an expandable sealing material 50, and arranged three-dimensionally. The sealing material 50 is compressed at the portions to be sealed when it foams. Accordingly, sealing is carried out among the cover 10, case 20, and connector 30. Out of the portions to be sealed formed at the facing portions of the cover 10, case 20, and connector 30; the one on at least either side is formed with a concave (22 and 32) to arrange the sealing material in. On the periphery of the portions to be sealed of the cover 10, case 20, and connector 30; gas exhaust channels (G1-G3) are formed which communicate with the concaves (22 and 32) and with the external space of the concaves (22 and 32). When the sealing material 50 foams, it is arranged in the concaves (22 and 32) by being compressed by the portions to be sealed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a three-dimensional sealing structure in which electronic components are stored in an airtight manner, and a three-dimensional sealing method.

Conventionally, there has been one disclosed in Patent Document 1 as a seal structure for storing and sealing a printed circuit board in a casing. The seal structure shown in Patent Document 1 includes a housing (case, cover), a printed circuit board, a connector, and the like. A printed circuit board on which a connector, a circuit element, and the like are mounted is mounted on the case, and the printed circuit board is covered. The connector and the case, the connector and the cover, and the case and the cover are sealed by fixing with an adhesive.
JP 2002-216886 A

  However, in the seal structure shown in Patent Document 1, it is difficult to disassemble the connector, case, and cover once the adhesive has hardened. Therefore, after the connector, the case, and the cover are fixed with an adhesive and a thermal test or the like is performed, the inside of the housing cannot be visually inspected, or the circuit element cannot be replaced.

  Therefore, it is also conceivable to apply a CIPG (Cured In Place Gasket) seal system that can be easily disassembled even after the connector, case, and cover are sealed to the seal structure. In this CIPG sealing method, first, a liquid seal material is applied to a seal portion of the connector, the case, and the cover before fixing the connector, the case, and the cover. Then, the sealing material is cured by irradiating the sealing material with ultraviolet rays or applying heat. The connector, case, and cover are assembled in such a state that the sealing material is cured. Then, a sealing force between the connector, the case, and the cover is ensured by applying a compressive force to the sealing material by applying a force from the outside to the case, the cover, and the like.

  However, when a liquid sealing material is used, the sealing material may leak from the seal portion. The CIPG method secures the sealing performance between the connector, the case, and the cover by applying a compressive force to the seal material. Therefore, when the seal material leaks from the seal portion, the compressive force applied to the seal material varies. It may occur and the sealing performance may decrease.

  In particular, when the CIPG seal method is applied to a three-dimensional seal structure, it is difficult to apply a uniform compressive force to the entire seal material. Therefore, if the seal material leaks as described above, the sealing performance is more significantly reduced. there's a possibility that.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a three-dimensional sealing structure and a three-dimensional sealing method that can be easily disassembled even after sealing and can suppress deterioration in sealing performance. .

  In order to achieve the above object, the three-dimensional seal structure according to claim 1 is characterized in that a seal part formed through a foamable seal material is three-dimensionally arranged at an opposite part of a plurality of members. Is a three-dimensional seal structure that seals between a plurality of members by being compressed from the seal portion by foaming, and at least one of the seal portions of the plurality of members is formed with a recess in which a seal material is disposed. A gas discharge passage that communicates the recess and the external space of the recess is formed around the seal portion of the member, and the seal material is compressed and arranged from the seal portion in the recess in a foamed state. It is what.

  As described above, since a plurality of members are sealed by applying a compressive force from the sealing portion in the recessed portion in a state where the sealing material is foamed, it is easily disassembled even after the plurality of members are sealed with the sealing material. It becomes possible.

  Moreover, since the sealing site | part of a some member is equipped with the recessed part which arrange | positions sealing material, it can suppress that sealing material leaks from a sealing site | part. Therefore, it becomes easy to apply a compressive force almost uniformly on the entire circumference of the sealing portion of the sealing material, so that deterioration of the sealing performance can be suppressed.

  In addition, a gas discharge passage that communicates the recess and the external space outside the recess is provided around the seal portion, so that the gas existing in the recess and the gas generated when the sealing material is foamed are discharged to the external space of the recess. Can do. Therefore, the void of the sealing material arranged in the recess can be removed, and sealing performance can be ensured.

  In addition, as shown in claim 2, the gas discharge passage communicates the space surrounded by the plurality of members as the external space and the concave portion, and the plurality of members includes the space surrounded by the plurality of members. You may make it provide the waterproof filter which lets gas pass between the exteriors of a some member.

  By doing in this way, the gas discharged | emitted from the recessed part and the gas which a sealing material emits at the time of foaming can be discharged | emitted outside the some member, without reducing waterproofness.

  Further, as shown in claim 3, the gas discharge passage may communicate the outside of the plurality of members as the external space with the recess. By doing in this way, the gas discharged | emitted from the recessed part and the gas which a sealing material emits at the time of foaming can be discharged | emitted to the exterior of a some member, without providing the waterproof filter etc. of a some member.

  However, when the gas discharge passage communicates with the outside of the plurality of members as the external space and the recess, the plurality of members sealed with the sealing material are covered with water, so that liquid such as water enters the gas discharge passage. May get in. Thus, when a liquid such as water enters the gas discharge passage, this liquid may reach the sealing material. And a sealing material may corrode by contact with a liquid, it becomes weak, and a sealing performance may fall.

  Therefore, when the gas discharge passage communicates with the outside of the plurality of members as the external space and the recess, as shown in claim 4, the liquid corresponding to the gas discharge passage is placed at a position corresponding to the gas discharge passage. It is preferable to provide a waterproof mechanism that prevents entry. By doing in this way, even if it is a case where the several member sealed with the sealing material got wet, it can reduce that a liquid contacts a sealing material and can ensure sealing performance.

  Further, the gas discharge passage only needs to be able to discharge the gas discharged from the recess and the gas generated when the sealing material is foamed. Therefore, as shown in claim 5, the gas discharge passage may be partially formed at the opposed portions of the plurality of members. May be. By doing in this way, the dimensional stability of the gas exhaust passage at the time of assembling a some member can be improved, and more uniform sealing performance can be ensured. Further, by partially forming the gas discharge passages at the opposing portions of the plurality of members, it is possible to further prevent the sealing material from leaking and to suppress the deterioration of the sealing performance.

  Further, as shown in claim 6, the gas discharge passage may be provided with a leakage prevention mechanism for the sealing material from the recess to the external space. By doing in this way, a sealing material can be made harder to leak from a seal | sticker site | part, and a sealing performance can be improved.

  Specifically, as shown in claim 7, the plurality of members include a connector that electrically connects the circuit board and the external device, and a plurality of members that sandwich the connector and house the circuit board inside. It can be a body.

  Further, as shown in claim 8, the gas discharge passage may be formed in at least one member of a plurality of members constituting the housing.

  Further, as shown in claim 9, the gas discharge passage is composed of a plurality of holes formed in the housing, and the holes are opposed to the recesses and are formed at positions corresponding to the center in the width direction of the recesses. You may do it. The sealing material is most easily foamed at the center in the width direction of the recess. Therefore, by doing in this way, it becomes easy to discharge the gas discharged from the recess and the gas generated when the sealing material is foamed, and it becomes easier to apply a compressive force more evenly around the entire circumference of the seal part, and the sealing property Can be improved.

  In addition, as shown in claim 10, the edge portion of the seal surface facing the recess in the casing is rounded, so that the gas existing in the recess or the gas generated when the sealing material is foamed is generated in the external space of the recess. Easy to discharge.

  In addition, as shown in claim 11, the portion of the housing that faces the recess is provided with an opposing recess that faces the recess and communicates with the hole, and the opposing recess is formed as the distance between the inner walls increases from the recess toward the hole. By gradually narrowing, the voids of the sealing material can be evenly removed. Furthermore, as shown in claim 12, the voids of the sealing material can be more evenly removed by forming the opposing concave portion in an arch shape.

  Further, as shown in claim 13, the sealing material may be disposed also in the gas discharge passage. Thus, by arranging the sealing material in the gas discharge passage, the contact area between the sealing material and the plurality of members is increased, and the sealing performance can be improved.

  Further, in the three-dimensional seal structure according to claim 14, a seal part formed through a foamable seal material is three-dimensionally arranged at an opposite part of a plurality of members, and after the housing is assembled, the seal material Is a three-dimensional seal structure that seals between a plurality of members by being compressed from the seal portion by foaming, and at least one of the seal portions in the plurality of members is formed with a recess in which a seal material is disposed, A convex portion that protrudes toward the concave portion is formed at a portion that faces the concave portion and is protruded toward the concave portion, and in a state where the convex portion and the concave portion are assembled, the sealing material is foamed to form the concave portion and the convex portion. It is characterized in that it is arranged compressed from the seal part in between.

  As described above, since a plurality of members are sealed by applying a compressive force from the sealing portion between the concave portion and the convex portion in a state where the sealing material is foamed, the plurality of members are sealed with the sealing material. Can be easily disassembled.

  In addition, by providing a convex part at the part facing the concave part, the contact area between the sealing material and the sealing part can be increased, so that the gas present in the concave part or the gas generated when the sealing material is foamed remains in the concave part. However, it becomes easy to apply a compressive force uniformly in the perimeter of a seal | sticker site | part, and can suppress the fall of a sealing performance.

  Furthermore, even when an external force is applied to a plurality of members, a concave portion and a convex portion are provided, and a compressive force is applied from the seal portion in a state where the sealing material is foamed between the concave portion and the convex portion. Therefore, it can suppress that a plurality of members shift.

  Further, as shown in claim 15, the convex portion may have a rectangular shape. By doing in this way, the contact area of a convex part and a sealing material can be enlarged, and it can be easy to ensure sealing performance. Further, as shown in claim 16, the convex portion may have a hemispherical shape. By doing in this way, while making it easy to make a sealing material contact with a convex part, the stress concentration to a sealing material can be reduced and it can be easy to ensure sealing performance. Further, as shown in claim 17, the convex portion may have a mountain shape. By doing in this way, the void of a sealing material can be made easy to remove and it can be easy to ensure sealing performance.

  Further, in the three-dimensional sealing method according to claim 18, in the three-dimensional sealing structure according to any one of claims 1 to 17, the recesses provided in at least one of the seal portions of the plurality of members are not foamed. The sealing material is provided, and the sealing material is foamed in a state where a plurality of members are assembled.

  Thus, by foaming the sealing material in a state where the plurality of members are assembled, when the plurality of members are assembled, the sealing material can be prevented from being deformed by being dragged by the members. Therefore, even in the three-dimensional seal structure, a substantially uniform compressive force can be applied to the seal material over the entire circumference of the seal portion, and a decrease in sealability can be suppressed.

  Further, in the three-dimensional sealing method according to claim 19, in the three-dimensional sealing structure according to any one of claims 14 to 17, a sealing material before foaming is provided in the concave portion so as to contact the convex portion, The sealing material is foamed in a state where a plurality of members are assembled.

  Thus, by providing a sealing material before foaming in contact with the convex part in the concave part and foaming the sealing material in a state where a plurality of members are assembled, there is no gas discharge passage and the gas present in the concave part in the concave part Even if the gas generated when the sealing material is foamed remains, the compression surface between the sealing part and the sealing material can be secured in advance, so that the sealing performance can be secured and the deterioration of the sealing performance is suppressed. can do.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
In the present embodiment, a description will be given using an example in which the three-dimensional seal structure of the present invention is applied to a seal structure of an electronic device. In particular, the three-dimensional seal structure of the present invention is suitable as a seal structure of an electronic device (for example, an engine ECU (Electric Control Unit) of a vehicle) disposed outside the vehicle compartment (for example, in the engine room) of the vehicle.

  FIG. 1 is a perspective view showing a schematic configuration of an electronic device according to the first embodiment of the present invention. FIG. 2 is a perspective view when the printed circuit board and the connector are mounted on the case of the electronic device according to the first embodiment of the present invention. 3 is a drawing before foaming of the sealing material of the electronic device according to the first embodiment of the present invention, (a) is a cross-sectional view taken along line AA in FIG. 1, and (b) is a cross-sectional view taken along line BB in FIG. It is. 4A and 4B are drawings after foaming of the sealing material of the electronic device according to the first embodiment of the present invention, wherein FIG. 4A is a cross-sectional view taken along line AA in FIG. 1 and FIG. 4B is a cross-sectional view taken along line BB in FIG. It is.

  As shown in FIGS. 1 and 2, the electronic device 100 includes a housing (cover 10, case 20), a connector 30, and a printed circuit board 40.

  The case is made of, for example, a metal material such as aluminum or iron, or a synthetic resin material, and has a box-like cover 10 (upper case) that is open on one side and a shallow box-like shape that closes the open surface of the cover 10. It is comprised by case 20 (lower housing | casing). Then, the connector 30 is sandwiched between the cover 10 and the case 20, and the cover 10, the case 20, and the connector 30 are assembled to form a housing having an internal space for accommodating the printed circuit board 40. Further, the cover 10 and the case 20 constituting the housing are formed by aluminum die-cast molding, synthetic resin material injection molding, or the like.

  As shown in FIG. 1, the cover 10 includes a connector opening 10 a for sandwiching the connector 30. The connector opening 10 a has a shape corresponding to the outer shape of the connector 30. In the present embodiment, as shown in FIG. 1, the connector opening 10 a includes a plane portion and an inclined portion corresponding to the outer shape of the connector 30.

  Further, reference numeral 11 shown in FIGS. 3A and 3B and the like is a cover outer peripheral surface that is a surface on the side of the case 20 in the side wall of the box-shaped cover 10, that is, a surface of an opening end portion of the cover 10. . This cover outer peripheral surface 11 is provided so as to be opposed to corresponding surfaces of the case 20 and the connector 30 (case outer peripheral surface 21 and connector peripheral surface 31) described later. The cover outer peripheral surface 11 and the opposing portions of the case 20 and the connector 30 (the case outer peripheral surface 21 and the connector peripheral surface 31) form a three-dimensional seal portion that compresses the sealing material 50. The cover outer peripheral surface 11 forms a substantially flat surface over the entire periphery of the side wall of the cover 10 and has a three-dimensional shape corresponding to the outer shape of the connector 30. However, although the cover outer peripheral surface 11 forms a substantially flat surface over the entire periphery of the side wall of the cover 10, an alignment portion with the case outer peripheral surface 21 may be partially provided.

  As shown in FIG. 1, the cover 10 is a gas between the internal space that accommodates the printed circuit board 40 surrounded by the cover 10, the case 20, and the connector 30 and the outside of the cover 10, the case 20, and the connector 30. A waterproof filter 10h is provided. As the waterproof filter 10h, for example, a filter described in Japanese Patent Application Laid-Open No. 2006-5162 by the present applicant can be used.

  As shown in FIG. 2 and the like, the case 20 includes a board mounting portion 23 on which the printed board 40 is mounted. As shown in FIG. 2 and the like, the case 20 has a case outer peripheral surface 21 (outer portion 21a, outer surface 21a, which is the surface of the side wall of the box-shaped case 20 on the cover 10 side, that is, the surface of the opening end of the case 20. An inner portion 21b). The case outer peripheral surface 21 is provided so as to face the above-described cover outer peripheral surface 11 and a corresponding surface (connector peripheral surface 31) of the connector 30 described later.

  Further, as shown in FIG. 2 and the like, the case outer peripheral surface 21 is a case-side seal-forming concave portion 22 (corresponding to the concave portion in the present invention) for disposing the seal material 50 over the entire circumference of the case outer peripheral surface 21. Hereinafter, it is also simply referred to as a case-side recess 22. The case-side recess 22 is a rectangular groove in the present embodiment. However, the present invention is not limited to this, and any groove can be used as long as the seal material 50 can be disposed. The objective can be achieved. The case-side recess 22 may be provided in a lump when the case 20 is formed by aluminum die casting or injection molding of a synthetic resin material, or after the case 20 is molded by aluminum die casting or injection molding of a synthetic resin material. You may provide by.

  The case outer peripheral surface 21 is divided into an outer portion 21 a and an inner portion 21 b by the case-side recess 22. The outer portion 21 a and the inner portion 21 b of the case outer peripheral surface 21 form a substantially flat surface over the entire periphery of the side wall of the case 20. However, the outer portion 21 a and the inner portion 21 b form a substantially flat surface over the entire side wall of the case 20, but an alignment portion with the cover outer peripheral surface 11 may be partially provided. .

  Further, the height from the bottom surface of the case-side recess 22 in the inner portion 21b of the case outer peripheral surface 21 is the case outer periphery over the entire outer periphery 21 of the case (the entire periphery of the side wall of the case 20) as shown in FIG. The height of the outer side portion 21a of the surface 21 is lower than the height from the bottom surface of the case-side recess 22. Accordingly, as shown in FIGS. 3A and 3B, the case outer peripheral surface 21, the cover outer peripheral surface 11, and the connector peripheral surface 31 (bottom 31c) face each other, that is, the cover 10, the case 20, and the connector 30. Are assembled between the inner portion 21b of the case outer peripheral surface 21 and the cover outer peripheral surface 11 and the connector peripheral surface 31 (bottom portion 31c).

  This gap is gas discharge passages G <b> 1 and G <b> 2 for discharging the gas (air) present in the case-side recess 22 and the gas generated when the sealing material 50 is foamed to the outside of the case-side recess 22. Further, the gap (gas discharge passages G1, G2) has a height from the bottom surface of the case-side recess 22 in the inner portion 21b of the case outer peripheral surface 21 over the entire circumference of the case outer peripheral surface 21 (the entire periphery of the side wall of the case 20). Since the height of the outer portion 21a of the case outer peripheral surface 21 is lower than the height from the bottom surface of the case-side recess 22, the outer peripheral surface 21 is formed over the entire circumference of the case outer peripheral surface 21 (the entire side wall of the case 20). The gas discharge passage G1 is formed between the cover outer peripheral surface 11 and the case outer peripheral surface 21, and the gas discharge passage G2 is formed between the connector peripheral surface 31 and the case outer peripheral surface 21. Is.

  That is, the inner portion 21b of the case outer peripheral surface 21 is in a state of facing the cover outer peripheral surface 11 and the connector peripheral surface 31, that is, in a state where the case 20, the cover 10 and the connector 30 are assembled. A passage G1 is formed, and a gas discharge passage G2 is formed together with the connector peripheral surface 31.

  The connector 30 electrically connects the printed circuit board 40 and an external device. As shown in FIG. 3B and the like, the connector 30 has a plurality of terminals 30t made of a conductive material (for example, brass plated with metal) electrically connected to the printed circuit board 40, and a part of the terminals 30t are embedded. A housing 30h made of an insulating material (for example, synthetic resin) is provided. The connector 30 is formed by inserting a terminal 30t into a mold corresponding to the outer shape of the housing 30h and insert-molding it with an insulating material.

  As shown in FIG. 2 and the like, the housing 30h has a trapezoidal shape with a width that allows the terminal 30t to be embedded. As shown in FIG. 2, FIG. 3B, etc., the connector-side seal forming recess 32 (the present invention) is formed on the surface facing the cover outer peripheral surface 11 in the peripheral surface (connector peripheral surface 31) of the housing 30h. (Hereinafter also referred to simply as a connector-side recess 32). In addition, although this connector side recessed part 32 is made into the rectangular-shaped groove | channel in this Embodiment similarly to the case side recessed part 22, this invention is not limited to this, The seal material 50 can be arrange | positioned. If it is a groove, the object of the present invention can be achieved. Moreover, the connector side recessed part 32 may be provided collectively at the time of insert molding, and may be provided by laser etc. after insert formation. The housing 30h is trapezoidal in the present embodiment, but the present invention is not limited to this.

  Further, a surface (region) of the connector peripheral surface 31 facing the cover outer peripheral surface 11 is divided into an outer portion 31 a and an inner portion 31 b by the connector-side recess 32. The outer portion 31 a, the inner portion 31 b, and the bottom portion 31 c of the connector peripheral surface 31 form a substantially flat surface over the entire periphery of the connector 30. However, although the outer portion 31a, the inner portion 31b, and the bottom portion 31c of the connector peripheral surface 31 form a substantially flat surface over the entire periphery of the connector 30, the positions of the cover outer peripheral surface 11 and the case outer peripheral surface 21 are as follows. You may make it provide a matching part partially.

  The height from the bottom surface of the connector-side recess 32 in the inner portion 31b of the connector peripheral surface 31 is from the bottom surface of the connector-side recess 32 in the outer portion 31a of the connector peripheral surface 31, as shown in FIG. It is lower than the height. Therefore, in the region of the connector peripheral surface 31 facing the cover outer peripheral surface 11, as shown in FIG. 3B, the cover outer peripheral surface 11 and the connector peripheral surface 31 face each other, that is, the cover 10 and the connector 30. In the assembled state, a gap is generated between the inner portion 31 b of the connector peripheral surface 31 and the cover outer peripheral surface 11. This gap is a gas discharge passage G <b> 3 for discharging the gas (air) present in the connector-side recess 32 and the gas generated when the sealing material 50 is foamed to the outside of the connector-side recess 32. That is, the inner portion 31b of the connector peripheral surface 31 constitutes the gas discharge passage G3 together with the cover outer peripheral surface 11 in a state facing the cover outer peripheral surface 11, that is, in a state where the cover 10 and the connector 30 are assembled.

  Further, the bottom 31c of the connector peripheral surface 31 is a surface facing the case outer peripheral surface 21 and forms a substantially flat surface. As shown in FIG. 3B, the bottom portion 31c of the connector peripheral surface 31 faces the case outer peripheral surface 21, that is, in a state where the case 20 and the connector 30 are assembled. The gas discharge passage G2 is configured together with the inner part 21b). The gas discharge passages G1 to G3 are sized so that the sealing material 50 does not leak outside. That is, the sealing material 50 has a size that does not leak to the outside due to the frictional force between the gas discharge passages G1 to G3 and the sealing material.

  The printed board 40 is a board in which lands, wiring patterns, via holes for connecting the wiring patterns, and the like (not shown) are formed. Electronic components such as a microcomputer, a resistor, and a capacitor (not shown) are mounted on the printed board 40. Further, as shown in FIG. 3B and the like, the terminal 30 t of the connector 30 is mounted on the land formed on the printed board 40. Note that the constituent material of the printed circuit board 40 is not particularly limited. For example, a known material such as a thermoplastic resin, a thermosetting resin, a ceramic, a composite of glass (for example, glass cloth) and a resin, or the like can be used.

  The sealing material 50 that seals the cover 10, the case 20, and the connector 30 (a plurality of members in the present invention) is applicable to a CIPG (Cured In Place Gasket) sealing method, and is a liquid having viscosity at the time of application. Yes, it is foamed and hardened by heating or ultraviolet irradiation. Specifically, for example, foamed silicone, foamed urethane, or the like can be used as the sealing material 50. In addition, the sealing material 50 can be applied to the CIPG sealing method, and can be applied as long as it is foamed and cured by heating, ultraviolet irradiation, or the like. Therefore, the sealing material 50 can be applied with a compressive force from the cover 10, the case 2, and the connector 30, in other words, by applying a compressive force to the cover 10, the case 20, and the connector 30, The connector 30 is sealed.

  And the three-dimensional seal structure in this Embodiment is made | formed by the above components. That is, as shown in FIG. 4A, the sealing material 50 is compressed from the case-side recess 22 and the cover outer peripheral surface 11 in a state of being foamed and cured, and is disposed in the case-side recess 22. 4B, the sealing material 50 is compressed from the case-side recess 22 and the bottom 31c of the connector peripheral surface 31 in a foamed and cured state, and is disposed in the case-side recess 22. The connector-side recess 32 and the cover outer peripheral surface 11 are compressed and disposed in the connector-side recess 32. Furthermore, the sealing material 50 is also disposed in the gas discharge passages G1 to G3.

  In this way, in the state where the sealing material 50 is foamed and cured, the case side recess 22 and the connector side recess 32 compress the case side recess 22, the connector side recess 32 and the cover outer peripheral surface 11, and the bottom portion 31 c of the connector peripheral surface 31. Since the cover 10, the case 20, and the connector 30 are sealed by applying force (by the CIPG sealing method), the cover 10, the case 20, and the connector 30 can be easily disassembled even after sealing with the sealing material 50. It becomes. That is, a three-dimensional seal structure in which a plurality of members (the cover 10, the case 20, and the connector 30) are bonded relatively weakly so as to be disassembled while ensuring sealing performance.

  Further, the seal portion of the cover 10, the case 20, and the connector 30, that is, the case-side concave portion in which the seal material 50 is disposed in any one of the facing portions of the cover outer peripheral surface 11, the case outer peripheral surface 21, and the connector peripheral surface 31. Since 22 and the connector side recessed part 32 are provided, it can suppress that the sealing material 50 leaks from a seal | sticker site | part. Therefore, since the compressive force is easily applied to the sealing material 50 substantially evenly around the entire circumference of the sealing portion, it is possible to suppress a decrease in sealing performance.

  Further, the gas that communicates with the case side recess 22, the connector side recess 32, the case side recess 22, and the external space of the connector side recess 32 (in this embodiment, the internal space surrounded by the cover 10, the case 20, and the connector 30). Since the discharge passages G1 to G3 are provided, the gas present in the case-side recess 22 and the connector-side recess 32 and the gas generated when the sealing material 50 is foamed can be discharged to the external space. Therefore, the void of the sealing material 50 arrange | positioned at the case side recessed part 22 and the connector side recessed part 32 can be extracted, and a sealing performance can be ensured.

  In the present embodiment, the gas discharged through the gas discharge passages G <b> 1 to G <b> 3 is discharged from the waterproof filter 10 h provided in the cover 10 to the outside of the electronic device 100. Therefore, the gas or the like can be discharged to the outside of the electronic device 100 without deteriorating waterproofness.

  Further, as shown in FIGS. 4A and 4B, by arranging the sealing material 50 also in the gas discharge passages G1 to G3, the contact area between the sealing material 50 and the cover 10, the case 20, and the connector 30 is increased. The sealing property can be improved.

  Here, the three-dimensional sealing method in the present embodiment will be described.

  First, as shown in FIGS. 3A and 3B, a seal material 50 is applied to the case-side recess 22. Then, the electrically connected connector 30 and the printed board 40 are mounted on the case 20. At this time, the printed circuit board 40 fits in the board mounting part 23 of the case 20 and is aligned so that the connector peripheral surface 31 (bottom part 31c) of the connector 30 and the case outer peripheral surface 21 (outer part 21a) of the case 20 come into contact with each other. And implement.

  Next, the sealing material 50 is applied to the connector-side recess 32. Then, the cover 10 is put on the connector 30. At this time, the cover outer peripheral surface 11 of the cover 10 and the connector peripheral surface 31 (outer portion 31a) of the connector 30 are aligned and mounted so as to contact each other. At this time, the sealing material 50 applied to the case-side recess 22 and the connector-side recess 32 is a liquid having viscosity. The case 20 and the cover 10 are fixed at a plurality of points by screwing. The connector 30 is fixed by being sandwiched between the case 20 and the cover 10.

  Then, heat is applied to the cover 10, the case 20, and the connector 30 assembled in such a state that the sealing material 50 is applied to the case-side recess 22 and the connector-side recess 32, or ultraviolet rays are irradiated. To do. Whether to apply heat or to irradiate ultraviolet rays depends on the characteristics of the sealing material 50. That is, the sealing material 50 that is foamed and cured by applying heat is irradiated with ultraviolet rays to the sealing material 50 that is foamed and cured by applying heat and irradiating ultraviolet rays.

  By applying heat or irradiating ultraviolet rays to the sealing material 50, the sealing material 50 is foamed and cured in the case-side recess 22 and the connector-side recess 32. When the sealing material 50 is foamed and cured, as shown in FIGS. 4A and 4B, the case-side recess 22, the connector-side recess 32, and the outer periphery of the cover are formed at the case-side recess 22 and the connector-side recess 32. A compressive force is applied from the bottom surface 31c of the surface 11 and the connector peripheral surface 31. In this way, the cover 10, the case 20, and the connector 30 can be three-dimensionally sealed.

  In this way, by foaming and curing the sealing material 50 in a state where the cover 10, the case 20, and the connector 30 are assembled, when the member is assembled, the sealing material 50 is deformed by being dragged by another member. Can be prevented. Therefore, even in the three-dimensional seal structure, a substantially uniform compressive force can be applied to the seal material 50 over the entire circumference of the seal portion, and a decrease in sealability can be suppressed.

  That is, if the sealing material 50 is foamed and cured before the cover 10, the case 20, and the connector 30 are assembled, the sealing material 50 has a shape protruding from the case-side recess 22 and the connector-side recess 32. When the cover 10, the case 20, and the connector 30 are assembled in such a state, the seal material 50 and the like at the three-dimensional seal portion, that is, the portion rising from the ground plane of the connector 30 (the inclined portion of the connector 30) There is a possibility of being deformed by being dragged from the portion 10a or the like. When the sealing material 50 is deformed in this way, it is difficult to apply a uniform compressive force to the entire sealing material 50, and the sealing performance may be lowered. However, the sealing material 50 is not dragged from other members by foaming and curing the sealing material 50 in a state where the cover 10, the case 20, and the connector 30 are assembled as in the above-described embodiment. Since deformation can be prevented, deterioration of the sealing performance can be suppressed.

  In recent years, with the expansion of the vehicle living space, the mounting space of the engine ECU has changed from the conventional mounting in the vehicle interior to the mounting in the engine room, and the waterproofness requirement of the engine ECU has been improved. On the other hand, in engine ECUs, in order to ensure a stable sealing performance, a waterproof technology by bonding (strongly fixing members) is the mainstream and put into practical use. However, such a bond has a stable sealing property and cannot be decomposed once bonded.

  On the other hand, in an engine ECU, an electronic component such as a printed circuit board is housed in a housing (case, cover) and sealed, and a thermal test or the like is performed. There is also a desire to change the circuit elements to be mounted. Therefore, the three-dimensional seal structure and the three-dimensional seal method in the present embodiment have the effects as described above, and are suitable for application to the seal structure and seal method of the engine ECU.

  In the present embodiment, the concave portion for forming the sealing material 50 has been described using an example provided in the case 20 and the connector 30, but the present invention is not limited to this, and the opposite cover is provided. What is necessary is just to provide in at least any one of the outer peripheral surface 11, the case outer peripheral surface 21, and the connector surrounding surface 31. FIG.

  Further, in the present embodiment, the connector opening 10a has been described using an example provided in the cover 10, but the present invention is not limited to this, and is provided in at least one of the cover 10 and the case 20. Just do it.

  For example, as shown in FIG. 5, the gas discharge passage G <b> 1 communicates the case-side recess 22 and the outside of the electronic device 100, that is, the case-side recess 22 and the outside of the cover 10, the case 20, and the connector 30. Good. Similarly, although not shown in the figure, the case side recess 22 and the outside of the electronic device 100, that is, the case side recess 22, the cover 10, the case 20, and the outside of the connector 30 are also communicated with each other. Good. Although not shown, the connector-side recess 32 and the outside of the electronic device 100, that is, the connector-side recess 32, the cover 10, the case 20, and the connector 30 may be communicated with each other with respect to the gas discharge passage G3. . 5A and 5B are partial cross-sectional views of the electronic device according to the first modification of the first embodiment of the present invention, where FIG. 5A is before foaming of the sealing material, and FIG. 5B is after foaming of the sealing material.

  In this case, the height from the bottom surface of the case-side recess 22 in the outer portion 21a of the case outer peripheral surface 21 is the case outer periphery over the entire outer periphery 21 of the case (the entire periphery of the side wall of the case 20) as shown in FIG. The height from the bottom surface of the case-side recess 22 in the inner portion 21b of the surface 21 is set lower.

  Further, the height from the bottom surface of the connector-side recess 32 in the outer portion 31a of the connector peripheral surface 31 is higher than the height from the bottom surface of the connector-side recess 32 in the inner portion 31b of the connector peripheral surface 31 as shown in FIG. make low.

  And the sealing material 50 will be exposed to an external environment in the gas exhaust passages G1-G3, as shown in FIG.5 (b) after foaming and hardening.

  In this way, the gas discharge passages G1 to G3 are communicated with the recesses (the case side recess 22, the connector side recess 32) and the outside of the cover 10, the case 20, and the connector 30 without providing the waterproof filter 10h, etc. The gas or the like can be discharged to the outside of the cover 10, the case 20, and the connector 30 (outside the electronic device 100).

  Moreover, the foaming state of the sealing material 50 can also be confirmed by visually inspecting the gas discharge passage G1 from the outside of the electronic device 100.

  However, when the gas discharge passages G1 to G3 are communicated with the recesses (the case-side recess 22 and the connector-side recess 32) and the outside of the cover 10, the case 20, and the connector 30, the sealing material 50 is sealed. When the cover 10, the case 20, and the connector 30 are wetted, liquid such as water may enter the gas discharge passages G1 to G3. Thus, when a liquid such as water enters the gas discharge passages G <b> 1 to G <b> 3, this liquid may reach the seal material 50. And the sealing material 50 may corrode or become brittle when it comes into contact with the liquid, and the sealing performance may be reduced.

  Therefore, as shown in FIG. 6, a waterproof mechanism for preventing liquid from entering the recesses (case-side recess 22 and connector-side recess 32) may be provided at positions corresponding to the gas discharge passages G1 to G3. 6A and 6B are partial cross-sectional views of an electronic device according to Modification 2 of the first embodiment of the present invention, in which FIG. 6A is before foaming of the sealing material, and FIG. 6B is after foaming of the sealing material.

  As the waterproof mechanism, as shown in FIG. 6, a stepped portion in which the side wall of the case 20 is recessed inward is provided, and the cover outer peripheral surface 11 of the cover 10 is vertically spaced from the stepped portion by a predetermined distance from the cover outer peripheral surface 11. A lateral wall 12 protruding in the direction is provided. In other words, the gas discharge passage G1 has a labyrinth structure by providing a waterproof mechanism. In addition, regarding the position corresponding to the gas discharge passages G2 and G3, a waterproof mechanism may be provided similarly, and the gas discharge passages G2 and G3 may have a labyrinth structure.

  By doing in this way, even if it is a case where the cover 10, the case 20, and the connector 30 sealed with the sealing material 50 are wetted, it is possible to reduce the contact of the liquid with the sealing material 50 and to ensure the sealing performance. be able to.

  Further, the gas discharge passage G1 only needs to be able to discharge the gas discharged from the case-side recess 22 or the gas discharged when the sealing material 50 is foamed, and therefore may be partially provided as shown in FIG. 7 is a cross-sectional view of an electronic device according to Modification 3 of the first embodiment of the present invention, (a) is a CC cross-sectional view of FIG. 1, and (b) is a DD cross-sectional view of (a). (C) is an EE sectional view of (a).

  In this case, as shown in FIGS. 7A and 7B, the case 20 has a height from the bottom surface of the case-side concave portion 22 in the inner portion 21b of the case outer peripheral surface 21 only at a portion where the gas discharge passage G1 is formed. Is lower than the height from the bottom surface of the case-side recess 22 in the outer portion 21 a of the case outer peripheral surface 21. On the other hand, as shown in FIGS. 7A and 7C, the portions where the gas discharge passage G <b> 1 is not formed are the height from the bottom surface of the case-side concave portion 22 in the inner portion 21 b of the case outer peripheral surface 21 and the case outer peripheral surface 21. The height from the bottom surface of the case-side recess 22 in the outer portion 21a is made substantially the same. In addition, it is good to provide the space | interval which forms the gas exhaust passage G1 by the space | interval which does not make the sealing performance by the sealing material 50 unstable. Similarly, the gas discharge passages G2 and G3 may be partially provided.

  By doing in this way, the dimensional stability of the gas exhaust passage G1 at the time of assembling a plurality of members (here, the cover 10 and the case 20) can be improved, and more uniform sealing performance can be secured. . Further, by partially forming the gas discharge passage G1, it is possible to further prevent the sealing material 50 from leaking from between a plurality of members (here, between the cover 10 and the case 20), and sealing performance. Can be suppressed.

  Further, as shown in FIG. 8, a step may be provided on the outer peripheral surface 11 of the cover in order to form the gas discharge passage G1. FIG. 8 is a partial cross-sectional view of an electronic device according to Modification 4 of the first embodiment of the present invention.

  The gas discharge passage G <b> 1 is configured by the inner portion 21 b of the case outer peripheral surface 21 and the cover outer peripheral surface 11. Therefore, as shown in FIG. 8, the height from the bottom surface of the case-side recess 22 in the inner portion 21b of the case outer peripheral surface 21 and the height from the bottom surface of the case-side recess 22 in the outer portion 21a of the case outer peripheral surface 21 are substantially the same. And And a recessed part is provided in the site | part corresponding to the case side recessed part 22 and the inner side part 21b in the cover outer peripheral surface 11. FIG. In this way, the gas discharge passage G1 may be configured.

  Although not shown, the gas discharge passage G2 may be configured in the same manner. That is, the height from the bottom surface of the case-side recess 22 in the inner portion 21 b of the case outer peripheral surface 21 is made substantially the same as the height from the bottom surface of the case-side recess 22 in the outer portion 21 a of the case outer peripheral surface 21. And the recessed part is provided in the site | part corresponding to the case side recessed part 22 and the inner side part 21b in the surrounding surface 31 of a connector. In this way, the gas discharge passage G2 may be configured.

  Further, although not shown, the gas discharge passage G3 may be configured in the same manner. That is, the height from the bottom surface of the connector-side recess 32 in the inner portion 31 b of the connector peripheral surface 31 is made substantially the same as the height from the bottom surface of the connector-side recess 32 in the outer portion 31 a of the connector peripheral surface 31. And the recessed part is provided in the site | part corresponding to the connector side recessed part 32 and the inner side part 31b in the cover outer peripheral surface 11. FIG. In this way, the gas discharge passage G3 may be configured.

  In other words, the gas discharge passages G1 to G3 are formed in at least one of the opposing parts (cover outer peripheral surface 11 and case outer peripheral surface 21, cover outer peripheral surface 11 and connector peripheral surface 31, case outer peripheral surface 21 and connector peripheral surface 31). What is necessary is just to provide and provide a dent part.

  Further, as shown in FIG. 9B, the gas discharge passage G <b> 1 is formed of the sealing material 50 from the case side recess 22 to the external space (in this case, the internal space surrounded by the cover 10, the case 20, and the connector 30). A leakage prevention mechanism may be provided. FIG. 9 is a drawing of an electronic device according to Modification 5 of the first embodiment of the present invention, (a) is a cross-sectional view taken along AA in FIG. 1, and (b) is an enlarged view of a characteristic portion (dotted line portion). It is sectional drawing.

  The leakage prevention mechanism for the seal material 50 may be any mechanism that improves the frictional force between the seal material 50 and the cover outer peripheral surface 11 and the case outer peripheral surface 21 constituting the gas discharge passage G1. As a specific leakage prevention mechanism for the sealing material 50, as shown in FIG. 9B, the gas discharge passage G1, that is, a position corresponding to the gas discharge passage G1 on the outer peripheral surface 11 of the cover, is provided from the case side recess 22 to the outside. The step portion 13 is provided so that the opening area becomes smaller toward the space. The step portion 13 may be provided on the inner portion 21b of the cover outer peripheral surface 21. By doing in this way, the sealing material 50 can be made more difficult to leak from between the cover outer peripheral surface 11 and the case outer peripheral surface 21, and the sealing performance can be improved.

  Although not shown in the drawings, a leakage prevention mechanism for the seal material 50 may be provided in the gas discharge passages G2 and G3 in the same manner.

  Further, the gas discharge passage may be through holes 15 provided at a plurality of positions of the cover 10 as shown in FIG. FIG. 10 is a drawing of an electronic device according to Modification 6 of the first embodiment of the present invention, (a) is a plan view of the electronic device, and (b) is an FF sectional view before foaming of the sealing material. (C) is a GG sectional view before foaming of the sealing material, and (d) is an FF sectional view after foaming of the sealing material.

  In this case, as shown in FIGS. 10A to 10D, the through holes 15 that are the gas discharge passages G4 are formed at a plurality of locations of the cover 10 by a drill or the like. 10 penetrates through the top surface. As shown in FIG. 10B, the through hole 15 is formed at a position facing the case-side recess 22 and corresponding to the center of the case-side recess 22 in the width direction. That is, the through hole 15 is formed such that the central axis of the through hole 15 and the central axis in the width direction of the case-side recess 22 coincide. Further, as shown in FIG. 10B, when the sealing material 50 is foamed and cured, the sealing material 50 is compressed from the case-side recess 22 and the cover outer peripheral surface 11 in the case-side recess 22, and the gas discharge passage G4 (through hole). Enter 15). The gas discharge passage G4 (through hole 15) may be provided in at least one of the cover 10 and the case 20.

  The sealing material 50 is most easily foamed at the center in the width direction of the case-side recess 22. Therefore, by doing in this way, it becomes easy to discharge | emit the gas discharged | emitted from the case side recessed part 22, and the gas which the sealing material 50 emits at the time of foaming, and it is easy to apply compressive force more uniformly in the perimeter of a seal | sticker site | part. Thus, the sealing property can be improved.

  Moreover, the foaming state of the sealing material 50 can also be confirmed by visually inspecting the gas discharge passage G4 (through hole 15) from the outside of the electronic device 100 (cover 10).

  Further, as shown in FIG. 11, the gas discharge passage end 16 may be rounded. That is, the edge portion (edge portion on the gas discharge passage G4 side) of the seal surface (cover outer peripheral surface 11) facing the case-side recess 22 in the cover 10 may be rounded. FIG. 11 is a GG cross-sectional view before foaming of the sealing material of the electronic device according to Modification 7 of the first embodiment of the present invention.

  In this case, the gas discharge passage end 16 that is the end of the case-side recess 22 of the through hole 15 forming portion of the cover 10 is rounded by chamfering or the like. When the gas discharge passage end 16 is rounded, the sealing material 50 has a corrugated cross-sectional shape in the longitudinal direction in a foamed and cured state. In this way, by forming the gas discharge passage end 16, which is the end of the case-side recess 22 of the through-hole 15 forming portion of the cover 10, into a rounded shape, the gas and the sealing material 50 existing in the case-side recess 22. Makes it easier to discharge the gas that is produced when foaming into the external space.

  In addition, an opposing concave portion that communicates with the through hole 15 is provided in a portion of the cover outer peripheral surface 11 that faces the case side concave portion 22, and the opposing concave portion increases as the distance between the inner walls increases from the case side concave portion 22 toward the through hole 15. Gradually narrow. As a more preferable shape, as shown in FIG. FIG. 12 is a partial cross-sectional view of an electronic device according to Modification 8 of the first embodiment of the present invention, where (a) is before foaming of the sealing material and (b) is after foaming of the sealing material.

  In this case, a portion of the cover outer peripheral surface 11 facing the case-side recess 22 is recessed. That is, in the cover outer peripheral surface 11, portions other than the portions that are in contact with the outer side portion 21 a and the inner side portion 21 b of the case outer peripheral surface 21 are recessed to form the opposing concave portion 17. By doing in this way, the void of the sealing material 50 can be extracted equally. Furthermore, by forming the opposing concave portion 17 in an arch shape, the voids of the sealing material 50 can be extracted more evenly.

  In addition to the arch shape, the opposing concave portion is not shown in the drawing, but the wall surface of the opposing concave portion is a flat shape, and the cross-sectional shape in the short direction is a triangular shape protruding from the case side concave portion 22 toward the through hole 15. Also good.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. FIG. 13 is a partial cross-sectional view of an electronic device according to a second embodiment of the present invention, where (a) is before foaming of the sealing material and (b) is after foaming of the sealing material.

  Since the three-dimensional sealing structure and the three-dimensional sealing method in the second embodiment are often in common with those in the first embodiment described above, a detailed description of the common parts will be omitted below, and different parts will be omitted. Explain mainly. The second embodiment is different from the first embodiment described above in that no gas discharge passage is provided.

  As shown in FIG. 13, there may be a three-dimensional seal structure in which the gas discharge passage G1 may not be provided. In addition, since the same structure is applicable also about the location corresponding to gas exhaust passage G2, G3, only the location corresponding to gas exhaust passage G1 is demonstrated here.

  In this case, as shown in FIG. 13A, the cover 101 is assembled to the case 201 on at least one of the cover outer peripheral surface 111 of the cover 101 and the case outer peripheral surface 211 of the case 201 (here, the cover outer peripheral surface 111). In this state, a convex portion 14 is provided that is spaced apart from the inner wall of the case-side concave portion 222 and protrudes toward the case-side concave portion 222 and contacts the sealing material 50 before foaming. The height from the bottom surface of the case-side recess 222 in the inner portion 211b of the case outer peripheral surface 211 is made substantially the same as the height from the bottom surface of the case-side recess 222 in the outer portion 211a of the case outer peripheral surface 211.

  When sealing such a member, first, the sealing material 50 is applied to the case-side recess 222, and the cover 101 is assembled to the case 201. At this time, the convex portion 14 is brought into contact with the sealing material 50 applied to the concave portion 222 on the case side. Then, as described above, the sealing material 50 is foamed and cured in the case-side recess 222 by applying heat to the sealing material 50 or irradiating it with ultraviolet rays.

  Then, in the three-dimensional seal structure in the modified example 6 sealed in this way, as shown in FIG. 13B, the seal material 50 is foamed and cured, and the case-side recess 222, the cover outer peripheral surface 111 and It is compressed from the convex part 14 and disposed between the case side concave part 222 and the convex part 14.

  As described above, the compressive force is applied from the case-side concave portion 222, the cover outer peripheral surface 111, and the convex portion 14 between the case-side concave portion 222 and the convex portion 14 in a state where the sealing material 50 is foamed. Since the case 201 is sealed, it can be easily disassembled even after the cover 101 and the case 201 are sealed with the sealing material 50.

  Further, by providing the convex portion 14 at a portion facing the case-side concave portion 222, the contact area between the sealing material 50, the case-side concave portion 222, and the cover outer peripheral surface 111 can be widened. Even if the gas to be generated or the gas produced when the sealing material is foamed remains in the recess, a compressive force is easily applied uniformly over the entire circumference of the seal portion, and a reduction in sealing performance can be suppressed.

  Further, by doing so, even when an external force is applied to the cover 101 or the case 201 so that the cover 101 and the case 201 are shifted in the horizontal direction, the cover 101 and the case 201 are prevented from being displaced. can do.

  Further, in this way, by providing the sealing material 50 before foaming so as to contact the convex portion 14 in the case side concave portion 222, by foaming and curing the sealing material 50 in a state where the cover 101 and the case 201 are assembled, Even when there is no gas discharge passage and the gas present in the case-side recess 222 or the gas generated when the sealing material 50 is foamed remains in the case-side recess 222, the compression surface of the cover outer peripheral surface 111 and the sealing material 50 is Since it can be secured in advance, it is possible to ensure the sealing performance and suppress the deterioration of the sealing performance.

  In addition, as shown in FIG. 13, the convex part 14 can make the contact area of the convex part 14 and the sealing material 50 wide by making it a rectangular shape, and can ensure sealing performance easily.

  Moreover, the convex part 14 is good also as hemispherical shape, as shown in FIG. By doing in this way, while making it easy to contact the sealing material 50 with respect to the convex part 14, the stress concentration to the sealing material 50 can be reduced, and it can be easy to ensure sealing performance. FIG. 14 is a partial cross-sectional view of an electronic device according to Modification 1 of the second embodiment of the present invention.

  Moreover, the convex part 14 is good also as a mountain shape, as shown in FIG. By doing in this way, the void of the sealing material 50 can be easily removed, and the sealing performance can be easily ensured. FIG. 15 is a partial cross-sectional view of an electronic device according to Modification 2 of the second embodiment of the present invention.

  In addition, the said 1st Embodiment, the modification 1 thru | or 8 of 1st Embodiment, 2nd Embodiment, and the modifications 1 and 2 of 2nd Embodiment can also be implemented independently. However, it is also possible to implement a combination of a plurality of modified examples.

1 is a perspective view illustrating a schematic configuration of an electronic device according to a first embodiment of the present invention. It is a perspective view at the time of mounting a printed circuit board and a connector in the case of the electronic device in the 1st Embodiment of this invention. It is drawing before foaming of the sealing material of the electronic device in the 1st Embodiment of this invention, (a) is AA sectional drawing of FIG. 1, (b) is BB sectional drawing of FIG. It is drawing after the foaming of the sealing material of the electronic device in the 1st Embodiment of this invention, (a) is AA sectional drawing of FIG. 1, (b) is BB sectional drawing of FIG. It is a fragmentary sectional view of the electronic device in the modification 1 of the 1st Embodiment of this invention, (a) is before foaming of a sealing material, (b) is after foaming of a sealing material. It is a fragmentary sectional view of the electronic device in the modification 2 of the 1st Embodiment of this invention, (a) is before foaming of a sealing material, (b) is after foaming of a sealing material. It is sectional drawing of the electronic device in the modification 3 of the 1st Embodiment of this invention, (a) is CC sectional drawing of FIG. 1, (b) is DD sectional drawing of (a), ( c) EE sectional drawing of (a). It is a fragmentary sectional view of the electronic device in the modification 4 of the 1st Embodiment of this invention. It is drawing of the electronic device in the modification 5 of the 1st Embodiment of this invention, (a) is AA sectional drawing of FIG. 1, (b) is an expanded sectional view of a characteristic part (dotted line location). . It is drawing of the electronic device in the modification 6 of the 1st Embodiment of this invention, (a) is a top view of an electronic device, (b) is FF sectional drawing before foaming of a sealing material, (c) is GG sectional drawing before foaming of a sealing material, (d) is FF sectional drawing after foaming of a sealing material. It is GG sectional drawing before foaming of the sealing material of the electronic device in the modification 7 of the 1st Embodiment of this invention. It is a fragmentary sectional view of the electronic device in the modification 8 of the 1st Embodiment of this invention, (a) is before foaming of a sealing material, (b) is after foaming of a sealing material. It is a fragmentary sectional view of the electronic device in the 2nd Embodiment of this invention, (a) is before foaming of a sealing material, (b) is after foaming of a sealing material. It is a fragmentary sectional view of an electronic device in modification 1 of a 2nd embodiment of the present invention. It is a fragmentary sectional view of an electronic device in modification 2 of a 2nd embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Cover, 10a Connector opening part, 10h Waterproof filter, 11 Cover outer peripheral surface, 11a Outer part, 11b Inner part, 12 Side wall (Waterproof mechanism), 13 Step part (Leakage prevention mechanism), 14, 14a, 14b Convex part, 15 through hole, 16 gas discharge passage end, 17 facing recess, 20 case, 21 case outer peripheral surface, 21a outer portion, 21b inner portion, 22 case side seal forming recess, 23 substrate mounting portion, 30 connector, 31 connector peripheral surface 31a outer part, 31b inner part, 31c bottom part, 32 connector side seal formation recess, t terminal, 40 printed circuit board, 50 seal material, G1 to G4 gas discharge passage

Claims (19)

A seal part formed through a foamable seal material is three-dimensionally arranged at an opposite part of a plurality of members, and the seal material is compressed from the seal part by foaming so that the plurality of members are interposed. A three-dimensional seal structure for sealing,
At least one of the seal portions in the plurality of members is formed with a recess in which the seal material is disposed,
A gas discharge passage is formed around the seal portion of the plurality of members so as to communicate the recess and the external space of the recess.
The three-dimensional seal structure, wherein the seal material is compressed and disposed from the seal portion in the recess in a foamed state.   The gas exhaust passage communicates the space surrounded by the plurality of members as the external space and the concave portion, and the plurality of members include the space surrounded by the plurality of members and the plurality of members. The three-dimensional seal structure according to claim 1, further comprising a waterproof filter that allows gas to pass between the outside and the outside.   3. The three-dimensional seal structure according to claim 1, wherein the gas discharge passage communicates the outside of the plurality of members as the external space with the recess.   The three-dimensional seal structure according to claim 3, further comprising a waterproof mechanism that prevents liquid from entering the concave portion at a position corresponding to the gas discharge passage.   The three-dimensional seal structure according to any one of claims 1 to 4, wherein the gas discharge passage is partially formed in a portion where the plurality of members are opposed to each other.   The three-dimensional seal structure according to any one of claims 1 to 5, wherein the gas discharge passage includes a mechanism for preventing leakage of the seal material from the recess to the external space.   The plurality of members include a connector that electrically connects a circuit board and an external device, and a housing that includes the plurality of members that sandwich the connector and house the circuit board therein. The three-dimensional seal structure according to any one of claims 1 to 6.   The three-dimensional seal structure according to claim 7, wherein the gas discharge passage is formed in at least one member of a plurality of members forming the casing.   The gas discharge passage is composed of a plurality of holes formed in the housing, and the holes are formed at positions corresponding to the center in the width direction of the recess. Item 9. A three-dimensional seal structure according to Item 8.   The three-dimensional seal structure according to claim 9, wherein an edge portion of the seal surface facing the concave portion in the casing has a rounded shape.   The portion of the housing that faces the recess includes an opposing recess that faces the recess and communicates with the hole, and the counter recess gradually narrows as the distance between the inner walls moves from the recess toward the hole. The three-dimensional seal structure according to claim 9 or 10, wherein the three-dimensional seal structure is configured.   The three-dimensional seal structure according to claim 11, wherein the facing concave portion has an arch shape.   The three-dimensional seal structure according to any one of claims 1 to 12, wherein the seal material is also disposed in the gas discharge passage. The seal part formed through the foamable seal material is three-dimensionally arranged at the opposing part of the plurality of members, and the seal material is compressed from the seal part by foaming after the housing is assembled. A three-dimensional seal structure for sealing between a plurality of members,
At least one of the seal portions in the plurality of members is formed with a recess in which the seal material is disposed,
A convex portion that is spaced apart from the inner wall of the concave portion and protrudes toward the concave portion is formed at a portion facing the concave portion,
In a state where the convex portion and the concave portion are assembled, the sealing material is foamed and arranged between the concave portion and the convex portion so as to be compressed from the sealing portion. Seal structure.   The three-dimensional seal structure according to claim 14, wherein the convex portion has a rectangular shape.   The three-dimensional seal structure according to claim 14, wherein the convex portion has a hemispherical shape.   The three-dimensional seal structure according to claim 14, wherein the convex portion has a mountain shape.   The three-dimensional seal structure according to any one of claims 1 to 17, wherein a seal material before foaming is provided in the recess, and the seal material is foamed in a state where the plurality of members are assembled. 3D sealing method.   The three-dimensional seal structure according to any one of claims 14 to 17, wherein a seal material before foaming is provided in the concave portion so as to contact the convex portion, and the seal is assembled in a state where the plurality of members are assembled. A three-dimensional sealing method characterized by foaming a material.

Images