JP2008049375A - Cutting apparatus and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting apparatus that can fully heat the surface of a substrate to be machined and that can attain high linearity and high positioning accuracy of a cutting line. <P>SOLUTION: The cutting apparatus includes a substrate holder 50 for holding a substrate 60 to be machined and a laser beam heating part 30 that locally heat by emitting a laser beam LB2 near the planned cutting line 65 of the substrate 60 to be machined held by the substrate holder 50. On the downstream side of the laser beam heating part 30, there is arranged a cooling part 40 for injecting a fluid cooling medium C near the planned cutting line 65 that is heated by the laser beam LB2 from the laser beam heating part 30, in the substrate 60 to be machined. Between a heating area HA which is locally heated by the laser beam LB2 emitted from the laser beam heating part 30 and a cooling area CA to which a fluid cooling medium C is injected from the cooling part 40, there is provided a shielding body that prevents the fluid cooling medium C injected from the cooling part 40 from entering into the heating area HA. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cleaving device capable of realizing high linearity of a cleaving line and high positioning accuracy, and a cleaving method using the cleaving device.

  Conventionally, in the method of cleaving the substrate to be processed 60 made of a brittle material, the laser beam LB2 is used to locally heat the substrate to be processed 60 by a laser heating unit (not shown), and from the cooling unit 40. A cooling area CA for cooling by locally blowing the cooling medium C is formed, and the substrate 60 to be processed is cleaved (see FIG. 9).

  That is, in FIG. 9, after heating the cutting line 65 of the substrate 60 to be processed in the heating area HA and then cooling in the cooling area CA, compressive stress and tensile stress are generated in the vicinity of the cutting line 65. , Cracks can be formed. Then, the crack is cut along a desired planned cutting line 65 by controlling the progress direction of the crack. As such a cooling medium C, in order to cool uniformly the heated location on the to-be-processed substrate 60, the cooling medium which mixed water and air is used in many cases.

  However, when a mixture of water and air is sprayed onto the substrate 60 to be processed, the mixture of water and air is sprayed and floats on the substrate 60 to be processed. For this reason, as shown in FIG. 9, the mixture of water and air may reach the vicinity of the laser beam that irradiates the heating region, and may inhibit heating of the substrate 60 to be processed.

  In particular, when the substrate to be processed (glass substrate) 60 made of glass is cleaved, a CO2 laser having a high output and a high absorption rate for the glass substrate 60 is generally used as the light source of the laser beam LB2. There are many. However, the wavelength of the laser beam LB2 emitted from the CO2 laser is 10.6 μm, and the water absorption rate is almost 100%.

  For this reason, if water spray enters the optical path of the laser beam LB2, the laser beam LB2 is absorbed by the water spray, the energy of the laser beam reaching the processing point is reduced, and the cleaving performance is reduced. End up.

  Specifically, the energy of the laser beam LB2 that reaches the processing point is reduced, so that the heating by the laser beam LB2 becomes insufficient. For this reason, the surface of the to-be-processed substrate 60 cannot be heated to the temperature required for cleaving, and the phenomenon that the scribe depth becomes shallow occurs. As described above, when the depth of the scribe is reduced, the linearity and positioning accuracy of the cleaving line are lowered, and the processing quality is deteriorated.

  The present invention has been made in consideration of such points, and the surface of the substrate to be processed can be sufficiently heated, and the cleaving line can achieve high linearity and high positioning accuracy. An object is to provide a device and a cleaving method using the cleaving device.

  The present invention relates to a cleaving apparatus that heats and cools a substrate to be processed made of a brittle material locally along a planned cutting line and generates a crack in the substrate to be processed by a stress generated at that time. A substrate holder that holds the processed substrate, a laser heating unit that irradiates the heated region in the vicinity of the planned cutting line of the substrate to be processed held by the substrate holder and locally heats the substrate, and a substrate held by the substrate holder. Among the processed substrates, a cooling region near the planned cutting line heated by the laser beam from the laser heating unit is provided with a cooling unit that injects a fluid coolant, and the laser beam emitted from the laser heating unit A fluid coolant sprayed from the cooling unit between a heated region of the substrate to be heated locally and a cooling region of the substrate to be processed from which the fluid coolant is sprayed from the cooling unit Is A fracturing device, characterized in that a shield to prevent the entering the hot zone.

  With such a configuration, the surface of the substrate to be processed can be sufficiently heated, and high linearity of the cleaving line and high positioning accuracy can be realized.

  The present invention includes a shielding hood having a shielding hood including a side wall that surrounds the outer periphery of a heating region of a substrate to be processed, which is locally heated by laser light emitted from a laser heating unit. This prevents the fluid coolant injected from the cooling unit from entering the heating region.

  With such a configuration, it is possible to efficiently prevent the fluid cooling medium ejected from the cooling unit from reaching the heating region.

  The present invention is the cleaving device characterized in that the planar shape of the region surrounded by the side wall of the shielding hood is similar to the heating region.

  With such a configuration, it is possible to prevent the fluid cooling medium ejected from the cooling unit from reaching the heating region evenly in a well-balanced manner.

  In the present invention, the opposite side of the shielding hood to the substrate to be processed is covered with a transmission window through which the laser beam irradiated from the laser heating unit passes, and a space is formed by the side wall of the shielding hood and the transmission window. The cleaving device is characterized in that an inflow pipe through which an inert gas or air flows is provided in a space surrounded by the transmission window.

  With such a configuration, it is possible to reliably prevent the flowable cooling medium injected from the cooling unit from flowing in through the gap between the shield and the workpiece substrate due to the flow of the inert gas or air. it can.

  The present invention is the cleaving apparatus characterized in that the transmission window is provided at the end of the side wall of the shielding hood opposite to the substrate to be processed, and the inflow pipe is connected to the side wall of the shielding hood.

  In the present invention, the laser heating unit includes a laser oscillator that irradiates laser light and a scanning mirror that scans the laser light from the laser oscillator on the substrate, and the shielding hood extends to above the scanning mirror, and the laser A cleaving device having a passage hole through which laser light reaching an scanning mirror from an oscillator passes.

  With such a configuration, it is possible to reliably prevent the flowable cooling medium injected from the cooling unit from flowing in from above the shielding hood.

  The present invention is a cleaving device characterized in that the shield has a heating mechanism for heating the shield itself.

  With such a configuration, it is possible to more reliably prevent a fluid cooling medium injected from the cooling unit from entering the heating region.

  The present invention relates to a cleaving apparatus that heats and cools a substrate to be processed made of a brittle material locally along a planned cutting line and generates a crack in the substrate to be processed by a stress generated at that time. A substrate holder that holds the processed substrate, a laser heating unit that irradiates the heating region near the planned cutting line of the substrate to be processed held by the substrate holder and locally heats the substrate by a laser beam, and the substrate holder A laser beam irradiated from the laser heating unit, including a cooling unit that injects a fluid coolant in a cooling region in the vicinity of the cutting line that is heated by the laser beam from the laser heating unit in the workpiece substrate. Air or an inert gas is jetted between a heated region of the substrate to be heated locally by the substrate and a cooling region of the substrate to be processed from which a fluid coolant is injected from the cooling unit. Agent A fracturing device, characterized in that a jetting mechanism to prevent from entering the heating zone.

  With such a configuration, the surface of the substrate to be processed can be sufficiently heated, and high linearity of the cleaving line and high positioning accuracy can be realized.

  The present invention is the cleaving device characterized in that the cooling unit has a cooling nozzle for injecting a fluid coolant.

  The present invention relates to a cleaving method in which a substrate to be processed made of a brittle material is heated and cooled locally along a planned cutting line, and the substrate to be processed is cracked by a stress generated at that time. A substrate holding process for holding the substrate to be processed by the holder, and a laser that locally heats the heating region near the planned cutting line of the substrate to be processed held by the substrate holder by the laser heating unit. Cooling that injects a fluid coolant into the cooling region near the planned cutting line heated by the laser beam from the laser heating unit among the substrate to be processed held by the substrate holder by the heating step and the cooling unit. And a substrate to be processed that is heated locally by laser light emitted from the laser heating unit, and a substrate to be processed on which a fluid coolant is injected from the cooling unit. The shield is provided between the cooling area, flowable coolant injected from the cooling unit is a cleaving method characterized by prevented from entering into the heating zone.

  With such a configuration, the surface of the substrate to be processed can be sufficiently heated, and high linearity of the cleaving line and high positioning accuracy can be realized.

  The present invention relates to a cleaving method in which a substrate to be processed made of a brittle material is heated and cooled locally along a planned cutting line, and the substrate to be processed is cracked by a stress generated at that time. A substrate holding process for holding the substrate to be processed by the holder, and a laser that locally heats the heating region near the planned cutting line of the substrate to be processed held by the substrate holder by the laser heating unit. Cooling that injects a fluid coolant into the cooling region near the planned cutting line heated by the laser beam from the laser heating unit among the substrate to be processed held by the substrate holder by the heating step and the cooling unit. And a flowable coolant is jetted from the heating region of the substrate to be processed, which is locally heated by the laser beam, and the cooling unit. Between the cooling area of the substrate to be processed that is, the air or inert gas is ejected, a splitting method of the coolant, characterized in that to prevent the entering the said heating zone.

  With such a configuration, the surface of the substrate to be processed can be sufficiently heated, and high linearity of the cleaving line and high positioning accuracy can be realized.

  According to the present invention, it is possible to sufficiently heat the surface of the substrate to be processed by preventing the fluid coolant sprayed from the cooling unit from entering the heating region, and the cutting line is high. Linearity and high positioning accuracy can be realized.

First Embodiment Hereinafter, a first embodiment of a cleaving apparatus according to the present invention will be described with reference to the drawings. Here, FIG. 1 and FIG. 2 are views showing a first embodiment of the present invention.

  The cleaving apparatus of the present invention heats and cools a substrate to be processed 60 made of a brittle material locally along the planned cutting line 65, and generates a crack in the substrate to be processed 60 by the stress generated at that time. To do.

  As shown in FIGS. 1 and 2, the cleaving apparatus irradiates a laser beam LB <b> 1 onto a substrate holder 50 that holds a substrate to be processed 60 and a planned cutting line 65 of the substrate to be processed 60 held by the substrate holder 50. Then, the laser preheating unit 20 that preheats locally, and the cutting schedule line that is arranged downstream of the laser preheating unit 20 (positive direction in the x direction in FIG. 1) and is preheated by the laser beam LB1 from the laser preheating unit 20 The laser heating unit 30 that irradiates the laser beam LB2 and locally heats the laser beam LB2 and the downstream side of the laser heating unit 30 (the positive direction in the x direction in FIG. 1) are held by the substrate holder 50. A cooling unit 40 for injecting a fluid cooling medium C is provided on the planned cutting line 65 of the substrate 60 to be processed, which is heated by the laser beam LB2 from the laser heating unit 30.

The laser preheating unit 20 shown in FIG. 1 is for locally heating the substrate 60 by irradiating the substrate 60 with the laser beam LB1. As shown in FIG. 1, the laser preheating unit 20 includes a laser oscillator 21 that emits about 200 W of CO ₂ laser light, a reflection mirror 22 that reflects the laser light LB1 emitted by the laser oscillator 21, and a reflection mirror 22. And a polygon mirror 23 that scans the reflected laser beam LB1 on the substrate 60 to be processed. The laser beam LB1 emitted from the laser oscillator 21 is reflected by the polygon mirror 23 via the reflection mirror 22 and repeatedly scanned along the planned cutting line 65 on the substrate 60 to be processed.

  The laser beam LB1 emitted from the laser oscillator 21 has a circular cross section immediately after being emitted from the laser oscillator 21. However, when the laser beam LB1 reaches the polygon mirror 23, the polygon mirror 23 changes the cross section from a circular shape to an elliptical shape or an oval shape. For this reason, the area (preheating area) on the substrate 60 to be preheated by the laser beam LB1 has an elliptical shape or an oval shape.

  In the above description, the polygon mirror 23 is used. However, the present invention is not limited to this, and a galvanometer mirror or a cylindrical lens may be used instead of the polygon mirror 23.

The laser heating unit 30 shown in FIG. 1 is for irradiating the processing substrate 60 with the laser beam LB2 to locally heat the processing substrate 60 and causing the processing substrate 60 to crack. As shown in FIG. 1, the laser heating unit 30 includes a laser oscillator 31 that emits CO ₂ laser light of several tens of watts to hundreds of tens of watts, and a reflection mirror that reflects the laser light LB2 emitted by the laser oscillator 31. 32 and a polygon mirror 33 that scans the laser beam LB2 reflected by the reflecting mirror 32 on the substrate 60 to be processed. The laser beam LB2 emitted from the laser oscillator 31 is reflected by the polygon mirror 33 through the reflection mirror 32 and repeatedly scanned along the planned cutting line 65 on the substrate 60 to be processed.

  The laser beam LB2 emitted from the laser oscillator 31 has a circular cross section immediately after being emitted from the laser oscillator 31. However, when the laser beam LB2 reaches the polygon mirror 33, the polygon mirror 33 deforms the cross section from a circular shape to an elliptical shape or an oval shape. For this reason, the region (heating region) HA on the substrate 60 to be heated by the laser beam LB2 has an elliptical shape or an oval shape (see FIG. 2).

  In the above description, the polygon mirror 33 is used. However, the present invention is not limited to this, and a galvanometer mirror or a cylindrical lens may be used instead of the polygon mirror 33.

  The cooling section 40 shown in FIG. 1 is for injecting a cooling medium C having fluidity onto a planned cutting line 65 on a substrate 60 that is locally heated to cool it. Examples of such a cooling medium C include water and mist (a mixture of water and gas), a gas such as nitrogen and helium, a particulate solid such as carbon dioxide particles (dry ice), a liquid such as alcohol, a mist-like alcohol, Snowy dry ice or the like can be used.

  As shown in FIGS. 1 and 2, the cooling unit 40 includes a cooling nozzle 41 that injects a fluid cooling medium C.

  Further, as shown in FIGS. 1 and 2, a heating area HA that is locally heated by the laser light LB <b> 2 irradiated from the laser heating unit 30, and a fluid cooling medium C is ejected from the cooling unit 40. A shielding hood (shielding body) 1 is provided so as to shield from the cooling area CA.

  As shown in FIG. 2, the shielding hood 1 includes a side wall 1 s that surrounds the outer periphery of the heating area HA that is locally heated by the laser beam LB <b> 2 irradiated from the laser heating unit 30. This is to prevent the fluid coolant C sprayed from the cooling unit 40 from entering the heating area HA.

  As shown in FIG. 2, the planar shape of the area SA surrounded by the side wall 1s of the shielding hood 1 is similar to the heating area HA.

  As shown in FIG. 1, the substrate holder 50 is disposed on a horizontal movement mechanism 55 that is movable in the horizontal direction.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, the substrate 60 is held by the substrate holder 50 (substrate holding step) (see FIG. 1).

  Next, the laser preheating unit 20 irradiates the laser beam LB1 and preheats a region on the planned cutting line 65 of the substrate to be processed 60 held by the substrate holder 50 (first preheating step). (See FIG. 1).

  Next, the substrate 60 to be processed held by the substrate holder 50 is moved by a predetermined distance in the x direction of FIGS. 1 and 2 by the horizontal movement mechanism 55.

  Next, the laser heating unit 30 irradiates the laser beam LB2, and a region on the planned cutting line 65 preheated by the laser beam LB1 from the laser preheating unit 20 is locally heated (first heating). Step) (see FIGS. 1 and 2). During this time, the laser preheating unit 20 irradiates the laser beam LB1, and the other region on the cutting line 65 of the substrate to be processed 60 is preheated locally (second preheating step) (see FIG. 1).

  Next, the substrate 60 to be processed held by the substrate holder 50 is moved by a predetermined distance in the x direction of FIGS. 1 and 2 by the horizontal movement mechanism 55.

  Next, a cooling medium 40 having fluidity is jetted by the cooling unit 40 disposed on the downstream side of the laser heating unit 30, and the laser heating unit 30 out of the substrate 60 to be processed held by the substrate holder 50. A region on the planned cutting line 65 heated by the laser beam LB2 is locally cooled (first cooling step) (see FIGS. 1 and 2). As a result, a region of the substrate 60 to be processed is cut on the planned cutting line 65. During this time, the laser heating unit 30 irradiates the laser beam LB2, and the other region on the planned cutting line 65 preheated by the laser beam LB1 from the laser preheating unit 20 is locally heated (second heating step). (See FIGS. 1 and 2).

  In this case, the other region on the substrate to be processed 60 heated by the laser heating unit 30 is positioned in the immediate vicinity of the upstream side of the one region.

  Further, the other region locally heated by the laser beam LB2 irradiated from the laser heating unit 30 is a heating region HA, and one region cooled by the cooling unit 40 is a cooling region CA. Between the other area (HA) heated by the irradiated laser beam LB2 and the cooling area CA (one area) cooled by the fluid cooling medium C ejected from the cooling unit 40, the shielding hood 1 Is provided.

  Therefore, the shielding hood 1 can prevent the fluid cooling medium C sprayed from the cooling unit 40 from entering the heating area HA (see FIGS. 1 and 2). As a result, the temperature of the heating area HA on the substrate 60 to be processed can be maintained at a high temperature, so that one area of the substrate 60 to be processed can be cleaved on the cleaving line 65 with high accuracy. In other words, one region of the substrate 60 to be processed can be cut straight at a position accurately positioned on the planned cutting line 65.

  Moreover, as shown in FIG. 2, since the shielding hood 1 has a shape that covers the heating area HA, the fluid cooling medium C sprayed from the cooling unit 40 is efficiently prevented from reaching the heating area HA. can do.

  Further, as shown in FIG. 2, the planar shape of the area SA surrounded by the side wall 1 s of the shielding hood 1 is similar to the heating area HA, so that the fluid cooling injected from the cooling unit 40 is performed. It is possible to prevent the medium C from reaching the heating area HA with a good balance.

  The first preheating step, the first heating step, and the first cooling step performed for one region of the substrate to be processed 60 are performed for all the regions on the planned cutting line 65 of the substrate 60 to be processed. The substrate 60 can be completely cleaved.

  Moreover, the shielding hood 1 may have a heating mechanism (not shown) for heating the shielding hood 1 itself. Thus, when the shielding hood 1 has the heating mechanism, it is possible to more reliably prevent the fluid cooling medium C injected from the cooling unit 40 from entering the heating area HA. For this reason, the to-be-processed substrate 60 can be cleaved more accurately on the cleaving planned line 65.

  In the above description, the shielding hood 1 including the side wall 1s surrounding the outer periphery of the heating area HA has been described as the shielding body. However, the shielding hood 1 is not limited to this, and is locally generated by the laser beam LB2 emitted from the laser heating unit 30. If it can shield between the heating area | region HA heated automatically and the cooling area | region CA where the fluid cooling medium C is injected from the cooling part 40, it can be used as a shielding body.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment shown in FIGS. 3 and 4, the upper end of the side wall 1 s of the shielding hood 1 (the end opposite to the substrate 60 to be processed) is irradiated with the laser beam LB2 irradiated from the laser heating unit 30. It is covered with a transmission window 3 that passes therethrough. Further, an inflow pipe 4 through which an inert gas or air flows into a space formed by the side wall 1 s of the shielding hood 1 and the transmission window 3 is connected to the side wall 1 s of the shielding hood 1. Other configurations are substantially the same as those of the first embodiment shown in FIGS.

  In the second embodiment shown in FIG. 3 and FIG. 4, the same parts as those in the first embodiment shown in FIG. 1 and FIG.

  As shown in FIGS. 3 and 4, the upper end of the side wall 1 s of the shielding hood 1 is covered by the transmission window 3, and the space formed by the side wall 1 s of the shielding hood 1 and the transmission window 3 on the side wall 1 s of the shielding hood 1. An inflow pipe 4 through which an inert gas or air flows is connected.

  For this reason, an inert gas or air can flow into the space surrounded by the side wall 1 s of the shielding hood 1 and the transmission window 3 through the inflow pipe 4. Therefore, it is possible to reliably prevent the flowable cooling medium C injected from the cooling unit 40 from flowing into the gap between the shielding hood 1 and the substrate to be processed 60 due to the flow of the inert gas or air. it can. As a result, the substrate 60 to be processed can be cleaved with high accuracy on the cleaving line 65.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIGS. The third embodiment shown in FIGS. 5 and 6 is a shielding hood having a through hole 7 that extends to above the polygon mirror (scanning mirror) 33 and allows the laser beam LB2 reaching the polygon mirror 33 from the laser oscillator 31 to pass therethrough. 1 is used, and the others are substantially the same as those of the first embodiment shown in FIGS.

  In the third embodiment shown in FIG. 5 and FIG. 6, the same parts as those in the first embodiment shown in FIG. 1 and FIG.

  As shown in FIGS. 5 and 6, the shielding hood 1 extends to above the polygon mirror 33. For this reason, it is possible to reliably prevent the flowable cooling medium C injected from the cooling unit 40 from flowing in from above the shielding hood 1. As a result, the substrate 60 to be processed can be cleaved with high accuracy on the cleaving line 65.

Fourth Embodiment Next, a fourth embodiment of the present invention will be described with reference to FIGS. In the fourth embodiment shown in FIG. 7 and FIG. 8, instead of providing the shielding hood 1, a heating region that is locally heated by the laser beam LB <b> 2 irradiated from the laser heating unit 30 in the substrate to be processed 60. Air or an inert gas is ejected between the HA and the cooling area CA where the fluid cooling medium C is injected from the cooling unit 40, and the cooling medium C is prevented from entering the heating area HA. The other features are substantially the same as those of the first embodiment shown in FIGS. 1 and 2.

  In the fourth embodiment shown in FIGS. 7 and 8, the same parts as those in the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, the substrate 60 is held by the substrate holder 50 (substrate holding step) (see FIG. 7).

  Next, the laser preheating unit 20 irradiates the laser beam LB1 and preheats a region on the planned cutting line 65 of the substrate to be processed 60 held by the substrate holder 50 (first preheating step). (See FIG. 7).

  Next, the workpiece substrate 60 held by the substrate holder 50 is moved by a predetermined distance in the x direction of FIGS. 7 and 8 by the horizontal movement mechanism 55.

  Next, the laser heating unit 30 irradiates the laser beam LB2 and locally heats a region on the planned cutting line 65 preheated by the laser beam LB1 from the laser preheating unit 20 (first heating). Step) (see FIGS. 7 and 8). During this time, the laser preheating unit 20 irradiates the laser beam LB1, and the other region on the cutting line 65 of the substrate 60 to be processed is preheated locally (second preheating step) (see FIG. 7).

  Next, the workpiece substrate 60 held by the substrate holder 50 is moved by a predetermined distance in the x direction of FIGS. 7 and 8 by the horizontal movement mechanism 55.

  Next, a cooling medium 40 having fluidity is jetted by the cooling unit 40 disposed on the downstream side of the laser heating unit 30, and the laser heating unit 30 out of the substrate 60 to be processed held by the substrate holder 50. A region on the planned cutting line 65 heated by the laser beam LB2 is locally cooled (first cooling step) (see FIGS. 7 and 8). As a result, a region of the substrate 60 to be processed is cut on the planned cutting line 65. During this time, the laser heating unit 30 irradiates the laser beam LB2, and the other region on the planned cutting line 65 preheated by the laser beam LB1 from the laser preheating unit 20 is locally heated (second heating step). (See FIGS. 7 and 8).

  At this time, the jetting mechanism 11 provided in the vicinity of the laser heating unit 30 from the heating region HA that is locally heated by the laser beam LB2 irradiated from the laser heating unit 30 and the cooling unit 40 in the substrate 60 to be processed. Air or an inert gas is ejected between the cooling medium CA in which the fluid cooling medium C is ejected (see FIGS. 7 and 8).

  For this reason, since the fluid cooling medium C injected from the cooling unit 40 can be prevented from entering the heating area HA, the temperature of the heating area HA on the substrate 60 to be processed can be kept high. it can. As a result, it is possible to cleave a region of the substrate 60 to be processed with high accuracy on the cleaving line 65. In other words, one region of the substrate 60 to be processed can be cut straight at a position accurately positioned on the planned cutting line 65.

  The first preheating step, the first heating step, and the first cooling step performed for one region of the substrate to be processed 60 are performed for all the regions on the planned cutting line 65 of the substrate 60 to be processed. The substrate 60 can be completely cleaved.

  Further, even if air or inert gas ejected by the ejection mechanism 11 reaches the heating area HA, it has no effect on heating the substrate 60 to be processed by the laser beam LB2 irradiated from the laser heating unit 30. Not give.

The side view which shows the cleaving apparatus by the 1st Embodiment of this invention. The perspective view which shows the vicinity of the heating area | region and cooling area | region of the cleaving apparatus by the 1st Embodiment of this invention. The side view which shows the cleaving apparatus by the 2nd Embodiment of this invention. The perspective view which shows the vicinity of the heating area | region and cooling area | region of the cleaving apparatus by the 2nd Embodiment of this invention. The side view which shows the cleaving apparatus by the 3rd Embodiment of this invention. The perspective view which shows the vicinity of the heating area | region and cooling area | region of the cleaving apparatus by the 3rd Embodiment of this invention. The side view which shows the cleaving apparatus by the 4th Embodiment of this invention. The perspective view which shows the vicinity of the heating area | region and cooling area | region of the cleaving apparatus by the 4th Embodiment of this invention. The perspective view which shows the vicinity of the heating area | region and cooling area | region of the conventional cleaving apparatus.

Explanation of symbols

1 Shielding hood (shielding body)
1 s Side wall of shielding hood 3 Transmission window 4 Inflow pipe 7 Passing hole 11 Ejecting mechanism 20 Laser preheating unit 30 Laser heating unit 33 Polygon mirror (scanning mirror)
40 Cooling part 41 Cooling nozzle 50 Substrate holder 60 Substrate 65 Processed cutting line CA Cooling area HA Heating area SA Area surrounded by side walls of shielding hood

Claims (11)

In a cleaving apparatus that heats and cools a substrate to be processed made of a brittle material locally along a cleaving line, and generates a crack in the substrate to be cleaved by stress generated at that time,
A substrate holder for holding the substrate to be processed;
A laser heating unit that irradiates a laser beam to a heating region near a planned cutting line of a substrate to be processed held by a substrate holder and locally heats the substrate;
Of the substrate to be processed held by the substrate holder, provided with a cooling unit for injecting a fluid coolant in the cooling region near the cutting line heated by the laser beam from the laser heating unit,
A cooling unit is provided between a heating region of the processing substrate that is locally heated by the laser light emitted from the laser heating unit and a cooling region of the processing substrate that is injected with a fluid coolant from the cooling unit. A cleaving apparatus comprising a shield that prevents fluid coolant sprayed from an intrusion into the heating region. The shielding body has a shielding hood composed of a side wall surrounding the outer periphery of the heating region that is locally heated by the laser light emitted from the laser heating portion of the substrate to be processed,
2. The cleaving device according to claim 1, wherein the shielding hood prevents the fluid coolant sprayed from the cooling unit from entering the heating region.   The cleaving apparatus according to claim 2, wherein the planar shape of the region surrounded by the side wall of the shielding hood is similar to the heating region. The opposite side of the shielding hood to the workpiece substrate is covered with a transmission window through which the laser light emitted from the laser heating unit passes,
A space is formed by the side wall of the shielding hood and the transmission window,
3. The cleaving apparatus according to claim 2, wherein an inflow pipe through which an inert gas or air flows is provided in a space surrounded by the side wall of the shielding hood and the transmission window.   The cleaving device according to claim 4, wherein the inflow pipe is connected to a side wall of the shielding hood. The laser heating unit includes a laser oscillator that emits laser light, and a scanning mirror that scans the laser light from the laser oscillator on the substrate,
3. The cleaving device according to claim 2, wherein the shielding hood has a passage hole that extends to above the scanning mirror and allows the laser light reaching the scanning mirror from the laser oscillator to pass therethrough.   The cleaving device according to claim 1, wherein the shield has a heating mechanism for heating the shield itself. In a cleaving apparatus that heats and cools a substrate to be processed made of a brittle material locally along a cleaving line, and generates a crack in the substrate to be cleaved by stress generated at that time,
A substrate holder for holding the substrate to be processed;
A laser heating unit that irradiates a laser beam to a heating region near a planned cutting line of a substrate to be processed held by a substrate holder and locally heats the substrate;
Of the substrate to be processed held by the substrate holder, provided with a cooling unit for injecting a fluid coolant in the cooling region near the cutting line heated by the laser beam from the laser heating unit,
Between the heating region of the substrate to be processed that is locally heated by the laser light emitted from the laser heating unit and the cooling region of the substrate to be processed where the fluid coolant is injected from the cooling unit, air or A cleaving apparatus comprising an ejection mechanism that ejects an inert gas and prevents the coolant from entering the heating region.   The cleaving apparatus according to claim 1, wherein the cooling unit includes a cooling nozzle that injects a fluid coolant. In a cleaving method in which a substrate to be processed made of a brittle material is heated and cooled locally along a planned cutting line, and the substrate to be processed is cracked by a stress generated at that time.
A substrate holding step for holding the substrate to be processed by the substrate holder;
A laser heating step in which a heating region in the vicinity of the planned cutting line of the substrate to be processed held by the substrate holder is irradiated with a laser beam and heated locally by the laser heating unit;
A cooling step of injecting a fluid coolant to a cooling region in the vicinity of the cutting line that is heated by the laser beam from the laser heating unit, out of the substrate to be processed held by the substrate holder by the cooling unit. ,
A shield is provided between the heating region of the substrate to be processed that is locally heated by the laser light emitted from the laser heating unit and the cooling region of the substrate to be processed to which a fluid coolant is injected from the cooling unit. A cleaving method comprising: providing a fluid coolant injected from a cooling unit to prevent entry into the heating region. In a cleaving method in which a substrate to be processed made of a brittle material is heated and cooled locally along a planned cutting line, and the substrate to be processed is cracked by a stress generated at that time.
A substrate holding step for holding the substrate to be processed by the substrate holder;
A laser heating step in which a heating region in the vicinity of the planned cutting line of the substrate to be processed held by the substrate holder is irradiated with a laser beam and heated locally by the laser heating unit;
A cooling step of injecting a fluid coolant to a cooling region in the vicinity of the cutting line that is heated by the laser beam from the laser heating unit, out of the substrate to be processed held by the substrate holder by the cooling unit. ,
Between the heating area of the substrate to be processed, which is locally heated by the laser beam, by the ejection mechanism provided in the vicinity of the laser heating section, and the cooling area of the substrate to be processed, where a fluid coolant is injected from the cooling section In addition, the cleaving method is characterized in that air or an inert gas is ejected to prevent the coolant from entering the heating region.

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